JP2009252193A - Ic tag label and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag label with excellent detergent resistance and printing characteristic, which is easily picked up, and to provide a manufacturing method thereof. <P>SOLUTION: The IC tag label 100 comprises an adhesive layer 6, an IC inlet 200, an adhesive layer 5, and a support 1 having a reversible thermosensitive recording layer 2, which are successively laminated on a support 3, wherein inner surfaces between the supports 1 and 3 are liquid-lightly adhered to each other by a hot-melt adhesive layer 4 on the outer circumferential edge side of the adhesive layer 5. According to this structure, since the IC inlet 200 is protected by preventing detergent from entering the inner part of the label by the supports 1 and 3 and the hot melt adhesive layer 4, the IC tag label 100 has excellent detergent resistance. Further, the adhesive layer 5 is formed on the inner side of the hot melt adhesive layer 4 to give flexibility and elastic property to the surface of the reversible thermosensitive recording layer 2 and further to give flexibility to the whole label, whereby providing the IC tab label 100 which is easily picked up. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an IC tag label used for physical distribution management and the like, and has a reversible thermosensitive recording layer for printing and an IC inlet for storing information, and a method for producing the same.

  Conventionally, in logistics management etc., logistics management has been carried out by attaching or tying labels printed with information such as destination, sender, product name, quantity, lot number, etc. to cardboard boxes or pallets. . However, once information is printed on a normal label with ink or the like, it cannot be erased, so the label can be used only once. Therefore, it has become possible to use a label having a reversible thermosensitive recording layer and rewrite information printed on the label by a dedicated thermal printer. Since this reversible thermosensitive recording layer can be decolored and colored by the load of thermal energy, the information once printed can be erased by the heat load and new information can be printed again. It becomes possible. However, the amount of printing information on such a physical distribution management label is limited to the size of the label.

  On the other hand, in recent years, a tag using an IC chip for wireless communication provided with a rewritable storage device called an IC tag has been attracting attention. This IC tag can hold electronic information inside, and has features such as a large amount of information to be held and electronic information inside the IC tag can be rewritten compared to a conventional barcode or the like. . Although the IC tag has such characteristics, information stored in the IC chip cannot be confirmed unless a dedicated reader is used. Therefore, if the IC tag can be provided with a rewritable visible information recording function using the reversible thermosensitive recording material as described above, the convenience of the IC tag is further improved. Therefore, Patent Document 1 proposes an IC tag label in which a label having a reversible thermosensitive recording layer and an IC tag are combined. This IC tag label has a reversible thermosensitive recording layer, and further includes an IC chip (IC module) having a memory function and an IC inlet on a flat plate including an antenna. In addition to the information printed on the label surface, a large amount of information that cannot be written there can be written on the IC chip of the IC tag label.

  In addition to Patent Document 1, an IC tag combining an IC tag and a reversible thermosensitive recording material has been proposed. For example, Patent Document 2 proposes an IC tag label incorporating an IC inlet. In the IC tag label proposed in Patent Document 2, a pressure-sensitive adhesive layer, an IC inlet, a pressure-sensitive adhesive layer, and a release sheet are laminated in this order on a support having a heat-sensitive recording material (either reversible or irreversible) on the surface. Since the adhesive layer appears on the surface by peeling off the release sheet, the adhesive layer can be attached to a cardboard box or the like. Patent Document 3 proposes an IC card having a reversible thermosensitive recording layer on the surface. In this IC card, an IC inlet is sandwiched between a support having a reversible thermosensitive recording layer and another support that is bonded oppositely, and two supports are encased in an adhesive layer. The body is bonded. In this IC card, a rewritable thermosensitive recording layer is provided on the card surface so that a user can visually confirm part of information written on the IC chip.

JP 2007-80162 A JP 2002-99888 A JP 2002-163623 A

  An IC tag label having a reversible thermosensitive recording layer is washed once with a cleaning solution to remove dirt, printed with new information, and then printed with a thermal printer. Write information to the chip. Such an IC tag label is required to have excellent cleaning properties and printing characteristics. In order to improve the cleaning performance, it is desired that the cleaning liquid resistance is high, and it is necessary to prevent the cleaning liquid from entering the inside because the liquid-tightness of the IC tag label is high. In order to improve printing characteristics, it is necessary to improve contact between the head of the thermal printer and the reversible thermosensitive recording surface of the label. For this purpose, it is preferable that the recording surface of the label surface has appropriate flexibility and elasticity. Further, it is desirable that such an IC tag label is easy to grasp when it falls on the floor or the like. In order to improve the ease of grasping the IC tag label, it is required that the IC tag label bend easily when picked up from above by hand, and therefore, the IC tag label as a whole is required to be flexible.

  In order to produce an IC tag label, an IC inlet is sandwiched between a support having a reversible thermosensitive recording layer and another support to be bonded, and the two supports must be bonded. An IC tag label is prepared by laminating two supports with an adhesive so that the support having an adhesive layer, an IC inlet, an adhesive layer, and a reversible thermosensitive recording layer is laminated in that order on the support (for example, patents) Reference 2) and a label having flexibility and elasticity. This is because the pressure-sensitive adhesive has flexibility and elasticity. However, in the case of an IC tag label configured using this pressure-sensitive adhesive, the cleaning liquid enters the bonding surface from the side of the bonding surface between the pressure-sensitive adhesive layer and the support, and the label is peeled off. This may cause a failure of the built-in IC chip. Further, when an IC tag label is produced between two supports so as to wrap an IC inlet with an adhesive layer (for example, Patent Document 3), the liquid-tightness is good and the cleaning liquid resistance of the label is improved. However, since the adhesive becomes hard, the flexibility and elasticity of the IC tag label are deteriorated, and the printing characteristics and ease of gripping are deteriorated.

  Therefore, an object of the present invention is to provide an IC tag label having excellent cleaning liquid resistance, printing characteristics and flexibility, and a method for producing the same.

The IC tag label according to the present invention is:
An IC tag label in which a first pressure-sensitive adhesive layer, an IC inlet, a second pressure-sensitive adhesive layer, and a second support molded with a resin are stacked in this order on a first support molded with a resin. ,
The second support has a reversible thermosensitive recording layer on the outer surface;
On the outer peripheral side of the layer structure constituted by the first pressure-sensitive adhesive layer, the IC inlet, and the second pressure-sensitive adhesive layer, the inner surface of the first support and the second support overlapped with each other. Are bonded by an adhesive layer.

  With this configuration, the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are laminated on the top and bottom of the IC inlet, and further, the resin-made first support and second support are formed on the top and bottom of the layer configuration. Are stacked. The outer peripheral side of the layer constituted by the first pressure-sensitive adhesive layer, the IC inlet, and the second pressure-sensitive adhesive layer is liquidated by the adhesive layer on the inner surface of the first support and the second support. Closely bonded. The second support has a reversible thermosensitive recording layer on the outer surface, and the first and second supports are formed of resin. As a result, the upper and lower sides of the IC inlet are prevented from entering the cleaning liquid by the first and second support bodies made of resin, and the first support body and the second support body are overlapped also on the side of the IC inlet. Intrusion of the cleaning liquid can be prevented by the adhesive layer in which the mating inner surfaces are adhered in a liquid-tight manner. Therefore, the liquid tightness of the IC tag label can be improved. Furthermore, the 1st and 2nd adhesive layer exists inside the adhesive bond layer of this IC tag label. Since the adhesive is a material having flexibility and elasticity, the surface of the IC tag label can have elasticity and flexibility by the adhesive layer. As a result, the contact property with the printer head is improved, and the printing characteristics of the IC tag label are improved. If the IC tag label falls on the floor or the like, it is necessary to pick it up from the label. For this purpose, the label as a whole must be flexible and bend easily. Since the present IC tag label can give flexibility to the entire IC tag label due to the presence of the pressure-sensitive adhesive layer, the IC tag label is easily bent and the ease of gripping is improved.

  In the IC tag label, in the second support having a reversible thermosensitive recording layer, a print area of the reversible thermosensitive recording layer is located immediately above the first adhesive layer or the second adhesive layer. It may be configured to do so. By setting the printing area directly above the pressure-sensitive adhesive layer, flexibility and elasticity can be given to the surface of the printing area. If there is flexibility and elasticity on the surface of the print area, the contact area of the printer head will be appropriately deformed by the flexibility, and will be in close contact by elasticity, so the contact between the surface of the print area and the printer head is improved. To do. This improves the way heat is transferred from the printer head to the reversible thermosensitive recording layer, thereby improving the printing characteristics of the IC tag label.

