JPH08118862A - Information storage carrier and manufacture thereof - Google Patents
Information storage carrier and manufacture thereofInfo
- Publication number
- JPH08118862A JPH08118862A JP6262666A JP26266694A JPH08118862A JP H08118862 A JPH08118862 A JP H08118862A JP 6262666 A JP6262666 A JP 6262666A JP 26266694 A JP26266694 A JP 26266694A JP H08118862 A JPH08118862 A JP H08118862A
- Authority
- JP
- Japan
- Prior art keywords
- protective material
- information storage
- sheet
- storage carrier
- bare chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ベアチップを基体上に
搭載してなる情報記憶担体とその製造方法とに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an information storage carrier having a bare chip mounted on a substrate and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】従来より、ベアチップを基体上に搭載
し、情報の記憶とリーダ・ライタとの間の情報のやり取
りとを行う情報記憶媒体が種々提案されている。この種
の情報記憶担体は、例えば預金情報、保険情報、定期券
情報、免許証情報、健康情報、身分証明情報等の個人情
報の記憶や、工場における製品管理情報の記憶、それに
商品流通業界における商品管理情報の記憶に使用される
か、あるいは使用が検討されている。2. Description of the Related Art Conventionally, various information storage media have been proposed in which a bare chip is mounted on a substrate and information is stored and information is exchanged with a reader / writer. This type of information storage carrier is used to store personal information such as deposit information, insurance information, commuter pass information, license information, health information, identification information, etc., product management information in factories, and in the product distribution industry. Used or under consideration for storage of merchandise management information.
【０００３】図７は、従来より知られているこの種の情
報記憶担体の要部断面図であって、プリント配線板１０
０の回路パターン１０１の形成面に透孔１０２を有する
枠板１０３を重ねあわせ、前記透孔１０２内にベアチッ
プ１０４を内装し、さらには前記プリント配線板１００
の裏面と前記枠板１０３の表面とに接着層１０５を介し
てカバーシート１０６，１０７を接着する構造になって
いる。前記ベアチップ１０４は、前記プリント配線板１
００上に接着層１０８を介して接着され、前記回路パタ
ーン１０１とボンディングワイヤ１０９により接続され
る。また、前記透孔１０２内には封止樹脂１１０が充填
され、ベアチップ１０４が保護される。FIG. 7 is a cross-sectional view of the principal part of a conventionally known information storage carrier of this type, which is a printed wiring board 10.
A frame plate 103 having a through hole 102 is superposed on the surface on which the circuit pattern 101 of 0 is formed, a bare chip 104 is internally provided in the through hole 102, and further, the printed wiring board 100 is provided.
The cover sheets 106 and 107 are adhered to the back surface of the frame plate 103 and the front surface of the frame plate 103 via an adhesive layer 105. The bare chip 104 is the printed wiring board 1
00 is bonded via an adhesive layer 108, and is connected to the circuit pattern 101 by a bonding wire 109. The through hole 102 is filled with a sealing resin 110 to protect the bare chip 104.
【０００４】かかる構成の情報記憶担体は、厚さｔが
１．３ｍｍ〜１．５ｍｍに形成されており、実用上十分
な剛性を有するので、単体で携帯及び使用しても、通
常、必要以上に湾曲してベアチップ１０４が破壊すると
いうことがない。The information storage carrier having such a structure has a thickness t of 1.3 mm to 1.5 mm and has sufficient rigidity for practical use. Therefore, even if it is carried and used alone, it is usually more than necessary. There is no chance that the bare chip 104 will be bent and broken.
【０００５】[0005]
【発明が解決しようとする課題】ところで、この種の情
報記憶担体においては、携帯や保管を便利にするため、
薄形化が強く要求されている。また、製造コストの低減
も強く要求されている。By the way, in this kind of information storage carrier, in order to make it convenient to carry and store,
There is a strong demand for thinner products. Further, there is a strong demand for reduction in manufacturing cost.
【０００６】しかるに、情報記憶担体を薄形化すると、
必然的にその剛性が低下し、携帯時あるいは使用時に情
報記憶担体が大きく湾曲して、ベアチップが破壊しやす
くなる。また、従来のように、プリント配線板と枠板と
上下のカバーシートとを貼りあわせた後に、前記枠板に
開設された透孔内に封止樹脂を充填してベアチップを樹
脂封止するという情報記憶担体の製造方法は、製造工程
が複雑であるために、製造コストの低減を図りがたい。However, if the information storage carrier is thinned,
Inevitably, its rigidity is lowered, and the information storage carrier is greatly curved when carried or used, and the bare chip is easily broken. Further, as in the conventional case, after the printed wiring board, the frame plate, and the upper and lower cover sheets are attached to each other, the sealing resin is filled in the through holes formed in the frame plate to seal the bare chip with the resin. Since the manufacturing process of the information storage carrier is complicated, it is difficult to reduce the manufacturing cost.
【０００７】本発明は、かかる課題を解決するためにな
されたものであって、その目的は、薄形で携帯や保管に
便利であり、かつ耐久性に優れた情報記憶担体を提供す
ること、及びこのような薄形の情報記憶担体を安価に製
造する方法を提供することにある。The present invention has been made to solve the above problems, and an object thereof is to provide an information storage carrier which is thin, convenient for carrying and storing, and excellent in durability. Another object of the present invention is to provide a method for inexpensively manufacturing such a thin information storage carrier.
【０００８】[0008]
【課題を解決するための手段】本発明は、前記の課題を
解決するため、情報記憶担体に関しては、基体と該基体
に担持されたベアチップとを有する情報記憶担体におい
て、前記ベアチップの表面部分に、軟質保護材を介して
硬質保護材を配置するという構成にした。In order to solve the above-mentioned problems, the present invention relates to an information storage carrier, comprising: an information storage carrier having a base and a bare chip carried on the base; The hard protective material is arranged via the soft protective material.
