JP5099746B2 - Rewrite recording medium and manufacturing method thereof - Google Patents

Description

  The present invention relates to a rewrite recording medium in which a rewrite sheet and an IC tag are combined, and a manufacturing method thereof.

  In recent years, rewritable rewritable recording media combining rewritable sheets and IC tags have been used in management operations such as production processes. A rewritable sheet is a sheet having a reversible thermosensitive recording layer provided on the sheet, which is printed by coloring the thermosensitive recording layer by heating with a thermal printer. An IC tag has an antenna and an IC chip on a substrate. It has an provided inlet and reads and writes data stored in the IC chip by radio waves from a dedicated reader / writer device. A rewrite recording medium composed of such a rewrite sheet and an IC tag can leave a backup when the IC chip breaks down by displaying the data in the IC chip on the thermal recording layer, There are advantages that a large amount of display information can be printed and that a two-dimensional code having a large area can be printed.

  FIG. 4 is a diagram showing a configuration example of a conventional rewrite recording medium. The rewritable recording medium 40 shown in the figure is composed of a rewritable sheet 41 provided with a thermosensitive recording layer on a base material sheet, and a partial inlet 42 obtained by cutting the peripheral edge of an inlet having an antenna and an IC chip on the base material. Yes. And after sandwiching both surfaces of the partial inlet 42 between the hot melt sheets 43 and 43 as shown in FIG. 5A, the rewrite sheet 41 is opposed to the front surface side, and the pair sheet 44 made of synthetic resin is opposed to the back surface side. The product as shown in FIG. 5B is manufactured by heat bonding.

  However, according to this manufacturing method, the thickness of the rewrite sheet 41 is usually about 130 μm, the thickness of the partial inlet 42 is about 220 μm, the thickness of the hot melt sheet 43 is about 30 μm, and the thickness of the pair sheet 44 is about 100 μm. Has a disadvantage that the product lacks flexibility (flexibility). In addition, unevenness due to the IC chip and a level difference due to the partial inlet 42 occur on the surface of the product, which causes blurring or omission in characters printed on the rewrite sheet 41. Furthermore, when the products are stacked on the printer stacker due to the unevenness and the level difference, an inclination occurs due to the variation in thickness, which causes a problem of conveyance in the printer and a decrease in the number of sheets that can be stacked.

  Next, FIG. 5 is a diagram showing another configuration example of the conventional rewrite recording medium. The rewritable recording medium 50 shown in the figure has no irregularities due to the thickness of the IC chip. That is, a core sheet 55 having an opening corresponding to the size of the IC chip as shown in FIG. 5A is used, and this core sheet 55 is covered from the top of the partial inlet 52, and both sides of the hot melt sheet 53, After being sandwiched by 53, the rewritable sheet 51 is opposed to the front surface side, and the pair sheet 54 is opposed to the back surface side, so that the product as shown in FIG.

  According to this manufacturing method, although the unevenness due to the IC chip is eliminated, the thickness of the core sheet 55 is usually about 188 μm, and the maximum thickness of the finished product is further increased to about 528 μm. There is a drawback that it is difficult to grasp the product when placed on a flat surface. In addition, since the level difference due to the partial inlet 52 still occurs on the surface of the rewritable sheet 51, the above-described problems such as printing defects and conveyance troubles are not solved.

  The following Patent Document 1 discloses a technique related to the information recording medium as described above, but this technique differs from the present invention in that a recording substrate having a reversible recording layer is combined with a photothermal conversion substrate. Sheets are stacked, a module having an antenna and an IC chip is inserted between the recording substrate and the sheet, and heated and pressed.

JP 2003-182250 A

  The present invention has been made to solve the above-described problems, and the object of the present invention is to rewrite particularly excellent in printability and handleability by eliminating unevenness and steps on the product surface and reducing the product thickness. It is to provide a recording medium and a manufacturing method thereof.

