1361477 % 九、發明說明： 【發明所屬之技術領域】 本案係關於一種電子標籤之封裝方法及封裝結構，尤 才曰一種適用於RFID電子標籤之封裝方法及封裝結構。 【先前技術】 無線射頻辨識技術（Radi〇 Frequency Identification，以 下商稱RFID)之電子標籤（Tag)是指晶片（IC)和天線 所構成的組件通稱’其係使用超高頻（UHF)頻帶（約86〇 〜960MHz )之無線訊號，且搭配專用的讀取器 (reader/writer )就可以從外部讀取或寫入資料。由於rfid 忐夠透過無線電訊號識別特定目標並讀取或寫入相關資 料，而無須建立識別系統與特定目標之間的機械或光學接 觸」因此可讓使用者能正確掌握物品的動向’以達成物流 的效率化’目此RFID有逐漸取代傳統的商品條碼及磁卡 的趨勢。 &雖然RFID已被大量應用在物料倉儲管理系統上，具 有仏格便宜及方便管理之優點，然而其侷限於以標 籤貼紙 之方式來進竹，容易因外力造成標籤破損及失效，且無法 ^於^他較為嚴苛的環境下，如在高濕度的環境或水中 谷易脫洛或氧化而失效。而在門禁及人員進出管制之應用 係將RFID標籤封裝於卡片中’然而使用人員仍須主 動持卡感應’當有危急狀況發生時，反而造成*便而無法 確切掌握人員進出之數量。 1361477 有鑑於此，本案發明人進一步思量如何改善RFID電 子標籤之封裝方法及封裝結構，以擴大RFID之應用範圍 並提升可靠度。 【發明内容】 本案之主要目的在於提供一種RFID電子標籤之封裝 方法及封裝結構，使RFID電子標籤可應用於高濕度環 境，具有耐彎折及耐水洗之功效。 本案之另一目的在於提供一種RFID電子標籤之封裝 方法及封裝結構，以擴大RFID電子標籤之應用範圍，如 無塵室人員管控、皮包防偽及鞋子防偽等等。 為達上述目的，本案之一較廣義實施態樣為提供一種 電子標籤之封裝方法，其係包含下列步驟：提供一基材； 形成一第一高分子樹脂層於該基材上；形成一電子標籤結 構於該第一高分子樹脂層上；形成一第二高分子樹脂層於 該電子標籤結構及該第一高分子樹脂層上；以及以一纖維 材質含浸於該第二高分子樹脂層中。 根據本案上述之構想，該電子標籤係為一 RHD電子 標籤。 根據本案上述之構想，該基材係為紙製材質或塑膠類 材質。 根據本案上述之構想，該形成第一高分子樹脂層於該 基材上之步驟係以印刷製程方式將該第一高分子樹脂層 塗佈於該基材上。 1361477 根據本案上述之構想，該形成電子標籤結構之步驟更 包含一天線形成步驟及一覆晶步驟，其中該天線形成步驟 係以印刷製程方式將一導電油墨塗佈於該第一高分子樹 脂層上，而該覆晶步驟係先以印刷製程或以針孔喷嘴將一 異方性導電膠或一非導電膠塗佈於該天線之輸入端點，再 將一晶片附著於該異方性導電膠或該非導電膠上。 根據本案上述之構想，該第一高分子樹脂層及該第二 φ 高分子樹脂層係分別選自環氧樹脂、橡膠、矽膠及壓克力 膠其中之一。較佳者，該第一高分子樹脂層及該第二高分 子樹脂層皆為環氧樹脂層。 根據本案上述之構想，該纖維材質係選自不織布、防 靜電布、尼龍及樹脂纖維其中之一。 本案之另一較廣義實施樣態為提供一種電子標籤之 封裝結構，其係包含：一基材；一第一高分子樹脂層，形 成於該基材上；一電子標籤結構，形成於該第一高分子樹 • 脂層上；以及一第二高分子樹脂層，形成於該電子標籤結 構及該第一高分子樹脂層上，其中該第二高分子樹脂層具 有含浸於其中之纖維材質，使該電子標籤之封裝結構具有 耐水洗及耐彎折之功效。 本案之又一較廣義實施樣態為提供一種無塵式人員 之管控方法，其係將上述之電子標籤之封裝結構縫入無塵 衣中，並利用電子標籤技術達到無塵室人員之管控。 【實施方式】 8 1361477 體現本案特徵與優點的一些典型實施例將在後段的 說明中詳細敘述。應理解的是本案能夠在不同的態樣上具 有各種的變化，其皆不脫離本案的範圍，且其中的說明及 圖式在本質上係當作說明之用，而非用以限制本案。 請參閱第一圖A-F，其係為本案較佳實施例之電子標 • 籤之封裝方法示意圖，其中，該電子標籤係為一無線射頻 識別技術（RFID)之電子標籤。如第一圖A所示，本案之 φ 電子標籤之封裝方法係首先提供一基材11，該基材可為紙 製材質或塑膠類材質，例如聚對苯二甲酸乙烯酯 (Polyethylene terephthalate，PET)，並於該基材 11 上形成 一第一高分子樹脂層12，該第一高分子樹脂層12較佳為 環氧樹脂（epoxy)層，但不以此為限，亦可為其他例如橡 膠、矽膠及壓克力膠等高分子樹脂層。該第一高分子樹脂 層12可藉由印刷製程方式塗佈於該基材11上，當然亦可 以其他方式形成於該基材11上。 • 第一圖B-D則說明RFID電子標籤結構形成於該第一 高分子樹脂層11上之步驟。RFID電子標籤主要包含天線 及晶片結構，因此RFID電子標籤結構之形成方法包含一 天線形成步驟及一覆晶步驟，該天線形成步驟係以印刷製 程方式將一導電油墨13塗佈於該第一高分子樹脂層12上 (如第一圖B所示），以作為RFID之天線結構，而該覆晶 步驟則先以印刷製程或以針孔喷嘴方式將一膠體14,例如 一異方性導電膠或一非導電膠，塗佈於該天線之輸入端點 (如第一圖C所示），再將一晶片15附著於該異方性導電 1361477 % 膠或該非導電膠上（如第一圖D所示），以完成該覆晶步 驟。當然，由於RFID技術的快速發展，RFID電子標籤結 構之形成方法亦有各種不同之實施態樣，而本案之主要構 想在於RFID電子標籤之封裝方法，因此RFID電子標籤 結構之形成方法並不受限於上述實施例，只要能形成天線 及完成覆晶之方法皆不脫離本案的保護範圍。 於上述RFID電子標籤結構形成後，一第二高分子樹 φ 脂層16接著形成於該RFID電子標籤結構之晶片15、天 線13及該第一高分子樹脂層12上，如第一圖E所示。該 第二高分子樹脂層16較佳為環氧樹脂層，但不以此為限， 亦可為其他例如橡膠、矽膠及壓克力膠等高分子樹脂層。 該第二高分子樹脂層16可藉由例如印刷製程之方式塗佈 覆蓋於該RHD電子標籤結構之晶片15、天線13及該第 一高分子樹脂層12上，但不以該印刷製程為限。 最後，以一纖維材質Π含浸於該第二高分子樹脂層 _ 16中，在含浸過程中，第二高分子樹脂16會滲透入纖維 材質17中，再施以壓力處理後，所形成之結構如第一圖F 所示。在一些實施例中，該纖維材質可為不織布、防靜電 布、尼龍或樹脂纖維等，但不以此為限。 本案之RFID電子標籤之封裝方法可使得纖維材質、 第二高分子樹脂層、第一高分子樹脂層及基材等緊密結 合，進而保護其中之天線及晶片等RFID電子標籤結構， 避免其受到外力破壞而失效，且可達到耐彎折及耐水洗的 丄場、477 功效，使RFID可應用於高濕度環境，並提高其可靠度及 使用壽命。 二+另—方面’本案亦提供一電子標籤之封裝結構，其中 =電子標籤係為一 RFID電子標籤。如第一圖F所示，該 包子‘籤之封裝結構包含—基材n、一第一高分子樹脂層 12、 =—電子標籤結構、一第二高分子樹脂層16及含浸於 該第一向分子樹脂層16中之纖維材質n。該基材η係為 、、代製材質或塑膠類材質，該第一高分子樹脂層12係形成 : 材11上’且5玄第一南分子樹脂層12較佳為環氧樹 :(epoxy)層，但不以此為限亦可為其他例如橡膠、矽 :及，克力膠等高分子樹脂層。該電子標籤結構包含形成 ;亥第阿分子樹脂層12上之天線13及覆蓋於該天線13 ^輸入端點上之晶# 15 °該第二高分子樹脂層16係形成 第一 ^線13、晶片15及該第一高分子樹脂層12上，且該 尚分子樹脂層16較佳為環氧樹脂層，但不以此為限， ::為其他：如橡膠、矽膠及壓克力膠等高分子樹脂層。 夕，该含浸於該第二高分子樹脂層16 :為不織布、防靜電布、尼龍或樹脂纖維等= 成之Ln杨之RFID電子减之料方賴封裝完 電子禪籤二:構具有耐彎折及耐水洗的功效糾 義之可==濕度環境，不但增加trfid電子標 >』讀及使用壽命’更擴大了 rfid 乾圍。