JP2000137786A - Card with image receiving layer and device and method for manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent thermal damage from being given to the image receiving layer which is formed previously to thermally transfer a face image and to form a noncontact type IC card, etc., with the face image which is free of thermal damage to the image receiving layer and has high heat resistance temperature. SOLUTION: This card 100 has a reverse-surface sheet 1, electronic components 4 for the card provided on the reverse-surface sheet 1, and a top- surface sheet 5 with the image receiving layer which seals the electronic components 4 and has the laminate structure wherein at least the reverse-surface sheet 1, top-surface sheet 5, and electronic components 4 are stuck together under specific working temperature conditions across adhesive sheets 10A and 10B. This structure can make uniform the thickness of the adhesion layers between the top surfaces of the electronic components 4 and the top-surface sheet 5, and the reverse surfaces of the electronic components 5 and the reverse- surface sheet 1 and increase the heat resistance temperature.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC containing a non-contact type face image such as a cash card, an employee ID card with a face photograph, an employee ID card, a membership ID card, a student ID card, an alien registration ID and various driver's licenses. The present invention relates to a card with an image receiving layer suitable for being applied to a card, an apparatus for manufacturing the card, and a method for manufacturing the card.

More specifically, in a card making method in which a member for a substrate and a member for a surface having an image receiving layer on which an image is formed by thermal transfer are bonded via an adhesive member, the members are bonded at a low temperature. By doing so, it is possible to eliminate thermal damage to the image receiving layer and to provide a non-contact type IC card with a high heat resistant temperature, such as a face image, because the curing reaction proceeds after bonding and the heat resistant temperature rises. It is.

[0003]

2. Description of the Related Art In recent years, an IC card in which an IC chip or an antenna is sealed in a resin card has been proposed. Since this type of IC card is a non-contact type, it has no information input / output terminals. Therefore, the information is used by converting it into a specific modulated radio wave, receiving it with an antenna, demodulating it with an IC chip, writing it into a memory or the like, or reading it out.

[0004] The non-contact type IC card is disclosed in, for example, Japanese Patent Application Laid-Open No. 9-275184, which is a technical document, as "Information Carrier and its Manufacturing Method".
According to this technical document, an electronic component such as an IC chip or an antenna is housed in a woven reinforcing member (hereinafter also referred to as a housing member), and is bonded with an upper and lower cover sheet via an adhesive member. An IC card is formed. Thereby, the IC card itself can be formed thin.

[0005] In this type of IC card, a printed member is used as a surface member, and for example, "XXX employee ID", "name", "issue date", etc. are used for the field of use of the card. Such image display information is often printed. The printing member is provided with an image receiving layer for forming a photograph of the face of the user of the card. A face photograph or the like is formed by sublimation thermal transfer using a thermal head, melt thermal transfer, or ink jet means. This I
The back sheet serving as a member for the substrate of the C card may be provided with a writing layer that can be written with a pen.

Accordingly, when mass-producing cash cards, employee cards, employee cards, membership cards, student cards, alien registration cards, various driver's licenses, and the like, a member for the surface on which image display information is printed. In many cases, a storage member for storing electronic components and a substrate member having a writing layer are used in the form of a long sheet. Of course, there are cases where ten or twenty cards are manufactured using large-sized sheets.

[0007]

However, in response to a demand for mass production of cash cards, employee cards, employee cards, membership cards, student cards, alien registration cards, various driver's licenses, etc., long sheets are required. When a method is used in which a member for a substrate in the form of a sheet or a large plate, a housing member, and a member for a surface are bonded with a liquid adhesive member, an equal amount of the adhesive member is applied to the housing member. Becomes difficult.

Accordingly, the thickness of the adhesive layers on the front and back of the storage member may be uneven, and the card surface may be uneven. The unevenness deteriorates the flatness of the card, which hinders the manufacture of an IC card having a uniform thickness.

[0009] To solve the problem of flatness, card processing is performed using a hot-melt adhesive that can be bonded, but has a solid state before bonding, but is melted by applying heat. By doing so, a card with no unevenness on the surface can be created.

However, when an image receiving layer for thermally transferring a face image is formed on the surface sheet in advance, the image receiving layer is damaged by heat when the lamination is performed at a high temperature. Therefore, there is a problem that the density of the transferred image is lowered or the color tone is changed. In particular, in the case of a driver's license or the like, considering storage in a car in summer, a card is required to have heat resistance of about 90 ° C.

In view of the above, the present invention has been made to solve the above-mentioned problems, and it is intended to prevent thermal damage to a previously formed image receiving layer for thermally transferring a face image, and to provide a face image having a high heat resistance temperature. It is an object of the present invention to provide a card with an image receiving layer capable of forming a non-contact type IC card or the like, an apparatus for manufacturing the same, and a method for manufacturing the same.

[0012]

In order to solve the above problems, a card with an image receiving layer according to the present invention comprises: a member for a substrate;
A surface member having an image receiving layer to which the face image of the card user is thermally transferred, wherein at least the substrate member and the surface member are interposed by a reactive hot melt resin adhesive member. Characterized in that it has a laminated structure bonded under the processing temperature conditions described above.

According to the card having the image receiving layer of the present invention, for example, the heat-sensitive temperature Ta ° C. at which the image receiving layer receives heat and causes thermal diffusion.
When the softening point of the reactive hot melt resin after the completion of the curing reaction is Tb ° C., [Tb− (35 ± 1)
5)] The member for the surface and the member for the substrate are bonded together at a heating temperature of ° C., and a laminated structure of a card with an image receiving layer is formed under the bonding conditions.

Therefore, it is possible to provide a card having an image receiving layer which is flat with almost no irregularities on the card surface, has a small card thickness, and has a high heat-resistant temperature. The reliability of an electronic card with a face image can be improved in the field of card use such as an ID card, a student ID card, an alien registration card, and various driver's licenses.

A first apparatus for manufacturing a card with an image receiving layer according to the present invention comprises a first supply means for supplying a member for a substrate, and a thin sheet-shaped first member provided on the member for the substrate by the first supply means. A second supply unit for supplying the first adhesive member, a third supply unit for supplying an electronic component for a card onto the first adhesive member by the second supply unit, and a third supply unit Fourth supply means for supplying a thin sheet-like second adhesive member onto the electronic component, and fifth supply means for supplying a surface member with an image receiving layer on the second adhesive member by the fourth supply means. And a member for a substrate and one surface of the electronic component are bonded by a first adhesive member, and the other surface and the member for the surface of the electronic component are fixed to each other by a second adhesive member. And laminating means for laminating under processing temperature conditions. That.

According to the first apparatus for manufacturing a card with an image receiving layer of the present invention, for example, the heat sensitive temperature of the image receiving layer is not higher than Ta.degree. When the subsequent softening point is Tb ° C., the substrate member and one surface of the electronic component are bonded to each other by a bonding temperature by a heating temperature of [Tb− (35 ± 15)] ° C. Since the other surface of the electronic component and the surface member are bonded together with the second bonding member interposed therebetween, heat damage to the image receiving layer due to heating during bonding is reduced. In addition, a non-contact type IC card with an image receiving layer having a high heat-resistant temperature can be manufactured.

A second manufacturing apparatus for a card with an image receiving layer according to the present invention comprises a first supply unit for supplying a substrate member with an adhesive, and a first supply unit for the substrate with an adhesive by the first supply unit. A second supply unit for supplying an electronic component for a card onto the member, and a third supply unit for supplying a member for an adhesive-attached surface with an image receiving layer on the electronic component by the second supply unit And bonding the substrate member with the adhesive and one surface of the electronic component, and bonding the other surface of the electronic component and the surface member with the adhesive with the image receiving layer to a predetermined processing temperature. And laminating means for laminating under conditions.

According to the second apparatus for manufacturing a card with an image receiving layer of the present invention, for example, the heat-sensitive temperature at which the image receiving layer receives heat and causes thermal diffusion is Ta ° C. or lower, and the curing reaction of the reactive hot melt resin is completed. When the subsequent softening point is Tb ° C., the bonding member joins the substrate member with the adhesive and one surface of the electronic component by a heating temperature of [Tb− (35 ± 15)] ° C. At the same time, the other surface of the electronic component and the member for the surface with the adhesive having the image receiving layer are bonded, so that there is no thermal damage to the image receiving layer due to heating at the time of bonding, and the heat resistant temperature is also reduced. A high non-contact type IC card with an image receiving layer can be manufactured.

The third apparatus for manufacturing a card with an image receiving layer according to the present invention comprises a first supply means for supplying a member for a substrate, and a thin sheet-like material on the substrate member by the first supply means. A second supply unit that supplies the first adhesive member, a third supply unit that supplies a storage member containing electronic components for a card onto the first adhesive member by the second supply unit, A fourth supply means for supplying a thin sheet-like second adhesive member onto the storage member provided by the third supply means, and a surface member having an image receiving layer on the second adhesive member provided by the fourth supply means And a first adhesive member for laminating the substrate member and one surface of the storage member, and a second adhesive member for attaching the other surface of the storage member to the image receiving layer. A bonding means for bonding the surface member with a predetermined processing temperature condition. It is characterized in further comprising.

According to the third apparatus for manufacturing a card with an image receiving layer of the present invention, for example, the heat receiving temperature of the image receiving layer is not higher than Ta ° C. at which the image receiving layer receives heat to cause thermal diffusion, and the curing reaction of the reactive hot melt resin is completed. When the subsequent softening point is set to Tb ° C., the substrate member and one surface of the storage member are bonded by the first adhesive member at a heating temperature of [Tb− (35 ± 15)] ° C. by the bonding means. Since it is bonded via the first adhesive member and the other surface of the storage member and the member for the surface with the image receiving layer are bonded via the second adhesive member, it is bonded to the card. While electronic components can be protected by the storage member,
There is no thermal damage to the image receiving layer due to heating during bonding, and a non-contact type IC card with an image receiving layer having a high heat resistance temperature can be manufactured.

The method for producing a card with an image receiving layer according to the present invention comprises:
A step of forming an image receiving layer for thermally transferring a face image of the card user on the surface member, and bonding the surface member and the substrate member having the image receiving layer formed thereon to a reactive hot melt resin adhesive member And laminating under predetermined processing temperature conditions.

In the present invention, the heating temperature Ta at which the image receiving layer receives heat and causes thermal diffusion is Ta. The image receiving layer surface is heated for a predetermined time (several minutes to 10 minutes) (for example, the image receiving layer surface is heated with a heating plate). After the transfer, the density of the image transferred to the image receiving layer is 90% or less of the density of the image transferred to the unheated image receiving layer with the same thermal energy. The softening point Tb of the reactive hot-melt resin after the reaction is completed is determined by determining whether the adhesive is completely left to stand in an atmosphere of normal temperature and normal humidity (for example, 23 ° C. and 55% RH) for 10 days and the reaction is completely completed. It is the softening point. In addition, the softening point of the hot melt adhesive is determined by the "Hot melt adhesive test method" JAI-
7.

According to the method of manufacturing a card having an image receiving layer of the present invention, an adhesive made of a reactive hot melt resin generally has a property of absorbing moisture in the air and solidifying, so that it is difficult to use it as an adhesive. For example, at the time of the bonding step of the member for the surface with the image receiving layer and the member for the substrate, the image receiving layer is heat-sensitive temperature Ta ° C. or less causing heat diffusion and heat reception,
The softening point of the reactive hot melt resin after completion of the curing reaction is T
When the temperature is set to b ° C., the member for the surface and the member for the substrate are bonded at a heating temperature of [Tb− (35 ± 15)] ° C.

Accordingly, a card with an image receiving layer having no heat damage to the image receiving layer due to heating during bonding and having a high heat-resistant temperature can be formed.
In the field of use of cards such as an employee card, an employee card, a member card, a student card, an alien registration card, and various driver's licenses, a highly reliable electronic card with a face image can be provided.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a card with an image receiving layer, an apparatus for manufacturing the same, and a method for manufacturing the same will be described with reference to the drawings.

(1) First Embodiment FIG. 1 is a cross-sectional view showing a configuration example of a card 100 with an image receiving layer as a first embodiment of the present invention. In the present embodiment, in a card making method in which a member for a substrate and a member for a surface having an image receiving layer on which an image is formed by thermal transfer are bonded with an adhesive member interposed therebetween, low temperature bonding is performed. By doing so, it is possible to eliminate thermal damage to the image receiving layer and to provide a non-contact type IC card with a high heat resistant temperature, such as a face image, because the curing reaction proceeds after bonding and the heat resistant temperature rises. It is.

The card 100 with an image receiving layer shown in FIG. 1 has, for example, a vertical length of about 6 cm, a horizontal length of about 9 cm, a thickness of about 0.4 mm to 1.0 mm, and an adhesive member. Except for the above, it has a three-layer structure. On the lowermost layer of the card 100 with the image receiving layer, a back sheet 1 having a thickness of about 100 μm as a member for a substrate is provided. The sheet thickness of the back sheet 1 is preferably about 50 μm to 300 μm. The back sheet 1 further has a writing layer (not shown) that can be written with a pen.

In this example, a card electronic component 4 is provided on the back sheet 1. The electronic component 4 electrically records information related to the user of the card 100 with the image receiving layer.
C-shaped chip 4A and coil-shaped antenna 4B connected to IC chip 4A. The IC chip 4A is a memory only or a microcomputer in addition to the memory. The electronic component 4 may include a capacitor.

