JPH10211784A - Ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card of a low cost by mass production with excellent durability. SOLUTION: A circuit pattern 4 is formed on a circuit sheet 1, and an IC 5 is mounted on the pattern 4. A heat fusible adhesive sheet 2 and a cover sheet 3 are superposed on the sheet 1, and hot pressed. Then, since the sheet 2 is fused and becomes fluidity, a periphery of the IC 5 is covered with the sheet 2 to protect it without tap, and the sheet 2 is sandwiched between the sheet 1 and the sheet 3 and adhered at both sides. Thus, since the IC card is formed in a simple three layer structure, it has excellent productivity with a low cost and since the IC 5 can be covered with the sheet 2 without gap, its strength against bending is enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card formed by adhering a plurality of layers of sheets, wherein the electronic component can be covered without any gap in order to improve bending strength and the like, and its manufacture. It is about the method.

[0002]

2. Description of the Related Art Generally, an IC card has a first sheet on which electronic components are mounted on one surface on which a circuit pattern is formed, a second sheet mounted on the first sheet for protecting the electronic components, and a second sheet. It often has a three-layer structure including a third sheet mounted on two sheets. The method of manufacturing an IC card having such a layer structure can be roughly classified into a molding method and a lamination method.

In a molding method, a first sheet on which electronic components are mounted is placed in a mold, and a liquid plastic material is poured into the mold to form a second sheet covering the electronic components. The third seat is mounted on the seat. In such a molding method, since at least one layer is molded with a mold, it is difficult to form a thin layer with a mold. Therefore, it is difficult to produce a thin IC card, and it is difficult for a user. Inconvenient to carry. Further, since a time-consuming process of setting an electronic component in a mold and pouring a liquid plastic material is required, it is not suitable for mass production at high speed.

On the other hand, the lamination method is to manufacture an IC card by laminating and bonding a plurality of sheets.
This lamination method is suitable for mass-producing IC cards in large quantities at high speed. For example, Japanese Patent Application Laid-Open No. 8-23036 adopting this lamination method
In Japanese Patent Application Publication No. 7, an IC card having a three-layer structure is manufactured as follows.

That is, a circuit pattern is formed on a sheet by printing means, and electronic components are connected to the circuit pattern by a conductive adhesive. An intermediate sheet made of thermoplastic is placed on the sheet on which the electronic components are mounted, and the sheet and the intermediate sheet are pressed by a compression device having a heating unit. Then, the intermediate sheet softened by the heating is plastically deformed by the pressing force of the compression device so that the electronic component is embedded therein, and is formed into a predetermined thickness in this state. At this time, the sheet and the intermediate sheet are simultaneously compression-bonded. Thereafter, the exterior sheet is bonded onto the intermediate sheet. Thus, an IC card having a three-layer structure is manufactured.

[0006]

In the method of manufacturing an IC card employing the above-described lamination method, the electronic component is embedded in an intermediate sheet to protect the electronic component. The embedding is performed by pressing the intermediate sheet in a heated state against the sheet on which the electronic component is mounted. In other words, the intermediate sheet is made of thermoplastic plastic and becomes softer when heated, so pressing the electronic component against it causes the electronic component to be embedded inside the intermediate sheet, just like pressing the electronic component to viscosity. It becomes to be.

However, since the intermediate sheet made of thermoplastic plastic becomes soft when heated, it does not flow, so it is difficult to cover electronic components without gaps, and it is difficult to cover the electronic parts without gaps. Is left with a void. If a gap exists around the electronic component as described above, when the IC card is bent many times during actual use, the intermediate sheet is easily peeled off from the gap, which causes a reduction in durability.

In addition, the exterior sheet is bonded to the intermediate sheet in a process after the intermediate sheet is mounted on the sheet. In this case, the bonding of the intermediate sheet to the sheet and the bonding of the exterior sheet to the intermediate sheet are performed. Must be performed separately, which reduces the manufacturability.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide an IC card in which the periphery of an electronic component can be filled with a plastic material without any gap, thereby improving durability. Therefore, a second object is to provide an IC card capable of efficiently manufacturing such an IC card.
An object of the present invention is to provide a method for manufacturing a C card.