【０００９】一方、この情報記憶担体の製造方法に関し
ては、ベアチップ、下基体のもとになる第１のシート状
体、上基体のもとになる第２のシート状体、軟質保護材
並びに硬質保護材を夫々作製する工程と、前記第１のシ
ート状体に所望の回路パターンを形成する工程と、該第
１のシート状体の所定位置に前記ベアチップを載置する
工程と、前記ベアチップのパッド部と前記回路パターン
とを電気的に接続する工程と、前記第１のシート状体の
ベアチップ載置面に前記第２のシート状体を重ねあわ
せ、前記ベアチップを前記透孔内に配置する工程と、前
記透孔内に前記軟質保護材を収納する工程と、該軟質保
護材上に前記硬質保護材を重ねあわせる工程と、これら
の組立体を一体化する工程とを含む構成にした。On the other hand, regarding the manufacturing method of this information storage carrier, a bare chip, a first sheet-shaped body which is a base of a lower base, a second sheet-shaped body which is a base of an upper base, a soft protective material and a hard material are used. A step of producing a protective material, a step of forming a desired circuit pattern on the first sheet-shaped body, a step of mounting the bare chip at a predetermined position of the first sheet-shaped body, The step of electrically connecting the pad portion and the circuit pattern, the second sheet-shaped body is superposed on the bare chip mounting surface of the first sheet-shaped body, and the bare chip is arranged in the through hole. The configuration includes a step, a step of accommodating the soft protective material in the through hole, a step of superposing the hard protective material on the soft protective material, and a step of integrating these assemblies.
【００１０】また、第２の製造方法として、ベアチップ
が実装されたＩＣモデュール、下基体のもとになる第１
のシート状体、上基体のもとになる第２のシート状体、
軟質保護材並びに硬質保護材を夫々作製する工程と、前
記第１のシート状体の所定位置に前記ＩＣモデュールを
載置する工程と、前記第１のシート状体のＩＣモデュー
ル載置面に前記第２のシート状体を重ねあわせ、前記ベ
アチップを前記透孔内に配置する工程と、前記透孔内に
前記軟質保護材を収納する工程と、該軟質保護材上に前
記硬質保護材を重ねあわせる工程と、これらの組立体を
一体化する工程とを含む構成にした。As a second manufacturing method, an IC module on which a bare chip is mounted and a first base which is a base of a lower substrate are used.
Sheet-like body, a second sheet-like body that is a base of the upper substrate,
A step of producing a soft protective material and a hard protective material, respectively, a step of placing the IC module at a predetermined position of the first sheet-shaped body, and a step of mounting the IC module on the IC module mounting surface of the first sheet-shaped body. Stacking a second sheet-shaped body and disposing the bare chip in the through hole; storing the soft protective material in the through hole; and stacking the hard protective material on the soft protective material. The configuration includes a step of combining and a step of integrating these assemblies.
【００１１】さらに、第３の製造方法として、ベアチッ
プが実装されたＩＣモデュールを作製する工程と、前記
ベアチップの周囲を軟質保護材にて覆う工程と、該軟質
保護材の周囲を硬質保護材にて覆う工程と、これら軟質
保護材及び硬質保護材が設けられたＩＣモデュールを金
型内に収納し、その周囲に基体を一体にモールドする工
程とを含む構成にした。Further, as a third manufacturing method, a step of producing an IC module on which a bare chip is mounted, a step of covering the periphery of the bare chip with a soft protective material, and a hard protective material around the soft protective material are provided. And a step of housing the IC module provided with the soft protective material and the hard protective material in a mold, and integrally molding a substrate around the IC module.
【００１２】[0012]
【作用】基体を薄形化すると必然的に情報記憶担体の剛
性が低下するが、ベアチップの設定部を硬質保護材にて
樹脂封止すれば、該部の剛性を高い値に保持できるの
で、携帯時あるいは使用時にベアチップに過大な外力が
作用せず、ベアチップの破壊が防止される。また、ベア
チップに直接硬質保護材を当接するのではなく、軟質保
護材を介して硬質保護材を当接するので、端子部の断線
等も防止される。When the base is made thin, the rigidity of the information storage carrier inevitably decreases. However, if the setting part of the bare chip is resin-sealed with a hard protective material, the rigidity of the part can be maintained at a high value. An excessive external force does not act on the bare chip when it is carried or used, and the bare chip is prevented from being broken. Further, since the hard protective material is not directly brought into contact with the bare chip but is brought into contact with the hard protective material via the soft protective material, disconnection of the terminal portion can be prevented.
【００１３】一方、当該情報記憶担体の第１の製造方法
によると、ベアチップを直接基体上に載置するので、Ｉ
Ｃモジュールを基体上に載置する場合に比べて、回路パ
ターンを形成するための基板を省略することができ、情
報記憶担体をより薄形化できる。On the other hand, according to the first manufacturing method of the information storage carrier, since the bare chip is directly mounted on the substrate, I
As compared with the case where the C module is mounted on the base, the substrate for forming the circuit pattern can be omitted, and the information storage carrier can be made thinner.
【００１４】また、前記第２の製造方法によると、所定
の部材を組み立てた後に、この組立体を加圧等するだけ
で所望の情報記憶担体を得ることができるので、ＩＣモ
デュールと下基体と上基体とを組み立てた後に、透孔内
に封止樹脂を注入してベアチップを樹脂封止するという
複雑な工程を回避することができ、情報記憶担体の製造
をより簡単に、製造コストをより安価にできる。Further, according to the second manufacturing method, a desired information storage carrier can be obtained only by assembling a predetermined member and then pressing the assembly, so that the IC module and the lower substrate can be obtained. After assembling the upper substrate, it is possible to avoid the complicated process of injecting the sealing resin into the through hole and sealing the bare chip with the resin, which makes it easier to manufacture the information storage carrier and further reduces the manufacturing cost. Can be cheap.
【００１５】さらに、前記第３の製造方法によると、Ｉ
Ｃモデュールを基体内にインサートモールドすることに
よって情報記憶担体を製造するので、量産性が高く、情
報記憶担体の製造を安価にできる。Further, according to the third manufacturing method, I
Since the information storage carrier is manufactured by insert-molding the C module in the base body, mass productivity is high and the information storage carrier can be manufactured at low cost.
【００１６】[0016]
【実施例】以下、本発明に係る情報記憶担体の第１実施
例を、図１〜図３に基づいて説明する。図１は本例に係
る情報記憶担体の分解斜視図、図２はその平面図、図３
は図２のＡ−Ａ部拡大断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the information storage carrier according to the present invention will be described below with reference to FIGS. FIG. 1 is an exploded perspective view of an information storage carrier according to this example, FIG. 2 is a plan view thereof, and FIG.
FIG. 3 is an enlarged sectional view taken along the line AA of FIG.
【００１７】図１及び図３から明らかなように、本例の
情報記憶担体は、ＩＣモデュール１と、下基体２と、上
基体３と、軟質保護材４と、硬質保護材５と、上カバー
シート６と、下カバーシート７とから構成される。As is apparent from FIGS. 1 and 3, the information storage carrier of this example has an IC module 1, a lower base 2, an upper base 3, a soft protective material 4, a hard protective material 5, and an upper base 5. It is composed of a cover sheet 6 and a lower cover sheet 7.
