JP2003108964A - Non-contact communication medium - Google Patents
Non-contact communication mediumInfo
- Publication number
- JP2003108964A JP2003108964A JP2001302730A JP2001302730A JP2003108964A JP 2003108964 A JP2003108964 A JP 2003108964A JP 2001302730 A JP2001302730 A JP 2001302730A JP 2001302730 A JP2001302730 A JP 2001302730A JP 2003108964 A JP2003108964 A JP 2003108964A
- Authority
- JP
- Japan
- Prior art keywords
- elastic body
- communication medium
- contact communication
- module
- medium according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
- G06K19/027—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、非接触でデータの
読み出しや書き込みを行う非接触通信媒体に関するもの
であり、より具体的にはICチップと送受信アンテナコ
イルからなるICモジュールを具備したICタグやIC
カードに、曲げ変形を生じた際の損傷を防止する方法に
関わるものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactless communication medium for reading and writing data in a contactless manner, and more specifically to an IC tag equipped with an IC module including an IC chip and a transmitting / receiving antenna coil. And IC
The present invention relates to a method of preventing damage when a card is bent and deformed.
【0002】[0002]
【従来の技術】近年、外部装置との信号交換を、電磁波
を利用して行なう非接触通信媒体が、種々の分野で使用
されている。この非接触通信媒体は、データの処理装置
や記憶装置として機能するICチップと、信号の送受信
を行なうアンテナコイルを基本要素とし、用途に応じて
カードやシートの形状の基材に封止成形されて製品に仕
上げられている。2. Description of the Related Art In recent years, non-contact communication media for exchanging signals with external devices using electromagnetic waves have been used in various fields. This non-contact communication medium has an IC chip that functions as a data processing device and a storage device and an antenna coil that transmits and receives signals as basic elements, and is molded by encapsulation on a base material in the form of a card or a sheet depending on the application. Finished into a product.
【0003】そして、従来、この種の通信媒体は、厚み
0.6〜0.9mm、縦横86×54mm前後のポリ塩化
ビニル(以下、PVCと記す)やポリエチレンテレフタ
レート(以下、PETと記す)などのプラスチック材料
と、ホットメルトあるいは熱硬化型接着剤などを組み合
わせたカード状基材や、粘着剤を塗布した合成紙などの
紙基材の貼り合わせたものが主であり、内部にICモジ
ュールを配置して構成され、引張りや曲げ変形に対し
て、ある程度の強度を有する媒体して使用されてきた。Conventionally, this type of communication medium has a thickness of 0.6 to 0.9 mm and a length and width of about 86 × 54 mm, such as polyvinyl chloride (hereinafter referred to as PVC) and polyethylene terephthalate (hereinafter referred to as PET). Mostly, a card-like base material that is a combination of the above-mentioned plastic material and hot melt or thermosetting adhesive, or a paper base material such as synthetic paper coated with an adhesive is stuck together. It has been arranged and configured, and has been used as a medium having a certain strength against tensile and bending deformations.
【0004】昨今、非接触通信媒体の用途多様化に伴
い、商品タグとしての市場の要望が増加し、ICモジュ
ール自体の形状の多様化や、タグとしたときの小型化、
さらには使用条件に合わせての曲げ変形に対する強度の
向上など、ユーザーの要求も多様になってきている。し
かしながら、上記の従来技術では、必ずしもこれらの新
しい要求に対し、応じきれなくなりつつあるのが実状で
ある。Recently, as the use of non-contact communication media has been diversified, the market demand as a product tag has increased, the shape of the IC module itself has been diversified, and the size of the tag has been reduced.
Furthermore, user demands such as improvement of strength against bending deformation according to usage conditions are becoming more diverse. However, in the above-mentioned conventional technology, the fact is that it is not always possible to meet these new requirements.
【0005】特に、問題なのが、厚みが1mm以上のI
Cモジュールの成形であり、成形後の媒体が曲面に貼り
付けて使用されるような用途が増えており、このような
場合に関しては、従来のような硬質の材料による構成で
は、可撓性に乏しく剛性が高過ぎるため、無理に貼り付
けようとすると、破断に至ってしまうことがあった。Particularly, there is a problem in that I having a thickness of 1 mm or more is used.
