JPH08276459A - Non-contact ic card and manufacture thereof - Google Patents
Non-contact ic card and manufacture thereofInfo
- Publication number
- JPH08276459A JPH08276459A JP7104620A JP10462095A JPH08276459A JP H08276459 A JPH08276459 A JP H08276459A JP 7104620 A JP7104620 A JP 7104620A JP 10462095 A JP10462095 A JP 10462095A JP H08276459 A JPH08276459 A JP H08276459A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- contact
- card
- module
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 79
- 239000011347 resin Substances 0.000 claims abstract description 79
- 239000003822 epoxy resin Substances 0.000 claims abstract description 49
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 49
- 238000001746 injection moulding Methods 0.000 claims abstract description 39
- 239000011521 glass Substances 0.000 claims abstract description 37
- 239000002994 raw material Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims description 47
- 239000007788 liquid Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 abstract description 33
- 239000000463 material Substances 0.000 abstract description 22
- 238000002347 injection Methods 0.000 abstract description 14
- 239000007924 injection Substances 0.000 abstract description 14
- 238000000465 moulding Methods 0.000 abstract description 11
- 238000007639 printing Methods 0.000 abstract description 5
- 238000005266 casting Methods 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 9
- 238000007789 sealing Methods 0.000 description 9
- 239000000047 product Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000012369 In process control Methods 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000010965 in-process control Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、非接触ＩＣカードとそ
の製造方法に関し、特に、機械的強度の強い薄型のカー
ドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactless IC card and a method for manufacturing the same, and more particularly to a thin card having high mechanical strength.
【０００２】[0002]
【従来の技術】近年、外部装置と電磁波等により非接触
でデータ通信ができるカード状の薄型の非接触ＩＣカー
ドが注目されている。従来の非接触ＩＣカードの製造方
法としては、例えば、非接触ＩＣモジュールが装着でき
る形状に厚紙基板を打ち抜いて、この厚紙基板に非接触
ＩＣモジュールを装着した後、厚紙基板の表裏両面に予
め所望の印刷が施された紙を仮止めし、次に、厚紙基板
よりも一回り大きい防水性の透明樹脂フィルムで表裏両
面から挟んで、熱融着等により四方をシールして封入す
る、いわゆるラミネートによる製造方法がある。或い
は、非接触ＩＣモジュールが装着できるような形状の樹
脂基板を射出成形等によって作成し、この樹脂基板に非
接触ＩＣモジュールを装着した後、樹脂基板に予め所望
の印刷が施された粘着シートを貼り付けて樹脂基板を表
裏両面からカバーすることよって製造する方法等が知ら
れている。2. Description of the Related Art In recent years, a card-shaped thin non-contact IC card which can perform non-contact data communication with an external device by electromagnetic waves or the like has attracted attention. As a conventional non-contact IC card manufacturing method, for example, a cardboard substrate is punched into a shape in which the non-contact IC module can be mounted, the non-contact IC module is mounted on the cardboard substrate, and then the front and back surfaces of the cardboard substrate are desired in advance. Temporarily fix the paper printed with, then sandwich it from both the front and back sides with a waterproof transparent resin film that is slightly larger than the cardboard substrate, seal by sealing on all sides by heat fusion etc. so-called laminate There is a manufacturing method according to. Alternatively, a resin substrate having a shape that allows the non-contact IC module to be mounted is created by injection molding or the like, and after mounting the non-contact IC module on the resin substrate, an adhesive sheet on which the desired printing has been performed in advance on the resin substrate is prepared. There is known a method of manufacturing by sticking and covering the resin substrate from both front and back surfaces.
【０００３】しかしながら、前者の製造方法では厚紙基
板を用いるために、曲げ等の外力に対する強度が劣り、
取り扱い上の問題があった。さらに、エッジ部分から剥
がれだし、切り欠きが進行する等、耐久性が悪い上に見
栄えも悪く、品質上の不安を利用者に与えるという問題
もあった。一方、後者の製造方法では、見栄えの点では
良いが、粘着シートによって表裏から樹脂基板を封止す
る構造であるために、粘着シートが樹脂基板から剥がれ
ることがあり、耐久性や経時的な気密性の点で問題があ
った。また、粘着シートは比較的薄いために、それ自身
の機械的強度も十分ではなかった。However, since the former manufacturing method uses a cardboard substrate, it is inferior in strength against external force such as bending.
There was a handling problem. Further, there is a problem that the durability is poor and the appearance is poor, such as peeling off from the edge portion and progress of notches, and the user is concerned about the quality. On the other hand, the latter manufacturing method is good in appearance, but the adhesive sheet may be peeled off from the resin substrate due to the structure of sealing the resin substrate from the front and back sides with the adhesive sheet, resulting in durability and airtightness over time. There was a problem in terms of sex. Moreover, since the pressure-sensitive adhesive sheet is relatively thin, its mechanical strength was not sufficient.
【０００４】このような観点から、本出願人は特開平６
−２８６３７５号公報で、予め射出成形によって成形さ
れた２つの樹脂板のうち１つには凹部が形成されたもの
を使用し、該凹部に非接触ＩＣモジュールを装着した
後、２つの樹脂板を接着して一体化する製造方法も開示
している。From this point of view, the applicant of the present invention has disclosed Japanese Patent Laid-Open No.
JP-A-286375 discloses that one of two resin plates formed by injection molding in advance has a recess formed therein, and after mounting the non-contact IC module in the recess, two resin plates are formed. It also discloses a manufacturing method of adhering and integrating.
【０００５】しかし、同号公報に開示した製造方法で
も、非接触ＩＣモジュールを表裏から挟むものが射出成
形による樹脂製の成形体であるために、非接触ＩＣカー
ドの様に薄型にした場合には充分な機械的強度が得られ
なかった。However, even in the manufacturing method disclosed in the above-mentioned publication, since a non-contact IC module sandwiched from the front and back is a resin-made molded body by injection molding, when it is made thin like a non-contact IC card. Did not have sufficient mechanical strength.
【０００６】そこで、本発明の目的は、薄型のカードで
あっても、機械的強度の強い非接触ＩＣカードと、その
製造方法を提供することである。Therefore, an object of the present invention is to provide a non-contact IC card having a high mechanical strength even if it is a thin card, and a manufacturing method thereof.
