US20090021352A1 - Radio frequency ic device and electronic apparatus - Google Patents

Radio frequency ic device and electronic apparatus Download PDF

Info

Publication number
US20090021352A1
US20090021352A1 US12/235,753 US23575308A US2009021352A1 US 20090021352 A1 US20090021352 A1 US 20090021352A1 US 23575308 A US23575308 A US 23575308A US 2009021352 A1 US2009021352 A1 US 2009021352A1
Authority
US
United States
Prior art keywords
radio frequency
frequency ic
electrode
circuit board
ic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/235,753
Inventor
Takeshi Kataya
Noboru Kato
Satoshi Ishino
Nobuo IKEMOTO
Ikuhei KIMURA
Yuya DOKAI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2007-186392 priority Critical
Priority to JP2007186392 priority
Priority to US11/851,661 priority patent/US7830311B2/en
Priority to PCT/JP2008/052129 priority patent/WO2009011144A1/en
Priority to PCT/JP2008/055962 priority patent/WO2009011154A1/en
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to US12/235,753 priority patent/US20090021352A1/en
Assigned to MURATA MANUFACTURING CO., LTD. reassignment MURATA MANUFACTURING CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIMURA, IKUHEI, ISHINO, SATOSHI, DOKAI, YUYA, IKEMOTO, NOBUO, KATAYA, TAKESHI, KATO, NOBORU
Publication of US20090021352A1 publication Critical patent/US20090021352A1/en
Application status is Abandoned legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/48Earthing means; Earth screens; Counterpoises
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/0239Signal transmission by AC coupling
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/0243Printed circuits associated with mounted high frequency components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q2213/00Indexing scheme relating to selecting arrangements in general and for multiplex systems
    • H04Q2213/13095PIN / Access code, authentication
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10098Component for radio transmission, e.g. Radio Frequency Identification Tag [RFID]

