JPH10109483A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve cutting processability and to eliminate thermal damage at the time of hot melt-adhering by embedding and fixing a chip in a recess formed on a laminate having a predetermined thickness and fixed at a right angle in fiber orienting directions of specific layers that the layers of vulcanized fiber having specific thickness are brought into contact with one another. SOLUTION: A base plate 1 constituted by vulcanized fiber is obtained by laminating and fixing three or more layers of the fiber having a thickness of 0.1 to 1mm via adhesive so that fiber orienting directions of the layers brought into contact with each other are formed at right angle with each other. As the adhesive, thermosetting resin of phenyl, melamine, urea, urea and melamine, or epoxy is used and adhered by a hot press. A thickness of the plate 1 formed of the fiber is 0.5 to 2mm. Then, a recess for embedding a chip is formed on the obtained plate 1, and the chip 2 is fixed to the recess with hot- melt adhesive.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card, and more particularly, to an IC card which can be incinerated, hardly generates cracks and curls, and has excellent surface smoothness, chip peeling strength, printability and design.

[0002]

2. Description of the Related Art Conventionally, IC cards have been used in which a plastic material such as PVC, polycarbonate or ABS is used as a substrate and a chip is embedded in the substrate.

[0003]

However, an IC card using a plastic material as a substrate has the following disadvantages. (1) In a manufacturing process, when a chip is fixed to a substrate by hot melt bonding or the like, the substrate is easily damaged by heat. . (2) The substrate is easily chipped or cracked during use, and using an IC card with chipping or cracking is liable to damage the hand and is dangerous. (3) The used IC card cannot be incinerated. In other words, due to the problem of exhaust gas during incineration and damage to the incinerator caused by the plastic material that is the substrate,
In fact, it cannot be incinerated. There were difficulties such as.

The inventors of the present invention have conducted intensive studies to solve such difficulties, and found that a laminated plate having a predetermined thickness formed by laminating and fixing vulcanized fibers having a specific thickness in a predetermined configuration is used as a substrate. By forming a concave portion on the surface of the substrate and embedding and fixing the chip in the concave portion, excellent cutting workability when forming the concave portion, and thermal damage of the substrate when fixing the chip to the substrate by hot melt bonding or the like. The printed IC card has excellent printability, and the obtained IC card has good split resistance, curl resistance, surface smoothness, chip peel resistance, etc. It has been found that the IC card can be made very good, and that the above-mentioned problems of the conventional IC card can be eliminated at a stretch, and the present invention has been completed.

[0005]

In the IC card according to the present invention, three or more layers of vulcanized fibers having a thickness of 0.1 to 1 mm are fixed to each other so that the fiber orientation directions of the adjacent layers are perpendicular to each other. A substrate having a thickness of 0.5 to 2 mm as a substrate, and burying a chip in a recess formed on the surface of the substrate.
It is stuck.

The vulcanized fiber used as the substrate of the IC card according to the present invention is JIS C-23.
15 or any equivalent thereto, and the type is not particularly limited. Vulcanized fiber is made by immersing, laminating, washing and drying a base paper made of wood or cotton fiber in a zinc chloride solution and finishing it into a plate shape.It has the highest mechanical strength as a natural fiber material. Processing such as punching and bending is possible, and impact resistance,
It has excellent wear resistance, oil resistance, electrical insulation, etc.

[0007] The substrate constituted by the vulcanized fiber according to the present invention has a predetermined thickness.
The laminate must be a laminate in which three or more layers of fibers are adhered so that the fiber orientation directions of adjacent layers are perpendicular to each other. In the case of a single plate or a two-layer laminate, or even in the case of a laminate of three or more layers, if the fiber orientation directions of the mutually adjoining layers are not perpendicular to each other, the substrate is easily curled,
In addition to causing troubles in the processing steps such as chip bonding and printing, when used as an IC card,
Troubles such as card reading failures are likely to occur.
In order to prevent curling of the substrate, the number of laminations is set to an odd number, and the configuration of the front and back sides with respect to the center in the thickness direction of the cross section of the laminated plate (type and thickness of vulcanized fiber used, type and amount of adhesive used, etc.) Is more preferably symmetric.

