JP2001126044A - Flexible ic module, its manufacturing method and manufacturing method of information carrier using flexible ic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flexible IC module which can be used for manufacturing a non-contact IC card, and to provide its manufacture method and also the manufacture method of an information carrier using the flexible IC module. SOLUTION: An IC chip 1 and a non-contact transmission coil 2 which is directly connected to the input/output terminal of the IC chip 1 are thermo- compression-bonded on a thermo-compression bonding synthetic resin sheet 3A. A hot pressing method or a roller pressing method can be applied as the manufacture method. In the manufacture of an information carrier, a cover sheet is thermo-compression-bonded on the surface/rear face of the flexible IC module. Non-woven fabric 3B formed of crystalline resin fiber including non-crystal copolymerized polyester can be used partially instead of the thermo- compression bonding synthetic resin sheet 3A.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible IC module serving as an information carrier such as a non-contact type IC card, a method of manufacturing the flexible IC module,
And a method for manufacturing an information carrier using the flexible IC module.

[0002]

2. Description of the Related Art Non-contact information carriers such as non-contact IC cards are being considered for use as substitutes for commuter passes, driver's licenses, telephone cards, cash cards, etc., and are expected to be used in large quantities. However, how to simplify the manufacturing process and reduce the unit price is one of the most important technical issues.

Conventionally, as a method of manufacturing a non-contact type IC card, a cutout hole is opened in a reinforcing member made of glass fiber or the like, and an IC chip and a non-contact signal transmission means as a non-contact signal transmission means are formed in the cutout hole. The transmission coil is housed, and then the inside of the cutout hole is sealed with resin to form a base, and finally, a cover sheet is attached to the front and back surfaces of the base to obtain a required non-contact IC card. Methods are known.

According to this method, by adjusting the size of the cutout hole to an appropriate size in accordance with the size of the coil, it is possible to manufacture a non-contact type IC card in which the setting position of the coil with respect to the base is accurately regulated. Therefore, it is possible to efficiently receive power and transmit and receive signals to and from the external device.

As another manufacturing method, for example, NIKKEI
As described in MECHANICAL 1997.1.6 no.497, pages 16 to 17, etc., a first resin sheet to which an IC chip and a non-contact transmission coil which is non-contact data transmission means are bonded. The second resin sheet having no IC chip and no coil is attached to the opposed portion of the fixed mold and the movable mold of the injection molding machine, respectively. Second resin sheet and IC
There has been proposed a method of obtaining a non-contact type IC card in which a chip and a non-contact transmission coil are integrated with a filling resin.

According to this method, a non-contact IC card having a resin sheet (cover sheet) attached to the front and back surfaces can be obtained by injection molding, so that the IC chip and the non-contact transmission coil are embedded. The non-contact type IC card can be manufactured more efficiently and the manufacturing cost can be reduced as compared with a conventional manufacturing method in which a cover sheet is bonded to the front and back surfaces of the base after curing the base. it can.

[0007] On the other hand, I
Regarding the connection method between C chip and coil for non-contact transmission,
Generally, a method of mounting an IC chip on a wiring board and connecting a non-contact transmission coil to an electrode terminal formed on the wiring board has been adopted.

[0008] Since this method has been established technically in the past, it is possible to connect the IC chip and the wiring board and the wiring board and the non-contact transmission coil with high reliability.

[0009]

However, the former method of manufacturing a conventional non-contact type IC card described above involves storing an IC chip and a coil in a cutout hole opened in a reinforcing member, and removing the inside and outside of the cutout hole. Since the resin is cured with resin, the strength inside the cutout hole without the reinforcing body is low, and when subjected to an improper external force such as bending, stress is concentrated inside the cutout hole and the base is easily broken. .

Further, after the IC chip and the coil are accurately set in the reinforcing member having the required cutout holes, the resin sealing in the cutout holes and the impregnation and curing of the resin into the reinforcing member must be performed. So the manufacturing process becomes complicated,
There is also a problem that it is difficult to manufacture an inexpensive information carrier. In particular, when producing various non-contact type IC cards on the same line, it is not necessary to prepare various reinforcements having different cutout holes according to the size of the IC chip and the non-contact transmission coil to be stored. Therefore, the production process is further complicated, and the manufacturing cost of the non-contact type IC card is high.

On the other hand, the latter of the above-mentioned conventional non-contact type IC card manufacturing methods involves mounting a cover sheet having an IC chip and a coil bonded to one side of a mold and performing injection molding. The high-temperature molten resin comes into contact with the portion where the adhesive has adhered and the portion where the adhesive has not adhered. For this reason, a thin non-contact card having a card thickness of 0.20 to 0.75 mm is apt to wrinkle at a boundary portion of each portion due to a difference in thermal expansion coefficient between a portion where the adhesive is attached and a portion where the adhesive is not attached. Has found that there is also a problem that the manufactured card may be warped. According to experiments,
Even if the resin temperature, injection speed, and injection pressure are variously changed,
It has been difficult to manufacture a non-contact type IC card without wrinkles in the cover sheet and without warpage.

Since a non-contact type IC card is handled by a finger and directly viewed, a wrinkled surface has a poor usability and aesthetic appearance, and the commercial value is lost by itself. Further, when printing is performed on the surface of the cover sheet after manufacturing the non-contact type IC card, it becomes impossible to perform clean printing on the surface of the card, so that the commercial value is also lost. On the other hand, when the non-contact type IC card is warped, not only is the commercial value lost for the same reason as above, but also the non-contact type transmission coil provided in the card and the reader / writer are provided. Since the distance from the non-contact transmission coil becomes non-uniform, communication failure is likely to occur. In addition, since stress is applied to the IC chip and the non-contact transmission coil in the card, the IC chip is easily broken and the non-contact transmission coil is easily disconnected, which also reduces the commercial value.

Further, the conventional connection method between an IC chip and a coil requires a wiring board as an indispensable component, so that the cost is high, and it is difficult to cope with a thin and flexible non-contact type IC card. There is a problem.

The present invention has been made to solve such a problem, and its object is to provide an information carrier,
In addition, to provide a flexible IC module that can be used as a semi-finished product for manufacturing an information carrier, to provide an efficient manufacturing method of the flexible IC module, and to improve a feeling of use using the flexible IC module. An object of the present invention is to provide a method for producing a good and beautiful information carrier at low cost and high efficiency.

[0015]

<Means for Solving the Problems><Structure of Flexible IC Module> The present invention has been made in order to solve the aforementioned problems.
Regarding flexible IC modules, first of all,
A flexible substrate made of a thermocompression-bondable synthetic resin sheet,
And a mounting component including at least an IC chip carried on the flexible substrate.

[0016] Secondly, a flexible base made of a thermocompression-bondable synthetic resin sheet and a fiber sheet, and a mounting component including at least an IC chip carried on the flexible base are provided.

Thirdly, a flexible base made of a fiber sheet partially containing an amorphous copolymerized polyester and a mounting component including at least an IC chip carried on the flexible base are provided.

In the first and second flexible IC modules, the thermocompression-bondable synthetic resin sheet made of a hot melt adhesive and formed into a sheet can be used. In this specification, the term "thermo-compression-bondable synthetic resin sheet" refers to an IC chip that is softened at a low temperature that does not cause thermal destruction of the IC chip, and is subjected to heat and pressure to apply the IC chip and the non-contact transmission to the surface thereof. A non-thermocompression synthetic resin sheet refers to a synthetic resin sheet capable of fixing a coil for use. The "non-thermocompression-bondable synthetic resin sheet" is an IC chip that does not melt at a low temperature that does not cause thermal destruction of the IC chip, and is subjected to heat and pressure. And a synthetic resin sheet to which a non-contact transmission coil cannot be fixed.

On the other hand, the third flexible I
In the C module, the fiber sheet has excellent self-compression bonding properties, and is porous and excellent in resin impregnation even after applying heat and pressure, and furthermore, has a small heat shrinkage.
It is preferable to use a composite fiber of a crystalline resin and a non-crystalline copolyester. In this case, it is particularly preferable to use, as the conjugate fiber, a fiber in which the non-crystalline copolymerized polyester is present in 50% or more of the fiber surface in order to secure required self-compression bonding property.
Further, as the fiber sheet, a sheet made of a mixture of a fiber made of a crystalline resin and a fiber made of an amorphous copolymerized polyester can also be used.

Also, as the fiber sheet in the second flexible IC module, a fiber sheet containing a crystalline resin and an amorphous copolymerized polyester can be used.
As the fiber sheet, those made of a composite fiber of a crystalline resin and an amorphous copolymerized polyester, or those made of a mixture of a fiber made of a crystalline resin and a fiber made of an amorphous copolymerized polyester, Can be used.

In the present invention, the term "fiber sheet" is a general term for a woven fabric, a knitted fabric and a non-woven fabric, and a material having a self-pressing property and / or a resin impregnating property is particularly preferably used.

In the present invention, “amorphous” refers to J
It means that a peak other than the glass transition temperature is not substantially shown in a DSC curve obtained by a heat flow rate differential scanning calorimetry (DSC, heating rate of 10 ° C./min) specified in IS K ^7121-1987. . Here, the “glass transition temperature” refers to a value obtained by a method of obtaining a glass transition temperature specified in JIS K ^7121-1987 . In the present invention, “crystalline” refers to JIS K
^7121-1987 means that it has substantially a peak other than the glass transition temperature in a DSC curve obtained by a heat flow rate differential scanning calorimetry (same as above).

Further, "self-compression bonding" means that when a compressive force is applied to a fiber sheet at room temperature or under heating, the fibers constituting the fiber sheet are joined and a plurality of fiber sheets are stacked. In addition, when a compressive force is applied, the superposed fiber sheets are joined to each other, and the shape of the fiber sheet is maintained in a state in which the volume is smaller than before compression.

In the second flexible IC module, the fiber sheet can be arranged only on one side of the IC chip, or can be arranged on both sides via the IC chip.

Hereinafter, components mounted on the flexible IC module will be described.

The components mounted on the flexible IC module include, in addition to an IC chip, an IC module, a non-contact transmission means for data and / or power, a capacitor, a resistor, a solar cell, a liquid crystal display, an image display, and light. Recording medium, magneto-optical recording medium, transparent code information display body formed using infrared absorber / infrared light emitter or phosphor, and at least one type of component selected from magnet or ferromagnetic material Or the combination of these parts with other parts. The most practical one is the non-connection of the data and / or power supply directly connected to the IC chip and the input / output terminals of the IC chip. Examples include a combination with a contact transmission coil.

As the non-contact transmission coil, a coil composed of a wound coil may be used, or a flat coil formed on the IC chip mounting surface of the flexible substrate by etching, printing, plating or the like may be used. Can also.

As the wire material for the winding coil, a wire in which an insulating layer made of polyurethane or the like is coated around a core wire made of copper, aluminum or the like to maintain insulation properties is used.
In order to facilitate the connection with the IC chip, a bonding metal layer such as gold or solder is coated around the core wire and an insulating layer is coated around the bonding metal layer, or a flexible base. It is particularly preferable that an insulating layer and an adhesive layer are provided around the core wire in order to enhance the bonding property of the core wire. When a wound coil is used as the non-contact transmission coil, the direct connection between the IC chip and the non-contact transmission coil can be performed by a wedge bonding method, a solder method, or a welding method.

According to the wedge bonding method, (1) the ultrasonic pressure and the high pressure are applied to the connecting portion to deform the pressurized portion of the coil into a flat shape, so that it is easy to disconnect from the boundary with the non-deformed portion. 2) The application of ultrasonic waves and high pressure to the connecting portion easily damages the IC chip, and the effect is particularly remarkable when a thin IC chip having a thickness of about 50 μm to 150 μm is used. There are inconveniences such as difficulties in managing connection conditions because of the use of ultrasonic waves having complicated settings, and difficulty in stably producing good products. Therefore, it is particularly preferable to employ a soldering method or a welding method that does not have such inconveniences.

The soldering of the non-contact transmission coil to the IC chip is performed by using an IC chip in which solder bumps are formed in advance on the input / output terminals, contacting both ends of the non-contact transmission coil with the solder bump, This can be performed by pressing a bonding tool against both ends of the non-contact transmission coil and melting the solder bumps with energy given by the bonding tool. On the other hand, the welding of the non-contact transmission coil to the IC chip uses an IC chip in which gold bumps or nickel bumps are formed in advance on the input / output terminals, and the gold bump or nickel bump is attached to both ends of the non-contact transmission coil. Then, the welding head is pressed against both ends of the non-contact transmission coil, and the gold and nickel bumps are melted by the energy given by the welding head.

Both the soldering bonding tool and the welding head need only be able to heat the required connecting metal material to a temperature higher than the melting temperature, and the same structure can be used.

In the first to third flexible IC modules, all or a part of the mounted component is embedded in the flexible base and is carried on the flexible base. In this case, it is also possible to embed all the mounted components in the flexible base and to form the front and back surfaces of the flexible base including the surface of the buried mounted components into a flat shape. Further, for the IC chip, in order to protect the connection portion of the non-contact transmission coil, the flexible base side (for the second flexible IC module,
IC with the input / output terminals facing the thermocompression-bonding synthetic resin sheet side)
It is particularly preferred to embed the chip. Furthermore, a cover sheet made of a non-thermocompression synthetic resin sheet can be lined on the back side of the flexible substrate to increase the strength of the flexible IC module as a product and facilitate the handling thereof.

The flexible IC module of this configuration is
Since the IC chip and the non-contact transmission coil directly connected to the input / output terminals of the IC chip are thermocompression-bonded on the flexible base, the required components are simply overlapped, and the required heat is applied between them. A flexible IC module, which is the target object, can be obtained only by applying pressure.
The production of a flexible IC module and, consequently, an information carrier using the same can be greatly simplified.

Further, since the IC chip is directly connected to the non-contact transmission coil, a wiring board is not required, and the thickness of the flexible IC module as a product and thus the information carrier can be reduced and the manufacturing cost can be reduced. .

