JP2001093934A - Method of manufacturing parts mounted with semiconductor part and finished product mounted with semiconductor part, and finished product mounted with semiconductor part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a high-quality, high- productivity and inexpensive assembly mounted with a semiconductor part, a method for manufacturing a finished product mounted with a semiconductor part, and a finished product mounted with a semiconductor part. SOLUTION: A semiconductor element 114 is buried in a first thermoelestic resin substrate 122, and a circuit pattern 116 is formed on the buried semiconductor element 114, thereby completing the mounting. Therefore, no anisotropic conductive sheet is used for mounting, so that the productivity can be improved greatly and the cost be reduced significantly than before. In addition, since the circuit pattern 116 is formed on the buried semiconductor element 114, the semiconductor element 114 can be prevented from sinking in the substrate. As a result, parts mounted with semiconductor part which has no disconnection in the circuit pattern and high quality can be produced stably.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC
An electronic component such as an IC chip, which is used when an IC chip is electrically connected to connection pads provided on a circuit pattern made of a conductive paste as in the case of manufacturing a card, is mounted on a base material. Of manufacturing a semiconductor component mounted component by manufacturing a semiconductor component mounted component, a method of manufacturing a semiconductor component mounted finished product having the semiconductor component mounted component manufactured by the manufacturing method, and the semiconductor component mounted completion The present invention relates to a completed semiconductor component mounted product manufactured by a product manufacturing method.

[0002]

2. Description of the Related Art A non-contact IC card will be described as an example, and a conventional method of manufacturing a completed product with semiconductor components mounted thereon will be described below with reference to FIGS. Conventionally, coils and I
When manufacturing a non-contact IC card that incorporates a C chip and transfers data with the outside through the coil,
Examples of the method of forming the coil include a method using a winding coil made of copper, a method of forming a coil by printing a conductive paste such as a silver paste, and a method of forming a coil by etching a metal foil such as a copper foil. In particular, a method of forming a circuit pattern and a coil by printing the above-mentioned conductive paste is becoming popular.

FIGS. 20 to 27 show a conventional non-contact IC card and a method of manufacturing the same. As shown in FIG. 20, in a conventional non-contact IC card, a coil pattern 2 is formed of a conductive paste on a first base material 1a.
The connection pad 6 provided on the outer peripheral end 3a of the coil pattern 2 and the connection pad 6 provided on the inner peripheral end 3b of the coil pattern 2
It is configured to be electrically connected to the electrode part of the C chip 4. In the manufacturing process, as shown in FIG. 21, first, in step (indicated by “S” in the figure) 1, the first base material 1 a
A circuit pattern including the coil pattern 2 is printed on the surface of the substrate with a conductive paste. As the conductive paste,
Silver paste is preferably used. The printing of the conductive paste is performed by screen printing, offset printing, gravure printing, or the like.
A conductive paste is printed on the first base material 1a through a mask of 65 mesh / inch and an emulsion thickness of 10 μm to form a circuit pattern with a conductor thickness of about 30 μm. The first base material 1
a and a second base material 2b described later have a thickness of 0.1 to 0.5 made of polyethylene terephthalate, vinyl chloride, polycarbonate, acrylonitrile butadiene styrene, or the like.
A thermoplastic resin of about mm is used.

[0004] In step 2, the first printing method is used.
The circuit pattern made of the conductive paste formed on the base material 1a is heated at a temperature of 120 ° C. for 10 minutes to cure the conductive paste. In step 3, FIG.
As shown in FIG.
Then, an anisotropic conductive sheet 9 is attached to the connection pad 6 provided on the inner peripheral end 3b. The anisotropic conductive sheet is a resin sheet containing metal particles, and electrically connects the metal particles and the connection pads 6 by being heated and pressed. In Step 4, the anisotropic conductive sheet 9 is heated to 100 ° C.
For 5 seconds to temporarily press the connection pads 6. In step 5, the semiconductor element 4 is placed on the temporarily compressed anisotropic conductive sheet 9.
And components such as capacitors. On the mounting surface of the semiconductor element 4, bumps 10 are formed on the electrode pads 7 on the semiconductor element 4 as shown in FIG. 23, and the bumps 10 and the connection pads 6 are anisotropically conductive as shown in FIG. They are electrically connected via the sheet 9. The bump 10 is formed by a wire bonding method or a plating method, specifically, solder, gold,
It is formed on the electrode pad 7 of the semiconductor element 4 by a plating method using silver and copper. In step 6, the semiconductor element 4 is heated at a temperature of 200 ° C. for 30 seconds to cure the anisotropic conductive sheet 9 as shown in FIG.