【０００７】[0007]
【課題を解決するための手段】本発明の非接触ＩＣカー
ドは、前記課題を解決し目的を達成するために、非接触
ＩＣモジュールが、ガラスエポキシ樹脂基板で形成され
る凹部内に載置されているインサート部品を、金型内に
載置した後、金型を閉じ、金型内を真空にした後、液状
の硬化性樹脂原料を金型内に注入し、該樹脂原料を硬化
させる低圧射出成形法により製造したカードとする。ま
た、非接触ＩＣモジュールを構成し得る電子部品が、ガ
ラスエポキシ樹脂基板で形成される凹部内の導電パター
ンに実装されているインサート部品を、金型内に載置し
た後、金型を閉じ、金型内を真空にした後、液状の硬化
性樹脂原料を金型内に注入し、該樹脂原料を硬化させる
低圧射出成形法により製造したカードでもある。In the non-contact IC card of the present invention, in order to solve the above-mentioned problems and achieve the object, the non-contact IC module is placed in a recess formed by a glass epoxy resin substrate. After placing the insert part in the mold, closing the mold and evacuating the mold, injecting a liquid curable resin raw material into the mold to cure the resin raw material Low pressure The card is manufactured by the injection molding method. In addition, the electronic component that can form the non-contact IC module is mounted on the mold, the insert component mounted on the conductive pattern in the recess formed by the glass epoxy resin substrate, and then the mold is closed. It is also a card manufactured by a low-pressure injection molding method in which a liquid curable resin material is injected into the mold after the inside of the mold is evacuated and the resin material is cured.
【０００８】また、本発明の非接触ＩＣカードの製造方
法は、非接触ＩＣモジュールを、ガラスエポキシ樹脂基
板で形成される凹部内に載置してインサート部品とし、
該インサートを金型内に載置した後、金型を閉じ、金型
内を真空にした後、液状の硬化性樹脂原料を金型内に注
入し、該樹脂原料を硬化させる低圧射出成形法により製
造するようにしたものである。また、非接触ＩＣモジュ
ールを構成し得る電子部品が、ガラスエポキシ樹脂基板
で形成される凹部内の導電パターンに実装されているイ
ンサート部品を、金型内に載置した後、金型を閉じ、金
型内を真空にした後、液状の硬化性樹脂原料を金型内に
注入し、該樹脂原料を硬化させる低圧射出成形法により
製造するようにしたものでもある。Further, in the method for manufacturing a non-contact IC card of the present invention, the non-contact IC module is placed in a recess formed by a glass epoxy resin substrate to form an insert part,
A low-pressure injection molding method in which the insert is placed in a mold, the mold is closed, the mold is evacuated, and then a liquid curable resin raw material is injected into the mold to cure the resin raw material. It is manufactured by. In addition, the electronic component that can form the non-contact IC module is mounted on the mold, the insert component mounted on the conductive pattern in the recess formed by the glass epoxy resin substrate, and then the mold is closed. It is also manufactured by a low-pressure injection molding method in which a liquid curable resin material is injected into the mold after the inside of the mold is evacuated and the resin material is cured.
【０００９】[0009]
【作用】本発明の非接触ＩＣカードでは、非接触ＩＣモ
ジュールに対して直接に射出成形せず、予めガラスエポ
キシ樹脂基板で形成された凹部に非接触ＩＣモジュール
を装着して、或いはガラスエポキシ樹脂基板の導電パー
タンに非接触ＩＣモジュールを構成し得る電子部品を実
装してインサート部品とした後に、該インサート部品を
金型に挿入してから射出成形するために、ガラス繊維で
強化されたガラスエポキシ樹脂基板によって、機械的強
度が優れたカードとなる。また、樹脂基板で形成された
凹部により、非接触ＩＣモジュールの装着時の位置決め
が確実となり、凹部周囲の枠部分によりカードの機械的
強度も強くなる。In the non-contact IC card of the present invention, the non-contact IC module is not directly injection-molded, but the non-contact IC module is mounted in the recess previously formed by the glass epoxy resin substrate, or the glass epoxy resin is used. A glass epoxy reinforced with glass fiber in order to mount an electronic component capable of forming a non-contact IC module on a conductive pattern of a substrate to form an insert component, insert the insert component into a mold, and then perform injection molding. The resin substrate makes the card excellent in mechanical strength. Further, the concave portion formed of the resin substrate ensures the positioning when the non-contact IC module is mounted, and the frame portion around the concave portion also increases the mechanical strength of the card.
【００１０】また、本発明の非接触ＩＣカードの製造方
法では、非接触ＩＣモジュールに対して直接に射出成形
せず、予めガラスエポキシ樹脂基板で形成された凹部に
非接触ＩＣモジュールを装着して、或いはガラスエポキ
シ樹脂基板の導電パターンに非接触ＩＣモジュールを構
成し得る電子部品を実装してインサート部品とした後
に、該インサート部品を金型に挿入してから射出成形す
るために、ガラス繊維で強化されたガラスエポキシ樹脂
基板によって、機械的強度が向上したカードが得られ
る。また、樹脂基板で形成された凹部により、非接触Ｉ
Ｃモジュールの装着時の位置決めが確実となり、凹部周
囲の枠部分により機械的強度の強いカードとなる。Further, in the method for manufacturing a non-contact IC card of the present invention, the non-contact IC module is not directly injection-molded, but the non-contact IC module is mounted in the recess previously formed of the glass epoxy resin substrate. Alternatively, a glass fiber is used to insert an electronic component that can form a non-contact IC module on a conductive pattern of a glass epoxy resin substrate to form an insert component, and then insert the insert component into a mold and then perform injection molding. The reinforced glass epoxy resin substrate provides a card with improved mechanical strength. In addition, due to the recess formed by the resin substrate, the non-contact I
When the C module is mounted, the positioning is ensured, and the frame portion around the recess forms a card with high mechanical strength.
【００１１】[0011]
【実施例】以下、本発明の非接触ＩＣカード及びその製
造方法の実施例について図面を参照しながら詳述する。Embodiments of the non-contact IC card and the method of manufacturing the same according to the present invention will be described in detail below with reference to the drawings.
【００１２】本発明では、非接触ＩＣモジュールを直接
に射出成形の金型に挿入せずに、一旦、ガラスエポキシ
樹脂基板に装着後に挿入する点に主たる特徴がある、さ
らに、挿入された後に、装着された非接触ＩＣモジュー
ルを射出成形時の熱圧で破損しない様な方法で射出成形
する点にも特徴がある。そして、後者の射出成形方法と
しては、後述するような低圧射出成形法により行うもの
である。The present invention is characterized mainly in that the non-contact IC module is once inserted into the glass epoxy resin substrate without being directly inserted into the injection molding die, and further, after being inserted, Another feature is that the mounted non-contact IC module is injection-molded by a method that is not damaged by the heat and pressure during injection molding. The latter injection molding method is a low-pressure injection molding method as described later.
