JP3126782B2 - Method for manufacturing thin semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thin semiconductor device, for example , a method for manufacturing an IC card in which a semiconductor module substrate is embedded in resin of a card base.

[0002]

2. Description of the Related Art Conventionally, as an IC card, a card case forming an outer peripheral portion of an IC card and having a built-in wiring board on which functional components are mounted, or a semiconductor module is fitted into a concave portion of a card base and adhered. There is something. This type of IC card will be described with reference to FIGS. FIGS. 6A and 6B show an example of a conventional IC card in which a functional component is built in a card case, wherein a is a plan view and b is a cross-sectional view taken along the line II-II in FIG. In these figures, 1 is an IC card,
The board 2 on which the functional component 3 is mounted is housed in the lower case 10a which forms one side of the card, and a spacer 11 is inserted into the space to fill the space after housing the board 2 in the case 10, and the upper case 10b is covered in this state. To form an IC card 1. 7 is a view showing a state in which the upper case 10b is removed from FIG. 6, wherein a is a plan view, and b is a cross-sectional view taken along a hoe line in FIG. The board 2 on which the functional component 3 shown in FIG. c is mounted is housed in the lower case 10a shown in FIG. d, as shown in FIGS.

FIGS. 8A and 8B are views showing another conventional IC card, wherein FIG. 8A is a plan view and FIG. 8B is a sectional view taken along line II-II of FIG. In these figures, 1 is an IC card, and 13 is a semiconductor module (hereinafter simply referred to as a module) fixed to the card base 12. The card base 12 is
Manufactured from molded products such as ABS resin, modules
A recess into which 13 is fitted is formed. The recess 12a is formed in the upper surface of the card base 12 so as to open. The module 13 is fixed to the concave portion 12a of the base with the electrode terminal 14 as an outer surface of the card, by arranging an adhesive on the bottom surface of the concave portion or treating the surface of the module in contact with the concave portion of the module.

[0004]

In the conventional card constructed as described above, the space in the case 10 is reduced, and
A spacer 11 is used to prevent the card 1 from being deformed by an external force, or a card base 12 and a module 13 are used.
There are many problems, such as that the shape of the module 13 and the shape of the concave portion 12a must be accurately matched in order to firmly bond the module 13 and eliminate the step on the card surface. In addition, an IC card has been manufactured by assembling a large number of parts integrally by bonding or the like.

As a method for solving such a problem,
There is a method of manufacturing an IC card by integral molding. That is, this is a method of manufacturing an IC card by integrally molding a substrate on which a functional component is mounted in a mold. In this case, when the thickness of the substrate is large, there is also a method of mechanically fixing the substrate to the card base with a molding resin, but when the thickness of the substrate is thin, such as when using a film substrate, the substrate is mechanically fixed. Is difficult to fix.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and by improving the bonding method at the time of integrally molding a substrate and a resin, it is possible to obtain a bonding method that is easy and reliable. The purpose is to obtain.

[0007]

A thin semiconductor device according to the present invention.
The method of manufacturing the body device includes the steps of:
After processing the heat-sensitive adhesive beforehand,
Therefore, together with the electronic components mounted on the wiring board,
Embedded and molded, especially the heat-sensitive type
For the adhesive treatment of the adhesive on the wiring board, release paper on one side
Die the heat-sensitive adhesive sheet into the desired shape
And bonding the adhesive surface of the adhesive sheet to the base of the wiring board.
The step of stacking on the plate surface and the above-mentioned by a hot roll or hot plate
Bonding the adhesive surface of the adhesive sheet to the substrate surface;
Is included. In addition, wiring board with heat-sensitive adhesive
Adhesive treatment to heat-sensitive type with release paper on one side
Punching a desired portion of the adhesive sheet, and the adhesive
Arrange the adhesive side of the sheet to a size larger than the desired size.
The process of stacking on the substrate surface of a wire substrate, and a hot roll or hot plate
Bonding the adhesive surface of the adhesive sheet to the substrate surface
And simultaneously performing the wiring substrate and the adhesive sheet
And finishing to the desired size.
It is. Also, a method of manufacturing a thin semiconductor device according to the present invention.
The method is characterized in that both sides of the substrate are subjected to an adhesive treatment.
Things.

[0008]

According to the method of manufacturing a thin semiconductor device of the present invention, if the surface of the portion of the substrate to be embedded in the molding resin is previously treated with a heat-sensitive adhesive, there is no troublesome step and the injection molding step can be performed simultaneously. The molding resin and the substrate can be bonded. Moreover, even if the substrate is treated with a heat-sensitive adhesive that is solid at room temperature and the functional component is not subjected to the adhesive treatment, the mounting of the functional component does not hinder anything. Sometimes adhesive processing can be done,
Adhesive treatment can be performed efficiently using a heat roll or the like.