  Further, in the IC tag label, a double-sided pressure-sensitive adhesive tape in which a pressure-sensitive adhesive layer is applied to both surfaces of the central substrate may be used instead of the first and / or second pressure-sensitive adhesive layers. The IC tag label can be provided with flexibility and elasticity by the double-sided adhesive tape. This improves the printing characteristics and ease of gripping of the IC tag label.

  The double-sided pressure-sensitive adhesive tape may be one in which an acrylic pressure-sensitive adhesive is applied to both surfaces of a central substrate formed of a urethane-based resin. Since the urethane-based resin and the acrylic pressure-sensitive adhesive are materials having flexibility and elasticity, the printing characteristics and ease of gripping of the IC tag label are improved.

  In the IC tag label, any one of a polyamide resin adhesive, a polyester resin adhesive, a polyurethane resin adhesive, and an ethylene vinyl acetate resin adhesive may be used for the adhesive layer. Thereby, the 1st support body shape | molded with resin and the 2nd support body can be adhere | attached liquid-tightly. Therefore, it is possible to prevent the cleaning liquid from entering the IC tag label side surface, improve the liquid tightness of the IC tag label, and obtain good cleaning liquid resistance.

Moreover, the IC tag label production method according to the present invention includes:
The resin-made 1st support body which affixed IC inlet by the 1st adhesive layer, the reversible thermosensitive recording layer on the outer surface, and the 2nd adhesive layer applied to the back surface In the IC tag label production method for producing an IC tag label by adhering the second support to the frame-like hot melt adhesive layer,
A frame of the frame-shaped hot melt adhesive layer, wherein the IC inlet attached to the first support and the second pressure-sensitive adhesive layer applied to the second support are opposed to each other. Stacking the first support and the second support so as to accommodate the first pressure-sensitive adhesive layer, the IC inlet, and the second pressure-sensitive adhesive layer inside,
And a step of bonding the frame-like hot melt adhesive layer by thermocompression bonding from the outside of the first and second supports.

  According to this production method, the first pressure-sensitive adhesive layer coated with the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer were applied to the opposite surface of the reversible thermosensitive recording layer. The resin-made second support is bonded using a frame-shaped hot melt adhesive layer. Here, the frame-shaped hot-melt adhesive layer is processed so that the first pressure-sensitive adhesive layer, the IC inlet, and the second pressure-sensitive adhesive layer are contained in the frame. Then, in the step of bonding the first and second supports, the second pressure-sensitive adhesive layer and the IC inlet face each other, and the first pressure-sensitive adhesive layer and the IC inlet are placed in the frame of the hot melt adhesive layer. And the second pressure-sensitive adhesive layer are stacked so as to be accommodated and bonded together by thermocompression bonding from the outside. In this case, since the hot melt adhesive is solid at room temperature, it does not flow as compared with the liquid adhesive, and therefore the first adhesive layer, the IC inlet, and the second adhesive layer are combined. When accommodated in the frame, it is easy to position the hot melt adhesive layer.

  The IC tag label produced by this method has a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer laminated on the upper and lower sides of the IC inlet, and a resin-made first support on the upper and lower sides of the layer structure. The body and the second support are stacked. The outer peripheral side of the layer constituted by the first pressure-sensitive adhesive layer, the IC inlet, and the second pressure-sensitive adhesive layer is frame-shaped on the overlapping inner surface of the first support and the second support. It is liquid-tightly bonded by a hot melt adhesive layer. As a result, the upper and lower sides of the IC inlet are prevented from entering the cleaning liquid by the first and second support members made of resin, and the first and second support members made of resin are also formed on the sides of the IC inlet. Intrusion of the cleaning liquid can be prevented by the hot melt adhesive layer in which the two are adhered in a liquid-tight manner. Therefore, an IC tag label having excellent liquid tightness can be produced. Furthermore, the IC tag label produced by this IC tag label production method has a pressure-sensitive adhesive layer inside the hot melt adhesive layer. Since the adhesive is a material having flexibility and elasticity, the surface of the IC tag label can have elasticity and flexibility by the adhesive layer. Thereby, since the contact property with the printer head is improved, an IC tag label having excellent printing characteristics can be produced. If the IC tag label falls on the floor or the like, pick the label from the top. For this purpose, the entire label must be flexible and bend easily. Since the IC tag label can give flexibility to the entire IC tag label due to the presence of the pressure-sensitive adhesive layer, the IC tag label is easily bent and an IC tag label that is easy to grasp can be produced.

  The IC tag label manufacturing method further includes a step of printing information on the first pressure-sensitive adhesive layer or a region immediately above the second pressure-sensitive adhesive layer in the reversible thermosensitive recording layer of the second support. And good. As a result, the print area is positioned on the adhesive layer. Since the pressure-sensitive adhesive is a material having flexibility and elasticity, it can give appropriate flexibility and elasticity to the surface of the printing area. If there is flexibility and elasticity on the surface of the print area, when the printer head comes into contact, the contact portion will be appropriately deformed due to the flexibility and will be in close contact with the elasticity. The contact with the printer head is improved. Thereby, since the heat transfer from the printer head to the reversible thermosensitive recording layer is improved, an IC tag label capable of obtaining good printing characteristics can be produced.

  In the IC tag label manufacturing method, a double-sided pressure-sensitive adhesive tape in which a pressure-sensitive adhesive is applied to both surfaces of a central substrate instead of the resin-made first support having an IC inlet attached thereto by the first pressure-sensitive adhesive layer. Alternatively, a resin-made first support with an IC inlet attached thereto may be used. When a double-sided adhesive tape is used, it is not necessary to apply an adhesive, and it is only necessary to apply a double-sided adhesive tape, which makes it easier to handle than using an adhesive alone.

  In the IC tag label manufacturing method, a reversible thermosensitive recording layer is provided on the outer surface instead of the resin-made second support having a reversible thermosensitive recording layer on the outer surface and a second pressure-sensitive adhesive layer coated on the rear surface. You may use the resin-made support body which has a recording layer and affixed the double-sided adhesive tape which apply | coated the adhesive to both surfaces of the center base material on the back surface. When a double-sided pressure-sensitive adhesive tape is used, it is not necessary to apply a pressure-sensitive adhesive, so that handling is easy.

  In the IC tag label manufacturing method, the double-sided adhesive tape may be one in which an acrylic double-sided adhesive tape is applied to both surfaces of a central substrate made of urethane resin. By using such a double-sided adhesive tape, an IC tag label can be produced more easily than applying an adhesive directly to the second support or IC inlet.

  In the IC tag label manufacturing method, any one of a polyamide-based resin adhesive, a polyester-based resin adhesive, a polyurethane-based resin adhesive, and an ethylene-vinyl acetate-based resin adhesive may be used as the hot melt adhesive layer. These adhesives do not contain a volatile organic solvent and the like, and an adhesive drying step is unnecessary, so that the productivity of IC tag labels can be improved.

  ADVANTAGE OF THE INVENTION According to this invention, the IC tag label which has the outstanding washing | cleaning liquid resistance, printing characteristics, and a softness | flexibility, and its manufacturing method can be provided.

  Hereinafter, preferred embodiments of an IC tag label and a manufacturing method thereof according to the present invention will be described with reference to the drawings.