【００１８】ＩＣモデュール１は、例えばループアンテ
ナやコイル等の非接触信号伝送手段１１と必要な回路パ
ターン（図示省略）とが形成されたプリント配線板１２
上にベアチップ１３を実装し、該ベアチップ１３の端子
部（パッド部）と前記回路パターンの端子部とを電気的
に接続してなる。前記ベアチップ１３は、メモリと送受
信回路と制御回路とを含んで構成されており、外部装置
（リーダ・ライタ）との間で前記非接触信号伝送手段１
１を介して非接触で信号の伝送を行うと共に、必要な情
報の記憶を行う。The IC module 1 is a printed wiring board 12 on which a non-contact signal transmission means 11 such as a loop antenna or a coil and a necessary circuit pattern (not shown) are formed.
The bare chip 13 is mounted on the upper portion, and the terminal portion (pad portion) of the bare chip 13 and the terminal portion of the circuit pattern are electrically connected. The bare chip 13 includes a memory, a transmission / reception circuit, and a control circuit, and the non-contact signal transmission means 1 is connected to an external device (reader / writer).
The signal is transmitted in a non-contact manner via 1 and necessary information is stored.
【００１９】下基体２は、ガラス繊維が１０％混入され
たホットメルト接着剤をもって、所定寸法のカード状に
形成される。The lower substrate 2 is formed into a card having a predetermined size with a hot melt adhesive containing 10% glass fiber.
【００２０】上基体３は、同じくガラス繊維が１０％混
入されたホットメルト接着剤をもって前記下基体２とほ
ぼ同形同大のカード状に形成され、所定の位置に樹脂封
止用の透孔３１が開設される。The upper substrate 3 is formed into a card shape having the same shape and size as that of the lower substrate 2 with a hot melt adhesive in which 10% of glass fiber is mixed, and a through hole for resin sealing is formed at a predetermined position. 31 is opened.
【００２１】軟質保護材４は、ガラス繊維を含まないホ
ットメルト接着剤をもって、前記透孔３１内に収納可能
な形状及び寸法に形成される。The soft protective material 4 is formed by a hot melt adhesive containing no glass fiber into a shape and size that can be accommodated in the through hole 31.
【００２２】硬質保護材５は、ガラス繊維が４０％混入
されたホットメルト接着剤をもって、前記透孔３１内に
収納可能な形状及び寸法に形成される。The hard protective material 5 is formed in a shape and size that can be stored in the through hole 31 by using a hot melt adhesive containing 40% of glass fiber.
【００２３】上カバーシート６は、例えばポリエチレン
テレフタレート等の樹脂材料をもって前記下基体２及び
上基体３とほぼ同形同大のカード状に形成され、その表
面には、当該情報記憶担体の商品名やメーカー名その他
のロゴなどがデザイン印刷される。The upper cover sheet 6 is formed of a resin material such as polyethylene terephthalate into a card shape having substantially the same shape and size as the lower base 2 and the upper base 3, and the surface thereof has the trade name of the information storage carrier. And manufacturer's name and other logos are printed.
【００２４】下カバーシート７は、例えばポリエチレン
テレフタレート等の樹脂材料をもって前記下基体２及び
上基体３とほぼ同形同大のカード状に形成され、その表
面には、当該情報記憶担体の取扱上の注意事項や発行元
との取決め事項等がデザイン印刷される。The lower cover sheet 7 is formed of a resin material such as polyethylene terephthalate into a card shape having substantially the same shape and size as the lower base body 2 and the upper base body 3, and the surface thereof is used for handling the information storage carrier. The notes and arrangements with the publisher are printed.
【００２５】前記ＩＣモデュール１は、前記下基体２の
所定位置に接着される。前記上基体３は、透孔３１をベ
アチップ１３の設定部に合致して、前記下基体２のＩＣ
モデュール設定面に被着される。軟質保護材４は、前記
透孔３１内に挿入されて前記ベアチップ１３に被着さ
れ、硬質保護材５は、前記透孔３１内に挿入されて当該
軟質保護材上に被着される。上カバーシート６は、前記
上基体３及び保護シート５の表面に被着される。下カバ
ーシート７は、下基体２の表面に被着される。The IC module 1 is adhered to a predetermined position on the lower substrate 2. The upper substrate 3 has the through holes 31 aligned with the setting portions of the bare chip 13 so that the IC of the lower substrate 2 is formed.
It is attached to the module setting surface. The soft protective material 4 is inserted into the through hole 31 and adhered to the bare chip 13, and the hard protective material 5 is inserted into the through hole 31 and adhered onto the soft protective material. The upper cover sheet 6 is attached to the surfaces of the upper substrate 3 and the protective sheet 5. The lower cover sheet 7 is attached to the surface of the lower substrate 2.
【００２６】なお、ホットメルト接着剤を主剤とするシ
ート状体は、それ自体に接着性があるため、他の接着剤
を介することなく、ＩＣモデュール１と下基体２との接
着、下基体２と上基体３との接着、下基体２と下カバー
シート７との接着、それに上基体３と上カバーシート６
との接着を行うことができる。また、ホットメルト接着
剤を主剤とするシート状体は、混入されるガラス繊維の
量が多くなるほど硬化後の硬度が高くなる。本例の情報
記憶担体においては、前記下基体２及び上基体３のガラ
ス繊維混入量が１０％に調整され、硬質保護材５のガラ
ス繊維混入量が４０％に調整され、軟質保護材４はガラ
ス繊維を含まないホットメルト接着剤にて形成されてい
るので、硬質保護材５の硬度が最も高く、軟質保護材の
硬度が最も低く、下基体２及び上基体３の硬度がその中
間値になる。Since the sheet-shaped body containing a hot melt adhesive as a main component has adhesiveness to itself, the adhesion between the IC module 1 and the lower substrate 2 and the lower substrate 2 without interposing another adhesive. To the upper base 3, the lower base 2 to the lower cover sheet 7, and the upper base 3 to the upper cover sheet 6.
Can be adhered to. Further, the sheet-shaped body containing a hot-melt adhesive as a main component has a higher hardness after curing as the amount of glass fibers mixed therein increases. In the information storage carrier of this example, the glass fiber content of the lower substrate 2 and the upper substrate 3 is adjusted to 10%, the glass fiber content of the hard protective material 5 is adjusted to 40%, and the soft protective material 4 is Since the hard protective material 5 has the highest hardness and the soft protective material has the lowest hardness because it is formed of the hot-melt adhesive containing no glass fiber, the hardness of the lower substrate 2 and the upper substrate 3 is an intermediate value. Become.
