JP4846351B2 - IC tag - Google Patents

Description

  The present invention relates to an IC tag including an IC tag element having an antenna and an IC chip, and particularly to an IC tag sealed and covered with a resin in a bag shape.

In recent years, IC tags can be used for a wide range of applications, such as affixed to articles, etc. in a single environment, for example, attached to clothing, from laundry to heat press. It is expanding to a range of uses for use in a number of different environments, such as laundry applications with secondary and tertiary processing environments along with the article.
However, a normal IC tag is an electronic functional part using an IC module having a conductive antenna and an IC chip (integrated electronic circuit) as an IC tag element. Will naturally be limited.
Therefore, in order to improve the environmental resistance performance of the IC tag and expand the usage range of the IC tag, the IC tag element is made of resin by molding such as a covering package, heat sealing and in-mold injection molding. Various proposals (Patent Document 1, Patent Document 2, and Patent Document 3) for covering and protecting the entire tag element have been made.
JP 2003-67696 A JP 2002-24783 A Noto 3101744 gazette

However, the conventional IC tag is attached to clothing or the like and cannot withstand in a plurality of different processing environments with secondary and tertiary processing environments together with the article from washing to drying and heat pressing. It was.
As an example, in the case of laundry applications used for the management of cleaning clothes, etc., IC tags are attached to clothes, and after being worn, they are used for washing processing where bending is repeated by washing with detergent, warm water or solvent. First, after heat drying with dewatering and wrinkle removal processing, it is subjected to repeated mechanical and physical thermal stresses with heating and pressurization until finishing such as iron heating and hot pressing. Therefore, in the conventional IC tag that simply covers and protects the IC tag element, even if it can withstand a certain washing process while maintaining watertightness, it repeats a cycle including heating and pressurization such as a drying process and a heat press process. As a result, the coating is damaged or the coating resin is melted, and eventually it becomes unusable due to loss of watertightness or deformation or destruction of the IC tag element. In the environment where it acts simultaneously, there was a problem in durability.

Even if it is attempted to improve the durability by thickening the coating resin to solve these problems, these strong and thick forms cause a sense of incongruity when attached to clothing due to lack of flexibility and bulk. It could not be applied to other uses.
Therefore, if the IC tag element is covered and molded with a resin film that is thinly molded with a known resin having excellent heat resistance and mechanical strength, at first glance, it will have flexibility, water tightness, and bending repeatability. It is expected that an IC tag excellent in heat resistance and heat resistance can be obtained.
However, as described above, even if the coating is thinly formed with a resin having excellent heat resistance, when an IC tag is actually manufactured and tested, flexibility is obtained, but satisfactory durability is obtained. Until now, there has been no IC tag with sufficient durability to meet these harsh conditions.

  Therefore, the present invention has an object to provide an IC tag that has flexibility and can obtain high heat resistance and bending resistance in addition to water resistance and chemical resistance, and can be applied to a wide range of uses. And

  According to the present invention, the above problem is solved by the following means.

In a first aspect of the present invention, there is provided an IC tag comprising: an IC tag element having an antenna and an IC chip; and a surface member made of a bag-like resin that contacts the IC tag element and covers the IC tag element. The member is sealed at a portion in the vicinity of the outer periphery of the IC tag element, the surface of the surface in contact with the IC tag element is formed into a rough surface, and the surface of the surface in contact with the IC tag element is in point contact The IC tag is characterized by being maintained in a state .

In a second aspect of the present invention, the surface member is a resin film having a thickness of 0.1 to 2 mm, and the rough surface has a ten-point average roughness in a range of 10 to 200 μm. 1 is an IC tag according to the first invention.

In a third aspect of the invention, the surface member is molded from at least one of polybutylene terephthalate, polymethylpentene, 6 nylon, 66 nylon, 11 nylon, 12 nylon, modified polyphenylene oxide, and modified polyphenylene ether . The IC tag according to the first invention or the second invention characterized by the above.

  According to a fourth invention, in the first to third inventions, the sealing is performed by heat-sealing the peripheral edges of the surface members disposed above and below the IC tag element. An IC tag according to any one of them.

  According to a fifth aspect of the invention, the sealing is made by adhering peripheral edges of surface members disposed above and below the IC tag element with an adhesive member. The IC tag according to any one of the above.