To achieve the above object, rewrite recording medium of the present invention, the rewrite sheet having a reversible thermosensitive recording layer on the surface side, an inlet sheet having an antenna and an IC chip on the upper surface side, the back face of the rewrite sheet and it provided between the upper surface of the inlet sheet, comprising a single core sheet having an opening for fitting the IC chip, the back surface and the upper surface of the core sheet of the rewrite sheet during is bonded by the first hot-melt sheet is interposed between them is melted and solidified, between the upper surface and the lower surface of the core sheet of the inlet sheet, a second hot which is interposed therebetween The melt sheet is bonded by melting and solidifying, and the first chip surface and the back surface of the rewritable sheet are connected to each other through the opening of the core sheet. The hot melt sheet and the second hot melt sheet are directly overlapped to be melted and solidified to be bonded, and the second hot melt sheet is melted and solidified between the outer peripheral surface of the IC chip and the opening. An adhesive layer formed by the first hot melt sheet that adheres between the back surface of the rewritable sheet and the upper surface of the core sheet, the upper surface of the inlet sheet, and the lower surface of the core sheet. The adhesive layer formed by the second hot melt sheet that is bonded between the outer peripheral surface of the IC chip and the opening is bonded by the adhesive layer formed by the second hot melt sheet that is bonded between It is characterized by being.

A method of manufacturing a rewrite recording medium of the present invention, the back surface of the rewrite sheet having a reversible thermosensitive recording layer on the surface side, between the upper surface of the inlet sheet having an antenna and an IC chip on the upper side, the one core sheets forming the openings IC chip is fitted is interposed, between the back surface and the upper surface of the core sheet of the rewrite sheet, the first hot-melt sheet is interposed therebetween bonded by melt solidification, between the upper surface and the lower surface of the core sheet of the inlet sheet is adhered by melting and solidification of the second hot-melt sheet interposed therebetween, the upper end surface of the IC chip and the Between the back surface of the rewritable sheet, the first hot melt sheet and the second hot melt sheet directly overlap and melt and solidify through the opening of the core sheet. Ri, adhered, between the outer peripheral surface and the opening of the IC chip, the second hot-melt sheet is adhered by melting and solidification, between the back and the upper surface of the core sheet of the rewrite sheet The first hot melt sheet adhesive layer, and the second hot melt sheet adhesive layer between the upper surface of the inlet sheet and the lower surface of the core sheet, It joins with the contact bonding layer by the said 2nd hot-melt sheet which adhere | attaches between the outer peripheral surface of an IC chip, and the said opening part .

  The type of the rewritable sheet is not particularly limited as long as it has a recording layer that can be rewritably displayed on the base sheet. For example, a rewritable sheet having a leuco dye type or a transparent / cloudy type thermal recording layer can be used.

  A leuco dye-type thermal recording layer is a resin binder in which a color former made of leuco dye and a developer made of an acidic substance are dispersed and applied to a base sheet, and the color developer and developer are melted by heating. Color develops, and when cooled rapidly to room temperature, the colored state is stable and printing can be performed. On the other hand, decoloring can be performed by heating again to melt the color former and developer and then slowly cooling to room temperature.

  Transparent and cloudy type heat-sensitive recording layer is a low molecular weight organic substance dispersed in a resin binder and coated on a transparent film. When heated to low temperature, the organic low molecule becomes cloudy and becomes cloudy when cooled to room temperature. Stable printing can be performed. On the other hand, decolorization can be performed by heating at a lower temperature to return the organic low molecule to transparent and cooling to room temperature.

  If the inlet sheet functions as an IC tag having an antenna and an IC chip on a base sheet and performs wireless data communication with an external reader / writer device, the communication method is not particularly limited. . For example, an electromagnetic coupling method, an electromagnetic induction method, a radio wave method, or the like can be employed.

  In the electromagnetic coupling method, communication is performed using mutual induction generated by applying a high-frequency wave by a long wave to the antenna. In this case, the antenna of the inlet sheet is a coil antenna. The electromagnetic induction system performs communication using a magnetic field generated in the vicinity of an antenna due to a long wave band or a short wave band. In this case, the antenna of the inlet sheet is a coil antenna. In the radio wave system, communication is performed using radio waves in the UHF band or microwave band. In this case, the antenna of the inlet sheet is a dipole antenna.

  Adhesives include solvent-based adhesives made of epoxy resin, urethane resin, etc., and have adhesive strength by heating and melting, and then have the function of bonding sheets by cooling and curing. A hot melt adhesive can be used. Among the hot melt adhesives, those processed into a sheet form are referred to as hot melt sheets, and examples thereof include a sheet made of a low melting point thermoplastic resin such as a polyethylene sheet or a polyamide sheet.

  As the core sheet, those having excellent adhesiveness with an adhesive and suitable flexibility are preferable. For example, synthetic paper using a synthetic resin such as polyester or polypropylene as a raw material is suitable.