<First Embodiment>
[IC tag label]
FIG. 1 is a plan view of an IC tag label 100 according to the first embodiment. 2 is a cross-sectional view of the IC tag label 100 shown in FIG. 1 taken along the line II-II. As shown in FIGS. 1 and 2, the IC tag label 100 has a rewritable reversible thermosensitive recording layer 2 covered with a protective layer 20 on one surface. An IC inlet 200 is built in the central portion of the IC tag label 100. The IC tag label 100 has a structure in which an IC inlet 200 is sandwiched between a support (second support) 1 and a support (first support) 3. An adhesive and a hot melt adhesive are used for bonding the support 1 and the support 3. That is, the support 1 and the support 3 are bonded to each other by a pressure-sensitive adhesive layer (second pressure-sensitive adhesive layer) 5 at the center of the IC tag label 100, and frame-like hot melt bonding is performed on the side of the outer peripheral edge of the pressure-sensitive adhesive layer 5. Bonded by the agent layer 4. The size of the IC tag label 100 is about 90 mm × 150 mm in length × width, and the entire average thickness is about 350 μm. The three corners of the IC tag label 100 are rounded, but the other corners are cut obliquely. This is because the reversible thermosensitive recording layer 2 is on one side, so that only one corner is cut obliquely in order to confirm the surface to be printed, and it is possible to determine which is the printing surface by the position of the cut corner. It is to do. The support 1 and the support 3 are formed of white PET (polyethylene terephthalate) resin having a thickness of about 100 μm.

  An IC inlet 200 is attached to the center of the support 3 with an adhesive layer 6 (first adhesive layer) (see FIG. 2). In this IC inlet 200, an antenna pattern 8 is formed of an electrically conductive material such as aluminum on an insulating sheet 7, and an IC chip 9 is connected to the antenna pattern 8. A reversible thermosensitive recording layer 2 is formed on the support 1, and information can be printed on this surface. Further, a protective layer 20 is formed on the reversible thermosensitive recording layer 2. This protective layer 20 prevents the reversible thermosensitive recording layer 2 from being scraped or peeled off due to physical contact or the like. This protective layer 20 does not particularly affect the heat conduction from the printer head to the reversible thermosensitive recording layer 2. The protective layer 20 is formed with an acrylic resin to a thickness of about 3 to 5 μm.

  The IC inlet 200 is sandwiched between the pressure-sensitive adhesive layer 5 and the pressure-sensitive adhesive layer 6, and the outside thereof is further sandwiched between the resin support 1 and the support 3. The upper and lower sides of the IC inlet 200 can prevent the cleaning liquid from entering by the support 1 and the support 3 made of resin. Further, since the support 1 and the support 3 are liquid-tightly bonded to each other on the side surface of the IC tag label 100 by the hot melt adhesive layer 4, the cleaning liquid may enter the inside also on the side of the IC tag label 100. Can be prevented. Since the hot melt adhesive layer 4 surrounds the adhesive layers 5 and 6, the adhesive layer is not exposed to the outside of the IC tag label 100. For this reason, when the IC tag label 100 is cleaned, the cleaning liquid does not enter the bonding surface from the side of the bonding surface between the pressure-sensitive adhesive layer 5 and the support 1. Further, since the cleaning liquid does not enter the adhesive surface from the side of the adhesive surface between the pressure-sensitive adhesive layer 5 and the support 3, the supports 1 and 3 are not peeled off.

  As shown in FIG. 1, the area that the pressure-sensitive adhesive layer 5 occupies in the entire IC tag label 100 is larger than that of the hot-melt adhesive layer 4. Thereby, the IC tag label 100 can be provided with flexibility and elasticity by the pressure-sensitive adhesive layer 5. Since the surface of the IC tag label 100 can be provided with flexibility and elasticity by the pressure-sensitive adhesive layer 5, the IC tag label 100 is a label having excellent printing characteristics. The area of the pressure-sensitive adhesive layer 5 occupies a large part of the IC tag label 100. The IC inlet 200 is attached by the pressure-sensitive adhesive layer 6, and this pressure-sensitive adhesive layer 6 also has flexibility. Furthermore, the IC inlet 200 also has flexibility. Therefore, the entire IC tag label 100 can be softened by the flexibility of the pressure-sensitive adhesive layer 5, the pressure-sensitive adhesive layer 6, and the IC inlet 200. Therefore, when falling on the floor or the like, it becomes easy to pick up the IC tag label 100 by hand while bending the center of the IC tag label 100 upward.

  FIG. 3 is a plan view showing a printing region 300 in the reversible thermosensitive recording layer 2 of the IC tag label 100. In FIG. 3, a region surrounded by a two-dot chain line is a print region 300. This print area 300 is an area immediately above the adhesive layer 5 (see FIG. 2). When the printing area 300 is located immediately above the pressure-sensitive adhesive layer 5, appropriate flexibility and elasticity can be given to the surface of the printing area 300. This is because the adhesive is a material having flexibility and elasticity. If the surface of the printing area 300 has flexibility and elasticity, when the printer head abuts, the abutting portion is appropriately deformed due to the flexibility, and is appropriately adhered to the printer head due to the elasticity. To the reversible thermosensitive recording layer 2 is improved. As a result, the IC tag label 100 can be provided with excellent printing characteristics.

[adhesive]
For the hot melt adhesive layer 4 (see FIG. 2), one of a polyamide resin adhesive, a polyester resin adhesive, a polyurethane resin adhesive, and an ethylene vinyl acetate resin adhesive is used. . The hot melt adhesive is solid at room temperature, melts by heat, is attached to the adherend in a molten state, and is solidified by cooling. The hot melt adhesive layer 4 is a frame-like solid at normal temperature, but the support 1 and the support 3 are arranged with the hot melt adhesive layer 4 interposed between the support 1 and the support 3. The hot melt adhesive layer 4 is melted by heat pressing with a laminator from the outside of the substrate, and then the hot melt adhesive layer 4 is solidified by cooling, so that the two supports 1 and 3 are liquid-tight. Glued. Accordingly, it is possible to prevent the cleaning liquid from entering the IC tag label 100 when the IC tag label 100 is cleaned. The thickness of the hot melt adhesive layer 4 is about 30 μm. The temperature at the time of thermocompression bonding with a laminator is determined by the type of adhesive. For example, when using a polyester-based adhesive, the temperature of the laminar roll is set to about 120 to 150 ° C. Since the hot melt adhesive layer 4 is hard, in order to ensure flexibility in the entire IC tag label 100, it is desirable to make the area occupied by the hot melt adhesive layer 4 in the entire label as small as possible. It is preferable to secure at least a width of about 3 mm.

[Adhesive]
An acrylic pressure-sensitive adhesive is used for the pressure-sensitive adhesive layer 5 and the pressure-sensitive adhesive layer 6. The pressure-sensitive adhesive layer 6 is formed by being applied to the surface of the IC inlet 200 where the antenna 8 and the IC chip 9 are arranged, and has a role of bonding the IC inlet 200 to the support 3. The pressure-sensitive adhesive layer 5 is formed by removing the area where the hot melt adhesive layer 4 abuts on the lower surface of the support 1 and applying it to the inside thereof. The IC inlet 200 is adhered to the support 3. In the state, it has a role which adhere | attaches the support body 1 and the support body 3 so that IC inlet 200 may be covered. The recording area 300 on the surface of the IC tag label 100 is an area immediately above the pressure-sensitive adhesive layer 5. Since the acrylic pressure-sensitive adhesive is a gel-like substance having flexibility and elasticity, the IC tag label 100 can be given flexibility and elasticity.

[Reversible thermosensitive recording layer]
For the reversible thermosensitive recording layer 2 (see FIG. 2), a leuco compound type thermosensitive recording material is used. The reversible thermosensitive recording layer 2 is formed by applying a thermosensitive recording material to the surface of the support 1 by printing or the like. The reversible thermosensitive recording layer 2 is not particularly limited in thickness, but is generally about 4 to 20 μm. On the reversible thermosensitive recording layer 2, the protective layer 20 is coated to a thickness of about 3 to 5 μm by printing with acrylic resin or the like. The thermosensitive recording material used for the reversible thermosensitive recording layer 2 can be colored and decolored depending on the temperature when heated, the heating rate during heating, and the cooling rate after heating. The leuco compound type heat-sensitive recording material utilizes a reversible color reaction between a leuco compound dispersed in a resin base material (matrix) and a visible colorant. Specific examples of the leuco compound include 3,3-bis (p-dimethylaminophenyl) -6-dimethylaminophthalide, 3,3-bis (p-dimethylaminophenyl) phthalide, 3,3-bis (1, 2-Dimethylindol-3-yl) -6-dimethylaminophthalide, 3-dimethylamino-6-chloro-7-methylfluorane, 3,3-bis (9-ethylcarbazol-3-yl-5)- Dimethylaminophthalide, 3-dimethylamino-7-dibenzylaminofluorane, 3-diethylamino-7-chlorofluorane, 3-diethylamino-6-methyl-7-anilinofluorane, 3-piperidino-6-methyl -7-anilinofluorane, 3- (n-ethyl-n-nitrile) amino-6-methyl-7-anilinofluorane, 3-dibutylamino- - methyl-7-anilinofluoran, 3- (n-ethyl--n- tetrahydrofuryl) such as amino-6-methyl-7-anilinofluoran and the like, used alone or as a mixture thereof.