Abstract

A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to radio frequency IC devices, and, more particularly, to a radio frequency IC device including a radio frequency IC chip used in an RFID (Radio Frequency Identification) system and an electronic apparatus including the radio frequency IC device.
  • 2. Description of the Related Art
  • Recently, an RFID system has been developed as a product management system in which a reader/writer arranged to generate an induction field communicates with an IC chip (hereinafter also referred to as an IC tag or a radio frequency IC chip) attached to a product or a case in a non-contact manner so as to obtain predetermined information stored in the IC chip.
  • Japanese Unexamined Patent Application Publication (Translation of PCT Application) No. 11-515094 discloses an RFID tag including an IC chip mounted on the main surface of a printed circuit board and an antenna provided in the printed circuit board. In this RFID tag, the antenna and the IC chip are electrically connected to each other. The miniaturization of the RFID tag is achieved by providing the antenna in the printed circuit board.
  • However, the number of manufacturing processes required to produce the RFID tag is increased in order to prepare the dedicated antenna, and a space is required for the dedicated antenna. This leads to increases in the manufacturing cost and size of the RFID tag. As illustrated in FIG. 2 in Japanese Unexamined Patent Application Publication (Translation of PCT Application) No. 11-515094, the number of manufacturing processes is increased especially if an antenna having a meander shape is formed, since internal electrodes included in a plurality of layers must be processed. Furthermore, in order to achieve the impedance matching between the IC chip and the antenna, a matching section is required. If the matching section is disposed between the antenna and the IC chip, the size of the antenna is increased. Furthermore, if the IC chip is modified, the shape of the antenna must be changed.
  • SUMMARY OF THE INVENTION
  • To overcome the problems described above, preferred embodiments of the present invention provide a small radio frequency IC device capable of easily achieving impedance matching without using a dedicated antenna and an electronic apparatus including the radio frequency IC device.
  • A radio frequency IC device according to a first preferred embodiment of the present invention includes a radio frequency IC chip arranged to process a transmitted/received signal, a circuit board on which the radio frequency IC chip is mounted, an electrode arranged on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is coupled to the radio frequency IC chip and the electrode.
  • A radio frequency IC device according to a second preferred embodiment of the present invention includes an electromagnetic coupling module including a radio frequency IC chip arranged to process a transmitted/received signal and a power supply circuit board that includes an inductance element coupled to the radio frequency IC chip, a circuit board on which the electromagnetic coupling module is mounted, an electrode arranged on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is coupled to the power supply circuit board and the electrode.
  • In the radio frequency IC device according to the first preferred embodiment, a radio frequency IC chip or a power supply circuit board is preferably coupled to an electrode arranged at a circuit board, for example, a ground electrode via a loop electrode. The electrode arranged on the circuit board functions as a radiation plate (an antenna) for the radio frequency IC chip. That is, the electrode receives a signal, and the radio frequency IC chip receives the signal from the electrode via the loop electrode and is operated by the received signal. A response signal output from the radio frequency IC chip is transmitted to the electrode via the loop electrode, and is then emitted from the electrode to the outside. Accordingly, a dedicated antenna is not required, and a space is not required for the dedicated antenna. The loop electrode can perform the impedance matching between the radio frequency IC chip and the electrode. Accordingly, a matching section is not necessarily required. Therefore, the efficiency of signal transmission between the radio frequency IC chip and the electrode is improved.
  • In a radio frequency IC device according to the second preferred embodiment, a power supply circuit board is disposed between a radio frequency IC, for example, a radio frequency IC chip and a loop electrode. This power supply circuit board includes a resonance circuit including an inductance element and/or a matching circuit. A frequency to be used is set by the resonance circuit and/or the matching circuit. If the radio frequency IC chip is changed in accordance with a frequency used by an RFID system, only a change in design of the resonance circuit and/or the matching circuit is required. It is not necessary to change the shape, size, and/or location of a radiation plate (electrode) or the state of coupling between the loop electrode and the electrode or the power supply circuit board. The resonance circuit and/or the matching circuit can also function to achieve the impedance matching between the radio frequency IC chip and the electrode. Accordingly, the efficiency of signal transmission between the radio frequency IC chip and the electrode is improved.
  • In the radio frequency IC device, the loop electrode is preferably coupled to the radio frequency IC chip or the power supply circuit board may preferably include a plurality of layers included in a multilayer circuit board.
  • The radio frequency IC chip stores various pieces of information about a product to which the radio frequency IC device is attached, and, furthermore, may be a re-writable radio frequency IC chip. That is, the radio frequency IC chip may have an information processing function in addition to an RFID system function.
  • According to preferred embodiments of the present invention, an existing electrode included in a circuit board can preferably be used as an antenna. Since a dedicated antenna is not required, a radio frequency IC device and an apparatus including the radio frequency IC device can be miniaturized. A resonance circuit and/or a matching circuit included in a loop electrode and/or a power supply circuit board may have an impedance matching function. Accordingly, a matching section is not necessarily required.
  • Other features, elements, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the present invention with reference to the attached drawings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1A is a plan view of a radio frequency IC device according to a first preferred embodiment of the present invention.
  • FIG. 1B is a cross-sectional view in a lengthwise direction of the radio frequency IC device according to the first preferred embodiment of the present invention.
  • FIG. 2 is a perspective view of a radio frequency IC chip.
  • FIG. 3A is a plan view of a radio frequency IC device according to a second preferred embodiment of the present invention.
  • FIG. 3B is a cross-sectional view in a lengthwise direction of the radio frequency IC device according to the second preferred embodiment of the present invention.
  • FIG. 4A is a plan view of a radio frequency IC device according to a third preferred embodiment of the present invention.
  • FIG. 4B is a cross-sectional view in a lengthwise direction of the radio frequency IC device according to the third preferred embodiment of the present invention.
  • FIG. 4C is a cross-sectional view in a widthwise direction of the radio frequency IC device according to the third preferred embodiment of the present invention.
  • FIG. 5A is a plan view of a radio frequency IC device according to a fourth preferred embodiment of the present invention.
  • FIG. 5B is a cross-sectional view in a lengthwise direction of the radio frequency IC device according to the fourth preferred embodiment of the present invention.
  • FIG. 6A is a plan view of a radio frequency IC device according to a fifth preferred embodiment of the present invention.
  • FIG. 6B is a cross-sectional view in a lengthwise direction of the radio frequency IC device according to the fifth preferred embodiment of the present invention.
  • FIG. 6C is a cross-sectional view in a widthwise direction of the radio frequency IC device according to the fifth preferred embodiment of the present invention.
  • FIG. 7A is a plan view of a radio frequency IC device according to a sixth preferred embodiment of the present invention.
  • FIG. 7B is a cross-sectional view in a lengthwise direction of the radio frequency IC device according to the sixth preferred embodiment of the present invention.
  • FIG. 8A is a plan view of a radio frequency IC device according to a seventh preferred embodiment of the present invention.
  • FIG. 8B is a cross-sectional view in a lengthwise direction of the radio frequency IC device according to the seventh preferred embodiment of the present invention.
  • FIG. 9 is an exploded plan view of a circuit board of a radio frequency IC device according to an eighth preferred embodiment of the present invention.
  • FIG. 10 is an exploded plan view of a circuit board of a radio frequency IC device according to a ninth preferred embodiment of the present invention.
  • FIG. 11 is a plan view of a circuit board of a radio frequency IC device according to a tenth preferred embodiment of the present invention.
  • FIG. 12 is a plan view illustrating a main portion of a circuit board of a radio frequency IC device according to an eleventh preferred embodiment of the present invention.
  • FIG. 13 is an exploded plan view of a circuit board of a radio frequency IC device according to a twelfth preferred embodiment of the present invention.
  • FIG. 14 is an exploded plan view of a circuit board of a radio frequency IC device according to a thirteenth preferred embodiment of the present invention.
  • FIG. 15 is an exploded perspective view of a power supply circuit board including a first exemplary resonance circuit.
  • FIG. 16 is a plan view of a power supply circuit board including a second exemplary resonance circuit.
  • FIG. 17 is a perspective view of a mobile telephone that is an electronic apparatus according to a preferred embodiment of the present invention.
  • FIG. 18 is a diagram describing a printed circuit board included in the mobile telephone.
  • DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
  • A radio frequency IC device and an electronic apparatus according to preferred embodiments of the present invention will be described below with reference to the accompanying drawings. In the drawings, the same numerals are used for similar components and portions so as to avoid repeated explanation.
  • First Preferred Embodiment
  • FIGS. 1A and 1B are diagrams illustrating a radio frequency IC device according to the first preferred embodiment of the present invention. This radio frequency IC device includes a radio frequency IC chip 5 arranged to process a transmitted/received signal of a predetermined frequency, a printed circuit board 20 on which the radio frequency IC chip 5 is mounted, and a ground electrode 21 and a loop electrode 22 which are arranged on the printed circuit board 20. Each of the ground electrode 21 and the loop electrode 22 is formed on the main surface of the printed circuit board 20 preferably by applying coating of conductive paste thereto or by etching metal foil on the printed circuit board 20.
  • The radio frequency IC chip 5 includes a clock circuit, a logic circuit, and a memory circuit, and stores necessary information. As illustrated in FIG. 2, input-output terminal electrodes 6 and mounting terminal electrodes 7 are provided on the undersurface of the radio frequency IC chip 5. One of the input-output terminal electrodes 6 is electrically connected to a connection electrode 22 a disposed at one end of the loop electrode 22 via a metal bump 8, and the other one of the input-output terminal electrodes 6 is electrically connected to a connection electrode 22 b disposed at the other end of the loop electrode 22 via the metal bump 8. A pair of connection electrodes 22 c and 22 d is disposed on the printed circuit board 20. One of the mounting terminal electrodes 7 of the radio frequency IC chip 5 is connected to the connection electrode 22 c via the metal bump 8, and the other one of the mounting terminal electrodes 7 is connected to the connection electrode 22 d via the metal bump 8.
  • The loop electrode 22 is arranged near the edge of the ground electrode 21 in the horizontal direction, whereby the loop electrode 22 and the ground electrode 21 are coupled to each other by electric field coupling. That is, by arranging the loop electrode 22 near the ground electrode on the same surface, a loop magnetic field H (denoted by a dotted line in FIG. 1A) is generated from the loop electrode 22 in the vertical direction. The generated loop magnetic field H enters the ground electrode 21 substantially at right angles, so that a loop electric field E (denoted by an alternate long and short dashed line in FIG. 1A) is excited. The loop electric field E induces another loop magnetic field H. Thus, the loop electric field E and the loop magnetic field H are generated on the entire surface of the ground electrode 21, so that a high-frequency signal is emitted. As described above, by arranging the ground electrode 21 and the loop electrode 22 close to each other on the same main surface while providing the electrical isolation between them, the electromagnetic field coupling therebetween is effectively achieved. Consequently, a radiation characteristic is improved.
  • The electromagnetic coupling between the loop electrode 22 and the ground electrode 21 enables a high-frequency signal received by the ground electrode 21 from a reader/writer to be transmitted to the radio frequency IC chip 5 via the loop electrode 22 so as to activate the radio frequency IC chip 5, and enables a response signal output from the radio frequency IC chip 5 to be transmitted to the ground electrode 21 via the loop electrode 22 and then be emitted from the ground electrode 21 toward the reader-writer.
  • The ground electrode 21 may preferably be defined by an existing component included in the printed circuit board 20 of an electronic apparatus containing the radio frequency IC device. Alternatively, a ground electrode used for another electronic component included in an electronic apparatus may be used as the ground electrode 21, for example. Accordingly, in this radio frequency IC device, a dedicated antenna is not required, and a space is not required for the antenna. Furthermore, since a large ground electrode 21 is used, a radiation characteristic is improved.
  • By controlling the length and width of the loop electrode 22 and the space between the loop electrode 22 and the ground electrode 21, the impedance matching between the radio frequency IC chip 5 and the ground electrode 21 can be achieved.
  • Second Preferred Embodiment
  • FIGS. 3A and 3B are diagrams illustrating a radio frequency IC device according to the second preferred embodiment of the present invention. This radio frequency IC device is substantially the same as a radio frequency IC device according to the first preferred embodiment. The ground electrode 21 and the loop electrode 22 are disposed on the bottom surface of the printed circuit board 20. Connection electrodes 24 a to 24 d are provided on the surface of the printed circuit board 20. The connection electrodes 24 a and 24 b are electrically connected through a via-hole conductor 23 to one end of the loop electrode 22 and the other end of the loop electrode 22, respectively. The connection electrodes 24 a to 24 d correspond to the connection electrodes 22 a to 22 d illustrated in FIGS. 1A and 1B. One of the input-output terminal electrodes 6 (see FIG. 2) is preferably electrically connected to the connection electrode 24 a via the metal bump 8, for example, and the other one of the input-output terminal electrodes 6 is preferably electrically connected to the connection electrode 24 b via the metal bump 8, for example. One of the mounting terminal electrodes 7 (see, FIG. 2) is preferably connected to the connection electrode 24 c via the metal bump 8, for example, and the other one of the mounting terminal electrodes 7 is preferably connected to the connection electrode 24 d via the metal bump 8, for example.
  • The ground electrode 21 and the loop electrode 22 are coupled in substantially the same manner as that described in the first preferred embodiment. The operational advantages of a radio frequency IC device according to the second preferred embodiment are substantially the same as those of a radio frequency IC device according to the first preferred embodiment. In this preferred embodiment, a large space for another electronic component can be obtained on the upper surface of the circuit board 20.
  • Third Preferred Embodiment
  • FIGS. 4A to 4C are diagrams illustrating a radio frequency IC device according to the third preferred embodiment of the present invention. In this radio frequency IC device, a loop electrode 25 includes connection electrodes 25 a and 25 b disposed on the surface of the printed circuit board 20, via-hole conductors 28, and an internal electrode 29. The loop electrode 25 is coupled to the ground electrode 21 disposed on the bottom surface of the printed circuit board 20 by electric field coupling. The connection electrodes 25 a and 25 b are preferably electrically connected via the metal bump 8 to the terminal electrodes 6 (see, FIG. 2). Connection electrodes 25 c and 25 d are electrically connected via the metal bump 8 to the terminal electrodes 7 (see, FIG. 2).
  • The loop electrode 25 is arranged near the ground electrode 21 in the vertical direction, and is coupled to the ground electrode 21 by electric field coupling. That is, a magnetic flux is generated from the loop electrode 25 near the surface on which the ground electrode 21 is arranged, and an electric field that intersects the magnetic field substantially at right angles is generated from the ground electrode 21. As a result, an electric field loop is excited on the ground electrode 21. The excited electric field loop generates a magnetic field loop. Thus, the electric field loop and the magnetic field loop are generated on substantially the entire surface of the ground electrode 21, such that a high-frequency signal is emitted. That is, by arranging the loop electrode 25 near the ground electrode 21 in the vertical direction while providing the electric isolation between the loop electrode 25 and the ground electrode 21, the flexibility in the placement of the loop electrode 25 can be increased.
  • The operation and operational advantages of a radio frequency IC device according to the third preferred embodiment are substantially the same as those of a radio frequency IC device according to the first preferred embodiment. In this preferred embodiment, since the loop electrode 25 is disposed in the printed circuit board 20, interference caused by the penetration of a magnetic field from the outside can be prevented. The ground electrode 21 may be formed in the printed circuit board 20. In this case, since a large space can be obtained on the main surface and the bottom surface of the printed circuit board 20, another line or another electronic component may be disposed thereon so as to increase the packing density.
  • Fourth Preferred Embodiment
  • FIGS. 5A and 5B are diagrams illustrating a radio frequency IC device according to the fourth preferred embodiment of the present invention. This radio frequency IC device includes a loop electrode 31 obtained by providing a cutout 21 a at one side of the ground electrode 21 disposed on the surface of the printed circuit board 20. Connection electrodes 31 a and 31 b are electrically connected via the metal bump 8 to one of the input-output terminal electrodes 6 (see, FIG. 2) and the other one of the input-output terminal electrodes 6, respectively. Connection electrodes 31 c and 31 d provided on the surface of the printed circuit board 20 are electrically connected via the metal bump 8 to the mounting terminal electrodes 7 (see, FIG. 2) of the radio frequency IC chip 5.
  • In the fourth preferred embodiment, the loop electrode 31 is electrically coupled to the ground electrode 21. The radio frequency IC chip 5 is coupled to the ground electrode 21 via the loop electrode 31 arranged therebetween. The operation and operational advantages of a radio frequency IC device according to the fourth preferred embodiment are substantially the same as those of a radio frequency IC device according to the first preferred embodiment.
  • Fifth Preferred Embodiment
  • FIGS. 6A to 6C are diagrams illustrating a radio frequency IC device according to the fifth preferred embodiment of the present invention. Similar to a radio frequency IC device according to the fourth preferred embodiment, in this radio frequency IC device, the ground electrode 21 is electrically coupled to a loop electrode 32. More specifically, the loop electrode 32 includes connection electrodes 33 a and 33 b disposed on the surface of the printed circuit board 20 and via-hole conductors 34. The ground electrode 21 is disposed on the bottom surface of the printed circuit board 20. The upper end of one of the via-hole conductors 34 is electrically connected to the connection electrode 33 a, and the upper end of the other one of the via-hole conductors 34 is electrically connected to the connection electrode 33 b. The lower ends of the via-hole conductors 34 are electrically connected to the ground electrode 21. The connection electrodes 33 a and 33 b are electrically connected via the metal bump 8 to the terminal electrodes 6 (see, FIG. 2) of the radio frequency IC chip 5. Connection electrodes 33 c and 33 d are electrically connected via the metal bump 8 to the terminal electrodes 7 (see, FIG. 2) of the radio frequency IC chip 5.
  • In the fifth preferred embodiment, the loop electrode 32 is electrically coupled to the ground electrode 21. The radio frequency IC chip 5 and the ground electrode 21 are coupled to each other via the loop electrode 32 disposed therebetween. The operation and operational advantages of a radio frequency IC device according to the fifth preferred embodiment are substantially the same as those of a radio frequency IC device according to the first preferred embodiment.
  • Sixth Preferred Embodiment
  • FIGS. 7A and 7B are diagrams illustrating a radio frequency IC device according to the sixth preferred embodiment of the present invention. In this radio frequency IC device, an electromagnetic coupling module 1 is provided by mounting the radio frequency IC chip 5 on a power supply circuit board 10. The electromagnetic coupling module 1 is electrically connected to a loop electrode 35 provided on the printed circuit board 20. Similar to the loop electrode 22 described in the first preferred embodiment, the loop electrode 35 is arranged near the ground electrode 21 provided on the surface of the printed circuit board 20, whereby the loop electrode 35 and the ground electrode 21 are coupled to each other by magnetic field coupling.
  • One of the input-output terminal electrodes 6 of the radio frequency IC chip 5, which are illustrated in FIG. 2, and the other one of the input-output terminal electrodes 6 are electrically connected via the metal bump 8 to electrodes 12 a and 12 b (see, FIGS. 15 and 16) provided on the surface of the power supply circuit board 10. One of the mounting terminal electrodes 7 of the radio frequency IC chip 5 and the other one of the mounting terminal electrodes 7 are electrically connected via the metal bump 8 to electrodes 12 c and 12 d. A protection film 9 is disposed between the surface of the power supply circuit board 10 and the bottom surface of the radio frequency IC chip 5 so as to improve the bonding strength between the power supply circuit board 10 and the radio frequency IC chip 5.
  • The power supply circuit board 10 includes a resonance circuit (not illustrated in FIGS. 7A and 7B) including an inductance element. Outer electrodes 19 a and 19 b (see, FIGS. 15 and 16) are provided on the bottom surface of the power supply circuit board 10, and the connection electrodes 12 a to 12 d (see, FIGS. 15 and 16) are provided on the surface of the power supply circuit board 10. The outer electrodes 19 a and 19 b are electromagnetically coupled to the resonance circuit included in the power supply circuit board 10, and are electrically connected to connection electrodes 35 a and 35 b of the loop electrode 35, respectively, with an electroconductive adhesive (not illustrated), for example. Alternatively, such electrical connection may be established by soldering.
  • That is, the power supply circuit board 10 includes a resonance circuit having a predetermined resonance frequency so as to transmit a transmission signal of a predetermined frequency output from the radio frequency IC chip 5 to the ground electrode 21 via the outer electrodes 19 a and 19 b and the loop electrode 35, or select a received signal of a predetermined frequency from among signals received by the ground electrode 21 and supply the selected received signal to the radio frequency IC chip 5. Accordingly, in this radio frequency IC device, the radio frequency IC chip 5 is operated by a signal received by the ground electrode 21, and a response signal output from the radio frequency IC chip 5 is emitted from the ground electrode 21.
  • In the electromagnetic coupling module 1, the outer electrodes 19 a and 19 b provided on the bottom surface of the power supply circuit board 10 are coupled to the resonance circuit included in the power supply circuit board 10 by electromagnetic field coupling, and are electrically connected to the loop electrode 35 that is coupled to the ground electrode 21 defining an antenna by electric field coupling. In this preferred embodiment, since a relatively large antenna element is not required as a separate component, the size of the electromagnetic coupling module 1 can be reduced. Furthermore, the size of the power supply circuit board 10 can be reduced. Accordingly, IC mounters that have been widely used can be used to mount the radio frequency IC chip 5 on the power supply circuit board 10. This reduces the cost of mounting. When a frequency band to be used is changed, only the design of the resonance circuit needs to be changed.
  • An inductance element alone may be used as an element provided in the power supply circuit board 10. The inductance element has a function of achieving the impedance matching between the radio frequency IC chip 5 and a radiation plate (the ground electrode 21).
  • Seventh Preferred Embodiment