  According to the present invention, since it is possible to abolish the conventional inlet cutting process and the operation of inserting the cut partial inlet, man-hours can be reduced and manufacturing time can be shortened. In addition, even if the rewrite sheet, hot melt sheet, and core sheet have the same thickness as before, the thickness of the finished product can be reduced by using the full inlet sheet instead of the pair sheet. Flexibility (flexibility) can be provided, and there is an effect that ease of handling is greatly improved.

  In addition, according to the present invention, the finished product surface has no unevenness due to the IC chip or a step due to the partial inlet as in the prior art, and the printing surface of the rewrite sheet becomes flat, so when printing on the rewrite sheet with a thermal printer There is also an effect that good printing can be performed without causing blur or omission.

  Furthermore, according to the present invention, since both sides of the product are flat and the entire thickness is uniform, the product does not tilt when stacked on the printer stacker, and troubles in transporting the printer are eliminated. There is also an effect that the number of stacked sheets can be increased as much as the overall thickness is reduced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram showing a configuration example of the rewritable recording medium of the present invention, FIG. 2 is a cross-sectional view of the rewritable recording medium, and FIG. 3 is a diagram showing a manufacturing method of the rewritable recording medium.

  As shown in FIG. 1, a rewrite recording medium 10 of the present embodiment is a recording medium having a rewrite sheet 11 on the front surface side and an inlet sheet 12 on the back surface side. The rewrite sheet 11 is printed by printing with a thermal printer. The data in the IC chip of the inlet sheet 12 can be read and written by wireless communication with a reader / writer device. The rewritable recording medium 10 is larger than the card size (85.6 mm × 54.0 mm) and smaller than the A5 plate size (148.0 mm × 210.0 mm), and its thickness is set to 500 μm or less. Yes.

  In the present embodiment, the rewritable sheet 11 employs a leuco dye type, and includes a reversible thermosensitive recording layer 11b on a base sheet 11a.

  The base sheet 11a is a support that supports the reversible thermosensitive recording layer 11b, and for example, a synthetic resin film such as PET can be used.

  The heat-sensitive recording layer 11b is uniformly coated on the surface of the substrate sheet 11a by dispersing a color former made of leuco dye and a developer made of an acidic substance in a resin binder. When the thermal recording layer 11b is heated by the thermal head of the printer, the color former and the developer are melted to develop color, and by rapidly cooling this, the colored state can be stably printed, while the hot plate or heat The heat-sensitive recording layer 11b is heated again with a roller to melt the color former and the developer, and the color can be erased by gradually cooling it. In the illustrated example, information based on a two-dimensional code is printed on the thermal recording layer 11b for backup of various data stored in the IC chip 12c described later.

  In the present embodiment, a leuco dye type is used for the rewrite sheet 11, but a transparent / cloudy type may be used instead.

  In the present embodiment, the inlet sheet 12 functions as an IC tag that employs an electromagnetic induction method, and includes an antenna 12b and an IC chip 12c on a base sheet 12a.

  The base sheet 12a is a support that supports the antenna 12b and the IC chip 12c, and for example, a synthetic resin film such as PET can be used.

  The antenna 12b is made of a conductor connected to the terminal of the IC chip 12c, and receives electric waves from the reader / writer device to generate power for starting the IC chip 12c. The shape of the antenna 12b is formed in a loop coil shape so as to adapt to the electromagnetic induction method.

  The IC chip 12c is an electronic component that performs data communication with the reader / writer device, and includes a CPU, a ROM, a RAM, and an EEPROM. The CPU analyzes the signal received from the reader / writer device, executes the process, and returns the execution result from the antenna 12b to the reader / writer device. ROM is a read-only memory that stores an execution program of the CPU, RAM is a working memory that temporarily stores data, and EEPROM is a non-volatile memory that stores communicated data in a rewritable manner. Various data necessary for management in the rewrite recording medium 10 is stored in the EEPROM.

  The inlet sheet 12 of the present embodiment is an electromagnetic induction type IC tag, but may be replaced with an electromagnetic coupling type or radio wave type IC tag.

  As shown in FIG. 2, in the rewrite recording medium 10, a core sheet 15 is interposed between the rewrite sheet 11 and the inlet sheet 12. The core sheet 15 is bonded to both the rewrite sheet 11 and the inlet sheet 12 by a hot melt layer 13a obtained by melting and curing a hot melt sheet 13 described later.