In general semiconductor mounting using a glass epoxy substrate or a ceramic substrate for the first base member 1a, the mounting of the semiconductor element is completed up to step 6. Then, in step 7, by laminating the first base material 1 a with the second base material 1 b, as shown in FIG. 26, the connection pads 6 and the bumps 10 are interposed via the anisotropic conductive paste 9. Thus, an IC card electrically connected is obtained. In FIG. 26, reference numeral 5 denotes a capacitor connected in parallel to the coil pattern 2.

[0006]

However, in the above-described conventional method for manufacturing a completed product with semiconductor components mounted thereon and the configuration of a non-contact IC card as a completed product with semiconductor components mounted manufactured by the manufacturing method, There were the following problems. The first
In general, inexpensive thermoplastic resins such as polyethylene terephthalate and vinyl chloride are used for the substrate 1a and the second substrate 1b. On the other hand, in the conventional manufacturing process, the temperature at the time when the semiconductor element 4 is fully press-bonded via the anisotropic conductive sheet 9 in the above step 6 is as high as 200 ° C. or more, so that the first base material 1a having poor heat resistance is used. And that the second base material 1b is easily deteriorated.

Further, in order to fix the components such as the semiconductor element 4 to the first base member 1a by using the anisotropic conductive sheet 9, the anisotropic conductive sheet 9 is temporarily press-bonded to the first base member 1a. A pressure step is required. Therefore, there is a problem that the number of processes is increased, productivity is reduced, and costs are increased. Also, the anisotropic conductive sheet 9
The same applies to the case where anisotropic conductive particles are used instead of.

Further, since the semiconductor element 4 is pressurized and heated at the time of the laminating process in the step 7, the semiconductor device 4 shown in FIG.
As shown in FIG. 7, the semiconductor element 4 sinks into the first base material 1a, and the circuit pattern 6 made of the conductive paste is deformed into a curved shape. As a result, the possibility of disconnection of the circuit pattern is high, and a malfunction such as malfunction occurs. The present invention has been made in order to solve such problems, and is a method for manufacturing a high-quality, high-productivity, and inexpensive semiconductor component-mounted component, a method for manufacturing a semiconductor-component-completed product, and a semiconductor component. The purpose is to provide mounted finished products.

[0009]

According to a first aspect of the present invention, there is provided a method of manufacturing a component on which a semiconductor component is mounted, wherein the semiconductor component is inserted into a base material and a circuit of the semiconductor component is provided on a pattern forming surface of the base material. The connection portion is exposed, and a circuit pattern formed of a conductive paste, which is electrically connected to the semiconductor component by contacting the circuit connection portion, is formed on the pattern forming surface, thereby forming the circuit pattern on the circuit pattern. Mounting a semiconductor component.

The base material is made of a thermoplastic resin material,
Insertion of the semiconductor component into the base material is performed by heating the semiconductor component and the base material and pressing the semiconductor component and the base material relative to each other. The substrate may be exposed on the pattern forming surface.

[0011] The circuit connection portion includes an electrode of the semiconductor component, a bump formed on the electrode, and a circuit connection member formed on a member forming surface of the bump. The semiconductor component is inserted into the base material. When this is done, the circuit connection member may be in a state of protruding from the pattern formation surface, and the circuit pattern may be in contact with the circuit connection member.

According to a second aspect of the present invention, there is provided a method of manufacturing a completed semiconductor component-mounted component, the method comprising manufacturing the semiconductor component-mounted component using the semiconductor component-mounted component manufacturing method of the first aspect.
The manufactured semiconductor component-mounted component is sealed with a resin material to manufacture a semiconductor component-mounted finished product.