Since the card 100 with the image receiving layer is a non-contact type, there is no terminal for information input / output. The information is converted into a specific modulated radio wave and received by the antenna 4B.
The data is demodulated by the C chip and written into a memory or the like, or read out therefrom. In a method used for a normal non-contact type IC card, the driving power source can take in external electromagnetic energy into the antenna 4B. For example,
By rectifying the electromotive force generated by electromagnetic induction, D
Obtain C power. Of course, in addition to this, it is also conceivable to take in electricity from high-frequency electromagnetic energy from the outside into the antenna body 4B or another object.

A surface sheet 5 having a thickness of about 100 μm is provided on the electronic component 4 as a surface member with an image receiving layer, and the electronic component 4 is enclosed. This top sheet 5 has a face image forming area 54A for forming a face image.
have. The face image forming area 54A will be described with reference to the image receiving layer 54. This example has a laminated structure in which at least the back sheet 1, the top sheet 5, and the electronic component 4 are bonded together with a thin sheet-like adhesive member (hereinafter simply referred to as an adhesive sheet) interposed. For example, a thickness of 50 μm
The first adhesive sheet 10A of about 300 μm
The back surface of the C chip 4A is bonded to the back sheet,
The thickness between the surface of the C chip 4A and the top sheet 5 is 50 μm.
It is bonded by a second adhesive sheet 10B of about m to 300 μm.

As the adhesive sheets 10A and 10B, those obtained by previously forming a reactive hot melt resin into a thin sheet shape are used. Hereinafter, the reactive hot melt resin formed in a thin sheet shape is also referred to as a reactive hot melt web. Here, a method of forming a reactive hot melt web will be described. For example, a reactive hot melt resin is melt-coated to a predetermined thickness on a release sheet by a T-die or the like.
Thereafter, the reactive hot melt resin and the like on the releasable sheet are cooled. Then, the solidified reaction type hot melt resin or the like is wound into a roll.

Thus, a roll-type reactive hot melt web can be formed. In this example, the reactive hot melt is used in the form of a web having a thickness of 50 μm to 300 μm. The softening point of the reactive hot melt before the reaction is 50 ° C. to 130 ° C. or less. The softening point of the hot melt was measured by a method based on JAI-7, "Test Method for Hot Melt Adhesive" of the Japan Adhesive Industry Standard.

In the case of a reactive hot melt resin, the curing proceeds by absorbing moisture in the air. Therefore, the curing is prevented from proceeding before the lamination process. For this reason, the bonding process must be performed in a short time (for example, within 24 hours after the processing). In order to avoid such a time constraint, some storage method is required. In this example, regarding the storage of the reactive hot melt web, a method of storing the hot melt web in a sealed container filled with a gas containing 80% or more of N ₂ or CO ₂ is adopted. According to this storage method, it is possible to avoid time restrictions such as lamination processing within 24 hours after processing.

Further, when the roll-shaped adhesive sheet is spread, the electric charges are peeled off and charged, and when the electric charges come into contact with the IC chip, the chip may be broken. In order to cope with this, in this example, an antistatic coat is applied to the surface of the adhesive sheet, or a charge elimination process is performed before contacting the IC chip, thereby preventing chip breakage. At this time, AC
The discharging process can be performed by using a discharge, a discharging brush, a grounded cloth, or the like.

The topsheet 5 is formed, for example, on a film support 51 shown in FIG.
3. An image receiving layer 54 and an upper layer 55 are laminated. The second adhesive sheet 10B is attached to the film support 51 side. The image receiving layer 54 forms a face image forming area 54A. In this example, when the heat-sensitive temperature at which the image receiving layer 54 receives heat and causes thermal diffusion is Ta ° C., and the softening point after the completion of the curing reaction of the reactive hot melt resin is Tb ° C., at least the heat-sensitive temperature Ta or lower. Then, [Tb- (35 ± 1
5) The top sheet 5 and the back sheet 1 are heated at a heating temperature of ° C.
And are pasted together.

As the above-mentioned film support 51, a general plastic film such as polyester, polyolefin, polystyrene and ABS is used. In particular, it is preferably formed of a resin such as polyethylene terephthalate (PET) or polypropylene (PP). In particular, when a biaxially stretched resin is used, a thin topsheet 5 having excellent strength can be formed. Film support 5
For example, when a biaxially stretched polyethylene terephthalate resin is used, the thickness of
m) to 300 μm or less (especially 250 μm).

The above-mentioned cushion layer 52 has a function of improving the contact of the thermal head during the printing process of a face image or the like. As the cushion layer 52, the tensile elastic modulus (AST
Preferably M D790) is 20 kgf / mm ² or more, and is preferably 200 kgf / mm ² or less. The thickness of the cushion layer 52 is preferably 2 μm or more (particularly 5 μm) from the viewpoint of the cushion effect, and is 200 μm from the viewpoint of the overall thickness and curl suppression.
m or less (particularly 50 μm).

Accordingly, the members forming the cushion layer 52 include, for example, polyethylene resin, polypropylene resin, polybutadiene resin, ethylene-vinyl acetate copolymer resin, ethylene-ethyl acrylate copolymer resin,
Styrene-butadiene-styrene block copolymer resin, styrene-isoprene-styrene block copolymer resin, styrene-ethylene-butadiene-styrene block copolymer resin, styrene-hydrogenated isoprene-styrene block copolymer resin Is preferred since it has flexibility.

In this example, the top sheet 5 is made of a printing material, and image display information is printed in a predetermined area in advance. The image display information indicates the field in which the image receiving layer-equipped card 100 is used, for example, “XXX employee ID”, “name”, “issue date”.
... and so on. The printing member is provided with an image receiving layer 54 for forming a photograph of the face of the user of the card 100 with the image receiving layer. In this example, the image receiving layer 54 is an ink member made of a sublimable dye. For example, heat from a thermal head is applied from the ink sheet side containing the dye, and the dye is sublimated to the image receiving layer 54 by this heat, or
By being transferred, a face photograph or the like is formed.

As a material of the image receiving layer 54, a polymer material such as a polyester resin, a polyvinyl chloride resin, a polyvinyl acetal resin, a polyvinyl butyral resin, an epoxy resin, and an acrylic resin can be used. Therefore, when processed at a high temperature, the structure of the polymer material changes and the image receiving layer is damaged. The layer adjacent to the image receiving layer 54, for example, the film support 51 or the cushion layer 52 is preferably a resin mixed (containing) with a white pigment in order to enhance the image formed on the image receiving layer 54.

The present invention is not limited to this. In order to increase the whiteness, a layer provided with voids may be used. The voids provide cushioning. Preferred examples of the white pigment include, but are not limited to, titanium oxide, barium sulfate, and calcium carbonate.

Next, a method of forming the topsheet 5 will be described. For example, when a biaxially stretched polyethylene terephthalate resin is used, the topsheet 5 of this example is formed by laminating a polyolefin resin on a plastic film having a thickness of about 100 μm by an extrusion lamination method or the like, and forming a cushion having a thickness of about 20 μm. The layer 52 is formed. Thereafter, an anchor layer 53 having a thickness of about several μm is formed on the cushion layer 52 by coating. Then, an image receiving layer 54 having a thickness of about several μm is formed on the anchor layer 53 by coating. Thereafter, a film thickness of several μm is formed on the image receiving layer 54.
An upper layer 55 of about m is formed by coating. This allows
The topsheet 5 as shown in FIG. 2 is completed.

FIG. 3 is a cross-sectional view showing a laminated structure of the back sheet 1. The back sheet 1 of this example has a writing layer 12 below a film support 11. This writing layer 12
For example, it is formed by diffusing calcium carbonate and silica fine particles into a polyester emulsion. The first adhesive sheet 10A is stuck on the film support 11.

In this example, the adhesive sheets 10A and 10B have
A reactive hot melt resin is used. The reactive hot melt resin is of a type in which the resin is melted and bonded, and then the resin is cured by absorbing moisture. Its characteristics are that, compared to ordinary hot melt resins, reactive hot melt resins have a longer bondable time and a higher softening temperature after bonding, so they are more durable and can be applied at lower temperatures. Suitable for processing and bonding. That is, in a normal hot melt resin, the temperature of the resin at the time of coating (hereinafter, referred to as a coating temperature) is the same as the temperature at which the resin is softened (hereinafter, referred to as a softening temperature). It does not become heat resistant.
Therefore, when high heat resistance is required, a high coating temperature is required.

At that point, since the reactive hot melt resin is cured after coating, the softening temperature is higher than the coating temperature.
The temperature rises by several tens of degrees Celsius. Therefore, when the surface of the image receiving layer 54 is made of a material that is easily damaged at high temperatures, the damage can be reduced. An example of a reactive hot melt resin is a resin mainly composed of a urethane polymer containing an isocyanate group at a molecular terminal, and the isocyanate group is activated by reacting with water, and further, isocyanate group reacted with water. Reacts with the prepolymer to form a crosslinked structure.

The reactive hot melt resins usable in the present invention include TE030 and T30 manufactured by Sumitomo 3M Limited.
E100 or Hibon 482 manufactured by Hitachi Chemical Co., Ltd.
0, Bondmaster 170 manufactured by Kanebo UNS Co.
Series, Macroplast made by Henkel
QR3460 and the like.

As described above, according to the card 100 with the image receiving layer according to the present embodiment, the heat-sensitive temperature Ta ° C. of the image receiving layer 54 is obtained.
When the softening point of the reactive hot melt resin after completion of the reaction is Tb ° C., [Tb− (35 ± 1)
5) The adhesive sheet 10 shown in FIG.
A, 10B form a laminated bonding structure in which the electronic component 4 is bonded between the back sheet 1 and the top sheet 5 having the image receiving layer.

Accordingly, the card 100 with an image receiving layer having a high heat-resistant temperature can be provided, so that a card such as a cash card, an employee card, an employee card, a membership card, a student card, a alien registration card, and various driver's licenses can be provided. In the field of use, the reliability of an IC card with a face image or the like can be improved.

Next, an apparatus for manufacturing a card with an image receiving layer according to the present embodiment will be described. FIG. 5 is a perspective view showing a configuration example of the card manufacturing apparatus 101 with an image receiving layer as the first embodiment.

Card manufacturing apparatus with image receiving layer 10 of the present invention
1 shows a card 100 having an image receiving layer by enclosing an electronic component 4 between a long sheet-shaped back sheet 1 and a long sheet-shaped top sheet 5 and then cutting and punching the card assembly. Is to manufacture.

In FIG. 5, the card manufacturing apparatus 101 with an image receiving layer is provided with a back sheet supply section 6 as a first supply means, and a long sheet (web) back sheet 1 as a substrate member is provided. It is wound around the sending shaft 6A. Here, the long sheet shape means that at least one or more cards with an image receiving layer can be punched out, for example, “XXXXX employee card”, “Name”,
This refers to a state in which image display information such as “issue date” is continuously formed. As the long sheet-like form, it is assumed that image display information is arranged in n rows in the width direction and m pieces in the longitudinal direction.

An adhesive sheet supply section 14 as a second supply means is provided above the back sheet supply section 6, and the first adhesive sheet 10A is supplied onto the back sheet 1 by the back sheet supply section 6. . The adhesive sheet supply unit 14 has a delivery shaft 14A, and the delivery sheet 14A
A is wound, and the adhesive sheet 10A is unreeled from the delivery shaft 14A. Since both surfaces of the adhesive sheet 10A are adhesive surfaces, the adhesive surface is protected by the release sheet 24A. The release sheet 24A is peeled off from the adhesive sheet 10A at the time of laminating, and becomes a waste paper. An unillustrated static elimination brush is provided downstream of the adhesive sheet supply unit 14 so that the charge that has been peeled and charged when the roll-shaped adhesive sheet is spread is released to the ground before coming into contact with the IC chip. This static elimination processing can prevent electrostatic breakdown of the IC chip.

Above the adhesive sheet supply section 14, a third
Is provided, and the electronic component 4 for a card is automatically supplied onto the adhesive sheet 10A by the adhesive sheet supply unit 14. The component transport belt 22 is driven based on, for example, a component transport control signal S4B. The component cassette 21 is located upstream of the component transport belt 22.
Is provided, for example, electronic components 4 divided into three groups are stored in a stacked manner. Parts cassette 2
For example, three movable lids (not shown) are provided at the bottom of the unit 1 in the transport direction, and the three lids are simultaneously opened based on the release permission signal S4A, and the electronic component 4 is moved to the component transport belt 22. It is made to fall at the same time.

An adhesive sheet supply section 15 as fourth supply means is provided above the component transport belt 22, and the second adhesive sheet 10 B is supplied onto the electronic component 4 by the component transport belt 22. The adhesive sheet supply unit 15 has a feed shaft 15A, and the adhesive sheet 1 is attached to the feed shaft 15A.
OB is wound, and the adhesive sheet 10B is unreeled from the delivery shaft 15A. Since both surfaces of the adhesive sheet 10B are also adhesive surfaces, the adhesive surface is protected by the release sheet 24B. This peeling sheet 24B is peeled off from the adhesive sheet 10B at the time of laminating, and becomes a waste paper. A discharging brush (not shown) is provided on the downstream side of the adhesive sheet supply section 15 so that the peeled and charged electric charge is released to the ground. As described above, the electrostatic discharge of the IC chip can be prevented by this static elimination process.