Further, in the flexible IC module of this configuration, since the IC chip and the non-contact transmission coil are thermocompression-bonded on the flexible substrate, at least one side of the flexible substrate where the IC chip and the non-contact transmission coil are not thermocompression-bonded. Can be formed smoothly, and by attaching a required cover sheet to the one surface, a wrinkle-free information carrier having a high commercial value can be produced. Of course, for the surface on which the IC chip and the non-contact transmission coil are thermocompression-bonded, for example, at the time of thermocompression, the IC chip and the non-contact transmission coil are completely embedded in the flexible base and the surface is shaped smoothly, or By applying means such as attaching a second cover sheet to the surface on which the IC chip and the non-contact transmission coil are thermocompression-bonded via another flexible substrate, the occurrence of wrinkles can be suppressed.

In addition, an IC is placed on a thermocompression-bondable synthetic resin sheet.
When the chip and the non-contact transmission coil are thermo-compressed together with the fiber sheet, the non-woven fabric can suppress the winding disorder and deformation of the non-contact transmission coil during thermo-compression bonding. And variations in communication characteristics can be suppressed, which is effective in improving the yield of non-defective products.

The IC module of this configuration has a base made of a thermocompression-bondable synthetic resin sheet or a fiber sheet and is extremely flexible, so that it can be used only as a component of a flat information carrier. Instead, the present invention can also be applied as an information carrier attached to a curved portion or a portion that undergoes repeated deformation.

<Method of Manufacturing Flexible IC Module> In order to solve the above-mentioned problems with respect to a method of manufacturing a flexible IC module, first, a mounting component including at least an IC chip is formed from a thermocompression bonding synthetic resin sheet. A step of arranging the non-contact transmission coil, the IC chip, and the flexible substrate into a pressurizing section of a press device, and applying heat and pressure to the joined body, And a step of integrally thermocompression bonding each member constituting the joined body.

Second, a step of thermocompression-bonding a mounting component including at least an IC chip to one surface of a fiber sheet to obtain an intermediate, a step of disposing the intermediate on a flexible substrate, And applying heat and pressure between the members by introducing the joined body consisting of and pressurizing force between the members, and thermocompression bonding the members constituting the joined body together. I do.

Third, a step of sandwiching a mounting component including at least an IC chip between two fiber sheets to obtain an intermediate by thermocompression bonding, and applying the intermediate to a flexible base made of a thermocompression-bondable synthetic resin sheet. And a step of introducing a joined body composed of the intermediate and the flexible base into a pressurizing portion of a press device, applying heat and pressure to the joined body, and integrating the members constituting the joined body into one. And thermocompression bonding.

Fourth, a step of arranging at least a mounting component including an IC chip on a flexible base made of a fiber sheet partially containing an amorphous copolymerized polyester, and a method of arranging the non-contact transmission coil and the mounting component. Introducing the joined body into the pressurizing section of the press device, applying heat and pressure to the joined body, and thermocompression-bonding the members constituting the joined body together.

Fifth, a step of forming a planar coil on one side of a flexible base made of a fiber sheet partially containing an amorphous copolyester, and combining an input / output terminal of an IC chip with a terminal portion of the planar coil. Then, a step of arranging the IC chip on the flexible substrate, and introducing a joined body composed of the flexible substrate and the IC chip into a pressurizing unit of a press device and applying heat and pressure to the joined body,
Electrically connecting the planar coil and the IC chip, and thermocompression bonding the members constituting the joined body together.

As the press device, a hot press device or a roll press device can be used. When using a hot press device, the joined body is introduced between a lower mold and an upper mold of the hot press device, and heat and pressure are applied to perform thermocompression bonding. When a roll press device is used, the joined body is introduced between opposing rollers of the roll press device, and heat and pressure are applied to perform thermocompression bonding.

According to these methods, the desired flexible IC module can be obtained only by positioning the flexible base and the required mounting member and superimposing them, and then thermocompression bonding these constituent members. The production of the module and thus of the information carrier using it can be greatly simplified.

Prior to thermocompression bonding of the mounting component to the flexible substrate, an intermediate body in which the mounting component is thermocompression bonded to the fiber sheet is prepared, and when the intermediate body is thermocompression bonded to the flexible substrate, the flexible substrate is used. The handling of the mounted components when arranging the mounted components on top becomes easy, and the manufacturing efficiency of the flexible IC module can be further improved,
Since displacement and deformation of the mounted components during heating and pressing can be prevented, the yield of non-defective products can be improved.

In each of these manufacturing methods, in order to facilitate the handling of the flexible substrate in each of the manufacturing steps and to facilitate the subsequent production of the information carrier, a mounting component is used as the flexible substrate. A non-thermocompression synthetic resin sheet lined on the back side not subjected to thermocompression bonding can also be used.

According to this means, a desired flexible IC module can be obtained only by positioning and arranging required members and then thermocompression bonding these members, thereby simplifying the manufacture of the flexible IC module. The manufacturing cost of the information carrier using the same can be reduced.

<Method of Manufacturing Information Carrier> In order to solve the above-mentioned problems with respect to the method of manufacturing an information carrier, first, a cover sheet is placed between a lower mold and an upper mold of a hot press apparatus. Interposing a laminate of a plurality of members including a flexible IC module having a thermocompression-bondable synthetic resin sheet, and applying heat and pressure to the laminate by relatively bringing the lower mold and the upper mold closer to each other. And a step of integrally thermocompression bonding each of the members constituting the laminated body.

Second, a step of manufacturing a laminate of a plurality of members including a cover sheet and a flexible IC module having a thermocompression-bondable synthetic resin sheet, and the step of forming the laminate between opposed rollers of a roll press device. And applying heat and pressure to the laminate, and thermocompression-bonding the members constituting the laminate together during the passage between the rollers.

The first method uses a so-called hot press method, and the second method uses a so-called roll press method. According to these methods, a desired information carrier can be obtained only by thermocompression bonding a required cover sheet to a thermocompression-bondable synthetic resin sheet of a flexible IC module manufactured in advance. Can be something.

In each of these manufacturing methods, the first cover sheet may be manufactured separately from the thermocompression-bondable synthetic resin sheet constituting the flexible IC module. In order to further improve the efficiency, it is also possible to use a non-thermocompression synthetic resin sheet lined on the back side of the thermocompression-bondable synthetic resin sheet (the surface on which the IC chip and the non-contact transmission coil are not thermocompression-bonded). it can.

The laminate serving as the base of the information carrier may be composed of one cover sheet and a flexible IC module laminated on the cover sheet,
It can also be composed of a first cover sheet, a flexible IC module laminated on the first cover sheet, and a second cover sheet laminated on the flexible IC module. Also, a first cover sheet and a flexible I laminated on the first cover sheet are provided.
It is also possible to comprise a C module, a second thermocompression-bondable synthetic resin sheet laminated on the flexible IC module, and a second cover sheet laminated on the second thermocompression-bondable synthetic resin sheet.

The second thermocompression-bondable synthetic resin sheet includes a hot-melt adhesive formed into a sheet and a hot-melt adhesive formed into a sheet and lined with a non-thermocompression synthetic resin sheet on one side. In addition, fiber sheet with self-compression bonding, fiber sheet impregnated with thermosetting resin,
Any one of a fiber sheet impregnated with a thermosetting resin and lined with a non-thermocompression synthetic resin sheet on one side can be used.

As the fiber sheet, both a sheet having a self-compressibility and a sheet having a self-compression property by impregnating with an appropriate amount of synthetic resin can be used. As a fiber sheet having a self-compression bonding property alone, a so-called conjugate fiber in which each single fiber is composed of two or more portions having different melting points is used as a material fiber, and amorphous polyethylene terephthalate is formed around a polyethylene terephthalate core material. Materials consisting of coated fibers, or blends or mixtures of two or more synthetic resin fibers having different melting points, and glass fibers, carbon fibers, Kepler fibers, chemical fibers, natural fibers or combinations thereof Fibers are used, and material fibers are joined with a resin binder. On the other hand, as a fiber sheet provided with self-compression bonding property by impregnating with an appropriate amount of synthetic resin, glass fiber, carbon fiber, Kepler fiber, chemical fiber, natural fiber or a combination of these as a material fiber is used. Can be. In the case of using a nonwoven fabric as the fiber sheet, for example, a web composed of random fibers obtained by opening a melt-spun synthetic resin filament, or a fine material obtained by spraying a solution of a raw polymer. Nonwoven fabrics of all known structures, such as those comprising a web of synthetic resin fibers having a network structure, can be used.

Further, the present invention solves the above-mentioned problems with respect to the method of manufacturing an information carrier. Third, the first heat-meltable sheet, the flexible IC module and the second Stacking the heat-fusible sheets in this order, and laminating the flexible IC module and the first and second heat-fusible sheets by pressing an upper mold of a hot press device from above the second heat-fusible sheets. Compressing the body in the thickness direction under heating, melting the first and second heat-meltable sheets by the energy thereof, and melting the first and second heat-meltable sheets. Impregnating the flexible IC module with the molten material, and hot-press molding an information carrier having a predetermined thickness.

Fourth, the first hot press is placed on the lower die.
Laminating the cover sheet, the first heat-fusible sheet, the flexible IC module, the second heat-fusible sheet, and the second cover sheet in this order, and a hot press device from above the second cover sheet. Press the upper mold of these flexible IC modules, 1st and 2nd
A step of compressing the laminate comprising the heat-meltable sheet and the first and second cover sheets in the thickness direction under heating, and melting the first and second heat-meltable sheets by the energy thereof; The flexible IC module is impregnated with a melt generated by melting the first and second heat-meltable sheets, and the first and second cover sheets are adhered to the flexible IC module by a predetermined thickness. Hot-press molding the information carrier.

According to such a means, a desired information carrier can be obtained only by thermocompression-bonding these members after positioning and arranging required members, so that the production cost of the information carrier can be reduced. it can.

[0058]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS <First Example of Flexible IC Module> A first example of a flexible IC module according to the present invention will be described with reference to FIGS. Figure 1 shows the first
FIG. 2 is a plan view of the flexible IC module according to the embodiment, FIG. 2 is a cross-sectional view of the flexible IC module according to the first embodiment, and FIG. 3 is an IC chip mounted on the flexible IC module according to the first embodiment. FIG. 4 is a cross-sectional view of a wire constituting the non-contact transmission coil, and FIG. 5 is a cross-sectional view showing a direct connection method between the IC chip and the non-contact transmission coil and a state of the connection portion. FIG. 6 is a cross-sectional view showing another direct connection method of the IC chip and the non-contact transmission coil and the state of the connection portion. FIG. 7 is a view showing the use of a welding device applied to the direct connection of the IC chip and the non-contact transmission coil. It is a block diagram of a state.

As is clear from FIGS. 1 to 3, the flexible IC module of this embodiment is directly connected to the IC chip 1 and the input / output terminals (pads) 1a of the IC chip 1, and is connected to a reader / writer (not shown) from the reader / writer. A non-contact transmission coil 2 that receives power supply to the IC chip 1 in a non-contact manner and transmits data to and from a reader / writer (not shown) in a non-contact manner, for example, by using a hot sheet formed in a sheet shape at normal temperature. It is configured to be fixed to one surface of a thermocompression-bondable synthetic resin sheet (flexible substrate) 3A such as a melt adhesive by thermocompression. As shown in FIG. 2A, the IC chip 1 and the non-contact transmission coil 2 are thermocompression bonded so that a part thereof is embedded in the thermocompression synthetic resin 3A. By devising the thickness of the resin sheet 3A and the heating conditions and pressing conditions during thermocompression bonding, FIG.
As shown in (b), it is also possible to perform thermocompression bonding so that the IC chip 1 and the non-contact transmission coil 2 are completely embedded in the thermocompression-bondable synthetic resin sheet 3A. In any case, the IC chip 1 and the non-contact transmission coil 2
In order to protect the connection portion, it is preferable that the input / output terminal 1a is thermocompression-bonded toward the thermocompression-bondable synthetic resin sheet 3A side, and the input / output terminal 1a is embedded in the thermocompression-bondable synthetic resin sheet 3A. .

As the IC chip 1, any IC chip conventionally mounted on a non-contact type IC card can be used. However, in order to reduce the thickness of the non-contact type IC card, the total thickness is 300 μm or less. It is desirable to use one thinned to preferably 200 μm or less. In particular, in order to apply the present invention to a thin card, it is preferable to use an IC chip 1 having a total thickness of about 50 μm to 150 μm. Since the configuration of the IC chip 1 is a matter belonging to the public domain and is not the gist of the present invention, the description is omitted.

On the other hand, regarding the non-contact transmission coil 2,
As shown in FIG. 4 (a), in addition to a core wire 2a made of a good conductive metal material such as copper or aluminum, a core wire 2a covered with an insulating layer 2b such as a resin is used.
To facilitate direct connection to the C chip 1, FIG.
As shown in FIG. 5, a wire made of a core metal 2a covered with a bonding metal layer 2c such as gold or solder, and an insulating layer 2b coated around the bonding metal layer 2c may be used. it can.

The wire constituting the non-contact transmission coil 2 has a diameter of 20 μm to 200 μm. The wire provided on the IC chip 1 for ensuring the connection between the IC chip 1 and the non-contact transmission coil 2. A terminal smaller than the length of one side of the output terminal 1a is selectively used. The non-contact transmission coil 2 is formed by turning a wire having a required coating and a required diameter several times to several tens of times in accordance with the characteristics of the IC chip.

As a direct connection system between the IC chip 1 and the non-contact transmission coil 2, wedge bonding, soldering or welding is particularly suitable.