According to a third aspect of the present invention, a completed semiconductor component mounted product is manufactured using the above-described method for manufacturing a completed semiconductor component mounted product according to the second aspect.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a semiconductor component-mounted component, a method for manufacturing a semiconductor component-mounted completed product, and a semiconductor component-mounted completed product according to embodiments of the present invention will be described below with reference to the drawings. explain. Here, the method of manufacturing the completed semiconductor component mounted product is a method of manufacturing a semiconductor component mounted completed product having the semiconductor component mounted component manufactured by the method of manufacturing the semiconductor component mounted component, and The completed semiconductor component mounted product is manufactured by the method of manufacturing a semiconductor component mounted finished product. In the drawings, the same components are denoted by the same reference numerals.

In the present embodiment, the first thermoplastic resin substrate 122 is taken as an example of fulfilling the function of the "substrate" described in the "Means for Solving the Problems". In the present embodiment, one set of the electrode 117, the bump 113, and the circuit connecting member 118 is taken as an example that fulfills the function of "." However, the "circuit connection part"
The concept is not limited to this, and includes the case of only the electrode 117 and the case of the electrode 117 and the bump 113. Further, in the present embodiment, a non-contact IC card is taken as an example which fulfills the function of “finished product with semiconductor components mounted thereon”, but is not limited to this. Also, in the present embodiment, the electrode 1
17, only the electrode 117 and the bump 113 are taken as an example.

FIG. 1 shows a non-contact IC card 101 as an example of a completed semiconductor component mounted product provided with a semiconductor component mounted component manufactured using the method of manufacturing a semiconductor component mounted component of the present embodiment. Is shown. In the non-contact IC card 101, the semiconductor element 114 is embedded in the first thermoplastic resin base material 122 in advance, and the bumps 11 exposed on the pattern forming surface 123 of the first thermoplastic resin base material 122 are formed.
The circuit connecting member 118 is formed on the third member forming surface 115. The circuit pattern 116 formed of the conductive paste and the circuit connecting member 118 are different from the conventional example in that electrical continuity is obtained directly without using an anisotropic conductive sheet or the like. 1
24 and 125 are the semiconductor element 114 and the circuit pattern 1
A second thermoplastic resin sheet base material and a third thermoplastic resin sheet base material that are subjected to a laminating process to protect the semiconductor component-mounted component 121 having No. 16. Hereinafter, a manufacturing procedure of the non-contact IC card 101 will be described with reference to FIGS. 2 to 8 and FIG.

In FIG. 2, reference numeral 117 denotes an electrode of a semiconductor element 114 corresponding to a semiconductor component;
4 shows a passivation film for protecting the active surface of No. 4. The steps shown in FIGS. 2 and 15 (“S” in FIG. 15)
The electrode 11 of the semiconductor element 114 at 101
The bumps 113 are formed on the substrate 7 by a wire bonding method using a metal wire made of Au, Cu, solder, or the like. Next, in step 102 shown in FIGS. 3 and 15, the semiconductor element 114 on which the bumps 113 are formed is made of a sheet formed of an electrically insulating thermoplastic resin such as polyethylene terephthalate, vinyl chloride, polycarbonate, acrylonitrile butadiene styrene, or the like. First
One or more are mounted on the thermoplastic resin substrate 122. Here, in the case of the present embodiment, the thickness of the first thermoplastic resin base material 122 is such that at least the member forming surface 115 of the bump 113 is in contact with the first thermoplastic resin base material 1.
Basically, the semiconductor device 1
It is desirable that the thickness be equal to or less than the total thickness of the thickness of the semiconductor element 114 and the thickness of the bump 113. For example, the thickness of the semiconductor element 114 is 0.18 m
When the height of the bump 113 is 0.04 mm, the thickness of the first thermoplastic resin base material 122 is preferably 0.2 mm.

Next, step 103 shown in FIG. 4 and FIG.
The first thermoplastic resin substrate 122 on which the semiconductor element 114 with the bump 113 is mounted
1 and 172, semiconductor element 1 with bump 113
The semiconductor element 114 is inserted into the first thermoplastic resin base 122 by pressing them relatively to each other while heating the base 14 and the first thermoplastic resin base 122. The conditions of the hot pressing are, for example, the first thermoplastic resin substrate 1 made of polyethylene terephthalate.
When using No. 22, the pressure is 30 kg / cm ² , and the temperature is 120 kg / cm ² .
° C, press time 1 minute. The temperature and pressure vary depending on the material of the first thermoplastic resin base material 122.