As the above-mentioned adhesive sheets 10A and 10B, thin sheets of reactive hot melt resin are used in advance. Above the adhesive sheet supply unit 15, a fifth
Is provided, and a top sheet 5 having an image receiving layer as a front member is supplied onto the adhesive sheet 10B. The top sheet supply unit 9 has a delivery shaft 9A, around which the top sheet 5 is wound, and the top sheet 5 is fed out from the delivery shaft 9A. The top sheet 5 is provided with the image receiving layer 54 and “OO
Image display information such as "employee's card", "name" and "issue date" are arranged in three columns in the width direction, and the image display information is printed continuously in the transport direction.

Driven rollers 19B and 19C are provided on the downstream side of the back sheet supply section 6, and driven rollers 19A are provided on the downstream side of the top sheet supply section 9, and the transfer direction of the back sheet 1 and the top sheet 5 is provided. Has been made changeable. A drive roller 16 for guiding and positioning is provided downstream of the five back sheet supply units 6, the adhesive sheet supply unit 14, the component conveying belt 22, the adhesive sheet supply unit 15, and the top sheet supply unit 9.

In this example, a positioning device 23 is provided on a region connecting the driven roller 19B and the driving roller 16 in the horizontal direction.
Is provided, and the electronic component 4 transported by the component transport belt 22 is disposed at a predetermined position on the adhesive sheet 10A. The positioning device 23 is a rectangular 3 parallel to the transport direction.
When the electronic component 4 having the two openings 23A and being conveyed by the component conveying belt 22 is dropped into the opening 23A, the electronic components 4 are arranged in three rows on the adhesive sheet 10A. Is made.

In the drive roller 16, the long sheet-shaped back sheet 1, the electronic component 4, and the long sheet-shaped top sheet are formed based on the alignment marks p0 (shown in FIGS. 9 and 12) printed in advance. 5 are aligned and guided in the direction of the vacuum heat press 17. On the downstream side of the drive roller 16, a vacuum heat press device as a bonding means is provided,
At least the heat-sensitive temperature of the image receiving layer 54 is equal to or lower than Ta ° C., and the heat-resistant temperature Tb ° C. of the reactive hot melt resin is:
At a heating temperature of [Tb− (35 ± 15)] ° C., the back sheet 1 and one surface of the electronic component 4 are bonded together with the adhesive sheet 10A, and the other surface and the front surface of the electronic component 4 are bonded with the adhesive sheet 10B. The sheet 5 is bonded.

This vacuum heat press device 17 is a flat type upper and lower press portion 17 which is disposed to face the upper and lower sides of the transport path.
A, 17B, and a long sheet-like surface sheet 5
A predetermined pressure is applied from above and below the long sheet-shaped back sheet 1. For this purpose, the upper and lower press sections 17A and 17B can be moved in a direction in which they are separated from each other. In this example, the electronic component 4 enclosed between the back sheet 1 and the top sheet 5 with the adhesive sheets 10A and 10B interposed therebetween is hereinafter referred to as a card assembly 20.

The upper and lower press sections 17A, 17B
Inside, an electric heater (not shown) 18 is provided to heat the card assembly 20 to a predetermined temperature (see FIG. 6 for the electric heater 18). In this example, the heating temperature is 4 depending on the type of the adhesive sheets 10A and 10B.
It is about 0 ° C to 120 ° C, and the heating time is 10 seconds to 120 ° C.
On the order of seconds. The adhesive sheets 10A and 10B melt when heated, and solidify when cooled. The device for heating and bonding the card assembly 20 is not limited to the vacuum hot press device 17, but may be a normal hot press or a heat roller device.

A card sheet transport belt 30 is provided downstream of the vacuum hot press device 17 to transfer the card assembly 20 heated and bonded by the vacuum hot press device 17 in a predetermined transport direction, in this example, a cutting device. It is conveyed to 40.
At this time, the moving distance of the card sheet conveying belt 30 is equal to the length L1 of the vacuum heat press device 17 in the conveying direction. A cutting device 40 is provided downstream of the card sheet transport belt 30.
Is provided, and the card assembly 20 is cut for each unit (for example, 3 rows × 2). As the cutting device 40, a vertical push-type cutter or a rotary cutter is used.

Next, a control method of the card manufacturing apparatus 101 with an image receiving layer will be described with reference to FIG.
FIG. 6 is a block diagram showing an outline of an example of a control system of the card manufacturing apparatus 101 with an image receiving layer.

In this example, a card manufacturing apparatus 10 with an image receiving layer
A control device 70 for controlling the entirety of the electronic component 1 is provided. In order to drop the electronic component 4 onto the adhesive sheet 10A at a predetermined timing, a release permission signal S4A is output to the component cassette 21 and a component transport control signal S4B is It is output to the conveyor belt 22. Further, the control device 70 detects an alignment mark p0 (shown in FIGS. 9, 12 and the like) formed in advance on the card assembly 20, and controls the card sheet transport belt 30 based on the detection. In this control system, a delivery detection sensor 71 is provided on the vacuum heat press device 17 side, and the alignment mark p0 of the card assembly 20 is detected at the card delivery position p1. The sensor 71 outputs a card sending position detection signal S1. An arrival detection sensor 72 is provided on the cutting device 40 side, and the alignment mark p of the card assembly 20 is provided at the card arrival position p2.
0 is detected. The sensor 72 outputs a card arrival detection signal S2.

The output stages of these sensors 71 and 72 include:
The control device 70 is connected, and the card sheet transport belt 30 is controlled based on the two detection signals S1 and S2. For example, the control device 70 controls the card sheet transport belt 30 to operate intermittently between the card delivery position p1 and the card arrival position p2. If the topsheet 5 is a long sheet and non-stretchable, only one of the sensors 71 and 72 can be used.

In this example, in order to form the card 100 with the image receiving layer, on the other hand, the back sheet 1 is fed out from the back sheet supply section 6 to the drive roller 16 via the driven rollers 19B and 19C, and the adhesive sheet supply section is provided. 14 to the drive roller 16 via the driven roller 19B and the adhesive sheet 10A.
From the component conveying belt 22 and the adhesive sheet 10A.
The electronic component 4 is supplied upward, the adhesive sheet 10B is fed from the adhesive sheet supply unit 15 to the drive roller 16, and the top sheet 5 is fed from the top sheet supply unit 9 to the drive roller 16 via the driven roller 19A.

Thereafter, the control device 70 sends the driving roller 16
When the drive control signal S3 is output, the drive roller 16 rotates. Then, an adhesive sheet 10A is provided between the long sheet-shaped back sheet 1 and the long sheet-shaped top sheet 5,
Card assembly 2 enclosing electronic component 4 with 10B interposed
0 is guided to the vacuum heat press device 17 by the drive roller 16. The control device 70 outputs a heating bonding control signal S5 to the vacuum heat press device 17.

In this vacuum heat press 17, the temperature and press pressure of the upper press section 17A and the lower press section 17B are controlled to be constant. The leading end of the first card assembly 20 is made to protrude from the vacuum heat press device 17. When the first heat bonding is completed, an end signal S6 is output from the vacuum heat press device 17 to the control device 70. This tip is detected by the sensor 71. The card sending position detection signal S1 by the sensor 71 is obtained by detecting the alignment mark p1.

A belt transport control signal S 7 is output to the card sheet transport belt 30 from the controller 70 which has received the card sending position detection signal S 1. The card sheet transport belt 30 starts to move by placing the card assembly 20 on the basis of the belt transport control signal S7, and the card assembly 20 after the first heat bonding is transported from the vacuum heat press device 17 to the cutting device 40. You. At this time, the drive rollers 16 also cooperate to move the card assembly 20 downstream. At this stage, the card assembly 20 has not been cut.

When the first card assembly 20 is conveyed from the vacuum hot press device 17 to the cutting device 40, the sensor 72
Thus, the arrival of the card assembly 20 is detected. The sensor 72 outputs a card delivery arrival detection signal S2 to the control device 70. The controller 70 that has received the card delivery arrival detection signal S2 outputs the belt transport control signal S7 to the card sheet transport belt 30, so that the card sheet transport belt 30 stops. Although not shown, a fan is provided on the downstream side of the vacuum hot press device 17, and the card assembly 20 discharged from the vacuum hot press device 17 is cooled by the wind by the fan until the card assembly 20 is cut.

On the other hand, in the component cassette 21, the electronic component 4 is dropped onto the component transport belt 22 at a predetermined timing based on the drop permission signal S4A, and the component transport control signal S4B
, The component transport belt 22 is driven. Thereby, the electronic component 4 is supplied onto the adhesive sheet 10A with good timing. In the vacuum heat press device 17, the second heat bonding is performed. When the second heat bonding is completed, the vacuum heat press device 17 outputs an end signal S6 to the control device 70.

Thereafter, a belt transport control signal S7 is output to the card sheet transport belt 30 from the control device 70 which has received the card sending position detection signal S1 from the sensor 71. The card sheet transport belt 30 starts moving the card assembly 20 by the belt transport control signal S7,
The card assembly 20 after the second heat bonding is conveyed from the vacuum hot press device 17 to the cutting device 40.

At this time, the drive rollers 16 also move the card assembly 20 downstream in cooperation. At this stage, the card assembly 20 can be cut. Therefore, when the second card assembly 20 is transported from the vacuum heat press device 17 to the cutting device 40, the sensor 72 detects that the card assembly 20 has arrived. A card arrival detection signal S2 is output from the sensor 72 to the control device 70.
The control device 70 that has received the card arrival detection signal S2 outputs the belt conveyance control signal S7 to the card sheet conveyance belt 30, so that the card sheet conveyance belt 30 stops.

At the same time, a cutting control signal S 8 is output to the cutting device 40. In the cutting device 40 to which the cutting control signal S8 is input, the card assembly 20 is cut into one unit of a card sheet with an image receiving layer. Similar operations are repeated for the third and subsequent times. Thereby, a plurality of image-receiving layer-attached card sheets can be obtained from the long sheet-shaped card assembly 20. The card sheet with the image receiving layer is air-dried for about 3 to 6 days, and after the adhesive sheets 10A and 10B are completely cured, the card 100 with the image receiving layer is punched out one by one.

As described above, according to the card manufacturing apparatus 101 with the image receiving layer according to the first embodiment, the vacuum hot press 17 is used to set the temperature of the image receiving layer 54 below the heat-sensitive temperature Ta ° C. With respect to the heat-resistant temperature Tb ° C., the back sheet 1 and one surface of the electronic component 4 are interposed with the adhesive sheet 10A in a state where heat is applied by a heating temperature of [Tb− (35 ± 15)] ° C. At the same time, the other surface of the electronic component 4 and the top sheet 5 are bonded via the adhesive sheet 10B.

Therefore, the pressing force of the vacuum hot pressing device 17 and the deformation of the adhesive sheets 10A and 10B due to the heat melting cause the space between one surface of the electronic component 4 and the top sheet 5 and the other surface and the back surface of the electronic component 4 The thickness of the adhesive layer with the sheet 1 can be made uniform. As a result, the electronic component 4 can be sandwiched between the adhesive sheets 10A and 10B having a uniform thickness after heat melting by the top sheet 5 and the back sheet 1, so that the card surface is flat with almost no irregularities and the card thickness is thin. In addition, a non-contact type IC card with an image receiving layer having a high heat-resistant temperature can be manufactured.

Next, a method for manufacturing the card 100 with the image receiving layer according to the first embodiment will be described with reference to FIGS. 7A to 7C are cross-sectional views of an example of a forming process (part 1) showing a method for manufacturing the card 100 with an image receiving layer as the first embodiment, and FIGS. 8A and 8B are diagrams of an example of the forming process (part 2). It is sectional drawing. 9 to 12 are top views showing each sheet-like member that complements the sheet-like member.

In this example, the image receiving layer 54 for thermally transferring the face image of the card user is formed on the top sheet 5, and the back sheet 1 in the form of a long sheet and the back sheet 1 in the form of a long sheet are used. Card assembly 2 in which electronic component 4 is bonded to surface sheet 5 via adhesive sheets 10A and 10B.
The case where 0 is formed will be described.

The back sheet 1 is wound around the delivery shaft 6A of the back sheet supply section 6 shown in FIG.
Is wound around a delivery shaft 14A of the adhesive sheet supply unit 14. The electronic components 4 are stored in the component cassette 21 in advance. Further, the adhesive sheet 10B is wound around a delivery shaft 15A of the adhesive sheet supply unit 15, and the topsheet 5 with the image receiving layer is wound around a delivery shaft 9A of the topsheet supply unit 9.
It is assumed that these members are prepared.

First, in FIG. 7A, the adhesive sheet supply unit 1 is placed on the back sheet 1 fed from the back sheet supply unit 6.
The adhesive sheet 10A drawn out from Step 4 is bonded. A reactive hot melt resin is used as the adhesive sheet 10A. In this example, the softening point of the reactive hot melt resin after the completion of the reaction is 95 ° C. or higher.

In this case, the softening point is set to 95 ° C. or higher because an employee card, an employee card, a member card, a student card, an alien registration card, various driver's licenses, etc. are placed in a parked car under the sunshine. Assuming that the temperature inside the vehicle reaches 90 ° C., the softening point of the reactive hot melt resin after the reaction needs to be 95 ° C. or higher. Therefore, the processing temperature in the vacuum heat press device 17 is as follows when the heat-sensitive temperature Ta of the image receiving layer 54 is 90 ° C.
The temperature is equal to or lower than the heat-sensitive temperature Ta, and [Tb− (35 ± 1)
5)] From the relational expression of ° C., the upper limit heating temperature is 75 ° C., and the lower limit heating temperature is 45 ° C. In this example, an intermediate value between the upper limit heating temperature of 75 ° C. and the lower limit heating temperature of 45 ° C. is taken, and the bonding condition is set to heating temperature = 60 ° C.