In the case of C module molding, there is an increasing number of applications in which the medium after molding is used by pasting it on a curved surface. In such a case, the conventional hard material configuration provides flexibility. Since it was scarce and had too high rigidity, if it was forcibly pasted, it sometimes broke.
【0006】また、これを克服するために紙基材を用い
ることがあるが、この場合には、ICチップやチップコ
ンデンサなど、チップ形状の複数の表面実装部品で構成
されるICモジュールの形状が、表面に浮き出して、平
滑に成形することが極めて困難である。その上、曲げの
繰り返しによって比較的容易に破断してしまう。In order to overcome this, a paper base material is sometimes used. In this case, the shape of an IC module composed of a plurality of chip-shaped surface-mounted components such as IC chips and chip capacitors is , It is extremely difficult to emboss on the surface and mold it smoothly. Moreover, repeated bending makes it relatively easy to break.
【0007】そして、さらに小型化を求められても、基
材のICモジュールの周辺部分に、少なくとも2mm以
上の接着代が必要となるなど、数々の問題があり、上記
従来の構成では、所望の形状を得ることが極めて困難な
状況である。Even if further miniaturization is demanded, there are various problems such as the need for a bonding margin of at least 2 mm or more around the IC module of the base material. It is a very difficult situation to obtain the shape.
【0008】[0008]
【発明が解決しようとする課題】従って、本発明が解決
しようとする技術的な課題は、上記の従来の問題点を解
決し、曲げ変形に対して、十分な強度を具備した非接触
通信媒体を提供することである。Therefore, the technical problem to be solved by the present invention is to solve the above-mentioned conventional problems and to provide a non-contact communication medium having sufficient strength against bending deformation. Is to provide.
【0009】[0009]
【課題を解決するための手段】本発明は、ICモジュー
ルの周囲に弾性体を配置するとともに、用いる弾性体の
ショア硬度を限定し、非接触通信媒体に加わった曲げ応
力を、前記弾性体に吸収させることにより、曲げ変形に
対する強度を向上することを検討した結果、なされたも
のである。According to the present invention, an elastic body is arranged around an IC module, the Shore hardness of the elastic body used is limited, and the bending stress applied to a non-contact communication medium is applied to the elastic body. It was made as a result of studying to improve the strength against bending deformation by absorbing.
【0010】即ち、本発明は、ICチップと送受信アン
テナコイルを有するICモジュールを具備した非接触通
信媒体において、前記ICモジュールを封止成形する基
材の少なくとも一部が、ショア硬度80以下の弾性体か
らなることを特徴とする非接触通信媒体である。That is, according to the present invention, in a non-contact communication medium provided with an IC module having an IC chip and a transmitting / receiving antenna coil, at least a part of a base material for molding the IC module is elastic with a Shore hardness of 80 or less. It is a non-contact communication medium characterized by comprising a body.
【0011】また、本発明は、前記の非接触通信媒体に
おいて、前記弾性体が、前記ICモジュールの周囲を包
囲してなることを特徴とする非接触通信媒体である。Further, the present invention is the non-contact communication medium as described above, wherein the elastic body surrounds the periphery of the IC module.
【0012】また、本発明は、前記の非接触通信媒体に
おいて、前記弾性体の少なくとも一部が、前記ICモジ
ュールの最長辺の近傍に配置されてなることを特徴とす
る非接触通信媒体である。Further, according to the present invention, in the non-contact communication medium, at least a part of the elastic body is arranged near a longest side of the IC module. .
【0013】また、本発明は、前記の非接触通信媒体に
おいて、前記弾性体が、織布と空隙により構成されてな
ることを特徴とする非接触通信媒体である。Further, the present invention is the non-contact communication medium as described above, wherein the elastic body is composed of a woven cloth and a void.
【0014】また、本発明は、前記の非接触通信媒体に
おいて、前記弾性体が、不織布からなることを特徴とす
る非接触通信媒体である。Further, the present invention is the non-contact communication medium as described above, wherein the elastic body is made of a non-woven fabric.