When wedge bonding the IC chip 1 and the non-contact transmission coil 2, as shown in FIG. 5A, a gold bump or a nickel bump 1d is previously formed on the input / output terminal 1a as the IC chip 1. What was done is used. When the nickel bump is formed, the cost of the IC chip 1 can be reduced as compared with the case where the gold bump is formed. When using the IC chip 1 on which the gold bumps or the nickel bumps 1d are formed, the non-contact transmission coil 2 may be a coil that does not have the bonding metal layer 2c, but the bonding is made easier and more reliable. For this reason, it is particularly preferable to use one in which a gold layer is coated around the core wire 2a. The wedge bonding between the input / output terminal 1a and the non-contact transmission coil 2 is performed as shown in FIG.
The end of the non-contact transmission coil 2 is superimposed on the input / output terminal 1a, the bonding tool 51 is pressed from the non-contact transmission coil 2 side to apply an ultrasonic wave, and the energy thereof carbonizes the insulating layer 2b and bumps 1d. By melting. Thereby, as shown in FIG. 5B, the input / output terminal 1a of the IC chip 1 and the non-contact transmission coil 2 are directly connected. As shown in these figures, it is natural that the non-contact transmission coil 2 is made of a wire having a smaller wire diameter than the width of the gold bump or the nickel bump 1d.

When the IC chip 1 and the non-contact transmission coil 2 are to be soldered, as shown in FIG.
As the C chip 1, an I / O terminal 1a in which a solder bump 1b is formed in advance by solder plating is used. In this case, as the non-contact transmission coil 2, a coil having no bonding metal layer 2 c can be used. However, in order to improve the wettability to solder and to make soldering easier and more reliable, the core 2 a It is particularly preferable to use a material whose periphery is coated with gold or the like. As shown in the drawing, the soldering of the input / output terminal 1a and the non-contact transmission coil 2 is performed by overlapping the end of the non-contact transmission coil 2 on the input / output terminal 1a. The bonding tool 52 heated to a predetermined temperature is pressed to carbonize the insulating layer 2b by the energy thereof and to form the solder bump 1.
Performed by dissolving b. As a result, FIG.
As shown in (b), the input / output terminal 1a of the IC chip 1 and the non-contact transmission coil 2 are soldered via the solder 1c. Instead of the configuration in which the solder bumps 1b are formed on the input / output terminals 1a of the IC chip 1, a non-contact transmission coil 2 having a core layer 2a coated with a solder layer is used in the same manner as described above. Soldering is also possible. Further, a solder bump 1b is formed on the input / output terminal 1a of the IC chip 1 and the contactless transmission coil 2b is formed.
For example, a cable in which a solder layer is coated around the core wire 2a may be used.

When the IC chip 1 and the non-contact transmission coil 2 are welded, the input / output terminals 1a are provided with gold bumps or the core 2a is covered with a gold layer. A non-contact transmission coil made of a wire or both of them are used. As a welding machine, as shown in FIG. 7, two welders are arranged in parallel with a small gap d.
Welding head 62 having two electrodes 61a and 61b, and a ribbon winding reel 63 attached to the welding head 62
a, 63b and these ribbon winding reels 63a, 63
b, and a ribbon-shaped resistance heating element 6 is wound so that a part thereof is in contact with the tips of the electrodes 61a and 61b.
4 and a motor 65 for driving the driving reel 63a. Ribbon-shaped resistance heating element 6
Molybdenum ribbon made of high-purity single-crystal molybdenum is most preferable because high specific resistance and high thermal conductivity enable high temperature to be generated locally, and the strength is excellent. It is.

At the time of welding, as shown in FIG.
The end of the non-contact transmission coil 2 is directly overlapped with the input / output terminal 1a of the chip 1, and the welding head 62 is pressed from the non-contact transmission coil 2 side. And the electrode 61
A pulse power is supplied to the insulating layers 2a and 61b to carbonize the insulating layer 2b using the resistance heat generated by the ribbon-shaped resistance heating element 64 and to melt the gold bump or the gold layer coated around the core wire 2a or both. I do. The motor 65 drives the driving reel 63 a as necessary, and brings the clean ribbon-shaped resistance heating element 64 into contact with the welding head 62 at all times. A brush 66 for removing carbides is provided on the ribbon-shaped resistance heating element 64.
With the addition, the ribbon-shaped resistance heating element 64 can be repeatedly used, and the running cost can be reduced.

The welding machine shown in FIG. 7 can be used as a heat source for soldering instead of the bonding tool 52 shown in FIG.

The flexible IC module of this configuration is
As illustrated in FIG. 1, an IC chip 1 and a non-contact transmission coil 2 directly connected to an input / output terminal 1a of the IC chip 1 are thermocompression-bonded on a flexible base made of a thermocompression-bondable synthetic resin sheet 3A. Therefore, the IC chip 1 and the non-contact transmission coil 2 are simply placed on the thermocompression-bondable synthetic resin sheet 3A, and the required heat and pressure are applied between them, and the flexible object of the object is obtained. An IC module can be obtained, and the manufacture of a flexible IC module and, consequently, an information carrier using the same can be greatly simplified.

Since the IC chip 1 and the non-contact transmission coil 2 are thermocompression-bonded on the flexible base made of the thermocompression-bondable synthetic resin sheet 3A, at least the IC chip 1 and the non-contact transmission coil 2 are thermocompression-bonded. One side of the thermocompression-bondable synthetic resin sheet 3A can be formed smoothly,
By attaching a required cover sheet to the one surface, an information carrier having high commercial value without wrinkles can be manufactured. Of course, the surface on which the IC chip 1 and the non-contact transmission coil 2 are thermocompression-bonded also has the IC chip 1 and the non-contact transmission coil inside the thermocompression-bondable synthetic resin sheet 3A at the time of thermocompression as illustrated in FIG. Cover coil is completely embedded and the surface thereof is shaped smoothly, or the surface of the IC chip 1 and the non-contact transmission coil 2 which is thermocompression-bonded to the second cover sheet via another thermocompression-bondable synthetic resin sheet. The occurrence of wrinkles can be suppressed by applying means such as applying a wrinkle.

Furthermore, the IC module of this configuration has a base made of the thermocompression-bondable synthetic resin sheet 3A and is extremely flexible, so that it can be used not only as a component of a flat information carrier, The present invention can also be applied as an information carrier attached to a curved portion or a portion that undergoes repeated deformation.

In addition, since the IC chip 1 and the non-contact transmission coil 2 are directly connected, the wiring board can be omitted, and the flexible non-contact IC card, which is the final product, can be made thin and low. Cost can be reduced. In particular, when a soldering method or a welding method is used as a direct connection method between the IC chip 1 and the non-contact transmission coil 2, compared to a case where the wedge bonding method is applied,
There are the following advantages. That is, in the wedge bonding, the ultrasonic wave oscillated from the bonding tool 51 is applied to the bonding portion while the bonding tool 51 is strongly pressed on the non-contact transmission coil 2 superposed on the input / output terminal 1a of the IC chip 1, Since the energy is used to break the insulating layer 2b and promote the melting of the gold plating layer 2d, the tip of the non-contact transmission coil 2 is deformed into a flat shape as shown in FIG. It is easy to break from the boundary with the part. In addition, the wedge bonding method easily damages an IC chip by applying an ultrasonic wave and a strong pressure to a connection portion, and particularly, a thickness of 50 μm to 1 μm.
The effect becomes remarkable when a thin IC chip of about 50 μm is used. Furthermore, in the wedge bonding method, maintenance and management of connection conditions are difficult because of using ultrasonic waves whose conditions are complicated, and it is difficult to stably produce good products.

On the other hand, the soldering method and the welding method do not apply an ultrasonic wave to the connection portion, and the pressing force of the bonding tool 52 and the welding head 62 is weaker than the wedge bonding method. This does not cause disconnection of the IC chip or breakage of the IC chip, and the maintenance of the connection conditions is easy because no ultrasonic wave is used. When the soldering method according to the present invention is employed, the periphery of the core wire 2a is covered with the bonding metal layer 2c.
And using the wire covered with the insulating layer 2b,
No oxide film is formed on the wire. Therefore, it is not necessary to use the flux required for removing the oxide film during the normal soldering, and it is possible to prevent the manufacturing process from being complicated due to the addition of the flux washing step.

<Second Example of Flexible IC Module>
Next, the second embodiment of the flexible IC module according to the present invention will be described.
An example will be described with reference to FIG. FIG. 8 is a sectional view of a flexible IC module according to the second embodiment.

As is clear from FIG. 8, in the flexible IC module of this embodiment, the IC chip 1 and the non-contact transmission coil 2 are sandwiched between _two thermocompression-bondable synthetic resin sheets 3A ₁ and 3A _2. Characterized by being thermocompressed. The heat-bondable synthetic resin sheet 3A _1, 3A ₂ of the present embodiment, it is possible to use a heat-bondable synthetic resin sheet 3A the same kind according to the first example. Other configurations are the same as those of the flexible IC module according to the first embodiment, and thus description thereof will be omitted to avoid duplication.

The flexible IC module of the present example
IC between _two thermocompression bonding synthetic resin sheets 3A ₁ and 3A ₂
Since the chip 1 and the non-contact transmission coil 2 were sandwiched,
As compared with the flexible IC module of the first example, the protection effect of the IC chip 1 and the non-contact transmission coil 2 is higher, the handling in the subsequent steps becomes easier, and a high-performance information carrier can be manufactured with high efficiency. it can. Further, since the protection effect of the IC chip 1 and the non-contact transmission coil 2 is high, it can be used as it is as an information carrier.

<Third Example of Flexible IC Module>
Next, the third embodiment of the flexible IC module according to the present invention will be described.
An example will be described with reference to FIG. FIG. 9 is a cross-sectional view of the flexible IC module according to the third embodiment.

As is clear from FIGS. 9A, 9B, and 9C, the flexible IC module of this embodiment is a flexible base for thermocompression-bonding the IC chip 1 and the non-contact transmission coil 2 with, for example, chloride. A non-thermocompression synthetic resin sheet (cover sheet) 41 such as a vinyl sheet or a polypropylene sheet is backed by a thermocompression synthetic resin sheet 3A. The IC chip 1 and the non-contact transmission coil 2 are thermocompression bonded to the surface of the thermocompression-bondable synthetic resin sheet 3A. Other configurations are the same as those of the flexible IC module according to the first embodiment, and thus description thereof will be omitted to avoid duplication.

The flexible IC module of the present example
Since the thermocompression bonding synthetic resin sheet 3A lined with the cover sheet 41 is used as a flexible base for thermocompression bonding the C chip 1 and the non-contact transmission coil 2, the thermocompression bonding synthetic resin sheet in the manufacturing process of the flexible IC module is used. And the strength of the flexible IC module as a product can be increased.

<Fourth Example of Flexible IC Module>
Next, the fourth embodiment of the flexible IC module according to the present invention will be described.
An example will be described with reference to FIGS. FIG. 10 is an exploded perspective view of the flexible IC module according to the fourth embodiment, and FIG. 11 is a sectional view of the flexible IC module according to the fourth embodiment.

As is clear from these figures, the flexible IC module of this embodiment has the non-woven fabric 12 covered on the surface of the IC chip 1 and the non-contact transmission coil 2 and the non-woven fabric of the IC chip 1 and the non-contact transmission coil 2. 12 together with a thermocompression-bondable synthetic resin sheet 3A.
As the non-woven fabric 12, any known non-woven fabric can be used. However, since the non-woven fabric 12 has good thermocompression bonding properties with the IC chip 1, the non-contact transmission coil 2, and the thermocompression-bondable synthetic resin sheet 3A, the above-described non-woven fabric is used. It is preferable to use a single substance having self-compression bonding property or a substance imparted with self-compression bonding property by impregnating with an appropriate amount of a synthetic resin. Particularly, since it is easy to handle and excellent in thermocompression bonding property, polyethylene terephthalate ( It is preferable to use a core material of PET) made of fibers coated with amorphous polyethylene terephthalate (PET-G).

In the example of FIG. 11, only a part of the IC chip 1 and the non-contact transmission coil 2 is embedded in the thermocompression-bondable synthetic resin sheet 3A. Can be embedded in the thermocompression-bondable synthetic resin sheet 3A. In the example of FIG.
With the input / output terminals 1a facing the nonwoven fabric 12 side, the IC chip 1 and the non-contact transmission coil 2 are made of a thermocompression-bondable synthetic resin sheet 3A.
The IC chip 1 and the non-contact transmission coil 2 can be thermocompression-bonded to the thermocompression-bondable synthetic resin sheet 3A with the input / output terminals 1a facing the thermocompression-bondable synthetic resin sheet 3A. It is. For other configurations, refer to
Since it is the same as the flexible IC module according to the embodiment, the description is omitted to avoid duplication.

The flexible IC module of the present example
Non-woven fabric 1 on the surface of C chip 1 and non-contact transmission coil 2
2 and thermocompression-bonded to the thermocompression-bondable synthetic resin sheet 3A. Therefore, when the flexible IC module is manufactured and when a cover sheet is thermocompressed on the surface of the flexible IC module to manufacture a desired information carrier, the IC Chip 1
And the non-contact transmission coil 2 is held by the nonwoven fabric 12, and the IC chip 1 and the non-contact transmission coil 2
And the deformation of the non-contact transmission coil 2 are suppressed. Therefore, disconnection of the non-contact transmission coil 2 can be prevented, and variation in communication characteristics can be suppressed, and the yield of non-defective products can be increased. When a large number of IC chips 1 and non-contact transmission coils 2 are arranged on a large-sized thermocompression-bondable synthetic resin sheet 3A to obtain a large number of desired flexible IC modules or information carriers,
Since the deformation of the non-contact transmission coil 2 can be suppressed, it is possible to prevent the non-contact transmission coil 2 from being cut in the cutting process, and from this point, it is possible to increase the yield of good products.

<Fifth Example of Flexible IC Module>
Next, the fifth embodiment of the flexible IC module according to the present invention will be described.
An example will be described with reference to FIG. FIG. 12 is a sectional view of the flexible IC module according to the fifth embodiment.

As is apparent from FIG. 12, the flexible IC module of this example has the non-woven fabric 12 disposed on both the front and back surfaces of the IC chip 1 and the non-contact transmission coil 2, and the IC chip 1 and the non-contact transmission coil 2 It is characterized by being thermocompression-bonded to the thermocompression-bondable synthetic resin sheet 3A together with the two nonwoven fabrics 12. Other configurations are the same as those of the flexible IC module according to the fourth embodiment, and therefore, description thereof will be omitted to avoid duplication.