  A sixth invention relates to the fifth invention, wherein the adhesive member is a resin film of an ethylene-vinyl acetate copolymer blended with a crosslinking agent, which is heated and three-dimensionally crosslinked. IC tag.

  The present invention has newly found that when an IC tag is manufactured or used, the IC tag element and the surface member adsorb or adhere to each other, which can greatly affect the durability of the IC tag. And this invention decided to make the surface of the surface which touches an IC tag element in the surface member which touches an IC tag element into a rough surface based on this new knowledge. According to the present invention, since the surface member and the IC tag element can maintain a point contact state and an air layer can be held between them, the adsorption or adhesion between the surface member and the IC tag element can be prevented. . As a result, according to the present invention, with respect to bending deformation acting on the IC tag, the surface member and the IC tag element reduce the frictional resistance at the boundary thereof, and the shear stress generated between these layers during the bending action is reduced. Since the stress can be relaxed, the physical stress on the IC chip or the antenna portion of the IC tag element can be reduced and its durability can be improved. Therefore, according to the present invention, there is provided an IC tag that has flexibility and can obtain high heat resistance and bending resistance in addition to water resistance and chemical resistance, and can be applied to a wide range of uses. can do.

  Hereinafter, preferred embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. The following description relates to the best mode for carrying out the invention and does not limit the present invention.

  The inventors of the present invention have created IC tags with excellent durability simply by improving the heat resistance of the coating resin in the process of trial manufacture and durability tests with various coating resin materials and various member configurations for IC tags. Clarified the cause of the failure.

  Completion of the present invention begins with a survey of actual IC tag usage and actual processing environment. According to a survey of the IC tag's thermal usage environment, when attaching an IC tag to clothing, it is attached by hot-melt resin with thermocompression bonding, and for removing wrinkles during heat drying after washing In addition, there are many processes that are not only heated but also subjected to pressure at the same time, such as hot-roll pressurization, and in the final process, such as hot pressing by iron heating or the like.

  According to the reproduction tests based on these investigations, it is concluded that the inner surface sealed in a bag shape under the environment where heating and pressurization act simultaneously, no matter how much the heat resistance of the surface member to be coated is increased. The conclusion that the IC tag element and the surface member in contact with the IC tag element are attracted or adhered due to the action of heating and pressurization, resulting in a significant decrease in the durability of the IC tag. did.

  Further, according to the detailed investigation experiment by the present inventors, the adhesion between the surface member and the IC tag element is determined by the shear stress between the layers of the IC tag element and the surface member when the IC tag is subjected to repeated bending such as washing. Act. The IC tag element itself is a very delicate electronic component, and has not been designed assuming the action of these external stresses. For this reason, the IC chip of the silicon crystal body from which the IC tag element protrudes against the shear stress is broken, or the connection between the IC chip and the antenna part or the antenna itself is broken. Further, the antenna and the IC chip are It elucidates the mechanism that causes a phenomenon such as peeling from the fixed film base material and the IC tag is destroyed.

In view of these facts, an effective means for solving the above-mentioned problems obtained as a result of continuing the trial research, that is, the surface of the surface member in contact with the IC tag element of the surface member arranged above and below the IC tag element It was to form on a rough surface.
The surface member formed with a rough surface in contact with the IC tag element maintains a point contact state with the IC tag element even after subsequent heating and pressurization, and a slight air layer is always maintained. Therefore, it is possible to prevent the surface member and the IC tag element from being adsorbed or adhered to each other to the maximum extent. As a result, with respect to bending deformation acting on the IC tag, the surface member and the IC tag element can reduce the frictional resistance at the boundary between them, and the shear stress generated between these layers can be reduced. The durability of the element can be greatly improved by minimizing the physical stress on the IC chip or antenna portion of the element.