[0008] Incidentally, vulcanized fibers are conventionally laminated and fixed via an adhesive. However, such a method increases the man-hours and significantly increases the cost. It is applied only when manufacturing thick vulcanized fiber with a thickness of about 3 mm or more, which is difficult to manufacture veneer,
It does not apply to the production of relatively thin vulcanized fibers with a thickness of less than 3 mm, particularly less than 2 mm, from which veneers can be produced in a continuous machine. Conventionally, when laminating and fixing vulcanized fibers via an adhesive, the fiber orientation directions of each veneer are made parallel to each other, and the fiber orientation directions of the mutually adjoining layers are perpendicular to each other. Lamination and fixation are not performed at all because the process becomes complicated and the yield decreases. Under such circumstances, 0.5 to 2 mm
In the present invention, a method of laminating and fixing a thin vulcanized fiber through an adhesive in an area that does not need to be laminated and fixed through an adhesive with the common sense of a person skilled in the art until now is applied. Further, when the fiber orientation directions of the mutually adjoining layers are set to be perpendicular to each other, it is disadvantageous in terms of production efficiency, but it has been found that various useful properties can be obtained as a substrate for an IC card.

The thickness of the substrate made of the vulcanized fiber according to the present invention is 0.5 to 2 mm, preferably 0.5 to 1.5 mm. If it is less than 0.5 mm, the mechanical strength is insufficient, and it cannot be sufficiently used for practical use. If it exceeds 2 mm, the IC card becomes too thick and cannot be applied to a normal IC card reader, which is not suitable.
The thickness of one layer of vulcanized fiber used for lamination is 0.1 to 1 mm, preferably 0.15 to 0.4 mm
Must. If the thickness is less than 0.1 mm, the number of layers required to form a substrate having a predetermined thickness increases, and the workability at the time of lamination increases, and the amount of adhesive used at the time of lamination increases,
Since the adhesive content in the substrate is high and the substrate has plastic properties, the obtained IC card is liable to be broken and is not suitable for incineration. If it exceeds 1 mm, the thickness of a laminate having three or more layers tends to exceed 2 mm, which is not suitable.

The vulcanized fibers used for lamination do not necessarily have to be vulcanized fibers having the same thickness, and vulcanized fibers having different thicknesses may be used. However, when vulcanized fibers having extremely different thicknesses are laminated, even if the number of laminations is three or more and the fiber orientation directions of the mutually adjoining layers are fixed so as to be perpendicular to each other, such laminated plates May cause the substrate to be easily curled. Therefore, when laminating vulcanized fibers having different thicknesses, it is necessary to take this point into consideration. In order to exhibit the curl prevention effect most effectively, it is preferable to select a vulcanized fiber having a thickness of 0.15 to 0.4 mm as the vulcanized fiber used for lamination.

Further, by using a flame retardant vulcanized fiber as the vulcanized fiber, an IC card having flame retardancy can be obtained. However, in this case, the vulcanized fiber having flame retardancy is somewhat inferior to the splitting resistance. For example, the vulcanized fiber having at least the front and back layers is made of vulcanized fiber having flame retardancy, so that the excellent resistance of the substrate can be obtained. It is possible to obtain the same flame-retardant effect as if the front and back surfaces of the IC card were made flame-retardant and the flame-retardant paint was applied while ensuring the splitting property.

In order to make the vulcanized fiber flame-retardant, a phosphorus-containing nitrogen-containing organic compound flame retardant, a condensed alkyl phosphate derivative, a guanidine phosphate,
After washing with a flame retardant aqueous solution containing at least one water-soluble flame retardant such as a phosphoric acid-modified organic sulfamate, an ester of dicyandiacid formaldehyde and secondary ammonium phosphate, and a monomethylol dicyandiacid phosphate. Dipping the vulcanized fiber in the stage where the moisture content of the saturated state or the early stage of the drying process is
The drug is included in vulcanized fiber, or in a base paper, aluminum hydroxide, a hydrous inorganic compound such as magnesium hydroxide or vinylidene chloride,
Flame-retardant thermoplastic synthetic resin fibers such as vinyl chloride and chlorinated polyethylene may be blended.

In manufacturing the IC card of the present invention, first, in order to manufacture a substrate constituted by the vulcanized fiber according to the present invention, for example, a vulcanized fiber having a predetermined thickness is about 0.5 to 1 m square. May be cut into squares, and the predetermined number may be laminated and fixed via an adhesive so that the fiber orientation directions of the mutually adjoining layers are perpendicular to each other.

Examples of the adhesive include phenolic, melamine, urea, urea / melamine, epoxy, vinyl acetate, ethylene vinyl acetate, urethane, acrylic, chloroprene, and synthetic rubber adhesives. The adhesive may be appropriately selected from the following types of adhesives, and the adhesive is cured by a hot-press using a thermosetting resin such as phenolic, melamine, urea, urea / melamine, and epoxy. The method of fixing by sticking is most preferable from the viewpoint of imparting sufficient peel strength, heat resistance and water resistance to the obtained substrate. The substrate constituted by the vulcanized fiber according to the present invention is obtained by cutting or punching the vulcanized fiber laminate thus obtained into a predetermined size. At this time, when the smaller angle of the angle formed between the fiber orientation axis of the vulcanized fiber laminate and the major axis or minor axis of the substrate obtained by cutting or punching is set to 10 to 45 degrees, the substrate Can be minimized to further suppress the occurrence of curling.