[0009]

【Example】

Embodiment 1 FIG. Hereinafter, one embodiment of the present invention will be described with reference to FIGS.
It will be explained by. 1A and 1B are views showing an IC card according to the present invention, FIG. 1A is a plan view, and FIG.
It is an A line sectional view. In the figure, a functional component 3 is connected to a wiring pattern (not shown) of a substrate 2 and mounted on the substrate. One surface of the substrate 2 is a panel 4 forming one surface of a card, and the other surface is covered with a molding resin 6. ing. The configuration of this IC card will be described in more detail. FIG. 2 is a plan view of the substrate 2 shown in FIG. 1. A heat-sensitive adhesive sheet having a melting point of 80.degree. It is. The treatment of the adhesive 7 is shown in FIGS. As shown in FIG. 4A, an adhesive sheet having a release paper 8 on one side of a predetermined shape is superimposed on a surface of the substrate 2 at a predetermined position of the substrate 2 on which no components are mounted, and
The substrate 2 and the heat-sensitive adhesive 7 are thermally fused as shown in FIG. In this state,
After mounting the functional components of the IC card on the substrate 2 and connecting the connection circuits by soldering, the release paper 8 is removed to bring the state shown in FIG. FIG. 2B shows an example in which only the surface of the substrate 2 in contact with the molding resin 6 is subjected to the adhesive treatment, and FIG. 2C shows an example in which the lower surface in contact with the panel 4 is also subjected to the adhesive treatment. Although the adhesive treatment on the panel 4 side is not shown, the adhesive treatment may be performed on the panel 4 itself.

The substrate 2 thus treated with an adhesive is formed into a card by the procedure shown in FIG. FIG. 5 is a cross-sectional view showing an injection molding process in which the substrate 2 on which the functional component 3 is mounted is integrally formed to form an IC card. 5 and set the substrate 2 on which the panel 4 and the functional component 3 are mounted inside the frame 5. In this state, the upper mold 9 b is fastened, and the molding resin 6 is injected from the gate 9 c to form the inside of the frame 5. The substrate 2 and the functional component 3 are embedded and injection molded integrally. In this example, a glass fiber reinforced epoxy resin substrate having a thickness of 0.2 mm was used as the substrate 2, and a glass fiber filled liquid crystal polymer was used for the frame 5 and the injection molding resin 6. The resin temperature during injection molding was set at 240 ° C. Since the melting point of the heat-sensitive adhesive treated on the substrate 2 is 80 ° C., it is melted by the heat of the injection molding resin at the time of molding.
The molding resin 6 and the heat-sensitive adhesive 7 are bonded to each other in a molten state at the end of the molding cycle, and are cooled in the pressurized state. Adhered to.

Embodiment 2 FIG. 3A and 3B are views showing another embodiment, in which a is a plan view, and b is a cross-sectional view taken along the line c-a in FIG. In this embodiment, the substrate 2a includes a plurality of IC cards 1
Substrate 2 is a single continuous substrate, and a heat-sensitive adhesive 7 sheet having release paper 8 on one side is also a continuous sheet formed by punching out a portion where the functional component 3 is mounted as a through hole. I have. The two are superimposed in a predetermined positional relationship with the adhesive surface as the substrate surface, and passed between heat rolls for heat treatment.
The heat-sensitive adhesive 7 is adhered to the substrate 2a. FIG. 2B shows such a state, and the portion on which the functional component 3 is mounted is not treated with an adhesive. After the substrate 2a has been subjected to the adhesive treatment in this manner, it is cut at a substrate cutting position indicated by 2b, which is the size required for each card, as shown in FIG. After that, the mounting of the functional component and the formation of a card by integral molding are the same as in the first embodiment.

As described above, the hot-melt type heat-sensitive adhesive 7 having the release paper 8 on one side of the substrate 2 in advance is adhered to the necessary parts by heat treatment, the release paper 8 is removed, and then integrated by injection molding. Molded into IC card functional parts 3
Embedded in a resin to strongly protect the functional component 3 as an IC card and the substrate 2 constituting a circuit, and to increase the number of steps particularly for strong adhesion between the substrate 2 and the molding resin 6 forming a card base. And obtained in the injection molding process. In the present embodiment, the peripheral portion and the central portion of the substrate are subjected to the adhesive treatment. However, depending on the size and area of the substrate, the treatment may be performed on the entire surface of the IC card where no functional component is mounted. May be applied to only two sides or four corners, or only to the periphery. In any case, at least four corners of a rectangular substrate need to be treated with an adhesive. When the thickness of the substrate is large, an adhesive treatment on the side surface of the substrate is also effective.