【００１３】先ず、図１は、本発明の非接触ＩＣカード
の製造方法の一実施例を説明する概略工程図である。ま
た、図２は、本発明の非接触ＩＣカードの製造方法の流
れを説明するフロー図である。以下、図１及び図２を参
照しながら、さらに本発明による製造方法を詳述する。First, FIG. 1 is a schematic process chart for explaining an embodiment of a method for manufacturing a non-contact IC card according to the present invention. Further, FIG. 2 is a flow chart for explaining the flow of the method for manufacturing a non-contact IC card of the present invention. Hereinafter, the manufacturing method according to the present invention will be described in detail with reference to FIGS. 1 and 2.
【００１４】先ず、最初は凹部を有するガラスエポキシ
樹脂基板を熱プレスによって製造する工程である（図２
のステップＳ１）。これには、図１（ａ）に示す、ベー
ス材５１と枠材５２の二つの完全硬化前のガラスエポキ
シ樹脂基板を、図１（ｂ）の如くプレス板５４ａ及び５
４ｂを用いて熱プレス成形により一体化して、図１
（ｃ）に示す様な内部に凹部を有するガラスエポキシ樹
脂基板５を製造する。なお、図１（ｂ）〜（ｇ）では断
面図で工程を示すが、図１（ａ）では枠材５２の斜視図
も示しておく。また枠材５２は、打ち抜き加工等により
形成する。ガラスエポキシ樹脂基板の完全硬化前のもの
としては、例えば、半硬化状態のガラスエポキシ樹脂基
板を用いれば良い。そして、加熱プレスの際には、凹部
５３に対応した形状を有するプレス板５４ａ及びプレス
５４ｂとを用いガラスエポキシ樹脂基板５１と５２とを
熱圧により硬化、密着させる。First, the first step is to manufacture a glass epoxy resin substrate having a recess by hot pressing (FIG. 2).
Step S1). To this end, two glass epoxy resin substrates, which are the base material 51 and the frame material 52, which have not been completely cured, as shown in FIG.
4b and integrated by hot press molding, as shown in FIG.
The glass epoxy resin substrate 5 having a recess inside as shown in (c) is manufactured. 1 (b) to 1 (g) show the steps in a sectional view, but FIG. 1 (a) also shows a perspective view of the frame member 52. The frame member 52 is formed by punching or the like. As the glass epoxy resin substrate before being completely cured, for example, a semi-cured glass epoxy resin substrate may be used. Then, at the time of hot pressing, the glass epoxy resin substrates 51 and 52 are hardened and brought into close contact with each other by heat and pressure using a press plate 54a and a press 54b having a shape corresponding to the recess 53.
【００１５】また、ガラスエポキシ樹脂基板５を凹部５
３を有する形状とする理由は、凹部５３を設けないで、
ベース材５１のみで該ベース材５１上に非接触ＩＣモジ
ュールを載置してもよいが、凹部５３を設けることによ
って、非接触ＩＣモジュールの位置決めを確実に行い、
成形時に金型内に流入する樹脂によって非接触ＩＣモジ
ュールが動いて金型と接触することを防止できるからで
ある。また、ベース材５１でもかなりの機械的強度が得
られるが、枠材５２の併用により、より強度の強いカー
ドが得られる。Further, the glass epoxy resin substrate 5 is provided with the recess 5
The reason for forming the shape having 3 is that the concave portion 53 is not provided,
Although the non-contact IC module may be mounted on the base material 51 only by the base material 51, the recess 53 is provided to surely position the non-contact IC module,
This is because it is possible to prevent the non-contact IC module from moving and coming into contact with the mold due to the resin flowing into the mold during molding. Further, the base material 51 can also obtain a considerable mechanical strength, but by using the frame material 52 together, a stronger card can be obtained.
【００１６】なお、ガラスエポキシ樹脂基板の枠材５２
の厚み（高さ）は、非接触ＩＣモジュールに実装されて
いる電子部品４の高さとの関係、及び金型内に流入する
エポキシ樹脂の流動性の観点観点から電子部品４の高さ
よりも厚い（高い）ことが好ましい。電子部品の高さが
通常０．５〜０．６ｍｍ程度なので、枠材５２は同等又
はこれよりも厚くする。なお、ベース材５１となるガラ
スエポキシ樹脂基板の厚みは、最終的なカードとしての
機械的強度を得る点から、通常は、０．１〜０．２ｍｍ
程度とする。薄すぎると充分な機械的強度が得られな
い。The frame member 52 of the glass epoxy resin substrate
Is thicker than the height of the electronic component 4 from the viewpoint of the relationship with the height of the electronic component 4 mounted on the non-contact IC module and the fluidity of the epoxy resin flowing into the mold. (High) is preferable. Since the height of the electronic component is usually about 0.5 to 0.6 mm, the frame member 52 is made equal or thicker. The thickness of the glass epoxy resin substrate that is the base material 51 is usually 0.1 to 0.2 mm from the viewpoint of obtaining mechanical strength as a final card.
The degree. If it is too thin, sufficient mechanical strength cannot be obtained.
【００１７】また、本発明ではガラスエポキシ樹脂基板
５が機械的強度に機能するために、非接触ＩＣモジュー
ルを構成するプリント基板としてフレキシブルプリント
基板を用いることもでき、プレキシブルプリント基板を
使用すれば薄型カードとして、有利である。Further, in the present invention, since the glass epoxy resin substrate 5 functions with mechanical strength, a flexible printed circuit board can be used as a printed circuit board constituting the non-contact IC module. It is advantageous as a thin card.
【００１８】そして、図１（ｄ）に示す如く、このガラ
スエポキシ樹脂基板５の凹部５３に、非接触ＩＣモジュ
ール２０を装着してインサート部品３０とする（図２の
ステップＳ２）。なお、非接触ＩＣモジュール２０は、
プリント基板上に、ＩＣ、コンデンサ、コイルアンテナ
等の電子部品を実装したものである。Then, as shown in FIG. 1D, the non-contact IC module 20 is mounted in the recess 53 of the glass epoxy resin substrate 5 to form an insert component 30 (step S2 in FIG. 2). The non-contact IC module 20 is
An electronic component such as an IC, a capacitor, and a coil antenna is mounted on a printed circuit board.