  • FIGS. 8A and 8B are diagrams illustrating a radio frequency IC device according to the seventh preferred embodiment of the present invention. Similar to a radio frequency IC device according to the sixth preferred embodiment, in this radio frequency IC device, the electromagnetic coupling module 1 is formed by mounting the radio frequency IC chip 5 on the power supply circuit board 10. The electromagnetic coupling module 1 is electrically connected to a loop electrode 36 provided on the printed circuit board 20. Similar to the loop electrode 31 described in the fourth preferred embodiment, the loop electrode 36 is obtained by forming the cutout 21 a at one side of the ground electrode 21. Connection electrodes 36 a and 36 b are electrically connected to the outer electrodes 19 a and 19 b provided on the bottom surface of the power supply circuit board 10, with a conductive adhesive (not illustrated), for example. In the seventh preferred embodiment, the structure and operation of the power supply circuit board 10 are substantially the same as those described in the sixth preferred embodiment, and the operation of the loop electrode 36 is substantially the same as that described in the fourth preferred embodiment.
  • Eighth Preferred Embodiment
  • FIG. 9 is an exploded view of a printed circuit board 40 included in a radio frequency IC device according to the eighth preferred embodiment of the present invention. The printed circuit board 40 is a multilayer board in which a plurality of dielectric layers or magnetic layers are laminated. Loop electrodes 51A to 51D are provided on a first layer 41A defining the surface of the printed circuit board 40, a second layer 41B, a third layer 41C, and a fourth layer 41D defining the bottom surface of the printed circuit board 40.
  • Similar to the loop electrode described in the fourth preferred embodiment (see, FIGS. 5A and 5B), the loop electrodes 51A to 51D are obtained by providing cutouts 50 a to 50 d at ground electrodes 50A to 50D provided on the layers 41A to 41D. Connection electrodes 52 a and 52 b of the loop electrode 51A provided on the first layer 41A are respectively electrically connected to the input-output terminal electrodes 6 of the radio frequency IC chip 5, or are electromagnetically coupled to the power supply circuit board 10 (the electromagnetic coupling module 1). The ground electrodes 50A to 50D may be electrically connected to each other through via-hole conductors. An electrode functioning as an antenna may not necessarily be a ground electrode.
  • Referring to FIGS. 1A and 1B, the loop electrode 22 is preferably used so as to cause the ground electrode 21 to function as an antenna, and the loop electrode 22 has an impedance conversion function. More specifically, the loop electrode 22 has an impedance between the connection electrodes 22 a and 22 b which is determined by the shape of the loop. A current corresponding to a signal transmitted from the radio frequency IC chip 5 or the power supply circuit board 10 coupled to the connection electrodes 22 a and 22 b flows along the loop.
  • The impedance (Z) between the connection electrodes 22 a and 22 b is represented by the sum of a real part and an imaginary part (X). As the size of the loop electrode 22 is reduced, the length of a current path is reduced. As the length of the current path is reduced, the resistance generated at the loop electrode 22 and the impedance (X=ωL) of an inductance (L) generated by a current passing through the path are reduced. If a space for the loop electrode 22 is reduced in accordance with the miniaturization of an apparatus, such as a mobile telephone, for example, the impedance of the loop electrode 22 is significantly reduced. This produces a large impedance difference between the loop electrode 22 and a radio frequency IC chip or a power supply (resonance/matching) circuit. Consequently, sufficient electric power cannot be supplied from the radio frequency IC chip 5 or the power supply circuit to a radiation plate.
  • In order to solve this problem, a higher impedance (Z) must be set for the loop electrode 22, that is, the real part or the imaginary part (X) must be increased. The eighth to thirteenth preferred embodiments solve such a problem. Accordingly, in the eighth preferred embodiment, the ground electrode 50A functions as an antenna and provides the same operational advantages as those described in the first preferred embodiment. Furthermore, in the eighth preferred embodiment, the size of the loop electrode 51A, which is provided on the first layer 41A and coupled to the radio frequency IC chip 5 or the power supply circuit board 10, is greater than that of the other loop electrodes, that is, the loop electrodes 51B to 51D. Accordingly, the length of a current path passing through the loop electrode 51A at the time of communication is increased, the resistance is increased, and the real part is increased. As a result, a higher impedance (Z) is obtained.
  • Ninth Preferred Embodiment
  • FIG. 10 is an exploded view of the printed circuit board 40 included in a radio frequency IC device according to the ninth preferred embodiment of the present invention. A radio frequency IC device according to the ninth preferred embodiment is substantially the same as a radio frequency IC device according to the eighth preferred embodiment except that connection electrodes 54 a and 54 b provided on the first layer 41A and coupled to the radio frequency IC chip 5 or the power supply circuit board 10 are electrically connected to the loop electrode 51B provided on the second layer 41B through via-hole conductors 54 c and the size of the loop electrode 51B is greater than that of the loop electrodes 51A, 51C, and 51D. Accordingly, the operational advantages of a radio frequency IC device according to the ninth preferred embodiment are substantially the same as those of a radio frequency IC device according to the eighth preferred embodiment.
  • Tenth Preferred Embodiment
  • FIG. 11 is a diagram illustrating the printed circuit board 20 included in a radio frequency IC device according to the tenth preferred embodiment of the present invention. A cutout 21 b is provided at the ground electrode 21 disposed on the surface of the printed circuit board 20. In the cutout 21 b, the loop electrode 31 is provided. On the inner side of the loop electrode 31, a meandering matching electrode 37 is disposed. Connection electrodes 37 a and 37 b that are the ends of the matching electrode 37 are coupled to the radio frequency IC chip 5 or the power supply circuit board 10.
  • Similar to the above-described preferred embodiments, in the tenth preferred embodiment, the ground electrode 21 functions as an antenna, and provides substantially the same operational advantages as those described in the first preferred embodiment. The meandering matching electrode 37 disposed on the inner side of the loop electrode 31 increases the length of a current path flowing through the loop electrode 31. The resistance and the real part are therefore increased. As a result, the impedance (Z) is increased. The exemplary shape of the matching electrode 37 illustrated in FIG. 11 may be changed in accordance with the shape or size of the cutout 21 b.
  • Eleventh Preferred Embodiment
  • FIG. 12 is a diagram illustrating the main portion of the printed circuit board 20 included in a radio frequency IC device according to the eleventh preferred embodiment of the present invention. A radio frequency IC device according to the eleventh preferred embodiment is substantially the same as a radio frequency IC device according to the tenth preferred embodiment except that the loop electrode 31 including the meandering matching electrode 37 on the inner side thereof is disposed in a cutout 21 c of the ground electrode 21 and is coupled to the ground electrode 21 by electric field coupling in substantially the same manner as that described in the first preferred embodiment.
  • Similar to the tenth preferred embodiment, in this preferred embodiment, the connection electrodes 37 a and 37 b which are the ends of the matching electrode 37 are coupled to the radio frequency IC chip 5 or the power supply circuit board 10. The ground electrode 21 functions as an antenna, and provides the same operational advantages as those described in the first and tenth preferred embodiments.
  • Twelfth Preferred Embodiment
  • FIG. 13 is an exploded view of the printed circuit board 40 included in a radio frequency IC device according to the twelfth preferred embodiment of the present invention. Similar to a printed circuit board described in the eighth preferred embodiment (see, FIG. 9), the printed circuit board 40 is a multilayer board in which a plurality of dielectric layers or a plurality of magnetic layers are laminated. The loop electrodes 51A to 51D are provided on the first layer 41A defining the surface of the printed circuit board 40, the second layer 41B, the third layer 41C, and the fourth layer 41D defining the bottom surface of the printed circuit board 40, respectively.
  • The loop electrodes 51A to 51D are obtained by providing the cutouts 50 a to 50 d at the ground electrodes 50A to 50D provided on the layers 41A to 41D, respectively. Connection electrodes 55 a and 55 b provided on the first layer 41A are respectively electrically connected to the input-output terminal electrodes 6 of the radio frequency IC chip 5, or are electromagnetically coupled to the power supply circuit board 10 (the electromagnetic coupling module 1). The ground electrodes 50A to 50D may be electrically connected to each other through via-hole conductors. An electrode functioning as an antenna may not necessarily be a ground electrode.
  • Furthermore, matching electrodes 56 a and 56 b are disposed on the inner side of the loop electrode 51B, and matching electrodes 57 a and 57 b are disposed on the inner side of the loop electrode 51C. The connection electrode 55 a is connected to one end of the matching electrode 57 a through a via-hole conductor 58 a, and the other end of the matching electrode 57 a is connected to one end of the matching electrode 56 a through a via-hole conductor 58 b. The other end of the matching electrode 56 a is connected to an end 50Aa of the ground electrode 50A through a via-hole conductor 58 c. The connection electrode 55 b is connected to one end of the matching electrode 57 b through a via-hole conductor 58 d, and the other end of the matching electrode 57 b is connected to one end of a matching electrode 56 b through a via-hole conductor 58 e. The other end of the matching electrode 56 b is connected to an end 50Ab of the ground electrode 50A through a via-hole conductor 58 f.
  • Similar to the above-described preferred embodiments, in the twelfth preferred embodiment, the ground electrode 50A functions as an antenna, and provides the same operational advantages as those described in the first preferred embodiment. Furthermore, the length of a current path passing through the loop electrode 51A is increased by the matching electrodes 56 a and 56 b, which are disposed on the inner side of the loop electrode 51B, and the matching electrodes 57 a and 57 b, which are disposed on the inner side of the loop electrode 51C. The resistance and the real part are therefore increased. As a result, the impedance (Z) can be increased. In the twelfth preferred embodiment, since the matching electrodes 56 a, 56 b, 57 a, and 57 b are included in a laminated structure, the length of a current path can be increased even in a small apparatus and a relatively high impedance (Z) can be obtained.
  • Thirteenth Preferred Embodiment
  • FIG. 14 is an exploded view of the printed circuit board 40 included in a radio frequency IC device according to the thirteenth preferred embodiment of the present invention. Similar to the printed circuit board described in the eighth and twelfth preferred embodiments, the printed circuit board 40 is a multilayer board in which a plurality of dielectric layers or a plurality of magnetic layers are laminated. The loop electrodes 51A to 51D are provided on the first layer 41A defining the surface of the printed circuit board 40, the second layer 41B, the third layer 41C, and the fourth layer 41D defining the bottom surface of the printed circuit board 40, respectively.
  • The loop electrodes 51A to 51D are obtained by providing the cutouts 50 a to 50 d in the ground electrodes 50A to 50D provided on the layers 41A to 41D, respectively. A connection electrode 61 provided on the first layer 41A and the end 50Aa of the ground electrode 50A are electrically connected to the input-output terminal electrodes 6 of the radio frequency IC chip 5, or are electromagnetically coupled to the power supply circuit board 10 (the electromagnetic coupling module 1). The ground electrodes 50A to 50D may be electrically connected to each other through via-hole conductors. An electrode functioning as an antenna may not necessarily be a ground electrode.
  • Furthermore, matching electrodes 62 and 63 are disposed on the inner sides of the loop electrode 51B and 51 c, respectively. The connection electrode 61 is connected to one end of the matching electrode 63 through a via-hole conductor 64 a, and the other end of the matching electrode 63 is connected to one end of the matching electrode 62 through a via-hole conductor 64 b. The other end of the matching electrode 62 is connected to the end 50Ab of the ground electrode 50A through a via-hole conductor 64 c.
  • Similar to the above-described preferred embodiments, in the thirteenth preferred embodiment, the ground electrode 50A functions as an antenna, and provides the same operational advantages as those described in the first preferred embodiment. Furthermore, the length of a current path passing through the loop electrode 51A is increased by the matching electrodes 62 and 63 which are disposed on the inner sides of the loop electrodes 51B and 51C, respectively. The resistance and the real part are therefore increased. As a result, the impedance (Z) can be increased. Similar to the twelfth preferred embodiment, in the thirteenth preferred embodiment, since the matching electrodes 62 and 63 are included in a laminated structure, the length of a current path can be increased in a small apparatus and a relatively high impedance (Z) can be obtained.
  • First Example of Resonance Circuit
  • FIG. 15 is a diagram illustrating a first example of a resonance circuit included in the power supply circuit board 10. The power supply circuit board 10 is obtained by laminating, press-bonding, and firing ceramic sheets 11A to 11H made of a dielectric material. On the sheet 11A, the connection electrodes 12 a and 12 b, the electrodes 12 c and 12 d, and via-hole conductors 13 a and 13 b are provided. On the sheet 11B, a capacitor electrode 18 a, conductor patterns 15 a and 15 b, and via-hole conductors 13 c to 13 e are provided. On the sheet 11C, a capacitor electrode 18 b, the via-hole conductors 13 d and 13 e, and a via-hole conductor 13 f are provided. On the sheet 11D, conductor patterns 16 a and 16 b, the via-hole conductors 13 e and 13 f, and via-hole conductors 14 a, 14 b, and 14 d are provided. On the sheet 11E, the conductor patterns 16 a and 16 b, the via-hole conductors 13 e, 13 f, and 14 a, and via-hole conductors 14 c and 14 e are provided. On the sheet 11F, a capacitor electrode 17, the conductor patterns 16 a and 16 b, the via-hole conductors 13 e and 13 f, and via-hole conductors 14 f and 14 g are provided. On the sheet 11G, the conductor patterns 16 a and 16 b and the via-hole conductors 13 e, 13 f, 14 f, and 14 g are provided. On the sheet 11H, the conductor patterns 16 a and 16 b and the via-hole conductor 13 f are provided.
  • By laminating the sheets 11A to 11H, an inductance element L1, an inductance element L2, a capacitance element C1, and a capacitance element C2 are provided. The inductance element L1 includes the conductor patterns 16 a that are helically connected by the via-hole conductors 14 c, 14 d, and 14 g. The inductance element L2 includes the conductor patterns 16 b that are helically connected by the via-hole conductors 14 b, 14 e, and 14 f. The capacitance element C1 includes the capacitor electrodes 18 a and 18 b. The capacitance element C2 includes the capacitor electrodes 18 b and 17.
  • One end of the inductance element L1 is connected to the capacitor electrode 18 b through the via-hole conductor 13 d, the conductor pattern 15 a, and the via-hole conductor 13 c. One end of the inductance element L2 is connected to the capacitor electrode 17 through the via-hole conductor 14 a. The other ends of the inductance elements L1 and L2 are combined on the sheet 11H, and are then connected to the connection electrode 12 a through the via-hole conductor 13 e, the conductor pattern 15 b, and the via-hole conductor 13 a. The capacitor electrode 18 a is electrically connected to the connection electrode 12 b through the via-hole conductor 13 b.
  • The connection electrodes 12 a and 12 b are respectively electrically connected via the metal bump 8 to the terminal electrodes 6 of the radio frequency IC chip 5. The electrodes 12 c and 12 d are respectively connected to the terminal electrodes 7 of the radio frequency IC chip 5.
  • On the bottom surface of the power supply circuit board 10, the outer electrodes 19 a and 19 b are provided by applying a coating of conductive paste thereto, for example. The outer electrode 19 a is coupled to the inductance element L (L1 and L2) by magnetic field coupling. The outer electrode 19 b is electrically connected to the capacitor electrode 18 b through the via-hole conductor 13 f. As described above, the outer electrodes 19 a and 19 b are electrically connected to the connection electrodes 35 a and 35 b of the loop electrode 35, or are electrically connected to the connection electrodes 36 a and 36 b of the loop electrode 36.
  • In this resonance circuit, the inductance elements L1 and L2 are obtained by the substantially parallel arrangement of two conductor patterns, that is, the conductor patterns 16 a and 16 b. Since the line lengths of the conductor patterns 16 a and 16 b are different from each other, the resonance frequencies of the inductance elements L1 and L2 are different from one another. Accordingly, a wider frequency band of a radio frequency IC device can be obtained.
  • Each of the ceramic sheets 11A to 11H may preferably be a ceramic sheet made of a magnetic material, for example. In this case, the power supply circuit board 10 can be easily obtained by a multilayer board manufacturing process including a sheet lamination method and a thick film printing method, for example.
  • Each of the sheets 11A to 11H may preferably be a flexible sheet made of a dielectric material, such as polyimide or liquid crystal polymer, for example. In this case, the inductance elements L1 and L2 and the capacitance elements C1 and C2 may be included in a laminate obtained by forming an electrode and a conductor on each of the flexible sheets using a thick film formation method and laminating these sheets by thermocompression bonding.
  • In the power supply circuit board 10, the inductance elements L1 and L2 and the capacitance elements C1 and C2 are disposed at different locations in a perspective plan view. The inductance elements L1 and L2 are coupled to the outer electrode 19 a by magnetic field coupling. The outer electrode 19 b functions as one electrode of the capacitance element C1.
  • Accordingly, in the electromagnetic coupling module 1 in which the radio frequency IC chip 5 is mounted on the power supply circuit board 10, the ground electrode 21 receives high-frequency signals (for example, UHF signals) emitted from a reader/writer (not illustrated). The electromagnetic coupling module 1 causes a resonance circuit, which is coupled to the outer electrodes 19 a and 19 b by magnetic field coupling and electric field coupling, to resonate via the loop electrode 35 or 36 so as to supply only a received signal that falls within a predetermined frequency range to the radio frequency IC chip 5. On the other hand, predetermined energy is extracted from the received signal, and is then used to cause the resonance circuit to match the frequency of information stored in the radio frequency IC chip 5 to a predetermined frequency and then transmit the information to the ground electrode 21 via the outer electrodes 19 a and 19 b and the loop electrode 35 or 36. The ground electrode 21 transmits or transfers the information to the reader/writer.
  • In the power supply circuit board 10, a resonance frequency characteristic is determined by a resonance circuit including the inductance elements L1 and L2 and the capacitance elements C1 and C2. The resonance frequency of a signal emitted from the ground electrode 21 is determined based on the self-resonance frequency of the resonance circuit.
  • The resonance circuit also functions as a matching circuit to perform the impedance matching between the radio frequency IC chip 5 and the ground electrode 21. The power supply circuit board 10 may include a matching circuit separately from a resonance circuit including an inductance element and a capacitance element (in this sense, a resonance circuit is also referred to as a matching circuit). If a matching circuit function is added to a resonance circuit, the design of the resonance circuit becomes complicated. If a matching circuit is provided separately from a resonance circuit, they can be separately designed. The loop electrodes 35 and 36 may have an impedance matching function or a resonance circuit function. In this case, by designing a resonance circuit (matching circuit) included in the power supply circuit board 10 in view of the shape of a loop electrode and the size of a ground electrode functioning as a radiation plate, a radiation characteristic can be improved.
  • Second Example of Resonance Circuit
  • FIG. 16 is a diagram illustrating a second example of a resonance circuit included in a power supply circuit board 70. The power supply circuit board 70 is a flexible PET film on which a helical conductor pattern 72 functioning as an inductance element L and a capacitor electrode 73 functioning as a capacitance element C are provided. The electrodes 12 a and 12 b extending from the conductor pattern 72 and the capacitor electrode 73 are respectively electrically connected to the terminal electrodes 6 of the radio frequency IC chip 5. The electrodes 12 c and 12 d provided on the power supply circuit board 70 are respectively electrically connected to the terminal electrodes 7 of the radio frequency IC chip 5.
  • Similar to the above-described first example of a resonance circuit, a resonance circuit included in the power supply circuit board 70 includes the inductance element L and the capacitance element C, and is coupled to the electrode 35 a or 36 a facing the inductance element L by magnetic field coupling and the electrode 35 b or 36 b facing the capacitance element C by electric field coupling. In this second example, since the power supply circuit board 70 is made of a flexible film, the height of the electromagnetic coupling module 1 is reduced. In the inductance element L, a resonance frequency can be adjusted by changing an inductance value. Preferably, the inductance value can be changed by changing the line width or line space of the conductor pattern 72, for example.
  • Similar to the first example, in the second example, the inductance element L is obtained by helically arranging two conductor patterns, that is, the conductor patterns 72, and connecting them at a central portion of the helical structure. The conductor patterns 72 have different inductance values L1 and L2. Accordingly, similar to the first example, since the resonance frequencies of the conductor patterns 72 can be different from one another other, a wider usable frequency band of a radio frequency IC device can be obtained.
  • Electronic Apparatus
  • Next, a mobile telephone will be described as an example of an electronic apparatus according to a preferred embodiment of the present invention. A mobile telephone 80 illustrated in FIG. 17 is usable for a plurality of frequencies. Various signals such as a terrestrial digital signal, a GPS signal, a WiFi signal, a CDMA communication signal, and a GSM communication signal are input into the mobile telephone 80.
  • As illustrated in FIG. 18, in a casing 81, the printed circuit board 20 is disposed. On the printed circuit board 20, a radio communication circuit 90 and the electromagnetic coupling module 1 are disposed. The radio communication circuit 90 preferably includes an IC chip 91, a balun 92 included in the printed circuit board 20, a BPF 93, and a capacitor 94, for example. The power supply circuit board 10 on which the radio frequency IC chip 5 is mounted is disposed on a loop electrode (for example, the loop electrode 35 described in the sixth preferred embodiment or the loop electrode 36 described in the seventh preferred embodiment) coupled to the ground electrode 21 provided on the printed circuit board 20, whereby a radio frequency IC device is formed.
  • A radio frequency IC device according to the present invention and an electronic apparatus according to the present invention are not limited to the above-described preferred embodiments, and various changes can be made to the present invention without departing from the spirit and scope of the present invention.
  • For example, as an electrode for transmitting and receiving a high-frequency signal, not only a ground electrode but also various other electrodes disposed in or on a circuit board can be used. Furthermore, various types of resonance circuits can be used. A material for each of the outer electrode and the power supply circuit board which have been described in the above-described preferred embodiments is provided only as an example. Any suitable material having the required characteristics may be used. A power supply circuit board may also have a radio frequency IC chip function so as to define a radio frequency IC chip and a power supply circuit on a single substrate. In this case, the size and profile of a radio frequency IC device can be reduced.
  • In the first to fifth preferred embodiments, instead of a radio frequency IC chip, the electromagnetic coupling module 1 described in the sixth and seventh preferred embodiments may be used, for example.
  • In order to mount a radio frequency IC chip on a power supply circuit board, another method other than a method using a metal bump may be used. A dielectric may be disposed between the electrode of a radio frequency IC chip and the connection electrode of a power supply circuit board so as to provide the capacitive coupling between these electrodes, for example. Furthermore, the capacitive coupling between a radio frequency IC chip and a loop electrode or between a power supply circuit board and a loop electrode may be provided.
  • An apparatus including a radio frequency IC device is not limited to a radio frequency communication apparatus, such as a mobile telephone. Various apparatuses each provided with a circuit board including a ground electrode, for example, home electric appliances such as a television set and a refrigerator, may be used.
  • As described above, preferred embodiments of the present invention are useful for a radio frequency IC device including a radio frequency IC chip and an electronic apparatus including the radio frequency IC device, and, in particular, has an advantage of obtaining a reduction is size and easily achieving impedance matching without a dedicated antenna.
  • While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.