The back sheet 1 has a writing layer 12 shown in FIG. 9 that can be written with a pen. This back sheet 1
Is also pre-printed with an alignment mark p0 at the end of. The alignment mark p0 is formed for each one or a plurality of card areas. Alignment mark p0
May be a black line or block having a low reflectance that can be detected by an optical sensor, but may be a magnetic mark, a slit or a hole.

Thereafter, the electronic component 4 is placed on the adhesive sheet 10A shown in FIG. 7B. The electronic component 4 has an IC chip 4A and an antenna 4B shown in FIG. 10, and is automatically supplied onto the adhesive sheet 10A via a component conveying belt 22 and a positioning tool 23. The electronic component 4 is stocked in a component cassette 21 shown in FIG. 11, and the electronic component 4 is arranged on the adhesive sheet 10A via the component conveying belt 22 and the positioning tool 23.

The electronic component 4 may be stored in the component cassette 21 in a state where the electronic component 4 is stored in the chip storage sheet 3 in a sheet shape in advance. The electronic component 4 housed in the chip housing sheet 3 can be arranged on the adhesive sheet 10A. The chip storage sheet 3 is made of a woven or nonwoven resin sheet. Electronic component 4 is an IC
The chip 4A and the antenna body 4B are housed therein, and include a chip capacitor and the like.

After forming the electronic component 4 on the adhesive sheet 10A, the adhesive sheet 10B is attached on the electronic component 4 in FIG. 7C. As the adhesive sheet 10B, a sheet in which a reactive hot melt resin is formed in a thin sheet shape in advance is used.

Then, in FIG. 8A, the adhesive sheet 10
On the entire surface of B, a long sheet-shaped top sheet 5 fed from the top sheet supply unit 9 is formed. Image display information for the user of the card 100 with the image receiving layer is printed in advance on a predetermined printing area shown in FIG. In this example, the top sheet 5 shown in FIG. 12 has a long sheet shape in which image display information is continuously printed in the transport direction. An alignment mark p0 is printed on the end of the topsheet 5 in advance. In this example, the long sheet-shaped top sheet 5 includes “XX employee identification”, “name”,
Image display information such as “issue date” is arranged in three columns in the width direction, and the image display information is printed continuously in the transport direction.

Thereafter, the card assembly 20 is heated, and a pressing process is performed from the top sheet 5 side and the back sheet 1 side shown in FIG. 8B. In this example, the bonding condition is heating temperature = 60.
° C and the heating time was about 30 seconds. The pressure is 5k
g / cm ² . At this time, the temperature and the press pressure of the upper press section 17A and the lower press section 17B shown in FIG. Thus, the long sheet-shaped card assembly 20 is completed.

In this example, the card assembly 20 is cut to form one unit of a card sheet with an image receiving layer. For example,
The card assembly 20 is cut into two or more pieces based on the alignment mark p0 formed outside the image display area of the card assembly 20. Then, after the card sheet with the image receiving layer is completely cured, the card 100 with the image receiving layer is punched out one by one by a punching device or the like.

As described above, according to the method for manufacturing the card 100 with the image receiving layer according to the first embodiment, the adhesive sheet 10A in which the reactive hot melt resin is formed into a thin sheet is formed on the surface of the electronic component 4. Similarly, a thin sheet-like adhesive sheet 10B is formed on the back surface, and heat is applied to these adhesive sheets 10A and 10B by a vacuum hot press device 17 at a heating temperature of 60 ° C. The front sheet 5 is formed, and the back sheet 1 is formed on the back surface of the electronic component 4.

Therefore, in the portion where the electronic component 4 is not provided, the adhesive sheets 10A and 10B are completely integrated by the heat melting and pressurization, and between the front surface of the electronic component 4 and the top sheet 5 and the back surface of the electronic component 4. The thickness of the adhesive layer between the back sheet 1 and the back sheet 1 can be made uniform.

As a result, the electronic component 4 is fixed to the adhesive sheet 10 having a uniform thickness by the top sheet 5 and the back sheet 1.
A, 10B. Therefore, it is possible to form a non-contact type IC card with a non-contact image receiving layer with good reproducibility, which is flat with almost no irregularities on the card surface, has a small card thickness, and has a high heat-resistant temperature Tb. In the field of card use such as card, employee card, membership card, student card, alien registration card and various driver's licenses, it is possible to provide highly reliable electronic cards with face images.

(2) Second Embodiment FIG. 13 is a sectional view showing a configuration example of a card 200 with an image receiving layer as a second embodiment of the present invention. In this embodiment, a member for a substrate with an adhesive and a member for a surface with an adhesive with an image receiving layer are prepared in advance, and the member for the substrate with the adhesive and one surface of the electronic component are prepared. By laminating the other surface of the electronic component and the member for the surface with the adhesive having the image receiving layer under a predetermined processing temperature condition, heat damage of the image receiving layer can be eliminated. ,And,
The curing reaction proceeds after bonding and the heat-resistant temperature rises, so that a non-contact type IC card with a face image with a high heat-resistant temperature can be provided.

The card 200 with an image receiving layer shown in FIG. 13 has, for example, a vertical length of about 6 cm, a horizontal length of about 9 cm, a thickness of about 0.4 mm to 1.0 mm, and an adhesive member. It has a three-layer structure. On the lowermost layer of the card 200 with an image receiving layer, a back sheet 1a with an adhesive is provided as a substrate member to which an adhesive member is attached in advance. The back sheet 1a is about 100 μm, and 50 μm to 300 μm.
A sheet thickness of about m is preferred. The formation of the adhesive member on the back sheet 1a is performed by applying a predetermined thickness to the back sheet 1a by a T-die method or the like melted as an adhesive. The adhesive-backed sheet 1a further has a writing layer (not shown) that can be written with a pen.

In this example, an electronic component 4 for a card is provided on the adhesive-backed sheet 1a. The electronic components 4 are an IC chip 4A for electrically recording information relating to the user of the card 200 with the image receiving layer, and a coiled antenna 4B connected to the IC chip 4A. The IC chip 4A is a memory only or a microcomputer in addition to the memory. The electronic component 4 may include a capacitor.

Since the card 200 with the image receiving layer is a non-contact type, there is no terminal for information input / output. The information is converted into a specific modulated radio wave and received by the antenna 4B.
The data is demodulated by the C chip and written into a memory or the like, or read out therefrom. In a method used for a normal non-contact type IC card, the driving power source can take in external electromagnetic energy into the antenna 4B. For example,
By rectifying the electromotive force generated by electromagnetic induction, D
Obtain C power. Of course, in addition to this, it is also conceivable to take in electricity from high-frequency electromagnetic energy from the outside into the antenna body 4B or another object.

A surface sheet 5a with an adhesive is provided on the electronic component 4 as a surface member with an image receiving layer, and the electronic component 4 is enclosed. The thickness of the top sheet 5a is about 100 μm, and a sheet thickness of about 50 to 300 μm is preferable. The formation of the adhesive member on the topsheet 5a is performed by applying a predetermined thickness to the topsheet 5a by a T-die method or the like melted as an adhesive. A reactive hot melt resin is used for these adhesives.

In this example, a reactive hot melt having a thickness of 5 mm was used.
Coating is performed at 0 to 300 μm. The softening point of the reactive hot melt before the reaction is 50 ° C. to 130 ° C. or less. The softening point of the hot melt was measured by a method based on JAI-7, "Test Method for Hot Melt Adhesive" of the Japan Adhesive Industry Standard.

In the case of the reactive hot melt resin, the curing proceeds by absorbing moisture in the air. Therefore, the curing is prevented from proceeding before the laminating process. For this reason, the bonding process must be performed in a short time (for example, within 24 hours after the processing). In order to avoid such a time constraint, some storage method is required. In this example, a method of storing a sheet with a reaction type hot melt in a closed container in which a gas containing 80% or more of N ₂ or CO ₂ is sealed is adopted. According to this storage method, it is possible to avoid time restrictions such as lamination processing within 24 hours after processing.

The details of the top sheet 5a and the back sheet 1a are the same as in the first embodiment. Also, the reactive hot melt resin is the same as that of the first embodiment, and the description thereof is omitted.

As described above, according to the card 200 with the image receiving layer according to the present embodiment, the heat-sensitive temperature Ta ° C. of the image receiving layer 54 is obtained.
When the softening point of the reactive hot melt resin after completion of the reaction is Tb ° C., [Tb− (35 ± 1)
5)] A backing sheet 1a with an adhesive and a topsheet 5a with an adhesive having an image receiving layer shown in FIG.
To form a laminated bonding structure in which the electronic component 4 is bonded.

Therefore, it is possible to provide the card 200 with an image-receiving layer having a high heat-resistant temperature, so that a card such as a cash card, an employee card, an employee card, a member card, a student card, an alien registration card and various driver's licenses can be provided. In the field of use, the reliability of an IC card with a face image or the like can be improved.

Next, an apparatus for manufacturing a card with an image receiving layer according to the present embodiment will be described. FIG. 14 is a perspective view showing a configuration example of a card manufacturing apparatus 201 with an image receiving layer as the second embodiment.

Card Manufacturing Apparatus 20 with Image Receiving Layer of the Present Invention
1 is to cut and punch out the card assembly after enclosing the electronic component 4 between the long sheet-shaped back sheet 1a with adhesive and the long sheet-shaped top sheet 5a with adhesive. And a card 200 with an image receiving layer.

In FIG. 14, the card manufacturing apparatus 201 with an image receiving layer is provided with a back sheet supply section 6B with an adhesive as a first supply means, and a long sheet-like (web-like) adhesive as a substrate member is provided. The back sheet 1a with the agent is wound around the delivery shaft 6A. Here, the long sheet shape means that at least one or more cards with an image receiving layer can be punched out, for example, “○
This refers to a form in which image display information such as "employee's card", "name", and "issue date" is continuously formed. As the long sheet-like form, it is assumed that image display information is arranged in n rows in the width direction and m pieces in the longitudinal direction.

The second above the adhesive sheet supply section 6B
Is provided, and the electronic component 4 for the card is automatically supplied onto the adhesive-backed sheet 1a by the adhesive-backed sheet supply section 6B. The component transport belt 22 is, for example, a component transport control signal S4
Drive based on B. A component cassette 21 is provided on the upstream side of the component transport belt 22, and accommodates, for example, electronic components 4 divided into three groups in a stacked manner. At the bottom of the component cassette 21, for example, three movable lids (not shown) are arranged side by side in the transport direction, and the three lids are opened at the same time based on the release permission signal S4A, and the electronic component 4 is transported. It falls on the belt 22 at the same time.

Above the component transport belt 22, a top sheet supply unit 9B with adhesive is provided as third supply means, and an image receiving layer as a surface member is provided on the electronic component 4 by the component transport belt 22. The supplied top sheet with adhesive 5a is supplied. Top sheet supply unit 9B with adhesive
Has a delivery shaft 9A, and the delivery shaft 9A is wound with a surface sheet 5a with an adhesive.
Is fed out from the delivery shaft 9A. The surface sheet 5a with the adhesive is provided with the image receiving layer 54 and the "employee of XXX employee",
Image display information such as "name" and "issue date" are arranged in three columns in the width direction, and the image display information is printed continuously in the transport direction.

Driven rollers 19B and 19C are provided on the downstream side of the adhesive-backed sheet supply section 6B, and driven rollers 19A are provided on the downstream side of the adhesive-backed sheet supply section 9B. The transport direction of the top sheet 1a and the adhesive-attached top sheet 5a can be changed. These three adhesive-backed sheet supply units 6
A drive roller 16 for guiding and positioning is provided on the downstream side of B, the component conveying belt 22 and the top sheet supply unit 9B with adhesive.

In this example, a positioning device 23 is provided on a region connecting the driven roller 19B and the driving roller 16 in the horizontal direction.
Is provided, and the electronic component 4 conveyed by the component conveying belt 22 is disposed at a predetermined position on the adhesive-backed sheet 1a. The positioning tool 23 has three rectangular openings 23A parallel to the conveying direction.
When the electronic components 4 transported by the above are dropped into the opening 23A, the electronic components 4 are arranged in three rows on the adhesive-backed sheet 1a.

In the drive roller 16 described above, the long sheet-shaped back sheet 1a with adhesive, the electronic component 4, and the long sheet are formed based on the pre-printed alignment marks p0 (shown in FIGS. 9 and 12). The sheet-like surface sheet with adhesive 5a is aligned and guided in the direction of the vacuum hot press device 17. A vacuum heat press as a bonding means is provided downstream of the drive roller 16, and at least the image receiving layer 5 is provided.
4 is not more than the heat-sensitive temperature Ta ° C., and the heat-resistant temperature Tb ° C. of the reactive hot-melt resin is represented by [Tb− (35 ± 1)
5) The backing sheet 1a with the adhesive is applied at a heating temperature of
And one surface of the electronic component 4, and the other surface of the electronic component 4 is bonded to the surface sheet 5 a with an adhesive.