【００１９】次に、図１（ｄ）のインサート部品３０を
図１（ｅ）の如く、７６ａ及び７６ｂで示される射出成
形金型の内部に配置する（ステップＳ３）。そして、図
１（ｆ）の如く金型内に液状の樹脂を注入して射出成形
することで、インサート部品３０は、射出樹脂８で封止
され、且つカードとしての成型体が得られる（ステップ
Ｓ４）。Next, as shown in FIG. 1E, the insert part 30 shown in FIG. 1D is placed inside the injection mold shown by 76a and 76b (step S3). Then, as shown in FIG. 1F, a liquid resin is injected into the mold and injection molding is performed, whereby the insert part 30 is sealed with the injection resin 8 and a molded body as a card is obtained (step). S4).
【００２０】上記の様にして得られた成形体は、片面は
ガラスエポキシ樹脂基板５が露出し、片面は射出成形樹
脂表面であり、このままも使用できるが、見栄えが悪い
ので、通常は、さらに図１（ｇ）の如く、得られた成形
物の表裏にシルクスクリーン印刷等の印刷手段により表
面化粧や所望の文字、図形等の情報を印刷した表面仕上
層６を設けて（ステップＳ５）、本発明の非接触ＩＣカ
ード１とする。The molded body obtained as described above has the glass epoxy resin substrate 5 exposed on one side and the injection-molded resin surface on the other side. It can be used as it is, but it usually looks bad. As shown in FIG. 1 (g), a surface finishing layer 6 on which information such as surface makeup and desired characters and figures is printed by printing means such as silk screen printing is provided on the front and back of the obtained molded product (step S5). The contactless IC card 1 of the present invention is used.
【００２１】次に、本発明の第２の特徴でもある、低圧
射出成形方法について説明する。Next, the low-pressure injection molding method, which is the second feature of the present invention, will be described.
【００２２】本発明の非接触ＩＣカードの製造方法で用
いる低圧射出成形法においては、真空にできる金型を用
い、また、該金型に注入する樹脂として液状の硬化性樹
脂原料を用いることに特徴がある。樹脂原料としては特
に制限はないが、例えば、エポキシ樹脂を用いた製造方
法の具体例として、長瀬チバ株式会社より「ＲＤＣＰ」
（登録商標）（Ｒａｐｉｄ Ｄｅｍｏｌｄｉｎｇ Ｃａ
ｓｔｉｎｇ Ｐｒｏｃｅｓｓ）、別名、「液状エポキシ
樹脂による低圧液状射出成形法」なる名称で販売されて
いる装置及び原料を使用した低圧射出成形法が使用でき
る。In the low-pressure injection molding method used in the method for manufacturing a non-contact IC card of the present invention, a mold that can be evacuated is used, and a liquid curable resin raw material is used as a resin injected into the mold. There are features. The resin raw material is not particularly limited. For example, as a specific example of the production method using an epoxy resin, “RDCP” from Nagase Ciba Co., Ltd.
(R) (R apid D emolding C a
sting P rocess), also known as low-pressure injection molding method using a device and a raw material is sold under the "low pressure liquid injection molding method using a liquid epoxy resin", entitled can be used.
【００２３】そして、図３は、係る低圧射出成形法の一
連のシステムの一例を示す概略構成図である。同図の如
く、液状の硬化性樹脂原料であるエポキシ樹脂の主剤成
分は樹脂タンク７１ａに貯蔵し、硬化剤成分は樹脂タン
ク７１ｂに貯蔵しておく。エポキシ樹脂の主剤及び硬化
剤はポンプ７２によって所定量計量され樹脂タンク７１
ａ及び７１ｂからミキサー７３に送られる。ミキサー７
３で主剤及び硬化剤は均一に混合される。ミキサー７３
で混合された後、エポキシ樹脂は射出ノズル７５に送ら
れ、金型内に注入される。金型は上部金型７６ａ及び下
部金型７６ｂで構成され、下部金型７６ｂに非接触ＩＣ
モジュールを有するインサート部品３０が載置される。
金型７６ａには真空ポンプ７７が接続され、真空ポンプ
７７は金型が閉じた後に金型内部を真空にする。そし
て、液状の硬化性樹脂原料としてミキサー７３で混合さ
れたエポキシ樹脂の主剤及び硬化剤が射出ノズル７５か
ら金型内に注入され、射出ノズル７５に接続された空気
圧縮機７４により樹脂は加圧される。FIG. 3 is a schematic block diagram showing an example of a series of systems of such a low pressure injection molding method. As shown in the figure, the main component of the epoxy resin, which is a liquid curable resin material, is stored in the resin tank 71a, and the curing agent component is stored in the resin tank 71b. A predetermined amount of the epoxy resin main component and the curing agent are measured by a pump 72 and the resin tank 71 is measured.
It is sent to the mixer 73 from a and 71b. Mixer 7
In 3, the main agent and the curing agent are uniformly mixed. Mixer 73
After being mixed in, the epoxy resin is sent to the injection nozzle 75 and injected into the mold. The mold is composed of an upper mold 76a and a lower mold 76b, and the lower mold 76b is a non-contact IC.
An insert part 30 having a module is placed.
A vacuum pump 77 is connected to the mold 76a, and the vacuum pump 77 creates a vacuum inside the mold after the mold is closed. Then, the main component and the curing agent of the epoxy resin mixed by the mixer 73 as the liquid curable resin raw material are injected into the mold from the injection nozzle 75, and the resin is pressed by the air compressor 74 connected to the injection nozzle 75. To be done.
【００２４】次に、上記低圧射出成形方法による射出成
形工程部分について、図１及び図３、そして、図５の射
出成形工程の流れを示すフロー図を参照しながら、詳述
する。Next, the injection molding process part by the above-mentioned low-pressure injection molding method will be described in detail with reference to FIGS. 1 and 3 and a flow chart showing the flow of the injection molding process of FIG.
