JP4508301B2 - Non-contact IC card - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact IC card, and more particularly to a non-contact IC card that can facilitate image printing by thermal transfer printing on the card surface and easily provide various additional functions to the card. It relates to a manufacturing method.
[0002]
[Prior art]
At present, there are many non-contact IC cards in the market of Mifare “micron registered trademark” specifications. The card structure has a structure in which a non-contact IC chip is embedded in a card base material, and is divided into one using a vinyl chloride base material and one using a nonwoven fabric and a PET (polyethylene terephthalate) base material.
FIG. 5 is a diagram showing a cross-sectional configuration of a conventional non-contact IC card using a vinyl chloride base material. This card is composed of a vinyl chloride sheet 211 as a center sheet and oversheets 212 and 213 made of vinyl chloride laminated on both sides thereof. The IC chip 22 is embedded in the embedding hole of the center sheet. At that time, the connection terminals of the antenna coil or winding antenna coil 24 formed on the center sheet by printed wiring technology and the positions of the bumps 221 and 222 of the IC chip 22 are connected. When laminating the center sheet and the oversheet, heat pressing is performed using a thermosetting epoxy adhesive (may be an adhesive sheet) 23 as shown in FIG.
[0003]
FIG. 6 is a diagram showing a cross-sectional configuration of a conventional non-contact IC card using a nonwoven fabric and a PET base material. In the case of this card, after the IC chip 22 and the winding antenna coil 24 are connected, non-woven fabrics 25 and 26 are applied to both sides of the card, and both sides of the outer side are heated and cured with an epoxy adhesive (adhesive sheet). The laminated body sandwiching the PET sheets 271 and 272 via 23 is hot-pressed to form a card base. At the time of hot pressing, the adhesive penetrates into the non-woven fabric, and after cooling, it becomes an integral card substrate by the thermosetting adhesive.
[0004]
For the card substrate thus formed, common information and pictures are provided by a normal printing method, and information and a face photograph of each card user are individually provided by a thermal transfer printer, particularly a sublimation type thermal transfer printer. Is done.
FIG. 4 is a diagram showing a method of painting on a card by a thermal transfer printer. FIG. 4A shows the direct printing method. When the thermal sublimation transfer ribbon 42 is brought into contact with the card 41 passing over the platen roller 45 and the image corresponding portion is heated by the thermal head 43, the sublimation property on the ribbon. The dye migrates to the card substrate and forms an image. If this operation is repeated for each of the colors cyan, magenta, yellow, and black, a color image is formed on the card.
[0005]
FIG. 4B shows a retransfer printing method, in which a necessary image is once subjected to thermal sublimation transfer to an intermediate transfer medium 44 having a base material wider than a card base material and having a peelable dye receiving layer formed thereon. The dye is transferred by the ribbon 42 to form an image. Thereafter, the intermediate transfer medium 44 having the image and the card 41 are brought into close contact with each other and passed between the heating roller 46 and the pressure roller 47 so that the image of the dye receiving layer formed on the intermediate transfer medium 44 is re-appeared on the card side. It is to be transcribed.
[0006]
In the case of the direct printing method, since it is difficult to transfer to the edge portion of the card, it is not possible to provide a pattern with the full width of the card, and a blank portion is generated around the card. On the other hand, the retransfer printing method can transfer the picture to the full width of the card as long as the image on the intermediate transfer medium is made wide. In addition, in the case of the direct method, high card flatness is required, and in a non-contact IC card in which unevenness of the IC chip is likely to occur, the printable area is limited, but in the case of the retransfer printing method, the card has some unevenness. However, since the pressure roller has cushioning properties, there is an advantage that an image having no defect can be formed on the entire surface of the card. However, since the card substrate is subjected to a temperature of 170 to 180 ° C. at the time of retransfer, it needs to have sufficient heat resistance.
[0007]
However, in the case of the above-mentioned vinyl chloride non-contact IC card, since the vinyl chloride base material is thermally deformed due to this heating, a sublimation type retransfer printer (for example, “CPX10000” manufactured by Dai Nippon Printing Co., Ltd.) is used. If you print characters and images, curling will occur. Further, in a normal direct method sublimation transfer printer (for example, “CP510” manufactured by Dai Nippon Printing Co., Ltd.), there is a problem that it is difficult to form an image over a wide area because inevitable irregularities are generated in the IC chip portion. Further, when an additional function such as a thermal rewrite display unit (thermal rewrite unit) is provided, writing is similarly difficult if there are irregularities.