Claims (29)

1. A radio frequency IC device comprising:
a radio frequency IC chip arranged to process a transmitted/received signal;
a circuit board on which the radio frequency IC chip is mounted;
an electrode arranged on the circuit board; and
a loop electrode arranged on the circuit board so that the loop electrode is coupled to the radio frequency IC chip and to the electrode.
2. The radio frequency IC device according to claim 1, wherein the loop electrode and the electrode arranged on the circuit board are arranged on the same main surface of the circuit board.
3. The radio frequency IC device according to claim 1, wherein at least one of the loop electrode and the electrode arranged on the circuit board is disposed in the circuit board.
4. The radio frequency IC device according to claim 1, wherein the loop electrode and the electrode arranged on the circuit board are electrically isolated from each other.
5. The radio frequency IC device according to claim 1, wherein the loop electrode and the electrode arranged on the circuit board are electrically connected to each other.
6. The radio frequency IC device according to claim 1, wherein the circuit board is a multilayer board in which one of a plurality of dielectric layers and a plurality of magnetic layers are laminated.
7. The radio frequency IC device according to claim 1, wherein the loop electrode provides an impedance matching function.
8. The radio frequency IC device according to claim 6, wherein the loop electrode is provided on a main surface of the circuit board and is provided on at least one of the plurality of dielectric layers or on at least one of the plurality of magnetic layers.
9. The radio frequency IC device according to claim 6, wherein the loop electrode is provided on a plurality of layers, and the loop electrode provided on at least one of the plurality of layers is different from the loop electrodes provided on the other ones of the plurality of layers in loop size.
10. The radio frequency IC device according to claim 9, wherein end portions of the loop electrode that is different from the loop electrodes in loop size are coupled to one of the radio frequency IC chip and the electromagnetic coupling module.
11. The radio frequency IC device according to claim 1, wherein a matching electrode is disposed on an inner side of the loop electrode.
12. An electronic apparatus comprising the radio frequency IC device according to claim 1.
13. A radio frequency IC device comprising:
an electromagnetic coupling module including a radio frequency IC arranged to process a transmitted/received signal and a power supply circuit board including an inductance element coupled to the radio frequency IC;
a circuit board on which the electromagnetic coupling module is mounted;
an electrode arranged on the circuit board; and
a loop electrode arranged on the circuit board so that the loop electrode is coupled to the power supply circuit board and to the electrode.
14. The radio frequency IC device according to claim 13, wherein a resonance circuit is provided in the power supply circuit board.
15. The radio frequency IC device according to claim 13, wherein a matching circuit is provided in the power supply circuit board.
16. The radio frequency IC device according to claim 13, wherein the loop electrode and the electrode arranged on the circuit board are arranged on the same main surface of the circuit board.
17. The radio frequency IC device according to claim 13, wherein at least one of the loop electrode and the electrode arranged on the circuit board is disposed in the circuit board.
18. The radio frequency IC device according to claim 13, wherein the loop electrode and the electrode arranged on the circuit board are electrically isolated from each other.
19. The radio frequency IC device according to claim 13, wherein the loop electrode and the electrode arranged on the circuit board are electrically connected to each other.
20. The radio frequency IC device according to claim 13, wherein the circuit board is a multilayer board in which one of a plurality of dielectric layers and a plurality of magnetic layers are laminated.
21. The radio frequency IC device according to claim 13, wherein the loop electrode provides an impedance matching function.
22. The radio frequency IC device according to claim 20, wherein the loop electrode is provided on a main surface of the circuit board and is provided on at least one of the plurality of dielectric layers or on at least one of the plurality of magnetic layers.
23. The radio frequency IC device according to claim 20, wherein the loop electrode is provided on a plurality of layers, and the loop electrode provided on at least one of the plurality of layers is different from the loop electrodes provided on the other ones of the plurality of layers in loop size.
24. The radio frequency IC device according to claim 23, wherein end portions of the loop electrode that is different from the loop electrodes in loop size are coupled to one of the radio frequency IC chip and the electromagnetic coupling module.
25. The radio frequency IC device according to claim 13, wherein a matching electrode is disposed on an inner side of the loop electrode.
26. The radio frequency IC device according to claim 13, wherein an outer electrode is provided on a surface of the power supply circuit board, the outer electrode being coupled to at least one of a resonance circuit and a matching circuit by electromagnetic field coupling and being electrically connected to the loop electrode.
27. The radio frequency IC device according to claim 13, wherein the power supply circuit board includes a multilayer board.
28. The radio frequency IC device according to claim 13, wherein the power supply circuit board includes a flexible board.
29. An electronic apparatus comprising the radio frequency IC device according to claim 1.
US12/235,753 2007-07-18 2008-09-23 Radio frequency ic device and electronic apparatus Abandoned US20090021352A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007-186392 2007-07-18
JP2007186392 2007-07-18
US11/851,661 US7830311B2 (en) 2007-07-18 2007-09-07 Wireless IC device and electronic device
PCT/JP2008/052129 WO2009011144A1 (en) 2007-07-18 2008-02-08 Wireless ic device and electronic apparatus
PCT/JP2008/055962 WO2009011154A1 (en) 2007-07-18 2008-03-27 Wireless ic device and electronic device
US12/235,753 US20090021352A1 (en) 2007-07-18 2008-09-23 Radio frequency ic device and electronic apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/235,753 US20090021352A1 (en) 2007-07-18 2008-09-23 Radio frequency ic device and electronic apparatus
US12/959,454 US8400307B2 (en) 2007-07-18 2010-12-03 Radio frequency IC device and electronic apparatus