【００２７】本例の情報記憶担体は、ベアチップ１３の
設定部を硬質保護材５にて樹脂封止したので、該部の剛
性を高い値に保持することができ、携帯時あるいは使用
時に下基体２及び上基体３が湾曲したとしても、ベアチ
ップ１３には過大な外力が作用せず、ベアチップ１３の
破壊を防止できる。また、ベアチップ１３に直接硬質保
護材５を当接するのではなく、軟質保護材４を介して硬
質保護材５を当接するので、端子部の断線等も防止でき
る。さらには、下基体２及び上基体３の硬度を硬質保護
材５の硬度よりも低い値に設定したので、下基体２及び
上基体３の湾曲をある程度許容することができ、携帯及
び使用が便利である。加えて、下基体２、上基体３、軟
質保護材４及び硬質保護材５の全てを、ホットメルト接
着剤を主剤とする材料にて作製するので、別途用意され
た接着剤や封止材を用いて情報記憶担体を組み立てる場
合に比べて、情報記憶担体の組立を極めて容易化でき、
情報記憶担体を安価に製造できる。In the information storage carrier of this example, the setting portion of the bare chip 13 is resin-sealed with the hard protective material 5, so that the rigidity of the portion can be maintained at a high value and the lower substrate can be carried or used. Even if 2 and the upper base 3 are curved, an excessive external force does not act on the bare chip 13, and the bare chip 13 can be prevented from being broken. Further, since the hard protective material 5 is not directly brought into contact with the bare chip 13 but is brought into contact with the hard protective material 5 via the soft protective material 4, it is possible to prevent disconnection of the terminal portion or the like. Furthermore, since the hardness of the lower base body 2 and the upper base body 3 is set to a value lower than the hardness of the hard protective material 5, the lower base body 2 and the upper base body 3 can be bent to some extent, which is convenient for carrying and using. Is. In addition, since the lower base 2, the upper base 3, the soft protective material 4 and the hard protective material 5 are all made of a material having a hot melt adhesive as a main component, an adhesive or a sealing material prepared separately can be used. As compared with the case of assembling the information storage carrier, the assembly of the information storage carrier can be extremely facilitated,
The information storage carrier can be manufactured at low cost.
【００２８】以下、前記実施例に係る情報記憶担体の製
造方法について説明する。The method of manufacturing the information storage carrier according to the above embodiment will be described below.
【００２９】まず、定法にしたがって、ベアチップ１３
が実装されたＩＣモデュール１を作製する。これと並行
して、シリコン板上にガラス繊維が１０％混入された反
応型ホットメルト接着剤を均等に溶射して第１のシート
状体を作製し、これ打ち抜いて下基体２のもとになる下
基体用シートを作製する。この下基体用シートは、所望
の下基体２よりもやや大型に形成される。また、前記第
１のシート状体を打ち抜いて、上基体３のもとになる透
孔３１を有する上基体用シートを作製する。この上基体
用シートも、所望の下基体２よりもやや大型に形成され
る。さらに、シリコン板上にガラス繊維を含まないホッ
トメルト接着剤を均等に溶射して第２のシート状体を作
製し、これ打ち抜いて軟質保護材４を作製する。また、
シリコン板上にガラス繊維が４０％混入されたホットメ
ルト接着剤を均等に溶射して第３のシート状体を作製
し、これ打ち抜いて硬質保護材５を作製する。さらに
は、ポリエチレンテレフタレートシートを打ち抜いて、
上カバーシート６及び下カバーシート７のもとになる上
カバー用シート及び下カバー用シートを作製する。これ
らの上カバー用シート及び下カバー用シートは、所望の
上カバーシート６及び下カバーシート７よりもやや大型
に形成される。First, according to the standard method, the bare chip 13
An IC module 1 in which is mounted is manufactured. At the same time, a reactive hot melt adhesive containing 10% glass fiber mixed is sprayed evenly on a silicon plate to prepare a first sheet-like body, which is punched out to form a lower substrate 2. The following lower substrate sheet is prepared. This lower substrate sheet is formed to be slightly larger than the desired lower substrate 2. Further, the first sheet-shaped body is punched out to manufacture an upper substrate sheet having the through holes 31 which are the bases of the upper substrate 3. This upper substrate sheet is also formed to be slightly larger than the desired lower substrate 2. Further, a hot melt adhesive containing no glass fiber is evenly sprayed on the silicon plate to prepare a second sheet-like body, which is punched out to prepare the soft protective material 4. Also,
A hot melt adhesive in which 40% of glass fibers are mixed is evenly sprayed on a silicon plate to prepare a third sheet-like body, which is punched out to prepare a hard protective material 5. Furthermore, punch out a polyethylene terephthalate sheet,
An upper cover sheet and a lower cover sheet, which are the basis of the upper cover sheet 6 and the lower cover sheet 7, are prepared. These upper cover sheet and lower cover sheet are formed to be slightly larger than the desired upper cover sheet 6 and lower cover sheet 7.
【００３０】次いで、下カバー用シート上に下基体用シ
ートを重ね、この下基体用シート上にＩＣモデュール１
を位置決めして載置する。また、透孔３１をベアチップ
１３の設定部に合致して、ＩＣモデュール１及び下基体
用シート上に上基体用シートを被着する。また、軟質保
護材４と硬質保護材５とをこの順に透孔３１内に収納す
る。さらには、これら上基体用シート及び保護シート５
上に上カバー用シートを被着する。Next, the lower base sheet is placed on the lower cover sheet, and the IC module 1 is placed on the lower base sheet.
Position and place. Further, the through hole 31 is aligned with the setting portion of the bare chip 13, and the upper substrate sheet is attached to the IC module 1 and the lower substrate sheet. The soft protective material 4 and the hard protective material 5 are housed in the through hole 31 in this order. Further, these upper substrate sheet and protective sheet 5
Put the top cover sheet on top.
【００３１】しかる後に、これらの組立体を厚さ方向に
加圧しつつ、ホットメルト接着剤の反応開始温度以上に
これらの組立体を加熱し、ホットメルト接着剤を硬化し
て一体に接合する。Thereafter, while pressing these assemblies in the thickness direction, they are heated above the reaction start temperature of the hot melt adhesive to cure the hot melt adhesive and bond them together.
【００３２】最後に、このようにして作製された接合体
の外周を打ち抜いて、所定寸法のカード状情報記憶担体
を得る。Finally, the outer periphery of the bonded body thus manufactured is punched out to obtain a card-shaped information storage carrier of a predetermined size.