The flexible IC module of this example is
Since the nonwoven fabric 12 is disposed on both front and back surfaces of the C chip 1 and the non-contact transmission coil 2, the displacement and the non-contact of the IC chip 1 and the non-contact transmission coil 2 at the time of manufacturing the flexible IC module and at the time of manufacturing the information carrier. The deformation of the transmission coil 2 is more effectively suppressed, and the yield of non-defective products can be further increased.

<Sixth Example of Flexible IC Module>
Next, the sixth embodiment of the flexible IC module according to the present invention will be described.
An example will be described with reference to FIG. FIG. 13 is a sectional view of a flexible IC module according to the sixth embodiment.

As is clear from FIG. 13, the flexible IC module of this example has an IC chip 1 and a non-contact type in a nonwoven fabric 3B (flexible base) made of a crystalline resin fiber partially containing an amorphous copolymerized polyester. The transmission coil 2 is embedded and thermocompression-bonded.

As the nonwoven fabric 3B, it is particularly preferable to use a nonwoven fabric in which the non-crystalline copolymerized polyester is present in a portion of 50% or more of the fiber surface in order to secure required self-compression bonding.

The other configuration is the same as that of the flexible IC module according to the first embodiment.
Description is omitted to avoid duplication.

The amorphous copolymerized polyester is softened by heating, and thus exhibits self-compression bonding properties. Further, since the amorphous copolyester does not melt even when heated, the voids between the fibers are not filled, and the resin impregnation property can be maintained even after the heat compression. Furthermore, a fiber sheet which does not consist entirely of an amorphous copolyester but partially contains a crystalline resin has excellent strength and small heat shrinkage during thermocompression bonding. Therefore, the flexible IC module according to the first embodiment, in which the IC chip 1 and the non-contact transmission coil 2 are embedded in the nonwoven fabric 3B partially made of a crystalline resin containing an amorphous copolymerized polyester, is according to the first embodiment. In addition to having the same effects as the flexible IC module, it has excellent self-compression bonding properties and resin impregnating properties, high strength, small heat shrinkage during thermocompression bonding, and is less likely to warp.

In this embodiment, a non-woven fabric composed of crystalline resin fibers partially containing an amorphous copolyester was used, but a single fiber composed of a crystalline resin and an amorphous copolyester were used. The same effect can be obtained when a nonwoven fabric made of a mixture with a single fiber is used.

In this embodiment, the nonwoven fabric 3B is used as the flexible base material. However, a woven fabric or a knitted fabric partially made of crystalline resin fibers containing an amorphous copolymerized polyester can also be used.

<Seventh Example of Flexible IC Module>
Next, the seventh embodiment of the flexible IC module according to the present invention is described.
An example will be described with reference to FIG. FIG. 14 is a sectional view of the flexible IC module according to the seventh embodiment.

As is apparent from FIG. 14, the flexible IC module of this example has an IC chip 1 and a non-contact transmission coil on one side of a nonwoven fabric 3B partially made of a crystalline resin fiber containing an amorphous copolymerized polyester. 2 is embedded and thermocompression-bonded. Other configurations are the same as those of the flexible IC module according to the sixth embodiment, and therefore, description thereof will be omitted to avoid duplication.

The flexible IC module of this embodiment has the same effects as those of the flexible IC module according to the sixth embodiment, and the IC chip 1 is mounted on one surface of the nonwoven fabric 3B.
In addition, since the non-contact transmission coil 2 is buried, it is possible to obtain a flexible IC module which is thin and uses a small amount of the nonwoven fabric 3B.

<Eighth Example of Flexible IC Module>
Next, the eighth embodiment of the flexible IC module according to the present invention will be described.
An example will be described with reference to FIG. FIG. 15 is a sectional view of a flexible IC module according to the eighth embodiment.

As is clear from FIG. 15, the flexible IC module of this embodiment is different from the configuration using a coil for the non-contact transmission coil 2 in that a flat surface formed on one surface of a nonwoven fabric 3B (flexible base) is used. It is characterized by using a coil. The non-contact transmission coil 2 composed of the planar coil can be formed by etching a metal foil provided on the surface of the nonwoven fabric 3B, printing or plating conductive ink on the surface of the nonwoven fabric 3B, or the like. Also,
The electrical connection between the planar coil 2 and the IC chip 1 can be made via a conductive paste or an anisotropic conductive film 4 to improve the bonding strength between the nonwoven fabric 3B (flexible base) and the IC chip 1. For this purpose, a potting resin can be used in combination.

The flexible IC module of this embodiment has the same effects as those of the flexible IC module according to the seventh embodiment, and also has a flat coil formed on one surface of a nonwoven fabric 3B (flexible base) as the non-contact transmission coil 2. Is used, so compared to using a wound coil,
The handling can be remarkably facilitated, and the yield of good products can be improved.

<First Example of Flexible IC Module Manufacturing Method> A first example of a flexible IC module manufacturing method according to the present invention will be described below with reference to FIG. FIG. 16 is an explanatory diagram illustrating a first example of the method for manufacturing a flexible IC module.

The manufacturing method shown in FIG. 16 is for manufacturing the flexible IC module shown in FIGS. 1 and 2 by applying a so-called hot pressing method. Before manufacturing the flexible IC module, the flexible IC module has a predetermined shape and a predetermined size. A thermocompression-bondable synthetic resin sheet 3 formed into a sheet and a sheet in which both ends of the non-contact transmission coil 2 are directly connected to the input / output terminals 1a of the IC chip 1 are prepared (see FIG. 3). Thereafter, as shown in FIG. 16, the thermocompression-bondable synthetic resin sheet 3 is placed on the lower mold 11 having a flat upper surface formed into a flat shape.
The connection body of the IC chip 1 and the coil 2 is placed on the thermocompression-bondable synthetic resin sheet 3 with the input / output terminals 1a facing downward. Next, the upper die 1 whose lower surface is formed in a smooth planar shape from above the IC chip 1 and the non-contact transmission coil 2.
4 is pressed and the thermocompression-bondable synthetic resin sheet 3 is heated.
Is compressed in the thickness direction. Thereby, the thermocompression bonding synthetic resin sheet 3 is softened, and the IC chip 1 and the non-contact transmission coil 2 are embedded in the thermocompression bonding synthetic resin sheet 3 by an amount corresponding to the pressing force. Thereafter, when the heated thermocompression-bondable synthetic resin sheet 3 is cooled, the thermocompression-bondable synthetic resin sheet 3 is hardened and the IC chip 1 and the coil 2 are securely held.
0 is obtained.

In the flexible IC module manufacturing method of this embodiment, the thermocompression bonding synthetic resin sheet 3 is used as a base for holding the IC chip 1 and the non-contact transmission coil 2. The required connector is placed on the thermocompression-bondable synthetic resin sheet 3 only by applying the required heat and pressure between them, and the required connector can be securely fixed. The IC module can be manufactured with extremely high efficiency. Also, IC
As the chip 1 and the non-contact transmission coil 2, the one in which both ends of the coil 2 are directly connected to the input / output terminal 1 a of the IC chip 1 is used, so that the flexible IC module can be formed thin.

In the example of FIG. 16, one connection body is thermocompression-bonded on one thermocompression-bondable synthetic resin sheet 3. The connection body is thermocompression-bonded at the same time.
Of course, it is also possible to cut a plurality of required flexible IC modules 10.

<Second Example of Flexible IC Module Manufacturing Method> Next, a second example of the flexible IC module manufacturing method according to the present invention will be described with reference to FIG. FIG. 17 is an explanatory diagram illustrating a second example of the method for manufacturing a flexible IC module.

The manufacturing method shown in FIG. 17 is for manufacturing the flexible IC module shown in FIGS. 1 and 2 by applying a so-called roll pressing method. A thermocompression-bondable synthetic resin sheet 3 shaped into a tape having dimensions and a non-contact transmission coil 2 having both ends directly connected to the input / output terminals 1a of the IC chip 1 are prepared (see FIG. 3). Thereafter, as shown in FIG. 17, one end of the thermocompression-bondable synthetic resin sheet 3 formed into a tape shape and wound into a roll shape is taken up by a take-up roller 78, and a manipulator or the like is conveyed to the upper surface thereof. Using the means 72, the input / output terminal 1a
The connecting body of the IC chip 1 and the coil 2 is mounted at equal intervals with the surface facing downward, and the thermocompression-bondable synthetic resin sheet 3 on which the connecting body is mounted is introduced between the heating / pressing rollers 74. Then, the thermocompression-bondable synthetic resin sheet 3 is compressed in the thickness direction under heating. Thereby, the thermocompression-bondable synthetic resin sheet 3
Is softened, and the IC chip 1 and the non-contact transmission coil 2 are embedded in the thermocompression-bondable synthetic resin sheet 3 by an amount corresponding to the pressing force. Thereafter, when the heated thermocompression-bondable synthetic resin sheet 3 is cooled, the thermocompression-bondable synthetic resin sheet 3 is hardened to form an IC.
Since the chip 1 and the non-contact transmission coil 2 are securely held, the required flexible IC module 10 is obtained.

The method for manufacturing a flexible IC module according to the present embodiment has the same effects as the method for manufacturing a flexible IC module according to the first embodiment. In addition, since the thermocompression bonding of each member is performed by a roll press, the thermocompression bonding of each member is continuously performed. It is possible to more efficiently manufacture a desired flexible IC module.

In the manufacturing method shown in FIGS. 16 and 17, only one thermocompression bonding synthetic resin sheet 3 is used, and the IC chip 1 and the non-contact transmission coil 2 are mounted on one surface of the thermocompression bonding synthetic resin sheet 3. After thermocompression bonding, a second thermocompression-bondable synthetic resin sheet is placed over the first thermocompression-bondable synthetic resin sheet on which the IC chip 1 and the non-contact transmission coil 2 are thermocompression-bonded, and these are thermocompression-bonded together. Then, the embedded flexible IC module shown in FIG. 8 can be manufactured. In this case, the input / output terminals 1a of the IC chip 1 do not necessarily need to face the first thermocompression-bonding synthetic resin sheet 3a, and the connection between the IC chip 1 and the coil 2 is made with the input / output terminals 1a facing upward. First thermocompression bonding synthetic resin sheet 3
a.

In the manufacturing method shown in FIGS. 16 and 17, the thermocompression-bondable synthetic resin sheet 3 is used alone. If the synthetic resin sheet 3 is used, a flexible IC having the cover sheet 41 shown in FIG.
Modules can be manufactured.

Further, in the manufacturing method shown in FIGS. 16 and 17, the connection body between the IC chip 1 and the non-contact transmission coil 2 is thermocompression-bonded to the thermocompression-bondable synthetic resin sheet 3 as it is. In order to prevent deformation of the contact transmission coil 2 and coil short circuit at the chip edge,
Of course, the periphery of the connection between the C chip 1 and the non-contact transmission coil 2 can be sealed with resin in advance.

<Third Example of Flexible IC Module Manufacturing Method> Next, a third example of the flexible IC module manufacturing method according to the present invention will be described with reference to FIGS. FIG. 18 is an explanatory diagram showing a method of thermocompression bonding of the IC chip 1 and the non-contact transmission coil 2 to the nonwoven fabric. FIG. FIG. 4 is an explanatory view showing a method of thermocompression bonding with a resin sheet 3.

The manufacturing method of this embodiment is to manufacture the flexible IC module shown in FIGS. 11 and 12 by applying a so-called hot pressing method. A thermocompression-bondable synthetic resin sheet 3 formed into a sheet having dimensions, a nonwoven fabric 12 having substantially the same dimensions as this, and both ends of a non-contact transmission coil 2 directly connected to input / output terminals 1a of an IC chip 1. (See FIG. 3). Next, as shown in FIG. 18, a non-woven fabric 12 having a self-compression bonding property is placed on a lower mold 11 having a flat upper surface, and the input / output terminals 1a face down on the non-woven fabric 12. The connection body between the coil 1 and the coil 2 is placed. Then, a relief hole 15 is formed from above the nonwoven fabric 12 to a portion corresponding to the IC chip setting portion on the lower surface.
The upper die 15 on which a is formed is pressed, and the non-contact transmission coil 2 is pressed under heating. Thereby, the intermediate body 20 in which the IC chip 1 and the non-contact transmission coil 2 are thermocompression-bonded to the surface of the self-compression bonding nonwoven fabric 12 is obtained. As described above, when the upper die 15 having the escape hole 15a formed at a required position is used, no direct stress is applied to the IC chip 1, so that it is possible to prevent the IC chip 1 from being broken in the manufacturing stage. Instead of forming the relief hole 15a in the upper mold 15, a member having rubber-like elasticity such as a silicon film or a Teflon film is replaced with the lower mold 11 and the upper mold 15.
When installed in at least one of the
Similar effects can be obtained.

Next, as shown in FIG. 19, the thermocompression-bondable synthetic resin sheet 3 is placed on the lower mold 11 having a flat upper surface and the IC is placed on the thermocompression-bondable synthetic resin sheet 3.
The nonwoven fabric 12 is placed with the chip 1 and the non-contact transmission coil 2 facing downward. Next, an upper mold 14 whose lower surface is formed in a smooth flat shape from above the nonwoven fabric 12 is pressed,
The thermocompression-bondable synthetic resin sheet 3 is compressed in the thickness direction under heating. Thereby, the thermocompression bonding synthetic resin sheet 3 is softened, and the IC chip 1 and the non-contact transmission coil 2 are buried in the thermocompression bonding synthetic resin sheet 3 by an amount corresponding to the pressing force. The resin sheet 3 and the nonwoven fabric 12 are integrated. Hereinafter, if the heated thermocompression-bondable synthetic resin sheet 3 is cooled, the thermocompression-bondable synthetic resin sheet 3 is hardened and the IC chip 1 and the coil 2 are securely held.
Thereby, the required flexible IC module 10 is obtained.