  Here, the shape of the rough surface formed on the surface member of the present invention is not particularly limited as long as it is a shape that can be in point contact with the IC tag element to reliably hold the air layer and prevent adhesion. For example, fine concavo-convex patterns such as satin-like, matte, matte, and grainy, and sculptural concavo-convex patterns such as conical, pyramidal, trapezoidal, linear, crossed, and leather wrinkles, Furthermore, an arbitrary uneven pattern shape such as an uneven pattern formed by polishing with sandpaper, a wire brush, or the like can be applied, and any rough form other than a specular form can be applied. Moreover, in order to form these uneven | corrugated patterns in a surface member, you may form simultaneously with manufacture of a surface member, and you may form by post-processing with respect to a surface member, all are resin films as a surface member It can be easily applied to the above.

Further, regarding the condition of the rough surface formed on the surface member of the present invention, the 10-point average roughness Rz is 10 in the surface roughness measured by the stylus-type surface roughness measuring instrument defined in JIS B0651 (1982). It is preferably formed on a rough surface of ˜200 μm (based on JISB0601-1982 surface roughness standard). Here, when the ten-point average roughness Rz of the surface member is 10 μm or less, the close contact with the surface member of the IC tag element due to heating and pressurization cannot be completely prevented, and the durability of the IC tag is significantly reduced. This is considered to be because when the ten-point average roughness Rz is 10 μm or less, the irregularities formed on the surface of the surface member are crushed and the surface member and the IC tag element are in close contact with each other. On the other hand, a rough surface having a ten-point average roughness Rz of 200 μm or more can completely prevent such adhesion, but the IC member is likely to crack due to repeated bending of the IC tag, which may reduce its durability. . This is presumably because the concave portion of the surface member is partially thinned on a rough surface having a ten-point average roughness Rz of 200 μm or more, and the mechanical durability is lowered.
From the above, the situation of the rough surface that is more preferable for obtaining more reliable durability is that the ten-point average roughness Rz is formed on a rough surface of 15 to 150 μm. In order to ensure the durability of the IC tag, it is preferable that the surface of the rough surface described above is preferable for obtaining reliable, stable and safe durability, and that the ten-point average roughness Rz is 20 to 100 μm. And more preferable.

  Next, the surface member of the present invention is a member that constitutes the surface of the IC tag by covering them in order to improve the environmental resistance of the above-mentioned IC tag element, and has water resistance, solvent resistance, and bending resistance. It is a material that is excellent in performance such as heat resistance, can be easily formed thin in order to maintain the flexibility of the IC tag after coating, and can easily form the rough surface. In addition, the IC tag element is sealed in a bag shape in the vicinity of the outer periphery to maintain watertightness, and is excellent in sealing performance such as fusion by heating, welding by a solvent, and adhesion by an adhesive. Any material can be applied as long as it is a material.

  The material meeting these target performances can be appropriately selected from thermoplastic resins, thermosetting resins, natural or synthetic rubber resins, cellulose resins and the like, and is not particularly limited. Examples include biaxially stretched PET film, biaxially stretched polyethylene naphthalate, polybutylene terephthalate, polymethylpentene, polysulfone, polyethersulfone, polyetheretherketone, polyimide, polyetherimide, polyamideimide, polyarylate, polyphenylene oxide. Examples thereof include thermoplastic resins excellent in heat resistance and mechanical strength, such as modified polyphenylene oxide, polyphenylene ether, modified polyphenylene ether, MXD6 nylon, 6 nylon, 46 nylon, 66 nylon, 11 nylon, and 12 nylon. Among these, resins selected from polybutylene terephthalate, polymethylpentene, 6 nylon, 66 nylon, 11 nylon, 12 nylon, modified polyphenylene oxide, modified polyphenylene ether, etc. are excellent in heat resistance and mechanical strength, It can be preferably applied because it has good heat-sealing sealability, excellent adhesion to an adhesive member, and film formation by extrusion is easy.

  Other resins include three-dimensionally cross-linked ethylene-vinyl acetate copolymer resin, fluorine resin, silicon resin, and urethane, silicon, fluorine, EVA, NBR, SBR, etc. Rubber-based resins, thermosetting resins such as epoxy-based, polyester-based and phenol-based resins, plastic base materials impregnated with these thermosetting resins, and the like are applicable as the surface member of the present invention. It is a resin having a heat resistance of at least a melting temperature or a heat distortion temperature of 120 ° C. or more, preferably a heat resistance of 150 ° C. or more, and more preferably a resin having similar heat resistance characteristics of 180 ° C. or more. Is preferred.