【００３３】本例の情報記憶担体製造方法によると、所
定の部材１〜７を組み立てた後に、これを加圧及び加熱
するだけで所望の情報記憶担体を得ることができるの
で、ＩＣモデュールと下基体と上基体とを組み立てた後
に、透孔内に封止樹脂を注入してベアチップを樹脂封止
するという複雑な工程を有する従来の方法に比べて、情
報記憶担体の製造をより簡単なものにすることができ、
情報記憶担体の製造コストを低減できる。また、ホット
メルト接着剤を主剤とするシート状体を用いて、下基体
２と上基体３と軟質保護材４と硬質保護材５とを作製し
たので、これらの各部材の接合に当たっては、６０〜８
０℃程度の温度に組立体を加熱すれば良く、熱硬化性の
接着剤を用いて各部材を接着する場合（硬化温度；１２
０℃）に比べて、加熱温度を低くすることができる。よ
って、硬化工程の短縮並びに消費エネルギの削減を図る
ことができると共に、過熱によるベアチップの損傷等を
防止して良品の歩留まりの向上を図ることができ、情報
記憶担体の製造コストを安価にできる。According to the method for manufacturing an information storage carrier of the present embodiment, a desired information storage carrier can be obtained only by assembling the predetermined members 1 to 7 and then pressurizing and heating them. A simpler method for manufacturing an information storage carrier, as compared with a conventional method having a complicated process of injecting a sealing resin into the through hole and resin-sealing the bare chip after assembling the base and the upper base. Can be
The manufacturing cost of the information storage carrier can be reduced. Further, since the lower base body 2, the upper base body 3, the soft protective material 4 and the hard protective material 5 were produced by using a sheet-like body containing a hot melt adhesive as a main component, the bonding of each of these members was 60 ~ 8
It suffices to heat the assembly to a temperature of about 0 ° C., and to bond each member with a thermosetting adhesive (curing temperature; 12
The heating temperature can be lowered as compared with (0 ° C.). Therefore, the curing process can be shortened and the energy consumption can be reduced, the bare chips can be prevented from being damaged by overheating, and the yield of non-defective products can be improved, so that the manufacturing cost of the information storage carrier can be reduced.
【００３４】なお、本発明は、ベアチップを保護するた
めに、ベアチップの表面部分を軟質保護材にて覆い、そ
の外面に硬質保護材を配置したことを特徴とするもので
あって、情報記憶担体を構成する各部材の形状、寸法、
材質、製造方法等が前記実施例に限定されるものではな
い。以下に、本発明の他の実施例を列挙する。The present invention is characterized in that, in order to protect the bare chip, the surface portion of the bare chip is covered with a soft protective material, and a hard protective material is arranged on the outer surface thereof. The shape and dimensions of each member constituting
The material, the manufacturing method, etc. are not limited to those in the above embodiment. Other examples of the present invention will be listed below.
【００３５】前記実施例においては、ホットメルト接
着剤を主剤とし、これに混入されるガラス繊維の量によ
って硬度が調整された軟質保護材４及び硬質保護材５を
もってベアチップ１３を樹脂封止したが、かかる構成に
代えて、図４に示すように、表面が軟質の接着剤８０、
例えばホットメルト接着剤、あるいはホットメルト接着
剤に所定量のガラス繊維を混入して硬度を調整したもの
にてコーティングされたガラス板等の硬質材８１を透孔
３１内に挿入することによって、ベアチップ１３を封止
することもできる。In the above embodiment, the bare chip 13 was resin-sealed with the hot-melt adhesive as the main agent and the soft protective material 4 and the hard protective material 5 whose hardness was adjusted by the amount of the glass fibers mixed therein. Instead of such a configuration, as shown in FIG. 4, an adhesive 80 having a soft surface,
For example, by inserting a hard material 81 such as a glass plate coated with a hot-melt adhesive agent or a material in which a predetermined amount of glass fibers is mixed in the hot-melt adhesive agent to adjust the hardness into the through hole 31, the bare chip It is also possible to seal 13.
【００３６】前記実施例においては、プリント配線板
１２とベアチップ１３とが一体化されたＩＣモジュール
１を下基体２と上基体３との間に取り付けたが、かかる
構成に代えて、図５に示すように、ループアンテナやコ
イル等の非接触信号伝送手段１１を含む所望の回路パタ
ーンが形成された下基体２にベアチップ１３を単独で取
り付け、前記下基板２に形成された回路パターンとベア
チップ１３の端子部とを電気的に接続することもでき
る。この場合、下基体２にベアチップ１３を実装後、下
基体２の回路パターン形成面に上基体３を被着し、上基
体３に開設された透孔３１内に軟質保護材４と硬質保護
材５とを順次挿入し、最後にこれらの部材を一体化し
て、所望の情報記憶担体を得る。In the above-mentioned embodiment, the IC module 1 in which the printed wiring board 12 and the bare chip 13 are integrated is mounted between the lower base body 2 and the upper base body 3. As shown, the bare chip 13 is individually attached to the lower substrate 2 on which a desired circuit pattern including the non-contact signal transmission means 11 such as a loop antenna or a coil is formed, and the circuit pattern formed on the lower substrate 2 and the bare chip 13 are attached. It can also be electrically connected to the terminal part of. In this case, after mounting the bare chip 13 on the lower substrate 2, the upper substrate 3 is adhered to the circuit pattern forming surface of the lower substrate 2, and the soft protective material 4 and the hard protective material are provided in the through holes 31 formed in the upper substrate 3. 5 and 5 are sequentially inserted, and finally these members are integrated to obtain a desired information storage carrier.
【００３７】前記実施例においては、下基体２のもと
になるシート状体及び上基体３のもとになるシート状体
を含む複数個の部材を貼りあわせることによって情報記
憶担体を作製したが、かかる構成に代えて、図６に示す
ように、前記下基体２及び上基体３に相当する基体１０
０をモールドにより成形することもできる。この場合、
ＩＣモデュール１のベアチップ１３設定部の周囲を軟質
保護材４にて覆い、次いで、該軟質保護材４の周囲を硬
質保護材５にて覆った後に、これら軟質保護材４及び硬
質保護材５が設けられたＩＣモデュール１を金型内に収
納し、その周囲に基体１００を一体にモールドすること
によって、所望の情報記憶担体を製造できる。また、ベ
アチップ１３を単独で金型内に収納し、該ベアチップ１
３の周囲を軟質保護材４にて覆うモールド成形と、該軟
質保護材４の周囲を硬質保護材５にて覆うモールド成形
と、基体１００のモールド成形とを連続的に行うことに
よって、所望の情報記憶担体を製造することもできる。In the above-mentioned embodiment, the information storage carrier is manufactured by bonding a plurality of members including the sheet-like body which is the base of the lower base 2 and the sheet-like body which is the base of the upper base 3. Instead of such a configuration, as shown in FIG. 6, a substrate 10 corresponding to the lower substrate 2 and the upper substrate 3
It is also possible to mold 0 by molding. in this case,
After the bare chip 13 setting portion of the IC module 1 is covered with the soft protective material 4 and then the soft protective material 4 is covered with the hard protective material 5, the soft protective material 4 and the hard protective material 5 are A desired information storage carrier can be manufactured by accommodating the provided IC module 1 in a mold and integrally molding the base 100 around the IC module 1. In addition, the bare chip 13 is separately housed in a mold, and the bare chip 1
By continuously performing the molding process for covering the periphery of the soft protective member 4 with the soft protective member 4, the molding process for covering the surrounding of the soft protective member 4 with the hard protective member 5, and the molding process of the base body 100 in succession. Information storage carriers can also be manufactured.
