JP4753339B2 - Non-contact communication medium - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact communication medium that reads and writes data in a non-contact manner. More specifically, the present invention relates to an IC tag or an IC card that includes an IC module including an IC chip and a transmission / reception antenna coil. It relates to a method for preventing damage caused by the occurrence of damage.
[0002]
[Prior art]
In recent years, non-contact communication media that use electromagnetic waves to exchange signals with external devices have been used in various fields. This non-contact communication medium has an IC chip that functions as a data processing device and storage device, and an antenna coil that transmits and receives signals as its basic elements, and is sealed and formed on a base material in the shape of a card or sheet depending on the application. The product is finished.
[0003]
Conventionally, this type of communication medium is a plastic material such as polyvinyl chloride (hereinafter referred to as PVC) and polyethylene terephthalate (hereinafter referred to as PET) having a thickness of 0.6 to 0.9 mm and a length and width of about 86 × 54 mm. And a card-like base material combined with hot melt or thermosetting adhesive, or a paper base material such as synthetic paper coated with an adhesive. It has been used as a medium having a certain degree of strength against tensile and bending deformation.
[0004]
In recent years, with the diversification of applications of non-contact communication media, the demand for product tags has increased, the diversification of the shape of IC modules themselves, the miniaturization of tags, and the use conditions. User demands such as improvement of strength against bending deformation have been diversified. However, in the above-described conventional technology, it is not always possible to meet these new requirements.
[0005]
In particular, the problem is the molding of IC modules with a thickness of 1 mm or more, and there are increasing applications in which the medium after molding is used after being attached to a curved surface. In the structure by a hard material, since it is lacking in flexibility and rigidity is too high, when it tried to attach forcibly, it might lead to a fracture | rupture.
[0006]
In order to overcome this, a paper base material may be used. In this case, the shape of the IC module composed of a plurality of chip-shaped surface mounting components such as an IC chip and a chip capacitor is formed on the surface. It is very difficult to protrude and form smoothly. In addition, it is relatively easily broken by repeated bending.
[0007]
Even if further downsizing is required, there are a number of problems such as the need for a bonding margin of at least 2 mm in the peripheral portion of the substrate IC module, and the above-described conventional configuration obtains a desired shape. This is an extremely difficult situation.
[0008]
[Problems to be solved by the invention]
Therefore, the technical problem to be solved by the present invention is to solve the above-mentioned conventional problems and provide a non-contact communication medium having sufficient strength against bending deformation.
[0009]
[Means for Solving the Problems]
In the present invention, an elastic body is arranged around the IC module, the Shore hardness of the elastic body to be used is limited, and the bending stress applied to the non-contact communication medium is absorbed by the elastic body, whereby the strength against bending deformation is achieved. It was made as a result of examining improvement.
[0010]
That is, the present invention is the same shape in the contactless communication medium provided with the IC module, and a rectangular plate-like primary molded body encapsulating the IC module therein, and the primary molded body having an IC chip and transceiver antenna coil in a plate-like elastic body provided space for accommodating the primary molded body inside, the elastic body is made to surround the periphery of the length and width direction of the primary molded body, without low some and also is a non-contact communication medium according to claim der Rukoto Shore hardness of 80 or less.
[0013]
Further, the present invention provides a non-contact communication medium of the, the elastic body is a non-contact communication medium, characterized by comprising a woven fabric.
[0014]
Moreover, this invention is a non-contact communication medium characterized by the said elastic body consisting of a nonwoven fabric in the said non-contact communication medium.
[0015]
According to the present invention, in the non-contact communication medium, the elastic body is made of an elastomer.
[0016]
The present invention is the non-contact communication medium according to the non-contact communication medium, wherein the elastic body is made of a hot-melt adhesive having a melting point of 80 to 200 ° C.
[0017]
The present invention is the non-contact communication medium, wherein the elastic body is a hot-melt adhesive mainly composed of a polyester polymer.
[0018]
In the non-contact communication medium according to the present invention, the elastic body includes at least one selected from a woven fabric, a nonwoven fabric, an elastomer, and a hot melt adhesive having a melting point of 80 to 200 ° C. It is a non-contact communication medium.
[0019]
[Action]
In the present invention, as described above, an elastic body having a Shore hardness of 80 or less is disposed as a cushioning material in the vicinity of the IC module. Become. The reason why the Shore hardness is limited to 80 or less is that an elastic body having a Shore hardness of more than this does not function sufficiently as a buffer material.
[0020]
The material of the elastic body to be used is not basically limited as long as it can be obtained with a Shore hardness of 80 or less. For example, various woven fabrics, non-woven fabrics, elastomers, hot melt adhesives, etc. Can be used. However, when a hot melt adhesive is used, it is poured into the vicinity of the IC module while being plasticized by heating. If the temperature at which plasticization is possible is excessively high, peripheral members such as a substrate may be damaged. There is a possibility, and it is necessary to limit its melting point to 80-200 ° C. The reason why the limiting condition of 80 ° C. or higher is added is that a hot-melt adhesive having a low melting point generally has a low average molecular weight and a concomitant reduction in mechanical strength.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be specifically described with reference to the drawings.
[0022]
FIG. 1 is a diagram showing an example of an IC tag according to the present invention. The dimensions are 2 mm in thickness, 60 mm in length, and 12 mm in width. FIG. 1A is a side view of a secondary molded body as a finished product, FIG. 1B is a combination configuration diagram of each component, and FIG. 1C is a front view of an elastic body. In FIG. 1, 100 is a completed product of a non-contact communication medium, 101 is an elastic body, 102 is a cover sheet, 200 is a primary molded body, and an IC module is disposed therein.
[0023]
In this example, a felt obtained by compression-molding wool fibers is used as the elastic body 101, and as shown in FIG. 1 (c), the primary molded body 200 can be accommodated therein. A space portion 103 adapted to the shape is provided. Moreover, as the cover sheet, a PET film having a thickness of 0.25 mm is used, and a hot melt adhesive is applied to the side facing the elastic body 101 and the primary molded body 200 in FIG. Has been.
[0024]
2 is a diagram showing an internal configuration of the primary molded body 200 in FIG. 1, FIG. 2 (a) is a front view, and FIG. 2 (b) is a side view. In FIG. 2, reference numeral 201 denotes a substrate made of a polyimide film. On the substrate 201, an IC bare chip 202 and a chip capacitor 203 sealed with an epoxy resin are placed. An antenna coil 204 constitutes an IC module together with the IC bare chip 202 and the chip capacitor 203. The IC module is sealed with a base substrate 205 made of PET to form a primary molded body.
[0025]
The members are arranged as shown in FIG. 1 (b), hot pressed from above and below, and laminated to obtain a secondary molded body, that is, a finished product 100 of an IC tag.
[0026]
The strength against bending deformation was evaluated by repeating the operation of winding the IC tag thus produced around a cylinder having a diameter of 100 mm. As a result, no damage was observed. For comparison, PET was used as an alternative to the elastic body 101 and the same evaluation was performed. As a result, 23% of the IC tag used for the evaluation showed damage such as peeling on the adhesive surface.
[0027]
In addition, although the example which has arrange | positioned the elastic body to the four periphery to the primary molded object 200 was shown here, even if it is a structure which surrounds the whole primary molded object with an elastic body, the effect more than equivalent to the said example is acquired. , Do not hesitate. Further, it was confirmed that the same result as in the above example was obtained even when the elastic body was disposed only in the vicinity of the primary molded body, that is, the longest side of the IC module.
[0028]
Furthermore, in the above example, felt was used as the elastic body, but as an elastic body having equivalent Shore hardness, styrene-butadiene rubber, polyester fiber woven fabric, ethylene-vinyl acetate copolymer and aliphatic series The same effect was obtained when a hot melt adhesive in which petroleum resin was mixed at a weight ratio of 1: 1 and a hot melt adhesive in which polyester was modified were used.
[0029]
【The invention's effect】
As described above, according to the present invention, by disposing the elastic body in the vicinity of the IC module, it is possible to improve the strength against bending deformation of the non-contact communication medium, and it is possible to ensure reliability. . In addition, although the example applied to IC tag was shown in embodiment, of course, it can apply also to an ID card and a prepaid card.
[Brief description of the drawings]
1A and 1B are diagrams illustrating an example of an IC tag according to the present invention, in which FIG. 1A is a side view of a secondary molded body that is a finished product, FIG. 1B is a combination configuration diagram of components, and FIG. (C) is a front view of an elastic body.
2A and 2B are diagrams showing an internal configuration of a primary molded body, in which FIG. 2A is a front view and FIG. 2B is a side view.
[Explanation of symbols]
100 Finished product of IC tag 101 Elastic body 102 Cover sheet 103 Space 200 Primary molded body 201 Substrate 202 IC bare chip 203 Chip capacitor 204 Antenna coil 205 Base substrate

Claims (7)

The non-contact communication medium provided with the IC module having an IC chip and transceiver antenna coil, a rectangular plate-like primary molded body encapsulating the IC module therein, the primary molded body in the same shape as the primary molded body and a housing to space the plate-shaped elastic body provided inside the elastic body, the result surrounds the periphery of the length and width direction of the primary molded body, some even without small, Shore noncontact communication medium, characterized in der Rukoto hardness of 80 or less. The non-contact communication medium according to claim 1, wherein the elastic body is non-contact communication medium, characterized in that it consists of a woven fabric. The contactless communication medium according to claim 1 , wherein the elastic body is made of a nonwoven fabric. The non-contact communication medium according to claim 1 , wherein the elastic body is made of an elastomer. 2. The non-contact communication medium according to claim 1 , wherein the elastic body is made of a hot-melt adhesive having a melting point of 80 to 200 ° C. 3. 2. The non-contact communication medium according to claim 1 , wherein the elastic body includes at least one selected from a woven fabric, a non-woven fabric, an elastomer, and a hot-melt adhesive having a melting point of 80 to 200 ° C. 3. Communication medium. 7. The non-contact communication medium according to claim 5 , wherein the elastic body is a hot-melt adhesive mainly composed of a polyester-based polymer.

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