【００２５】低圧射出成形工程の最初は、先ず、金型を
成形温度に予熱しておく（図５のステップＳ１１）。予
熱温度は通常１３０〜１４０℃程度である。そして、金
型のパーティング面に離型剤を塗布する（ステップＳ１
２）。次に、図１（ｅ）の如くインサート部品３０を下
部金型７６ｂに載置する（ステップＳ１３）。なお、イ
ンサート部品も８０〜１２０℃程度に予熱しておく。そ
して、上部金型７６ａと下部金型７６ｂとを型締めを行
う（ステップＳ１４）。型締め後、金型内を真空にす
る。真空時間は１０〜３０秒程度で、真空度は１Ｔｏｒ
ｒ程度まで行う（ステップＳ１５）。金型内を真空にす
る工程と平行して、或いは真空にした後、所定量の硬化
性樹脂を計量し、混合する（ステップＳ１６）。そし
て、射出ノズルから真空の金型内に液状の硬化性樹脂を
射出する（ステップＳ１７）。射出圧力は通常３〜７ｋ
ｇ／ｃｍ2 程度で、射出・保圧時間は１５０〜２００秒
程度で完了する。この状態が図１（ｆ）である。At the beginning of the low-pressure injection molding process, the mold is first preheated to the molding temperature (step S11 in FIG. 5). The preheating temperature is usually about 130 to 140 ° C. Then, a mold release agent is applied to the parting surface of the mold (step S1).
2). Next, as shown in FIG. 1E, the insert part 30 is placed on the lower mold 76b (step S13). The insert parts are also preheated to about 80 to 120 ° C. Then, the upper mold 76a and the lower mold 76b are clamped (step S14). After the mold is clamped, the inside of the mold is evacuated. The vacuum time is about 10 to 30 seconds, and the degree of vacuum is 1 Tor.
Perform up to about r (step S15). In parallel with the step of applying a vacuum to the inside of the mold or after applying a vacuum, a predetermined amount of curable resin is weighed and mixed (step S16). Then, the liquid curable resin is injected from the injection nozzle into the vacuum mold (step S17). Injection pressure is usually 3-7k
At about g / cm 2 , the injection / holding time is about 150 to 200 seconds. This state is shown in FIG.
【００２６】そして、脱型が可能な強度が得られるまで
樹脂の硬化が進行した後に型開きし（ステップＳ１
８）、成形体を取出す（ステップＳ１９）。なお、金型
の型締めから型開き迄の脱型時間は通常２４０〜３００
秒程度である。次いで、後硬化工程として、樹脂を所定
温度で所定時間加熱して完全に硬化させる（ステップＳ
２０）。Then, the mold is opened after the curing of the resin is progressed until the strength capable of releasing the mold is obtained (step S1).
8) Then, the molded body is taken out (step S19). The mold release time from mold clamping to mold opening is usually 240 to 300.
It is about a second. Then, as a post-curing step, the resin is heated at a predetermined temperature for a predetermined time to be completely cured (step S
20).
【００２７】そして、図４はこのようにして得られる非
接触ＩＣカード１の内部の回路部品等の主要なものの配
置を透視した見た透視図であり、カード１の周縁部には
ガラスエポキシ樹脂基板からなる枠材５２、枠材５２の
内側にＩＣ４１、コンデンサ４２及びコイル４３が実装
されたプリント基板３が配置された状態を示す。FIG. 4 is a perspective view showing the arrangement of the main components such as the circuit components inside the non-contact IC card 1 obtained in this manner as seen through, and the peripheral portion of the card 1 is made of glass epoxy resin. A state is shown in which a frame member 52 made of a substrate and a printed circuit board 3 on which an IC 41, a capacitor 42, and a coil 43 are mounted are arranged inside the frame member 52.
【００２８】なお、上記の実施例では、液状の硬化性樹
脂原料として、常温で液状の熱硬化性樹脂であるエポキ
シ樹脂を用いたが、いわゆる射出成形や後述するトラン
スファ成形等の高温の溶融樹脂を用いる方法と比較し
て、インサート部品が熱損傷を受けない程度の成形温度
であれば良いのであるから、例えば常温では固体だが４
０〜５０℃程度と比較的低温で液状となるものでも構わ
ない。この意味で、本発明でいう「液状」とは常温では
固体だが比較低温で液状となるものも包含する。但し、
常温で固体の場合は、金型に至るまでの樹脂の供給系、
すなわち、樹脂タンク、ポンプ、ミキサー、射出ノズル
等は樹脂が液状化する所望の温度まで樹脂を加熱できる
ヒータ等の加熱手段を備えた装置としておくことは必要
である。In the above embodiment, the epoxy resin, which is a thermosetting resin that is liquid at room temperature, is used as the liquid curable resin material, but a high temperature molten resin such as so-called injection molding or transfer molding described later is used. Compared with the method using, it is sufficient if the molding temperature is such that the insert parts are not damaged by heat.
It may be liquid at a relatively low temperature of about 0 to 50 ° C. In this sense, the term "liquid" as used in the present invention includes those which are solid at room temperature but become liquid at a comparatively low temperature. However,
If it is solid at room temperature, the resin supply system up to the mold,
That is, it is necessary that the resin tank, pump, mixer, injection nozzle and the like are provided with a heating means such as a heater capable of heating the resin to a desired temperature at which the resin is liquefied.
【００２９】上述した実施例では、プリント基板に電子
部品を実装後の非接触ＩＣモジュール２０をガラスエポ
キシ樹脂基板５に載置してインサート部品３０として、
これを金型内に挿入して射出成形した。本発明の他の実
施例では、非接触ＩＣモジュールを構成し得る電子部品
を、ガラスエポキシ樹脂基板に形成された導電パターン
に実装してインサート部品として、該インサート部品を
金型内に挿入してもよい。In the above-described embodiment, the non-contact IC module 20 after mounting the electronic parts on the printed board is placed on the glass epoxy resin board 5 to form the insert parts 30.
This was inserted into a mold and injection-molded. In another embodiment of the present invention, an electronic component that can form a non-contact IC module is mounted on a conductive pattern formed on a glass epoxy resin substrate as an insert component, and the insert component is inserted into a mold. Good.
【００３０】すなわち、図６に示す様に、図６（ａ）
は、ガラスエポキシ樹脂基板の枠材５２と、導電ペース
トにより印刷形成された導電パターン５６を有するベー
ス材５１とを示す。そして、このベース材５１と枠材５
２とを上述と同様にして熱プレスにより一体化して、図
６（ｂ）に示す、凹部５３内に導電パータン５６を有す
るガラスエポキシ樹脂基板５とする。次いで、導電パタ
ーン５６に、非接触ＩＣモジュールを構成し得る、Ｉ
Ｃ、コンデンサ、アンテナ等の電子部品４を実装して、
図６（ｃ）に示すインサート部品３０とする。そして、
インサート部品３０を前記同様に射出成形して電子部品
４を射出樹脂８で封止し、且つ成形体とした後、表裏に
表面仕上層６を印刷形成すれば、図６（ｄ）に示す本発
明の非接触ＩＣカードが得られる。That is, as shown in FIG. 6, FIG.