【００３８】前記実施例においては、必要に応じて所
定量のガラス繊維が混入された反応型ホットメルト接着
剤をシリコン板の表面に溶射することによって、下基体
２、上基体３、軟質保護材４及び硬質保護材５のもとに
なるシート状体を作製したが、かかる構成に代えて、こ
れらの各部材のうちの少なくとも１つを印刷によって作
製することもできる。In the above-mentioned embodiment, the lower substrate 2, the upper substrate 3 and the soft protective material are sprayed on the surface of the silicon plate by spraying a reactive hot melt adhesive in which a predetermined amount of glass fiber is mixed as required. Although the sheet-like body which is the base of 4 and the hard protective material 5 was produced, at least one of each of these members can be produced by printing instead of such a configuration.
【００３９】前記実施例においては、大型のシート状
体から下基体２及び上基体３を型抜きした後にＩＣモジ
ュール１の搭載等を行うが、かかる構成に代えて、大型
のシート状体に複数個のＩＣモジュール１又はベアチッ
プ１３を搭載し、所定の部材を組み立てかつ一体化した
後に、型抜きを行って所定形状の情報記憶担体を取り出
すようにすることもできる。In the above-mentioned embodiment, the IC module 1 is mounted after the lower base body 2 and the upper base body 3 are stamped out from a large sheet-shaped body. It is also possible to mount individual IC modules 1 or bare chips 13, assemble and integrate predetermined members, and then perform die cutting to take out the information storage carrier having a predetermined shape.
【００４０】前記実施例においては、下基体２、上基
体３、軟質保護材４、硬質保護材５の各部材をホットメ
ルト接着剤を主剤とするシート状体にて作製したが、こ
れらの各部材は、それ自体接着性を有しない材料を用い
て作製することもできる。この場合には、接合に際し
て、各部材が接着剤を介して貼りあわされる。In the above-mentioned embodiment, the lower base 2, the upper base 3, the soft protective material 4, and the hard protective material 5 were made of a sheet-like body containing hot-melt adhesive as a main component. The member can also be made using a material that itself does not have adhesive properties. In this case, at the time of joining, the respective members are pasted together via an adhesive.
【００４１】その他、前記各実施例においては、カード
状の情報記憶担体を例にとって説明したが、本例の要旨
はこれに限定されるものではなく、例えばコイン状など
任意の形状の情報記憶担体の製造に応用することができ
る。In addition, in each of the above-mentioned embodiments, the card-shaped information storage carrier has been described as an example, but the gist of the present embodiment is not limited to this, and the information storage carrier of any shape such as a coin shape can be used. Can be applied to the manufacture of.
【００４２】[0042]
【発明の効果】以上説明したように、請求項１に記載の
発明は、ベアチップの表面部分に、軟質保護材を介して
硬質保護材を配置したので、該部の剛性を高い値に保持
することができ、携帯時あるいは使用時に基体が湾曲し
たとしても、ベアチップには過大な外力が作用せず、ベ
アチップの破壊を防止できる。また、ベアチップに直接
硬質保護材を当接するのではなく、軟質保護材を介して
硬質保護材を当接するので、端子部の断線等も防止でき
る。As described above, according to the invention described in claim 1, since the hard protective material is arranged on the surface portion of the bare chip via the soft protective material, the rigidity of the portion is maintained at a high value. Even if the base body is curved during carrying or use, an excessive external force does not act on the bare chip, and the bare chip can be prevented from being broken. In addition, since the hard protective material is not directly contacted with the bare chip but is contacted with the hard protective material through the soft protective material, disconnection of the terminal portion can be prevented.
【００４３】一方、請求項１０及び請求項１１に記載の
発明は、所定の部材を組み立てた後に、これを一体化す
るだけで所望の情報記憶担体を得ることができるので、
ＩＣモデュールと下基体と上基体とを組み立てた後に、
透孔内に封止樹脂を注入してベアチップを樹脂封止する
という複雑な工程を有する従来の方法に比べて、情報記
憶担体の製造をより簡単なものにすることができ、情報
記憶担体の製造コストを低減できる。On the other hand, according to the tenth and eleventh aspects of the present invention, a desired information storage carrier can be obtained only by assembling predetermined members and then assembling them.
After assembling the IC module, the lower substrate and the upper substrate,
Compared with the conventional method having a complicated process of injecting a sealing resin into the through hole and resin-sealing the bare chip, the manufacturing of the information storage carrier can be made simpler. Manufacturing cost can be reduced.
【００４４】また、請求項１５に記載の発明は、情報記
憶担体の基体部分をモールド成形するので、下基体及び
上基体の貼りあわせによって基体を作製する場合に比べ
て、情報記憶担体の製造をより簡単なものにすることが
でき、情報記憶担体の製造コストを低減できる。According to the fifteenth aspect of the present invention, since the base portion of the information storage carrier is molded, the information storage carrier can be manufactured as compared to the case where the base is manufactured by bonding the lower base and the upper base. It can be simpler and the manufacturing cost of the information storage carrier can be reduced.
【図１】第１実施例に係る情報記憶担体の分解斜視図で
ある。FIG. 1 is an exploded perspective view of an information storage carrier according to a first embodiment.
【図２】第１実施例に係る情報記憶担体の平面図であ
る。FIG. 2 is a plan view of the information storage carrier according to the first embodiment.
【図３】図２のＡ−Ａ部断面図である。FIG. 3 is a sectional view taken along the line AA of FIG.
【図４】第２実施例に係る情報記憶担体の要部断面図で
ある。FIG. 4 is a cross-sectional view of essential parts of an information storage carrier according to a second embodiment.
