JPH11221986A - Manufacture of ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a non-contact type IC card having excellent smoothness of a front surface and excellent reliability of securely disposed components in a simple step. SOLUTION: The method for manufacturing an IC card in which a component including an IC chip is placed at a predetermined position between two opposed boards and a resin is filled comprises the steps of adhering a resin selected from a thermosetting resin, hot-melt resin and ultraviolet curable resin on both sides simultaneously or respective sides subsequently of a sheet placing the component including the IC chip, and then laminating the boards. And, the boards are laminated by heating or pressurizing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a non-contact type IC card suitable for use as an identification card such as a driver's license, an employee card, a membership card, an alien registration card, a student ID card, and the like.

[0002]

2. Description of the Related Art A non-contact type IC card has no components on its surface, so it is advantageous for forming an authentication identification image such as a face image on the surface, performing printing, and preventing alteration and alteration. It is suitable for use as a card (hereinafter, also referred to as an ID card). When used as an ID card, one surface usually carries a card title, a face image, bibliographic items, and the like, and the other surface is often a writable surface for additional writing or the like.

[0003] By the way, as a method of manufacturing a non-contact type IC card, a heat bonding method, an adhesive bonding method and an injection molding method are known. Among them, the adhesive bonding method has a low processing temperature and is used. Because there are few restrictions on the card base material, there is an advantage in the selection of a receiving layer, a writable layer, etc. in the thermal transfer and sublimation image forming method for forming an authentication identification image and bibliographic information,
Also, since it is a continuous production method, it is advantageous for mass production.

Further, the present applicant has proposed a manufacturing method in which a resin layer is formed on a substrate sheet in advance and components are sealed in the resin layer (Japanese Patent Application No. 9-275702).

[0005]

However, in the adhesive bonding method, a part including an IC chip is placed in a predetermined position in advance and then the resin is filled. In addition, there is a problem that the stability is lacking when the smoothness of the surface is impaired due to the flow or cooling of the resin and unevenness is generated. In recent years, a face image for authentication and identification is often formed by a sublimation thermal transfer method with high gradation and excellent resolution.However, image formation by the sublimation thermal transfer method particularly requires smoothness of an image forming surface, The sublimation heat transfer method cannot be used for forming a face image on a card having such surface irregularities. Although this is improved by the resin layer encapsulation method, it does not completely eliminate the unevenness but has a similar problem. Furthermore, if the surface is flattened by hot pressing after bonding, parts (such as an antenna) including an IC chip may move.

[0006] In addition, in these manufacturing methods, the components are placed at predetermined positions on the sheet at a single point or in plural combinations, and the shape of the loop of the antenna or the like is not disturbed because the oscillation frequency is maintained at a predetermined value. Must be placed on the
The process is complicated because a robot is used or a plurality of parts are set in the frame and the frame is removed after placing. Furthermore,
In a method of manufacturing an IC card by inserting an IC chip, an antenna, and the like between two sheets and bonding them, irregularities are generated on the outer surface of the sheet holding the IC chip and the like.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a non-contact type IC card which is excellent in surface smoothness, in which components are securely arranged, and which is excellent in reliability. It is to manufacture with.

[0008]

An object of the present invention is to provide an IC card in which a component including an IC chip is mounted at a predetermined position between two opposing substrates and is filled with resin. A step of attaching a resin selected from thermosetting, hot-melt, or ultraviolet-curing resins to both sides of a sheet on which a component including an IC chip is placed, simultaneously or one by one, and then laminating the substrate. This is achieved by performing a method of manufacturing an IC card and bonding the substrates by a heat or pressure treatment.

In other words, the present inventor places components including an IC chip on a sheet in advance and regulates the position of each component.
The present invention was conceived to reduce the amount of resin on the part side to avoid the problem caused by the resin flow.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to embodiments, but embodiments of the present invention are not limited thereto.

FIG. 1 shows an example of a card manufactured by a manufacturing method of the present invention using a resin sheet in which components including an IC chip are integrated, and 1 is a sublimation heat transfer image received on an outer surface. The first substrate 2 having an image receiving layer to be formed is a second substrate having a writable layer on the outer surface. The image receiving layer is made of a material that traps and fixes the dye when the ink composed of the sublimable dye is heated and diffused by the thermal head. For example, vinyl chloride, polyacetal, polybutyral, etc. are known as good image receiving layers. Have been. In general, these materials for the image receiving layer are powdered, dissolved in a solvent such as isocyanate, applied with a gravure coater or the like, and dried, and the solvent is formed by volatilization. The support of the first substrate on which the image receiving layer is formed is mixed with a white pigment or folded into a honeycomb structure to enhance the formed image, such as polyethylene terephthalate (PET) or polypropylene. (PP), polyester, polyethylene, polystyrene, nylon and the like.

To form a multi-tone image for authentication and identification on the image receiving layer, the pulse width of the thermal head is changed by changing the pulse width applied to the thermal head so that each dot has a tone by the thermal head. The amount of thermal diffusion is controlled. At this time, if the substrate support has a honeycomb structure containing air bubbles, the contact with the thermal head becomes uniform, and since the heat insulating property is good, the cutting of each dot is also good, and a good image is obtained. Can be obtained.

The writable layer is, for example, a dispersion of fine particles of calcium carbonate and silica in a polyester emulsion. Similar to the image receiving layer, the fine particles are dispersed in a resin solution dissolved in a solvent, and the dispersion is applied by a gravure coater or the like. Then, a solvent is vaporized through a drying section to form the solvent.

The support for the second substrate may be of any function from the original required function. However, when heating and pressing, the symmetrical material configuration on both sides provides less warpage and a flat surface. Preferably, it is the same as the support of the first substrate.