In addition, it is difficult to retransfer characters and images with a sublimation retransfer printer on a conventional PET non-contact IC card surface. In ordinary direct method sublimation transfer printers, it is difficult to form images due to the molecular orientation characteristics of the film. There is a problem that it is difficult to provide an additional function of embossing, magnetic stripe, or hologram.
[0008]
[Problems to be solved by the invention]
Therefore, the present invention realizes a non-contact IC card that is excellent in surface smoothness that can accurately perform post-processing such as individual information and face photo printing on the card surface by a heat-sensitive sublimation transfer printer, and that can perform retransfer printing of sublimation transfer. It has been made. In particular, a polycarbonate sheet having high heat resistance and good retransfer printing can be used as a card substrate.
[0009]
[Means for Solving the Problems]
The first aspect of the present invention to solve the above problems, IC chip I C chip connected to the antenna coil, on one side across the antenna coil through the mesh sheet and the hot-melt adhesive sheet the polycarbonate sheet was laminated Te, on the other side, by laminating a PET sheet heat sealed through the mesh sheet and the hot-melt adhesive sheet, in the contactless IC card is embedded an IC chip in the card body The outer surface of the polycarbonate sheet is provided with a pattern that fills the card width with a sublimation-type retransfer printer, and the outer surface of the PET sheet is provided with a display unit composed of a metal vapor deposition layer, a thermal rewrite display layer, and a protective layer in this order. There is a non-contact IC card characterized by the above. Since such a non-contact IC card has high heat resistance, it is easy to provide a pattern with heat-sensitive sublimation transfer printing, and it is easy to provide other additional functions.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
The present invention relates to a novel non-contact IC card and a method for manufacturing the same, and is characterized in that, in particular, a polycarbonate sheet is used on one side of an IC card substrate and a PET sheet is used on the other side.
Hereinafter, embodiments of the present invention will be described in detail, but the present invention is not limited to the following embodiments.
[0013]
FIG. 1 is a diagram showing a non-contact IC card stacking process according to the present invention. As shown in FIG. 1, the IC chip 12 having the antenna coil 14 connected between the mesh sheets 15 and 16 is sandwiched, and the polycarbonate sheet 111 is placed on one side of the card via the adhesive sheets 17 and 18 on the both sides. After laminating the PET sheet 112, heat fusion is applied by applying hot pressure. The antenna coil 14 is connected between the bumps 121 and 122 of the IC chip 12 by winding a thin conductive wire such as copper or aluminum several times to a size within the card size. It is preferable to adjust the total thickness before pressing the above-mentioned sheets so as to be in the range of 0.68 to 0.84 mm so that the thickness after pressing becomes the reference thickness of 0.76 mm. As will be described later, it is preferable to apply white concealment printing on the outer surface of the polycarbonate sheet, and metal deposition to increase the visibility of the thermal rewrite layer on the outer surface of the PET sheet. It is preferable to provide a layer.
[0014]
In this case, prior to heat pressing, a process may be performed in which the IC chip 12 to which the antenna coil 14 is connected is lightly pressed and mounted between the first mesh sheet and the second mesh sheet. This is because when the mesh sheet is heat-meltable, heat is applied to dissolve it slightly to fix the IC chip between the sheets and stabilize it. Further, a step of laminating a polycarbonate sheet or a PET sheet on one surface of the mesh sheet on which the IC chip and the antenna coil are mounted via an adhesive layer and temporarily attaching the mesh sheet may be performed. In this method, an ultrasonic sealer or the like is pressed and heat is applied in a spot manner, and the sheet is similarly fixed to one of the sheets. Since the IC chip 12 has a thickness of about 50 to 150 μm, it is absorbed into the thickness of the mesh sheet, which is an elastic body, before being solidified, thereby reducing the uneven shape on the card surface. In other words, the mesh sheet gives strength to the card and penetrates the adhesive so that the mesh sheet on both sides of the IC chip, polycarbonate, and PET sheet are integrated, and further, the irregularities of the IC chip and the antenna coil are absorbed. It has the effect of smoothing the shape.
[0015]
FIG. 2 is a view showing a state after hot pressing of the non-contact IC card of the present invention. When the card base material laminated in the state of FIG. 1 is sandwiched between mirror plates and introduced into a press machine and heated and pressurized under the same conditions as a normal PVC card, the adhesive sheets 17 and 18 melt (partially). In the remaining state, the both sides of the polycarbonate sheet 111 and the PET sheet 112 sandwiching the IC chip 12 by penetrating into the mesh sheets 15 and 16 are bonded via the mesh sheet to form a completely integrated card base.