【図５】第３実施例に係る情報記憶担体の要部断面図で
ある。FIG. 5 is a cross-sectional view of essential parts of an information storage carrier according to a third embodiment.
【図６】第４実施例に係る情報記憶担体の要部断面図で
ある。FIG. 6 is a cross-sectional view of essential parts of an information storage carrier according to a fourth example.
【図７】従来例に係る情報記憶担体の要部断面図であ
る。FIG. 7 is a sectional view of an essential part of an information storage carrier according to a conventional example.
１ ＩＣモデュール ２ 下基体 ３ 上基体 ４ 軟質保護材 ５ 硬質保護材 ６ 上カバーシート ７ 下カバーシート １３ ベアチップ ３１ 樹脂封止用の透孔 1 IC Module 2 Lower Base Body 3 Upper Base Body 4 Soft Protective Material 5 Hard Protective Material 6 Upper Cover Sheet 7 Lower Cover Sheet 13 Bare Chip 31 Through Hole for Resin Sealing
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/56 Ｒ 23/28 Ｚ 6921−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location H01L 21/56 R 23/28 Z 6921-4E
Claims (15)
を有する情報記憶担体において、前記ベアチップの表面
部分に、軟質保護材を介して硬質保護材を配置したこと
を特徴とする情報記憶担体。1. An information storage carrier having a base and a bare chip carried on the base, wherein a hard protective material is arranged on a surface portion of the bare chip via a soft protective material.
て、前記ベアチップが単独で前記基体に取り付けられ、
該基体の表面に所望の回路パターンを形成すると共に、
前記ベアチップのパッド部と前記回路パターンとが電気
的に接続されていることを特徴とする情報記憶担体。2. The information storage carrier according to claim 1, wherein the bare chip is independently attached to the base,
While forming a desired circuit pattern on the surface of the substrate,
An information storage carrier, wherein the pad portion of the bare chip and the circuit pattern are electrically connected.
て、前記ベアチップが所望の回路パターンを有する基板
上に取り付けられ、前記ベアチップのパッド部と前記回
路パターンとが電気的に接続されたＩＣモジュールを、
前記基体に取り付けたことを特徴とする情報記憶担体。3. The information storage carrier according to claim 1, wherein the bare chip is mounted on a substrate having a desired circuit pattern, and the pad portion of the bare chip and the circuit pattern are electrically connected. To
An information storage carrier attached to the base.
て、前記基体の硬度が、前記軟質保護材の硬度と前記硬
質保護材の硬度の中間値に調整されていることを特徴と
する情報記憶担体。4. The information storage carrier according to claim 1, wherein the hardness of the base is adjusted to an intermediate value between the hardness of the soft protective material and the hardness of the hard protective material. Carrier.
て、前記基体及び軟質保護材並びに硬質保護材が、いず
れも高分子材料を主剤とし、これに添加されるガラス繊
維の添加量によって硬度が調整されたものにて形成され
ていることを特徴とする情報記憶担体。5. The information storage carrier according to claim 1, wherein the base material, the soft protective material, and the hard protective material each have a polymer material as a main component and have a hardness depending on the amount of glass fiber added thereto. An information storage carrier, which is formed of a conditioned material.
て、前記基体及び軟質保護材が、高分子材料を主剤と
し、これに添加されるガラス繊維の添加量によって硬度
が調整されたものにて形成され、前記硬質保護材が、ガ
ラス板にて形成されていることを特徴とする情報記憶担
体。6. The information storage carrier according to claim 1, wherein the base material and the soft protective material are mainly composed of a polymer material and the hardness of which is adjusted by the amount of glass fiber added thereto. An information storage carrier, characterized in that the hard protective material is formed of a glass plate.
おいて、前記高分子材料が、ホットメルト接着剤である
ことを特徴とする情報記憶担体。7. The information storage carrier according to claim 5, wherein the polymer material is a hot melt adhesive.
て、前記基体の表面及び裏面に、それぞれ所望のデザイ
ン印刷がなされた上カバーシート及び下カバーシートが
被着されていることを特徴とする情報記憶担体。8. The information storage carrier according to claim 1, wherein an upper cover sheet and a lower cover sheet on which a desired design is printed are adhered to the front surface and the back surface of the base, respectively. Information storage carrier.
て、前記基体が、平板状の下基体と、前記ベアチップの
設定部と対応する位置に、前記軟質保護材及び硬質保護
材を挿入するための透孔が開設された上基体とからなる
ことを特徴とする情報記憶担体。9. The information storage carrier according to claim 1, wherein the base body is for inserting the soft protective material and the hard protective material in a position corresponding to a flat lower substrate and a setting portion of the bare chip. An information storage carrier, comprising: an upper substrate having a through hole formed therein.
のシート状体、上基体のもとになる第２のシート状体、
軟質保護材並びに硬質保護材を夫々作製する工程と、前
記第１のシート状体に所望の回路パターンを形成する工
程と、該第１のシート状体の所定位置に前記ベアチップ
を載置する工程と、前記ベアチップのパッド部と前記回
路パターンとを電気的に接続する工程と、前記第１のシ
ート状体のベアチップ載置面に前記第２のシート状体を
重ねあわせ、前記ベアチップを前記透孔内に配置する工
程と、前記透孔内に前記軟質保護材を収納する工程と、
該軟質保護材上に前記硬質保護材を重ねあわせる工程
と、これらの組立体を一体化する工程とを含むことを特
徴とする情報記憶担体の製造方法。10. A bare chip, a first base for a lower substrate.
Sheet-like body, a second sheet-like body that is a base of the upper substrate,
A step of producing a soft protective material and a hard protective material respectively, a step of forming a desired circuit pattern on the first sheet-shaped body, and a step of placing the bare chip at a predetermined position of the first sheet-shaped body And a step of electrically connecting the pad portion of the bare chip and the circuit pattern, and the second sheet-shaped body is superposed on the bare chip mounting surface of the first sheet-shaped body, and the bare chip is transparent. A step of arranging in the hole, a step of accommodating the soft protective material in the through hole,
A method for manufacturing an information storage carrier, comprising: a step of superposing the hard protective material on the soft protective material; and a step of integrating these assemblies.