The method of manufacturing a flexible IC module according to the present embodiment has the same effects as the method of manufacturing a flexible IC module according to the first embodiment, and furthermore, the surface of the nonwoven fabric 12 has an IC.
Since the intermediate body 20 in which the chip 1 and the non-contact transmission coil 2 are thermocompression-bonded is thermocompression-bonded to the thermocompression-bondable synthetic resin sheet 3, the IC chip 1 when setting on the thermocompression-bondable synthetic resin sheet 3 is used. In addition, the handling of the non-contact transmission coil 2 can be facilitated, and the productivity of the flexible IC module can be further increased. IC chip 1
In addition, since the non-contact transmission coil 2 is always held by the nonwoven fabric 12, the position of the IC chip 1 and the non-contact transmission coil 2 is displaced and the non-contact transmission coil 2 Deformation is less likely to occur, and disconnection of the non-contact transmission coil 2 due to displacement or variation in communication characteristics due to deformation of the non-contact transmission coil 2 can be suppressed, so that the yield of non-defective products can be increased. Further, when a large number of flexible IC modules or information carriers are to be obtained by arranging a large number of IC chips 1 and non-contact transmission coils 2 on a large thermocompression-bonding synthetic resin sheet 3, non-contact transmission is required. Therefore, it is possible to prevent the non-contact transmission coil 2 from being cut during the cutting process, and to improve the yield of non-defective products.

<Fourth Example of Flexible IC Module Manufacturing Method> Next, a fourth example of the flexible IC module manufacturing method according to the present invention will be described with reference to FIG. FIG. 20 is an explanatory diagram showing a fourth example of the method for manufacturing a flexible IC module.

The manufacturing method of FIG. 20 employs a so-called roll press method to apply the flexible IC shown in FIGS. 11 and 12.
Manufacture of module, flexible IC
Prior to the production of the module, a thermocompression-bondable synthetic resin sheet 3 formed in a tape shape of a predetermined size and wound in a roll shape
And an intermediate body 20 formed in a tape shape having substantially the same dimensions and wound in a roll shape (a structure in which a connection body of the IC chip 1 and the non-contact transmission coil 2 is attached to the nonwoven fabric 12 at equal intervals; FIG. 17). After a while, FIG.
As shown in FIG. 0, one end of the thermocompression-bondable synthetic resin sheet 3 and one end of the intermediate body 20 are pulled out, and the connection between the IC chip 1 and the non-contact transmission coil 2 is set inside, and the thermocompression-bondable synthetic resin sheet 3 is The bonded body is bonded to the body 20, and then the bonded body is introduced between the heating / pressing rollers 74 and compressed in the thickness direction under heating. Thereby, the thermocompression bonding synthetic resin sheet 3 is softened, and the IC chip 1 and the non-contact transmission coil 2 are buried in the thermocompression bonding synthetic resin sheet 3 by an amount corresponding to the pressing force. The resin sheet 3 and the nonwoven fabric 12 constituting the intermediate body 20 are adhered to each other. Thereafter, if the heated thermocompression-bondable synthetic resin sheet 3 is cooled, the thermocompression-bondable synthetic resin sheet 3 is hardened and the IC chip 1
In addition, the coil 2 for non-contact transmission is securely held, so that the required flexible IC module 10 is obtained. Reference numeral 75 in the drawing denotes a pull-out roller, 76
Denotes a guide roller, 77 denotes a bonding roller, 78 denotes a take-up roller, and 79 denotes a cooling roller.

The method of manufacturing a flexible IC module according to this embodiment has the same effects as the method of manufacturing a flexible IC module according to the third embodiment, and furthermore, since the thermocompression bonding of each member is performed by a roll press, the thermocompression bonding of each member is continuously performed. It is possible to more efficiently manufacture a desired flexible IC module.

<Fifth Example of Flexible IC Module Manufacturing Method> Next, a fifth example of the flexible IC module manufacturing method according to the present invention will be described with reference to FIG. FIG. 21 is an explanatory diagram illustrating a fifth example of the flexible IC module manufacturing method.

The method of manufacturing a flexible IC module according to the present embodiment includes manufacturing of the intermediate body 20 and flexible I which is a finished product.
The production of the C module is performed in one step, and the bonding between the thermocompression bonding synthetic resin sheet 3 and the intermediate body 20 is performed by hot pressing.

That is, as shown in FIG. 21, the method of manufacturing a flexible IC module according to the present embodiment is similar to that of the thermocompression-bondable synthetic resin sheet 3 formed in a tape shape having a predetermined size and wound in a roll shape. A self-bonding nonwoven fabric 12 formed in a tape shape and wound in a roll shape is prepared, and one end of the nonwoven fabric 12 is pulled out.
The connection body M of the IC chip 1 and the non-contact transmission coil 2 manufactured in the bonding step is placed on the top at equal intervals. Then
The nonwoven fabric 12 on which the connection body M is placed is divided into a lower mold 11 and an upper mold 15.
Then, the connection body M and the nonwoven fabric 12 are compressed in the thickness direction under heating. Thereby, the intermediate body 20 in which the connection body M and the nonwoven fabric 12 are integrated
Is produced. Next, the drawn-out end of the thermocompression-bondable synthetic resin sheet 3 is superimposed on the connection body mounting surface of the intermediate body 20 produced in this way, and introduced into the heating press 92, and the intermediate body 20 and the thermocompression-bondable synthetic resin sheet 3 are introduced. The joined body of the resin sheets 3 is compressed in the thickness direction under heating. Thereby, the thermocompression bonding synthetic resin sheet 3 is softened, and the intermediate body 20 and the thermocompression bonding synthetic resin sheet 3 are integrated. Next, the integrated intermediate body 20 and the thermocompression-bondable synthetic resin sheet 3 are combined with the cooling press 9.
Flexible IC that is introduced into 3 and molded to a predetermined thickness
The module raw material 94 is obtained. The material 94 is wound into a roll and stored. In the figure, reference numeral 75 denotes a pull-out roller, 76 denotes a guide roller, and 78 denotes a take-up roller.

The manufacturing method of the flexible IC module according to the present embodiment has the same effects as the manufacturing method of the flexible IC module according to the fourth embodiment. In addition, the manufacturing of the intermediate body 20 and the manufacturing of the finished flexible IC module are performed in one step. Therefore, the production of the raw material of the flexible IC module can be performed more efficiently. Further, since the intermediate body 20 and the thermocompression-bondable synthetic resin sheet 3 are bonded together by hot pressing, the heating time of both members can be made sufficiently longer than in the case of the roll press method. As the sheet 3, for example, a resin material such as vinyl chloride or ABS can be used.

<Sixth Example of Flexible IC Module Manufacturing Method> Next, a sixth example of the flexible IC module manufacturing method according to the present invention will be described with reference to FIG. FIG. 22 is an explanatory diagram illustrating a sixth example of the method of manufacturing a flexible IC module.

The manufacturing method of this example employs a so-called hot press method.
Applying the flexible IC module shown in FIG.
To manufacture flexible IC modules.
Prior to production, some of the materials contained amorphous copolyesters.
Sheet made of crystalline resin fiber
First and second nonwoven fabrics 3B shaped like₁, 3B ₂
And the input / output terminal 1a of the IC chip 1
Prepare a cable with both ends directly connected (see Fig. 3)
You.

[0123] Thereafter, as shown in FIG. 22, on the upper surface of the lower mold 11 formed into a smooth flat, the first nonwoven fabric 3B _1, and connection of IC chip 1 and the coil 2, the 2 of the nonwoven fabric 3B ₂ and positioned relative to each other is placed in this order. Next, the upper die 14 having a flat lower surface is pressed from above the laminate, and the IC chip 1 and the non-contact transmission coil 2 are pressed under heating. Thus, the nonwoven fabric _3B 1, 3B amorphous copolymerizable polyester in ₂ softens, 1 two non-woven fabrics _3B, IC chip 1 and the non-contact transmission coil 2 between the 3B ₂ is thermocompression. Hereinafter, if the heated non-woven fabrics 3B ₁ and 3B ₂ are cooled,
Since the amorphous copolyester in B ₁ and 3B ₂ is hardened and the IC chip 1 and the coil 2 are securely held, the required flexible IC module 10 is obtained. The other points are the same as those of the method of manufacturing the flexible IC module according to the first example, and the description is omitted.

Manufacturing method of flexible IC module of this example
The method is based on the method of manufacturing the flexible IC module according to the first example.
In addition to having the same effect as the
As a part, containing amorphous copolyester
Non-woven fabric 3B made of resin fiber ₁, 3B₂Because we used
It can maintain good resin impregnation even after thermocompression bonding,
Information carrier using this kind of flexible IC module
Can be manufactured easily and thermocompression bonding
Thermal shrinkage of the non-woven fabric during
Flexible IC module can be manufactured
You.

In the above-described embodiment, the first and second nonwoven fabrics 3B ₁ and 3B ₂ are arranged above and below the IC chip 1 and the coil 2 via the connection body, respectively, as shown in FIG. of was prepared a flexible IC module, if omitted second nonwoven 3B _2, it is possible to manufacture the flexible IC module 14 by the same process. Of course, in this case I
In order to protect the C chip 1, as shown in FIG.
An upper die 15 having a relief hole 15a formed in a portion corresponding to the chip setting portion is used.

In this embodiment, the nonwoven fabrics 3B ₁ and 3B ₂ are used as the flexible base material.
It is of course possible to use other fiber sheets such as woven or knitted fabrics.

<Seventh Example of Flexible IC Module Manufacturing Method> Next, a seventh example of the flexible IC module manufacturing method according to the present invention will be described with reference to FIG. FIG. 23 is an explanatory view showing a seventh example of the method for manufacturing a flexible IC module.

The manufacturing method of this example is to manufacture the flexible IC module shown in FIG. 15 by applying a so-called hot pressing method. A nonwoven fabric 3B made of a crystalline resin fiber containing a polymerized polyester and formed into a sheet having a predetermined shape and a predetermined dimension, and an IC chip 1 are prepared.

Then, first, on one side of the nonwoven fabric 3B,
For example, the desired planar coil 2 for non-contact transmission is formed using means such as etching, printing or plating. Then
As shown in FIG. 23, the nonwoven fabric 3 </ b> B is placed on the lower mold 11 having a flat upper surface with the planar coil 2 facing upward, and a conductive paste is applied to a pad portion of the planar coil 2. Alternatively, the IC chip 1 is arranged via the ACF 4. Further, a second non-woven fabric 3 is placed on the IC chip 1 from above.
Put B on. Thereafter, the upper die 15 having a flat lower surface is pressed from above the second nonwoven fabric 3B, and the IC chip 1 is pressed under heating. Thereby, the IC chip 1
And the planar coil 2 are electrically connected via a conductive paste or ACF4. Further, the amorphous copolyester in the nonwoven fabric 3B softens, and an IC is formed between the two nonwoven fabrics 3B.
The chip 1 is thermocompression-bonded. Hereinafter, the heated nonwoven fabric 3B
Is cooled, the amorphous copolyester in the nonwoven fabric 3B is hardened and the IC chip 1 is securely held, whereby the required flexible IC module 10 is obtained. Other points are the same as those of the flexible IC module manufacturing method according to the fifth example, and the description is omitted.

The method of manufacturing a flexible IC module according to the present embodiment has the same effects as the method of manufacturing a flexible IC module according to the fifth embodiment, and also includes a planar coil formed on a nonwoven fabric 3B as a flexible substrate as a coil for non-contact transmission. Is used, the handling of the coil 2 in the manufacturing process of the flexible IC module can be remarkably facilitated, and the yield of non-defective products can be increased, as compared with the case of using a wound coil.

<First Example of Information Carrier Manufacturing Method> Hereinafter, a first example of an information carrier manufacturing method using the flexible IC module 10 according to each of the above-described embodiments will be described by taking a non-contact IC card manufacturing method as an example. This will be described with reference to FIG.
FIG. 24 is an explanatory diagram illustrating a method for manufacturing the non-contact IC card according to the present example.

The manufacturing method shown in FIG. 24 employs a hot press method utilizing the bonding of thermocompression-bondable synthetic resin sheets, and is formed into a predetermined shape and a predetermined size before manufacturing a non-contact IC card. First cover sheet 41
And the flexible IC module 10 manufactured as described above, a sheet-shaped second thermocompression-bondable synthetic resin sheet 5 formed into a predetermined shape and a predetermined dimension, and a second cover sheet 43 are prepared. .

Thereafter, as shown in FIG. 24, the first cover sheet 41 is placed on the lower mold 11 having a flat upper surface formed in a flat shape.
The flexible IC module 10 is stacked with the thermocompression bonding surfaces of the C chip 1 and the non-contact transmission coil 2 facing upward, and a second thermocompression-bondable synthetic resin sheet 5 and a second cover sheet are further placed on the flexible IC module 10. And 43 in this order. Next, the second cover sheet 43
The upper mold 14 whose lower surface is formed into a flat flat surface is pressed from above, and the laminate is compressed in the thickness direction under heating.
Thereby, the thermocompression bonding synthetic resin sheet 3 and the second thermocompression bonding synthetic resin sheet 5 constituting the flexible IC module 10 are softened, and the thermocompression bonding property forming the first cover sheet 41 and the flexible IC module 10 are softened. The synthetic resin sheet 3, the thermocompression-bondable synthetic resin sheet 3 and the second thermocompression-bondable synthetic resin sheet 5 that constitute the flexible IC module 10, and the second thermocompression-bondable synthetic resin sheet 5
And the second cover sheet 43 adhere to each other,
The thermocompression-bondable synthetic resin sheet 3 and the second thermocompression-bondable synthetic resin sheet 5 constituting the flexible IC module 10 are deformed by an amount corresponding to the pressing force, and the IC chip 1 and the non-contact transmission coil 2 are thermocompressed. Synthetic resin sheets 3,5
Embedded in the first and second cover sheets 4
1, 43 are flattened. Thereafter, when the heated thermocompression-bondable synthetic resin sheets 3 and 5 are cooled, the thermocompression-bondable synthetic resin sheets 3 and 5 are hardened to form the IC chip 1 and the coil 2.
Is securely held, and the first and second cover sheets 41 and 43 are respectively bonded to the thermocompression-bondable synthetic resin sheets 3 and 5.
So that each cover sheet 41,
A desired non-contact IC card can be obtained by performing desired printing or the like on the surface of 43.