FIG. 5 corresponding to step 104 is a sectional view showing a state of the semiconductor element 114 and the first thermoplastic resin base 122 after the above-described pressing. According to the above-described operation of inserting the semiconductor element 114 into the first thermoplastic resin base material 122, in this embodiment, as shown in FIG.
The member forming surface 115, that is, the surface where the bump 113 contacts the hot press plate 171 by the above pressing,
The semiconductor elements 114 and the bumps 113 are embedded in the first thermoplastic resin base 122 while being exposed on the pattern formation surface 123 of the thermoplastic resin base 122. At this time, in the present embodiment, in order to reduce the thickness, the back surface 114 a facing the active surface of the semiconductor element 114 and the first thermoplastic resin base material 12 facing the pattern forming surface 123 are formed.
The second back surface 122a is made to be the same surface as shown in the figure, but is not limited to this. That is, the thickness of the first thermoplastic resin base 122 and the thickness of the hot press
By adjusting the pressing force and the like of 71 and 172, for example, the semiconductor element 1 is moved from the back surface 122a of the first thermoplastic resin base material 122.
The back surface 114a of the 14 may be projected.

It is to be noted that the member forming surface 115 is an example that functions as an electrical connection surface. In the present embodiment, only the member forming surface 115 is exposed on the pattern forming surface 123 of the first thermoplastic resin base material 122. However, for example, the shape of the hot press plate 171 is devised or the like, so that the member forming surface 115 is formed. In addition, part or all of the bumps 113 may be exposed from the pattern forming surface 123. With such a configuration, the electrical connection surface corresponds to the outer surface of a portion exposed from the pattern forming surface 123. Note that FIG. 16 shows a case where the member forming surface 115 of the bump 113 and the vicinity thereof are exposed from the pattern forming surface 123.

Next, step 1 in FIG. 6 and FIG.
At 05, the member forming surface 11 of the bump 113 exposed on the pattern forming surface 123 of the first thermoplastic resin base material 122
The circuit connecting member 118 is formed on the substrate 5 by a wire bonding method using a metal wire made of Au, Cu, solder, or the like. Next, step 10 in FIGS.
In 6, using a conductive paste such as Ag and Cu,
The circuit pattern 116 electrically connected to the semiconductor element 114 so as to be in contact with the circuit connection member 118, preferably as shown in FIG. 122 is formed on the pattern forming surface 123. The formation of the circuit pattern 116 using the conductive paste is generally performed by screen printing, offset printing, gravure printing, or the like. For example, in the case of screen printing, a conductive paste is printed through a mask of 165 mesh / inch and an emulsion thickness of 10 μm, and a circuit pattern 116 having a conductor thickness of about 30 μm is used.
To form In this embodiment, the formed circuit pattern 116 has the shape of an antenna coil for transmitting and receiving information to and from the semiconductor element 114 wirelessly. Of course, the circuit pattern 116 is not limited to the antenna coil shape, but is formed in a form corresponding to the function of the semiconductor component-mounted component as a product. Thus, the semiconductor element 114 is mounted on the circuit pattern 116. The mounted component in the state shown in FIG. 7 is referred to as a semiconductor component mounted component 121.

Next, step 1 in FIG. 8 and FIG.
In 07, the above-mentioned semiconductor component-mounted component 121 is placed in the thickness direction from the sheet-like second thermoplastic resin base material 124 having electrical insulation such as polyethylene terephthalate, vinyl chloride, polycarbonate, acrylonitrile butadiene styrene, and the third heat component. The components 121 are sandwiched and laminated with the plastic resin substrate 125 to seal the semiconductor component-mounted component 121. The conditions of the lamination process are as follows:
When the second thermoplastic resin substrate 124 and the third thermoplastic resin substrate 125 made of polyethylene terephthalate are pressed with a hot press plate, the pressure is 30 kg / cm ² and the temperature is 120.
° C, pressure rise time 1 minute, pressure hold time 1 minute. Through the above steps, as shown in FIG. 1, a semiconductor component mounted component as a module on which the semiconductor element 114 is mounted, or a semiconductor component mounted component having the semiconductor component mounted component as in the present embodiment. A non-contact IC card 101 corresponding to an example that functions as a completed product is completed.