The PET sheet referred to in the present application refers to a sheet obtained by forming a resin polymerized from ordinary terephthalic acid and ethylene glycol, and usually refers to a sheet that is stretched and has semi-crystalline characteristics.
[0016]
FIG. 3 is a diagram showing a state in which an additional function is added to the non-contact IC card. The non-contact IC card of the present invention having the above-described substrate configuration is suitable for providing various additional functions. For example, the non-contact IC card of the present invention comprising a PET sheet and a polycarbonate sheet surface has higher heat resistance than a vinyl chloride base card and is not deformed even by retransfer printing. In particular, the polycarbonate sheet is suitable as a surface for retransferring the dye receiving layer by sublimation transfer, and a sublimation transfer image layer can be provided on the entire card surface by retransfer. When using a transparent polycarbonate sheet and providing a retransfer image, it is preferable to print in advance with white ink in order to conceal the base as described above.
[0017]
Further, a technique for providing a reversibly rewritable display layer (thermal rewrite layer) 30 on the PET sheet 112 has been established. In general, the display layer variably displays a transparent or cloudy state according to a thermal history, and therefore, in many cases, a printed or metal-deposited layer 31 is provided in the background for easy visual recognition. Therefore, when providing the said vapor deposition layer, after vapor-depositing on the PET sheet | seat surface, printing of the frame printing part 32 which forms the window of a display part is performed, and a thermal display layer is apply | coated after that. This vapor deposition layer is provided in advance before hot pressing as described above. Alternatively, a material on which such a thermal rewrite part is formed may be purchased and laminated on the card surface. As the rewrite method, a transparent / cloudy type or a leuco type can be used. In order to rewrite the display layer with a thermal head or the like, it is usual to further provide a protective layer for the display layer.
[0018]
Hereinafter, each material used will be described.
[Mesh sheet]
The mesh sheet to be laid is a material having high shear strength and flexibility that can be restored when bent, cushioning material, or the boundary between the card base and the rigid IC chip when bent under specified conditions. The material is preferably made of a material having sufficient elasticity to absorb the shear stress concentrated on the portion and diffuse the force. In particular, a material having high shear strength, flexibility, and elasticity is preferably used. Further, it is necessary to have an appropriate gap for allowing the molten resin to permeate. For example, it can be composed of a mesh sheet made of a mesh sheet as described below, a nonwoven fabric, or the like.
[0019]
Its is material, nylon (nylon 66, nylon 6, nylon 11, nylon 610, nylon 4, nylon 7, nylon 9, nylon 12), polyester, acrylic, vinylon, rayon, polypropylene, polyvinylidene chloride, polyethylene, polyurethane , Polystyrene, polyfluoroethylene (Teflon) synthetic fibers, cellulose, acetate, triacetate, ethylcellulose, semi-synthetic fibers of chlorinated rubber, hydrochloric acid rubber, natural fibers such as wool, face, silk, glass fibers or various A sheet having a hole in a plastic film can be used.
[0020]
Not by weaving machines there is a sheet formed into a cloth-like various manufacturing methods. For example, wet nonwoven fabrics in which fibers and paper are made by papermaking technology, chemical bond in which fiber webs are bonded with an adhesive, thermal bond dry nonwoven fabric in which heat is self-bonded, spunbond in which self-bonding is performed directly by spinning There is. As the fibers used in these, various natural or synthetic fibers can be used as in the case of the mesh sheet.
[0021]
〔adhesive〕
Conventionally known ones such as epoxy, urethane, acrylic, vinyl and amide can be used. A coating-type liquid adhesive may be used, but use of an adhesive sheet that can eliminate viscosity adjustment and solvent drying steps is preferable from the viewpoint of good workability and a uniform adhesive layer. The adhesive sheet preferably has a strong adhesive force easily obtained by hot pressing and does not protrude from the adhesive. A polyurethane-based or polyester-based hot-melt type can be used as an adhesive that can be adhered to a polycarbonate or PET sheet.
[0022]
【Example】
Example 1
An embodiment of the present invention will be described with reference to FIGS.
An IC chip 12 having a thickness of 120 μm was used, and a copper wire was wound around the antenna coil 14 into a size of 45 × 75 mm and formed into a planar shape for use. An antenna coil was connected to the IC chip, and the mesh sheets 15 and 16 were applied to both sides of the IC chip to be mounted by applying heat pressure. As the mesh sheet, a 0.10 mm thick nonwoven fabric made of PE / PET material was used.