【0015】また、本発明は、前記の非接触通信媒体に
おいて、前記弾性体が、エラストマーからなることを特
徴とする非接触通信媒体である。The present invention is also the non-contact communication medium as described above, wherein the elastic body is made of an elastomer.
【0016】また、本発明は、前記の非接触通信媒体に
おいて、前記弾性体が、融点が80〜200℃のホット
メルト接着剤からなることを特徴とする非接触通信媒体
である。The present invention is also the non-contact communication medium as described above, wherein the elastic body is made of a hot melt adhesive having a melting point of 80 to 200 ° C.
【0017】また、本発明は、前記の非接触通信媒体に
おいて、前記弾性体が、ポリエステル系高分子を主成分
とするホットメルト接着剤であることを特徴とする非接
触通信媒体である。The present invention is also the non-contact communication medium as described above, wherein the elastic body is a hot melt adhesive containing a polyester polymer as a main component.
【0018】また、本発明は、前記の非接触通信媒体に
おいて、前記弾性体が、織布、不織布、エラストマー、
融点が80〜200℃のホットメルト接着剤から選ばれ
る少なくとも1種を含むことを特徴とする非接触通信媒
体である。In the noncontact communication medium according to the present invention, the elastic body is a woven fabric, a non-woven fabric, an elastomer,
A non-contact communication medium comprising at least one selected from hot-melt adhesives having a melting point of 80 to 200 ° C.
【0019】[0019]
【作用】本発明においては、前記のようにICモジュー
ルの近傍に、ショア硬度80以下の弾性体を緩衝材とし
て配置するので、非接触通信媒体に曲げ変形が加わって
も、破壊に至ることが、極めて少なくなる。ショア硬度
を80以下に限定したのは、これ以上のショア硬度の弾
性体では、緩衝材として十分に機能しないからである。In the present invention, as described above, an elastic body having a Shore hardness of 80 or less is arranged as a cushioning material near the IC module, so that even if bending is applied to the non-contact communication medium, it may be destroyed. , Very few. The shore hardness is limited to 80 or less because an elastic body having a shore hardness higher than this does not sufficiently function as a cushioning material.
【0020】また、用いる弾性体の材質は、80以下の
ショア硬度で得られるものであれば、基本的に限定され
るものではなく、例えば、各種の、織布、不織布、エラ
ストマー、ホットメルト接着剤などが使用できる。ただ
し、ホットメルト接着剤を用いる場合は、加熱して可塑
化した状態で、ICモジュール近傍に流し込むことにな
るので、可塑化し得る温度が過度に高いと、基材などの
周辺の部材を損傷する可能性があり、その融点を80〜
200℃に限定する必要がある。なお、80℃以上とい
う限定条件を加えたのは、一般に融点の低いホットメル
ト接着剤は、平均分子量が低く、それに付随して機械的
な強度も低くなるからである。The material of the elastic body to be used is not basically limited as long as it can be obtained with a Shore hardness of 80 or less. For example, various kinds of woven cloth, non-woven cloth, elastomer, hot melt adhesive are used. Agents can be used. However, when a hot-melt adhesive is used, it is poured into the vicinity of the IC module while being heated and plasticized. Therefore, if the temperature at which it can be plasticized is excessively high, peripheral members such as the base material will be damaged. Possibly, its melting point is 80 ~
It must be limited to 200 ° C. The limiting condition of 80 ° C. or higher is added because, in general, a hot-melt adhesive having a low melting point has a low average molecular weight and accompanying it also has a low mechanical strength.
【0021】[0021]
【発明の実施の形態】次に、本発明の実施の形態につい
て、図を参照して具体的に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be specifically described with reference to the drawings.
【0022】図1は、本発明によるICタグの一例を示
す図で、寸法は、厚さが2mm、長さが60mm、幅が
12mmである。図1(a)は完成品である二次成形体
の側面図、図1(b)は、各部品の組み合わせ構成図、
図1(c)は弾性体の正面図である。図1において、1
00は非接触通信媒体の完成品、101は弾性体、10
2はカバーシート、200は一次成形体で、内部にIC
モジュールが配置されている。FIG. 1 is a view showing an example of an IC tag according to the present invention. The dimensions are 2 mm in thickness, 60 mm in length and 12 mm in width. FIG. 1A is a side view of a secondary molded body that is a finished product, and FIG. 1B is a combined configuration diagram of each component.