[0010]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides an IC card having a circuit pattern formed on one side and a circuit sheet on which electronic components are mounted on the circuit pattern. An adhesive sheet formed of a plastic material having fluidity and having a heat melting property, which is mounted on the circuit sheet so as to cover the electronic component, and a cover sheet mounted on the adhesive sheet Adopt configuration.

In the present invention, the term "thermal fusibility" refers to the property of being molten and becoming fluid when heated, and it does not matter whether a thermoplastic is a thermosetting plastic. The temperature at which the electronic component is melted is preferably a temperature at which the electronic component is not adversely affected and the circuit sheet and the cover sheet are not melted. In the above-described means of the present invention, since the adhesive sheet is formed of the above-mentioned heat-fusible plastic, the adhesive sheet becomes fluid when heated, and the fluidity around the electronic component is increased by the fluidity. Penetrate without gaps. Therefore, even if the IC card is bent many times during actual use, the adhesive sheet is hardly peeled off from the circuit sheet, and the durability is improved.

In the IC card of the present invention, it is preferable that the circuit sheet, the adhesive sheet, and the cover sheet are formed of a polyester plastic. Polyester plastics, unlike vinyl chloride plastics, do not generate harmful gases such as chlorine gas when burned. For this reason, when the IC card is discarded, even if it is incinerated, there is no possibility that it will adversely affect the environment.

Further, according to the present invention, the circuit pattern is
It can be formed of a conductive paste made of a polyester-based silver paste. Even with this configuration, the IC
When the card is incinerated, the circuit pattern does not generate harmful gas, and the silver in the paste does not burn and remains as a little slag, so there is no risk of adversely affecting the environment.

Further, according to the present invention, the electronic component can be flip-chip mounted on the circuit pattern using an anisotropic conductive adhesive. By flip-chip mounting the electronic components, the IC card can be made thin. Since the electronic component is covered with the adhesive sheet without any gap as described above, sufficient durability can be achieved even with flip-chip mounting.

In the present invention, a fibrous sheet can be provided on the adhesive sheet at a position corresponding to the electronic component. Since the fibrous sheet increases the tensile strength of the adhesive sheet,
The resistance to bending and the like during actual use of the IC card increases, and the reliability of protection of electronic components increases.

Further, the present invention provides a structure in which the electronic component is covered with a sealing material having a higher thermal melting property than the adhesive sheet, and the adhesive sheet covers the electronic component from outside the sealing material. Can be adopted. In this configuration, since the adhesive sheet having both heat melting property and adhesiveness is relatively soft, covering the electronic component with a harder sealing material can more reliably protect the electronic component. it can.

According to the present invention, in order to manufacture an IC card at low cost, a circuit pattern is formed on one surface, and a circuit sheet having electronic components mounted on the circuit pattern is melted when heated to improve fluidity. An adhesive sheet formed of a plastic material having a heat-fusing property and a cover sheet shall be constituted, and the adhesive sheet and the cover sheet are sequentially laminated on the one surface of the circuit sheet, By heating the adhesive sheet to a molten state, the electronic component is covered with a plastic material forming the adhesive sheet, and the circuit sheet and the cover sheet are adhered to both surfaces of the adhesive sheet. ing.

According to this manufacturing method, the three sheets can be bonded by a simple process of laminating a circuit sheet, an adhesive sheet, and a cover sheet and heating them.
Since the three sheets can be adhered by the adhesiveness of the adhesive sheet itself, there is no need to separately apply an adhesive,
This makes it possible to produce a large number of IC cards at high speed.

Further, the present invention relates to a circuit sheet in which a circuit pattern is formed on one surface of an IC card and electronic components are mounted on the circuit pattern. A sealing material formed of a plastic material and mounted on the circuit sheet so as to cover the electronic component; and a sealing material formed of a material harder than the sealing material and filled with the sealing material. With holes,
A protection sheet attached to the one surface of the circuit sheet;
A cover sheet mounted on the protective sheet may be provided.

In the IC card having this configuration, since the electronic component is directly covered with the sealing material having heat melting property, the electronic component can be covered without any gap. In addition, since a portion except for the sealing material between the circuit sheet and the cover sheet is constituted by a hard protective sheet, it is excellent in bending resistance and the like, and can enhance the durability of the IC card.