Next, a recess for chip embedding is formed in the obtained substrate by a cutting machine, and the chip is fixed to the recess by hot melt bonding or the like, thereby obtaining the I of the present invention.
C card is obtained. Further, by printing on the surface of the substrate, an IC card having excellent design properties can be obtained. In addition, as a result of testing various printing methods, when printing is performed on the surface of the substrate composed of the vulcanized fiber according to the present invention, first, a UV curable anchor coating agent layer is provided on the substrate surface, and then the UV offset is applied. It has been found that when printing is performed, the quality of the printed surface is further improved, and an IC card having more excellent design properties can be obtained.

[0016]

Next, the present invention will be described more specifically based on the following examples. The measurement of each item in this example was performed by the following method. Machinability of recess for chip burying. . . Visually observe the condition of the cutting part. 良好 Good without fuzz, chipping, etc. △ Slight fluffing, chipping, etc. × Fluff, chipping, etc. occur. Was evaluated.

Adhesiveness of chip. . . Visual observation of the condition of the back surface of the substrate after bonding. 良好 Good without damage such as swelling, depression, discoloration, etc. Δ: Some damage such as fluffing, swelling, depression, discoloration, etc. occurs. × Damage such as swelling, depression, discoloration, etc. occurs. Was evaluated.

Split resistance. . . A repetitive bending test specified in ISO 7816-1 was performed, and evaluated according to the number of repetitions until a failure such as cracking or breaking occurred: 以上 1500 times or more 〇 1000 to 1499 times △ 700 to 999 times × 699 times or less .

Curling resistance: 50 ° C., 95 RH%,
After being humidified for 24 hours and dried at 60 ° C. for 24 hours, immediately after the end of the long side of the IC card is pressed against a horizontal surface, the height at which the other end rises from the horizontal surface is measured. Δ: More than 1 mm and 2 mm or less × more than 2 mm.

Appropriate incineration: Put the IC card on a ceramic dish, and visually observe the amount of smoke and the state of adhesion of the melt to the dish when incinerated in an electric furnace adjusted to 900 ° C. Almost no melt adhesion.少 し There is little smoke, but there is no adhesion of melt. C: Both smoking and adhesion of the melt are remarkably observed. Was evaluated.

EXAMPLE 1 Three 0.25 mm thick, 1 m square vulcanized fibers were laminated via a urea / melamine adhesive such that the fiber orientation directions of the mutually adjoining layers were perpendicular to each other. The applied amount of the adhesive was 22 g / adhesive layer m ² for the solid mold, and heated and pressed by a hot press (at a temperature of 98 ° C. and a pressure of 20 kg / m).
(cm ² , time: 60 minutes) to obtain a laminate.
Next, the laminated plate was cut by a cutting machine to have a size of 8.5 cm × 5.3.
A substrate with a cm thickness of 0.8 mm was obtained. A 12 mm square, first stage depth 200 μm, second stage depth 600
A concave part for embedding chips having a two-stage structure of μm is formed, and hot-melt adhesive is applied to the concave part (using a polyurethane-based adhesive, the amount of the adhesive is 60 g / m ^{2 in} solid content, and the heating condition is 200 ° C. × 1 second). The pressing condition is 1.5kg / cm ² × 1
For 2 seconds, a module tape portion made of glass epoxy, which is a substrate of an IC chip module having a 12 mm square and a thickness of 200 μm, on which a chip was mounted, was fixed to obtain an IC card A.

However, the smaller of the angles formed by the fiber orientation axis of the vulcanized fiber laminated plate and the long axis of the substrate obtained by cutting was set to 30 degrees. In the manufacturing process of the IC card A, the cutting workability of the recess for embedding the chip and the heat resistance at the time of bonding the chip, the splitting resistance, the curling resistance and the incineration suitability of the IC card A were tested. The results are shown in Table 1. FIG. 1 is a perspective view of the IC card A. 1 is a substrate and 2 is a chip.