FIG. 1C is a front view of the elastic body. In FIG. 1, 1
00 is a completed non-contact communication medium, 101 is an elastic body, 10
2 is a cover sheet, 200 is a primary molded body, and an IC inside
The module is placed.
【0023】本例においては、弾性体101として、羊
毛繊維を圧縮成形したフェルトが用いられていて、図1
(c)に示したように、内部に一次成形体200が収納
できるように、一次成形体の形状に適合した空間部10
3が設けられている。また、カバーシートとしては、厚
さが0.25mmのPETフィルムが用いられていて、
図1(b)における弾性体101と一次成形体200に
対向する側には、ホットメルト接着剤が塗付されてい
る。In this example, a felt obtained by compression-molding wool fibers is used as the elastic body 101.
As shown in (c), the space portion 10 adapted to the shape of the primary molded body so that the primary molded body 200 can be housed therein.
3 is provided. As the cover sheet, a PET film having a thickness of 0.25 mm is used.
A hot melt adhesive is applied to the side facing the elastic body 101 and the primary molded body 200 in FIG. 1B.
【0024】また、図2は、図1における一次成形体2
00の内部構成を示す図であり、図2(a)は正面図、
図2(b)は側面図である。図2において、201は基
板であり、ポリイミドのフィルムからなっている。基板
201の上には、エポキシ樹脂で封止されたICベアチ
ップ202、チップコンデンサ203が載置されてい
る。204はアンテナコイルであり、ICベアチップ2
02とチップコンデンサ203とともにICモジュール
を構成している。ICモジュールは、PETからなるベ
ース基材205により封止され、一次成形体を構成して
いる。FIG. 2 shows the primary molded body 2 in FIG.
00 is a view showing the internal structure of FIG. 00, FIG.
FIG. 2B is a side view. In FIG. 2, 201 is a substrate, which is made of a polyimide film. On the substrate 201, an IC bare chip 202 and a chip capacitor 203, which are sealed with epoxy resin, are placed. Reference numeral 204 denotes an antenna coil, which is the IC bare chip 2
02 and the chip capacitor 203 constitute an IC module. The IC module is sealed by a base substrate 205 made of PET to form a primary molded body.
【0025】そして、前記の各部材は、図1(b)に示
したように配置し、上下方向から熱プレスを行ない、積
層して二次成形体、即ち、ICタグの完成品100を得
る。Then, the above-mentioned members are arranged as shown in FIG. 1 (b), subjected to heat pressing from above and below, and laminated to obtain a secondary molded body, that is, a finished product 100 of the IC tag. .
【0026】このようにして作製したICタグを、直径
100mmの円筒に巻き付けるという操作を繰り返すこ
とで、曲げ変形に対する強度を評価した。その結果、何
ら損傷が認められなかった。比較のため、弾性体101
の代替にPETを用いたもので、同様の評価を行なった
ところ、評価に用いたICタグの23%に、接着面での
剥離などの損傷が見られた。The strength against bending deformation was evaluated by repeating the operation of winding the IC tag thus produced around a cylinder having a diameter of 100 mm. As a result, no damage was observed. For comparison, the elastic body 101
When PET was used instead of the above, the same evaluation was performed. As a result, 23% of the IC tags used for evaluation showed damage such as peeling on the adhesive surface.
【0027】なお、ここでは、一次成形体200に四周
に弾性体を配置した例を示したが、弾性体で一次成形体
全体を包囲する構造としても、前記の例と同等以上の効
果が得られることは、論を俟たない。また、弾性体を一
次成形体、即ち、ICモジュールの最長辺近傍にのみ配
置しても、前記の例と同様の結果が得られることが確認
できた。Here, an example is shown in which the elastic body is arranged on the four circumferences of the primary molded body 200. However, even if the elastic body surrounds the entire primary molded body, an effect equal to or more than that of the above example can be obtained. What is said is indisputable. It was also confirmed that the same results as in the above example were obtained even when the elastic body was arranged only in the vicinity of the longest side of the primary molded body, that is, the IC module.