Further, according to the present invention, an IC card is formed by forming a circuit pattern on one surface, mounting a circuit sheet on which electronic components are mounted on the circuit pattern, and an amorphous sheet which becomes molten when heated and becomes fluid. And a protective sheet mounted on the circuit sheet so as to cover the electronic component, and a cover sheet mounted on the protective sheet.

According to this means, since the amorphous plastic material is relatively strong in strength and excellent in fluidity in a molten state, a protective sheet having a crystal structure with relatively strong strength is provided. Unlike this, the electronic component can be covered by the protective sheet itself without a gap without separately providing a sealing material.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described specifically with reference to examples. FIGS. 1 to 6 show a first embodiment of the present invention. As shown in FIG. 1, an IC card according to this embodiment has a circuit sheet which is exposed on one side to constitute an exterior of a lower surface of the IC card shown in FIG. 1, an adhesive sheet 2, and a cover sheet 3 constituting an exterior of the upper surface of the IC card in the figure.

The circuit sheet 1 is made of a sheet made of polyester-based plastic, for example, PET (polyethylene terephthalate) having a thickness of about 188 μm, and a coil-shaped circuit pattern 4 is formed on the upper surface thereof as shown in FIG. In addition, an IC 5 as an electronic component connected to the circuit pattern 4 is mounted. The circuit pattern 4 is formed by a screen printing means using a conductive paste, for example, a polyester-based silver paste, and the IC 5 is flipped by an epoxy-based anisotropic conductive adhesive 6 shown in FIG. It is mounted on a chip. In the IC card, the coil-shaped circuit pattern 4 is for inductively coupling the IC 5 with an external device, and data transmission between the two is performed via the circuit pattern 4.

The adhesive sheet 2 is made of a sheet having a thickness of about 400 μm and made of, for example, a polyester-based hot-melt adhesive having a heat-melting property which becomes fluid when heated. The adhesive sheet 2 has a function of protecting the IC 5 and the circuit pattern 4 and adhering itself to the circuit sheet 1 and the cover sheet 3.
It covers the IC 5 and the circuit pattern 4 without gaps.

Here, the thermal fusibility refers to the property of being heated to a molten state and giving fluidity, and the temperature of the molten state does not adversely affect the IC 5, and the circuit sheet 1 and the cover are not melted. Temperature at which the sheet 3 does not melt,
For example, the melting point is preferably 100 to 150 ° C.

The cover sheet 3 is for protecting the relatively soft adhesive sheet 2, and is made of a PET (polyethylene terephthalate) sheet having a thickness of, for example, about 188 μm, like the circuit sheet 1. It is adhered to the upper surface of.

A method of manufacturing such an IC card having a three-layer structure will be described with reference to FIG. First, a circuit pattern 4 is formed on a circuit sheet 1 as shown in FIG.
FIG. 4 shows a procedure for forming the circuit pattern 4. this is,
This is mainly a method for causing both the start end 4a and the end 4b of the coil-shaped circuit pattern 4 to be present inside the circuit pattern 4, and as shown in FIG. The coil pattern 4c is formed by screen printing using a polyester-based silver paste. At this time, the terminal portion 4b of the circuit pattern 4 is formed discontinuously inside the coil pattern 4c.

Then, as shown in FIG. 4B, an insulating film 7 containing polyester-based plastic as a main component is screen-printed on the coil pattern 4c existing between the terminal portion 4b and the outer terminal of the coil pattern 4c. Then, as shown in FIG. 4C, a jumper 4e for connecting the terminal portion 4b and the outer terminal of the coil pattern 4c is formed on the insulating film 7 by screen printing.
As described above, the circuit pattern 4 in which both the start end 4a and the end end 4b exist inside the coil pattern 4c is formed.

After the circuit pattern 4 is formed on the circuit sheet 1 in this manner, the IC 5 is flip-chip mounted on the circuit sheet 1 as shown in FIG. As shown in FIG. 5, the IC 5 is mounted on the circuit sheet 1 by applying an epoxy-based anisotropic conductive adhesive 6 to the start end 4a and the end 4b of the circuit pattern 4 and mounting the IC 5 chip thereon. Put on,
Then, it is performed by thermocompression bonding in which pressure is applied while heating. Then, the bumps 5a of the IC 5 and both ends 4a and 4b of the circuit pattern 4 are electrically connected by the conductive particles 6a in the anisotropic conductive adhesive 6 interposed therebetween, and the IC 5 is connected to the anisotropic conductive adhesive. The adhesive 6 adheres to the circuit sheet 1.