Example 2 1 m square 0.25 mm thick flame retardant vulcanized fiber (containing about 30% by weight of solid content of phosphorus-containing nitrogen-containing organic compound flame retardant in the absolute dry weight of vulcanized fiber) , UL standard V-0.) Two pieces and the same 1 m square 0.25 mm thick vulcanized fiber used in Example 1 (hereinafter, usually referred to as vulcanized fiber) One sheet is laminated in the same manner as in Example 1 with the flame retardant vulcanized fiber as the front and back layers and the vulcanized fiber as the middle layer, and the fiber orientation directions of the mutually adjoining layers are at right angles to each other. An IC card B of the same type as the IC card A was obtained in the same manner as in Example 1 except that the IC card B was fixed. In the manufacturing process of the IC card B, the cutting workability of the concave portion for chip embedding and the heat resistance at the time of bonding the chip, the splitting resistance, the curling resistance and the incineration suitability of the IC card B were tested. The results are shown in Table 1.

Example 3 In Example 1, an anchor coat treatment was performed on the substrate surface (treatment conditions were that a UV-curable anchor coat agent was applied to a medium pressure mercury lamp U
V light source, output 1500Watt, wavelength 200-380n
m, at an irradiation distance of about 80 nm, the card is continuously conveyed for about 0.5 seconds, and then subjected to UV offset printing. I got In the manufacturing process of the IC card C, the cutting workability of the recess for embedding the chip, the heat resistance at the time of bonding the chip, the splitting resistance, the curling resistance and the incineration suitability of the IC card C were tested. The results are shown in Table 1.

Comparative Example 1 An IC card A was prepared in the same manner as in Example 1 except that a vulcanized fiber laminated board of 1 m square and 0.8 mm thick vulcanized fiber was used as a substrate. A similar IC card D was obtained. IC
In the manufacturing process of the card D, the cutting workability of the concave portion for burying the chip, the heat resistance at the time of bonding the chip, and the splitting resistance, the curling resistance and the incineration suitability of the IC card D were tested, and the results are shown in Table 1.

Comparative Example 2 In Example 1, two 0.4 mm vulcanized fibers of 1 m square were replaced with three layers of vulcanized fibers in such a manner that the fiber orientation directions of the mutually adjoining layers were perpendicular to each other. An IC card E of the same type as the IC card A was obtained in the same manner as in Example 1 except that the layers were laminated and fixed in the same manner as in Example 1. In the manufacturing process of the IC card E, the cutting workability of the concave portion for burying the chip and the heat resistance at the time of bonding the chip, the splitting resistance, the curl resistance and the incineration suitability of the IC card E were tested. The results are shown in Table 1.

COMPARATIVE EXAMPLE 3 Example 1 was repeated except that, in place of the vulcanized fiber laminate, a 4-millimeter circular netted 0.8 mm thick paperboard cut into 1 m square was used as the substrate. In the same manner as in the above, an IC card F of the same type as the IC card A was obtained.
In the manufacturing process of the IC card F, the cutting workability of the concave portion for burying the chip, the heat resistance at the time of bonding the chip, the splitting resistance, the curl resistance and the incineration suitability of the IC card F were tested. The results are shown in Table 1.

COMPARATIVE EXAMPLE 4 In Example 1, a 1-m square 0.25 mm thick vulcanized fiber was replaced with a 4-mesh mesh having a thickness of 0.3 m.
Example 1 was prepared by cutting three pieces of paperboard having a length of 1 m into a 1 m square so that the fiber orientation directions of the mutually adjoining layers were perpendicular to each other.
An IC card G of the same type as the IC card A was obtained in the same manner as in Example 1 except that the layers were laminated and fixed in the same manner as in Example 1. IC
In the manufacturing process of the card G, the cutting workability of the concave portion for burying the chip, the heat resistance at the time of bonding the chip, and the splitting resistance, the curling resistance and the incineration suitability of the IC card G were tested. The results are shown in Table 1.

Comparative Example 5 An I-type IC card of the same type as IC card A was prepared in the same manner as in Example 1 except that a 0.8 mm thick PVC plate was used as a substrate in place of the vulcanized fiber laminate.
C card H was obtained. In the manufacturing process of the IC card H, the cutting workability of the concave portion for burying the chip, the heat resistance at the time of chip bonding, the splitting resistance, the curling resistance and the suitability for incineration of the IC card H were tested. The results are shown in Table 1.

[0030]

[Table 1]

From Examples 1 to 3 and Comparative Examples 1 to 5 and Table 1, the IC card according to the present invention is characterized in that the cutting workability of the recess for burying the chip in the manufacturing process of the IC card, the heat resistance when the chip is bonded, and the IC card It can be seen that all of the evaluation items of the splitting resistance, curling resistance and incineration suitability of the sample were excellent. In addition, in terms of incineration, the purpose can be achieved by using ordinary paperboard as the substrate, but the IC card F or IC card G obtained in Comparative Example 3 or Comparative Example 4 can be easily torn by hand. This is not enough for practical use from this point.

On the other hand, Embodiment 1, Embodiment 2 or Embodiment 3
The IC card A, the IC card B or the IC card C according to the present invention obtained in the above has a strength equivalent to that of a conventional plastic substrate IC card, and the substrate is a vulcanized fiber mainly composed of a natural fiber material. Because of the laminated / fixed structure, the plastic material has flexibility that is not available in a plastic material, and is less likely to be chipped or cracked by an impact as compared with a plastic substrate IC card.

[0033]

According to the IC card of the present invention, a laminated plate having a predetermined thickness is formed by laminating and fixing vulcanized fibers having a specific thickness in a predetermined structure, and a concave portion is formed on the surface of the substrate. However, since the chip is embedded and fixed in the concave portion, the chip is excellent in cutting workability when forming the concave portion for chip embedding, and almost no thermal damage of the substrate occurs when the chip is fixed to the substrate by hot melt bonding or the like. Also, it is excellent in printability and design, and the obtained IC card has good cracking resistance, curling resistance, surface smoothness, chip peeling strength, etc., and has been used. It is possible to incinerate.

More specifically, (A) In a conventional IC card using a plastic material as a substrate, when a chip is fixed to the substrate by hot-melt bonding or the like in a manufacturing process, the substrate may be damaged by heat. Although easy to receive, the IC card according to the present invention does not suffer from such thermal damage because the substrate is made of vulcanized fiber having excellent heat resistance.

(B) In a conventional IC card using a plastic material as a substrate, the substrate is easily chipped or cracked during use, and using an IC card with chipping or cracking is likely to damage the hand, which is dangerous. In the IC card according to the present invention, since the laminated board having a predetermined laminated / fixed structure using vulcanized fiber having excellent strength is used as the substrate, the IC card has excellent split resistance and high safety during use.

(C) In the case of a conventional IC card using a plastic material as a substrate, due to the problem of exhaust gas during incineration and damage to the incinerator caused by the plastic material as a substrate,
Although the incineration treatment could not be performed in practice, the IC card according to the present invention uses a laminated plate having a predetermined laminated and fixed structure using vulcanized fiber, which is a natural fiber material, as a substrate. Since the main constituent material is a natural fiber mainly composed of cellulose fiber, the incineration treatment can be carried out without worrying that the problem of exhaust gas during incineration and damage to the incinerator peculiar to plastic materials does not occur.

(D) Since it is impossible to write characters on a conventional IC card using a plastic material as a substrate with a writing instrument such as a pencil, a ballpoint pen, a fountain pen, etc., the IC card owner (used Person) A paper-like material and a process for attaching a signature field for identification to the back of the plastic card were necessary. However, in the IC card according to the present invention, since the substrate itself has good entry suitability, such a signature field is required. No materials and processes are required for formation.

(E) A conventional IC card using a plastic material as a substrate has a heat-resistant temperature of about 90 ° C.
GSM specification mobile phone I requiring heat resistance of 0 ° C or higher
Although there was a problem in C card production, in the IC card according to the present invention, the substrate was kept at 200 ° C. in a relatively short processing time.
It has the above heat resistance and can be used without any problem.

[Brief description of the drawings]

FIG. 1 is a perspective view of an IC card according to the present invention.

[Explanation of symbols]

 1 board 2 chip

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Ryo Takita 23 Omura, Buzen City, Fukuoka Prefecture Japan Engineering Co., Ltd.

Claims (5)

[Claims] 1. A vulcanized material having a thickness of 0.1 to 1 mm.
Three or more layers of fibers, the fiber orientation directions of the mutually adjoining layers are fixed at right angles to each other, and a laminate having a thickness of 0.5 to 2 mm is used as a substrate, and chips are formed in recesses formed on the surface of the substrate. An IC card characterized by being embedded and fixed. 2. The IC card according to claim 1, wherein the number of stacked vulcanized fibers is odd. 3. The IC card according to claim 1, wherein at least one layer of vulcanized fibers is a vulcanized fiber having twist resistance. 4. The IC card according to claim 1, wherein at least the vulcanized fibers in the front and back layers are vulcanized fibers having twist resistance. 5. The method according to claim 1, wherein a UV curable anchor coating agent layer is formed on the substrate surface, and a UV offset printing layer is formed on the anchor coating agent layer.
The IC card according to 2, 3 or 4.