This vacuum heat press device 17 is a flat type upper and lower press portion 17 which is disposed to face the upper and lower sides of the transport path.
A and 17B, and a predetermined pressure is applied from above the long sheet-like adhesive-backed top sheet 5a and from below the long sheet-like adhesive-backed sheet 1a. For this purpose, the upper and lower press sections 17A and 17B can be moved in a direction in which they are separated from each other. In this example, a back sheet 1a with an adhesive and a top sheet 5 with an adhesive
The electronic component 4 encapsulated between the two is referred to as a card assembly 20 hereinafter.

The upper and lower press sections 17A, 17B
Inside, an electric heater (not shown) 18 is provided to heat the card assembly 20 to a predetermined temperature (see FIG. 6 for the electric heater 18). In this example, the heating temperature is about 40 ° C. to 120 ° C., and the heating time is 10 minutes.
Seconds to about 120 seconds. The device for heating and bonding the card assembly 20 is not limited to the vacuum hot press device 17, but may be a normal hot press or a heat roller device.

A card sheet transport belt 30 is provided on the downstream side of the vacuum hot press device 17, and the card assembly 20 heated and bonded by the vacuum hot press device 17 is transported in a predetermined transport direction, in this example, a cutting device. It is transported to 40.
At this time, the moving distance of the card sheet conveying belt 30 is equal to the length L1 of the vacuum heat press device 17 in the conveying direction. A cutting device 40 is provided downstream of the card sheet transport belt 30.
Is provided, and the card assembly 20 is cut for each unit (for example, 3 rows × 2). As the cutting device 40, a vertical push-type cutter or a rotary cutter is used.

Next, with reference to FIG. 15, a method of manufacturing the card 200 with the image receiving layer according to the second embodiment will be described with reference to a method of controlling the card manufacturing apparatus 201 with the image receiving layer. FIG. 15 is a block diagram showing an outline of an example of a control system of the card manufacturing apparatus 201 with an image receiving layer. Regarding the formation process diagram as the second embodiment, the description is omitted with reference to the formation process diagram of the first embodiment.

In this example, a card manufacturing apparatus 20 with an image receiving layer is used.
A control device 70 for controlling the entirety of the component cassette 2 is provided. In order to drop the electronic component 4 onto the adhesive-backed sheet 1a at a predetermined timing, the release permission signal S4A is transmitted to the component cassette 2
1 and the component transport control signal S4B is output to the component transport belt 22. Further, the control device 70 controls the alignment mark p0 (FIG. 9,
12 and the like, and the card sheet transport belt 30 is controlled based on the detection. In this control system, a delivery detection sensor 71 is provided on the vacuum heat press device 17 side, and the alignment mark p0 of the card assembly 20 is detected at the card delivery position p1. The sensor 71 outputs a card sending position detection signal S1. Also,
An arrival detection sensor 72 is provided on the cutting device 40 side, and an alignment mark p0 of the card assembly 20 is detected at the card arrival position p2. The sensor 72 outputs a card arrival detection signal S2.

The output stages of these sensors 71 and 72 include:
The control device 70 is connected, and the card sheet transport belt 30 is controlled based on the two detection signals S1 and S2. For example, the control device 70 controls the card sheet transport belt 30 to operate intermittently between the card delivery position p1 and the card arrival position p2. If the surface sheet 5a with the adhesive is a long sheet and non-stretchable, the sensors 71, 7
2 can be used alone.

In this example, to form the card 200 with the image receiving layer, on the other hand, the back sheet supply unit 6 with the adhesive
B feeds the back sheet 1a with adhesive to the drive roller 16 via the driven rollers 19B and 19C, supplies the electronic component 4 from the component transport belt 22 onto the back sheet 1a with adhesive, and supplies the top sheet with adhesive. The top sheet 5a with adhesive is fed from the portion 9B to the drive roller 16 via the driven roller 19A.

Thereafter, the control device 70 sends the driving roller 16
When the drive control signal S3 is output, the drive roller 16 rotates. Then, the card assembly 20 in which the electronic components 4 are sealed between the long sheet-shaped back sheet 1a with adhesive and the long sheet-shaped top sheet 5a with adhesive is driven by a driving roller 16 into a vacuum heat press device. It is led to 17.
The control device 70 outputs a heating bonding control signal S5 to the vacuum heat press device 17.

In this vacuum hot press apparatus 17, the temperature and press pressure of the upper press section 17A and the lower press section 17B are controlled to be constant. The leading end of the first card assembly 20 is made to protrude from the vacuum heat press device 17. When the first heat bonding is completed, an end signal S6 is output from the vacuum heat press device 17 to the control device 70. This tip is detected by the sensor 71. The card sending position detection signal S1 by the sensor 71 is obtained by detecting the alignment mark p1.

The belt transport control signal S7 is output to the card sheet transport belt 30 from the control device 70 which has received the card sending position detection signal S1. The card sheet transport belt 30 starts to move with the card assembly 20 placed thereon by the belt transport control signal S7, and the card assembly 20 after the first heat bonding is transported from the vacuum heat press device 17 to the cutting device 40. You. At this time, the drive rollers 16 also cooperate to move the card assembly 20 downstream. At this stage, the card assembly 20 has not been cut.

When the first card assembly 20 is transported from the vacuum hot press device 17 to the cutting device 40, the sensor 72
Thus, the arrival of the card assembly 20 is detected. The sensor 72 outputs a card delivery arrival detection signal S2 to the control device 70. The controller 70 that has received the card delivery arrival detection signal S2 outputs the belt transport control signal S7 to the card sheet transport belt 30, so that the card sheet transport belt 30 stops. Although not shown, a fan is provided on the downstream side of the vacuum hot press device 17, and the card assembly 20 discharged from the vacuum hot press device 17 is cooled by the wind from the fan until the card assembly 20 is cut.

On the other hand, in the component cassette 21, the electronic component 4 is dropped on the component transport belt 22 at a predetermined timing based on the drop permission signal S4A, and the component transport control signal S4B
, The component transport belt 22 is driven. Thereby, the electronic component 4 is supplied onto the adhesive sheet 10A with good timing. In the vacuum heat press device 17, the second heat bonding is performed. When the second heat bonding is completed, the vacuum heat press device 17 outputs an end signal S6 to the control device 70.

Thereafter, a belt transport control signal S7 is output to the card sheet transport belt 30 from the control device 70 which has received the card output position detection signal S1 from the sensor 71. The card sheet transport belt 30 starts moving the card assembly 20 by the belt transport control signal S7,
The card assembly 20 after the second heat bonding is conveyed from the vacuum hot press device 17 to the cutting device 40.

At this time, the drive rollers 16 also move the card assembly 20 downstream in cooperation. At this stage, the card assembly 20 can be cut. Therefore, when the second card assembly 20 is transported from the vacuum heat press device 17 to the cutting device 40, the sensor 72 detects that the card assembly 20 has arrived. A card arrival detection signal S2 is output from the sensor 72 to the control device 70.
The control device 70 that has received the card arrival detection signal S2 outputs the belt conveyance control signal S7 to the card sheet conveyance belt 30, so that the card sheet conveyance belt 30 stops.

At the same time, a cutting control signal S8 is output to the cutting device 40. In the cutting device 40 to which the cutting control signal S8 is input, the card assembly 20 is cut into one unit of a card sheet with an image receiving layer. Similar operations are repeated for the third and subsequent times. Thereby, a plurality of image-receiving layer-attached card sheets can be obtained from the long sheet-shaped card assembly 20. The card sheet with the image receiving layer is air-dried for about 3 to 6 days, and after the adhesive is completely cured, the cards 200 with the image receiving layer are punched out one by one.

As described above, the card manufacturing apparatus 201 with the image receiving layer and the card 2 with the image receiving layer as the second embodiment
According to the manufacturing method of No. 00, the heat-sensitive temperature of the image receiving layer 54 is lower than or equal to Ta ° C. and the heat-resistant temperature Tb ° C. of the reactive hot-melt resin is determined by the vacuum heat press 17 according to [Tb−
(35 ± 15)] In a state where heat is applied at a heating temperature of ° C., the back sheet with adhesive 1a and one surface of the electronic component 4 are bonded together, and the other side of the electronic component 4 is bonded. The surface and the top sheet with adhesive 5a are bonded together.

Therefore, the electronic component 4 is deformed by the pressing force of the vacuum hot pressing device 17 and the deformation due to the heat melting of the adhesive.
Of the electronic component 4 and the back surface sheet 1a with an adhesive can be made uniform in thickness.

As a result, the electronic component 4 can be sandwiched between the top sheet 5a with adhesive and the back sheet 1a with adhesive with a uniform thickness after heat melting. A non-contact type IC card with an image receiving layer having a small thickness and a high heat resistance temperature can be manufactured. Therefore, cash cards,
In the field of use of cards such as an employee card, an employee card, a member card, a student card, an alien registration card, and various driver's licenses, a highly reliable electronic card with a face image can be provided.

(3) Third Embodiment FIG. 16 shows a card 20 with an image receiving layer according to a third embodiment.
It is a perspective view which shows the example of lamination structure of No. 0. In this embodiment, the electronic components stored in the porous storage member in advance are surrounded by a frame member provided in the outer peripheral region on the back sheet 1, and the frame member and the storage member are bonded to the adhesive sheet 10 </ b> A. It is bonded between the top sheet 5 and the back sheet 1 with predetermined processing temperature conditions via 10B.

The card 300 with the image receiving layer shown in FIG. 16 has the same size as that of the first embodiment, and has a three-layer structure except for the adhesive member. This card 30 with an image receiving layer
A bottom sheet 0 is provided on the lowermost layer, and a frame member 2 is provided on the outer peripheral area of the back sheet 1 to prevent water or chemicals from entering from the end of the card. The back surface of the frame member 2 is attached by a first adhesive sheet 10A formed on the entire surface of the back sheet 1.

A chip storage sheet 3 is provided inside the frame member 2 as a porous storage member, and stores the electronic component 4 as described in the first embodiment. In this example, at least the frame member 2 is made of a resin material that is substantially equal to or thicker than the thickness of the electronic component 4 and has high water resistance and chemical resistance. In this example, the electronic component 4 is previously covered with a porous resin sheet, and the electronic component 4 is protected.

As the chip storage sheet 3, a woven or non-woven resin sheet is used. For example, if the thickness of the frame member 2 is set to 500 μm and the electronic component 4 having a thickness of about 300 μm is protected above and below by a porous material having cushioning properties and the adhesive sheets 10A and 10B, the durability is further improved. The use of a porous resin sheet for the chip storage sheet 3 is based on the fact that the adhesive sheet 10 at the time of heat bonding is used.
This is because the impregnating properties of A and 10B are improved and the adhesiveness between the members becomes superior.

A top sheet 5 is bonded to the entire surface of the back sheet 1 including the frame member 2 in the same manner as in the first embodiment so as to enclose the chip storage sheet 3. The surface of the frame member 2 is formed by a second surface formed on the entire surface under the topsheet 5.
Is bonded by an adhesive sheet 10B. The laminated structure of the top sheet 5 and the back sheet 1 with the image receiving layer is the same as that of the first embodiment, and the members of the adhesive sheets 10A and 10B are the same as those of the first embodiment. . Note that components having the same reference numerals as those in the first embodiment have the same functions, and a description thereof will be omitted.

In this example, the frame member 2 has an IC chip 4
For example, after forming the frame member 2 having the opening 13 having substantially the same size as the outer peripheral region of the electronic component 4 on the back sheet 1 with the adhesive sheet 10A interposed therebetween, The chip housing sheet 3 housing the electronic component 4 is arranged inside the frame member 2. After that, the surface sheet 5 with the image receiving layer is bonded to the entire surface of the chip storage sheet 3 with the adhesive sheet 10B interposed therebetween under the same processing temperature conditions as in the first embodiment. Is obtained. Of course, frame member 2
, A resin material having high water resistance and chemical resistance is used.

As described above, according to the card 300 with the image receiving layer according to the third embodiment, the IC chip 4 shown in FIG.
A resin material, which is slightly thicker than the thickness t of the IC chip 4A and has high water resistance and chemical resistance, is provided on the outer peripheral area of the porous chip storage sheet 3 in which the electronic components 4 such as the antenna A and the antenna body 4B are stored. Is provided. Therefore, since the peripheral portion of the chip storage sheet 3 storing the electronic components 4 shown in FIG. 18 can be strengthened by the frame member 2, the image receiving layer is excellent in water resistance and chemical resistance, resistant to peeling, and extremely thin in card thickness. The attached card 300 can be provided.

Next, a card manufacturing apparatus 301 with an image receiving layer according to a third embodiment will be described. FIG. 19 is a perspective view showing a configuration example of a card manufacturing apparatus 301 with an image receiving layer. Card manufacturing apparatus 301 with image receiving layer according to the present invention
Is that a chip storage sheet 3 containing an electronic component 4 is sealed between a long sheet-shaped back sheet 1 and a long sheet-shaped top sheet 5 to provide a card 30 with an image receiving layer.
0 is manufactured.

In FIG. 19, a back sheet supply unit 6 as a first supply means is provided in a card manufacturing apparatus 301 with an image receiving layer.
Is provided, and a long sheet-shaped (web-shaped) back sheet 1 is provided.
Is wound around the sending shaft 6A. An adhesive sheet supply unit 14 as a second supply unit is provided above the back sheet supply unit 6, and the first adhesive sheet 10 is provided on the back sheet 1.
A is supplied. The adhesive sheet supply unit 14 has a delivery shaft 14A.
The adhesive sheet 10A is wound around the delivery shaft 14A, and the adhesive sheet 10A is fed out from the delivery shaft 14A. The adhesive sheet 10A is protected by the release sheet 24A as in the first embodiment. An unillustrated static elimination brush is also provided on the downstream side of the adhesive sheet supply unit 14 so that the peeled and charged electric charge is released to the ground, so that electrostatic breakdown of the IC chip can be prevented.