Next, as shown in FIG. 3 (c), the adhesive sheet 2 and the cover sheet 3 are sequentially stacked on the circuit sheet 1 on which the ICs 5 are mounted, and then the whole is thermocompression-bonded by a hot press (not shown). I do. Then, the intermediate adhesive sheet 2 melts and becomes fluid, and as shown in FIG. 3D, the plastic in the molten state covers the entire IC 5 without any gap, and the gap between the circuit patterns 4 Also penetrate without gaps. At the same time, the adhesive sheet 2 is formed into a uniform thickness by pressure from both upper and lower sides, and adheres to the circuit sheet 1 and the cover sheet 3. Then, the adhesive sheet 2 is cured by the subsequent cooling, and the circuit sheet 1 and the
An IC card in which three layers of the adhesive sheet 2 and the cover sheet 3 are strongly bonded is manufactured.

In the above description, the IC cards are manufactured one by one through the above-described procedure. However, in actuality, as shown in FIG. 6, a large number of circuit sheets 1 having a large area are provided. A large number of circuit patterns 4 are formed and ICs 5 are mounted on each of them. Then, the adhesive sheet 2 having a large area and the cover sheet 3 are overlaid and thermocompressed by a hot press device. As shown by the dashed line, a large number of IC cards are cut and separated to obtain IC cards.

As described above, according to this embodiment, the IC card has a simple three-layer structure, and the adhesive sheet 2 as an intermediate layer has the function of protecting the IC 5 and the upper and lower circuit sheets 1 and the cover sheet 3. Since it has a function of adhering the three sheets, there is no need to separately apply an adhesive, and the three sheets 1
Since the three sheets 1 to 3 can be integrated by stacking and thermocompressing the sheets 3 to 3, mass production at a high speed at low cost becomes possible.

In addition, since the intermediate adhesive sheet 2 is formed of a plastic sheet having heat melting property, the intermediate adhesive sheet 2 becomes fluid by heating and easily penetrates into minute gaps around the IC 5. . Therefore, the IC 5 can be covered with the adhesive sheet 2 without any gap, and even when the bending force is repeatedly applied to the IC card by actual use, the adhesive sheet 2 is peeled off from the IC 5 or the circuit sheet 1. And the durability can be prevented as much as possible, resulting in excellent durability.

Further, the circuit sheet 1, the adhesive sheet 2, and the cover sheet 3, which constitute most of the IC card, are all made of polyester plastic, and the circuit pattern 4, the insulating film 7 are also the main components. Is a polyester-based plastic, and the anisotropic conductive adhesive 6 is an epoxy-based plastic. Therefore, when the IC card is incinerated and discarded, no toxic gas is generated, which contributes to environmental conservation.

Other materials included in the IC card include a slight amount of silver contained in the paste constituting the circuit pattern 4, silicon of the IC 5, and trace amounts of conductive particles 6a (for example, nickel) contained in the anisotropic conductive adhesive 6. Particles), which do not burn and remain in the form of fine slag, so that appropriate post-treatment does not adversely affect the environment.

A second embodiment of the present invention will be described with reference to FIG. This figure schematically shows a case where the IC card having the structure shown in the first embodiment is manufactured by a continuous lamination manufacturing method, which will be described below. This description will also clarify the outline of the manufacturing facility. The circuit sheet 1, the adhesive sheet 2, and the cover sheet 3 are each formed in a long strip shape, and are formed into rolls 8 to 10. The circuit sheet 1 is pulled out from the roll 8, and first, the circuit pattern 4 is formed by the screen printing device 11. Thereafter, the circuit sheet 1 is sent to the firing furnace 12, where the paste forming the circuit pattern 4 is dried. Next, the circuit sheet 1 is sent to the mounting device 13, where the IC 5 is mounted.