[0023]
A hot melt adhesive sheet 18 having a thickness of 0.05 mm is laminated on one surface of the nonwoven fabric 16 on which the IC chip is mounted, and a polycarbonate sheet 111 (manufactured by Teijin Chemicals Ltd.) 111 having a thickness of 0.35 mm is further laminated. Temporary pasting was performed. Temporary pasting was carried out by pressing the ultrasonic sealer from the nonwoven fabric surface against the polycarbonate sheet surface to heat the substrate and partially melt the substrate to fix several places. Similarly, a PET sheet (“Lumirror” 112) having a thickness of 0.188 mm was laminated on the outer surface side of the nonwoven fabric 15 via an adhesive sheet 17 having a thickness of 0.05 mm. At this time, the total thickness of the laminated sheet was 0.838 mm. In addition, the white concealment printing was performed previously on the surface used as the card | curd outer surface of a polycarbonate sheet.
[0024]
Next, mirror plates were applied to both sides of the laminate, and the laminate was introduced into a press machine and laminated by applying hot pressure (140 ° C., 25 kgf / cm ² , 15 minutes). After pressing, the card had a smooth surface and the total thickness of the card substrate was 760 μm. The number of card impositions on the card base was 16 on 4 rows and 4 rows, and then punched to separate the individual cards.
The thermal rewrite display layer 30 was formed by coating the surface of the PET sheet with a recording material (“TCF-BC650-ML” manufactured by Ricoh Co., Ltd.) consisting of a vapor deposition layer, a rewritable display layer, and a protective layer.
A face photo was printed on the polycarbonate sheet surface of the card by a sublimation type retransfer printer (“CPX10000” manufactured by Dai Nippon Printing Co., Ltd.), but a good sublimation transfer image layer can be provided because the card has high heat resistance. did it.
[0025]
The following test was performed on the non-contact IC card after the heat pressing.
(1) The card is bent 250 times at a rate of 30 times per minute in the front direction and the back direction with a bending deflection amount of 2 cm in the card long side direction.
(2) The card is bent 250 times at a rate of 30 times / min.
As a result, the non-contact IC card of this example did not break or crack the card base in the IC chip embedded portion or other portions, and there was no change in appearance. In addition, communication with an external device was performed in a non-contact manner.
[0026]
【The invention's effect】
Since the non-contact IC card of the present invention has high heat resistance as described above, the face photo print by retransfer printing is excellent, and various functions such as a rewrite display unit can be easily added.
Since the non-contact IC card of the present invention having such characteristics can have the above additional functions, it can be used in various fields as a gate card and a point card such as a mileage card or as a gate management dedicated card. It becomes possible.
When a point card is used, a record is displayed on the rewrite display unit, and when the card is used as a gate management card, a face photo print for identifying a person can be performed to provide an ID function.
[Brief description of the drawings]
FIG. 1 is a diagram showing a non-contact IC card stacking process according to the present invention.
FIG. 2 is a view showing a state after hot pressing of the non-contact IC card of the present invention.
FIG. 3 is a diagram showing a state in which an additional function is added to a non-contact IC card.
FIG. 4 is a diagram illustrating a method of painting on a card by a thermal transfer printer.
FIG. 5 is a diagram showing a cross-sectional configuration of a conventional non-contact IC card using a vinyl chloride base material.
FIG. 6 is a diagram showing a cross-sectional configuration of a conventional non-contact IC card using a nonwoven fabric and a PET substrate.
[Explanation of symbols]
12 IC chip 14 Antenna coil 15, 16 Mesh sheet 17, 18 Adhesive sheet 22 IC chip 23 Adhesive 24 Antenna coil 25, 26 Non-woven fabric 30 Display layer 31 Deposition layer 32 Printing section 41 Card 42 Sublimation transfer ribbon 43 Thermal head 44 Intermediate Transfer medium 45 Platen roller 46 Heating roller 47 Pressure roller 111 Polycarbonate sheet 112 PET sheet 121, 122 IC chip bumps 221, 222 IC chip bumps 271, 272 PET sheet

Claims (1)

The antenna coil connected to the IC chip I C chips, on one side across the antenna coil, a polycarbonate sheet was laminated with the mesh sheet and the hot-melt adhesive sheet, the other side, the mesh sheet In a non-contact IC card in which a PET sheet is laminated and heat-sealed through a hot-melt adhesive sheet , and an IC chip is embedded in the card substrate, the card is printed on the outer surface of the polycarbonate sheet by a sublimation retransfer printer. A non-contact IC card characterized in that a pattern is provided to the full width, and a display portion comprising a metal vapor deposition layer, a thermal rewrite rewrite display layer, and a protective layer is provided in order on the outer surface of the PET sheet .

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