ル、下基体のもとになる第１のシート状体、上基体のも
とになる第２のシート状体、軟質保護材並びに硬質保護
材を夫々作製する工程と、前記第１のシート状体の所定
位置に前記ＩＣモデュールを載置する工程と、前記第１
のシート状体のＩＣモデュール載置面に前記第２のシー
ト状体を重ねあわせ、前記ベアチップを前記透孔内に配
置する工程と、前記透孔内に前記軟質保護材を収納する
工程と、該軟質保護材上に前記硬質保護材を重ねあわせ
る工程と、これらの組立体を一体化する工程とを含むこ
とを特徴とする情報記憶担体の製造方法。11. An IC module on which a bare chip is mounted, a first sheet-like body which is a base of a lower base, a second sheet-like body which is a base of an upper base, a soft protective material and a hard protective material, respectively. A step of manufacturing, a step of placing the IC module at a predetermined position of the first sheet-shaped body,
Stacking the second sheet-like body on the IC module mounting surface of the sheet-like body, arranging the bare chip in the through-hole, and storing the soft protective material in the through-hole, A method for manufacturing an information storage carrier, comprising: a step of superposing the hard protective material on the soft protective material; and a step of integrating these assemblies.
担体の製造方法において、前記第１のシート状体、第２
のシート状体、軟質保護材並びに硬質保護材のうちの少
なくとも１つを、印刷により作製することを特徴とする
情報記憶担体の製造方法。12. The method for manufacturing an information storage carrier according to claim 10, wherein the first sheet-shaped body and the second sheet-shaped body are provided.
At least one of the sheet-shaped body, the soft protective material and the hard protective material is produced by printing.
担体の製造方法において、必要に応じて所定量のガラス
繊維が混入された反応型ホットメルト接着剤をシリコン
板上に溶射して一定厚さのシート状体を作製し、剥離
後、必要に応じて型抜きを行い、所定形状の第１のシー
ト状体、第２のシート状体、軟質保護材又は硬質保護材
を作製することを特徴とする情報記憶担体の製造方法。13. The method for manufacturing an information storage carrier according to claim 10 or 11, wherein a reactive hot melt adhesive containing a predetermined amount of glass fiber mixed therein is sprayed onto a silicon plate to have a constant thickness. A sheet-shaped body having a predetermined shape is formed, and after peeling, die-cutting is performed as necessary to produce a first sheet-shaped body, a second sheet-shaped body, a soft protective material or a hard protective material having a predetermined shape. A method of manufacturing a characteristic information storage carrier.
担体の製造方法において、前記第１のシート状体及び第
２のシート状体を、型抜きにより複数個の下基体又は上
基体を取り出せる大きさに作製し、該大型の第１のシー
ト状体にベアチップ又はＩＣモジュールを載置した後、
当該第１のシート状体に前記第２のシート状体を重ねあ
わせ、該第２のシート状体に開設された前記透孔内に前
記軟質保護材と前記硬質保護材とを順次収納し、これら
各部材の組立体を一体化後、型抜きによって所望形状の
情報記憶担体を得ることを特徴とする情報記憶担体の製
造方法。14. The method for manufacturing an information storage carrier according to claim 10, wherein a plurality of lower base bodies or upper base bodies can be taken out from the first sheet-shaped body and the second sheet-shaped body by die cutting. After being manufactured to a size and mounting a bare chip or an IC module on the large-sized first sheet-shaped body,
The second sheet-shaped body is superposed on the first sheet-shaped body, and the soft protective material and the hard protective material are sequentially stored in the through holes formed in the second sheet-shaped body, A method for manufacturing an information storage carrier, characterized in that an information storage carrier having a desired shape is obtained by die-cutting after assembling an assembly of these respective members.
ルを作製する工程と、前記ベアチップの周囲を軟質保護
材にて覆う工程と、該軟質保護材の周囲を硬質保護材に
て覆う工程と、これら軟質保護材及び硬質保護材が設け
られたＩＣモデュールを金型内に収納し、その周囲に基
体を一体にモールドする工程とを含むことを特徴とする
情報記憶担体の製造方法。15. A step of producing an IC module on which a bare chip is mounted, a step of covering the periphery of the bare chip with a soft protective material, a step of covering the periphery of the soft protective material with a hard protective material, and these soft materials. And a step of housing an IC module provided with a protective material and a hard protective material in a mold, and integrally molding a base body around the IC module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26266694A JP3505238B2 (en) | 1994-10-26 | 1994-10-26 | Information storage carrier and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26266694A JP3505238B2 (en) | 1994-10-26 | 1994-10-26 | Information storage carrier and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08118862A true JPH08118862A (en) | 1996-05-14 |
| JP3505238B2 JP3505238B2 (en) | 2004-03-08 |
Family
ID=17378928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26266694A Expired - Fee Related JP3505238B2 (en) | 1994-10-26 | 1994-10-26 | Information storage carrier and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3505238B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1086569A (en) * | 1996-09-13 | 1998-04-07 | Dainippon Printing Co Ltd | Ic card and its manufacture |
| JP2000085283A (en) * | 1998-09-16 | 2000-03-28 | Dainippon Printing Co Ltd | Noncontact ic card and its manufacture |
| JP2000137786A (en) * | 1998-11-04 | 2000-05-16 | Konica Corp | Card with image receiving layer and device and method for manufacture thereof |
| JP2001307049A (en) * | 2000-04-21 | 2001-11-02 | Dainippon Printing Co Ltd | Non-contact data carrier |
| WO2005004045A1 (en) | 2003-07-07 | 2005-01-13 | Konica Minolta Photo Imaging, Inc. | Ic card and ic card manufacturing method |
| JP2009259258A (en) * | 1997-09-26 | 2009-11-05 | Gemplus Sca | Electronic device with disposable chip and method for making the same |
-
1994
- 1994-10-26 JP JP26266694A patent/JP3505238B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1086569A (en) * | 1996-09-13 | 1998-04-07 | Dainippon Printing Co Ltd | Ic card and its manufacture |
| JP2009259258A (en) * | 1997-09-26 | 2009-11-05 | Gemplus Sca | Electronic device with disposable chip and method for making the same |
| JP4618462B2 (en) * | 1997-09-26 | 2011-01-26 | ジェマルト エスアー | Disposable chip electronic device and manufacturing method |
| JP2000085283A (en) * | 1998-09-16 | 2000-03-28 | Dainippon Printing Co Ltd | Noncontact ic card and its manufacture |
| JP4508301B2 (en) * | 1998-09-16 | 2010-07-21 | 大日本印刷株式会社 | Non-contact IC card |
| JP2000137786A (en) * | 1998-11-04 | 2000-05-16 | Konica Corp | Card with image receiving layer and device and method for manufacture thereof |
| JP2001307049A (en) * | 2000-04-21 | 2001-11-02 | Dainippon Printing Co Ltd | Non-contact data carrier |
| WO2005004045A1 (en) | 2003-07-07 | 2005-01-13 | Konica Minolta Photo Imaging, Inc. | Ic card and ic card manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3505238B2 (en) | 2004-03-08 |
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