Above the adhesive sheet supply section 14, a third
A chip sheet supply section 8 is provided as a supply means, and the chip storage sheet 3 storing the electronic components 4 is wound around a delivery shaft 8A. Above the chip sheet supply unit 8, a frame member supply unit 7 as a sixth supply unit is provided.
A long sheet-like frame member 2 is wound.

An adhesive sheet supply section 15 as a fourth supply means is provided above the frame member supply section 7, and the second adhesive sheet 10B is supplied onto the chip storage sheet 3 by the frame member supply section 7. Is done. The adhesive sheet supply unit 15 has a feed shaft 15A, and the adhesive sheet 1 is attached to the feed shaft 15A.
OB is wound, and the adhesive sheet 10B is unreeled from the delivery shaft 15A. The adhesive sheet 10B is also protected by the release sheet 24B as in the first embodiment. The discharging brush 45 is also provided on the downstream side of the adhesive sheet supply unit 15.
Is provided so that the peeled and charged electric charge escapes to the ground, so that electrostatic breakdown of the IC chip can be prevented. As the adhesive sheets 10A and 10B, those in which a reactive hot melt resin is formed in a thin sheet shape in advance as in the first embodiment are used.

Above the adhesive sheet supply section 15, a fifth
Is provided on the adhesive sheet 10B by the adhesive sheet supply unit 15 to supply the surface sheet 5 with the image receiving layer. Top sheet supply unit 9
Has a delivery shaft 9A, and the delivery shaft 9A has a topsheet 5
Is wound, and the topsheet 5 is fed out from the delivery shaft 9A. As in the first embodiment, the top sheet 5 includes an image receiving layer 54, an “employee's card”, a “name”,
Image display information such as “issue date” is arranged in three rows in the width direction, and the image display information is printed continuously in the transport direction.

A driven roller 19A is provided downstream of the front sheet supply unit 9, a driven roller 19C is provided downstream of the back sheet supply unit 6, a driven roller 19D is provided downstream of the chip sheet supply unit 8, and Driven rollers 19E are provided on the downstream side of the frame member supply unit 7, respectively, so that the conveying direction of the top sheet 5, the back sheet 1, the chip storage sheet 3, the frame member 2, and the like can be changed.

At the downstream side of these six back sheet supply units 6, adhesive sheet supply unit 14, chip sheet supply unit 8, frame member supply unit 7, adhesive sheet supply unit 15, and top sheet supply unit 9, a guide / position is provided. A driving roller 16 for alignment is provided, and the frame member is arranged on the back sheet 1 and one surface of the frame member 2 and the chip storage sheet 3 with the adhesive sheet 10A interposed therebetween based on the pre-printed alignment mark p0. 2 and the other surface of the chip storage sheet 3 and the top sheet 5 are aligned with the adhesive sheet 10B interposed therebetween,
It is guided in the direction of the vacuum heat press 17.

A vacuum heat press device 17 is provided downstream of the drive roller 16 as a bonding means. As in the first embodiment, the heat-sensitive temperature of the image receiving layer 54 is lower than Ta ° C. With respect to the softening point Tb ° C. after completion of the reaction of the mold hot melt resin, the back sheet 1, the frame member 2 and the adhesive sheet 10A are heated by a processing temperature of [Tb− (35 ± 15)] ° C. The chip storage sheet 3 is bonded to one surface, and the chip storage sheet 3 and the other surface of the frame member 2 are bonded to the top sheet 5 by the adhesive sheet 10B.

Since the vacuum heat press 17 has the same function as the first embodiment, the description is omitted. In this example, the frame member 2 and the chip storage sheet 3 with the adhesive sheets 10A and 10B interposed between the back sheet 1 and the top sheet 5 are hereinafter referred to as a card assembly 20 '.

A card sheet transport belt 30 is provided downstream of the vacuum hot press device 17, and the card assembly 20 ′ heated and bonded by the vacuum hot press device 17 is transported to the cutting device 40. The moving distance at that time is also length L
Equal to one. A cutting device 40 is provided downstream of the card sheet conveying belt 30, and the card assembly 20 'is cut into a single sheet. The cutting device 40 includes a first
As in the case of the first embodiment, a vertical push-type cutter or a rotary cutter is used.

Subsequently, a control method of the card manufacturing apparatus 301 with an image receiving layer will be described with reference to FIG. FIG. 20 is a block diagram illustrating an outline of an example of a control system of the card manufacturing apparatus 301 with an image receiving layer.

In this example, a card manufacturing apparatus 30 with an image receiving layer is used.
A control device 70 'for controlling the entirety of the card assembly 20 is provided.
(Shown in FIG. 12), and the card sheet transport belt 30 is controlled based on the detection. In this control system, similarly to the first embodiment, a sensor 71 for detecting transmission and a sensor 72 for detecting arrival are provided. A control device 70 'is connected to the output stages of these sensors 71 and 72, and the card sheet transport belt 30 is controlled in the same manner as in the first embodiment based on the card delivery position detection signal S1 and the card arrival detection signal S2. Is done.

In this example, in order to form the card 300 with an image receiving layer, the driven roller 19
C, the back sheet 1 is fed to the drive roller 16, the adhesive sheet supply unit 14 feeds the adhesive sheet 10A to the drive roller 16, and the chip sheet supply unit 8 feeds the chip storage sheet 3 via the driven roller 19D. The frame member 2 is fed from the frame member supply unit 7 to the drive roller 16 via the driven roller 19E, the adhesive sheet 10B is fed from the adhesive sheet supply unit 15 to the drive roller 16, and the driven roller 19A is fed from the top sheet supply unit 9. The top sheet 5 is fed out to the drive roller 16 with the interposition.

After that, the control device 70 sends the driving roller 16
When the drive control signal S3 is output, the drive roller 16 rotates. Then, an adhesive sheet 10A is provided between the long sheet-shaped back sheet 1 and the long sheet-shaped top sheet 5,
The card assembly 20 ′ enclosing the frame member 2 and the chip storage sheet 3 with the intermediary of 10 B is guided to the vacuum heat press device 17 by the drive roller 16. A heating bonding control signal S5 is output from the control device 70 'to the vacuum heat press device 17. Based on the heat bonding control signal S5, the temperatures and press pressures of the upper press section 17A and the lower press section 17B are controlled to a processing temperature of 60 ° C. and a pressure of 5 kg / cm ² as in the first embodiment. .

The tip of the first card assembly 20 'is the first
The head is taken out of the vacuum heat press device 17 in the same manner as in the embodiment. When the first heat bonding is completed, an end signal S6 is output from the vacuum heat press device 17 to the control device 70 '. This tip is detected by the sensor 71. Card sending position detection signal S1 by this sensor 71
Is obtained by detecting the alignment mark p1.

A belt transport control signal S7 is output to the card sheet transport belt 30 from the control device 70 'which has received the card sending position detection signal S1. In response to the belt conveyance control signal S7, the card sheet conveyance belt 30 starts moving with the card assembly 20 'placed thereon, and the card assembly 20' after the first heating and bonding is transferred from the vacuum heat press device 17 to the cutting device 40. Conveyed. At this time, the driving roller 1
6 also moves the card assembly 20 'downstream.
At this stage, the card assembly 20 'has not been cut.

When the first card assembly 20 'is transported from the vacuum hot press device 17 to the cutting device 40, the sensor 7
2 detects that the card assembly 20 'has arrived. The sensor 72 outputs a card delivery arrival detection signal S2 to the control device 70 '. The controller 70 'that has received the card delivery detection signal S2 outputs the belt transport control signal S7 to the card sheet transport belt 30, so that the card sheet transport belt 30 stops. Although not shown, as in the first embodiment, the card assembly 20 'ejected from the vacuum heat press 17 is cooled by a fan.

On the other hand, in the vacuum hot press apparatus 17, the second heat bonding is performed. When the second heat bonding is completed, an end signal S6 is output from the vacuum heat press device 17 to the control device 70 '. Thereafter, the controller 70 ′, which has received the card sending position detection signal S 1 from the sensor 71, sends a belt conveyance control signal S 7 to the card sheet conveyance belt 30.
Is output. The card sheet transport belt 30 starts moving the card assembly 20 'by the belt transport control signal S7, and the card assembly 20' after the second heating and bonding is transported from the vacuum hot press device 17 to the cutting device 40. You.

At this time, the drive roller 16 also moves the card assembly 20 'to the downstream side in cooperation. At this stage, the card assembly 20 'can be cut. Accordingly, when the second card assembly 20 ′ is transported from the vacuum heat press device 17 to the cutting device 40, the sensor 72 detects that the card assembly 20 ′ has arrived. The card arrival detection signal S2 is output from the sensor 72 to the control device 70 '. The control device 70 'that has received the card arrival detection signal S2 outputs the belt conveyance control signal S7 to the card sheet conveyance belt 30, so that the card sheet conveyance belt 30 stops.

At the same time, a cutting control signal S8 is output to the cutting device 40. In the cutting device 40 to which the cutting control signal S8 has been input, the card assembly 20 'is cut into one unit of a card sheet with an image receiving layer. Similar operations are repeated for the third and subsequent times. Thereby, a plurality of card sheets with an image receiving layer can be obtained from the card assembly 20 '.

As described above, according to the card manufacturing apparatus 301 with an image receiving layer according to the third embodiment, the frame member that surrounds the back sheet 1, the chip storage sheet 3, and the electronic component 4 by the vacuum heat press 17 is used. 2 is bonded at a processing temperature of 60 ° C. via an adhesive sheet 10A made of a reactive hot melt resin into a thin sheet, and the frame member 2 and the chip storage sheet 3 are bonded together. The other surface and the topsheet 5 are bonded together at a processing temperature of 60 ° C. via the adhesive sheet 10B.

Therefore, the electronic component 4 is transferred to the chip storage sheet 3.
Between the one surface of the chip storage sheet 3 and the top sheet 5 and between the other surface of the chip storage sheet 3 and the back sheet 1 without performing feedback control such as the application amount of the adhesive member. The thickness of the adhesive layer between them can be made uniform. Thereby, the chip storage sheet 3 can be sandwiched between the adhesive sheets 10A and 10B having a uniform thickness by the top sheet 5 and the back sheet 1, so that the card surface has almost no irregularities and is flat.
A non-contact type IC card with an image receiving layer having a small card thickness and a high heat-resistant temperature Tb can be manufactured.

At the same time, the periphery of the chip storage sheet 3 containing the electronic components 4 can be strengthened by the frame member 2, so that the image receiving layer is excellent in water resistance and chemical resistance, resistant to peeling, and extremely thin in card thickness. The attached card 300 can be manufactured.

Card manufacturing apparatus 301 with image receiving layer of this example
In the case of the supply of the electronic components 4, the chip storage sheet 3 is simply fed out from the delivery shaft 8A, so that there is no need to control a transport mechanism such as a component cassette or a component transport belt as compared with the first embodiment. Thereby, the control device 70 '
Can be further reduced.

Subsequently, referring to FIGS. 21 to 25,
A method for manufacturing the card 300 with the image receiving layer according to the third embodiment will be described. 21A to 21C are cross-sectional views of an example (1) of a forming step showing a method of manufacturing the card 300 with an image receiving layer according to the third embodiment, and FIGS.
FIG. 2C is a sectional view of an example (part 2) of the forming step. FIG.
FIGS. 3 to 25 are top views showing the sheet-like members that complement it.

In this example, the image receiving layer 54 for thermal transfer of the face image of the card user is formed on the top sheet 5. An adhesive sheet 10A is provided between the back sheet 1 and the top sheet 5 with the chip storage sheet 3 disposed inside,
The case of forming the card assembly 20 'bonded with the intermediary of 10B will be described.

The back sheet 1 is wound around the delivery shaft 6A of the back sheet supply section 6 shown in FIG.
A is wound around a delivery shaft 14A of the adhesive sheet supply unit 14. The electronic component 4 is stored in a chip storage sheet 3 made of a porous storage member, and the chip storage sheet 3 is wound around a delivery shaft 8 </ b> A of a chip sheet supply unit 8. Further, an opening 13 having substantially the same size as the outer peripheral area of the electronic component 4 is provided.
The frame member 2 in the form of a long sheet is wound around the delivery shaft 7A of the frame member supply section 7. The adhesive sheet 10B is wound around a delivery shaft 15A of the adhesive sheet supply unit 15, and the top sheet 5 with the image receiving layer is wound around a delivery shaft 9A of the top sheet supply unit 9. It is assumed that these members are prepared.

First, in FIG. 21A, the adhesive sheet 10A drawn from the adhesive sheet supply section 14 is attached onto the back sheet 1 fed from the back sheet supply section 6. The back sheet 1 has a writing layer 12 that can be written with a pen as in the first embodiment.

Thereafter, in FIG. 21B, the adhesive sheet 1
The chip storage sheet 3 drawn out from the chip sheet supply unit 8 is pasted on OA. The chip storage sheet 3 is made of a woven or nonwoven resin sheet. The chip storage sheet 3 shown in FIG. 23 includes electronic components 4 such as the IC chip 4A and the antenna 4B described in the first embodiment. Are stored in advance.