舉例而+ , 电千払戴之應用 5，由於本案之rfid電子標籤封裝結構具 1361477 \ 有耐彎折及耐水洗的功效，同時配合纖維材質之特性，可 將封裝完成之RFID電子標籤缝製於無塵衣中，以進行無 塵室人員之管控，且在無塵衣高潔淨度之要求下，即使頻 繁的清洗無塵衣，並在洗衣過程中經過擰、摔、揉折等動 作，也不會破壞RFID電子標籤之結構，仍能被讀取器所 讀取，故可達到無塵室人員管控之目的。更甚者，由於RFID 電子標籤係缝製在無塵衣中，只要在感應範圍内即可被讀 φ 取器讀取，而無需由使用人員另外持卡感應，在危急狀況 發生時，更能掌握無塵室人員之進出。 為進一步測試利用本案之RFID電子標籤之封裝方法 所封裝完成之RFID封裝結構之耐彎折及耐水洗的功效， 茲將未經封裝之RFID標籤及以本案封裝方法完成封裝之 RFID標藏同時置入無塵衣洗衣機中進行清洗，其中該清 洗模式包括於55°C溫水中洗滌1〇分鐘，於20°C冷水中洗 滌50分鐘，於70°C熱風下烘烤30分鐘，以及於20°C冷 φ 風下烘烤20分鐘。清洗結果如第二圖所示，其中未經封 裝之RFID標籤21因晶片脫落造成失效，且天線線路發生 氧化及凹折，而以本案封裝方法完成封裝之RFID標籤22 則無失效現象，且高分子樹脂層未發生裂痕。 另外，以本案封裝方法完成封裝之RHD標籤在經過 多次重複清洗後，仍能有效被讀取。表一顯示以本案封裝 方法完成封裝之RHD標籤及未經封裝之RFID標籤之讀 取距離與清洗次數的對照表，從表中可知，以本案封裝方 法完成封裝之RFID標籤在清洗36次後依然可以在原設計 12 1361477 之5m讀取距離下被讀取。換言之，以本案封裝方法完成 封裝之RFID標籤可以有效抵抗在洗衣機中的揉折及浸 泡，亦可有效抵抗在熱風70°C及冷風20°C之烘烤而不被 破壞，確實具有耐彎折及耐水洗的功效。 表一 組別 經封裝之RFID標籤 未封裝之RFID標籤 清洗次數 36 1 設計讀取距離 5m 5m 實際讀取距離 5m Om 再者，以本案封裝方法完成封裝之RFID標籤亦可缝 製於皮包、鞋子或其他皮革製品，除用作人員及物流管控 外，亦可將RFID標籤視作物品身份證，達到防偽之目的。 此外，本案之RFID電子標籤之封裝方法可在一次製 • 程中完成大量之封裝結構，再裁切成個別之RFID電子標 籤，亦可大大降低封裝成本及增進產率。 縱上所述，本案係提供一種RFID電子標籤之封裝方 法及封裝結構，可使RFID電子標籤具有耐彎折及耐水洗 之功效，且可進一步擴大RFID電子標藏之應用範圍，如 無塵室人員管控、皮包防偽及鞋子防偽等等。因此，本案 之電子標籤之封裝方法及封裝結構具有極高之實用性，實 為一具產業價值之發明，爰依法提出申請。 13 1361477 \ 本案得由熟知此技術之人士任施匠思而為諸般修 飾，然皆不脫如附申請專利範圍所欲保護者。1361477 % Nine, invention description: [Technical field of invention] This case relates to an electronic label packaging method and package structure, and particularly to a packaging method and package structure suitable for RFID electronic labels. [Prior Art] The RFID tag of the Radi Frequency Identification (hereinafter referred to as RFID) refers to the component of the chip (IC) and the antenna, which is commonly referred to as the UHF band. A wireless signal of about 86 〇 to 960 MHz can be read or written from the outside with a dedicated reader (writer/writer). Since rfid can identify specific targets and read or write relevant data through radio signals, there is no need to establish mechanical or optical contact between the identification system and a specific target. This allows the user to correctly grasp the movement of the item to achieve logistics. The efficiency of this RFID has gradually replaced the trend of traditional commodity barcodes and magnetic cards. & Although RFID has been widely used in material storage management systems, it has the advantages of cheap and convenient management. However, it is limited to the use of label stickers to enter the bamboo, which is easy to cause damage and failure of the label due to external force, and can not ^ In his more severe environment, such as in high humidity environment or water, the valley is easy to detach or oxidize and fail. In the application of access control and personnel access control, the RFID tag is packaged in the card. However, the user still needs to actively carry the card sensor. When a critical situation occurs, it will cause the number of personnel to enter and exit. 1361477 In view of this, the inventor of the present invention further considered how to improve the packaging method and package structure of the RFID electronic tag to expand the application range of RFID and improve the reliability. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide a packaging method and a package structure of an RFID electronic tag, so that the RFID electronic tag can be applied to a high-humidity environment, and has the advantages of bending resistance and water washing resistance. Another object of the present invention is to provide an RFID electronic tag packaging method and package structure to expand the application range of RFID electronic tags, such as clean room personnel control, leather bag anti-counterfeiting and shoe anti-counterfeiting. In order to achieve the above object, a broader aspect of the present invention provides a method for packaging an electronic label, comprising the steps of: providing a substrate; forming a first polymer resin layer on the substrate; forming an electron a label structure is formed on the first polymer resin layer; a second polymer resin layer is formed on the electronic label structure and the first polymer resin layer; and a fiber material is impregnated into the second polymer resin layer . According to the above concept of the present invention, the electronic tag is an RHD electronic tag. According to the above concept of the present invention, the substrate is made of a paper material or a plastic material. According to the above concept, the step of forming the first polymer resin layer on the substrate is performed by applying the first polymer resin layer to the substrate in a printing process. According to the above concept of the present invention, the step of forming an electronic tag structure further includes an antenna forming step and a flip chip step, wherein the antenna forming step applies a conductive ink to the first polymer resin layer in a printing process. And the flip chip step is to apply an anisotropic conductive paste or a non-conductive paste to the input end of the antenna by a printing process or a pinhole nozzle, and then attach a wafer to the anisotropic conductive Glue or the non-conductive glue. According to the above concept, the first polymer resin layer and the second φ polymer resin layer are each selected from the group consisting of epoxy resin, rubber, silicone rubber and acrylic glue. Preferably, the first polymer resin layer and the second polymer resin layer are both epoxy layers. According to the above concept of the present invention, the fiber material is selected from the group consisting of non-woven fabrics, antistatic fabrics, nylon and resin fibers. Another broad aspect of the present invention provides a package structure for an electronic tag, comprising: a substrate; a first polymer resin layer formed on the substrate; and an electronic tag structure formed on the first a polymer layer on the lipid layer; and a second polymer resin layer formed on the electronic tag structure and the first polymer resin layer, wherein the second polymer resin layer has a fiber material impregnated therein, The package structure of the electronic tag has the functions of washing resistance and bending resistance. In a broader aspect of the present invention, a control method for a dust-free person is provided, which is to sew the above-mentioned electronic label packaging structure into a dust-free garment, and use electronic label technology to achieve control of the clean room personnel. [Embodiment] 8 1361477 Some exemplary embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention is capable of various modifications in various embodiments and is not intended to limit the scope of the invention. Please refer to FIG. 1A-F, which is a schematic diagram of a method for packaging an electronic label according to a preferred embodiment of the present invention, wherein the electronic label is an electronic label of a radio frequency identification (RFID) technology. As shown in FIG. A, the φ electronic label packaging method of the present invention first provides a substrate 11 which can be made of paper material or plastic material, such as polyethylene terephthalate (PET). And forming a first polymer resin layer 12 on the substrate 11, the first polymer resin layer 12 is preferably an epoxy layer, but not limited thereto, and may be other, for example. A polymer resin layer such as rubber, silicone or acrylic. The first polymer resin layer 12 can be applied to the substrate 11 by a printing process, and can of course be formed on the substrate 11 by other means. • The first figure B-D illustrates the step of forming an RFID electronic tag structure on the first polymer resin layer 11. The RFID electronic tag mainly includes an antenna and a wafer structure. Therefore, the method for forming the RFID electronic tag structure includes an antenna forming step and a flip chip step, and the antenna forming step applies a conductive ink 13 to the first high in a printing process. The molecular resin layer 12 (as shown in the first figure B) serves as an antenna structure of the RFID, and the flip chip step firstly applies a colloid 14 such as an anisotropic conductive paste in a printing process or in a pinhole nozzle manner. Or a non-conductive glue is applied to the input end of the antenna (as shown in FIG. C), and a wafer 15 is attached to the anisotropic conductive 1361477% glue or the non-conductive glue (as shown in the first figure). D is shown) to complete the flip chip step. Of course, due to the rapid development of RFID technology, the formation method of the RFID electronic tag structure has various implementation modes, and the main idea of the present case lies in the packaging method of the RFID electronic tag, so the formation method of the RFID electronic tag structure is not limited. In the above embodiments, the method of forming the antenna and completing the flip chip is not deviated from the scope of protection of the present invention. After the RFID tag structure is formed, a second polymer tree φ lipid layer 16 is formed on the chip 15 of the RFID tag structure, the antenna 13 and the first polymer resin layer 12, as shown in FIG. Show. The second polymer resin layer 16 is preferably an epoxy resin layer, but not limited thereto, and may be other polymer resin layers such as rubber, silicone, and acrylic. The second polymer resin layer 16 can be coated on the wafer 15, the antenna 13 and the first polymer resin layer 12 covering the RHD electronic tag structure by, for example, a printing process, but not limited by the printing process. . Finally, a fiber material is impregnated into the second polymer resin layer 16 , and during the impregnation process, the second polymer resin 16 is infiltrated into the fiber material 17 and then subjected to pressure treatment to form the structure. As shown in the first figure F. In some embodiments, the fiber material may be a non-woven fabric, an antistatic cloth, a nylon or a resin fiber, or the like, but is not limited thereto. The RFID electronic label packaging method of the present invention can closely bond the fiber material, the second polymer resin layer, the first polymer resin layer and the substrate, thereby protecting the RFID electronic tag structure such as the antenna and the wafer, thereby avoiding external force. Destruction