  Any of these resins can be used after being processed into a thin film or sheet. For example, the thermoplastic resin and the synthetic rubber resin can be easily formed into a film by known molding means such as known extrusion molding or calendar molding. In the case of a thermosetting resin or the like, it can be formed by a known molding means such as cast molding or press molding.

  And it is preferable to form the uneven | corrugated pattern demonstrated previously on the surface simultaneously with these film forming shaping | molding. If it is a thermoplastic resin, this can be efficiently formed by embossing with respect to the molten resin at the time of film formation, for example using the roll by which the mat | matte process and the engraving process were performed. Moreover, if it is other resin, formation of the rough surface by said uneven | corrugated pattern can be efficiently performed simultaneously with film forming with these rolls or a shaping | molding die.

As another method for forming a rough surface, a means for forming these surfaces into a rough surface by post-processing on the resin film or sheet once formed into a film can be used. For example, if it is a thermoplastic resin, after the surface is once heated and melted, it can be subjected to after-embossing with the above roll or mold.
Further, regardless of the above-described resin, the surface of the resin may be etched using a corrosive action of a chemical or the like to form an uneven pattern to make it rough.

  As another method, for example, a concavo-convex pattern is formed by polishing a surface of a film-forming film or sheet by rotating a wire brush adjusted to a circular shape or a sanding paper formed endlessly. The surface of the surface member can be formed into a rough surface. In this case, all of the above-mentioned resins can be handled, a small amount of processing can be easily handled, and the rough surface state can be freely changed and adjusted. is there.

  Thus, the thickness of the surface member for maintaining flexibility by covering the IC tag element in a bag shape with the film or sheet formed into a rough surface and having a rough surface is not particularly limited. A thickness of about 0.1 to 2 mm is preferable for maintaining flexibility. A more preferable thickness of the surface member is 100 to 1000 μm, and the thickness when the IC tag is attached to clothing or the like is such a thickness that the presence is not felt as much as possible. However, the determination of these thicknesses can be appropriately designed depending on the rigidity performance of the material resin.

  The surface member is arranged above and below the IC tag element with a size larger than that of the IC tag element to cover the entire surface thereof, and the upper and lower surface members are sealed in a bag shape near the outer periphery of the IC tag element. Therefore, preferably, if the surface member is the above-mentioned thermoplastic resin, it can be easily and efficiently sealed by known heat fusion means such as heat fusion bonding, heat sealing, high frequency welder fusion, and ultrasonic welder fusion. In addition, the IC tag can be provided with excellent water tightness.

  As other sealing processing examples, a method of melting the surface member of the sealing portion with a chemical such as a solvent can be applied, and an adhesive member is provided between the sealing portions of the upper and lower surface members. A method in which the upper and lower surface members are adhered and the watertightness is maintained can also be preferably applied. As the adhesive member, known thermosetting adhesives such as an epoxy resin, a urethane resin, and a phenol resin can be used. Since these are excellent in heat resistance and adhesiveness, they can be preferably used.

  Furthermore, as an example of another adhesive member, a three-dimensionally crosslinked ethylene-vinyl acetate copolymer resin can be exemplified. As an example of applying the resin, a resin film made of an ethylene-vinyl acetate copolymer resin, which is formed by blending a crosslinking agent in advance with an ethylene-vinyl acetate copolymer resin, is used to seal the upper and lower surface members. After arranging the layers between the layers, the whole is integrally heated, so that the adhesive member functions as an adhesive and good water tightness is obtained. Furthermore, the ethylene-vinyl acetate copolymer resin blended with the cross-linking agent melts evenly between the layers of the upper and lower surface members due to the properties of the thermoplastic resin at the initial stage of heating, and then the subsequent heating. Due to the continuation, the ethylene-vinyl acetate copolymer resin, which is originally a thermoplastic resin having a low melting point, is chemically three-dimensionally cross-linked by the radical reaction of the cross-linking agent previously blended in the resin, and the three-dimensional cross-linked ethylene- Since it becomes a vinyl acetate copolymer resin, once crosslinked, it does not melt by heating and has excellent heat resistance.

  Here, as a cross-linking agent to be blended with the ethylene-vinyl acetate copolymer resin, an organic peroxide that decomposes at a temperature of 100 ° C. or higher to generate a radical reaction can be used, but the stability at the time of blending is maintained. From the above, it is preferable to use a known organic peroxide having a decomposition temperature of 70 ° C. or more at a half-life of 10 hours or a half-life at 130 ° C. of 1 hour or less. As a result, an ethylene-vinyl acetate copolymer resin is used. Crosslinking is possible by heating at 70 ° C. or higher, and the crosslinking can be completed in a shorter time if the temperature is 130 ° C. or higher. The three-dimensionally crosslinked ethylene-vinyl acetate copolymer is heated by such heating. The resin is not melted by reheating and is given excellent heat resistance. These heating can utilize well-known heating means, such as heating by a thermostat, press heating, etc., for example.

  And such an adhesive member can use the range of about 50 micrometers-2 mm, for example. In addition, when the resin film having such a film-shaped thickness is disposed in the vicinity of the outer periphery of the IC tag element and sealed in comparison with the above-described sealing method examples, the sealing portion becomes thin. Accordingly, the thickness of the IC tag element can be increased, and there is an advantage that the entire IC tag can be made into a relatively uniform and flat IC tag.

  Next, in the present invention, as an IC tag element (also referred to as an IC module) having an antenna and an IC chip, regardless of the IC tag system, standard, and type, any function that can achieve its purpose is used. A type of IC module can also be used. For example, it may be an IC module made of only a material consisting of only an antenna coil and an IC chip, or a structure in which an antenna and an IC chip are fixed on a film substrate such as polyester can be preferably used.

  As an example of the IC module fixed on the latter film substrate, the antenna portion is pattern-printed with a conductive ink such as silver paste on a film substrate of about 50 to 200 μm, or a copper foil is laminated. The film base may be formed by photoetching a copper foil antenna part, and then an IC module or the like in which an IC device chip is bonded and fixed on these connecting parts with a conductive adhesive or the like Handling during coating is easy and can be preferably used.

  And as these forms, an antenna part is thinly formed with about 1-300 micrometers, and as an IC device connected to this, it is a size of about 0.5-5 mm square, and the height is about 0.1-1 mm. It is an IC module in the form of a film piece on which an IC chip is mounted and only a minute IC chip protrudes partially in a convex shape although it looks like a thin film. Also, those having an area of about 1/1 to 1/10 of the size of about 55 × 85 mm are often used as modules for IC tags.

  Furthermore, the mass produced by coating an insulating resin on the upper surface of the IC module in which the antenna part and the IC chip are fixed on these film bases is usually used as an IC tag for general use as it is. Even commercially available IC tags with other configurations can be preferably used as the IC tag element of the present invention, and the IC tag of the present invention is in the form and type of these IC tag elements. It can be applied regardless of size.

  FIG. 1 is an explanatory sectional view of a side surface for explaining an IC tag 10 according to a first embodiment of the present invention. FIG. 2 is a plan external view of the IC tag 10 according to the first embodiment of the present invention. In the first embodiment, in FIG. 1 and FIG. 2, an IC tag element 4 in which an IC chip 1 and an antenna 2 are fixedly formed on a film substrate 3, and an upper and lower sides are disposed adjacent to the IC tag element 4. The surface member 6 made of a resin film having a size larger than that of the element 4 and covering the entire surface of the IC tag element 4 is an IC tag 10 in which upper and lower surface members are sealed in a bag shape in the vicinity of the outer periphery of the IC tag element 4. The state of is shown.

  The IC tag element 4 is an antenna 2 that is pattern-printed with silver paste to a thickness of 30 μm on a film base 3 having a thickness of 100 μm and 10 × 46 mm using a biaxially stretched film of polyethylene terephthalate (hereinafter referred to as PET). And a 2 mm square × 0.5 mm height IC chip 1 bonded and fixed on the connection portion of the antenna 2, and further, a coating resin 5 for insulation and fixing is formed on the surface thereof. It is a commercially available IC tag element 4 that can be used as a general IC tag as it is in a good use environment.

  The surface member 6 disposed on both the upper and lower surfaces of the IC tag element 4 is a resin film having a thickness of 500 μm formed by extrusion molding using 11 nylon resin having a melting point of 186 ° C. and excellent heat resistance. At the same time as the extrusion, the resin film was pressed and transferred at the time of melting of the film by a pressure roll subjected to a mat (textured concavo-convex pattern) process, and the concavo-convex pattern 7 formed on the mat-like rough surface was provided on one side. The surfaces of the upper and lower surface members 6 on which the uneven pattern 7 is formed are arranged so as to be in contact with the IC tag element 4.

  Here, when the surface roughness of the concavo-convex pattern 7 formed on the surface member 6 was measured, the ten-point average roughness Rz was 42 μm in the longitudinal direction of the resin film, and the surface roughness was 44 μm in the lateral direction. Met. About the surface roughness meter used in this case, the Tokyo Seimitsu Co., Ltd. product: Surface roughness shape measuring machine: Surfcom 112B was used.

  Next, the upper and lower surface members 6 are adjusted to a size of 50 × 100 mm, which is large enough to cover the entire surface of the IC tag element 4, and the IC tag element 4 is sandwiched in the vicinity of the center. In the vicinity of the outer periphery of the IC tag element 4, the upper and lower surface members 6 are heat-sealed with a commercially available output 3 kW high-frequency welder fusion machine. The width | variety of the heat sealing | fusion part 9 of the outer periphery at this time was 3 mm. At this time, it can be seen that the appearance of the heat-sealed portion 9 of the translucent surface member 6 is changed to transparent, and the upper and lower surface members 6 are well heat-sealed.

Further, with respect to the distance between the inner side of the heat fusion part 9 and the outer side of the IC tag element 4, the distance between both ends in the longitudinal direction of the IC tag element 4 is 4 mm, and the gap between each edge in the short direction is 2 mm The interval. This is because the amount of displacement during bending deformation of the IC tag 10 in the longitudinal direction is taken into consideration.
Thereafter, the remaining surface member 6 on the outer periphery was removed so that the width of the outer heat-sealing portion 9 was 2 mm, and an IC tag 10 having a size of 18 × 58 was obtained. The IC tag 10 was an IC tag having moderate flexibility.

Here, in Example 1, the surface member 6 adjacent to the IC chip 1 side and the surface member 6 adjacent to the film substrate 3 side are configured with the same thickness, but for example, the thickness on the IC chip 1 side For example, the thickness of the upper and lower surface members 6 may be different from each other for the purpose of improving the coating strength.
In the first embodiment, the shape of the heat-sealing portion 9 and the outer shape of the IC tag 10 are rectangular shapes. For these shapes, for example, the corner portions are formed in an R shape, and the corner portions are formed. For example, clothing items may not be damaged.

  FIG. 3 is a side sectional view for explaining an IC tag 20 according to a second embodiment of the present invention. In the second embodiment, the same IC tag element 4 and the same surface member 6 as those in the first embodiment are used in FIG. 3, but in particular, the means for forming the rough surface of the surface member 6 is different. The state of the IC tag 20 in which the means for sealing the upper and lower surface members in a bag shape in the vicinity of the outer periphery of the tag element 4 is shown, and the others are the same as in the first embodiment.

  The surface members 6 arranged on both the upper and lower surfaces of the IC tag element 4 of the second embodiment are resin films made of 11 nylon resin formed by extrusion as in the first embodiment. Although the uneven | corrugated pattern 7 was processed and the surface member of Example 1 is different, the various performances are the same. In the polishing process for forming the concavo-convex pattern 7, the surface of the resin film is polished at a passing speed of 6 m / min by a sander machine that rotates an 80th endless sanding paper at a peripheral speed of 20 m / sec.

  When the surface roughness of the concavo-convex pattern 7 formed on the surface member 6 thus obtained was measured in the same manner as in Example 1, the ten-point average roughness Rz was 61 μm in the longitudinal direction of the resin film, and the lateral direction was The surface roughness was 64 μm. The surface member 6 made of the resin film had a thickness of 400 μm and was adjusted to a size of 50 × 100 mm.

  Further, in the second embodiment, the adhesive member 8 is used on the outer peripheral portion of the surface member 6 as a means for sealing in a bag shape with the upper and lower surface members in the vicinity of the outer periphery of the IC tag element 4. The adhesive member 8 is a resin film formed with an ethylene-vinyl acetate copolymer (hereinafter referred to as EVA) resin blended with a crosslinking agent with an organic peroxide and having a thickness of 250 μm and an outer shape of 50 × 100 mm. Further, the center portion was cut into a window shape with a size of 16 × 52 which is larger than the IC tag element 4, and a frame shape was used.

  Thus, after each obtained member was piled up as shown in FIG. 3, the whole was inserted into a vacuum suction bag (not shown), put into a thermostat while being decompressed at −0.09 MPa, and heated. The heating conditions were 70 ° C. for 5 minutes, 100 ° C. for 5 minutes, 130 ° C. for 20 minutes, 135 ° C. for 30 minutes, and 140 ° C. for 30 minutes, followed by removal and cooling.

  Then, after taking out from a vacuum suction bag, the excess outer periphery resin was excised and the IC tag 20 of the magnitude | size of the same 18x58 mm as Example 1 was produced. Compared with Example 1, the IC tag 20 had excellent flatness and appropriate flexibility. Further, since the adhesive member 8 is an EVA resin that is three-dimensionally cross-linked by a pre-mixed crosslinking agent by heating and is three-dimensionally cross-linked, it is an IC tag 20 that is predicted to be an adhesive member having excellent heat resistance. .

  Here, as an application example of the second embodiment, the size of the film base 3 of the IC tag element 4 is configured to be equal to the dimension of the surface member 6, and the lower surface member 6 is omitted. Can do. In this case, the adhesive member 8 is excellent in adhesiveness between the IC tag element 4 and the film base 3 and can maintain good watertightness.

[Comparative example]
A comparative example (not shown) for comparison with the IC tags 10 and 20 of the present invention will be described. The comparative example used the resin film which does not form the uneven | corrugated pattern 7 formed in the surface member 6 in the structure of Example 1. FIG. The resin film is a resin film obtained by the same 11 nylon resin as in Example 1 and also by extrusion molding. However, the resin film is replaced with a pressure roll subjected to mat processing used to form the concavo-convex pattern 7. And a resin film formed using a mirror surface roll used in normal extrusion molding. As for the surface roughness of the resin film thus obtained, the 10-point average roughness Rz was 4 μm in the longitudinal direction of the resin film, and the surface roughness was 9 μm in the lateral direction. This is an IC tag of a comparative example manufactured in the same manner as in Example 1 except that such a resin film is disposed on the upper and lower surfaces of the IC tag element 4 as the surface member 6.

[Performance comparison]
Three IC tags were manufactured for each of the three types of IC tags of Examples 1 and 2 and the comparative example, and a non-contact data reading test was compared with the host device of the data carrier system. The IC tag was also able to send and receive data without inferiority.

  Next, each of the three types of the three IC tags was divided into three polyester cloth work clothes, and a laundry test was performed by actually attaching each of the three IC tags. The method of attachment is to overlap the entire IC tag with a commercially available adhesive cloth with hot melt adhesive applied to the fabric, and press it with a commercially available electric iron at a set temperature of 190 ° C. for 20 seconds. A test garment was prepared in which three pieces each were bonded and fixed to the collar portion of the clothes at even intervals.

Then, about 3 of these test garments, using a commercial 6 kg fully automatic electric washing machine and using a commercial laundry soap for 50 minutes, including washing, rinsing and dehydration, After being dried for 30 minutes using an electric rotating drum dryer, ironing for about 20 seconds was further performed on the collar portion attached with the IC tag at 160 ° C. with the electric iron.
And after carrying out the washing test which made these all processes 1 cycle, after performing the above-mentioned data reading test, as for the IC tag 10 and 20 of Example 1 and Example 2, all can read sufficiently. It was a thing.

  On the other hand, none of the three IC tags of the comparative example could be read. The surface member 6 is softened at a temperature near the melting point by the iron heating and pressurization, and the IC tag element 4 is adhered to the IC tag element 4 in an adhesive manner, whereby shear stress due to repeated bending action during washing and drying. It seems that the IC tag element 4 could not withstand the damage to the IC module. When these IC tags were disassembled, the antenna 2 was in particular in close contact with the surface member 6, and when it was forcibly removed, the antenna 2 was peeled off from the film substrate 3 and exhibited an appearance of close contact.

Further, for the IC tags 10 and 20 of Example 1 and Example 2, the washing test was further performed for 50 cycles, and the washing test was completed.
Thereafter, the above-described data reading test was performed, and all of the IC tags of these examples were sufficiently readable.
Further, when the IC tags 10 and 20 of the present invention were disassembled in the same manner as in the comparative example, there was no adhesion phenomenon as in the comparative example, and the uneven pattern 7 remained almost as it was, Since the shearing stress on the IC tag element 4 due to the bending action was relaxed, the IC tag was highly durable.

  Based on the above results, the present invention includes an IC tag element having an antenna and an IC chip, and a surface member that contacts the IC tag element and seals the IC tag element in a bag shape. The IC tag with a rough surface that comes into contact with the surface is flexible enough to be used in laundry applications with harsh usage environments, and has high heat resistance in addition to water resistance and chemical resistance. It was confirmed that the IC tag has excellent durability and bending resistance and has excellent durability.

  In recent years, as a data carrier system capable of remotely reading a larger amount of information, instead of a bar code method conventionally used as an identification system for automatically reading tag information attached to articles etc., IC tags, RF Development of an IC tag identification system using a non-contact communication medium called a tag, an electronic tag, an electronic tag, etc. has been actively conducted.

  These identification systems tag an IC module having an antenna and an IC chip as basic elements and attach them to an article, etc., via a transmission medium such as magnetism, electromagnetic waves, and microwaves (radio waves) with a host side device. This is a remote identification system in which information is added to an IC tag or information on the tag is read by performing non-contact communication.

  In addition, among these information transmission methods, an IC tag that uses the energy of a transmission signal from a host-side device as the driving power of the IC tag itself may be a very small thin piece without mounting a battery or the like. Therefore, in addition to the range of use for identifying and managing in a single environment, attempts have been made to apply to the range of use placed in a plurality of different environments.

  In order to be used in a plurality of different environments, the IC tag must be able to withstand harsh conditions. However, the IC tag according to the present invention has flexibility, in addition to water resistance and chemical resistance. Since it has high heat resistance and bending resistance, it can withstand severe conditions as compared with conventional IC tags. Therefore, according to the present invention, the IC tag can be used even under harsh conditions that could not be used conventionally, so that the use range of the IC tag can be expanded.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side sectional view illustrating an IC tag 10 according to a first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS It is an external view of the plane of the IC tag 10 concerning Example 1 of this invention. It is explanatory drawing sectional drawing of the side explaining the IC tag 20 concerning Example 2 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC chip 2 Antenna 3 Film base material 4 IC tag element 5 Coating resin 6 Surface member 7 Irregular pattern 8 Adhesive member 9 Thermal fusion part 10 IC tag 20 IC tag

Claims (6)

In an IC tag comprising: an IC tag element having an antenna and an IC chip; and a surface member made of a bag-shaped resin that is in contact with the IC tag element and covers the IC tag element.
The surface member is sealed at a portion in the vicinity of the outer periphery of the IC tag element, and a surface of the surface in contact with the IC tag element is formed into a rough surface, and the surface of the surface in contact with the IC tag element is Maintained in point contact,
IC tag characterized by this. The surface member is a resin film having a thickness of 0.1 to 2 mm,
The rough surface has a ten-point average roughness in the range of 10 to 200 μm.
The IC tag according to claim 1, wherein: Said surface member, polybutylene terephthalate, polymethyl pentene, 6 nylon, 66 nylon, 11 nylon, 12 nylon, modified polyphenylene oxide, and is formed from at least one of modified polyphenylene ether, it is characterized in claim Item 3. The IC tag according to Item 1 or 2.   The IC tag according to any one of claims 1 to 3, wherein the sealing is performed by heat-sealing peripheral edges of surface members arranged above and below the IC tag element.   The IC tag according to any one of claims 1 to 3, wherein the sealing is performed by adhering a peripheral edge of a surface member disposed above and below the IC tag element with an adhesive member. .   6. The IC tag according to claim 5, wherein the adhesive member is a resin film of an ethylene-vinyl acetate copolymer mixed with a crosslinking agent that is three-dimensionally crosslinked by heating.

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