As described above, according to the present embodiment, a card is formed after the semiconductor element 114 is embedded in the first thermoplastic resin base material 122 in advance.
Base material 1 of semiconductor element 4 after carding as shown in FIG.
No sinking into a occurs. Therefore, the circuit pattern 1
The wire 16 is not disconnected, and it is possible to manufacture a high-quality semiconductor component mounted component and a completed semiconductor component mounted product. Further, since there is no need to use a bonding material such as an anisotropic conductive sheet or anisotropic conductive particles, there is no step required for processing the anisotropic conductive sheet or the like, and a high-productivity and inexpensive semiconductor component-mounted component and It is possible to provide a finished product on which semiconductor components are mounted.

In the above-described embodiment, the circuit connecting member 118 and the circuit pattern 116 are configured to be in contact with each other. However, it is conceivable that the electrical connection with the bump 113 may be slightly inferior. Unlike the semiconductor component mounted component 126 shown in FIG. 16 and the non-contact IC card 106 shown in FIG. 17, the circuit connecting member 118 is not provided, and the bump 113 is formed on the member forming surface 115 and the vicinity thereof, or on the member forming surface. It is also possible to configure so as to achieve electrical connection with the circuit pattern 116 only by using 115. FIG. 16 shows the circuit pattern 11 on the member forming surface 115 and its vicinity.
FIG. 17 shows a case in which electrical connection with the circuit pattern 116 is made only by the member forming surface 115. FIG.
Further, as described above, the hot press plate 1 used when inserting the semiconductor element 114 into the first thermoplastic resin base material 122 is used.
By devising the component 71, unlike the semiconductor component mounted component 127 shown in FIG. 18 and the non-contact IC card 107 shown in FIG. Circuit pattern 11
6 may be directly contacted.
In this case, the surface 117a of the electrode 117 corresponds to the electrical connection surface.

Therefore, when the electrode 117 of the semiconductor element 114 is configured to be in direct contact with the circuit pattern 116, steps 101, 102, and 105 of the above-described steps 101 to 107 are deleted. Further, in the above-described embodiment, the manufacturing process from the point of receiving the supply of the semiconductor element 114 has been described. However, when a product that has already been subjected to the steps 101 to 104 can be supplied, the process can be started from the step 105. If it is possible to supply a material in which the surface 117 a of the electrode 117 of the semiconductor element 114 is exposed on the pattern forming surface 123 of the first thermoplastic resin base material 122, the process can be started from the above-described step 106.

After the circuit pattern 116 is formed on the pattern forming surface 123 in step 107 as shown in FIG. 9, electronic components 129 such as capacitors and resistors are placed at predetermined positions on the circuit pattern 116. Can be formed to form a semiconductor component-mounted component 128. Then, as shown in FIG. 10, the semiconductor component-mounted component 128 is sandwiched and laminated with a second thermoplastic resin base 124 and a third thermoplastic resin base 125 from the thickness direction thereof. The non-contact IC card 102 shown in FIG.

Although FIGS. 1 to 10 only show the connection between the semiconductor element 114 and the circuit pattern 116, FIG. 7 is a plan view showing the entire semiconductor component mounted component 121 shown in FIG. 11 shows a cross-sectional view of the II section shown in FIG. 11, and FIG.
FIG. 13 is a cross-sectional view of the non-contact IC card 101 obtained by laminating the entire structure 21 with a second thermoplastic resin base 124 and a third thermoplastic resin base 125. Also, as shown in FIG.
In order to make a jumper connection between the outer peripheral end 130 of the semiconductor element 114 and the corresponding part 131 of the electrode 117 of the semiconductor element 114, an insulating film 132 is provided on the circuit pattern 116, and then the outer peripheral end 130 and the electrode corresponding part 131 are electrically conductive paste. And electrically connected by a conductive foil 133 or the like. This completes the jumper as shown. The insulating film 132 is formed by bonding a polyester-based insulating foil or printing an insulating paint.

In the above description, when manufacturing a non-contact IC card as an example that fulfills the function of a completed semiconductor component mounted product, the semiconductor component mounted component 121 and the semiconductor component mounted component 128 are replaced by two semiconductor component mounted components. Thermoplastic resin substrate 12
It adopts the configuration of sandwiching at 2,125,
The configuration is not limited to this. For example, when the first thermoplastic resin base material 122 is placed on a plate and sealed, only the third thermoplastic resin base material 125 may be used. Depending on the type, function, etc., two thermoplastic resin base materials 122,
The use of 125 may be appropriately devised.