and failure, and can achieve the bending and washing resistance of the market, 477 effect, so that RFID can be used in high humidity environment, and improve its reliability and service life. Two + other aspects The present case also provides an electronic tag packaging structure, wherein = electronic tag is an RFID electronic tag. As shown in FIG. F, the package structure of the package includes: a substrate n, a first polymer resin layer 12, an electronic tag structure, a second polymer resin layer 16, and an impregnation in the first The fiber material n in the molecular resin layer 16 is obtained. The base material η is made of a material, or a plastic material. The first polymer resin layer 12 is formed on the material 11 and the 5th first south molecular resin layer 12 is preferably an epoxy tree: (epoxy) The layer, but not limited thereto, may be other polymer resin layers such as rubber, enamel: and crepe. The electronic tag structure comprises: an antenna 13 on the Haidiya molecular resin layer 12 and a crystal 15 15 covering the input terminal of the antenna 13 to form a first wire 13, On the wafer 15 and the first polymer resin layer 12, and the molecular resin layer 16 is preferably an epoxy resin layer, but not limited thereto, and the like: other: such as rubber, silicone rubber and acrylic adhesive. Polymer resin layer. In the evening, the second polymer resin layer 16 is impregnated into a non-woven fabric, an antistatic cloth, a nylon or a resin fiber, etc. = Ln Yang's RFID electronic subtraction material is packaged in an electronic Zen card 2: the structure has a bending resistance The effect of folding and washing resistance can be corrected == humidity environment, not only increase trfid electronic standard > 』 read and service life 'enlarged rfid dry circumference. For example, +, electric millennium wear application 5, because the rfid electronic label package structure of this case has 1361477 \ resistance to bending and washing, and with the characteristics of fiber material, the packaged RFID electronic label can be sewn In the dust-free clothing, to control the clean room personnel, and in the dust-free clothing high cleanliness requirements, even if the dust-free clothes are frequently cleaned, and after the washing process, the action of twisting, falling, folding, etc. It will not destroy the structure of the RFID electronic tag, and it can still be read by the reader, so it can achieve the purpose of control of the clean room personnel. What's more, since the RFID electronic tag is sewn in the dust-free clothes, it can be read by the read φ picker within the sensing range, without the need for additional card sensing by the user, and even more in the event of a critical situation. Master the entry and exit of clean room personnel. In order to further test the bending and water-resistant effect of the RFID package structure encapsulated by the RFID electronic label packaging method of the present invention, the unpacked RFID tag and the RFID tag packaged by the package method of the present invention are simultaneously placed. The cleaning is carried out in a clean clothes washing machine, wherein the washing mode comprises washing in warm water of 55 ° C for 1 minute, washing in cold water of 20 ° C for 50 minutes, baking in hot air at 70 ° C for 30 minutes, and at 20 ° C cold φ air bake for 20 minutes. The cleaning result is as shown