  The core sheet 15 is for filling gaps so as to eliminate unevenness of the product surface due to the thickness of the IC chip 12c, and a sheet having excellent adhesiveness with the hot melt sheet 13 and having appropriate flexibility is used. ing. For example, a synthetic paper using a synthetic resin such as polyester or polypropylene as a raw material is suitable. The core sheet 15 is provided with an opening 15a at a predetermined position. The IC chip 12c is fitted into the opening 15a, and the core sheet 15 and the IC chip 12c are set at substantially the same height. Thereby, there is no unevenness on the front surface of the rewrite sheet 11 and the back surface of the inlet sheet 12, and both surfaces of the rewrite recording medium 10 have a flat structure.

  The above is the configuration of the rewritable recording medium of the present invention, and the manufacturing method thereof will be described below.

  As shown in FIG. 3, the antenna 12b is first formed on the base material sheet 12a. The base sheet 12a is formed of a synthetic resin film (thickness 100 μm) such as PET, and the antenna 12b is patterned in a loop coil shape on the synthetic resin film by screen printing, inkjet printing, intaglio printing, or the like. It is formed by printing or etching copper foil or aluminum foil. The conductive paste is a paste that can be printed by mixing and dispersing conductive particles such as gold, platinum, silver, copper, palladium, nickel, tin, lead, and indium in a resin binder of vinyl resin or phenol resin. It is a thing.

  Next, the IC chip 12c is mounted on the antenna 12b. Since the antenna 12b is formed in a loop coil shape, a bonding agent is applied to the coil end of the antenna 12b. As the bonding agent, a conductive adhesive in which a conductive filler is mixed with a thermosetting epoxy resin can be used. Then, the IC chip 12c (thickness: 170 μm) is placed on the bonding agent with the terminals facing downward, and is pressed by a mounting machine to connect the antenna 12b and the IC chip 12c, thereby producing the inlet sheet 12.

  Next, the hot melt sheet 13 is laminated on the inlet sheet 12. As the hot melt sheet 13, a thermoplastic resin sheet (thickness 30 μm) having a low melting point such as a polyethylene sheet or a polyamide sheet can be used. Two hot melt sheets 13 are used as shown in the figure, and a core sheet 15 is inserted between the two hot melt sheets 13 and 13.

  The core sheet 15 is preferably synthetic paper made of a synthetic resin such as polyester or polypropylene. Examples of commercially available synthetic paper include polyester-based synthetic paper “Chrisper” (Toyobo Co., Ltd., product name), and polypropylene-based synthetic paper. Paper "Yupo" (manufactured by YUPO Corporation, product name). In the present embodiment, the “crisper” (thickness: 188 μm) is used. The core sheet 15 is formed with an opening 15a for fitting the IC chip 12c by drilling according to the size of the IC chip 12c. Then, as shown in the figure, both surfaces of the core sheet 15 are sandwiched between the hot melt sheets 13, 13, the opening 15 a of the core sheet 15 is aligned with the position of the IC chip 12 c, and is laminated on the IC chip mounting surface of the inlet sheet 12.

  Next, the rewritable sheet 11 is laminated on the hot melt sheet 13. The rewritable sheet 11 is formed by printing a reversible thermosensitive recording layer 11b on a substrate sheet 11a. The base sheet 11a is composed of a synthetic resin film (thickness 100 μm) such as PET, and the thermosensitive recording layer 11b (thickness 30 μm) is a chromophoric agent composed of a leuco dye and a visible substance composed of an acidic substance such as a phenolic compound. A colorant, a sensitizer that promotes the chemical reaction between the two, and a holding agent that uniformly disperses these components and adheres to the base sheet are mixed in a resin binder to form a printable paste. is there. The rewritable sheet 11 is laminated on the hot melt sheet 13 on the front side with the surface on which the heat-sensitive recording layer 11b is applied.

  Finally, the rewrite sheet 11 and the inlet sheet 12 are bonded. When the rewritable sheet 11 and the inlet sheet 12 laminated as described above are heated at a predetermined temperature, the hot melt sheets 13 and 13 are melted and have an adhesive force to each other. Thereafter, the hot melt sheet 13 is cured by cooling to room temperature, and a hot melt layer 13a is formed. The base sheet 11a and the core sheet 15 of the rewritable sheet 11 are bonded via the hot melt layer 13a on the front side, and the base sheet 12a and the core sheet 15 of the inlet sheet 12 are bonded via the hot melt layer 13a on the back side. Glued together. As a result, as shown in FIG. 2, the rewrite recording medium 10 having no irregularities on the front surface of the rewrite sheet 11 and the back surface of the inlet sheet 12 is completed.

  In the present embodiment, the hot melt sheet 13 is used, but an adhesive such as a hot melt adhesive or a solvent adhesive may be used instead.