  The developer is a compound that reversibly releases protons by the action of thermal energy and has both a developer action and a color-removing action on the leuco compound. That is, the color developer has both an acidic group composed of a phenolic hydroxyl group or a carboxyl group and a basic group composed of an amino group, and becomes acidic or basic due to a difference in thermal energy, and develops the leuco compound. It will be decolored. Further, as the color-developing agent having any one functional group of acidic group or basic group, for example, aminobenzoic acid, o-aminobenzoic acid, 4-amino-3-methylbenzoic acid, 3-amino-4 -Methylbenzoic acid, 2-amino-5-ethylbenzoic acid, 3-amino-4-butylbenzoic acid, 4-amino-3-methoxybenzoic acid, 3-amino-4-ethoxybenzoic acid, 2-amino-5 -Chlorobenzoic acid, 4-amino-3-bromobenzoic acid, 2-amino-2-nitrobenzoic acid, 4-amino-3-nitrobenzoic acid, 3-amino-4-nitrilebenzoic acid, aminosalicylic acid, diaminobenzoic acid Examples include acid, 2-methyl-5-amononaphthoic acid, 3-ethyl-4-aminonaphthoic acid, nicotinic acid, isonicotinic acid, 2-methylnicotinic acid, and 6-chloronicotinic acid. Further, those having a basic group as a part of a chlorinated compound are salts or complex salts of a compound having a phenolic hydroxyl group or a carboxyl group and a compound having an amino group, such as hydroxybenzoic acids, hydroxysalicylic acids, gallic acid. Examples thereof include salts or complex salts of acids such as acids and bisphenolacetic acid and bases such as aliphatic amines, phenylalkylamines and triallylalkylamines. Specific examples thereof include p-hydroxybenzoic acid-alkylamine salt, p-hydroxybenzoic acid-phenylalkylamine salt, m-hydroxybenzoic acid-alkylamine salt, p-hydroxybenzoic acid methyl-alkylamine salt, p- Examples thereof include stearyl-alkylamine salt of hydroxybenzoic acid, bisphenolacetic acid-alkylamine, bisphenolacetic acid octyl-alkylamine salt, and the like. The leuco compound and the visible colorant are not limited to these.

  Examples of the resin base material include acrylic resins, polyester resins, polyurethane resins, polyureas, melamines, polycarbonates, polyamides, polyvinyl pyrrolidones, polyvinyl alcohols, polyvinyl chlorides, polyvinyl butyrals, and the like. Used. In order to improve the repeated printing erasure resistance, it is preferable to add a curing agent that crosslinks three-dimensionally corresponding to the resin base material, a cross-linking agent, and the like to the resin base material in an amount of 0.5 to 10% by weight.

  For the reversible thermosensitive recording layer 2, a phase change type thermosensitive recording material may be used. The phase change type heat-sensitive recording material changes to white turbidity or transparency as the crystal state of the organic low molecular weight substance dispersed in the resin base material (matrix) changes. The phase change type heat-sensitive recording material can be switched between a cloudy state and a transparent state depending on the temperature at the time of heating, the heating rate at the time of heating, and the cooling rate after the heating. Therefore, when this phase change type reversible thermosensitive recording material is used, it is necessary to provide a colored layer of aluminum or the like under the reversible thermosensitive recording layer 2. This is because the support 1 used for the IC tag label 100 uses white PET, and even if the white turbidity / transparency state of the heat-sensitive recording material is switched, it is difficult to see the white background. When aluminum is used for the colored layer, the transparent portion shows the color of aluminum (silver), and the cloudy portion is expressed by white letters or the like. In the phase change type thermal recording material, the organic low molecular weight substance dispersed in the resin base material includes a fatty acid, a fatty acid derivative or an alicyclic organic acid. More specifically, among saturated fatty acids, dicarboxylic acid, myristic acid, pentadecanoic acid, palmitic acid, heptadecanoic acid, stearic acid, nanodecanoic acid, arachidic acid, behenic acid, lignoceric acid, serotic acid, montanic acid, melicic acid, etc. Is mentioned. Specific examples of the unsaturated fatty acid include oleic acid, elaidic acid, linoleic acid, sorbic acid, stearic acid and the like. In addition, a fatty acid, a fatty acid derivative, or an alicyclic organic acid is not limited to these, and it is also possible to use a mixture of two or more of these.

  Resin base materials used for phase change type heat-sensitive recording materials include acrylic resins, urethane resins, polyester resins, cellulose acetate resins, nitrocellulose resins, vinyl chloride resins, vinyl acetate resins. A single, mixed or copolymer may be used. In order to control the transparent temperature range of the reversible thermosensitive recording layer 2, it is preferable to add 0.1 to 20% by weight of a resin plasticizer, a high boiling point solvent, or the like with respect to the resin base material. Further, in order to improve the repetitive print erasure resistance of the reversible thermosensitive recording layer 2, 0.5 to 10% by weight is added to the resin base material, such as a three-dimensional cross-linking curing agent and cross-linking agent corresponding to the resin base material. Good.

[IC inlet]
4 is a plan view of the IC inlet 200 incorporated in the IC tag label 100, and FIG. 5 is a VV cross-sectional view of the IC inlet 200 shown in FIG. In FIG. 4, an IC inlet 200 has an antenna pattern 8 formed on one surface on an insulating sheet 7, and an IC chip 9 is connected to the antenna pattern 8. The size of the IC inlet 200 is about 25 × 95 mm in length × width. The IC chip 9 has a contactless wireless communication function with a reader / writer device and a memory function. Therefore, the IC chip 9 can perform non-contact wireless communication with the reader / writer device via the antenna pattern 8 and can store various information. The insulating sheet 7 has a thickness of about 25 to 40 μm and is formed of PET resin. The antenna pattern 8 is made of aluminum and has a thickness of about 10 to 20 μm. The IC chip 9 is fixed to the insulating sheet 7 with an IC chip fixing adhesive 11. The IC chip 9 has two bumps 10 for electrical connection with the antenna pattern 8. The IC chip fixing adhesive 11 bonds the back surface of the IC chip 9 and the insulating sheet 7 between the two bumps 10. The IC chip 9 is fixed to the insulating sheet 7 by the adhesive 11 for fixing the IC chip, and the two bumps 10 of the IC chip 9 and the end portions of the antenna pattern 8 are in direct contact to be electrically connected. . In the manufacturing method of the IC inlet 200, first, the aluminum antenna pattern 8 is stuck on the insulating sheet 7 by the adhesive layer 30. The antenna pattern 8 may be formed by performing an etching process on a sheet in which an aluminum foil is bonded to the PET sheet 7 with an adhesive, thereby forming the antenna pattern 8. After the antenna pattern 8 is formed in this way, the IC chip 9 is mounted with the IC chip fixing adhesive 11. The antenna pattern 8 may be made of copper instead of aluminum.

  Examples of the adhesive resin for the adhesive 11 for fixing the IC chip 9 to the insulating sheet 7 include natural rubber (NR), styrene / butadiene copolymer rubber, polyisobutylene, isobutylene-isoprene copolymer, isoprene rubber, Butadiene polymer, styrene / butadiene copolymer, styrene / isoprene copolymer, styrene / isoprene / styrene block polymer, styrene / butadiene / styrene block polymer, chloroprene rubber, butadiene / acrylonitrile copolymer rubber, butyl rubber, acrylic polymer, Vinyl ether polymer, polyvinyl alcohol, polyvinyl butyral, polyvinyl pyrrolidone, vinyl pyrrolidone / vinyl acetate copolymer, dimethylaminoethyl / methacrylic acid / vinyl pyrrolidone copolymer, polyvinyl Lolactam, polyvinylpyrrolidone, maleic anhydride copolymer, silicone adhesive (polyvinylsiloxane), polyurethane, polyvinyl chloride, gelatin, shellac, gum arabic, rosin, rosin ester, ethylcellulose, carboxymethylcellulose, paraffin, tristearin, polyethylene , Polypropylene, acrylic resin, vinyl resin, polyisobutene, polybutadiene, epoxy resin, phenol resin, polyurethane resin, polyester, polyamide, silicone, polystyrene, melamine resin and the like.