According to the manufacturing method of this embodiment, the second thermocompression-bondable synthetic resin sheet 5 and the first and second cover sheets 41,
Since the required non-contact IC card can be obtained only by thermocompression bonding of 43, the manufacture of the non-contact IC card can be extremely simplified. Further, since the IC chip 1 and the non-contact transmission coil 2 are thermocompression-bonded on the thermocompression-bondable synthetic resin sheet 3, at least the IC chip 1 and the non-contact transmission coil 2 are not thermocompression-bonded. 3
Can be formed smoothly on one side, and by attaching a required cover sheet to the one side, a non-contact IC card with high commercial value without wrinkles can be manufactured. Further, since no through-holes are formed in the thermocompression-bondable synthetic resin sheets 3 and 5 as the base, stress is not concentrated on a specific portion even when the non-contact IC card is curved, and the durability is excellent. Further, the non-contact IC card of the present embodiment has a base made of thermocompression-bondable synthetic resin sheets 3 and 5 and is extremely flexible, so that it can be used as a component of a flat non-contact IC card. However, the present invention can also be applied to a non-contact IC card attached to a curved portion or a portion that undergoes repeated deformation. In addition, the non-contact IC card of the present example has an IC chip 1
And the contactless transmission coil 2 are directly connected, so that the wiring board can be omitted, and the thickness and cost of the contactless IC card can be reduced.

In the example shown in FIG. 24, the non-contact IC cards are manufactured one by one using the single-piece flexible IC module 10. However, the use of the multiple-piece flexible IC module is required. Non-contact I
Of course, it is also possible to take a large number of C cards.

In the example shown in FIG. 24, the IC chip 1 and the non-contact transmission coil 2
A flexible IC module 10 obtained by thermocompression-bonding a connector with the above-mentioned connector was used, but the connector was sandwiched between two thermocompression-bondable synthetic resin sheets 3a and 3b as shown in FIG. A flexible IC module can also be used. In this case, the thermocompression bonding synthetic resin sheet 5 in FIG. 24 becomes unnecessary.

In the example of FIG. 24, the thermocompression-bondable synthetic resin sheets 3 and 5 and the cover sheet 4 manufactured separately from each other are used.
However, it is also possible to use thermocompression-bondable synthetic resin sheets 3 and 5 in which a back sheet made of a non-thermocompression-bondable synthetic resin sheet is backed in advance on the back surface. This facilitates the handling of the thermocompression-bondable synthetic resin sheet in each manufacturing process, so that the production of the information carrier can be made more efficient.

In the example shown in FIG. 24, the flexible IC
Although the first cover sheet 41 and the second cover sheet 43 are arranged on both the front and back surfaces of the module 10, any one of the cover sheets may be omitted in order to reduce the thickness of the information carrier.

Further, in the example of FIG. 24, the flexible IC module 10 having no nonwoven fabric is used.
As shown in FIG. 12, a flexible IC module in which the nonwoven fabric 12 is provided on one or both sides of the IC chip 1 and the non-contact transmission coil 2 can also be used.

<Second Example of Manufacturing Method of Information Carrier> In the manufacturing method of FIG. 25, the self-compression bonding property is imparted by impregnating a thermocompression bonding synthetic resin sheet and a nonwoven fabric having a self-compression bonding property or an appropriate amount of synthetic resin. A hot-press method using bonding with a non-woven fabric, and a non-contact IC
Prior to the manufacture of the card, the first cover sheet 41 formed into a predetermined shape and predetermined size, the flexible IC module 10 manufactured as described above, and the nonwoven fabric 12 formed into a predetermined shape and predetermined size And a second cover sheet 43 are prepared.

After that, as shown in FIG. 25, the first cover sheet 41 is placed on the lower mold 11 having a flat upper surface and is flattened.
The flexible IC module 10 is stacked with the thermocompression bonding surfaces of the C chip 1 and the non-contact transmission coil 2 facing upward, and the nonwoven fabric 1 is further placed on the flexible IC module 10.
2 and the second cover sheet 43 are stacked in this order. Next, the upper mold 14 having a flat lower surface is pressed from above the second cover sheet 43, and the laminate is compressed in the thickness direction under heating. Thereby, the thermocompression-bondable synthetic resin sheet 3 constituting the flexible IC module 10 is softened, and the self-compression bonding property of the nonwoven fabric 12 is exhibited, so that the first cover sheet 41 and the flexible IC
Thermocompression-bondable synthetic resin sheet 3 constituting module 10,
The thermocompression-bondable synthetic resin sheet 3 and the nonwoven fabric 12 constituting the flexible IC module 10 and the nonwoven fabric 12 and the second cover sheet 43 adhere to each other, and the thermocompression-bondable synthetic resin sheet 3 constituting the flexible IC module 10 is provided. And the non-woven fabric 12 is deformed by an amount corresponding to the pressing force, and the IC chip 1 and the non-contact transmission coil 2 are embedded in the thermocompression-bondable synthetic resin sheet 3 and the non-woven fabric 12,
Further, the surfaces of the first and second cover sheets 41 and 43 are flattened.

Thereafter, when the heated thermocompression bonding synthetic resin sheet 3 and the nonwoven fabric 12 are cooled, the thermocompression bonding synthetic resin sheet 3 is hardened and the nonwoven fabric 12 self-presses, so that the IC chip 1 and the coil 2 are securely formed. While being held, the first and second cover sheets 41 and 43 are adhered to the thermocompression-bondable synthetic resin sheet 3 and the nonwoven fabric 12, respectively. Therefore, a desired non-contact IC card can be obtained by performing desired design printing or the like on the surfaces of the cover sheets 41 and 43.

The other points are the same as those in the manufacturing method of FIG. 24, and the description will be omitted to avoid duplication. The information carrier manufacturing method of this example has the same effect as the manufacturing method of FIG.

In the example shown in FIG. 25, the IC chip 1 and the non-contact transmission coil 2
Although the flexible IC module 10 obtained by thermocompression-bonding the connector with the above is used, a flexible IC module provided with the nonwoven fabric 12 in advance as shown in FIGS. 11 and 12 can also be used. In this case, the nonwoven fabric 12 in FIG. 25 becomes unnecessary.

In the example of FIG. 25, the thermocompression-bondable synthetic resin sheet 3 and the nonwoven fabric 12 and the cover sheets 41 and 43 manufactured separately from each other are used. It is also possible to use a thermocompression-bondable synthetic resin sheet 3 in which a cover sheet made of a non-thermocompression-bondable synthetic resin sheet is backed in advance. By doing so, the thermocompression-bondable synthetic resin sheet 3 and the nonwoven fabric 1
Since the handling of the information carrier 2 becomes easy, the production of the information carrier can be made more efficient.

<Third Example of Manufacturing Method of Information Carrier> The manufacturing method shown in FIG. 26 employs a roller press method utilizing joining of thermocompression-bondable synthetic resin sheets.
Prior to the manufacture of the C card, a first cover sheet 41 formed into a tape having a predetermined shape and a predetermined dimension and wound in a roll shape, and formed into a tape shape having a predetermined shape and a predetermined size, and formed into a roll shape A flexible IC module 10, a second thermocompression-bondable synthetic resin sheet 5 formed into a tape having a predetermined shape and a predetermined size and wound into a roll, and a tape having a predetermined shape and a predetermined size And a second cover sheet 43 wound in a roll shape.

As shown in FIG. 26, the first cover sheet 41, the flexible IC module 10, the second thermocompression-bondable synthetic resin sheet 5, and the second cover sheet 43 are pulled out of each roller by a pull-out roller 75. The guide rollers 76 guide the pulled-out tape-shaped members to the bonding roller 77 in a predetermined arrangement. In the bonding roller 77, the flexible IC module 10 is superimposed on the first cover sheet 41 with the thermocompression bonding surfaces of the IC chip 1 and the non-contact transmission coil 2 facing downward, and the second flexible IC module 10 is placed on the flexible IC module 10. The thermocompression-bondable synthetic resin sheet 5 and the second cover sheet 43 are laminated in this order to produce a four-layer laminated body. Next, the laminate is introduced between the heating / pressing rollers 74 and compressed in the thickness direction under heating. Thereby, the thermocompression bonding synthetic resin sheet 3 and the second thermocompression bonding synthetic resin sheet 5 constituting the flexible IC module 10 are softened, and the thermocompression bonding property forming the first cover sheet 41 and the flexible IC module 10 are softened. The synthetic resin sheet 3, the thermocompression-bondable synthetic resin sheet 3 and the second thermocompression-bondable synthetic resin sheet 5 constituting the flexible IC module 10, the second thermocompression-bondable synthetic resin sheet 5 and the second cover sheet 43 Are adhered to each other, and the thermocompression-bondable synthetic resin sheet 3 and the second thermocompression-bondable synthetic resin sheet 5 constituting the flexible IC module 10 are deformed by an amount corresponding to the pressing force, and the IC chip 1 and the non-contact transmission are performed. Coil 2 is embedded in these thermocompression-bondable synthetic resin sheets 3 and 5, and the surfaces of the first and second cover sheets 41 and 43 are It is the tanker.

Thereafter, when the heated thermocompression-bondable synthetic resin sheets 3 and 5 are cooled, the thermocompression-bondable synthetic resin sheets 3 and 5 are hardened, and the IC chip 1 and the coil 2 are securely held. The first and second cover sheets 41 and 43 are closely attached to the thermocompression-bondable synthetic resin sheets 3 and 5, respectively. The laminated body after the thermocompression bonding is wound around the winding roller 78 and stored. Therefore, if necessary, each cover sheet 4
A desired non-contact IC card can be obtained by performing desired printing or the like on the surfaces of the components 1 and 43 and then cutting the surface into the required shape and dimensions.

The other points are the same as those in the manufacturing method shown in FIG. 24, and the description is omitted to avoid duplication. The information carrier manufacturing method of this example has the same effects as those of the manufacturing method of FIG. 24, and also uses the roller press method, so that the efficiency of manufacturing a non-contact IC card can be further improved.

In the example shown in FIG. 26, the IC chip 1 and the non-contact transmission coil 2
A flexible IC module 10 obtained by thermocompression-bonding a connector with the above-mentioned connector was used, but the connector was sandwiched between two thermocompression-bondable synthetic resin sheets 3 and 5, as shown in FIG. The flexible IC module 10 can also be used. In this case, the second thermocompression-bondable synthetic resin sheet 5 in FIG. 26 becomes unnecessary.

In the example of FIG. 26, the thermocompression-bondable synthetic resin sheets 3 and 5 and the cover sheet 4 manufactured separately from each other are used.
However, it is also possible to use thermocompression-bondable synthetic resin sheets 3 and 5 in which a back sheet made of a non-thermocompression-bondable synthetic resin sheet is backed in advance on the back surface. By doing so, the thermocompression-bonding synthetic resin sheet 3 in each manufacturing process
Since the handling of the information carrier becomes easy, the production of the information carrier can be made more efficient.

<Fourth Example of Manufacturing Method of Information Carrier> In the manufacturing method shown in FIG. 27, the self-compression bonding property is imparted by impregnating a thermocompression-bondable synthetic resin sheet alone with a nonwoven fabric having self-compression bonding property or an appropriate amount of synthetic resin. A roller press method using bonding with a non-woven fabric, and a non-contact IC
Prior to the production of the card, the first cover sheet 41 is formed into a tape having a predetermined shape and predetermined dimensions, and is wound into a roll, and is formed into a tape having a predetermined shape and predetermined dimensions, and is formed into a roll. A wound flexible IC module 10, a non-woven fabric 12 formed into a tape having a predetermined shape and predetermined dimensions and wound into a roll, and a non-woven fabric 12 formed into a tape having a predetermined shape and predetermined dimensions, and formed into a roll The wound second cover sheet 43 is prepared.

As shown in FIG. 27, the first cover sheet 41, the flexible IC module 10, the nonwoven fabric 12, and the second cover sheet 43 were pulled out of each roller by a pull-out roller 75, and pulled out by a guide roller 76. Each tape-shaped member is guided to the bonding roller 77 in a predetermined arrangement. In the bonding roller 77, the first
The flexible IC module 10 is overlaid on the cover sheet 41 with the thermocompression bonding surfaces of the IC chip 1 and the non-contact transmission coil 2 facing downward, and the nonwoven fabric 12 and the second cover sheet 43 are placed on the flexible IC module 10. Are laminated in this order to produce a laminate having a four-layer structure. Next, the laminate is introduced between the heating / pressing rollers 74 and compressed in the thickness direction under heating. Thereby, the thermocompression bonding synthetic resin sheet 3 constituting the flexible IC module 10 is softened, and the self-compression bonding property of the nonwoven fabric 12 is exhibited, and the thermocompression bonding synthetic resin constituting the first cover sheet 41 and the flexible IC module 10 is formed. The resin sheet 3, the thermocompression-bondable synthetic resin sheet 3 constituting the flexible IC module 10 and the nonwoven fabric 12, the nonwoven fabric 12 and the second cover sheet 43 adhere to each other, and the thermocompression bonding property constituting the flexible IC module 10 The synthetic resin sheet 3 and the nonwoven fabric 12 are deformed by an amount corresponding to the pressing force, and the IC chip 1 and the non-contact transmission coil 2 are deformed.
Are embedded in the thermocompression-bondable synthetic resin sheet 3 and the nonwoven fabric 12, and furthermore, the first and second cover sheets 41,
43 is flattened.

Thereafter, if the heated thermocompression-bondable synthetic resin sheet 3 and the nonwoven fabric 12 are cooled, the thermocompression-bondable synthetic resin sheet 3 is cured and the nonwoven fabric 12 is self-pressed, so that the IC chip 1 and the coil 2 are securely formed. While being held, the first and second cover sheets 41 and 43 are adhered to the thermocompression-bondable synthetic resin sheet 3 and the nonwoven fabric 12, respectively. The laminated body after the thermocompression bonding is wound around the winding roller 78 and stored. Therefore, each cover sheet 41,
After performing desired printing or the like on the surface of the 43, it is possible to obtain a required non-contact IC card by cutting into a required shape and size.