Although liquid crystal polymer is used for injection molding, the present invention is not limited to this case depending on the combination with the substrate. If there is no inconvenience such as warpage in the integrally molded IC card, other thermoplastic resin may be used. Of course, the same effect can be obtained even if used. And it is a matter of course that the melting temperature of the heat-sensitive type adhesive is not limited to 80 ° C. Selection is the minimum condition. The heat-sensitive adhesive does not necessarily have to have release paper as long as it is in the form of a sheet. However, a solution-type adhesive requires an application step. Further, the effect of the adhesive treatment on the substrate is the same even after the functional component is mounted.

[0014]

As described above, according to the present invention, a heat-sensitive adhesive sheet is preliminarily applied to a necessary portion of the substrate by thermal transfer on the substrate before the components are mounted, and a release paper is attached immediately before injection molding. It can be passed through the mounting process of functional parts as it is, and since the adhesive is solid at room temperature, it does not adhere to other things, and it is strongly bonded by the temperature and pressure of the injection molding resin in the injection molding process Therefore, there is an effect that a highly reliable thin semiconductor device can be easily obtained by a simple process.

[Brief description of the drawings]

FIG. 1 is a diagram showing an IC card according to one embodiment of the present invention, wherein a is a plan view and b is a cross-sectional view taken along the line II in FIG.

FIG. 2 is a diagram showing a circuit board on which functional components of an IC card according to another embodiment of the present invention are mounted, wherein a is a plan view, b and c.
FIG. 2 is a sectional view taken along line 2-2 in FIG.

3A and 3B are views showing an adhesion processing substrate according to the present invention, wherein a is a plan view, and b is a cross-sectional view taken along a line c-a in FIG.

FIG. 4 is a cross-sectional view showing an adhesion processing step according to the present invention;
Proceed in the order of a, b, and c.

FIG. 5 is a cross-sectional view showing a molding process of the IC card according to the present invention, and IC cards are formed in the order of a to d.

FIG. 6 is a diagram showing a conventional IC card, where a is a plan view and b
FIG. 2 is a sectional view taken along the line II in FIG.

7A and 7B are views showing a part of a conventional IC card, where a is a plan view, and b, c, and d are cross-sectional views taken along a ho-ho line.

FIG. 8 is a view showing another conventional IC card, in which a is a plan view and b is a cross-sectional view taken along line f-a in FIG.

FIG. 9 is a cross-sectional view illustrating a configuration of a conventional IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC card 2 Substrate 2a Substrate 2b Substrate cutting position 3 Functional parts 4 Panel 5 Frame 6 Molding resin 7 Thermal adhesive 8 Release paper 9 Mold 9a Lower mold 9b Upper mold 9c Gate

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-14194 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G06K 19/077 B42D 15/10 521

Claims (3)

(57) [Claims] 1. A circuit board on which electronic components are mounted is injection-molded.
Embedded in resin along with electronic components depending on shape
In a method of manufacturing a thin semiconductor device to be a body device, a heat-sensitive type contact portion is previously formed on a portion of the wiring substrate which contacts the molding resin.
After treating the adhesive, the molding resin
It is embedded and molded together with the mounted electronic components, and the adhesive processing of the heat-sensitive adhesive to the wiring board is performed.
Is a heat-sensitive adhesive sheet with release paper on one side.
Stamping into a predetermined shape;
The process of superposing the adhesive surface on the substrate surface of the wiring board and the heat roll
Alternatively, the adhesive surface of the adhesive sheet is
Bonding to a plate surface . 2. A wiring board on which electronic components are mounted is injection-molded.
Embedded in resin along with electronic components depending on shape
In a method of manufacturing a thin semiconductor device to be a body device, a heat-sensitive type contact portion is previously formed on a portion of the wiring substrate which contacts the molding resin.
After treating the adhesive, the molding resin
It is embedded and molded together with the mounted electronic components, and the adhesive processing of the heat-sensitive adhesive to the wiring board is performed.
The principle is to use a heat-sensitive adhesive sheet with release paper on one side.
Punching a desired portion and bonding the adhesive sheet
Wiring board whose size is larger than desired
And a hot roll or hot plate.
Bonding the adhesive surface of the adhesive sheet to the substrate surface,
Before punching the wiring board and the adhesive sheet simultaneously
And finishing to a desired size.
Method of manufacturing a thin semiconductor device that. 3. The method for manufacturing a thin semiconductor device according to claim 1 , wherein an adhesive treatment is performed on both surfaces of the substrate.