On the other hand, the adhesive sheet 2 and the cover sheet 3
Are pulled out of the respective rolls 9 and 10 and superimposed on the circuit sheet 1 after the IC 5 has been mounted. The three stacked sheets 1 to 3 are placed in a hot roll device 14.
Where it is heated and pressurized. Thus, the IC 5 is covered with the plastic forming the adhesive sheet 2 without any gap, and the three sheets 1 to 3 are bonded to each other by the adhesive action of the adhesive sheet 2. After this,
The three-layered sheet is sent to the punching press 15, where it is cut into IC cards one by one. The sheet after cutting the IC card is taken up by the take-up roller 16. By adopting such a manufacturing method, IC cards can be manufactured continuously, and higher-volume high-speed manufacturing becomes possible.

FIGS. 8 to 11 show a third embodiment of the present invention. This is because, on the lower and upper surfaces of the IC card manufactured by the procedure described in the first embodiment, the design films 17 and 18 made of PET are bonded to the adhesive films 19 and 20 formed by, for example, a polyester hot melt adhesive.
Are bonded together.

The base material of the design films 17 and 18 is transparent, and a design is printed on one surface thereof. The printed surface is a surface to be bonded to the circuit sheet 1 and the cover sheet 3. In FIG. 10, 17a, 18a
Indicates the printed layer of each of the design films 17 and 18, and the back surface printing prevents the designs applied to the design films 17 and 18 from being rubbed and thinned.
A beautiful feeling can be given forever. The design films 17, 18 have a thickness of, for example, about 50 μm including the print layers 17a, 18a.

The IC card having the design films 17, 18 bonded to both sides is manufactured by the procedure shown in FIG. That is, in the same manner as described in the first embodiment, the circuit pattern 4 is formed on the circuit sheet 1, the IC 5 is mounted, and the adhesive sheet 2 and the cover sheet 3 are mounted on the circuit sheet 1.
Are stacked and thermocompression-bonded, thereby manufacturing the card body 21 (FIGS. 11A to 11D).

Then, as shown in FIG. 11 (e), the adhesive films 19, 20 and the design films 17, 18 are overlaid on the upper and lower surfaces of the card body 21, and thermocompression-bonded. As a result, the adhesive films 19 and 20 are brought into a molten state, and FIG.
The design films 17, 18 are bonded to the card body 21 as shown in FIG. The design may be printed on the lower surface and the upper surface of the card body 21 without printing the design on the design films 17 and 18, and the printing may be protected by the design films 17 and 18. Even in this case, the printed design can be protected by the design films 17 and 18.

Not only the design films 17 and 18 are bonded to the card body 21 so that the printed surface is on the back surface, but also the base materials of the design films 17 and 18 are white and bonded to the card body 21. After that, the design may be printed on the outer surfaces of the design films 17 and 18, or the design film 1 may be printed on the surface in advance.
7 and 18 may be attached to the card body 21. In this case, however, the design is liable to be rubbed and thinned or dirty during use of the IC card, although it is related to the life of the IC card and the rubbing resistance of printing.

FIGS. 12 to 14 show a fourth embodiment of the present invention. This embodiment is different from the first embodiment in that a reinforcing fibrous sheet 22 is sandwiched between the adhesive sheet 2 and the cover sheet 3 at a position corresponding directly above the IC 5. The fibrous sheet 22 is made of, for example, glass fiber or polyester fiber having a thickness of 20 μm. Particularly, the latter made of polyester fiber can be incinerated without generating harmful gas, so that there is no environmental pollution due to disposal. It is preferred in that respect.

The procedure for manufacturing the IC card containing the reinforcing fibrous sheet 22 is as shown in FIG. 14, in which the adhesive sheet 2 and the cover sheet 3 are attached to the circuit sheet 1 on which the IC 5 is mounted.
The steps are the same as those in the first embodiment except that the fibrous sheet 22 is sandwiched between the adhesive sheet 2 and the cover sheet 3 when stacking.

In the thus constructed IC card of this embodiment, when bending, twisting, and pressing force are applied to the IC card during actual use, the bending, twisting, and pressing force are reduced by the tensile force of the fibrous sheet 22. Since a large resistance can be exhibited, the strength of the IC 5 can be increased and the IC 5 can be excellent in durability.

FIG. 15 shows a fifth embodiment of the present invention. This embodiment is different from the first embodiment in that, after the IC 5 is mounted on the circuit sheet 1, for example, an epoxy-based material having heat melting property is used. The plastic encapsulant 23 is heated and melted, and is hung down on the IC 5 to cover around the IC 5. Thereafter, the adhesive sheet 2 and the cover sheet 3 are stacked and hot pressed.