In the above-described embodiment, in order to improve the tact time, the thickness of the first thermoplastic resin base material 122 is adjusted and the hot press operation is controlled as described above. (1) Inserting operation of semiconductor element 114 with bump 113 into thermoplastic resin base material 122 and bump 11
The operation of exposing the member forming surface 115 to the pattern forming surface 123 is performed in the same step, but is not limited to this. That is, the electrical connection surface, for example, the member formation surface 115 is not exposed to the pattern formation surface 123, and the first thermoplastic resin base 122 is melted by heat generated when the circuit connection member 118 is formed, thereby forming a circuit connection. Member 118
Is formed on the member forming surface 115 and the circuit connecting member 11 is formed.
8 and the member forming surface 115 may be electrically connected.

In the above-described embodiment, the circuit pattern 116 is formed on the pattern forming surface 123 of the first thermoplastic resin substrate 122. Can also be configured. That is, the circuit pattern 116 can be formed on the third thermoplastic resin base 125 facing the pattern forming surface 123.

[0031]

As described in detail above, in the first aspect of the present invention, the method for manufacturing a semiconductor component mounted component, in the second aspect, the method for manufacturing a semiconductor component mounted finished product, and
According to the completed semiconductor component mounted product of the aspect, after the semiconductor component is inserted into the base material, a circuit pattern is formed on the inserted semiconductor component to complete the mounting. Therefore, since the anisotropic conductive sheet is not used at the time of mounting, it is possible to significantly improve productivity and reduce costs as compared with the related art. In addition, since a circuit pattern is formed on the semiconductor component inserted into the base material, it is possible to prevent sinking of the semiconductor component into the base material as conventionally occurred, and as a result, disconnection of the circuit pattern is prevented. Therefore, it is possible to stably produce high-quality semiconductor component mounted components and semiconductor component mounted finished products.

[Brief description of the drawings]

FIG. 1 is a sectional view of a completed semiconductor component mounted product according to an embodiment of the present invention.

FIG. 2 is a view for explaining a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a view showing a state in step 101.

FIG. 3 is a view for explaining a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a view showing a state in step 102.

FIG. 4 is a view for explaining the manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a view showing a state in step 103.

FIG. 5 is a diagram for explaining a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a diagram showing a state in step 104.

FIG. 6 is a view for explaining a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a view showing a state in step 105.

FIG. 7 is a diagram for explaining the manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a diagram showing a state in step 106.

FIG. 8 is a diagram for explaining the manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a diagram showing a state in step 107.

9 is a cross-sectional view showing a state in which electronic components are mounted on a circuit pattern with respect to the semiconductor component mounted components included in the completed semiconductor component mounted product shown in FIG.

10 is a cross-sectional view showing a state where the semiconductor component-mounted component shown in FIG. 9 is subjected to lamination processing.

11 is a plan view of the non-contact IC card when the completed semiconductor component mounted product shown in FIG. 1 is a non-contact IC card; FIG.

12 is a cross-sectional view taken along a line II shown in FIG.

FIG. 13 shows the above I of the non-contact IC card in FIG.
It is sectional drawing in the -I part.

FIG. 14 is a plan view showing a state in which a jumper is provided in the non-contact IC card in FIG. 11;

15 is a flowchart showing a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1;

FIG. 16 is a cross-sectional view of a modification of the semiconductor component-mounted component shown in FIG. 7;

17 is a cross-sectional view showing a state where the semiconductor component-mounted component shown in FIG. 16 has been subjected to lamination processing.

FIG. 18 is a sectional view of still another modification of the component on which the semiconductor component is mounted shown in FIG. 7;

19 is a cross-sectional view showing a state where the semiconductor component-mounted component shown in FIG. 18 has been subjected to lamination processing.

FIG. 20 is a perspective view showing the structure of a conventional non-contact IC card.

FIG. 21 is a flowchart showing a conventional non-contact IC card manufacturing process.

FIG. 22 is a cross-sectional view showing a conventional non-contact IC card manufacturing process.