The other points are the same as those in the manufacturing method shown in FIG. 26, and the description will be omitted to avoid duplication. The information carrier manufacturing method of this example has the same effect as the manufacturing method of FIG.

In the example shown in FIG. 27, the IC chip 1 and the non-contact transmission coil 2
Although the flexible IC module 10 formed by thermocompression bonding of the connector with the above is used, a flexible IC module in which the connector is sandwiched between a thermocompression-bondable synthetic resin sheet and a predetermined nonwoven fabric may be used. it can. In this case,
The nonwoven fabric 12 in FIGS. 11 and 12 becomes unnecessary.

In the example of FIG. 27, the thermocompression-bondable synthetic resin sheet 3 and the nonwoven fabric 12 and the cover sheets 41 and 43 manufactured separately from each other are used. It is also possible to use a thermocompression-bondable synthetic resin sheet 3 in which a cover sheet made of a non-thermocompression-bondable synthetic resin sheet is backed in advance. By doing so, the thermocompression-bondable synthetic resin sheet 3 and the nonwoven fabric 1
Since the handling of the information carrier 2 becomes easy, the production of the information carrier can be made more efficient.

The cover sheet 4 according to each of the above embodiments.
In order to enhance the bonding to the thermocompression bonding sheets 3, 5, and 12, fine irregularities, for example, irregularities corresponding to the abrasive grain size of No. 400 to No. 1000 specified by JIS are formed on the back surface of No. 1, 43. Is preferred. Also, the cover sheets 41, 43
When printing is performed directly on the surface of the cover sheets 41 and 43, it is preferable to form fine irregularities on the surfaces of the cover sheets 41 and 43 in order to enhance printability. In this case, the cover sheets 41 and 43 are used in order to improve the printability by improving the ink riding.
No. 3000 to 100 of abrasive grain size specified by JIS on the surface of
It is preferable to form irregularities corresponding to No. 00. As a method for manufacturing such a cover sheet, a diameter of 0.1 μm
A method of embedding a filler of up to several tens of μm (abrasives or the like can be used) into a raw sheet of a cover sheet by electrostatic coating, a method of kneading the filler with a cover sheet material, and a method of kneading the surface of the raw sheet. A method of polishing with abrasive grains can be given.

<Fifth Example of Information Carrier Manufacturing Method> Next, a fifth example of the information carrier manufacturing method according to the present invention will be described with reference to FIG. FIG. 28 is an explanatory diagram showing a fifth example of the information carrier manufacturing method.

The method of manufacturing an information carrier according to the present embodiment includes performing, in one step, from manufacturing of an intermediate body 20 that is a base of a flexible IC module to manufacturing of an information carrier as a finished product, and a thermocompression bonding synthetic resin sheet. 3 and the casing of the flexible IC module 10 (raw sheet 94) is hot-pressed.

That is, the information carrier manufacturing method of this example is the same as that of FIG.
As shown in the figure, a thermocompression-bondable synthetic resin sheet 3 formed in a tape shape having a predetermined size and wound in a roll shape,
And cover sheets 41 and 43 for casing and overlay sheets 95 and 96 are prepared, and required members are sequentially joined in each step using hot press devices 91, 92, 98 and cooling presses 93, 98. go.

The steps up to the production of the flexible IC module raw material 94 are the same as those of the fifth example of the flexible IC module production method (see FIG. 21). Is displayed,
Description is omitted.

After fabricating the flexible IC module fabric 94, the cover sheets 41 and 43 drawn from the roll are superimposed on both the front and back surfaces of the fabric 94, and then the cover sheets 41 and 43 are rolled on the outer surfaces thereof. The pulled-out overlay sheets 95 and 96 are overlapped, and a magnetic stripe 97 is overlapped on the outer surface of the overlay sheet 96. Thereafter, these laminates are introduced into a heating press 98 and compressed in the thickness direction to integrate each member. Next, the integrated laminate is introduced into a cooling press 99 to obtain a raw material 100 of an information carrier molded to a predetermined thickness. Finally, punch the raw 100
01 to obtain an information carrier (non-contact IC card) 102 having a predetermined shape. The laminated body after the information carrier 102 is cut out is wound up by a roller and disposed. In the drawing, reference numeral 75 is a pull-out roller, 76 is a guide roller, 7
Reference numeral 8 denotes a winding roller.

The method of manufacturing a flexible IC module according to the present example has the same effects as the method of manufacturing a flexible IC module according to the fourth example. In addition, the manufacturing of the intermediate body 20 and the manufacturing of a flexible IC module as a finished product are performed in one step. Therefore, the production of the raw material of the flexible IC module can be performed more efficiently. Further, since the intermediate body 20 and the thermocompression-bondable synthetic resin sheet 3 are bonded together by hot pressing, the heating time of both members can be made sufficiently longer than in the case of the roll press method. As the sheet 3, for example, a resin material such as vinyl chloride or ABS can be used.

<Sixth Example of Information Carrier Manufacturing Method> Next, a sixth example of the information carrier manufacturing method according to the present invention will be described with reference to FIG. FIG. 29 is an explanatory diagram showing a sixth example of the information carrier manufacturing method.

The information carrier manufacturing method of this example relates to a method of manufacturing a non-contact IC card having no cover sheet by a so-called hot press method using the flexible IC module 10 shown in FIG.

First, prior to manufacturing a non-contact IC card,
Heat fusible sheets 45 and 46 formed of a thermoplastic resin such as PET, for example, molded into a predetermined shape and predetermined dimensions, and the flexible IC module 10 manufactured as described above are prepared.

Next, as shown in FIG. 29, the first heat-fusible sheet 45, the flexible IC module 10, and the second heat-fusible sheet are placed on the lower mold 11 having a flat upper surface. And 46 in this order. In this state, the upper mold 14 having a flat lower surface is pressed from above the second heat-meltable sheet 46, and the laminate is compressed in the thickness direction under heating. During this compression process, the first
Then, the second heat-meltable sheets 45 and 46 are melted, and a part or the whole of the meltable sheets 45 and 46 is impregnated in the fiber sheet 3B which is a flexible base constituting the flexible IC module 10.
As a result, the flexible IC module 10 and the heat-fusible sheets 45 and 46 are integrated, and
The C module 10 is casing by the heat fusible sheets 45 and 46. Hereinafter, if necessary, the outer peripheral portion is shaped and design printing is performed on the surface of the heat-fusible sheet to obtain a non-contact IC card as a product.

According to the manufacturing method of this example, since the casing of the flexible IC module 10 is formed by the so-called hot pressing method, the heating and pressurizing conditions during the casing are easily controlled, and a highly accurate non-contact IC card is obtained. be able to.

In the example shown in FIG. 29, the non-contact IC card is manufactured one by one using the single-piece flexible IC module 10. Non-contact I
Of course, it is also possible to take a large number of C cards.

In the example of FIG. 29, the IC chip 1 and the non-contact transmission coil 2 are composed of two fiber sheets 3B ₁ and 3B.
A flexible IC module 10 of the buried 13 between ₂ was used but, IC on one side of a sheet of fiber sheets 3B as shown in FIG. 14 the chip 1 and the non-contact transmission coil 2
The flexible IC module in which is embedded can be casing in the same manner.

Further, in the example of FIG. 29, design printing was immediately performed on the hot-pressed hot-melt sheets 45 and 46.
It is, of course, possible to design print the surface of the surface 46 on a rough surface or a ground below.

<Seventh Example of Information Carrier Manufacturing Method> Next, a seventh example of the information carrier manufacturing method according to the present invention will be described with reference to FIG. FIG. 29 is an explanatory diagram showing a seventh example of the information carrier manufacturing method.

The information carrier manufacturing method of this example relates to a method of manufacturing a non-contact IC card having a cover sheet by a so-called hot press method using the flexible IC module 10 shown in FIG.

First, prior to manufacturing a non-contact IC card,
Cover sheets 41 and 43 made of a heat-resistant resin material molded in a predetermined shape and dimensions, heat-fusible sheets 45 and 46 made of a thermoplastic resin such as PET molded in a predetermined shape and dimensions, and The flexible IC module 10 manufactured as described above is prepared.

Next, as shown in FIG. 30, a first cover sheet 41, a first heat-meltable sheet 45, and a flexible I-type sheet are placed on a lower mold 11 having a flat upper surface.
The C module 10, the second heat-meltable sheet 46, and the second cover sheet 43 are stacked in this order. In this state, the upper mold 14 having a flat lower surface formed on the second cover 43 is pressed from above the second cover 43, and the laminate is compressed in the thickness direction under heating. During this compression process, the first
And the second heat-meltable sheets 45 and 46 are melted, a part of which is impregnated into the fiber sheet 3B which is a flexible base constituting the flexible IC module 10, and the other part is bonded with the cover sheets 43 and 41. I do. Thereby, the flexible IC module 10 and the first and second
Are integrated with the first and second cover sheets 41, 43, and the flexible IC module 10 is casing. Hereinafter, if necessary, the outer peripheral portion is shaped and design printing is performed on the surface of the heat-fusible sheet to obtain a non-contact IC card as a product.

The method of manufacturing an information carrier according to this embodiment has the same effects as the method of manufacturing an information carrier according to the sixth embodiment, and further includes the cover sheets 41 and 43 made of a heat-resistant resin material.
A non-contact IC card having more excellent heat resistance can be manufactured.

The cover sheets 41 and 43 can be formed of any transparent or opaque synthetic resin sheet having predetermined heat resistance, such as polyvinyl chloride, PET, polyethylene naphthalate, etc. From the viewpoint, it is particularly preferable to use a resin material that does not generate chlorine during incineration. Other points are the same as the information carrier manufacturing method according to the sixth example,
The description is omitted to avoid repetition.

Hereinafter, other embodiments of the present invention will be listed.

(1) Instead of a nonwoven fabric, a woven fabric, a knitted fabric, a paper, a leather, or the like having a self-compression bonding property can be used.

(2) In the above embodiments, a flexible IC module in which the IC chip 1 and the coil 2 are embedded and a non-contact IC card are described as examples of mounted components, but other mounted components are embedded. Even when a flexible IC module is used, a non-contact IC card can be manufactured in the same manner.

(3) In the above embodiments, the method of manufacturing a non-contact type IC card has been described as an example. However, a non-contact type IC information carrier having another shape such as a coin shape or a ribbon shape may be used. Of course it is easy.

(4) Regarding the direct connection method between the IC chip and the coil, in addition to the methods described in the above embodiments,
A connection method of connecting an IC chip and a coil via a conductive resin can also be adopted.

(5) I described in each of the above embodiments.
Connection method between the input / output terminal 1a of the C chip 1 and the coil 2,
That is, the periphery of the core wire 2a and the bonding metal layer 2c is formed by the insulating layer 2b.
Bonding is performed by using a wire as it is covered with the wire, and the input / output terminals 1a of the IC chip 1 and the coil 2 are connected while carbonizing and removing the insulating layer 2b by the energy given from the bonding tool. This method can be applied not only to the connection between the input / output terminal 1a of the IC chip 1 and the coil 2, but also to the connection of a jumper wire to a wiring board or the connection of a coil in a magnetic head, for example. .

(6) The second thermocompression-bondable synthetic resin sheet 5
This can be omitted for the nonwoven fabric 12.

[0186]

The flexible IC module of the present invention is obtained by thermocompression-bonding a mounting component including an IC chip on a flexible base made of a thermocompression-bondable synthetic resin sheet or a fiber sheet. A desired flexible IC module can be obtained simply by placing required mounting components on a fiber sheet and applying required heat and pressure between them, and a flexible IC module can be obtained.
The production of the module and thus of the information carrier using it can be greatly simplified. In addition, since the flexible IC module of the present invention thermocompression-bonds a mounting component on a flexible substrate made of a thermocompression-bondable synthetic resin sheet or a fiber sheet, at least one surface of the flexible substrate on which the mounting component is not thermocompression-bonded is smooth. It is possible to provide an information carrier which can be formed and has high commercial value and high durability without wrinkles or stress concentration.

The method for manufacturing a flexible IC module according to the present invention is characterized in that a mounting component including an IC chip is positioned and arranged on a flexible base made of a thermocompression-bondable synthetic resin sheet or a fiber sheet, and then these components are thermocompression-bonded. Thus, a desired flexible IC module can be obtained by simply performing the above steps, so that the manufacture of the flexible IC module and, consequently, the information carrier using the same can be extremely simplified.

In particular, when using an intermediate obtained by thermocompression bonding an IC chip and a non-contact transmission coil on the surface of a non-woven fabric and casing the intermediate with a flexible base made of a thermocompression-bondable synthetic resin sheet, The handling of these IC chips and the coil for non-contact transmission when setting them on a press-fittable synthetic resin sheet can be facilitated, and flexible I
The productivity of the C module can be further improved.
In addition, since the IC chip and the non-contact transmission coil are always held by the non-woven fabric, misalignment of the IC chip and the non-contact transmission coil and deformation of the non-contact transmission coil during thermocompression bonding to the thermocompression-bondable synthetic resin sheet. It is unlikely to occur, and it is possible to suppress the disconnection of the non-contact transmission coil due to the displacement and the variation of the communication characteristics due to the deformation of the non-contact transmission coil, so that the yield of non-defective products can be increased. Furthermore, in the case where a large number of IC chips and non-contact transmission coils are arranged on a large thermocompression-bonding synthetic resin sheet to obtain a large number of desired flexible IC modules or information carriers, the non-contact transmission coil Because deformation can be suppressed,
The cutting of the non-contact transmission coil in the cutting process can be prevented, and the yield of non-defective products can be increased from this point as well.

According to the method for producing an information carrier of the present invention, a desired information carrier can be obtained only by casing the front and back surfaces of a pre-fabricated flexible IC module with a required resin sheet. It can be simple.