  As the adhesive used for the adhesive layer 30, a high molecular organic substance, a low molecular organic substance, or a composite resin thereof is used. For example, a polyester polyurethane resin, a polyurethane resin, a polyester resin, an acrylonitrile-styrene resin, a polystyrene, a polyacrylonitrile, Examples thereof include polymethyl acrylate, polymethyl methacrylate, vinyl acetate, and polyvinyl alcohol. An adhesive made of an epoxy resin may be used.

  An anisotropic conductive adhesive may be used for the connection between the IC chip 9 and the antenna pattern 8. When the anisotropic conductive adhesive is used, the two bumps 10 of the IC chip 9 and the end of the antenna pattern 8 are electrically connected to each other via the anisotropic conductive adhesive. An anisotropic conductive adhesive is obtained by dispersing conductive particles in an adhesive resin and can obtain conductivity only in the thickness direction. As an adhesive resin of this anisotropic conductive adhesive, polyurethane resin, polyester polyurethane resin, acrylonitrile-butadiene-styrene resin, acrylonitrile-styrene resin, polystyrene, polyacrylonitrile, polymethyl acrylate, polymethyl methacrylate, vinyl acetate, Vinyl resins such as polyvinyl alcohol, polycarbonate resins, epoxy resins, etc. can be used alone or as a mixture or composite. The conductive particles dispersed in the adhesive resin include gold (Au), nickel (Ni), aluminum (Al), tin (Sn), or nonconductive particles, hollow particles, and the surface of a foil piece. Particles that have been subjected to conductive treatment (physical or chemical treatment with Au, Ni, Al, Sn, etc.) can be used. Further, when the IC chip 9 is mounted on the antenna pattern 8, the antenna pattern 8 and the bumps 10 may be joined by ultrasonic welding. In order to increase the mechanical strength, ultrasonic welding and IC chip fixing adhesive 11 may be used in combination. In this case, after the IC chip 9 is fixed to the insulating sheet 7 by the IC chip fixing adhesive 11, the bumps 10 and the antenna pattern 8 are joined by ultrasonic welding.

[IC tag label production method]
The IC tag label 100 is manufactured by the following process as shown in FIGS.

(1) Formation of pressure-sensitive adhesive layer on IC inlet sheet 400 FIG. 6 is a plan view of the IC inlet sheet 400, and FIG. 7 is a cross-sectional view of the IC inlet sheet 400 after the pressure-sensitive adhesive layer 6 is formed. As shown in FIG. 6, the IC inlet sheet 400 is a state in which the IC inlets 200 are arranged in two rows and connected in a sheet shape. As shown in FIG. 7, an acrylic adhesive is applied to the surface of the IC inlet sheet 400 on which the IC chip is disposed to form an adhesive layer 6, and the release sheet 12 is formed on the formed adhesive layer 6. Processing to paste. The release sheet 12 is obtained by applying a release agent to one side of a resin film such as PET, foamed PET, polypropylene, or polypropylene, polyethylene laminated paper, glassine paper, or clay coated paper. The release sheet 12 is attached so that the surface on which the release agent is applied and the pressure-sensitive adhesive layer 6 face each other. The release agent is preferably a silicone-based release agent, and other fluorine-based and long-chain alkyl group-containing carbides can be used. Although there is no restriction | limiting in particular about the thickness of a peeling sheet, Usually, it is about 20-150 micrometers.

(2) Cutting the IC inlet sheet 400 and attaching the IC inlet 200 to the support 3 FIG. 8 is a cross-sectional view of the support 3 in a state where the IC inlet 200 is attached. The IC inlet sheet 400 in which the pressure-sensitive adhesive layer 6 has been formed in the step (1) is cut along with the pressure-sensitive adhesive layer 6 and the release sheet 12 along the cutting line 500 shown in FIGS. Divide 200 into one. In the IC inlet 200 divided as shown in FIG. 8, the release sheet 12 attached to the pressure-sensitive adhesive layer 6 is peeled off, and the IC inlet 200 is adhered to the center of the support 3 whose outer shape is processed by the pressure-sensitive adhesive layer 6. .

(3) Formation of pressure-sensitive adhesive layer on support 1 FIG. 9 is a cross-sectional view of support 1 on which pressure-sensitive adhesive layer 5 is formed. As shown in FIG. 9, an acrylic pressure-sensitive adhesive is applied to the surface opposite to the reversible thermosensitive recording layer 2 on the support 1 in which the reversible thermosensitive recording layer 2 and the protective layer 20 are formed and the outer shape is processed. After forming the agent layer 5, the process which sticks the peeling sheet 13 to the adhesive layer 5 is performed. At this time, the pressure-sensitive adhesive layer 5 is formed leaving a region where the hot melt adhesive layer 4 is adhered to the peripheral edge of the support 1. The release sheet 13 is the same as the release sheet 12. The release sheet 13 is attached so that the surface on which the release agent is applied and the pressure-sensitive adhesive layer 5 face each other.

(4) Processing of Hot Melt Adhesive Layer 4 FIG. 10 is a perspective view of the hot melt adhesive layer 4, and FIG. 11 is a XI-XI sectional view of the hot melt adhesive layer 4 shown in FIG. As shown in FIGS. 10 and 11, the hot melt adhesive layer 4 is processed. The hot melt adhesive layer 4 has a frame shape in which the central portion is cut out in accordance with the shape of the pressure-sensitive adhesive layer 5. The outer shape of the hot melt adhesive layer 4 is processed according to the size of the support 1 and the support 3.

(5) Bonding of Support 1 and Support 3 FIG. 12 is a cross-sectional view showing how the support 1 and the support 3 are bonded together. As shown in FIG. 12, in the support 1 on which the pressure-sensitive adhesive layer 5 is formed, the release sheet 13 (see FIG. 9) is peeled off, and the frame-shaped hot melt adhesive layer 4 is stacked on the support 1. At this time, the hot-melt adhesive layer 4 is overlaid so that the pressure-sensitive adhesive layer 5 of the support 1 is contained in the frame. The pressure-sensitive adhesive layer 5 and the IC inlet 200 are faced to each other, overlapped with the contour of the outer shape so that the support 1 and the support 3 do not protrude from each other, and heat-pressed from the outer surface of the supports 1 and 3 by a laminator. To do. By thermocompression bonding, the support 1 and the support 3 are bonded to each other by the pressure-sensitive adhesive layer 5 and the hot-melt adhesive layer 4 is melted to support the support 1 and the support 3 on the outer peripheral side of the pressure-sensitive adhesive layer 5. And glue the inner surface.

  In place of this bonding method, the support 3 is disposed so that the IC inlet 200 is on the upper surface, and the hot melt adhesive layer 4 is stacked on the support 3 to form the support 1 from above. The support 1 and the support 3 are overlapped so that the pressure-sensitive adhesive layer 5 fits within the frame of the hot melt adhesive layer 4 and is bonded by thermocompression bonding from the outer surfaces of the supports 1 and 3. Also good.

(6) The completed state is as shown in FIGS. As a result, the pressure-sensitive adhesive layer 5, the pressure-sensitive adhesive layer 6, and the IC inlet 200 all fit within the frame of the hot-melt adhesive layer 4.