After the chip storage sheet 3 is formed on the adhesive sheet 10A, the frame member 2 is bonded from the chip storage sheet 3 in FIG. 21C. The frame member 2 and the back sheet 1 are bonded together by an adhesive sheet 10A that impregnates the chip storage sheet at the time of heat melting. The frame member 2 is provided with an opening 13 shown in FIG. 24 which is large enough to accommodate the electronic components 4 one by one, for example, continuously in the transport direction.
The size of the opening 13 is equal to the size of the outer peripheral region of the electric component 4, and the thickness thereof is substantially equal to or larger than the thickness of the electronic component 4. Moreover, the frame member 2 is formed using a water-resistant and chemical-resistant resin material. For the frame member 3, for example, a hot-melt resin such as a reactive hot-melt type or an acrylic or epoxy-type hot-melt resin is previously formed into a sheet, and an opening 13 is punched in the resin sheet.

Thereafter, in FIG. 22A, the entire surface of the frame member 2 and the chip storage sheet 3 is
Is bonded. As the adhesive sheets 10A and 10B, those obtained by forming a reactive hot melt resin in a thin sheet shape in advance are used. In this example, an adhesive sheet 10A having a lower softening point than the chip storage sheet 3,
Use 10B. Preferably, the adhesive sheets 10A, 1A,
0B has a softening point of 20 ° C. as compared with the chip storage sheet 3.
The reactive hot melt resin in the form of a thin sheet as low as above is used.

In this case, the reason why the softening point of the adhesive sheets 10A and 10B was lowered by 20 ° C. or more compared to the softening point of the chip storage sheet 3 is that the shape of the chip storage sheet 3 as a container is eliminated and that the IC chip 4 To protect the device from thermal destruction. This is because if the softening points of the adhesive sheets 10A and 10B and the softening point of the chip storage sheet 3 are too close to each other, the chip storage sheet or the use state of the card with the image receiving layer as described above will be lost. 3 is deformed, which may cause unevenness of the card with the image receiving layer.

That is, with respect to the adhesive sheets 10A and 10B, the softening point of the chip storage sheet 3 is 20 ° C. or more, preferably, the softening point of the adhesive sheets 10A and 10B is 95 ° C. or higher. The temperature difference between the softening point of the adhesive sheets 10A and 10B and the softening point of the chip housing sheet 3 may be provided to such an extent that the temperature can be suppressed below the breaking temperature of the IC chip (for example, the melting temperature of the solder). It is based on ideas.

In this example, the reason why the chip storage sheet 3 is first formed on the back sheet 1 is to make the long sheet-shaped top sheet 5 as flat as possible. That is, when the frame member 2 is formed on the back sheet 1 first, since the chip storage sheet 3 is formed in a long sheet shape, an excess portion of the chip storage sheet 3 covers the frame member 2. . Therefore, although slightly, the chip storage sheet 3 remains in the pressed frame member 2 in the thickness together with the adhesive sheet 10B. This uneven thickness prevents flattening of the topsheet 5. By bringing this to the back side of the frame member 2, the topsheet 5 can be flattened.

Then, in FIG. 22B, the adhesive sheet 1
A top sheet 5 having an image receiving layer is formed on the top sheet 0B. Image display information for the user of the card 300 with the image receiving layer is printed on the top sheet 5 in advance in the same manner as in the first embodiment. In this example, the topsheet 5 has a long sheet shape. An alignment mark p0 is printed on the end of the topsheet 5 in advance. When the topsheet 5 is formed on the frame member 2 and the chip storage sheet 3, a foamable urethane sheet (not shown) is placed inside the frame member 2, that is, between the storage area for the electronic component 4 and the topsheet 5. It may be formed between them. The urethane sheet can further protect the top sheet 5 and the like of the electronic component 4.

Thereafter, in FIG. 22C, when a heating and pressing treatment is performed in the same manner as in the first embodiment, a long sheet-shaped card assembly 20 'shown in FIG. 25 is completed. The bonding conditions at that time were set in the same manner as in the first embodiment, and the heating temperature was set to 60 ° C., and the heating time was set to about 30 seconds. The pressure is about 5 kg / cm ² . In this example, the card assembly 20 'is cut from the frame member 2 to form one unit of a card sheet with an image receiving layer.

The hatched portion shown in FIG. 25 is the frame member 2 formed to protect the electronic component 4. This frame member 2
Is a card assembly 20 ′ with one image-receiving layer card 30.
When it is punched to zero, it is a part that is harder than the central part of the card 300 with the image receiving layer. When cutting is performed with the above-mentioned frame member 2 as a target, the card assembly 20 ′
Can be cut without deformation. Even if adhesive sheet 1
Even if 0A and 10B are not completely cured, if the frame member 2 is cut, the card is hardly distorted. Then, after the card sheet with the image receiving layer is completely cured, the cards 300 with the image receiving layer are punched out one by one by a punching device or the like.

As described above, according to the method of manufacturing the card 300 with the image receiving layer according to the third embodiment, the reactive hot melt resin is formed into a thin sheet on the surface of the chip housing sheet 3 housing the electronic components 4. At the same time as forming the adhesive sheet 10A, the adhesive sheet 10B is formed on the back surface thereof. The top sheet 5 is formed, and the back sheet 1 is formed on the back surface of the chip storage sheet 3.

Therefore, the electronic component 4 is transferred to the chip storage sheet 3.
The parts without the electronic component 4 are completely integrated with the adhesive sheets 10A and 10B by the heat melting and pressurization, so that the space between the surface of the chip storage sheet 3 and the top sheet 5 and the chip storage sheet 3 Between the back surface and the back sheet 1, the thickness of the adhesive layer can be made uniform.

Thus, the chip storage sheet 3 can be sandwiched between the adhesive sheets 10A and 10B having a uniform thickness by the top sheet 5 and the back sheet 1. Therefore, in the same manner as in the first and second embodiments, a non-contact type IC card with an image receiving layer having a flat card surface with almost no unevenness, a small card thickness, and a high heat-resistant temperature Tb is reproducible. Cash card, because it can be well formed
In the field of use of cards such as an employee card, an employee card, a member card, a student card, an alien registration card, and various driver's licenses, a highly reliable electronic card with a face image can be provided.

(4) Fourth Embodiment FIGS. 26A to 26C are cross-sectional views of an example of a forming process showing a method for manufacturing a card 400 with an image receiving layer as a fourth embodiment. In this example, a frame is formed on the back sheet 1 in real time using a thin sheet adhesive member which is cured by ultraviolet light, and the electronic component 4 is processed between the back sheet 1 and the top sheet 5 by a predetermined process. It is bonded under temperature conditions.

For example, in FIG.
An adhesive sheet 10C as a thin sheet-like adhesive member is attached thereon. The adhesive sheet 10C is formed by previously forming a resin that is cured by ultraviolet light into a thin sheet shape. As the adhesive member, a thin sheet-like member impregnated with a resin that is cured by ultraviolet light may be used.

Then, in FIG. 26B, the adhesive sheet 1
The electronic component 4 is formed on 0C. At this time, the chip storage sheet 3 in which the electronic components 4 are stored in advance may be formed on the adhesive sheet 10C. After that, after forming the adhesive sheet 10D on the electronic component 4, ultraviolet rays are irradiated. The ultraviolet light is applied so as to surround the electronic component 4. This is because the irradiated portion hardens and functions as a frame.

Then, in FIG. 26C, the adhesive sheet 1
After the top sheet 5 with the image receiving layer is formed on 0D, the back sheet 1,
The electronic component 4 and the topsheet 5 are subjected to a heat bonding process. The bonding conditions were set to be approximately the same as those of the first to third embodiments, that is, the heating temperature was set to 60 ° C., and the heating time was set to about 30 seconds. The pressure is about 5 kg / cm ² . By this bonding process, the peripheral portion of the card becomes harder like a frame than the central portion of the card.

As described above, according to the fourth embodiment, the peripheral portion of the electronic component 4 can be strengthened with the lapse of time by the heat-cured adhesive sheets 10C and 10D without using the frame member 2. It is possible to manufacture a card 400 having an image receiving layer, which has excellent properties and chemical resistance, is resistant to peeling, and has an extremely thin card thickness as compared with the first embodiment.

In the above-described embodiment, the case where the electronic component 4 is stored in the long sheet-shaped chip storage sheet 3 has been described. However, the present invention is not limited to this. Card 4 with image receiving layer housed in sheet 3 and sandwiched between back sheet 1 and top sheet 5
00 may be formed.

In each embodiment, the release sheet 2 is provided on one surface.
Long sheet-like adhesive sheet 10 having 4A and 24B
Although the case where A and 10B are used has been described, the present invention is not limited to this, and sheet-like adhesive sheets 10A and 10B having a release sheet may be used. For example, the back sheet is supplied in the form of a long sheet, and the top sheet 5
When the electronic components 4 are supplied in the form of a single sheet, the adhesive sheets 10A and 10B are used.
Or when the chip storage sheet 3 is sealed. The top sheet 5 and the adhesive sheets 10A and 10B can be saved.

If a reactive hot-melt resin is used as the adhesive sheets 10A and 10B, card bonding and the like can be performed at a relatively low temperature so that the adhesive sheets 10A and 10B can be easily formed. Even
Non-contact type IC card such as employee card, employee card, member card, student card, alien registration card, various driver's license etc. Can be obtained.

[0182]

As described above, according to the card with the image receiving layer of the present invention, the member for the substrate and the member for the surface having the image receiving layer are interposed with the adhesive member made of the reactive hot melt resin. To form a laminated structure bonded under predetermined processing temperature conditions.

With this structure, it is possible to provide a card with an image receiving layer having a flat surface with almost no irregularities on the card surface, a thin card thickness, no thermal damage to the image receiving layer, and a high heat-resistant temperature. The reliability of an electronic card with a face image can be improved in a card application field such as a card, an employee card, an employee card, a member card, a student card, an alien registration card, and various driver's licenses.

According to the first apparatus for manufacturing a card with an image receiving layer of the present invention, a member for a substrate and one surface of an electronic component for a card are interposed by a thin sheet-like first adhesive member. A bonding means for bonding the other surface of the electronic component and a member for a surface with an image under a predetermined processing temperature condition with a thin sheet-shaped second bonding member interposed therebetween. Provided.

With this configuration, the electronic component can be bonded to a uniform thickness by the surface member with the image receiving layer and the substrate member without performing feedback control such as the amount of the adhesive member such as a reactive hot melt resin applied. Since it can be sandwiched between members, it is possible to manufacture a non-contact type IC card with a non-contact type image receiving layer having a flat surface with almost no irregularities on the card surface, a thin card thickness, no thermal damage to the image receiving layer, and a high heat resistance temperature. be able to.

According to the second apparatus for manufacturing a card having an image receiving layer of the present invention, a member for a substrate to which an adhesive has been attached in advance and one surface of an electronic component for a card are bonded together. A bonding means is provided for bonding the other surface of the component and a member for a surface having an image with an adhesive in advance under predetermined processing temperature conditions.

According to this configuration, the electronic component can be bonded to a uniform thickness by the member for the surface with the image receiving layer and the member for the substrate without performing feedback control such as the application amount of the adhesive member such as a reactive hot melt resin. Since it can be sandwiched between members, it is possible to manufacture a non-contact type IC card with a non-contact type image receiving layer having a flat surface with almost no irregularities on the card surface, a thin card thickness, no thermal damage to the image receiving layer, and a high heat resistance temperature. be able to.

According to the third apparatus for manufacturing a card with an image receiving layer of the present invention, the substrate member and one surface of the storage member storing the electronic components for the card are in the form of the first sheet-like adhesive. At the same time, the other surface of the storage member and the surface member with the image receiving layer are bonded under a predetermined processing temperature condition with a sheet-shaped second adhesive member interposed therebetween. Bonding means is provided.

With this configuration, the electronic component can be protected by the storage member, and the storage member can be made uniform by the surface member with the image receiving layer and the substrate member without performing feedback control of the application amount of the adhesive member. Since the card can be sandwiched between adhesive members, the card surface is flat with almost no irregularities, the card thickness is thin, and
A non-contact type IC card with an image receiving layer having a high heat resistance temperature can be manufactured.

According to the method of manufacturing a card with an image receiving layer of the present invention, after an image receiving layer for thermally transferring a face image is formed on a surface member, the surface member and the substrate member are reacted with each other. Bonding is performed under a predetermined processing temperature condition with an adhesive member made of hot melt resin interposed.

With this configuration, a card with an image receiving layer having a high heat-resistant temperature without heat damage to the image receiving layer due to heating at the time of bonding can be formed. Can be provided.

The present invention is extremely applicable to non-contact type IC cards such as cash cards on which facial images are formed, employee cards, employee cards, membership cards, student cards, alien registration cards, and various driver's licenses. It is suitable.

[Brief description of the drawings]

FIG. 1 is a card 10 having an image receiving layer according to a first embodiment.
It is a perspective view which shows the example of lamination structure of No. 0.

FIG. 2 is a cross-sectional view showing an example of a laminated structure of the topsheet 5.

FIG. 3 is a sectional view showing an example of a laminated structure of the back sheet 1.

FIG. 4 is a cross-sectional view illustrating an example of a laminated structure of the card 100 with an image receiving layer.

FIG. 5 is a perspective view showing a configuration example of a card manufacturing apparatus 101 with an image receiving layer as the first embodiment.

FIG. 6 is a block diagram showing an example of the control system.

