JP2012053570A - Ic tag and ic chip breakage prevention method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC tag capable of further reducing IC chip breakage, and an IC chip breakage prevention method.SOLUTION: An IC tag 1 comprises: a support 11; an IC chip 12 connected to an antenna circuit of the support 11; and an adhesive material. A reinforcement material 40 having an aperture 41 is attached on a surface 201 (outermost surface) on the opposite side to a surface where the adhesive material 32 of the support 11 is laminated, so that the IC chip 12 is arranged within the aperture 41 from a planar view of the IC tag 1. At a cross section perpendicular to a surface of the support 11, the formulae, (1)L≥1.50×T1 and (2)T2≥0.35×T1, are satisfied when setting a distance between an aperture inner edge 411 of the reinforcement material 40 and an outer edge 121 of the IC chip 12 as L[mm], setting a thickness from a surface (undersurface 122) on the side of the adhesive material 32 of the IC chip 12 to the surface 201 as T1[mm] and setting a thickness of the reinforcement material 40 as T2[mm].

Description

  The present invention relates to an IC tag and an IC chip damage prevention method.

In recent years, contactless RFID has been developed and widely used to obtain information from IC tags by holding an IC tag attached to an article to be managed (adhered body) over an information acquisition device, and to identify and manage the article. is doing. The IC chip incorporated in the IC tag is activated by an electromagnetic wave emitted from the information acquisition device, and can transmit / receive information to / from the information acquisition device or rewrite data. IC tags are used in a wide variety of fields, such as commuter pass tickets for various transportation facilities, entry / exit management at companies, etc., inventory management of goods, and logistics management.
As IC tags have become widespread, there has been a problem that IC chips are cracked or damaged by external stress (external stress).
For example, when the IC tag is attached to a hard adherend, the portion of the IC tag where the IC chip is mounted is larger in thickness than the portion where the IC chip is not mounted, and is raised. Yes. For this reason, external stress is easily applied to the portion where the IC chip is mounted, and the IC chip is cracked. Also, in recent years, there are an increasing number of cases where an IC tag is attached to a card-like adherend, and when this card is stacked, stress concentrates on the portion where the IC chip is mounted. It becomes.
Various techniques have been developed to prevent such breakage of the IC chip.
For example, Patent Document 1 discloses that an RF-ID medium in which an IC chip is mounted on a resin sheet has a diameter sufficient to include the IC chip on the opposite side of the IC chip through the resin sheet. An arrangement in which a ring-shaped reinforcing member is arranged is described. Patent Document 1 also describes that the reinforcing member is made of ink so that it can be formed by printing.
Further, in Patent Document 2, an IC chip protective sheet in which a circular opening serving as a relief space for an IC chip is bonded to one surface of an inlet base material, and an antenna pattern is attached to the other surface of the inlet base material. And an IC tag label provided with an IC chip mounted on the antenna pattern. The IC tag label described in Patent Document 2 is obtained by laminating an IC chip protective sheet having an opening having a predetermined shape and size with respect to a continuous inlet in a strip shape so that the IC chip is positioned at the center of the opening, and thereafter It is manufactured by punching into a label shape.
In addition, Patent Document 3 describes an IC tag in which an antenna portion, a substrate provided with an IC chip, and a protective plate having a hole portion are stacked in a storage space inside the exterior body and stored in a non-adhesive manner. In this IC tag, the position of the hole is a position where the IC chip can be accommodated when the protective plate and the substrate are overlapped.

JP 2009-301099 A International Publication No. 2008/047630 JP 2009-211144 A

However, in the reinforcing member described in Patent Document 1, since the reinforcing member is formed by printing ink, the thickness dimension cannot be secured sufficiently, and thus it is insufficient for preventing damage to the IC chip.
The IC chip protection sheet described in Patent Document 2 does not take into consideration the size of the IC chip and the size of the opening, and may be insufficient for preventing damage to the IC chip. Furthermore, since the IC chip protective sheet described in Patent Document 2 is laminated to the inlet before the IC tag label is attached to the adherend, the IC chip label is already attached to the adherend. There is also a problem that it is difficult to apply.
In addition, in the protective plate described in Patent Document 3, the dimension of the hole of the protective plate is set to a diameter that can accommodate the IC chip, and the thickness of the IC chip is not taken into consideration. Is insufficient. In addition, since it is necessary to store in the exterior member in advance, there is also a problem that it is difficult to apply to an IC tag label already attached to an adherend.