In the IC card of the present embodiment manufactured as described above, the epoxy-based plastic forming the sealing material 23 is harder than the adhesive sheet 2 made of a polyester-based hot melt adhesive. For this reason, since the IC 5 is directly covered with the sealing material 23 that is harder than the adhesive sheet 2, the strength of the IC 5 portion against bending, twisting, and pressing can be increased.

The sealing of the IC 5 of the fourth embodiment with the sealing material 23 can be applied to the case where the design film is adhered to both sides of the card body as in the second embodiment. An application example is shown in a sixth embodiment in FIG. The manufacturing procedure of the sixth embodiment is different from that of the second embodiment in that the step of mounting the IC 5 on the circuit sheet 1 (FIG. 16B) and the bonding sheet 2 and the cover sheet 3 are overlaid on the circuit sheet 1. During the step (FIG. 16D),
Step of covering around IC 5 with sealing material 23 (FIG. 16)
(C)).

FIGS. 17 to 19 show a seventh embodiment of the present invention. In this embodiment, a protective sheet 25 is adhered to the same circuit sheet 1 as in the first embodiment by an adhesive film 24, and a cover sheet similar to that in the first embodiment is further attached to the protective sheet 25 by an adhesive film 26. 3 is bonded.

Here, the protective sheet 25 is a sheet made of PET, and the adhesive films 24 and 26 are formed of a hot-melt adhesive such as a polyethylene hot melt adhesive. Since the protection sheet 25 is inferior in heat melting property, it is difficult to directly cover the IC 5 with the protection sheet 25.
For this reason, a sealing hole 27 for accommodating the IC 5 is formed in the protective sheet 25, and the sealing hole 27 is made of a hot-melt adhesive such as a polyester-based hot-melt adhesive for covering the IC 5 without gap. Is filled with a sealing material 28 made of plastic having.

The manufacturing procedure of the IC card of the seventh embodiment is shown in FIG. 19, and first, a circuit pattern 4 is formed on the circuit sheet 1 in the same manner as in the first embodiment.
(A)), the IC 5 is mounted on the circuit pattern 4 (FIG. 19 (b)). Thereafter, the adhesive film 24 and the protective sheet 25 having the sealing holes 27 formed thereon are sequentially stacked on the circuit sheet 1 and a circular sealing material 28 is fitted into the sealing holes 27 (FIG. 19 (c)) Further, the adhesive film 26 and the cover sheet 3 are stacked on the protective sheet 25,
Thermocompression bonding (FIG. 19C). Thereby, the sealing material 28
Is melted and becomes fluid, so that the sealing material 28 is
5 is covered without any gap, and the inside of the sealing hole 27 is filled. At the same time, the adhesive films 24 and 26 are melted by heat and integrated with the sealing material 28 also melted by heat.
5 and the circuit sheet 1 are bonded together, and the protective sheet 25 and the cover sheet 3 are bonded together.

In this embodiment, the intermediate layer is composed of the relatively hard PET protective sheet 25, so that the intermediate layer is composed of the relatively soft adhesive sheet 2. Compared with the first embodiment, the IC card has a higher resistance to bending and is superior in durability. Further, the circuit sheet 1, the adhesive films 24 and 26, the protection sheet 25,
Since the main constituent parts such as the cover sheet 3 are formed of polyester-based plastic, there is no risk of generating harmful gas when incinerated and disposed.

When manufacturing an IC card having the structure shown in the seventh embodiment, a step of mounting the IC 5 on the circuit sheet 1 as in the eighth embodiment shown in FIG. 20 (FIG. 20B).
Between the step of superposing the protective sheet 25 and the cover sheet on the circuit sheet 1 (FIG. 20D), the periphery of the IC 5 is covered by the sealing material 23 with no gap as in the fifth embodiment shown in FIG. Step (FIG. 20 (c)) is included.
In this way, the IC 5 is covered with the relatively hard sealing material 23, so that the durability can be further improved.