Shows a frame member 52 of a glass epoxy resin substrate and a base member 51 having a conductive pattern 56 formed by printing with a conductive paste. Then, the base material 51 and the frame material 5
2 and 2 are integrated by hot pressing in the same manner as described above to obtain the glass epoxy resin substrate 5 having the conductive pattern 56 in the recess 53 shown in FIG. 6B. Next, a non-contact IC module can be formed on the conductive pattern 56. I
Mount the electronic parts 4 such as C, capacitor, antenna,
The insert part 30 shown in FIG. And
After the insert part 30 is injection-molded in the same manner as described above to seal the electronic part 4 with the injection resin 8 and form a molded body, the surface finishing layer 6 is formed by printing on the front and back surfaces. The contactless IC card of the invention can be obtained.
【００３１】ところで、本発明の製造方法で行う回路部
品の封止を兼ねた射出成形方法としては、特定の低圧射
出成形方法が好ましいが、このような低圧射出成形方法
を採用する利点について説明する。By the way, a specific low-pressure injection molding method is preferable as an injection-molding method which also serves as sealing of circuit components, which is carried out by the manufacturing method of the present invention. The advantages of adopting such a low-pressure injection molding method will be described. .
【００３２】樹脂原料として液状の物質を電子部品の封
止に用いる方法としては、従来技術の欄で説明した様に
液状エポキシ樹脂を流し込む、いわゆる、ポッティング
法が良く知られており、また、金型を用いてインサート
された電子部品や回路を溶融樹脂で樹脂封止する方法と
しては、トランスファ成形法が良く知られている。そこ
で、これら２方法の問題点と対比させつつ、本発明で行
う低圧射出成形方法の利点についてさらに説明する。As a method of using a liquid substance as a resin raw material for sealing electronic parts, a so-called potting method in which a liquid epoxy resin is poured as described in the section of the prior art is well known, and gold is used. A transfer molding method is well known as a method of resin-sealing an electronic component or a circuit inserted using a mold with a molten resin. Therefore, the advantages of the low-pressure injection molding method according to the present invention will be further described while comparing the problems of these two methods.
【００３３】先ず、ポッテング法では、以下のような問
題点がある。通常エポキシ樹脂を使用するが、樹脂硬化
に長時間を必要とし生産性が悪い。また、樹脂原料中に
含有させる充填剤が沈降して不均一となり、ヒートサイ
クル性能が低下する。充填剤の含有量を多くできない。
大気中の湿度の影響を受けやすい。このような点から、
封止したままの形状で使用することはなく、封止物は必
ずケースで囲うことが必要である上、封止物の表面をそ
のままカード表面として使用することもできず、薄型の
非接触ＩＣカードとして適していない。First, the Potting method has the following problems. Epoxy resin is usually used, but it takes a long time to cure the resin, resulting in poor productivity. In addition, the filler contained in the resin raw material precipitates and becomes non-uniform, and the heat cycle performance deteriorates. The filler content cannot be increased.
It is easily affected by atmospheric humidity. From this point,
The thin non-contact IC cannot be used as it is, and the encapsulant must be surrounded by a case, and the surface of the encapsulant cannot be used as it is as a card surface. Not suitable as a card.
【００３４】次に、トランスファ成形法では、以下のよ
うな問題点がある。常温で固形の樹脂原料を直前に融解
してから金型内に射出成形する方法であるために、成形
温度が高く（１５０℃以上）、また成形圧力も高い（５
０〜２００ｋｇ／ｃｍ2 ）。この高温、高圧で部品が損
傷する恐れがある。また、細かい空隙、例えば、コイル
部品の線間に樹脂原料が進入しない。従って、形状の複
雑な部品等では成形不良が発生し易い。熱圧を利用する
ため含浸処理工程への適用が不可能である。樹脂原料を
保管するのに冷蔵室が必要で工程管理上も面倒で、材料
組成面でも選択の自由度が狭い。Next, the transfer molding method has the following problems. Since this is a method in which a resin material that is solid at room temperature is melted immediately before injection molding in a mold, the molding temperature is high (150 ° C or higher) and the molding pressure is high (5
0-200 kg / cm 2 ). This high temperature and high pressure may damage the parts. Further, the resin material does not enter between the fine voids, for example, the wires of the coil component. Therefore, molding defects are likely to occur in parts having complicated shapes. Since it uses hot pressure, it cannot be applied to the impregnation process. A refrigerating room is required to store the resin raw material, which is troublesome in process control, and the degree of freedom in selection in terms of material composition is narrow.
【００３５】以上の様に、従来より電子部品の封止方法
として良く知られているポッティング法及び成形もでき
るトランスファ成形法には、各種問題点があり、そこ
で、非接触ＩＣモジュールに対して樹脂で封止し且つ所
定の形状とする成形を行うのは難しい。As described above, there are various problems in the potting method and the transfer molding method, which are well known in the related art as a method for sealing electronic parts, and there are various problems. It is difficult to perform molding by sealing with and forming into a predetermined shape.
【００３６】これに対して、本発明の非接触ＩＣカード
の製造方法では、上述のように液状の樹脂原料を金型内
に注入する方法とするために、樹脂封止技術ではある
が、前記方法による各種難点を解消した成形方法とな
る。On the other hand, in the non-contact IC card manufacturing method of the present invention, since the method is the method of injecting the liquid resin raw material into the mold as described above, the resin sealing technique is used. This is a molding method that solves various difficulties due to the method.
【００３７】すなわち、本発明が用いる低圧射出成形法
によれば、樹脂原料として液状の硬化性樹脂原料を使用
する点、及び樹脂を注入する前に型内を真空にしておく
点等によって次の様な利点が得られるものである。先
ず、高圧が不要であり（射出圧力は２〜７ｋｇ／ｃｍ2
程度）、温度も低温で良い（金型温度は１３０〜１６０
℃程度）液状真空射出成形であるために細かい空隙まで
樹脂原料を進入し、コイル部品等も含浸できる。部品の
損傷が少ない。従って、樹脂の硬化時間が短縮できる。
材料組成面での選択の自由度が大きい。充填剤の含有量
を多くしても成形できる。従って、得られる成形品の性
能は樹脂原料を選定することによって熱衝撃性や難燃性
等も改善でき、また、大気中の湿度の影響を受けにく
い。そして、ガラスエポキシ樹脂基板との併用による硬
化性樹脂による成形品そのものがカードとしての性能を
満足するので、封止、カード成形を一工程ででき、別
途、樹脂の成形体を製造しその中に非接触ＩＣモジュー
ルを装着する方法にくらべて製造工程も簡略である。That is, according to the low-pressure injection molding method used in the present invention, a liquid curable resin raw material is used as the resin raw material, and the inside of the mold is evacuated before injecting the resin. Such advantages can be obtained. First, high pressure is not necessary (the injection pressure is 2 to 7 kg / cm 2
Temperature) and the temperature can be low (mold temperature is 130-160)
Since it is a liquid vacuum injection molding, it is possible to penetrate the resin raw material into even fine voids and impregnate coil parts and the like. Less damage to parts. Therefore, the curing time of the resin can be shortened.