in the second figure, in which the unpackaged RFID tag 21 is disabled due to wafer detachment, and the antenna line is oxidized and concavely folded, and the packaged RFID tag 22 in the present package has no failure phenomenon and is high. The molecular resin layer did not crack. In addition, the RHD label that has been packaged in the package method of this case can be effectively read after repeated cleaning. Table 1 shows the comparison table between the reading distance and the number of cleaning times of the packaged RHD tag and the unpacked RFID tag in the package method of the present case. It can be seen from the table that the RFID tag completed by the package method in this case is still after 36 times of cleaning. It can be read at the 5m read distance of the original design 12 1361477. In other words, the RFID tag that is packaged by the packaging method of the present invention can effectively resist the folding and immersion in the washing machine, and can effectively resist the baking in the hot air at 70 ° C and the cold air at 20 ° C without being damaged, and is indeed resistant to bending. And the ability to wash. Table group of unpackaged RFID tags Unpackaged RFID tag cleaning times 36 1 Design reading distance 5m 5m Actual reading distance 5m Om Furthermore, the RFID tags that are packaged in this case can also be sewn to leather bags and shoes. Or other leather products, in addition to personnel and logistics control, RFID tags can also be regarded as item IDs for anti-counterfeiting purposes. In addition, the RFID electronic tag packaging method of the present invention can complete a large number of package structures in one process, and then cut into individual RFID electronic tags, which can greatly reduce the packaging cost and increase the yield. In the above, the present invention provides a packaging method and a package structure of an RFID electronic tag, which can make the RFID electronic tag have the advantages of bending resistance and water washing resistance, and can further expand the application range of the RFID electronic tag, such as a clean room. Personnel control, leather bag anti-counterfeiting and shoe anti-counterfeiting, etc. Therefore, the packaging method and package structure of the electronic tag of the present invention have extremely high practicability, and it is an invention of industrial value, and the application is made according to law. 13 1361477 \ This case has been modified by people who are familiar with this technology, but they are all protected as intended.
14 1361477 % 【圖式簡單說明】 第一圖A-F:係為本案較佳實施例之電子標籤之封裝方法 示意圖。 第二圖：係顯示未經封裝之RFID標籤及以本案封裝方法 完成封裝之RFID標籤之清洗結果。 φ 【主要元件符號說明】 11 :基材 12 :第一高分子樹脂層 13 :導電油墨、天線 14 :膠體 15 :晶片 16 :第二高分子樹脂層 17 :纖維材質 • 21 :未經封裝之RFID標籤 22:以本案封裝方法完成封裝之RFID標籤 1514 1361477 % [Simplified description of the drawings] The first figure A-F is a schematic diagram of the packaging method of the electronic tag of the preferred embodiment of the present invention. The second picture shows the cleaning results of the unpackaged RFID tags and the RFID tags that have been packaged in the package method. φ [Description of main component symbols] 11 : Substrate 12 : First polymer resin layer 13 : Conductive ink, antenna 14 : Colloid 15 : Wafer 16: Second polymer resin layer 17 : Fiber material • 21 : Unpackaged RFID tag 22: The RFID tag 15 that is packaged in the package method of the present invention