Another method of manufacturing an IC card having the structure shown in the seventh embodiment is shown in FIG. 21 as a ninth embodiment. The difference between the manufacturing method of the ninth embodiment of FIG. 21 and the manufacturing method of the seventh embodiment of FIG. 19 is that after forming the circuit pattern 4 on the circuit sheet 1 (FIG. 21A), The adhesive film 24 and the protection sheet 25 are overlaid and thermocompression bonded, and the protection sheet 25 is bonded to the circuit sheet 1 (FIG. 21B). Thereafter, the sealing hole 2 of the protection sheet 25 is formed.
The IC 5 is connected to the start end 4a and the end 4b of the circuit pattern 4 exposed in the same manner as in the first embodiment (FIG. 21C).

Next, a sealing material 28 is filled in the sealing hole 27 of the protection sheet 25 in a hot-melt state to cover the IC 5 without any gap (FIG. 21D). 26, the cover sheet 3 is overlaid and hot-pressed to adhere the cover sheet 3 to the protective sheet 26 (FIG. 2).
1 (e)).

In this configuration, since the bonding of the protective sheet 25 to the circuit sheet 1 by thermocompression is performed before the mounting of the IC 5, no pressure is applied to the IC 5 during thermocompression. In addition, since the bonding of the protective sheet 25 of the cover sheet 3 by thermocompression bonding is performed after the IC 5 is covered with the sealing material 28, the pressing force by the thermocompression bonding can be received by the sealing material 28 and acts directly on the IC 5 There is no danger. Therefore, there is no possibility that the IC 5 is broken under the influence of the pressing force due to the thermocompression bonding, and the defective rate can be reduced.

FIG. 22 shows a tenth embodiment of the present invention. This embodiment differs from the first embodiment in that an intermediate sheet 29 made of amorphous PET is used in place of the adhesive sheet 2 made of a polyester hot melt adhesive. Amorphous PET
Is excellent in heat melting property and fluidity when melted. Therefore, when the circuit sheet 1, the protection sheet 29, and the cover sheet 3 are bonded by thermocompression bonding, the protection sheet is used. 29 melts and penetrates into the IC 5 and the circuit pattern 4 without any gap. For this reason, unlike the seventh embodiment shown in FIGS. 17 to 19 in which a PET sheet is also used as the protection sheet 25, the protection sheet 29 is not filled with the sealing material 28 by opening the sealing hole 27. I can do it. However, since the amorphous PET has low adhesiveness, it is necessary to insert the adhesive sheets 30 and 31 between the protective sheet 29 and the circuit sheet 1 and the cover sheet 3 and hot press them.

The present invention is not limited to the embodiment described above and shown in the drawings, and the following modifications or extensions are possible. The adhesive sheet 2 for covering the IC 5 and the sealing materials 23 and 28 are not limited to thermoplastics such as polyester hot-melt adhesives. What is necessary is just to be in a molten state.

The circuit sheet 1, the cover sheet 3, and the protective sheet 25 are made of the same polyester PE instead of PET.
N (polyethylene naphthalate), PEN
In this case, the heat resistance of the IC card can be improved due to its nature. The sealing materials 23 and 28 are not limited to polyester-based plastics, but may be epoxy-based plastics. The reinforcing fibrous sheet 22 is not limited to those formed of polyester fibers, but may be formed of other plastic fibers, for example, acetate fibers, or may be woven with thin metal wires. However, in the case of using a thin metal wire, it is preferable to use as little as possible in consideration of the communication performance with external devices and the influence on the environment.

The reinforcing fibrous sheet 22 has not only a structure inserted between the adhesive sheet 2 and the cover sheet 3 but also an IC
5 may be embedded in the adhesive sheet 2 by covering the fibrous sheet 22. Further, the reinforcing fibrous sheet 22 may be embedded in the adhesive sheet 2 in advance, and the fibrous sheet may be embedded in the entire adhesive sheet 2 or only in a portion corresponding to the IC 5. Is also good. The anisotropic conductive adhesive 6 is not limited to an epoxy-based adhesive, but may be a polyester-based adhesive, which has a less adverse effect on the environment at the time of disposal.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an IC card showing a first embodiment of the present invention.

FIG. 2 is an exploded perspective view.

FIG. 3 is a process chart showing a method of manufacturing an IC card.

FIG. 4 is a process chart showing a method of forming a circuit pattern on a circuit sheet.