The degree of freedom in selection in terms of material composition is great. It can be molded even if the content of the filler is increased. Therefore, the performance of the obtained molded product can be improved in thermal shock resistance, flame retardancy, etc. by selecting the resin raw material, and is not easily affected by the humidity in the atmosphere. And since the molded product itself made of a curable resin combined with a glass epoxy resin substrate satisfies the performance as a card, sealing and card molding can be done in one step, and a molded product of resin is separately manufactured and The manufacturing process is simpler than the method of mounting the non-contact IC module.
【００３８】以上、常温で液状の熱硬化性樹脂であるエ
ポキシ樹脂を具体例として説明してきたが、このような
エポキシ樹脂とてしは、前記長瀬チバ株式会社より販売
されているエポキシ樹脂（例えば、主剤ＸＮＲ−８２０
５及び硬化剤ＸＮＨ−８２０５）等により優れた物性の
非接触ＩＣカードが得られる。しかし、本発明はこれら
エポキシ樹脂に限定されるものではなく、その他、液状
の硬化性樹脂で、樹脂封止を満足し、且つ結果として得
られる成形物がカードとしての要求物性を具備する樹脂
原料であれば良く、また、硬化手段は熱に限定されるも
のではなく、熱と熱以外の手段との併用であっても良
い。The epoxy resin, which is a thermosetting resin that is liquid at room temperature, has been described above as a specific example. Such an epoxy resin is sold by Nagase Ciba Co., Ltd. (for example, epoxy resin). , Main agent XNR-820
5 and the curing agent XNH-8205) and the like can provide a non-contact IC card having excellent physical properties. However, the present invention is not limited to these epoxy resins. In addition, a resin raw material which is a liquid curable resin, satisfies the resin encapsulation, and the molded product obtained has physical properties required as a card. However, the curing means is not limited to heat, and heat and a means other than heat may be used in combination.
【００３９】なお、非接触ＩＣカードには、液晶表示素
子や、高分子／脂肪酸複合膜による可逆表示素子等の表
示素子を組み込んでおき、表示機能付きとしても良い。The non-contact IC card may have a display function by incorporating a display element such as a liquid crystal display element or a reversible display element made of a polymer / fatty acid composite film.
【００４０】[0040]
【発明の効果】本発明の非接触ＩＣカードでは、内部の
ガラス繊維強化されたガラスエポキシ樹脂により、薄型
であっても機械的強度に優れる。また、特定の低圧射出
成形法を利用しているために、内部の電子部品等の損傷
の恐れもなく、信頼性の高い非接触ＩＣカードとなる。
また、導電パターンを形成したガラスエポキシ樹脂の基
板に直接電子部品を実装した場合には、予め非接触ＩＣ
モジュールとして組み立てる必要がなく、より薄型のカ
ードが得られる。本発明の非接触ＩＣカードの製造方法
では、上記の様な優れた性能の非接触ＩＣカードが容易
に得られる。The non-contact IC card of the present invention is excellent in mechanical strength even if it is thin due to the glass epoxy resin reinforced with glass fiber inside. In addition, since a specific low-pressure injection molding method is used, there is no fear of damage to electronic components inside, and a highly reliable non-contact IC card is obtained.
When electronic components are directly mounted on a glass epoxy resin substrate on which a conductive pattern is formed, a non-contact IC is previously prepared.
A thinner card is obtained without the need to assemble it as a module. According to the method for manufacturing a non-contact IC card of the present invention, the non-contact IC card having excellent performance as described above can be easily obtained.
【図１】本発明の非接触ＩＣカードの製造方法の一実施
例の工程説明図。FIG. 1 is a process explanatory view of an embodiment of a method for manufacturing a non-contact IC card of the present invention.
【図２】本発明の製造方法を説明するフロー図。FIG. 2 is a flowchart illustrating a manufacturing method of the present invention.
【図３】本発明の製造方法の一実施例の低圧射出成形法
のシステムの概略構成図。FIG. 3 is a schematic configuration diagram of a low-pressure injection molding system according to an embodiment of a manufacturing method of the present invention.
【図４】本発明の非接触ＩＣカードの内部を説明する透
視図。FIG. 4 is a perspective view for explaining the inside of the non-contact IC card of the present invention.
【図５】本発明の製造方法の内の射出成形工程を説明す
るフロー図。FIG. 5 is a flow diagram illustrating an injection molding process in the manufacturing method of the present invention.
【図６】本発明の非接触ＩＣカードの製造方法の他の実
施例の工程説明図。FIG. 6 is a process explanatory view of another embodiment of the method for manufacturing a non-contact IC card of the present invention.
１ 非接触ＩＣカード ２０ 非接触ＩＣモジュール ３０ インサート部品 ３ プリント基板 ４ 回路部品 ４１ ＩＣ ４２ コンデンサ ４３ コイル ４４ エポキシ樹脂 ５ ガラスエポキシ樹脂基板 ５１ 同ベース材 ５２ 同枠材 ５３ 凹部 ５４ａ プレス板 ５５ｂ プレス板 ５６ 導電パターン ６ 表面仕上層 ７１ａ 樹脂タンク（主剤） ７１ｂ 樹脂タンク（硬化剤） ７２ ポンプ ７３ ミキサー ７４ 空気圧縮機 ７５ 射出ノズル ７６ａ，７６ｃ 上部金型 ７７ 真空ポンプ ８ 射出樹脂 1 Non-contact IC Card 20 Non-contact IC Module 30 Insert Part 3 Printed Circuit Board 4 Circuit Part 41 IC 42 Capacitor 43 Coil 44 Epoxy Resin 5 Glass Epoxy Resin Substrate 51 Same Base Material 52 Same Frame Material 53 Recess 54a Press Plate 55b Press Plate 56 Conductive pattern 6 Surface finishing layer 71a Resin tank (main agent) 71b Resin tank (hardening agent) 72 Pump 73 Mixer 74 Air compressor 75 Injection nozzles 76a, 76c Upper mold 77 Vacuum pump 8 Injection resin
Claims (4)
シ樹脂基板で形成される凹部内に載置されているインサ
ート部品を、金型内に載置した後、金型を閉じ、金型内
を真空にした後、液状の硬化性樹脂原料を金型内に注入
し、該樹脂原料を硬化させる低圧射出成形法により製造
したことを特徴とする非接触ＩＣカード。1. A non-contact IC module, wherein an insert part placed in a recess formed of a glass epoxy resin substrate is placed in a mold, the mold is closed, and the inside of the mold is vacuumed. A non-contact IC card manufactured by a low-pressure injection molding method in which a liquid curable resin raw material is injected into a mold and then the resin raw material is cured.