  The IC tag label 100 manufactured by this manufacturing method uses the area immediately above the pressure-sensitive adhesive layer 5 as a print area 300 and prints various information in the print area 300. Thereby, the softness | flexibility and elasticity by the adhesive layer 5 can be given to the surface of the printing area | region 300. FIG. By providing the surface of the printing area 300 with flexibility and elasticity, the contact property of the printer head is improved, and the IC tag label 100 having good printing characteristics can be manufactured. The IC tag label 100 has a large area of the pressure-sensitive adhesive layer 5 in the whole. The IC inlet 200 is also attached to the support 3 by the pressure-sensitive adhesive layer 6, and this pressure-sensitive adhesive layer 6 also has flexibility and elasticity. Further, the IC inlet 200 is also flexible. Therefore, the IC tag label 100 can be given flexibility by the pressure-sensitive adhesive layer 5, the pressure-sensitive adhesive layer 6 and the IC inlet 200. As a result, the IC tag label 100 is easily bent, so that when it falls on the floor or the like, the IC tag label 100 can be easily picked up by bending the center portion from above. In the IC tag label 100, the outer peripheral side of the layer constituted by the pressure-sensitive adhesive layer 5, the IC inlet 200, and the pressure-sensitive adhesive layer 6 is liquid-tightly bonded by the hot melt adhesive layer 4. The upper and lower sides of the IC inlet 200, the pressure-sensitive adhesive layer 5, and the pressure-sensitive adhesive layer 6 are sandwiched between the resin support 1 and the support 3. With such a structure, the pressure-sensitive adhesive layer 5, the pressure-sensitive adhesive layer 6, and the IC inlet 200 are not exposed to the outside. Thereby, when the IC tag label 100 is cleaned, the cleaning liquid does not enter the adhesive surface from the side of the adhesive surface between the pressure-sensitive adhesive layer 5 and the support 1. Further, since the cleaning liquid does not enter the adhesive surface from the side of the adhesive surface between the pressure-sensitive adhesive layer 5 and the support 3, the supports 1 and 3 are not peeled off.

  In the manufacturing method of the IC tag label 100, the support 1 and the support 3 are bonded using the hot melt adhesive layer 4. Since the hot melt adhesive is solid at room temperature, it does not flow as compared with the case where a liquid adhesive is used. Therefore, the adhesive layer 5, the IC inlet 200, and the adhesive layer 6 are combined with each other in the hot melt adhesive layer 4. It is easy to position the hot melt adhesive layer 4 when it is accommodated in the frame. In particular, in the IC tag label 100, if the pressure-sensitive adhesive layer 5 protrudes to the end portion, there is a possibility that the cleaning liquid may enter the inside. Therefore, the outer peripheral side of the pressure-sensitive adhesive layer 5 is firmly attached to the hot melt adhesive layer 4. Need to be glued by. Since the hot-melt adhesive layer 4 does not use an organic solvent, an adhesive drying step is not necessary. Also, the production process can be easily automated.

Second Embodiment
[IC tag label]
The second embodiment will be described with a focus on differences from the first embodiment, and the description of the same configuration as the first embodiment will be omitted. Common configurations are given the same reference numerals. The IC tag label 100 in the first embodiment is configured using the pressure-sensitive adhesive layer 5 and the pressure-sensitive adhesive layer 6. In 2nd Embodiment, it replaces with this adhesive layer 5 and the adhesive layer 6, and comprises the IC tag label 600 using the double-sided adhesive tape. A second embodiment will be described with reference to FIGS. FIG. 13 is a cross-sectional view of an IC tag label 600 configured using double-sided adhesive tapes 50 and 60. The plan view of the IC tag label 600 is the same as FIG. 1 in the first embodiment. In 2nd Embodiment, it replaces with the adhesive layer 5 and uses the double-sided adhesive tape 50 instead of the adhesive layer 5, and uses the double-sided adhesive tape 60 instead of the adhesive layer 6 compared with 1st Embodiment. The double-sided adhesive tapes 50 and 60 have a three-layer structure because they have a structure in which an adhesive is applied to both surfaces of the central substrate. In FIG. 13, a double-sided adhesive tape 50 is obtained by applying an adhesive layer 14 and an adhesive layer 16 to both surfaces of a central substrate 15, respectively. Further, the double-sided adhesive tape 60 is obtained by applying the adhesive layer 17 and the adhesive layer 19 to both surfaces of the central substrate 18, respectively. The double-sided adhesive tape 50 is affixed to the surface of the support 1 opposite to the reversible thermosensitive recording layer 2, and the support 1 and the support 3 are attached to each other. The support 1 and the support 3 are bonded by the hot melt adhesive layer 4. The IC inlet 200 is attached to the support 3 with a double-sided adhesive tape 60. A hot melt adhesive layer 4 having a thickness of 30 to 50 μm can be used. The shape of the hot melt adhesive layer 4 is the same as that of the first embodiment, and the adhesive is also the same material as that of the first embodiment.

[Double-sided adhesive tape]
The double-sided pressure-sensitive adhesive tape 50 uses a urethane-based resin for the central base material 15 and has an adhesive layer 14 and a pressure-sensitive adhesive layer 16 formed on both surfaces by using an acrylic pressure-sensitive adhesive. . Also in the double-sided adhesive tape 60, the center base material 18 is made of urethane resin, and the adhesive layer 17 and the adhesive layer 19 are formed on both surfaces by using an acrylic adhesive, respectively. The thickness of the central base material 15 and 18 made of urethane resin is 12 to 25 μm, and the thickness of the acrylic pressure-sensitive adhesive layers 14, 16, 17 and 19 applied to both surfaces of the base material 15 and 18 is 15 to 15 μm. 25 μm. Therefore, the thickness of each double-sided adhesive tape 50, 60 is about 42 to 75 μm. In the second embodiment, since the thickness of the hot melt adhesive layer 4 is 30 to 50 μm, a double-sided adhesive tape that matches the thickness is selected. In the IC tag label 600 according to the second embodiment, an area immediately above the double-sided adhesive tape 50 is used as a printing area 300 (see FIG. 13). Both the urethane-based resin and the acrylic-based adhesive used for the double-sided adhesive tape 50 are materials having flexibility and elasticity. Therefore, moderate flexibility and elasticity by the double-sided adhesive tape 50 can be given to the surface of the printing region 300 of the IC tag label 600, and good printing characteristics can be obtained. In addition, the IC tag label 600 is a flexible label with sufficient flexibility due to the flexibility of the double-sided adhesive tape 50. If the label falls on the floor, the center portion of the label is bent from above and picked by hand. The IC tag label 600 is easy to lift.

[IC tag label production method]
A method for producing the IC tag label 600 according to the second embodiment will be described with reference to FIGS.

(1) Affixing Double-Sided Adhesive Tape 60 to IC Inlet Sheet 400 FIG. 14 is a cross-sectional view illustrating a state in which the double-sided adhesive tape 60 is adhered to the IC inlet sheet 400. FIG. 15 is a cross-sectional view showing a state in which the double-sided adhesive tape 60 is attached to the IC inlet sheet 400. As shown in FIG. 14, the adhesive layer 17 on the lower surface side of the double-sided adhesive tape 60 with the release sheet 21 attached to the upper surface is opposed to the surface on which the IC chip 9 of the IC inlet sheet 400 is disposed, The double-sided adhesive tape 60 and the IC inlet sheet 400 are affixed. A plan view of the IC inlet sheet 400 used in this step is the same as FIG. 6 of the first embodiment. A cross-sectional view after the double-sided adhesive tape 60 is attached to the IC inlet sheet 400 is as shown in FIG. In this state, the double-sided adhesive tape 60 is affixed to the IC inlet sheet 400, and the release sheet 21 is attached to the adhesive layer 19 of the double-sided adhesive tape 60. The release sheet 21 is the same as the release sheets 12 and 13 used in the first embodiment, and is attached with the surface on which the release agent is applied and the adhesive layer 19 facing each other. is there.

(2) Cutting IC inlet sheet 400 and attaching IC inlet 200 to support 3 FIG. 16 is a cross-sectional view of IC inlet 200 attached to support 3. The IC inlet sheet 400 is cut together with the double-sided adhesive tape 60 and the release sheet 21 along the cutting line 500 shown in FIG. At this time, similarly to the manufacturing method in the first embodiment, the IC inlets 200 are divided one by one (see FIG. 6). After performing the cutting process, the release sheet 21 of the double-sided adhesive tape 60 affixed to the IC inlet 200 is peeled off, and as shown in FIG. IC inlet 200 is stuck through 60.