FIG. 5 is a sectional view showing a mounted state of the IC.

FIG. 6 is a perspective view of manufacturing a large number of IC cards.

FIG. 7 is a schematic manufacturing process diagram of an IC card showing a second embodiment of the present invention.

FIG. 8 is a sectional view of an IC card showing a third embodiment of the present invention.

FIG. 9 is an exploded perspective view of an IC card.

FIG. 10 is a partially enlarged sectional view.

FIG. 11 is a process chart showing a method of manufacturing an IC card.

FIG. 12 is a sectional view of an IC card showing a fourth embodiment of the present invention.

FIG. 13 is an exploded perspective view.

FIG. 14 is a process chart showing a manufacturing method.

FIG. 15 is a process chart of a manufacturing method showing a fifth embodiment of the present invention.

FIG. 16 is a process chart of a manufacturing method showing a sixth embodiment of the present invention.

FIG. 17 is a sectional view showing a seventh embodiment of the present invention.

FIG. 18 is an exploded perspective view.

FIG. 19 is a process chart showing a manufacturing method.

FIG. 20 is a process chart of a manufacturing method showing an eighth embodiment of the present invention.

FIG. 21 is a process chart of a manufacturing method showing a ninth embodiment of the present invention.

FIG. 22 is a process chart of a manufacturing method showing a tenth embodiment of the present invention.

[Explanation of symbols]

In the figure, 1 is a circuit sheet, 2 is an adhesive sheet, 3 is a cover sheet, 4 is a circuit pattern, 5 is an IC (electronic component), 6 is an anisotropic conductive adhesive, 17 and 18 are design films, 19 and
Reference numeral 20 denotes an adhesive film, 22 denotes a fibrous sheet, 23 denotes a sealing material, 27 denotes a sealing hole, and 28 denotes a sealing material.

Claims (9)

[Claims] 1. A circuit sheet having a circuit pattern formed on one surface and electronic components mounted on the circuit pattern, and a circuit sheet formed of a heat-meltable plastic material which becomes molten when heated and has fluidity. An IC card comprising: an adhesive sheet mounted on a sheet so as to cover the electronic component; and a cover sheet mounted on the adhesive sheet. 2. The IC card according to claim 1, wherein the circuit sheet, the adhesive sheet and the cover sheet are formed of a polyester plastic. 3. The IC card according to claim 1, wherein the circuit pattern is formed of a conductive paste made of a polyester-based silver paste. 4. The I according to claim 1, wherein the electronic component is flip-chip mounted on the circuit pattern using an anisotropic conductive adhesive.
C card. 5. The IC card according to claim 1, wherein a fibrous sheet is provided on the adhesive sheet at a position corresponding to the electronic component. 6. The electronic component is covered with a sealing material having a higher thermal fusibility than the adhesive sheet, and the adhesive sheet covers the electronic component from outside the sealing material. The IC card according to claim 1, wherein 7. A circuit sheet having a circuit pattern formed on one surface and electronic components mounted on the circuit pattern, and an adhesive sheet formed of a heat-meltable plastic material which becomes molten and becomes fluid when heated. And an IC card comprising a cover sheet, wherein the adhesive sheet and the cover sheet are sequentially laminated on the one surface of the circuit sheet, and the adhesive sheet is heated to be in a molten state. A method of manufacturing an IC card, wherein the electronic component is covered with a plastic material forming an adhesive sheet, and the circuit sheet and the cover sheet are adhered to both surfaces of the adhesive sheet. 8. A circuit sheet having a circuit pattern formed on one surface and electronic components mounted on the circuit pattern, and a circuit sheet formed of a heat-meltable plastic material which becomes molten and becomes fluid when heated. A sealing material mounted on the sheet so as to cover the electronic component, and a material harder than the sealing material;
An IC card having a sealing hole filled with the sealing material, a protection sheet mounted on the one surface of the circuit sheet, and a cover sheet mounted on the protection sheet. 9. A circuit sheet having a circuit pattern formed on one surface thereof and an electronic component mounted on the circuit pattern; and a circuit sheet formed of an amorphous plastic material which becomes molten and becomes fluid when heated. An IC card comprising: a protection sheet mounted on a circuit sheet so as to cover the electronic component; and a cover sheet mounted on the protection sheet.