FIG. 23 is a cross-sectional view showing a conventional non-contact IC card manufacturing process.

FIG. 24 is a cross-sectional view showing a conventional non-contact IC card manufacturing process.

FIG. 25 is a cross-sectional view showing a conventional non-contact IC card manufacturing process.

FIG. 26 is a sectional view showing the structure of a conventional non-contact IC card.

FIG. 27 is a cross-sectional view showing a malfunction state in a conventional non-contact IC card.

[Explanation of symbols]

101, 102: Non-contact IC card, 113: Bump,
114: semiconductor element, 115: member forming surface, 116: circuit pattern, 117: electrode, 118: circuit connecting member,
Reference numeral 121 denotes a component on which semiconductor components are mounted, 122 denotes a first thermoplastic resin base, 123 denotes a pattern forming surface, 124 denotes a second thermoplastic resin base, and 125 denotes a third thermoplastic resin base.
... Semiconductor component mounted parts, 129 ... Electronic parts.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hideki Miyagawa 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Shinji Murakami 1-1, Sachimachi, Takatsuki-shi, Osaka Matsushita Electronics Corporation No. (72) Inventor Yutaka Harada 1-1, Sachicho, Takatsuki-shi, Osaka Matsushita Electronics Co., Ltd. F-term (reference) 5F044 KK02 KK19 KK23 QQ04 RR18

Claims (12)

[Claims] 1. A semiconductor component (114) on a substrate (122).
And the pattern forming surface (12
3) Circuit connection portions (113, 117,
118) is exposed, and is electrically connected to the semiconductor component by being in contact with the circuit connection portion, and the circuit pattern (1) formed of conductive paste is formed.
And 16) mounting the semiconductor component on the circuit pattern by forming step 16) on the pattern formation surface. 2. The method according to claim 1, wherein the base is made of a thermoplastic resin material, and the semiconductor component is inserted into the base by heating the semiconductor component and the base and relative to the semiconductor component and the base. 2. The method of manufacturing a semiconductor component-mounted component according to claim 1, wherein the electrical connection surface of the circuit connection portion is exposed on the pattern forming surface of the base material. 3. 3. The method according to claim 1, wherein the circuit connecting portion is an electrode of the semiconductor component. 4. The circuit connecting portion is an electrode (117) of the semiconductor component and a bump (113) formed on the electrode. Insertion of the semiconductor component into the base material exposes the bump. 3. The method of manufacturing a semiconductor component-mounted component according to claim 1, which is performed. 5. The circuit connecting portion includes an electrode (117) of the semiconductor component, a bump (113) formed on the electrode, and a circuit connecting member (118) formed on a member forming surface (115) of the bump. And wherein the circuit connection member projects from the pattern forming surface when the semiconductor component is inserted into the base member, and wherein the circuit pattern contacts the circuit connection member. A method for manufacturing the semiconductor component-mounted component described in the above. 6. The method according to claim 1, further comprising, after forming the circuit pattern, mounting an electronic component on the circuit pattern. 7. The method according to claim 1, wherein the circuit pattern has a shape for an antenna coil for wirelessly transmitting and receiving information to and from the semiconductor component. . 8. A semiconductor component, wherein the semiconductor component-mounted component manufactured by the method for manufacturing a semiconductor component-mounted component according to claim 1 is sealed with a resin material (124, 125). A method for manufacturing a completed semiconductor component mounted product, comprising: manufacturing a mounted completed product. 9. The semiconductor component-mounted component is sealed with the resin material by sandwiching the semiconductor component-mounted component with two resin materials (124, 125) from the thickness direction of the semiconductor component-mounted component. 9. The method for manufacturing a completed semiconductor component mounted product according to claim 8, wherein the method is performed. 10. The resin material is made of a thermoplastic resin sheet, and the thermoplastic resin sheet is heated and pressed against the semiconductor component mounted component to perform the sealing of the semiconductor component mounted component. 9. The method for producing a finished product having semiconductor components mounted thereon according to item 9. 11. A completed semiconductor component-mounted product manufactured using the method for manufacturing a completed semiconductor component-mounted product according to claim 1. Description: 12. The completed product with mounted semiconductor components according to claim 11, wherein the completed product with mounted semiconductor components is a non-contact IC card.