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US11/851,661 Continuation-In-Part US7830311B2 (en) 2007-07-18 2007-09-07 Wireless IC device and electronic device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/959,454 Continuation US8400307B2 (en) 2007-07-18 2010-12-03 Radio frequency IC device and electronic apparatus

Publications (1)

Publication Number Publication Date
US20090021352A1 true US20090021352A1 (en) 2009-01-22

Family

ID=46332014

Family Applications (2)

Application Number Title Priority Date Filing Date
US12/235,753 Abandoned US20090021352A1 (en) 2007-07-18 2008-09-23 Radio frequency ic device and electronic apparatus
US12/959,454 Active US8400307B2 (en) 2007-07-18 2010-12-03 Radio frequency IC device and electronic apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
US12/959,454 Active US8400307B2 (en) 2007-07-18 2010-12-03 Radio frequency IC device and electronic apparatus

Country Status (1)

Country Link
US (2) US20090021352A1 (en)

Cited By (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080119135A1 (en) * 2006-11-21 2008-05-22 Takanori Washiro Communication system and communication apparatus
US20090197529A1 (en) * 2008-02-06 2009-08-06 Hitachi Displays, Ltd Communication system by electrostatic coupling and electromagnetic induction
US20090262041A1 (en) * 2007-07-18 2009-10-22 Murata Manufacturing Co., Ltd. Wireless ic device
US20090278760A1 (en) * 2007-04-26 2009-11-12 Murata Manufacturing Co., Ltd. Wireless ic device
US20100038437A1 (en) * 2007-05-11 2010-02-18 Murata Manufacturing Co., Ltd. Wireless ic device
US20100302013A1 (en) * 2008-03-03 2010-12-02 Murata Manufacturing Co., Ltd. Radio frequency ic device and radio communication system
US20110001608A1 (en) * 2009-07-01 2011-01-06 Fujitsu Limited Rfid tag
US20110043338A1 (en) * 2008-05-26 2011-02-24 Murata Manufacturing Co., Ltd. Wireless ic device system and method of determining authenticity of wireless ic device
US20110226860A1 (en) * 2010-03-16 2011-09-22 Industrial Technology Research Institute Printed circuit board with antenna for rfid chip and method for manufacturing the same
US20120012369A1 (en) * 2009-04-02 2012-01-19 Murata Manufacturing Co., Ltd. Circuit board
US8228765B2 (en) 2006-06-30 2012-07-24 Murata Manufacturing Co., Ltd. Optical disc
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US20130002404A1 (en) * 2010-08-10 2013-01-03 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US20130044039A1 (en) * 2011-08-19 2013-02-21 Hon Hai Precision Industry Co., Ltd. Ceramic antenna
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8413907B2 (en) 2007-07-17 2013-04-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8941552B2 (en) 2010-02-19 2015-01-27 Murata Manufacturing Co., Ltd. Composite printed wiring board and wireless communication system
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
CN104733862A (en) * 2012-06-28 2015-06-24 株式会社村田制作所 The communication terminal apparatus
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
CN106207478A (en) * 2015-04-07 2016-12-07 智易科技股份有限公司 Dual-band antenna disposed on both sides of a substrate
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US20170177914A1 (en) * 2012-12-04 2017-06-22 Nec Corporation Device detecting spatial variation of complex permittivity and system detecting presence/absence of article
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US9940564B2 (en) 2014-04-28 2018-04-10 Murata Manufacturing Co., Ltd. Wireless IC device, clip-shaped RFID tag, and article having RFID tag
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag
EP2555494B1 (en) * 2010-03-31 2019-05-08 Dexerials Corporation Antenna device and communication device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6316049B2 (en) * 2014-03-24 2018-04-25 キヤノン株式会社 Printing apparatus and control method
TWI566465B (en) * 2015-04-30 2017-01-11 智易科技股份有限公司 Assembly-type dual-band printed antenna

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5710458A (en) * 1993-12-20 1998-01-20 Kabushiki Kaisha Toshiba Card like semiconductor device
US5852289A (en) * 1994-09-22 1998-12-22 Rohm Co., Ltd. Non-contact type IC card and method of producing the same
US5995006A (en) * 1995-09-05 1999-11-30 Intermec Ip Corp. Radio frequency tag
US20060001138A1 (en) * 2004-06-30 2006-01-05 Hitachi, Ltd. IC-tag-bearing wiring board and method of fabricating the same
US20060044769A1 (en) * 2004-09-01 2006-03-02 Forster Ian J RFID device with magnetic coupling
US20060055601A1 (en) * 2002-07-05 2006-03-16 Shozaburo Kameda Antenna with built-in filter
US20060208899A1 (en) * 2005-03-07 2006-09-21 Kenji Suzuki RFID relay antenna, RFID system, container, disposition method, communication confirmation method, and package construction
US20060267138A1 (en) * 2005-05-30 2006-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20070004028A1 (en) * 2005-03-10 2007-01-04 Gen-Probe Incorporated Signal measuring system for conducting real-time amplification assays
US20070052613A1 (en) * 2005-09-06 2007-03-08 Sebastian Gallschuetz Radio frequency identification transponder antenna