(3) Affixing Double-Sided Adhesive Tape 50 to Support 1 FIG. 17 is a cross-sectional view after applying the double-sided adhesive tape 50 to the support 1. As shown in FIG. 17, in the support 1 in which the reversible thermosensitive recording layer 2 and the protective layer 20 were formed and the outer shape was processed, a release sheet 22 was attached to the opposite surface and the top surface of the reversible thermosensitive recording layer 2. The double-sided adhesive tape 50 is affixed to the support 1 so that the adhesive layer 14 on the lower surface side of the double-sided adhesive tape 50 faces each other. At this time, the double-sided adhesive tape 50 is attached to the peripheral portion of the support 1 leaving a region where the hot melt adhesive layer 4 is adhered. Further, the release sheet 22 is the same as the release sheets 12 and 13 in the first embodiment, and is attached with the surface on which the release agent is applied and the pressure-sensitive adhesive layer 14 facing each other.

(4) Processing of hot melt adhesive layer 4 The hot melt adhesive layer 4 is processed in the same manner as in the first embodiment (see FIGS. 10 and 11). The hot melt adhesive layer 4 has a frame shape in which a central portion is cut out in accordance with the shape of the double-sided adhesive tape 50. The outer shape of the hot melt adhesive layer 4 is processed according to the size of the support 1 and the support 3.

(5) Bonding of Support 1 and Support 3 FIG. 18 is a cross-sectional view illustrating how the support 1 and the support 3 are bonded together. As shown in FIG. 18, in the support 1 to which the double-sided adhesive tape 50 is attached, the release sheet 22 (see FIG. 17) is peeled off, and the frame-shaped hot melt adhesive layer 4 is stacked on the support 1. At this time, the hot melt adhesive layer 4 is overlaid so that the double-sided pressure-sensitive adhesive tape 50 of the support 1 fits in the frame. The double-sided adhesive tape 50 and the IC inlet 200 are opposed to each other, overlapped with the outline of the support 1 and the support 3 so as not to protrude from each other, and heated from the outer surface of the supports 1 and 3 by a laminator. Crimp. The support 1 and the support 3 are bonded together by the double-sided adhesive tape 50 by thermocompression bonding, and the hot melt adhesive layer 4 is melted to support the support 1 and the support on the outer peripheral side of the double-sided adhesive tape 50. The overlapping inner surface with the body 3 is bonded.

  In place of this bonding method, the support 3 is disposed so that the IC inlet 200 is on the upper surface, and the hot melt adhesive layer 4 is overlaid on the support 3 and is applied to the support 1 from above. The support 1 and the support 3 are overlapped so that the double-sided adhesive tape 50 fits within the frame of the hot melt adhesive layer 4 and is bonded by thermocompression bonding from the outer surfaces of the supports 1 and 3. You may do it.

(6) With such a manufacturing method, an IC tag label 600 as shown in FIG. 13 is completed.

  Also in the IC tag label 600 produced by this production method, the upper and lower sides of the double-sided adhesive tape 50, the IC inlet 200, and the double-sided adhesive tape 60 are sandwiched between the resin support 1 and the support 3. Further, the outer peripheral side of the layer constituted by the double-sided pressure-sensitive adhesive tape 50, the IC inlet 200, and the double-sided pressure-sensitive adhesive tape 60 is liquid-tightly bonded by the hot melt adhesive layer 4. With such a structure, the double-sided adhesive tape 50, the IC inlet 200, and the double-sided adhesive tape 60 are not exposed to the outside. The IC inlet 200 can be prevented from being exposed to the cleaning liquid by being sandwiched between the support 1 and the support 3 made of resin at the upper and lower sides, and the hot melt adhesive layer 4 also forms a cleaning liquid on the side of the IC inlet 200. It can be prevented from being exposed. Since the double-sided adhesive tape 50 is not exposed to the outside, the cleaning liquid does not enter the adhesive surface from the side of the adhesive surface between the adhesive layer 16 of the double-sided adhesive tape 50 and the support 3, and the double-sided adhesive property. The tape 50 is not peeled off from the support 3. Further, since the cleaning liquid does not enter the adhesive surface from the side of the adhesive surface between the adhesive layer 14 of the double-sided adhesive tape 50 and the support 1, the double-sided adhesive tape 50 is peeled off from the support 1. There is no end to it. With such a configuration, the cleaning liquid resistance of the IC tag label 600 is improved.

  In the IC tag label 600, since the double-sided adhesive tape 50 is positioned immediately above the printing area 300 in the support 1 (see FIG. 13), the flexibility and elasticity of the double-sided adhesive tape 50 on the surface of the printing area 300 are improved. Can be given. This is because the central substrate 15 and the adhesive layers 14 and 16 constituting the double-sided adhesive tape 50 have flexibility and elasticity. If the surface of the recording area 300 has flexibility and elasticity, the portion where the printer head abuts is appropriately deformed due to the flexibility, and is appropriately adhered to the printer head due to the elasticity. IC tag label 600 having good printing characteristics can be manufactured. In the IC tag label 600, the ratio of the double-sided adhesive tape 50 to the whole is large. In addition, since the double-sided adhesive tape 60 is also flexible, the flexibility of the double-sided adhesive tapes 50, 60 can make the IC tag label 600 easy to bend. If the IC tag label 600 is easy to bend at the center, it is easy to bend the center from above and pick it up by hand when it falls on the floor or the like. When the double-sided adhesive tapes 50 and 60 are used, it is not necessary to apply the adhesive to the support or the like. Since the double-sided adhesive tapes 50 and 60 have the adhesive layers 14, 16, 17 and 19 fixed by the central base materials 15 and 18, it is only necessary to attach the double-sided adhesive tapes 50 and 60 to the support or the like. It becomes easier to handle than the adhesive alone, and the IC tag label 600 can be easily produced.

<Effects of IC tag label and production method thereof>
The IC tag labels 100 and 600 in the first and second embodiments use the pressure-sensitive adhesive layer 5 or the double-sided pressure-sensitive adhesive tape 50 at the center, and the support 1 and the support by the hot-melt adhesive layer 4 on the sides. 3, the upper and lower sides of the IC inlet 200 are sandwiched between the support 1 and the support 3, and the sides are sealed by the hot melt adhesive layer 4, so that the cleaning liquid enters the inside. It is possible to make the IC tag label excellent in cleaning liquid resistance. Further, by making the central portion of the IC tag labels 100 and 600 the pressure-sensitive adhesive layer 5 or the double-sided pressure-sensitive adhesive tape 50, the printing characteristics due to the flexibility and elasticity of the pressure-sensitive adhesive layer 5 or the double-sided pressure-sensitive adhesive tape 50 can be easily grasped. An IC tag label with excellent thickness can be obtained. By the IC tag label manufacturing method in the first and second embodiments, it is possible to manufacture the IC tag labels 100 and 600 having excellent cleaning resistance, printing characteristics, and ease of gripping. In addition, the use of the hot melt adhesive layer 4 can facilitate the positioning of the hot melt adhesive layer 4 as compared with a liquid adhesive.

  The present invention is not limited to the above embodiment.

  In the first embodiment, the pressure-sensitive adhesive layers 5 and 6 are used to constitute the IC tag label 100. In the second embodiment, both the pressure-sensitive adhesive layers 5 and 6 are replaced with double-sided pressure-sensitive adhesive tapes 50 and 60. Although the IC tag label 600 is configured, only one adhesive layer may be replaced with a double-sided adhesive tape. For example, instead of the pressure-sensitive adhesive layer 5 in the first embodiment, the double-sided pressure-sensitive adhesive tape 50 may be used, and the pressure-sensitive adhesive layer 6 may be used as it is to constitute an IC tag label. In the case of producing such an IC tag label, in the method for producing the IC tag label 100 in the first embodiment, the step of “(3) forming an adhesive layer on the support 1” is replaced with “(( By substituting with the “3) Affixing double-sided adhesive tape 50 to the support 1” step, an IC tag label can be produced.

  Conversely, in the first embodiment, instead of the adhesive layer 6 of the IC tag label 100, a double-sided adhesive tape 60 may be used, and the adhesive layer 5 may be used as it is to constitute an IC tag label. In this case, as the IC tag label production method, in the production method of the IC tag label 100 in the first embodiment, “(1) Formation of an adhesive layer on the IC inlet sheet 400” and “(2) Cutting of the IC inlet sheet 400”. And the step of “attaching the IC inlet 200 to the support 3” are the steps of “(1) sticking the double-sided adhesive tape 60 to the IC inlet sheet 400” and “(2) the IC inlet sheet 400” in the second embodiment. It can be manufactured by replacing with the steps of “cutting and attaching the IC inlet 200 to the support 3”.