部品が、ガラスエポキシ樹脂基板で形成される凹部内の
導電パターンに実装されているインサート部品を、金型
内に載置した後、金型を閉じ、金型内を真空にした後、
液状の硬化性樹脂原料を金型内に注入し、該樹脂原料を
硬化させる低圧射出成形法により製造したことを特徴と
する非接触ＩＣカード。2. An electronic component that can form a non-contact IC module, an insert component mounted on a conductive pattern in a recess formed by a glass epoxy resin substrate is placed in the mold, and then the mold is placed. After closing and vacuuming the mold,
A non-contact IC card manufactured by a low-pressure injection molding method in which a liquid curable resin raw material is injected into a mold and the resin raw material is cured.
シ樹脂基板で形成される凹部内に載置してインサート部
品とし、該インサートを金型内に載置した後、金型を閉
じ、金型内を真空にした後、液状の硬化性樹脂原料を金
型内に注入し、該樹脂原料を硬化させる低圧射出成形法
により製造することを特徴とする非接触ＩＣカードの製
造方法。3. A non-contact IC module is placed in a recess formed by a glass epoxy resin substrate to form an insert part, and the insert is placed in the mold, and then the mold is closed to set the inside of the mold. A method for producing a non-contact IC card, which comprises producing a low-pressure injection molding method of injecting a liquid curable resin raw material into a mold and curing the resin raw material after evacuating.
部品が、ガラスエポキシ樹脂基板で形成される凹部内の
導電パターンに実装されているインサート部品を、金型
内に載置した後、金型を閉じ、金型内を真空にした後、
液状の硬化性樹脂原料を金型内に注入し、該樹脂原料を
硬化させる低圧射出成形法により製造することを特徴と
する非接触ＩＣカードの製造方法。4. An electronic component that can form a non-contact IC module, an insert component mounted on a conductive pattern in a recess formed by a glass epoxy resin substrate is placed in a mold, and then the mold is placed. After closing and vacuuming the mold,
A method for producing a non-contact IC card, which comprises producing a liquid curable resin raw material in a mold and curing the resin raw material by a low pressure injection molding method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7104620A JPH08276459A (en) | 1995-04-06 | 1995-04-06 | Non-contact ic card and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7104620A JPH08276459A (en) | 1995-04-06 | 1995-04-06 | Non-contact ic card and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08276459A true JPH08276459A (en) | 1996-10-22 |
Family
ID=14385494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7104620A Withdrawn JPH08276459A (en) | 1995-04-06 | 1995-04-06 | Non-contact ic card and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08276459A (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1024685A (en) * | 1996-07-10 | 1998-01-27 | Dainippon Printing Co Ltd | Ic card and manufacture thereof |
| JPH10166771A (en) * | 1996-12-17 | 1998-06-23 | Dainippon Printing Co Ltd | Non-contact type ic card and its manufacture |
| JP2000137786A (en) * | 1998-11-04 | 2000-05-16 | Konica Corp | Card with image receiving layer and device and method for manufacture thereof |
| JP2000183279A (en) * | 1998-10-05 | 2000-06-30 | Fuji Electric Co Ltd | Package for semiconductor element and manufacture thereof |
| DE10328836A1 (en) * | 2003-06-26 | 2005-01-13 | Schoeller Wavin Systems Services Gmbh | Method for producing a container with a data carrier and container with a data carrier |
| JP2007081442A (en) * | 1998-10-05 | 2007-03-29 | Fuji Electric Device Technology Co Ltd | Package of semiconductor element and method of manufacturing the same |
| US7296736B2 (en) | 2003-12-25 | 2007-11-20 | Honda Motor Co., Ltd. | Product management system |
| US7764173B2 (en) | 2003-02-14 | 2010-07-27 | Honda Motor Co., Ltd. | IC tag equipped vehicle and management system thereof |
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| JP2019531918A (en) * | 2016-07-27 | 2019-11-07 | コンポーズキュア，リミティド ライアビリティ カンパニー | Overmolded electronic component for transaction card and manufacturing method thereof |
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-
1995
- 1995-04-06 JP JP7104620A patent/JPH08276459A/en not_active Withdrawn
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|---|---|---|---|---|
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| JPH10166771A (en) * | 1996-12-17 | 1998-06-23 | Dainippon Printing Co Ltd | Non-contact type ic card and its manufacture |
| JP2000183279A (en) * | 1998-10-05 | 2000-06-30 | Fuji Electric Co Ltd | Package for semiconductor element and manufacture thereof |
| JP2007081442A (en) * | 1998-10-05 | 2007-03-29 | Fuji Electric Device Technology Co Ltd | Package of semiconductor element and method of manufacturing the same |
| JP2000137786A (en) * | 1998-11-04 | 2000-05-16 | Konica Corp | Card with image receiving layer and device and method for manufacture thereof |
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| JP2012252448A (en) * | 2011-06-01 | 2012-12-20 | Dainippon Printing Co Ltd | Ic tag and manufacturing method of ic tag |
| JP2019531918A (en) * | 2016-07-27 | 2019-11-07 | コンポーズキュア，リミティド ライアビリティ カンパニー | Overmolded electronic component for transaction card and manufacturing method thereof |
| US11267172B2 (en) | 2016-07-27 | 2022-03-08 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
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| US11501128B2 (en) | 2017-09-07 | 2022-11-15 | Composecure, Llc | Transaction card with embedded electronic components and process for manufacture |
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| US11232341B2 (en) | 2017-10-18 | 2022-01-25 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
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| US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
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