  As described above, according to the present invention, since it is not necessary to cut the inlet or insert the cut partial inlet as in the prior art, man-hours are reduced and manufacturing time is shortened. The rewrite sheet 11, the hot melt sheet 13, and the core sheet 15 have the same thickness as the conventional one, but the pair sheet on the back side (equivalent to a thickness of 100 μm) is abolished, and instead the top sheet of the base sheet 12a. By using the entire inlet sheet 12 on which the antenna 12b and the IC chip 12c are directly mounted, the maximum thickness of the finished product can be suppressed to about 478 μm. For this reason, since the whole thickness becomes thinner than a conventional product, the flexibility (flexibility) can be given to the product, and the ease of handling is greatly improved.

  Further, since the unevenness due to the IC chip 12c and the step due to the partial inlet are eliminated on the front and back surfaces of the completed rewrite recording medium 10, and the printing surface of the rewrite sheet 11 has a flat structure, the rewrite is performed by a thermal printer. When printing on the sheet 11, no blur or omission occurs, and good printing becomes possible.

  Furthermore, since both sides of the product are flat and the thickness of the entire product is uniform, the product does not tilt when stacked on the printer stacker, and troubles during transportation with the printer can be solved. There is also an advantage that the number of sheets that can be stacked increases as the thickness decreases.

The figure which shows the example of 1 structure of the rewrite recording medium of this invention. 1 is a cross-sectional view of a rewritable recording medium of the present invention. The figure which shows the manufacturing method of the rewrite recording medium of this invention. The figure which shows the example of 1 structure of the conventional rewrite recording medium. The figure which shows the other structural example of the conventional rewrite recording medium.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Rewrite recording medium 11 Rewrite sheet 11a Base material sheet 11b Thermal recording layer 12 Inlet sheet 12a Base material sheet 12b Antenna 12c IC chip 13 Hot melt sheet 13a Hot melt layer 15 Core sheet 15a Opening part

Claims (2)

A rewrite sheet having a reversible thermosensitive recording layer on the surface side;
An inlet sheet having an antenna and an IC chip on the upper surface side;
Provided between the back surface and the upper surface of the inlet sheet in the rewrite sheet, comprising a single core sheet having an opening for fitting the IC chip,
Between the back surface and the upper surface of the core sheet of the rewrite sheet is adhered by the first hot-melt sheet is interposed between them is melted and solidified,
Between the upper surface and the lower surface of the core sheet of the inlet sheet is bonded by the second hotmelt sheet interposed therebetween is melted and solidified,
Between the upper end surface of the IC chip and the back surface of the rewritable sheet, the first hot melt sheet and the second hot melt sheet are directly overlapped and melted and solidified through an opening of the core sheet. And
Between the outer peripheral surface of the IC chip and the opening is bonded by melting and solidifying the second hot melt sheet,
The adhesive layer of the first hot melt sheet that adheres between the back surface of the rewritable sheet and the upper surface of the core sheet, and the upper surface of the inlet sheet and the lower surface of the core sheet are adhered. The adhesive layer formed by the second hot melt sheet is bonded by an adhesive layer formed by the second hot melt sheet that bonds the outer peripheral surface of the IC chip and the opening. To rewrite recording media. And back surface of the rewrite sheet having a reversible thermosensitive recording layer on the surface side, between the upper surface of the inlet sheet having an antenna and an IC chip on an upper surface side, one forming the opening in which the IC chip is fitted Interposing the core sheet of
Between the back surface and the upper surface of the core sheet of the rewrite sheet adhered by melting and solidification of the first hot-melt sheet interposed therebetween,
Between the upper surface and the lower surface of the core sheet of the inlet sheet is adhered by melting and solidification of the second hot-melt sheet interposed therebetween,
Between the upper end surface of the IC chip and the back surface of the rewrite sheet, the first hot melt sheet and the second hot melt sheet are directly overlapped and melted and solidified through the opening of the core sheet. Glue,
Between the outer peripheral surface of the IC chip and the opening, the second hot melt sheet is bonded by melting and solidifying,
The adhesive layer of the first hot melt sheet that adheres between the back surface of the rewritable sheet and the upper surface of the core sheet, and the upper surface of the inlet sheet and the lower surface of the core sheet are adhered. The adhesive layer formed by the second hot melt sheet is bonded by the adhesive layer formed by the second hot melt sheet that bonds the outer peripheral surface of the IC chip and the opening. A method for manufacturing a recording medium.

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