  Moreover, the magnitude | size of the adhesive layers 5 and 6 and the double-sided adhesive tapes 50 and 60 is not restricted to the said embodiment. FIG. 19 is a cross-sectional view of an IC tag label 700 configured using adhesive layers 23 and 24 in which the sizes of the adhesive layers 5 and 6 used in the IC tag label 100 are changed. The pressure-sensitive adhesive layers 23 and 24 are reversed in size from the pressure-sensitive adhesive layers 5 and 6 of the IC tag label 100 in the first embodiment, and the pressure-sensitive adhesive layer 24 has a larger area than the pressure-sensitive adhesive layer 23. In the IC tag label 700, the pressure-sensitive adhesive layer (first pressure-sensitive adhesive layer) 24 has the IC inlet 200 attached to the support 3 and the support 1 and the support 3 are bonded together. Further, the IC inlet 200 is attached to the support 1 via an adhesive layer (second adhesive layer) 23. In the IC tag label 700, the print area 300 is directly above the pressure-sensitive adhesive layer 24, but the area directly above the pressure-sensitive adhesive layer 23 is also included. Therefore, since the flexibility and elasticity by the adhesive layers 23 and 24 can be given to the surface of the printing region 300, the IC tag label 700 has excellent printing characteristics. Of course, an IC tag label may be configured by using a double-sided adhesive tape in place of either or both of the adhesive layers 23 and 24.

  Although the hot melt adhesive layer 4 is used in the above embodiment, a liquid adhesive may be used. For example, an ethylene vinyl acetate resin emulsion adhesive or an epoxy resin adhesive can be used. In the first and second embodiments, the IC tag label 100 and the IC tag label 600 are rectangular labels. However, the shape of the label is not limited to a rectangle, but a triangle, a polygon, a trapezoid, a parallelogram, a circle, It may be oval. For example, in the case of a circular IC tag label, the hot melt adhesive layer 4 is processed into a ring shape, and the pressure-sensitive adhesive layer 5, the IC inlet 200, and the pressure-sensitive adhesive layer 6 are arranged on the inside thereof. Good. In the said embodiment, although white PET was used for the support body 1 and the support body 3, if it is a plastic which is not brittle, arbitrary plastic supports can be applied.

It is a top view of IC tag label 100 in a 1st embodiment. It is II-II sectional drawing of the IC tag label 100 shown in FIG. FIG. 3 is a diagram showing a print area 300 of the IC tag label 100 shown in FIGS. 1 and 2. 2 is a plan view of an IC inlet 200. FIG. It is VV sectional drawing of IC inlet 200 shown in FIG. 2 is a plan view of an IC inlet sheet 400. FIG. It is sectional drawing of IC inlet sheet 400 in which the adhesive layer 6 was formed. In 1st Embodiment, it is sectional drawing of the state which affixed IC inlet 200 to the support body 3. FIG. In 1st Embodiment, it is sectional drawing of the support body 1 after forming the adhesive layer 5. FIG. 2 is a perspective view of a hot melt adhesive layer 4. FIG. It is XI-XI sectional drawing of the hot-melt-adhesive agent layer 4 shown in FIG. In 1st Embodiment, it is sectional drawing which shows the mode of the bonding of the support body 1 and the support body 3. In FIG. It is sectional drawing of the IC tag label 600 in 2nd Embodiment. In 2nd Embodiment, it is sectional drawing which shows a mode that the double-sided adhesive tape 60 is affixed on IC inlet sheet 400. FIG. In 2nd Embodiment, it is sectional drawing in the state which affixed the double-sided adhesive tape 60 on IC inlet sheet 400. FIG. In 2nd Embodiment, it is sectional drawing in the state which affixed IC inlet 200 to the support body 3. FIG. In 2nd Embodiment, it is sectional drawing which shows the state after affixing the double-sided adhesive tape 50 on the support body 1. FIG. In 2nd Embodiment, it is sectional drawing which shows a mode that the support body 1 and the support body 3 are affixed. It is sectional drawing of the IC tag label 700. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,3 ... Support body 2 ... Reversible thermosensitive recording layer 4 ... Hot melt adhesive layer 5, 6 ... Adhesive layer 7 ... Insulating sheet 8 ... Antenna pattern 9 ... IC chip 10 ... Bump 11 ... Adhesive for fixing IC chip 12, 13, 21, 22 ... release sheets 14, 16, 17, 19 ... pressure-sensitive adhesive layers 15, 18 ... central substrate 20 ... protective layers 23, 24 ... pressure-sensitive adhesive layer 30 ... adhesive layer
50 , 60 ... Double-sided adhesive tape
100 , 600 , 700 ... IC tag label
200 ... IC inlet 300 ... Print area
400 ... IC inlet sheet 500 ... Cutting line

Claims (11)

An IC tag label in which a first pressure-sensitive adhesive layer, an IC inlet, a second pressure-sensitive adhesive layer, and a second support molded with a resin are stacked in this order on a first support molded with a resin. ,
The second support has a reversible thermosensitive recording layer on the outer surface;
On the outer peripheral side of the layer structure constituted by the first pressure-sensitive adhesive layer, the IC inlet, and the second pressure-sensitive adhesive layer, the inner surface of the first support and the second support overlapped with each other. An IC tag label characterized in that is adhered by an adhesive layer.   2. The IC according to claim 1, wherein in the second support, a print area of the reversible thermosensitive recording layer is located immediately above the first pressure-sensitive adhesive layer or the second pressure-sensitive adhesive layer. Tag label.   3. The IC tag label according to claim 1, wherein the IC tag label is configured by using a double-sided adhesive tape in which an adhesive is applied to both surfaces of a central base material in place of the first and / or second adhesive layer.   4. The IC tag label according to claim 3, wherein the double-sided pressure-sensitive adhesive tape is obtained by applying an acrylic pressure-sensitive adhesive to both surfaces of a central base material formed of a urethane-based resin.   The adhesive layer is any one of a polyamide resin adhesive, a polyester resin adhesive, a polyurethane resin adhesive, and an ethylene vinyl acetate resin adhesive. The IC tag label according to one item. The resin-made 1st support body which affixed IC inlet by the 1st adhesive layer, the reversible thermosensitive recording layer on the outer surface, and the 2nd adhesive layer applied to the back surface In the IC tag label production method for producing an IC tag label by adhering the second support to the frame-like hot melt adhesive layer,
A frame of the frame-shaped hot melt adhesive layer, wherein the IC inlet attached to the first support and the second pressure-sensitive adhesive layer applied to the second support are opposed to each other. Stacking the first support and the second support so as to accommodate the first pressure-sensitive adhesive layer, the IC inlet, and the second pressure-sensitive adhesive layer inside,
And a step of bonding the frame-shaped hot melt adhesive layer by thermocompression bonding from the outside of the first and second supports.   The method further comprises a step of printing information on the first pressure-sensitive adhesive layer or a region immediately above the second pressure-sensitive adhesive layer in the reversible thermosensitive recording layer of the second support. 6. A method for producing an IC tag label according to 6.   Instead of the first support made of resin with the IC inlet attached to the first adhesive layer, the IC inlet was attached with a double-sided adhesive tape with adhesive applied to both surfaces of the central substrate. The method for producing an IC tag label according to claim 6 or 7, wherein a first support made of resin is used.   In place of the resin-made second support having a reversible thermosensitive recording layer on the outer surface and a second pressure-sensitive adhesive layer applied on the back surface, the back surface has a reversible thermosensitive recording layer on the outer surface. A resin-made second support having a double-sided adhesive tape having a pressure-sensitive adhesive applied to both surfaces of a central substrate is used. A method for producing an IC tag label according to 1.   10. The IC according to claim 8, wherein the double-sided adhesive tape is a double-sided adhesive tape in which an acrylic adhesive is applied to both surfaces of a central base material formed of a urethane-based resin. Tag label production method.   The hot-melt adhesive layer is made of any one of a polyamide resin adhesive, a polyester resin adhesive, a polyurethane resin adhesive, and an ethylene vinyl acetate resin adhesive. The IC tag label production method as described in any one of these.

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