  An object of the present invention is to provide an IC tag and an IC chip breakage prevention method that can further reduce breakage of an IC chip.

The IC tag of the present invention is
An IC tag comprising: a support body on which an antenna circuit is formed; an IC chip connected to the antenna circuit; and an adhesive layer laminated on a surface of the support body on the antenna circuit side,
A reinforcing material having an opening is provided on the outermost surface of the IC tag opposite to the surface on which the adhesive material is laminated, and the IC chip is disposed in the opening in a plan view of the IC tag. Pasted as
In a cross section perpendicular to the surface of the support, the distance between the inner edge of the opening of the reinforcing member and the outer edge of the IC chip is L [mm], and the thickness from the surface on the adhesive material side of the IC chip to the outermost surface When the thickness dimension is T1 [mm] and the thickness dimension of the reinforcing material is T2 [mm], the following expressions (1) and (2) are satisfied.

  In the IC tag of the present invention, it is preferable that the reinforcing material has a base material layer and an adhesive material layer, and the adhesive material layer is attached to the outermost surface of the IC tag.

  In the IC tag of the present invention, it is preferable that the opening of the reinforcing member has a circular shape, an elliptical shape, or a polygonal shape.

The IC chip breakage prevention method of the present invention includes:
Preventing damage to the IC chip of an IC tag comprising: a support body on which an antenna circuit is formed; an IC chip connected to the antenna circuit; and an adhesive material on the antenna circuit side surface of the support body. IC chip damage prevention method,
On the outermost surface of the IC tag opposite to the surface on which the adhesive material is laminated, a reinforcing material having an opening is disposed in the opening in a plan view of the IC tag. Pasted as
In a cross section perpendicular to the surface of the support, the distance between the inner edge of the opening of the reinforcing member and the outer edge of the IC chip is L [mm], and the thickness from the surface on the adhesive material side of the IC chip to the outermost surface When the thickness dimension is T1 [mm] and the thickness dimension of the reinforcing material is T2 [mm], the following expressions (3) and (4) are satisfied.

  According to the present invention, the reinforcing member having the opening is arranged on the side of the IC tag opposite to the surface on which the adhesive of the support is laminated so that the IC chip is disposed in the opening in a plan view of the IC tag. Affixed to the outermost surface. And since a reinforcing material relieves the external stress which tends to concentrate on the location where the IC chip was connected when the IC tag was attached to the adherend, damage to the IC chip can be reduced. Moreover, since the reinforcing material is attached to the outermost surface of the IC tag so as to satisfy the above formulas (1) and (2) in consideration of the size of the IC chip and the thickness of the support, etc., the IC chip is damaged. It can be reduced more. The surface of the IC tag on the opposite side to the surface on which the adhesive of the support is stacked is the surface of the IC tag on which the support is bonded if no other sheet is stacked on the support. It corresponds to the outermost surface of the support itself on the opposite side of the surface, and when other sheets are laminated on the opposite side of the surface on which the adhesive of the support is laminated, the outermost surface of the other sheets, etc. It corresponds to.

  Further, according to the IC chip breakage prevention method of the present invention, the reinforcing material can be stuck even after the IC tag is stuck on the adherend. Therefore, since a reinforcing material can be appropriately added according to the use of the IC tag, the user can easily prevent damage to the IC chip.

The top view which shows the IC tag which concerns on embodiment of this invention affixed on the to-be-adhered body. Sectional drawing of the IC tag and the to-be-adhered body seen in the II-II line direction of FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Configuration of IC tag)
As shown in FIGS. 1 and 2, the IC tag 1 of this embodiment is used by being attached to an adherend 2. The IC tag 1 is a passive IC tag and functions by electromagnetic waves emitted from an information acquisition device (not shown).
The IC tag 1 includes an IC inlet 10, a printing surface sheet 20, a double-sided pressure-sensitive adhesive sheet 30 as a protective layer, and a reinforcing material 40. A release sheet (not shown) is attached to the double-sided pressure-sensitive adhesive sheet 30 on the IC tag 1 before being attached to the adherend 2.
The IC inlet 10 includes a flat circuit substrate 11 as a support, an antenna circuit (not shown) described later formed on the circuit substrate 11, and an IC chip 12.
As the circuit substrate 11, synthetic resin films such as polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), polycarbonate (PC), polyurethane (PU), polyvinyl chloride (PVC), polyimide, and high-quality paper Paper materials such as coated paper, kraft paper, and glassine paper, and sheet materials such as non-woven fabric can be used. The thickness dimension of the circuit substrate 11 is not particularly limited and may be appropriately selected according to the use. For example, the thickness is preferably 5 μm or more and 2000 μm or less, and particularly preferably 10 μm or more and 500 μm or less.
An antenna circuit is formed on one surface of the circuit substrate 11, and an IC chip 12 is connected to the antenna circuit. While the antenna circuit is formed, the double-sided pressure-sensitive adhesive sheet 30 is laminated on the surface to which the IC chip 12 is connected (surface 111 on the antenna circuit side). In the present embodiment, the IC chip 12 has a rectangular shape in a plan view of the IC tag 1, but may have a square shape or the like.
Further, the printing surface sheet 20 is attached to the other surface 112 of the circuit substrate 11.

The reinforcing material 40 is for relaxing external stress applied to the IC chip 12 of the IC tag 1 attached to the adherend 2.
The reinforcing member 40 has a ring shape having an opening 41, and as shown in FIG. 2, the outermost surface of the IC tag 1 opposite to the antenna circuit side surface 111 of the circuit substrate 11 on which the double-sided adhesive sheet 30 is laminated. Is pasted. Here, the outermost surface corresponds to the surface 201 of the printing surface sheet 20 attached to the other surface 112 of the circuit substrate 11. As a result of sticking the reinforcing member 40 in this way, the IC chip 12 is positioned inside the opening 41 in a plan view of the IC tag 1 as shown in FIG.

And the dimension and thickness dimension of the opening part 41 of the reinforcing material 40 satisfy | fill the relationship demonstrated below.
First, in a cross section orthogonal to the surface of the circuit substrate 11, the distance between the opening inner edge 411 of the reinforcing member 40 and the outer edge of the IC chip 12 is L [mm], and the surface on which the double-sided adhesive sheet 30 of the IC chip 12 is laminated. When the thickness dimension from the top to the surface 201 of the printing surface sheet 20 is T1 [mm] and the thickness dimension of the reinforcing member 40 is T2 [mm], the following formulas (5) and (6) Meet. The surface of the IC chip 12 on which the double-sided pressure-sensitive adhesive sheet 30 is laminated corresponds to the lower surface 122 of the IC chip 12 in FIG. More specifically, an adhesive 32 of a double-sided pressure-sensitive adhesive sheet 30 to be described later is laminated on the lower surface 122 of the IC chip 12, and the lower surface 122 corresponds to the surface of the IC chip 12 on the adhesive 32 side.

The distance L needs to be 1.5 times or more the thickness dimension T1, and if it is less than 1.5 times, the separation distance between the IC chip 12 and the reinforcing member 40 is insufficient, and the IC chip 12 may be damaged. When the separation distance is insufficient, the reinforcing material 40 is attached to the inclined surface of the printing surface sheet 20 around the raised IC chip 12, and external stress received by the reinforcing material 40 is applied to the IC chip 12 through the inclined surface. This is probably because of The distance L is preferably 2 times or more of the thickness dimension T1, and more preferably 5 times or more.
The distance L is such that when the reinforcing member 40 is affixed to the outermost surface of the IC tag 1 (in this embodiment, the surface 201 of the surface sheet 20 for printing), the inner edge 411 of the opening is the circuit substrate 11 or the printing. It restrict | limits so that it may not protrude from the edge of the surface sheet 20 for an operation. That is, the IC chip 12 needs to be surrounded by the reinforcing material 40 on the circuit base material 11.
The distance L is measured or calculated from the arrangement relationship between the IC chip 12 and the reinforcing material 40.

The thickness dimension T2 of the reinforcing member 40 needs to be 0.35 times or more of the thickness dimension T1, and if it is less than 0.35 times, the IC chip 12 may be damaged because the reinforcing member 40 is thin. This is presumably because the external stress was applied to the raised IC chip 12 portion of the printing surface sheet 20 because the thickness was insufficient to receive the external stress. The thickness dimension T2 of the reinforcing member 40 is preferably 0.4 times or more of the thickness dimension T1, and more preferably 0.45 times or more.
The larger the thickness dimension T2 of the reinforcing member 40 is, the greater the contribution to prevention of breakage of the IC chip 12 is. However, when the thickness dimension T2 is too large, the thickness dimension of the IC tag 1 is also increased. Therefore, the upper limit of the thickness dimension T2 is appropriately set according to the use of the IC tag 1 or the like.

Normally, when the IC tag 1 is attached to the adherend 2, the location where the IC chip 12 is connected is raised as compared with other locations as shown in FIG. It becomes easy to concentrate and add to the place where the IC chip 12 is connected.
However, since the reinforcing material 40 satisfies the relationship of the above formulas (5) and (6) in which the dimensions of the IC chip 12, the circuit base material 11, the printing surface sheet 20, and the like are considered, the reinforcing material 40 is The external stress applied to the IC chip 12 is appropriately received. Therefore, it becomes difficult for external stress to be concentrated and applied to the place where the IC chip 12 is connected, and the breakage of the IC chip 12 is further reduced.
Further, the shapes of the reinforcing member 40 and the opening 41 are not limited as long as the relations of the above formulas (5) and (6) are satisfied, and are not limited to those of the present embodiment. The outer shape of the reinforcing member 40 is circular, elliptical, polygonal, etc. in plan view, and the opening 41 is circular, elliptical, polygonal, and the outer shape of the reinforcing member 40 and both shapes of the opening 41 are appropriately combined. be able to.

  The width of the reinforcing member 40 is preferably 0.5 mm or more, and more preferably 1.0 mm or more. Moreover, the upper limit of the width dimension of the reinforcing material 40 is appropriately set so as not to disturb the display of characters, designs, and the like printed on the printing surface sheet 20.

The reinforcing material 40 includes a base material 42 and an adhesive layer 43.
As the base material 42, synthetic resin films such as polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), polycarbonate (PC), polyurethane (PU), polyvinyl chloride (PVC), polyimide, high-quality paper, Paper materials such as coated paper, craft paper, and glassine paper, and sheet materials such as non-woven fabric can be used. The thickness dimension of the base material 42 is not particularly limited and may be appropriately selected according to the application. For example, the thickness is preferably 5 μm or more and 2000 μm or less, and particularly preferably 10 μm or more and 500 μm or less.
The adhesive layer 43 can be formed using, for example, an acrylic, silicone, rubber, polyester, polyurethane, or other adhesive. Among these, acrylic pressure-sensitive adhesives are preferable because they are excellent in terms of adhesive strength. Although the thickness dimension of the adhesive layer 43 is not specifically limited, For example, 1 micrometer or more and 300 micrometers or less are preferable, and 5 micrometers or more and 150 micrometers or less are especially preferable.

The printing surface sheet 20 is printed with visible information such as product information, and protects the IC inlet 10. Examples of visible information on the printing surface sheet 20 include product information (product number, product name, etc.), price, barcode, pattern, mark, and the like.
The printing surface sheet 20 is bonded to the surface of the circuit base 11 opposite to the surface on which the antenna circuit and the IC chip 12 are formed.
Moreover, it is preferable that the printing surface sheet 20 has printability on the surface, and the material can be widely applied. For example, the synthetic resin film, paper material, nonwoven fabric, etc. exemplified in the circuit substrate 11 are used. Can be used. Moreover, what formed the to-be-printed layer for performing various printings, such as thermal recording, pressure-sensitive recording, thermal transfer recording, laser beam recording, and inkjet recording, can be used as needed.
Further, the printing surface sheet 20 may be transparent or opaque.
A pressure-sensitive adhesive layer 21 may be formed on the printing surface sheet 20. In this embodiment, the surface sheet 20 is attached to the circuit substrate 11 via the pressure-sensitive adhesive layer 21.
The pressure-sensitive adhesive layer 21 can be formed using, for example, an acrylic, silicone-based, rubber-based, polyester-based, or polyurethane-based pressure-sensitive adhesive. Among these, acrylic pressure-sensitive adhesives are preferable because they are excellent in terms of adhesive strength. Although the thickness dimension of the adhesive layer 21 is not specifically limited, For example, 1 micrometer or more and 300 micrometers or less are preferable, and 5 micrometers or more and 150 micrometers or less are especially preferable.

The double-sided pressure-sensitive adhesive sheet 30 is laminated on the surface of the circuit substrate 11 on which the antenna circuit and the IC chip 12 are formed, and functions as a protective member and an adhesive for attaching to the adherend 2.
The double-sided pressure-sensitive adhesive sheet 30 is obtained by applying a pressure-sensitive adhesive to the front and back surfaces of a sheet-like base material 31 to form an adhesive 32 and a patch 33.
As the base material 31, for example, the above-described synthetic resin film, paper material, nonwoven fabric, or the like exemplified for the circuit base material 11 can be used.
Although the thickness dimension of the base material 31 varies depending on the material, it is a thickness dimension that can protect the IC chip 12 and can follow the shape of the product when it is attached to a curved surface portion of the product. It is preferable to have flexibility. Therefore, the thickness dimension of the base material 31 is preferably, for example, 3 μm or more and 500 μm or less, and particularly preferably 5 μm or more and 300 μm or less.

  The adhesive material 32 is provided on the surface of the substrate 31 on the antenna circuit or IC chip 12 side, and seals following the unevenness formed by the antenna circuit and the IC chip 12 connected to the antenna circuit. The adhesive material 32 is not particularly limited and can be widely applied as long as it has a sufficient adhesive force that can bond the IC chip 12 and the antenna circuit to the base material 31. The adhesive 32 can be formed using, for example, an acrylic, silicone, rubber, polyester, polyurethane, or other adhesive. Among these, acrylic pressure-sensitive adhesives are preferable because they are excellent in terms of adhesive strength.

The adhesive material 33 is provided on the surface of the base material 31 opposite to the antenna circuit or the IC chip 12, and attaches the IC tag 1 and the adherend 2 to each other. Further, the material 33 can be widely applied as long as the IC tag 1 can be adhered to the adherend 2, and the same adhesive as the adhesive 32 can be used.
Although the thickness dimension of the adhesive material 32 and the adhesive material 33 is not specifically limited, For example, 1 micrometer or more and 300 micrometers or less are preferable, and 5 micrometers or more and 150 micrometers or less are especially preferable.
Further, instead of the double-sided PSA sheet 30 having a three-layer structure with the base material 31 as a core, a single-layer adhesive layer without a core may be used. The single adhesive layer may be the same as the adhesive 32.
The printing surface sheet 20 may be laminated on the IC chip 12 and used as a protective layer, and the double-sided pressure-sensitive adhesive sheet 30 may be laminated on the surface of the circuit substrate 11 on which the IC chip 12 is not mounted. good.

  The release sheet is laminated on the adhesive material 33 on the side opposite to the surface laminated on the antenna circuit. In a state before being attached to the adherend 2, the release sheet bears the function of protecting the IC inlet 10 together with the adhesive material 33, and if necessary, a release agent layer is provided on the surface in contact with the adhesive material 33. Is preferred. As the release sheet, for example, paper such as polyethylene laminated paper, coated paper, and glassine paper, or a synthetic resin film such as polyethylene, polypropylene, and polyethylene terephthalate can be used. Moreover, as a release agent used for the release agent layer of the release sheet, for example, a silicone resin, a fluorine resin, a long-chain alkyl resin, or the like can be used.

  The adherend 2 is an object to which the IC tag 1 is attached, and examples thereof include various media such as paper, cards, and boxes that require information management. Among them, when the adherend 2 is hard, the portion to which the IC chip 12 of the IC tag 1 is connected is particularly prone to be raised, which contributes to preventing damage to the IC chip 12 by attaching the reinforcing material 40. Great effect. Examples of the hard adherend 2 include cards and boxes formed of a hard resin such as polycarbonate or polypropylene, or a metal material.

(IC chip damage prevention method)
As a method for preventing breakage of the IC chip 12, for example, the IC tag 1 in which the reinforcing material 40 is bonded in advance to the surface 201 of the printing surface sheet 20 so as to satisfy the above formulas (5) and (6) is attached. 2 can be used. Further, for example, when the IC tag 1 before the reinforcing member 40 is attached to the adherend 2, the above formulas (5) and (5) are applied to the surface 201 of the printing surface sheet 20 later. It is also possible to use the reinforcing material 40 attached so as to satisfy 6).

(Effect of this embodiment)
According to the IC tag 1 according to the present embodiment, the surface of the top sheet 20 for printing is such that the reinforcing member 40 having the opening 41 is disposed in the opening 41 in the plan view of the IC tag 1. 201 is attached.
And since the reinforcing material 40 relieves the external stress which tends to concentrate on the location where the IC chip 12 is connected when the IC tag 1 is attached to the adherend 2, the damage of the IC chip 12 can be reduced. In addition, the reinforcing member 40 is attached to the surface 201 of the printing surface sheet 20 so as to satisfy the above formulas (5) and (6) in consideration of the size of the IC chip 12 and the thickness dimension of the circuit substrate 11 and the like. Therefore, damage to the IC chip 12 can be further reduced.

  In addition, according to the IC chip breakage prevention method according to the present embodiment, the reinforcing member 40 can be attached even after the IC tag 1 is attached to the adherend 2. Therefore, since the reinforcing member 40 can be added as appropriate according to the application of the IC tag 1, the user can easily reduce the breakage of the IC chip 12.

In addition, this invention is not limited to embodiment mentioned above, The deformation | transformation as shown below is also included.
In the above embodiment, the IC tag is exemplified as an IC tag that can be used for a non-contact type RFID, but it can also be applied as an RFID module. Further, it can be similarly applied to a non-contact IC card or an IC card module.
In this embodiment, the passive type is used for the IC tag, but it may be an active type.

  Further, the printing surface sheet 20 may not be attached to the circuit substrate 11. In this case, the thickness dimension T1 [mm] in the formula (5) is a thickness dimension from the lower surface 122 of the IC chip 12 to the other surface 112 of the circuit substrate 11 in FIG.

  Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

<Example 1>
(Manufacturing process of antenna circuit)
As the circuit substrate, Nikaflex (manufactured by Nikkan Kogyo Co., Ltd. (copper / PET = 35 μm / 50 μm)) which is a copper foil / PET (polyethylene terephthalate) bonded product was used. An etching resist pattern was printed on the circuit substrate by a screen printing method. Thereafter, unnecessary copper foil was removed by etching to form a circuit.
Thereafter, in order to connect the innermost part and the outermost part of the circuit, an insulating resist ink (manufactured by Nippon Atchison Co., Ltd., product name: ML25089) and a silver paste material (manufactured by Toyobo Co., Ltd., product name: DW250L-1) Was used to form a jumper. The jumper was formed by screen printing. Thereby, an antenna circuit was produced.

(IC inlet creation process (IC chip mounting))
The IC inlet was manufactured by mounting an RFID-IC chip (manufactured by NXP Corporation, product name: IcodeSLI) on the manufactured antenna circuit by a flip chip method. As for the size of the IC chip, the long side length was 900 μm, the short side length was 780 μm, and the thickness dimension was 150 μm.
For mounting, a flip chip mounting machine (manufactured by Kyushu Matsushita Corp., product name: FB30T-M) was used. As the bonding material, an anisotropic conductive paste (ACP, manufactured by Kyocera Chemical Co., Ltd., product name: TAP0602F) was used in an amount of ACP applied of 0.28 mg. Mounting was performed with the heating temperature to the ACP being 220 ° C. for the IC chip, the load to the IC chip being 2N (200 gf), and the pressure heating time being 7 seconds.

(IC tag processing process)
A double-sided pressure-sensitive adhesive sheet (manufactured by Lintec Corporation, product name: PET25W PA-T1 8KX 8EC *) was attached to the IC chip mounting surface of the IC inlet.

(Production of reinforcing material and pasting process)
A reinforcing material obtained by applying an acrylic adhesive (product of Lintec, product name: PA-T1, thickness: 20 μm) as an adhesive material layer to PET (thickness: 75 μm) as a base material layer, an outer diameter of 9 mm, It was formed in a ring shape with an inner diameter of 4 mm and a width of 2.5 mm. That is, the opening was circular with a diameter of 4 mm.
The formed reinforcing material was affixed to the circuit substrate so that the IC chip was positioned inside the opening. More specifically, the circuit substrate was attached in a plan view so that the center of the IC chip was positioned at the center of the opening of the reinforcing material.
Thus, an IC tag according to Example 1 was produced.

<Example 2>
In Example 1, the IC tag according to Example 2 was changed in the same manner as in Example 1 except that the thickness of PET as the base material layer of the reinforcing material was changed to 100 μm and the inner diameter of the opening was changed to 2 mm. Produced.

<Example 3>
In Example 1, an IC tag according to Example 3 was produced in the same manner as in Example 1 except that the thickness of the PET as the base material layer of the reinforcing material was changed to 100 μm.

<Example 4>
In Example 1, after the IC tag processing step, a surface sheet for printing was attached as a display layer on the surface where the IC chip of the inlet was not mounted. Here, the product name: FR4415-50 (manufactured by Lintec Corporation, thickness: 70 μm) was used for the top sheet for printing.
Furthermore, in Example 1, the thickness of PET as the base material layer of the reinforcing material was changed to 100 μm.
Other than this, an IC tag according to Example 4 was produced in the same manner as in Example 1.

<Example 5>
In Example 4, an IC tag according to Example 5 was produced in the same manner as in Example 4 except that the inner diameter of the opening of the reinforcing material was 8 mm.

<Example 6>
In Example 4, an IC tag according to Example 6 was produced in the same manner as in Example 4 except that the reinforcing material was formed in a ring shape having an outer diameter of 27 mm and an inner diameter of 20 mm.

<Example 7>
In Example 4, an IC tag according to Example 7 was produced in the same manner as in Example 4 except that the shape of the opening of the reinforcing material was formed in a square shape having a vertical dimension of 2 mm and a horizontal dimension of 2 mm. The square opening was provided at the center of a circle having a diameter of 9 mm.

<Comparative Example 1>
In Example 1, an IC tag according to Comparative Example 1 was produced in the same manner as in Example 1 except that the reinforcing material was not attached.

<Comparative example 2>
In Example 4, an IC tag according to Comparative Example 2 was produced in the same manner as in Example 4 except that the thickness of PET as the base material layer of the reinforcing material was changed to 75 μm.

<Comparative Example 3>
In Example 4, an IC tag according to Comparative Example 3 was produced in the same manner as Example 4 except that the inner diameter of the opening of the reinforcing material was changed to 2 mm.

<Comparative example 4>
In Example 4, an IC tag according to Comparative Example 4 was produced in the same manner as in Example 4 except that the reinforcing material was not attached.

  Table 1 shows IC tags according to the examples and comparative examples. In Table 1, T1 and T2 are synonymous with those described in the above formulas (5) and (6). Further, in this embodiment, since the rectangular IC chip is arranged in the circular or quadrangular opening of the reinforcing material, the linear distance from the corner of the IC chip to the closest position of the inner edge of the reinforcing material opening is The shortest distance L from the outer edge of the IC chip to the inner edge of the opening of the reinforcing material. Since this shortest distance (hereinafter referred to as Ls) only needs to satisfy the relationship of Expression (5), Table 1 shows this distance Ls.

[Evaluation test of IC chip damage prevention effect]
The double-sided PSA sheet side of the IC tags according to Examples 1 to 7 and Comparative Examples 1 to 4 was attached to an acrylic plate (thickness: 2 mm) to prepare a test body. Twenty test specimens were produced for each example and the IC tag according to the comparative example.
The five test specimens to which the IC tags according to the same embodiment are attached are overlapped so that the positions of the IC tags overlap each other, and an acrylic with no IC tag attached on the uppermost specimen. The boards were stacked. Then, a load of 10 kgf was applied to the acrylic plate to which the IC tag was not attached (load test). This load test was performed four times for each of the test bodies according to Examples 1 to 7 and Comparative Examples 1 to 4.
The IC tag after the load test was checked for operation with Handy RW (manufactured by Welcat Co., Ltd., product name: XIT-150-BR).
The test results are shown in Table 2.
Table 2 also shows the calculated value (1.50 × T1) of the right side of the formula (5), the distance Ls, the calculated value of the right side of the formula (6) (0.35 × T1), and the thickness of the reinforcing material. The dimension T2 is shown.

  First, compared with the case where the printing surface sheet is not attached, by providing the reinforcing material as in Examples 1 to 3, the IC chip breakage rate is provided with the reinforcing material as in Comparative Example 1. Compared to the case without it, it was significantly lower. Among Examples 1 to 3, Example 2 in which the reinforcing material thickness T2 is larger than the calculated value of Expression (6) and Example 3 in which the distance L is larger than the calculated value of Expression (5) IC chip breakage rate is low. That is, the breakage rate is reduced by increasing the thickness of the reinforcing material while ensuring a predetermined distance L between the IC chip and the reinforcing material.

Next, when compared with the case where the printing surface sheet is pasted, the distance L satisfies the formula (5) as in Examples 4 to 7, the formula (6) is satisfied, and the reinforcing material is provided. The IC chip breakage rate was greatly reduced. That is, even when the printing surface sheet is attached, the damage rate is reduced by securing the distance L between the IC chip and the reinforcing material to a predetermined value or more and increasing the thickness of the reinforcing material. Further, the breakage rate is reduced not only in the shape of the opening as in the fourth to sixth embodiments but also in the quadrangle as in the seventh embodiment.
On the other hand, as in Comparative Example 2, if the relationship of Equation (6) was not satisfied, even if the distance L satisfied Equation (5), the breakage rate was extremely high. This is thought to be because external stress cannot be appropriately received because the thickness of the reinforcing material is thin, and external stress concentrates on the connected portion of the IC chip.
Further, as in Comparative Example 3, when the distance L was smaller than the calculated value of Equation (5), the breakage rate was particularly high even if the relationship of Equation (6) was satisfied. This is presumably because the IC chip and the reinforcing material were not separated by a predetermined distance or more so as to satisfy the formula (5), and the external stress received by the reinforcing material was also applied to the IC chip.

1 IC tag 11 Circuit substrate (support)
12 IC chip 32 Adhesive 40 Reinforcing material 41 Opening 121 Outer edge 201 Surface (outermost surface)
411 Opening inner edge L distance

Claims (4)

An IC tag comprising: a support body on which an antenna circuit is formed; an IC chip connected to the antenna circuit; and an adhesive layer laminated on a surface of the support body on the antenna circuit side,
A reinforcing material having an opening is provided on the outermost surface of the IC tag opposite to the surface on which the adhesive material is laminated, and the IC chip is disposed in the opening in a plan view of the IC tag. Pasted as
In a cross section perpendicular to the surface of the support, the distance between the inner edge of the opening of the reinforcing member and the outer edge of the IC chip is L [mm], and the thickness from the surface on the adhesive material side of the IC chip to the outermost surface An IC tag characterized by satisfying the following formulas (1) and (2) when the thickness dimension is T1 [mm] and the thickness dimension of the reinforcing material is T2 [mm].

The IC tag according to claim 1,
The said reinforcing material has a base material layer and an adhesive material layer, and the said adhesive material layer is affixed on the outermost surface of the said IC tag. IC tag characterized by the above-mentioned. In the IC tag according to claim 1 or 2,
The IC tag, wherein the opening of the reinforcing material has any one of a circular shape, an elliptical shape, and a polygonal shape. Preventing damage to the IC chip of an IC tag comprising: a support body on which an antenna circuit is formed; an IC chip connected to the antenna circuit; and an adhesive material on the antenna circuit side surface of the support body. IC chip damage prevention method,
On the outermost surface of the IC tag opposite to the surface on which the adhesive material is laminated, a reinforcing material having an opening is disposed in the opening in a plan view of the IC tag. Pasted as
In a cross section perpendicular to the surface of the support, the distance between the inner edge of the opening of the reinforcing member and the outer edge of the IC chip is L [mm], and the thickness from the surface on the adhesive material side of the IC chip to the outermost surface An IC chip breakage prevention method characterized by satisfying the following formulas (3) and (4) when the thickness dimension is T1 [mm] and the thickness dimension of the reinforcing material is T2 [mm].

Images