Family Cites Families (278)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3364564A (en) * 1965-06-28 1968-01-23 Gregory Ind Inc Method of producing welding studs dischargeable in end-to-end relationship
JPS6193701A (en) * 1984-10-13 1986-05-12 Toyota Motor Corp Antenna system for automobile
US5253969A (en) * 1989-03-10 1993-10-19 Sms Schloemann-Siemag Aktiengesellschaft Feeding system for strip material, particularly in treatment plants for metal strips
JP2763664B2 (en) * 1990-07-25 1998-06-11 日本碍子株式会社 Distributed circuit wiring board
NL9100176A (en) 1991-02-01 1992-03-02 Nedap Nv Antenna with transformer for non-contact transfer of information from the integrated circuit card.
NL9100347A (en) 1991-02-26 1992-03-02 Nedap Nv An integrated transformer for a noncontact IC card.
JPH04321190A (en) * 1991-04-22 1992-11-11 Mitsubishi Electric Corp Antenna circuit and its production for non-contact type portable storage
DE69215283D1 (en) * 1991-07-08 1997-01-02 Nippon Telegraph & Telephone Extendable antenna system
DE69420219T2 (en) * 1993-10-04 1999-12-09 Ford Motor Co Tunable PCB antenna
US5491483A (en) * 1994-01-05 1996-02-13 Texas Instruments Incorporated Single loop transponder system and method
US6096431A (en) 1994-07-25 2000-08-01 Toppan Printing Co., Ltd. Biodegradable cards
JP3141692B2 (en) * 1994-08-11 2001-03-05 松下電器産業株式会社 Millimeter-wave for the detector
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
GB2299898B (en) * 1995-04-13 1999-05-19 Northern Telecom Ltd A layered antenna
US5955723A (en) * 1995-05-03 1999-09-21 Siemens Aktiengesellschaft Contactless chip card
US5629241A (en) * 1995-07-07 1997-05-13 Hughes Aircraft Company Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same
JP3150575B2 (en) * 1995-07-18 2001-03-26 沖電気工業株式会社 Tag device and manufacturing method thereof
DE19534229A1 (en) * 1995-09-15 1997-03-20 Licentia Gmbh transponder arrangement
AUPO055296A0 (en) * 1996-06-19 1996-07-11 Integrated Silicon Design Pty Ltd Enhanced range transponder system
US6104311A (en) 1996-08-26 2000-08-15 Addison Technologies Information storage and identification tag
JP2001505682A (en) 1996-10-09 2001-04-24 エーファウツェ リギッド フィルム ゲームベーハー Connection arrangement for the manufacturing method and the smart card
JPH10193849A (en) 1996-12-27 1998-07-28 Rohm Co Ltd Circuit chip-mounted card and circuit chip module
DE19703029A1 (en) 1997-01-28 1998-07-30 Amatech Gmbh & Co Kg Transmission module for a transponder device and transponder apparatus and method for operating a transponder device
WO1998040930A1 (en) * 1997-03-10 1998-09-17 Precision Dynamics Corporation Reactively coupled elements in circuits on flexible substrates
WO1999050932A1 (en) * 1998-03-31 1999-10-07 Matsushita Electric Industrial Co., Ltd. Antenna unit and digital television receiver
WO1999026195A1 (en) * 1997-11-14 1999-05-27 Toppan Printing Co., Ltd. Composite ic module and composite ic card
JPH11261325A (en) * 1998-03-10 1999-09-24 Fec:Kk Coil element and its manufacture
US5936150A (en) * 1998-04-13 1999-08-10 Rockwell Science Center, Llc Thin film resonant chemical sensor with resonant acoustic isolator
JP2002505645A (en) 1998-04-14 2002-02-19 リバティ・カートン・カンパニー−テキサス Compressor and a container for other goods
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
JP2000021639A (en) 1998-07-02 2000-01-21 Sharp Corp Inductor, resonance circuit using the same, matching circuit, antenna circuit, and oscillation circuit
JP2000022421A (en) * 1998-07-03 2000-01-21 Murata Mfg Co Ltd Chip antenna and radio device mounted with it
EP0977145A3 (en) 1998-07-28 2002-11-06 Kabushiki Kaisha Toshiba Radio IC card
JP2000311226A (en) 1998-07-28 2000-11-07 Toshiba Corp Radio ic card and its production and read and write system of the same
JP2000059260A (en) 1998-08-04 2000-02-25 Sony Corp Storage device
BR9913043B1 (en) 1998-08-14 2012-10-02 processes to sort a group of unordered items having radio frequency identification elements, to use a radio frequency identification device held in the hand to read information from a radio frequency identification element, and to use an identification device by radio frequency to identify and locate items having a radio frequency identification element.
BR9912929A (en) * 1998-08-14 2001-05-08 3M Innovative Properties Co The antenna system, combination, and method of interrogating certain items
JP4411670B2 (en) 1998-09-08 2010-02-10 凸版印刷株式会社 Method of manufacturing a non-contact ic card
JP4508301B2 (en) 1998-09-16 2010-07-21 大日本印刷株式会社 Non-contact ic card
JP3632466B2 (en) 1998-10-23 2005-03-23 凸版印刷株式会社 Inspection apparatus and method for non-contact ic card
US6837438B1 (en) * 1998-10-30 2005-01-04 Hitachi Maxell, Ltd. Non-contact information medium and communication system utilizing the same
JP2000137785A (en) 1998-10-30 2000-05-16 Sony Corp Manufacture of noncontact type ic card and noncontact type ic card
JP3924962B2 (en) 1998-10-30 2007-06-06 株式会社デンソー id tag for dish-like article
JP2000137779A (en) 1998-10-30 2000-05-16 Hitachi Maxell Ltd Non-contact information medium and production thereof
JP2000148948A (en) 1998-11-05 2000-05-30 Sony Corp Non-contact ic label and its manufacture
JP2000172812A (en) 1998-12-08 2000-06-23 Hitachi Maxell Ltd Noncontact information medium
JP3088404B2 (en) 1999-01-14 2000-09-18 埼玉日本電気株式会社 Mobile radio terminal and a built-in antenna
JP2000222540A (en) 1999-02-03 2000-08-11 Hitachi Maxell Ltd Non-contact type semiconductor tag
JP2000228602A (en) * 1999-02-08 2000-08-15 Alps Electric Co Ltd Resonance line
JP2000243797A (en) 1999-02-18 2000-09-08 Sanken Electric Co Ltd Semiconductor wafer, and cutting method thereof, and semiconductor wafer assembly and cutting method thereof
JP2000251049A (en) 1999-03-03 2000-09-14 Konica Corp Card and production thereof
JP4106673B2 (en) 1999-03-05 2008-06-25 株式会社エフ・イー・シー Antenna device using the coil unit, the printed circuit board
JP4349597B2 (en) 1999-03-26 2009-10-21 大日本印刷株式会社 The method of manufacturing Ic chip manufacturing method and a built-in memory medium it
JP2000286634A (en) 1999-03-30 2000-10-13 Hiroyuki Arai Antenna system and its manufacture
JP3751178B2 (en) 1999-03-30 2006-03-01 宏之 新井 Transceiver
US6542050B1 (en) * 1999-03-30 2003-04-01 Ngk Insulators, Ltd. Transmitter-receiver
JP3067764B1 (en) 1999-03-31 2000-07-24 株式会社豊田自動織機製作所 For mobile communication coupler, the method of communication mobile and mobile
JP2000321984A (en) 1999-05-12 2000-11-24 Hitachi Ltd Label with rf-id tag
JP3557130B2 (en) 1999-07-14 2004-08-25 新光電気工業株式会社 A method of manufacturing a semiconductor device
JP2001043340A (en) 1999-07-29 2001-02-16 Toppan Printing Co Ltd Composite ic card
US6259369B1 (en) * 1999-09-30 2001-07-10 Moore North America, Inc. Low cost long distance RFID reading
JP3451373B2 (en) * 1999-11-24 2003-09-29 オムロン株式会社 Method of manufacturing an electromagnetic wave readable data carrier
JP4186149B2 (en) 1999-12-06 2008-11-26 株式会社エフ・イー・シー Auxiliary antenna for Ic card
JP2001188890A (en) 2000-01-05 2001-07-10 Omron Corp Non-contact tag
JP2001240046A (en) 2000-02-25 2001-09-04 Toppan Forms Co Ltd Container and manufacturing method thereof
JP2001257292A (en) 2000-03-10 2001-09-21 Hitachi Maxell Ltd Semiconductor device
JP2001256457A (en) 2000-03-13 2001-09-21 Toshiba Corp Semiconductor device, its manufacture and ic card communication system
WO2001073685A1 (en) 2000-03-28 2001-10-04 Lucatron Ag Rfid label with an element for regulating the resonance frequency
JP4624537B2 (en) 2000-04-04 2011-02-02 大日本印刷株式会社 Non-contact data carrier device, container
JP2001319380A (en) 2000-05-11 2001-11-16 Mitsubishi Materials Corp Optical disk with rfid
JP2001331976A (en) 2000-05-17 2001-11-30 Casio Comput Co Ltd Optical recording type recording medium
JP4223174B2 (en) 2000-05-19 2009-02-12 Dxアンテナ株式会社 Film antenna
JP2001339226A (en) 2000-05-26 2001-12-07 Nec Saitama Ltd Antenna system
JP2001344574A (en) 2000-05-30 2001-12-14 Mitsubishi Materials Corp Antenna device for interrogator
JP2001352176A (en) 2000-06-05 2001-12-21 Fuji Xerox Co Ltd Multilayer printed wiring board and manufacturing method of multilayer printed wiring board
US6400323B2 (en) * 2000-06-23 2002-06-04 Toyo Aluminium Kabushiki Kaisha Antenna coil for IC card and manufacturing method thereof
AU775854B2 (en) * 2000-07-04 2004-08-19 Credipass Co., Ltd. Passive transponder identification system and credit-card type transponder
JP4138211B2 (en) 2000-07-06 2008-08-27 株式会社村田製作所 Electronic components and a method of manufacturing the same, a set electronic component mounting structure of an electronic component, and electronic device
JP2002024776A (en) 2000-07-07 2002-01-25 Nippon Signal Co Ltd:The Ic card reader/writer
BRPI0112645B1 (en) * 2000-07-19 2016-07-05 Hanex Co Ltd housing structure and installation structure for a radio frequency identification indicator and communication method using a radio frequency identification indicator
RU2163739C1 (en) 2000-07-20 2001-02-27 Криштопов Александр Владимирович Antenna
JP2002042076A (en) 2000-07-21 2002-02-08 Dainippon Printing Co Ltd Non-contact data carrier and booklet therewith
JP3075400U (en) 2000-08-03 2001-02-16 昌栄印刷株式会社 Non-contact type ic card
JP2002063557A (en) 2000-08-21 2002-02-28 Mitsubishi Materials Corp Tag for rfid
JP2002076750A (en) 2000-08-24 2002-03-15 Murata Mfg Co Ltd Antenna device and radio equipment equipped with it
JP4615695B2 (en) 2000-10-19 2011-01-19 三星エスディーエス株式会社Samsung SDS Co., Ltd. And ic module for Ic card, ic card to use it
US6634564B2 (en) * 2000-10-24 2003-10-21 Dai Nippon Printing Co., Ltd. Contact/noncontact type data carrier module
JP4628611B2 (en) 2000-10-27 2011-02-09 三菱マテリアル株式会社 antenna
JP4432254B2 (en) 2000-11-20 2010-03-17 株式会社村田製作所 A surface mount antenna structure and communication apparatus including the same
JP2002157564A (en) 2000-11-21 2002-05-31 Toyo Aluminium Kk Antenna coil for ic card and its manufacturing method
JP2002185358A (en) 2000-11-24 2002-06-28 Supersensor Pty Ltd Method for fitting rf transponder to container
JP4641096B2 (en) 2000-12-07 2011-03-02 大日本印刷株式会社 Non-contact data carrier device and the booster antenna unit interconnection member
JP2002183690A (en) 2000-12-11 2002-06-28 Hitachi Maxell Ltd Noncontact ic tag device
AU2609302A (en) * 2000-12-15 2002-06-24 Electrox Corp Process for the manufacture of novel, inexpensive radio frequency identificationdevices
JP3788325B2 (en) 2000-12-19 2006-06-21 株式会社村田製作所 Laminated coil component and a method of manufacturing the same
TW531976B (en) * 2001-01-11 2003-05-11 Hanex Co Ltd Communication apparatus and installing structure, manufacturing method and communication method
JP2002280821A (en) 2001-01-12 2002-09-27 Furukawa Electric Co Ltd:The Antenna system and terminal equipment
KR20020061103A (en) * 2001-01-12 2002-07-22 후루까와덴끼고오교 가부시끼가이샤 Antenna device and terminal with the antenna device
JP2002232221A (en) 2001-01-30 2002-08-16 Alps Electric Co Ltd Transmission and reception unit
JP4662400B2 (en) 2001-02-05 2011-03-30 大日本印刷株式会社 Semiconductor module with an article of the coil-on-chip type
CN1310376C (en) 2001-03-02 2007-04-11 皇家菲利浦电子有限公司 Module and the electronic device
JP4712986B2 (en) 2001-03-06 2011-06-29 大日本印刷株式会社 Rfid tagged liquid container
JP3570386B2 (en) * 2001-03-30 2004-09-29 松下電器産業株式会社 Wireless capability built-in portable information terminal
JP2002298109A (en) 2001-03-30 2002-10-11 Toppan Forms Co Ltd Contactless ic medium and manufacturing method thereof
JP2002308437A (en) 2001-04-16 2002-10-23 Dainippon Printing Co Ltd Inspection system using rfid tag
JP2002319812A (en) 2001-04-20 2002-10-31 Oji Paper Co Ltd Data carrier adhesion method
JP4700831B2 (en) 2001-04-23 2011-06-15 株式会社ハネックス Communication distance method of enlarging Rfid tag
JP3621655B2 (en) 2001-04-23 2005-02-16 株式会社ハネックス中央研究所 Rfid tag structure and manufacturing method thereof
FI112550B (en) 2001-05-31 2003-12-15 Rafsec Oy Smart Label smart label web and
JP2002362613A (en) 2001-06-07 2002-12-18 Toppan Printing Co Ltd Laminated packaging material having non-contact ic, packaging container using laminated packaging material and method for detecting opened seal of packaging container
JP4710174B2 (en) 2001-06-13 2011-06-29 株式会社村田製作所 Balanced lc filter
JP4882167B2 (en) 2001-06-18 2012-02-22 大日本印刷株式会社 Non-contact ic chip card with an integrated form
JP2002373029A (en) 2001-06-18 2002-12-26 Hitachi Ltd Method for preventing illegal copy of software by using ic tag
JP4759854B2 (en) 2001-06-19 2011-08-31 株式会社寺岡精工 How to install and ic tag built-in marker to the metal of the Ic tag
JP2003087008A (en) * 2001-07-02 2003-03-20 Ngk Insulators Ltd Laminated type dielectric filter
JP4058919B2 (en) 2001-07-03 2008-03-12 日立化成工業株式会社 Contactless ic labels, contactless ic card, ic module for non-contact ic label or contactless ic card
JP2003026177A (en) 2001-07-12 2003-01-29 Toppan Printing Co Ltd Packaging member with non-contact type ic chip
JP2005236339A (en) 2001-07-19 2005-09-02 Oji Paper Co Ltd Ic chip mounted body
JP2003030612A (en) 2001-07-19 2003-01-31 Oji Paper Co Ltd Ic chip mounting body
AT377908T (en) 2001-07-26 2007-11-15 Irdeto Access Bv Time Valid reasoning system
JP3629448B2 (en) 2001-07-27 2005-03-16 Tdk株式会社 The antenna device and an electronic apparatus having the same
JP2003069335A (en) 2001-08-28 2003-03-07 Hitachi Kokusai Electric Inc Auxiliary antenna
JP2003067711A (en) 2001-08-29 2003-03-07 Toppan Forms Co Ltd Article provided with ic chip mounting body or antenna part
JP2003078333A (en) * 2001-08-30 2003-03-14 Murata Mfg Co Ltd Radio communication apparatus
JP2003078336A (en) 2001-08-30 2003-03-14 Tokai Univ Laminated spiral antenna
JP4514374B2 (en) 2001-09-05 2010-07-28 トッパン・フォームズ株式会社 Rf-id inspection system
JP4747467B2 (en) 2001-09-07 2011-08-17 大日本印刷株式会社 Non-contact ic tag
JP2003085520A (en) 2001-09-11 2003-03-20 Oji Paper Co Ltd Manufacturing method for ic card
US6741212B2 (en) * 2001-09-14 2004-05-25 Skycross, Inc. Low profile dielectrically loaded meanderline antenna
JP4698096B2 (en) 2001-09-25 2011-06-08 トッパン・フォームズ株式会社 Rf-id inspection system
JP4845306B2 (en) 2001-09-25 2011-12-28 トッパン・フォームズ株式会社 Rf-id inspection system
JP2003110344A (en) 2001-09-26 2003-04-11 Hitachi Metals Ltd Surface-mounting type antenna and antenna device mounting the same
JP2003132330A (en) 2001-10-25 2003-05-09 Sato Corp Rfid label printer
JP2003134007A (en) 2001-10-30 2003-05-09 Auto Network Gijutsu Kenkyusho:Kk System and method for exchanging signal between on- vehicle equipment
JP3908514B2 (en) 2001-11-20 2007-04-25 大日本印刷株式会社 Manufacturing method of Ic tagged package and ic-tagged package
JP3984458B2 (en) 2001-11-20 2007-10-03 大日本印刷株式会社 Manufacturing method of Ic tagged package
US6812707B2 (en) * 2001-11-27 2004-11-02 Mitsubishi Materials Corporation Detection element for objects and detection device using the same
JP3894540B2 (en) 2001-11-30 2007-03-22 トッパン・フォームズ株式会社 Interposer having an electrically conductive connecting part
JP2003188338A (en) 2001-12-13 2003-07-04 Sony Corp Circuit board and its manufacturing method
JP3700777B2 (en) 2001-12-17 2005-09-28 三菱マテリアル株式会社 Method of adjusting the resonant frequency using the electrode structures and the electrodes of the tag Rfid
JP2003188620A (en) 2001-12-19 2003-07-04 Murata Mfg Co Ltd Antenna integral with module
JP4028224B2 (en) 2001-12-20 2007-12-26 大日本印刷株式会社 Paper ic card substrate having a non-contact communication function
JP3895175B2 (en) 2001-12-28 2007-03-22 Ntn株式会社 Dielectric resin integrated antenna
JP2003209421A (en) 2002-01-17 2003-07-25 Dainippon Printing Co Ltd Rfid tag having transparent antenna and production method therefor
JP3915092B2 (en) 2002-01-21 2007-05-16 株式会社エフ・イー・シー Booster antenna for Ic card
JP2003216919A (en) 2002-01-23 2003-07-31 Toppan Forms Co Ltd Rf-id media
JP2003233780A (en) 2002-02-06 2003-08-22 Mitsubishi Electric Corp Data communication device
JP3998992B2 (en) 2002-02-14 2007-10-31 大日本印刷株式会社 Antenna pattern forming method and ic tagged package to ic chip mounted on the web
JP2003243918A (en) 2002-02-18 2003-08-29 Dainippon Printing Co Ltd Antenna for non-contact ic tag, and non-contact ic tag
JP2003249813A (en) 2002-02-25 2003-09-05 Tecdia Kk Tag for rfid with loop antenna
US7119693B1 (en) * 2002-03-13 2006-10-10 Celis Semiconductor Corp. Integrated circuit with enhanced coupling
JP2003288560A (en) 2002-03-27 2003-10-10 Toppan Forms Co Ltd Interposer and inlet sheet with antistatic function
US7129834B2 (en) * 2002-03-28 2006-10-31 Kabushiki Kaisha Toshiba String wireless sensor and its manufacturing method
JP2003309418A (en) 2002-04-17 2003-10-31 Alps Electric Co Ltd Dipole antenna
JP2003317060A (en) 2002-04-22 2003-11-07 Dainippon Printing Co Ltd Ic card
JP2003317052A (en) 2002-04-24 2003-11-07 Smart Card:Kk Ic tag system
JP3879098B2 (en) 2002-05-10 2007-02-07 株式会社エフ・イー・シー Booster antenna for Ic card
JP3979178B2 (en) 2002-05-14 2007-09-19 凸版印刷株式会社 Non-contact ic media module and non-contact ic medium
US6753814B2 (en) * 2002-06-27 2004-06-22 Harris Corporation Dipole arrangements using dielectric substrates of meta-materials
JP3803085B2 (en) 2002-08-08 2006-08-02 株式会社日立製作所 Radio ic tag
JP4107381B2 (en) 2002-08-23 2008-06-25 横浜ゴム株式会社 Pneumatic tire
JP2004096566A (en) 2002-09-02 2004-03-25 Toenec Corp Inductive communication equipment
DE10393263T5 (en) * 2002-09-20 2005-09-15 Fairchild Semiconductor Corp. Method and system for a logarithmic spiral antenna with a large bandwidth for a radio frequency identification tag system
JP4367013B2 (en) * 2002-10-28 2009-11-18 セイコーエプソン株式会社 Noncontact communication medium
JP2004234595A (en) 2003-02-03 2004-08-19 Matsushita Electric Ind Co Ltd Information recording medium reader
JP3735635B2 (en) 2003-02-03 2006-01-18 松下電器産業株式会社 The antenna apparatus and the radio communication device using the same
EP1445821A1 (en) * 2003-02-06 2004-08-11 Matsushita Electric Industrial Co., Ltd. Portable radio communication apparatus provided with a boom portion
JP2004253858A (en) 2003-02-18 2004-09-09 Fec Inc Booster antenna device for ic tag
JP2004280390A (en) 2003-03-14 2004-10-07 Toppan Forms Co Ltd Rf-id media and method for manufacturing the same
JP4034676B2 (en) 2003-03-20 2008-01-16 日立マクセル株式会社 Non-contact communication type information carrier
JP2004297249A (en) 2003-03-26 2004-10-21 Matsushita Electric Ind Co Ltd Coupler between different phase lines, mounting method therefor, and coupling method between different phase lines
JP2004297681A (en) 2003-03-28 2004-10-21 Toppan Forms Co Ltd Non-contact information recording medium
US7652636B2 (en) * 2003-04-10 2010-01-26 Avery Dennison Corporation RFID devices having self-compensating antennas and conductive shields
JP4208631B2 (en) 2003-04-17 2009-01-14 日本ミクロン株式会社 A method of manufacturing a semiconductor device
JP2004326380A (en) 2003-04-24 2004-11-18 Dainippon Printing Co Ltd Rfid tag
JP2004334268A (en) 2003-04-30 2004-11-25 Dainippon Printing Co Ltd Paper slip ic tag, book/magazine with it, and book with it
JP2004336250A (en) * 2003-05-02 2004-11-25 Taiyo Yuden Co Ltd Antenna matching circuit, and mobile communication apparatus and dielectric antenna having the same
JP2004343000A (en) 2003-05-19 2004-12-02 Fujikura Ltd Semiconductor module, non-contact integrated circuit tag having the semiconductor module, and method of manufacturing semiconductor module
JP2004362190A (en) 2003-06-04 2004-12-24 Hitachi Ltd Semiconductor device
JP4828088B2 (en) 2003-06-05 2011-11-30 凸版印刷株式会社 Ic tag
JP2005005866A (en) * 2003-06-10 2005-01-06 Alps Electric Co Ltd Antenna-integrated module
JP3982476B2 (en) * 2003-10-01 2007-09-26 ソニー株式会社 Communications system
JP4062233B2 (en) 2003-10-20 2008-03-19 トヨタ自動車株式会社 Loop antenna device
JP4680489B2 (en) 2003-10-21 2011-05-11 三菱電機株式会社 Information recording and reading system
JP3570430B1 (en) * 2003-10-29 2004-09-29 オムロン株式会社 Loop coil antenna
JP4343655B2 (en) * 2003-11-12 2009-10-14 日立金属株式会社 antenna
JP4451125B2 (en) 2003-11-28 2010-04-14 シャープ株式会社 Small antenna
JP2005165839A (en) 2003-12-04 2005-06-23 Nippon Signal Co Ltd:The Reader/writer, ic tag, article control device, and optical disk device
JP4177241B2 (en) * 2003-12-04 2008-11-05 株式会社日立情報制御ソリューションズ Radio ic tag for the antenna, container with wireless ic tag and radio ic tag
US6999028B2 (en) * 2003-12-23 2006-02-14 3M Innovative Properties Company Ultra high frequency radio frequency identification tag
JP4326936B2 (en) 2003-12-24 2009-09-09 シャープ株式会社 Wireless tag
TWI343671B (en) 2003-12-25 2011-06-11 Mitsubishi Materials Corp
EP1548674A1 (en) * 2003-12-25 2005-06-29 Hitachi, Ltd. Radio IC tag, method and apparatus for manufacturing the same
JP4089680B2 (en) 2003-12-25 2008-05-28 三菱マテリアル株式会社 The antenna device
JP2005210676A (en) * 2003-12-25 2005-08-04 Hitachi Ltd Wireless ic tag, and method and apparatus for manufacturing the same
JP2005190417A (en) 2003-12-26 2005-07-14 Taketani Shoji:Kk Fixed object management system and individual identifier for use therein
WO2005073937A2 (en) 2004-01-22 2005-08-11 Mikoh Corporation A modular radio frequency identification tagging method
JP4271591B2 (en) 2004-01-30 2009-06-03 双信電機株式会社 The antenna device
KR101270180B1 (en) 2004-01-30 2013-05-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 An inspection apparatus, inspenction method, and method for manufacturing a semiconductor device
JP2005229474A (en) 2004-02-16 2005-08-25 Olympus Corp Information terminal device
JP4393228B2 (en) 2004-02-27 2010-01-06 シャープ株式会社 Small antenna and a radio tag with it
JP2005275870A (en) 2004-03-25 2005-10-06 Matsushita Electric Ind Co Ltd Insertion type radio communication medium device and electronic equipment
JP2005284352A (en) 2004-03-26 2005-10-13 Toshiba Corp Portable electronic equipment
JP4067510B2 (en) 2004-03-31 2008-03-26 シャープ株式会社 Television receiver
JP2005293537A (en) 2004-04-05 2005-10-20 Fuji Xynetics Kk Cardboard with ic tag
US8139759B2 (en) * 2004-04-16 2012-03-20 Panasonic Corporation Line state detecting apparatus and transmitting apparatus and receiving apparatus of balanced transmission system
JP2005311205A (en) * 2004-04-23 2005-11-04 Nec Corp Semiconductor device
JP2005321305A (en) 2004-05-10 2005-11-17 Murata Mfg Co Ltd Electronic component measurement jig
JP2005322119A (en) 2004-05-11 2005-11-17 Ic Brains Co Ltd Device for preventing illegal taking of article equipped with ic tag
JP4551122B2 (en) 2004-05-26 2010-09-22 株式会社三宅 Sticking apparatus Rfid label
US7317396B2 (en) 2004-05-26 2008-01-08 Funai Electric Co., Ltd. Optical disc having RFID tag, optical disc apparatus, and system for preventing unauthorized copying
JP4360276B2 (en) 2004-06-02 2009-11-11 船井電機株式会社 Optical disk and an optical disk reproducing apparatus having a wireless ic tag
JP2005345802A (en) 2004-06-03 2005-12-15 Casio Comput Co Ltd Imaging device, replacement unit used for the imaging device, and replacement unit use control method and program
JP4348282B2 (en) 2004-06-11 2009-10-21 株式会社日立製作所 Method for producing ic tag, and Wireless ic tag radio
JP2005352858A (en) 2004-06-11 2005-12-22 Hitachi Maxell Ltd Communication type recording medium
JP4328682B2 (en) * 2004-07-13 2009-09-09 富士通株式会社 Storage case of the radio tag antenna structure and a radio tag antenna with optical recording media for optical recording medium
JP4413698B2 (en) 2004-07-15 2010-02-10 日本電業工作株式会社 Parasitic element with a ring antenna
JP2004362602A (en) 2004-07-26 2004-12-24 Hitachi Ltd Rfid tag
US7295161B2 (en) * 2004-08-06 2007-11-13 International Business Machines Corporation Apparatus and methods for constructing antennas using wire bonds as radiating elements
JP2005129019A (en) 2004-09-03 2005-05-19 Sony Chem Corp Ic card
JP4273098B2 (en) * 2004-09-07 2009-06-03 キヤノン株式会社 Multi-layer printed circuit board
JP4600742B2 (en) 2004-09-30 2010-12-15 ブラザー工業株式会社 The print head and the tag-label producing device
JP2006107296A (en) 2004-10-08 2006-04-20 Dainippon Printing Co Ltd Non-contact ic tag and antenna for non-contact ic tag
GB2419779A (en) 2004-10-29 2006-05-03 Hewlett Packard Development Co Document having conductive tracks for coupling to a memory tag and a reader
JP2006148518A (en) 2004-11-19 2006-06-08 Matsushita Electric Works Ltd Adjuster and adjusting method of non-contact ic card
JP2006151402A (en) 2004-11-25 2006-06-15 Rengo Co Ltd Corrugated box with radio tag
US7545328B2 (en) * 2004-12-08 2009-06-09 Electronics And Telecommunications Research Institute Antenna using inductively coupled feeding method, RFID tag using the same and antenna impedance matching method thereof
JP4281683B2 (en) 2004-12-16 2009-06-17 株式会社デンソー Ic tag of the mounting structure
JP4942998B2 (en) 2004-12-24 2012-05-30 株式会社半導体エネルギー研究所 The method for manufacturing a semiconductor device and a semiconductor device
US8716834B2 (en) 2004-12-24 2014-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including antenna
JP4541246B2 (en) 2004-12-24 2010-09-08 トッパン・フォームズ株式会社 Non-contact ic module
JP4737505B2 (en) 2005-01-14 2011-08-03 日立化成工業株式会社 Method for producing Ic tag inlet and ic tag inlet
JP4711692B2 (en) 2005-02-01 2011-06-29 富士通株式会社 Meander line antenna
JP2006237674A (en) 2005-02-22 2006-09-07 Suncall Corp Patch antenna and rfid inlet
JP2006232292A (en) 2005-02-22 2006-09-07 Nippon Sheet Glass Co Ltd Container with electronic tag, and rfid system
JP4330575B2 (en) 2005-03-17 2009-09-16 富士通株式会社 Tag antenna
JP4437965B2 (en) 2005-03-22 2010-03-24 Necトーキン株式会社 Wireless tag
JP4087859B2 (en) * 2005-03-25 2008-05-21 東芝テック株式会社 Wireless tag
JP4750450B2 (en) 2005-04-05 2011-08-17 富士通フロンテック株式会社 Rfid tag
JP2006302219A (en) 2005-04-25 2006-11-02 Fujita Denki Seisakusho:Kk Rfid tag communication range setting device
EP1724708B1 (en) * 2005-04-26 2016-02-24 Amotech Co., Ltd. Magnetic sheet for radio frequency identification antenna, method of manufacturing the same.
JP4771115B2 (en) 2005-04-27 2011-09-14 日立化成工業株式会社 Ic tag
JP4452865B2 (en) 2005-04-28 2010-04-21 智三 太田 Radio ic tag device and rfid system
JP4529786B2 (en) * 2005-04-28 2010-08-25 株式会社日立製作所 Signal processing circuit, and the non-contact ic card and tag with this
JP4740645B2 (en) 2005-05-17 2011-08-03 富士通株式会社 A method of manufacturing a semiconductor device
JP2007007888A (en) 2005-06-28 2007-01-18 Oji Paper Co Ltd Non-contact ic chip mount body mounting corrugated cardboard and its manufacturing method
JP4720348B2 (en) 2005-08-04 2011-07-13 パナソニック株式会社 Rf-id reader writer device antenna and rf-id reader writer and rf-id system using the same
JP4737716B2 (en) 2005-08-11 2011-08-03 ブラザー工業株式会社 RFID ic circuit holder, tag tape roll, RFID cartridge
JP4801951B2 (en) * 2005-08-18 2011-10-26 富士通フロンテック株式会社 Rfid tag
JP4384102B2 (en) 2005-09-13 2009-12-16 株式会社東芝 Portable radio and the antenna device
JP4075919B2 (en) 2005-09-29 2008-04-16 オムロン株式会社 Antenna unit and the non-contact ic tag
JP4826195B2 (en) 2005-09-30 2011-11-30 大日本印刷株式会社 Rfid tag
JP4774273B2 (en) 2005-10-31 2011-09-14 株式会社サトー Rfid labels and rfid sticking method of label
JP4747783B2 (en) 2005-10-31 2011-08-17 凸版印刷株式会社 Inlet and its impedance for Rfid tags adjusting method and rfid tag
JP2007159083A (en) 2005-11-09 2007-06-21 Alps Electric Co Ltd Antenna matching circuit
JP2007150642A (en) 2005-11-28 2007-06-14 Hitachi Ulsi Systems Co Ltd Interrogator for wireless tag, antenna for wireless tag, wireless tag system, and wireless tag selector
JP2007150868A (en) 2005-11-29 2007-06-14 Renesas Technology Corp Electronic equipment and method of manufacturing the same
JP4871579B2 (en) 2005-12-01 2012-02-08 東芝テック株式会社 Wireless tag adjustment system
US7573388B2 (en) 2005-12-08 2009-08-11 The Kennedy Group, Inc. RFID device with augmented grain
KR101010834B1 (en) 2006-01-19 2011-01-25 가부시키가이샤 무라타 세이사쿠쇼 Ic wireless devices and components for a wireless device ic
US7519328B2 (en) 2006-01-19 2009-04-14 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
JP4123306B2 (en) 2006-01-19 2008-07-23 株式会社村田製作所 Wireless ic device
JP4026080B2 (en) 2006-02-24 2007-12-26 オムロン株式会社 Antenna, and rfid tag
WO2007105607A1 (en) * 2006-03-10 2007-09-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP4735368B2 (en) 2006-03-28 2011-07-27 富士通株式会社 Planar antenna
CN101416353B (en) 2006-04-10 2013-04-10 株式会社村田制作所 Wireless IC device
CN101346852B (en) 2006-04-14 2012-12-26 株式会社村田制作所 Wireless IC device
WO2007119310A1 (en) 2006-04-14 2007-10-25 Murata Manufacturing Co., Ltd. Antenna
AT539463T (en) 2006-04-26 2012-01-15 Murata Manufacturing Co object with food-provided circuit board
CN101351817B (en) 2006-04-26 2012-04-25 株式会社村田制作所 Article provided with electromagnetically coupled module
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US7589675B2 (en) 2006-05-19 2009-09-15 Industrial Technology Research Institute Broadband antenna
WO2007138857A1 (en) 2006-06-01 2007-12-06 Murata Manufacturing Co., Ltd. Radio frequency ic device and composite component for radio frequency ic device
WO2008007606A1 (en) 2006-07-11 2008-01-17 Murata Manufacturing Co., Ltd. Antenna and radio ic device
DE102006057369A1 (en) 2006-12-04 2008-06-05 Airbus Deutschland Gmbh Radio frequency identification tag for e.g. identifying metal container, has radio frequency identification scanning antenna with conductor loop that is aligned diagonally or perpendicularly to attachment surface
EP2148449B1 (en) 2007-05-11 2012-12-12 Murata Manufacturing Co., Ltd. Wireless ic device
JP4561932B2 (en) 2007-07-18 2010-10-13 株式会社村田製作所 Wireless ic device
EP2096709B1 (en) 2007-12-20 2012-04-25 Murata Manufacturing Co., Ltd. Radio ic device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5710458A (en) * 1993-12-20 1998-01-20 Kabushiki Kaisha Toshiba Card like semiconductor device
US5852289A (en) * 1994-09-22 1998-12-22 Rohm Co., Ltd. Non-contact type IC card and method of producing the same
US5995006A (en) * 1995-09-05 1999-11-30 Intermec Ip Corp. Radio frequency tag
US20060055601A1 (en) * 2002-07-05 2006-03-16 Shozaburo Kameda Antenna with built-in filter
US20060001138A1 (en) * 2004-06-30 2006-01-05 Hitachi, Ltd. IC-tag-bearing wiring board and method of fabricating the same
US20060044769A1 (en) * 2004-09-01 2006-03-02 Forster Ian J RFID device with magnetic coupling
US20060208899A1 (en) * 2005-03-07 2006-09-21 Kenji Suzuki RFID relay antenna, RFID system, container, disposition method, communication confirmation method, and package construction
US20070004028A1 (en) * 2005-03-10 2007-01-04 Gen-Probe Incorporated Signal measuring system for conducting real-time amplification assays
US20060267138A1 (en) * 2005-05-30 2006-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20070052613A1 (en) * 2005-09-06 2007-03-08 Sebastian Gallschuetz Radio frequency identification transponder antenna