[Brief description of the drawings]

FIG. 1 is a partially cutaway plan view of a flexible IC module according to a first embodiment.

FIG. 2 is an enlarged sectional view taken along line AA of FIG.

FIG. 3 is a plan view of an essential part of an IC chip and a coil mounted on the flexible IC module according to the first embodiment.

FIG. 4 is a sectional view of a wire constituting the coil.

FIG. 5 is a cross-sectional view showing a method of directly connecting an IC chip and a coil and a state of a connection portion.

FIG. 6 is a sectional view showing another direct connection method of the IC chip and the coil and a state of a connection portion.

FIG. 7 is a use state diagram of a welding device applied to direct connection between an IC chip and a coil.

FIG. 8 is a plan view of a flexible IC module according to a second embodiment.

FIG. 9 is a plan view of a flexible IC module according to a third embodiment.

FIG. 10 is an exploded perspective view of a flexible IC module according to a fourth embodiment.

FIG. 11 is a sectional view of a flexible IC module according to a fourth embodiment.

FIG. 12 is a sectional view of a flexible IC module according to a fifth embodiment.

FIG. 13 is a sectional view of a flexible IC module according to a sixth embodiment.

FIG. 14 is a sectional view of a flexible IC module according to a seventh embodiment.

FIG. 15 is a sectional view of a flexible IC module according to an eighth embodiment.

FIG. 16 shows a first method of manufacturing a flexible IC module.
It is explanatory drawing which shows an example.

FIG. 17 shows a second method of manufacturing a flexible IC module.
It is explanatory drawing which shows an example.

FIG. 18 is an explanatory view showing a method of thermocompression bonding of an IC chip and a non-contact transmission coil to a nonwoven fabric.

FIG. 19 is an explanatory view showing a thermocompression bonding method between a nonwoven fabric on which an IC chip and a non-contact transmission coil are thermocompression-bonded and a thermocompression-bondable synthetic resin sheet.

FIG. 20 shows a fourth method of manufacturing a flexible IC module.
It is explanatory drawing which shows an example.

FIG. 21 is a fifth view of the flexible IC module manufacturing method.
It is explanatory drawing which shows an example.

FIG. 22 shows a sixth method of manufacturing a flexible IC module.
It is explanatory drawing which shows an example.

FIG. 23 is a seventh view of the flexible IC module manufacturing method;
It is explanatory drawing which shows an example.

FIG. 24 is an explanatory diagram showing a first example of a method for manufacturing a non-contact IC card.

FIG. 25 is an explanatory view showing a second example of the method for manufacturing a non-contact IC card.

FIG. 26 is an explanatory view showing a third example of the method for manufacturing a non-contact IC card.

FIG. 27 is an explanatory view showing a fourth example of the method for manufacturing a non-contact IC card.

FIG. 28 is an explanatory view showing a fifth example of the method for manufacturing a non-contact IC card.

FIG. 29 is an explanatory view showing a sixth example of the method for manufacturing a non-contact IC card.

FIG. 30 is an explanatory view showing a seventh example of the method for manufacturing a non-contact IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 1a Input / output terminal 1b Solder bump 1c Solder 2 Coil 2a Core wire 2b Insulation layer 2c Connection metal layer 3A Thermocompression-bondable synthetic resin sheet (flexible base) 3B Nonwoven fabric (flexible base) 4 Conductive paste or ACF 5 Second Thermocompression-bondable synthetic resin sheet 10 flexible IC module 11 lower mold 12 nonwoven fabric 14, 15 upper mold 41 first cover sheet 43 second cover sheet 45 first heat-meltable sheet 46 second heat-meltable sheet 51, 52 Bonding tool 61a, 61b Electrode 62 Welding head 63a, 63b Ribbon winding reel 64 High resistance tape 65 Motor 71-79 Roller

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Kazuhiko Omichi 1-88 Ushitora, Ibaraki City, Osaka Prefecture Inside Hitachi Maxell Co., Ltd. (72) Kyoichi Obama 1-188 Ushitora, Ibaraki City, Osaka Prefecture F-term (reference) in Hitachi Maxell, Ltd. 2C005 MA12 MA18 MB02 MB10 NA09 NB13 PA33 RA22 5B035 BA05 BB09 CA01 CA23

Claims (41)

[Claims] 1. A flexible IC module, comprising: a flexible base made of a thermocompression-bondable synthetic resin sheet; and a mounting component including at least an IC chip carried on the flexible base. 2. A flexible IC module comprising: a flexible base made of a thermocompression-bondable synthetic resin sheet and a fiber sheet; and a mounting component including at least an IC chip carried on the flexible base. 3. A flexible IC module comprising: a flexible base partly made of a fiber sheet containing an amorphous copolymerized polyester; and a mounting component including at least an IC chip carried by the flexible base part. . 4. The flexible IC module according to claim 1, wherein the thermocompression-bondable synthetic resin sheet is made of a hot-melt adhesive. 5. The flexible IC module according to claim 3, wherein the fiber sheet is made of a composite fiber of a crystalline resin and a non-crystalline copolymerized polyester. 6. The flexible IC module according to claim 5, wherein the conjugate fiber has a non-crystalline copolyester present in at least 50% or more of the fiber surface. IC module. 7. The flexible IC module according to claim 3, wherein the fiber sheet is made of a mixture of a fiber made of a crystalline resin and a fiber made of an amorphous copolymerized polyester. module. 8. The flexible IC module according to claim 2, wherein the fiber sheet is made of a composite fiber of a crystalline resin and a non-crystalline copolymerized polyester. 9. The flexible IC module according to claim 2, wherein the fiber sheet is made of a mixture of a fiber made of a crystalline resin and a fiber made of an amorphous copolymerized polyester. module. 10. The flexible IC module according to claim 2, wherein a woven fabric, a knitted fabric, or a nonwoven fabric having a self-compression bonding property and / or a resin impregnating property is used as the fiber sheet. Flexible IC module. 11. The flexible IC module according to claim 2, wherein the fiber sheet is disposed only on one side of the IC chip. 12. The flexible IC module according to claim 2, wherein the fiber sheet is disposed on both sides of the fiber sheet via the IC chip. 13. The flexible IC module according to claim 1, wherein the mounting component is:
IC chip, IC module, non-contact transmission means of data and / or power, capacitor, resistor, solar cell, liquid crystal display, image display, optical recording medium, magneto-optical recording medium, infrared absorber / infrared light emission A transparent code information display body formed using a body or a phosphor, and at least any one component selected from a magnet or a ferromagnetic material, or a combination of these components with other components Characteristic flexible IC module. 14. The flexible IC according to claim 13,
In the module, a flexible IC module includes, as the mounting component, a non-contact transmission coil for data and / or power directly connected to an IC chip and input / output terminals of the IC chip. 15. The flexible IC according to claim 14,
In the module, as the non-contact transmission coil,
Flexible IC using a wound coil
module. 16. The flexible IC according to claim 15,
In the module, the input / output terminal of the IC chip and both ends of the non-contact transmission coil are directly connected by a wedge bonding method, a soldering method, or a welding method. 17. The flexible IC according to claim 15,
In the module, the non-contact transmission coil is formed using a wire in which a bonding metal layer is coated around a core wire and an insulating layer is coated around the bonding metal layer. Flexible IC module. 18. The flexible IC according to claim 15,
In the module, the non-contact transmission coil is formed by using a wire in which an insulating layer is coated around a core wire. 19. The flexible IC according to claim 15,
In the module, the non-contact transmission coil is formed by using a wire having an insulating layer and an adhesive layer around a core wire. 20. The flexible IC according to claim 14,
In the module, as the non-contact transmission coil,
A flexible IC module, wherein a flat coil formed by etching, printing or plating is used on an IC chip mounting surface of the flexible substrate. 21. The flexible IC module according to claim 1, wherein all or a part of the mounted component is embedded in the flexible base. 22. The flexible IC module according to claim 1, wherein all of the mounted components are embedded in the flexible base, and a surface of the flexible body including a surface of the embedded mounted components; A flexible IC module having a rear surface formed into a flat shape. 23. The flexible IC module according to claim 1, wherein the IC chip is embedded with the input / output terminals facing the flexible substrate. 24. The flexible IC module according to claim 2, wherein the IC chip is embedded with input / output terminals facing the thermocompression-bondable synthetic resin sheet side. 25. The flexible IC module according to claim 1, wherein a cover sheet made of a non-thermocompression-synthetic resin sheet is lined on a back surface of the flexible base. module. 26. A step of arranging a mounting component including at least an IC chip on a flexible base made of a thermocompression-bondable synthetic resin sheet, and introducing a joined body composed of the mounting part and the flexible base into a pressing unit of a press device. Applying heat and pressure to the joined body and thermocompression-bonding each of the members constituting the joined body together. 27. A step of thermocompression-bonding a mounting component including at least an IC chip to one surface of a fiber sheet to obtain an intermediate;
Arranging the intermediate body on a flexible base, introducing a bonded body including the intermediate body and the flexible base into a pressurizing unit of a press device, and applying heat and pressure between the members to form the bonded body; And a step of integrally thermocompression bonding each member constituting the flexible IC module. 28. A step of sandwiching a mounting component including at least an IC chip between two fiber sheets to obtain an intermediate by thermocompression bonding, and disposing the intermediate on a flexible base made of a thermocompression-bondable synthetic resin sheet. Step, and applying a heat and pressure to the joined body by introducing the joined body consisting of these intermediates and the flexible base into the pressurizing unit of the press device,
And a step of integrally thermocompression bonding each member constituting the joined body. 29. A step of arranging a mounting component including at least an IC chip on a flexible base made of a fiber sheet partially containing an amorphous copolymerized polyester, and pressing a joined body including the mounting component and the fiber sheet. Introducing a heat and a pressing force to the joined body by applying the heat and pressure to the joined body, and thermocompression-bonding the respective members constituting the joined body together. . 30. A step of forming a planar coil on one side of a flexible substrate made of a fiber sheet partially containing an amorphous copolymerized polyester, and an IC mounted on a terminal portion of the planar coil.
Arranging the IC chip on the flexible substrate by matching the input / output terminals of the chip, and introducing a bonded body composed of the flexible substrate and the IC chip into a pressurizing portion of a press device to apply heat to the bonded body. And the pressing force to electrically connect the planar coil and the IC chip,
And a step of integrally thermocompression bonding each member constituting the joined body. 31. The method for manufacturing a flexible IC module according to claim 26, wherein the press device is a hot press device or a roll press device. 32. The method of manufacturing a flexible IC module according to claim 26, wherein a non-thermocompression-bondable synthetic resin sheet is lined on a back side of the flexible base, where the IC chip is not thermocompression-bonded. A method for manufacturing a flexible IC module, comprising: 33. A step of interposing a laminate of a plurality of members including a cover sheet and a flexible IC module having a thermocompression bonding synthetic resin sheet between a lower mold and an upper mold of a hot press device; Applying a heat and a pressing force to the laminate by relatively bringing the lower mold and the upper mold closer to each other, and thermocompression-bonding the members constituting the laminate integrally. Manufacturing method. 34. A step of producing a laminate of a plurality of members including a cover sheet and a flexible IC module having a thermocompression-bondable synthetic resin sheet, and introducing the laminate between opposed rollers of a roll press device. Applying heat and pressure to the laminate, and thermocompression-bonding the members constituting the laminate in the process of passing between the rollers. . 35. The method for manufacturing an information carrier according to claim 33, wherein the laminate is a single cover sheet, and a flexible IC laminated on the cover sheet.
A method for manufacturing an information carrier, comprising: a C module. 36. The method for manufacturing an information carrier according to claim 33, wherein the laminate is a first cover sheet, a flexible IC module laminated on the first cover sheet, and the flexible board. A method for manufacturing an information carrier, comprising: a second cover sheet laminated on an IC module. 37. The method for manufacturing an information carrier according to claim 33, wherein the laminate is a first cover sheet, a flexible IC module laminated on the first cover sheet, and the flexible board. Production of an information carrier comprising a second thermocompression-bondable synthetic resin sheet laminated on an IC module and a second cover sheet laminated on the second thermocompression-bondable synthetic resin sheet Method. 38. The method for manufacturing an information carrier according to claim 33, wherein the first cover sheet is non-backed in advance on a back surface side of a thermocompression-bondable synthetic resin sheet constituting the flexible IC module. A method for producing an information carrier, comprising a thermocompression-bondable synthetic resin sheet. 39. The method for manufacturing an information carrier according to claim 37, wherein the second thermocompression-bondable synthetic resin sheet is a hot-melt adhesive formed into a sheet, or a non-heat-formed sheet formed into a sheet. A hot-melt adhesive lined with a press-bondable synthetic resin sheet, a fiber sheet with self-press bonding property, a fiber sheet impregnated with a thermosetting resin, a non-thermo-press bonding synthetic resin sheet impregnated with a thermosetting resin on one side A method for producing an information carrier, comprising using any of the backed fiber sheets. 40. A step of superposing a first heat-fusible sheet, a flexible IC module, and a second heat-fusible sheet on a lower die of a hot press in this order;
Press the upper mold of the hot press device from above the hot-melt sheet to compress the flexible IC module and the laminate comprising the first and second hot-melt sheets in the thickness direction under heating, A step of melting the first and second heat-meltable sheets, and impregnating the flexible IC module with a melt generated by melting the first and second heat-meltable sheets; Hot-press molding the information carrier. 41. A first cover sheet, a first hot-melt sheet and a flexible IC on a lower die of a hot press apparatus.
Superposing the module, the second heat-fusible sheet and the second cover sheet in this order, and pressing the upper die of the hot press device from above the second cover sheet to form these flexible IC modules, A step of compressing the laminate comprising the second heat-meltable sheet and the first and second cover sheets in the thickness direction under heating, and melting the first and second heat-meltable sheets by the energy; And a melt produced by fusing the first and second heat-meltable sheets to a flexible IC.
The module is impregnated, and the first
And hot-pressing the information carrier having a predetermined thickness by bonding the second cover sheet and a second cover sheet.