FIGS. 7A to 7C are cross-sectional views illustrating an example (No. 1) of forming steps of the method for manufacturing the card 100 with the image receiving layer according to the first embodiment.

FIGS. 8A and 8B are cross-sectional views illustrating an example (No. 2) of forming steps of the method for manufacturing the card 200 with the image receiving layer according to the first embodiment.

FIG. 9 is a top view showing a printing example of the back sheet 1;

FIG. 10 is a top view (part 1) illustrating an example of supplying the electronic component 4;

11 is a top view (part 2) illustrating an example of supplying the electronic component 4. FIG.

12 is a top view showing a printing example of the top sheet 5. FIG.

FIG. 13 shows a card 2 with an image receiving layer according to a second embodiment.
It is a perspective view which shows the example of lamination structure of 00.

FIG. 14 is a perspective view showing a configuration example of a card manufacturing apparatus 201 with an image receiving layer as a second embodiment.

FIG. 15 is a block diagram showing an example of the control system.

FIG. 16 shows a card 3 with an image receiving layer according to a third embodiment.
It is a perspective view which shows the example of lamination structure of 00.

FIG. 17 shows the frame members 2 and I of the card 300 with the image receiving layer.
It is sectional drawing which shows the example of a relationship with the thickness of C chip 4A.

18 is a top view showing a configuration example of a frame member 2 surrounding the electronic component 4. FIG.

FIG. 19 is a perspective view illustrating a configuration example of a card manufacturing apparatus 301 with an image receiving layer according to a third embodiment.

FIG. 20 is a block diagram showing an example of the control system.

FIGS. 21A to 21C are cross-sectional views illustrating examples (No. 1) of forming steps of a method of manufacturing a card 300 with an image receiving layer according to a third embodiment.

FIGS. 22A and 22B are cross-sectional views illustrating an example (No. 2) of forming steps of the method for manufacturing the card 300 with the image receiving layer according to the third embodiment.

FIG. 23 is a top view showing a configuration example of the chip storage sheet 3 in the form of a long sheet.

FIG. 24 is a top view showing a configuration example of the long sheet-like frame member 2.

FIG. 25 is a top view showing an example of cutting the long sheet-shaped card assembly 20 ′.

26A to 26C are cross-sectional views illustrating an example of a forming process of a method for manufacturing a card 400 with an image receiving layer according to a fourth embodiment.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 back sheet (member for board) 1a back sheet with adhesive (member for board) 2 frame member 3 chip storage sheet (storage member) 4 electronic component 4A IC chip 4B antenna body 5 top sheet (member for front surface) 5a Backsheet with adhesive (member for backside) 6 Backsheet supply unit (first supply unit) 6B Backsheet supply unit with adhesive (first supply unit) 7 Frame member supply unit (sixth supply unit) 8) Chip sheet supply unit (third supply unit) 9 Top sheet supply unit (fifth supply unit) 9B Top sheet supply unit with adhesive (third supply unit) 10, 10A, 10B Adhesive sheet (thin sheet) 13 Opening part 14 Adhesive sheet supply part (second supply means) 15 Adhesion sheet supply part (fourth supply means) 16 Drive roller 17 Vacuum heat press device (lamination means) 2 , 20 'Card assembly 21 Component cassette 22 Component transport belt (third supply means) 23 Alignment tool 30 Card sheet transport belt 40 Cutting device 70, 70' Control device 100, 200, 300, 400 Card with image receiving layer 101 , 201,301 Card manufacturing equipment with image receiving layer

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G06K 19/07 G06K 19/00 H 19/077 K F Term (Reference) 2C005 MA11 MA13 MA14 MA15 MB01 PA02 PA03 PA19 PA21 PA23 RA04 RA10 RA17 5B035 AA07 BB09 BC01 CA02 CA23

Claims (42)

[Claims] 1. A substrate member, and a surface member having an image receiving layer onto which a face image of the card user is thermally transferred, wherein at least the substrate member and the surface member react. A card with an image receiving layer, which has a laminated structure which is bonded under a predetermined processing temperature condition via an adhesive member made of a mold hot melt resin. 2. The method according to claim 1, wherein the image receiving layer and the reactive hot melt resin are used, and the heat receiving temperature at which the image receiving layer receives heat and causes thermal diffusion is Ta ° C.
When the softening point of the reactive hot melt resin after completion of the curing reaction is Tb ° C., at least the heat-sensitive temperature Ta or lower and [Tb−
2. The card with an image receiving layer according to claim 1, wherein the surface member and the substrate member are bonded together at a heating temperature of (35 ± 15)] ° C. 3. The card with an image receiving layer according to claim 1, further comprising an electronic component between said substrate member and said surface member. 4. The card with an image receiving layer according to claim 1, wherein said electronic component is stored in a porous storage member. 5. The apparatus according to claim 1, further comprising: a frame member provided in an outer peripheral region on the substrate member; and an electronic component provided in an inner region of the frame member. card. 6. The card with an image receiving layer according to claim 1, wherein the adhesive member is formed by forming a reactive hot melt resin into a thin sheet in advance. 7. The card with an image receiving layer according to claim 1, wherein the adhesive member is formed by applying the adhesive member to the surface member and the substrate member in advance. 8. The card with an image receiving layer according to claim 1, wherein the card is provided by further providing a sheet on the surface on the surface member. 9. A first supply means for supplying a substrate member, and a second supply means for supplying a thin sheet-like first adhesive member on the substrate member by the first supply means. A third supply unit for supplying an electronic component for a card onto the first adhesive member provided by the second supply unit; and a thin sheet-shaped second adhesive member provided on the electronic component provided by the third supply unit. A fourth supply unit for supplying a surface member with an image receiving layer on a second adhesive member provided by the fourth supply unit; and A member for a substrate and one surface of the electronic component are bonded together, and the other surface of the electronic component and a member for the surface are bonded by the second adhesive member under predetermined processing temperature conditions. An apparatus for manufacturing a card with an image receiving layer, comprising: a bonding means. 10. A first supply unit for supplying a substrate member with an adhesive, and an electronic component for a card is supplied onto the substrate member with the adhesive by the first supply unit. A second supply unit, a third supply unit for supplying a member for the surface with an adhesive having an image receiving layer on the electronic component by the second supply unit, and a member for the substrate with the adhesive and the electronic device. A bonding means for bonding one surface of the component and bonding the other surface of the electronic component and a member for a surface with an adhesive having an image receiving layer under a predetermined processing temperature condition. An apparatus for manufacturing a card having an image receiving layer. 11. A first supply unit for supplying a substrate member, and a second supply unit for supplying a thin sheet-shaped first adhesive member on the substrate member by the first supply unit. A third supply unit for supplying a storage member containing electronic components for a card on the first adhesive member by the second supply unit; and a thin sheet-like member on the storage member provided by the third supply unit. A fourth supply unit for supplying a second adhesive member, a fifth supply unit for supplying a surface member with an image receiving layer on the second adhesive member by the fourth supply unit, The member for the substrate and one surface of the storage member are bonded to each other with an adhesive member, and the other surface of the storage member and the member for the surface with the image receiving layer are fixed to each other by the second adhesive member. Laminating means for laminating under processing temperature conditions. The image-receiving layer with a card of the production apparatus. 12. The method according to claim 1, wherein the image receiving layer, the reactive hot melt resin, and the laminating unit are used, and a heat-sensitive temperature at which the image receiving layer receives heat and causes thermal diffusion is Ta ° C.
When the softening point after the completion of the curing reaction of the reactive hot melt resin is Tb ° C., at least the heat-sensitive temperature Ta is determined by the laminating unit.
The method according to any one of claims 9 to 11, wherein the surface member and the substrate member are bonded together at a heating temperature of [Tb- (35 ± 15)] ° C. Equipment for manufacturing cards with an image receiving layer. 13. The apparatus according to claim 11, wherein a woven, non-woven, or porous resin sheet is used as the storage member. 14. The apparatus according to claim 9, wherein the adhesive member has a release sheet on at least one surface and is handled as a long sheet. . 15. The apparatus according to claim 9, wherein the adhesive member has a release sheet on at least one surface and is handled as a single sheet. . 16. The apparatus for manufacturing a card with an image receiving layer according to claim 9, further comprising a sixth supply unit for supplying a frame member for surrounding an outer peripheral region of the electronic component. . 17. The apparatus for manufacturing a card with an image receiving layer according to claim 9, wherein the adhesive member is formed by forming a reactive hot melt resin into a thin sheet in advance. . 18. The adhesive member is applied in advance to the surface member and the substrate member, and the surface member and the substrate member with the adhesive to which the adhesive member is applied are used. The apparatus for manufacturing a card with an image receiving layer according to claim 10. 19. A step of forming an image receiving layer for thermally transferring a face image of the card user on a surface member, and reacting the surface member with the image receiving layer formed thereon with a substrate member. Laminating under a predetermined processing temperature condition with an adhesive member made of a mold hot melt resin interposed therebetween. 20. When the image-receiving layer and the reactive hot melt resin are used, the heat-sensitive temperature at which the image-receiving layer receives heat and causes thermal diffusion is Ta ° C.
When the softening point of the reactive hot melt resin after completion of the curing reaction is Tb ° C., at least the heat-sensitive temperature Ta or lower and [Tb−
20. The method for manufacturing a card with an image receiving layer according to claim 19, wherein the surface member and the substrate member are bonded together at a heating temperature of (35 ± 15) ° C. 21. The method according to claim 19, wherein the image receiving layer is a layer for receiving a sublimable dye. 22. A step of supplying a thin sheet-shaped first adhesive member on the substrate member; a step of arranging a card electronic component on the first adhesive member; Supplying a second adhesive member in the form of a thin sheet to the substrate, supplying a surface member with an image receiving layer on the second adhesive member, and forming the substrate member, the electronic component, and the surface member. 20. The method for producing a card with an image receiving layer according to claim 19, further comprising the step of: 23. A step of forming a substrate member with an adhesive, a step of arranging an electronic component for a card on the substrate member with an adhesive, and an image receiving layer on the electronic component. Supplying a member for a surface with an adhesive, and bonding the member for a substrate with an adhesive and one surface of an electronic component, and the other surface of the electronic component and an image receiving layer. Laminating a surface member with an adhesive under predetermined processing temperature conditions.
10. The method for producing a card with an image receiving layer according to item 9. 24. A step of supplying a first adhesive member in the form of a thin sheet onto the member for the substrate, and arranging a storage member in which electronic components for a card are stored in advance on the first adhesive member. A step of supplying a thin sheet-shaped second adhesive member on the housing member; and supplying a surface member with an image receiving layer on the second adhesive member to form a substrate member. 20. The method for producing a card with an image receiving layer according to claim 19, further comprising a step of laminating a storage member and a surface member. 25. The method for producing a card with an image receiving layer according to claim 24, wherein a woven, nonwoven, or porous resin sheet is used as the storage member. 26. The method according to claim 24, wherein the electronic component is stored in a long sheet-shaped storage member. 27. The method for manufacturing a card with an image receiving layer according to claim 24, wherein the electronic component is stored in a single sheet-like storage member. 28. The method according to claim 24, wherein an adhesive member having a lower softening point than the storage member is used. 29. The card with an image receiving layer according to claim 24, wherein a thin sheet reactive hot melt resin having a softening point lower than that of the housing member by 20 ° C. or more is used as the adhesive member. Production method. 30. The method for manufacturing a card with an image receiving layer according to claim 19, wherein the adhesive member is a long sheet having a release sheet on at least one surface. 31. The method for manufacturing a card with an image receiving layer according to claim 19, wherein the adhesive member is a sheet-like sheet having a release sheet on at least one surface. 32. The method for manufacturing a card with an image receiving layer according to claim 19, wherein said adhesive member is formed by forming a reactive hot melt resin into a thin sheet in advance. 33. The electronic device according to claim 22, wherein the electronic component is an IC chip for electrically storing information of the card user, and a coil-shaped antenna connected to the IC chip. A method for producing a card with an image receiving layer according to any one of the above. 34. The method according to claim 19, wherein the surface member is a printing member in which image display information is printed in a predetermined area in advance. 35. The method for manufacturing a card with an image receiving layer according to claim 22, wherein a frame member for surrounding an outer peripheral region of the electronic component is formed. 36. The method according to claim 35, wherein the frame member is a thermosetting resin film. 37. The method according to claim 35, wherein the frame member is formed by forming a reactive hot melt resin into a sheet. 38. The frame member according to claim 35, wherein a water-resistant and chemical-resistant resin material is used which is substantially equal to or thicker than the thickness of the electronic component. A method for producing a card with an image receiving layer according to the above. 39. The frame member, wherein a water-resistant and chemical-resistant thin sheet-shaped adhesive member is formed in an outer peripheral region of the electronic component or the housing member, and then the adhesive member is cured by heat treatment. The method for producing a card with an image receiving layer according to claim 35. 40. The frame member may be formed of a thin sheet-shaped adhesive member cured by ultraviolet light or a thin sheet-shaped member impregnated with the adhesive member, and then irradiating the adhesive member with ultraviolet light. The method for producing a card with an image receiving layer according to claim 35. 41. The method for manufacturing a card with an image receiving layer according to claim 19, wherein the member for the substrate is a long sheet. 42. A long sheet-like frame member having an opening substantially the same as the outer peripheral region of the electronic component or slightly larger than the outer peripheral region of the electronic component is formed on the substrate member. The method for producing a card with an image receiving layer according to claim 41.