Cited By (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8725071B2 (en) 2006-01-19 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8228765B2 (en) 2006-06-30 2012-07-24 Murata Manufacturing Co., Ltd. Optical disc
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US20080119135A1 (en) * 2006-11-21 2008-05-22 Takanori Washiro Communication system and communication apparatus
US7853208B2 (en) * 2006-11-21 2010-12-14 Sony Corporation Communication system and communication apparatus
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US20090278760A1 (en) * 2007-04-26 2009-11-12 Murata Manufacturing Co., Ltd. Wireless ic device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US20100038437A1 (en) * 2007-05-11 2010-02-18 Murata Manufacturing Co., Ltd. Wireless ic device
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8662403B2 (en) 2007-07-04 2014-03-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
US8413907B2 (en) 2007-07-17 2013-04-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US9830552B2 (en) 2007-07-18 2017-11-28 Murata Manufacturing Co., Ltd. Radio IC device
US20090262041A1 (en) * 2007-07-18 2009-10-22 Murata Manufacturing Co., Ltd. Wireless ic device
US8380124B2 (en) * 2008-02-06 2013-02-19 Hitachi, Displays, Ltd. Communication system by electrostatic coupling and electromagnetic induction
US20090197529A1 (en) * 2008-02-06 2009-08-06 Hitachi Displays, Ltd Communication system by electrostatic coupling and electromagnetic induction
US20100302013A1 (en) * 2008-03-03 2010-12-02 Murata Manufacturing Co., Ltd. Radio frequency ic device and radio communication system
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US9022295B2 (en) 2008-05-21 2015-05-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8973841B2 (en) 2008-05-21 2015-03-10 Murata Manufacturing Co., Ltd. Wireless IC device
US20110043338A1 (en) * 2008-05-26 2011-02-24 Murata Manufacturing Co., Ltd. Wireless ic device system and method of determining authenticity of wireless ic device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
CN104362424A (en) * 2008-11-17 2015-02-18 株式会社村田制作所 The wireless communication device
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9136212B2 (en) * 2009-04-02 2015-09-15 Murata Manufacturing Co., Ltd. Circuit board
US20120012369A1 (en) * 2009-04-02 2012-01-19 Murata Manufacturing Co., Ltd. Circuit board
JP2014147097A (en) * 2009-04-14 2014-08-14 Murata Mfg Co Ltd Wireless IC device
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8876010B2 (en) 2009-04-14 2014-11-04 Murata Manufacturing Co., Ltd Wireless IC device component and wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US9203157B2 (en) 2009-04-21 2015-12-01 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9564678B2 (en) 2009-04-21 2017-02-07 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8424771B2 (en) 2009-07-01 2013-04-23 Fujitsu Limited RFID tag
US20110001608A1 (en) * 2009-07-01 2011-01-06 Fujitsu Limited Rfid tag
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8704716B2 (en) 2009-11-20 2014-04-22 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8941552B2 (en) 2010-02-19 2015-01-27 Murata Manufacturing Co., Ltd. Composite printed wiring board and wireless communication system
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8528829B2 (en) 2010-03-12 2013-09-10 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US20110226860A1 (en) * 2010-03-16 2011-09-22 Industrial Technology Research Institute Printed circuit board with antenna for rfid chip and method for manufacturing the same
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
EP2555494B1 (en) * 2010-03-31 2019-05-08 Dexerials Corporation Antenna device and communication device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US20130002404A1 (en) * 2010-08-10 2013-01-03 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8981906B2 (en) * 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US8960561B2 (en) 2011-02-28 2015-02-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8757502B2 (en) 2011-02-28 2014-06-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US20130044039A1 (en) * 2011-08-19 2013-02-21 Hon Hai Precision Industry Co., Ltd. Ceramic antenna
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag
CN104733862A (en) * 2012-06-28 2015-06-24 株式会社村田制作所 The communication terminal apparatus
US9858458B2 (en) * 2012-12-04 2018-01-02 Nec Corporation Device detecting spatial variation of complex permittivity and system detecting presence/absence of article
US20170177914A1 (en) * 2012-12-04 2017-06-22 Nec Corporation Device detecting spatial variation of complex permittivity and system detecting presence/absence of article
US9940564B2 (en) 2014-04-28 2018-04-10 Murata Manufacturing Co., Ltd. Wireless IC device, clip-shaped RFID tag, and article having RFID tag
CN106207478A (en) * 2015-04-07 2016-12-07 智易科技股份有限公司 Dual-band antenna disposed on both sides of a substrate