The IC chip 3 is mounted on the resin sheet 6 in advance together with the coiled antenna 4 joined by the joining portion 5, and after attaching the resin 7, the substrate is pasted to constitute an IC card. As the resin sheet 6, PET, P
P, polyester, polyethylene, nylon and the like can be adopted.

The resin 7 may be selected from a thermosetting type, a hot melt type, and an ultraviolet curable type. Examples of the thermosetting resin include epoxy, phenol, urethane, and unsaturated polyester resins, and examples of the hot melt resin include ethylene-vinyl acetate copolymer (EVA), polyester, polyamide, and thermosetting resins. Plastic elastomer,
Epoxy-based and acrylic-based resins can be used as the UV-curable resin, such as a polyolefin-based resin and a room-temperature type or a special type of reaction type in which curing is accelerated by moisture.

Although FIG. 1 shows an IC module component having an antenna coil, a component having an antenna pattern formed on a flexible printed film substrate may be used. As the printed circuit board, a thermoplastic film such as polyester is used, and when heat resistance is required, polyimide is advantageous. In this case, the bonding between the IC chip and the antenna pattern is performed using a conductive adhesive such as a silver paste, a copper paste, or a carbon paste (EN-
4000 series, Toshiba Chemical XAP series, etc.)
Or using an anisotropic conductive film (such as Anisorm manufactured by Hitachi Chemical Co., Ltd.).

The bonding of the substrates may be performed by a hot press method, a vacuum press method, a combination use of a pressure roller and a press, or a combination of ultraviolet irradiation and a pressure press when using an ultraviolet curable resin.

FIG. 2 shows a schematic diagram of a process according to an example of the manufacturing method of the present invention. In addition, since it is a figure which shows typically, the magnitude | size and thickness of a component, the thickness of material, etc. are exaggeratedly drawn.

In FIG. 1, a resin sheet 6 on which an IC chip 3 and a coiled antenna 4 joined to the chip by a joining portion 5 are mounted in advance is conveyed in the direction of the arrow. The resin 71 is applied. Next, a first substrate 1 having an image receiving layer for receiving a sublimation thermal transfer image on the outer surface is superimposed, and a hot pressing step 1 is performed.
Laminated at 0. Note that it is more preferable to press several cards at a time than to press the sheets one by one from the viewpoint of efficiency.

Further, a resin 72 is applied as an adhesive to the back surface by an offset coater 9, and a second substrate 2 having a writable layer on the outer surface is overlaid and bonded in a hot press step 11. The resins 71 and 72 may both be applied before the hot pressing step 10 and hot pressed simultaneously after the substrates 1 and 2 are overlaid. In addition, 12 is a perforation or a slit which helps to cut smoothly when cutting into a single-sheet card later.

When an epoxy-based adhesive resin is used as the resins 71 and 72, a two-liquid type is mainly used as such a resin. It is better to be done. In this case, a stirring means is provided so that the mixture is uniformly mixed at the time of spreading on the card.
In the case of a hot-melt resin, particularly a reactive hot-melt resin, since it is easily affected by moisture, it is preferable to provide a means for shutting off moisture so as not to enter a hopper or the like holding the resin from a nozzle or the like when the process is stopped. .

As described above, since the IC chip and the antenna are held on the center sheet in advance or immediately before bonding, the IC chip and the antenna are sandwiched between the upper and lower substrates via the adhesive resin. The distortion of the central sheet due to the difference in physical properties (thermal conductivity, specific gravity, specific heat, hardness, elasticity, etc.) of the antenna and the like does not affect the substrate surface because the adhesive acts as a cushion.

Other preferred embodiments that can be adopted are listed below.

1) 10 to 100 μm as a cushion layer for absorbing stress on at least one substrate inside the card.
2) Attach a metal foil sheet to the center sheet to increase thermal conductivity and uniform heat diffusion, or insert the metal foil sheet somewhere inside the card. 3) Insert an IC chip or An antenna or the like is incorporated into a porous resin sheet such as a nonwoven fabric to form a central sheet (see JP-A-9-275184 and JP-A-9-286189). 4) Using a pre-cut central sheet, timing is controlled. 5) Place the central sheet on one substrate coated with adhesive resin, cover the surface with adhesive resin, and place and press the other substrate. 6) When using ultraviolet curable resin When hot-melt type resin is used, it is cured by exposing it to high humidity air for about 1 second to 10 minutes. 7) The resin is applied to the center sheet using a spray type applicator.

[0026]

According to the present invention, a resin selected from a thermosetting resin, a hot-melt resin, or an ultraviolet-curing resin is adhered to both sides of a sheet on which components including IC chips are placed, simultaneously or one by one. After the bonding, the positions of the components are regulated, and the inconvenience associated with the flow and cooling of the resin does not occur.

[Brief description of the drawings]

FIG. 1 is a view showing one example of a card manufactured by a manufacturing method of the present invention.

FIG. 2 is a schematic view of a process according to an example of the manufacturing method of the present invention.

[Explanation of symbols]

 1, 2 substrate 3 IC chip 4 coiled antenna 5 joint 6 resin sheet 7 resin 8, 9 offset coater 10, 11 hot press process 12 perforation or slit

Claims (2)

[Claims] 1. An I-beam is provided at a predetermined position between two opposing substrates.
In manufacturing an IC card in which a component including a C chip is mounted and filled with resin, on the both sides of a sheet on which the component including the IC chip is mounted, simultaneously or one by one,
A method for manufacturing an IC card, comprising a step of attaching a resin selected from a thermosetting resin, a hot-melt resin, or an ultraviolet-curing resin, and then bonding the substrate. 2. The method for manufacturing an IC card according to claim 1, wherein the bonding of the substrates is performed by heating or pressing.