【0028】さらに、前記に例では、弾性体としてフェ
ルトを用いたが、同等のショア硬度を具備した弾性体と
して、スチレン−ブタジエンゴム、ポリエステル繊維の
織布、エチレン−酢酸ビニル共重合体と脂肪族系の石油
樹脂を重量比で1:1で混合したホットメルト接着剤、
ポリエステルを変性したホットメルト接着剤を用いた場
合も、同様の効果が得られた。Further, although felt is used as the elastic body in the above-mentioned examples, as the elastic body having the equivalent Shore hardness, styrene-butadiene rubber, woven polyester fiber cloth, ethylene-vinyl acetate copolymer and fat are used. Hot-melt adhesive containing 1: 1 weight ratio of group petroleum resin,
Similar effects were obtained when a hot-melt adhesive modified with polyester was used.
【0029】[0029]
【発明の効果】以上に説明したように、本発明によれ
ば、ICモジュールの近傍に弾性体を配置することで、
非接触通信媒体の曲げ変形に対する強度を向上すること
が可能となり、信頼を確保することができる。なお、実
施の形態には、ICタグに応用した例を示したが、ID
カード、プリペイドカードにも適用し得るのは勿論であ
る。As described above, according to the present invention, by disposing the elastic body in the vicinity of the IC module,
It is possible to improve the strength of the non-contact communication medium against bending deformation, and it is possible to secure reliability. In addition, although an example of application to an IC tag has been shown in the embodiment,
Of course, it can be applied to cards and prepaid cards.
【図1】本発明によるICタグの一例を示す図で、図1
(a)は完成品である二次成形体の側面図、図1(b)
は、各部品の組み合わせ構成図、図1(c)は弾性体の
正面図。1 is a diagram showing an example of an IC tag according to the present invention, and FIG.
FIG. 1A is a side view of a secondary molded product that is a finished product, FIG. 1B.
Is a configuration diagram of a combination of the respective parts, and FIG. 1C is a front view of the elastic body.
【図2】一次成形体の内部構成を示す図であり、図2
(a)は正面図、図2(b)は側面図。FIG. 2 is a diagram showing an internal structure of a primary molded body, and FIG.
2A is a front view, and FIG. 2B is a side view.
100 ICタグの完成品 101 弾性体 102 カバーシート 103 空間部 200 一次成形体 201 基板 202 ICベアチップ 203 チップコンデンサ 204 アンテナコイル 205 ベース基材 100 finished product of IC tag 101 elastic body 102 cover sheet 103 space 200 Primary molding 201 substrate 202 IC bare chip 203 Chip capacitor 204 antenna coil 205 Base material
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Claims (9)
するICモジュールを具備した非接触通信媒体におい
て、前記ICモジュールを封止成形する基材の少なくと
も一部は、ショア硬度80以下の弾性体からなることを
特徴とする非接触通信媒体。1. In a non-contact communication medium including an IC module having an IC chip and a transmitting / receiving antenna coil, at least a part of a base material for molding the IC module is made of an elastic body having a Shore hardness of 80 or less. A non-contact communication medium characterized by.
て、前記弾性体は、前記ICモジュールの周囲を包囲し
てなることを特徴とする非接触通信媒体。2. The non-contact communication medium according to claim 1, wherein the elastic body surrounds the periphery of the IC module.
て、前記弾性体の少なくとも一部は、前記ICモジュー
ルの最長辺の近傍に配置されてなることを特徴とする非
接触通信媒体。3. The non-contact communication medium according to claim 1, wherein at least a part of the elastic body is arranged near a longest side of the IC module.
載の非接触通信媒体において、前記弾性体は、織布と空
隙により構成されてなることを特徴とする非接触通信媒
体。4. The non-contact communication medium according to claim 1, wherein the elastic body includes a woven fabric and a void.
載の非接触通信媒体において、前記弾性体は、不織布か
らなることを特徴とする非接触通信媒体。5. The non-contact communication medium according to claim 1, wherein the elastic body is made of a non-woven fabric.
載の非接触通信媒体において、前記弾性体は、エラスト
マーからなることを特徴とする非接触通信媒体。6. The non-contact communication medium according to claim 1, wherein the elastic body is made of an elastomer.
載の非接触通信媒体において、前記弾性体は、融点が8
0〜200℃のホットメルト接着剤からなることを特徴
とする非接触通信媒体。7. The non-contact communication medium according to claim 1, wherein the elastic body has a melting point of 8
A non-contact communication medium comprising a hot-melt adhesive at 0 to 200 ° C.
て、前記弾性体は、ポリエステル系高分子を主成分とす
るホットメルト接着剤であることを特徴とする非接触通
信媒体。8. The non-contact communication medium according to claim 7, wherein the elastic body is a hot melt adhesive containing a polyester polymer as a main component.
載の非接触通信媒体において、前記弾性体は、織布、不
織布、エラストマー、融点が80〜200℃のホットメ
ルト接着剤から選ばれる少なくとも1種を含むことを特
徴とする非接触通信媒体。9. The non-contact communication medium according to claim 1, wherein the elastic body is selected from a woven fabric, a non-woven fabric, an elastomer, and a hot melt adhesive having a melting point of 80 to 200 ° C. A contactless communication medium comprising at least one kind.
Priority Applications (1)
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JP2001302730A JP4753339B2 (en) | 2001-09-28 | 2001-09-28 | Non-contact communication medium |
Applications Claiming Priority (1)
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JP2001302730A JP4753339B2 (en) | 2001-09-28 | 2001-09-28 | Non-contact communication medium |
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JP2003108964A true JP2003108964A (en) | 2003-04-11 |
JP4753339B2 JP4753339B2 (en) | 2011-08-24 |
Family
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JP2001302730A Expired - Fee Related JP4753339B2 (en) | 2001-09-28 | 2001-09-28 | Non-contact communication medium |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7789316B2 (en) | 2007-03-23 | 2010-09-07 | Fujitsu Limited | Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device |
US7960215B2 (en) | 2007-03-23 | 2011-06-14 | Fujitsu Limited | Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device |
US7982295B2 (en) | 2007-03-23 | 2011-07-19 | Fujitsu Limited | Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device |
EP2760045A1 (en) * | 2013-01-28 | 2014-07-30 | ASTRA Gesellschaft für Asset Management mbH & Co. KG | Elastomer product |
Citations (4)
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JPH1070215A (en) * | 1996-08-28 | 1998-03-10 | Sakai Composite Kk | Sealing frame for protecting integrated circuit chip |
JP2000036024A (en) * | 1998-07-17 | 2000-02-02 | Mitsubishi Plastics Ind Ltd | Laminate sheet for non-contact type ic card |
JP2000085283A (en) * | 1998-09-16 | 2000-03-28 | Dainippon Printing Co Ltd | Noncontact ic card and its manufacture |
JP2001237351A (en) * | 2000-02-22 | 2001-08-31 | Hitachi Maxell Ltd | Semiconductor device |
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2001
- 2001-09-28 JP JP2001302730A patent/JP4753339B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH1070215A (en) * | 1996-08-28 | 1998-03-10 | Sakai Composite Kk | Sealing frame for protecting integrated circuit chip |
JP2000036024A (en) * | 1998-07-17 | 2000-02-02 | Mitsubishi Plastics Ind Ltd | Laminate sheet for non-contact type ic card |
JP2000085283A (en) * | 1998-09-16 | 2000-03-28 | Dainippon Printing Co Ltd | Noncontact ic card and its manufacture |
JP2001237351A (en) * | 2000-02-22 | 2001-08-31 | Hitachi Maxell Ltd | Semiconductor device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7789316B2 (en) | 2007-03-23 | 2010-09-07 | Fujitsu Limited | Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device |
US7960215B2 (en) | 2007-03-23 | 2011-06-14 | Fujitsu Limited | Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device |
US7982295B2 (en) | 2007-03-23 | 2011-07-19 | Fujitsu Limited | Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device |
EP2760045A1 (en) * | 2013-01-28 | 2014-07-30 | ASTRA Gesellschaft für Asset Management mbH & Co. KG | Elastomer product |
Also Published As
Publication number | Publication date |
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JP4753339B2 (en) | 2011-08-24 |
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