Also Published As

Publication number Publication date
US20110074584A1 (en) 2011-03-31
US8400307B2 (en) 2013-03-19

Similar Documents

Publication Publication Date Title
EP2573871B1 (en) Antenna apparatus and communication terminal apparatus
CN103729676B (en) Wireless device ic
CN102576929B (en) The antenna device and a mobile communication terminal
CN103500873B (en) Ic ic wireless device and a wireless module
JP4561932B2 (en) Wireless ic device
CN101960665B (en) Radio IC device
US8690070B2 (en) Wireless IC device component and wireless IC device
EP2680193B1 (en) Apparatus comprising an RFID device
CN101558532B (en) Radio IC device and component for radio IC device
WO2009142288A1 (en) Wireless ic device
US8757500B2 (en) Wireless IC device
JP5024372B2 (en) Wireless ic device
JP5733435B2 (en) Printed wiring board
WO2011001709A1 (en) Antenna and antenna module
US8081119B2 (en) Product including power supply circuit board
US8006910B2 (en) Wireless IC device
US7764928B2 (en) Wireless IC device and component for wireless IC device
US10013650B2 (en) Wireless communication module and wireless communication device
WO2011118379A1 (en) Rfid system
US8610636B2 (en) Radio frequency IC device
JP3148168U (en) Wireless ic device
EP2071495B1 (en) Wireless ic device
JPWO2008007606A1 (en) Antenna and wireless ic device
EP2251934B1 (en) Wireless ic device and wireless communication system
JP2008072243A (en) Wireless ic device

Legal Events

Date Code Title Description
AS Assignment

Owner name: MURATA MANUFACTURING CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KATAYA, TAKESHI;KATO, NOBORU;ISHINO, SATOSHI;AND OTHERS;REEL/FRAME:021569/0555;SIGNING DATES FROM 20080901 TO 20080916

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION