200950016 九、發明說明： 【發明所屬之技術領域】 本案係關於—種電子標籤之封裝方法及封裝結構，尤 指一種適用於RFID電子標籤之封裝方法及封裝結構。 【先前技術】 無線射頻辨識技術（Radio Frequency Identification，以 ❹下簡稱RFID)之電子標籤（Tag)是指晶片（IC)和天線 所構成的組件通稱，其係使用超高頻（UHF)頻帶（約86〇 〜960MHz )之無線訊號，且搭配專用的讀取器 (reader/writer )就可以從外部讀取或寫入資料。由於RFm 能夠透過無線電訊號識別特定目標並讀取或寫入相關資 料，而無須建立識別系統與特定目標之間的機械或光學接 觸，因此可讓使用者能正確掌握物品的動向，以達成物流 的效率化，因此RFID有逐漸取代傳統的商品條碼及磁卡 φ 的趨勢。 雖然RFID已被大量應用在物料倉儲管理系統上具 有4貝格便且及方便6理之優點’然而其侷限於以標鐵貼^ 之方式來進行，容易因外力造成標籤破損及失效，且無法 應用於其他較為嚴苛的環境下，如在高濕度的環境或水中 容易脫落或氧化而失效。而在門禁及人員進出管制之應用 上，係將RHD標籤封裝於卡片中，然而使用人員仍須主 動持卡感應，當有危急狀況發生時，反而造成不便而無法 確切掌握人員進出之數量。 6 200950016 有鑑於此，本案發明人進一步思量如何改善RFID電 子標籤之封裝方法及封裝結構，以擴大RFID之應用範圍 並提升可靠度。 【發明内容】 本案之主要目的在於提供一種RFID電子標籤之封裝 方法及封裝結構，使RFID電子標籤可應用於高濕度環 境，具有耐彎折及耐水洗之功效。 ❹ 本案之另一目的在於提供一種RFID電子標籤之封裝 方法及封裝結構，以擴大RFID電子標籤之應用範圍，如 無塵室人員管控、皮包防偽及鞋子防偽等等。 為達上述目的，本案之一較廣義實施態樣為提供一種 電子標籤之封裝方法，其係包含下列步驟：提供一基材； 形成一第一高分子樹脂層於該基材上；形成一電子標籤結 構於該第一高分子樹脂層上；形成一第二高分子樹脂層於 該電子標籤結構及該第一高分子樹脂層上；以及以一纖維 材質含浸於該第二高分子樹脂層中。 根據本案上述之構想，該電子標籤係為一 RFID電子 標籤。 根據本案上述之構想，該基材係為紙製材質或塑膠類 材質。 根據本案上述之構想，該形成第一高分子樹脂層於該 基材上之步驟係以印刷製程方式將該第一高分子樹脂層 塗佈於該基材上。 200950016 根據本案上述之構想，該形成電子標籤結構之步驟更 包含一天線形成步驟及一覆晶步驟，其中該天線形成少驟 係以印刷製程方式將—導電油墨塗佈於該第—高分子樹 脂層上，而該覆晶步驟係先以印刷製程或以針孔喷嘴將〆 異方性導電膠或一非導電膠塗佈於該天線之輪入端點，存 將一晶片附著於該異方性導電膠或該非導電膠上。 根據本案上述之構想，該第一高分子樹脂層及該第> ❹高分子樹脂層係分別選自環氧樹脂、橡膠、矽膠及壓克力 膠其中之一。較佳者，該第一高分子樹脂層及該第二高分 子樹脂層皆為環氧樹脂層。 根據本案上述之構想，該纖維材質係選自不織布、防 靜電布、尼龍及樹脂纖維其中之一。 本案之另一較廣義實施樣態為提供一種電子標籤之 封裝結構，其係包含：一基材；一第一高分子樹脂層，形 成於該基材上，·一電子標籤結構，形成於該第一高分子樹 ❹ 知層上；以及一第二高分子樹脂層，形成於該電子標籤結 構及該第一高分子樹脂層上，其中該第二高分子樹脂層具 有含浸於其中之纖維材質’使該電子標籤之封裝結構具有 耐水洗及耐彎折之功效。 本案之又一較廣義實施樣態為提供一種無塵式人員 之管控方法’其係將上述之電子標籤之封裝結構缝入無塵 衣中，並利用電子標籤技術達到無塵室人員之管控。 【實施方式】 8 200950016 體現本案特徵與優點的一些典型實施例將在後段的 說明中詳細敘述。應理解的是本案能夠在不同的態樣上具 有各種的變化，其皆不脫離本案的範圍，且其中的說明及 圖式在本質上係當作說明之用，而非用以限制本案。 請參閱第一圖A-F，其係為本案較佳實施例之電子標 籤之封裝方法示意圖’其中’該電子標籤係為一無線射頻 識別技術（RFID )之電子標籤。如第一圖a所示，本案之 〇 電子標籤之封裝方法係首先提供一基材11，該基材可為紙 製材質或塑耀·類材質’例如聚對苯二曱酸乙烯醋 (Polyethylene terephthalate，PET)’ 並於該基材 η 上形成 —第一高分子樹脂層12,該第一高分子樹脂層12較佳為 環氧樹脂（epoxy)層’但不以此為限，亦可為其他例如橡 膠、石夕膠及墨克力膠等高分子樹脂層。該第一高分子樹月旨 層12可藉由印刷製程方式塗佈於該基材11上，當然亦可 以其他方式形成於該基材11上。 ® 第一圖B-D則說明RFID電子標籤結構形成於該第— 高分子樹脂層11上之步驟。RFID電子標籤主要包含天線 及晶片結構，因此RFID電子標籤結構之形成方法包含— 天線形成步驟及一覆晶步驟，該天線形成步驟係以印刷製 程方式將一導電油墨13塗佈於該第—高分子樹脂層12上 (如第一圖B所示），以作為RFID之天線結構，而該覆晶 步驟則先以印刷製程或以針孔喷嘴方式將一膠體14，例如 —異方性導電膠或一非導電膠，塗佈於該天線之輸入端點 (如第一圖C所示）’再將一晶片15附著於該異方性導電 9 200950016 膠或該非導電膠上（如第一圖D所示），以完成_曰+ 驟。當然’由於RFID技術的快速發展，RFID電子== 構之形成方法亦有各種不同之實施態樣，而本案^ = 想在於RFID電子標籤之封裝方法，因此rfid 結構之形成方法並不受限於上述實施例，只要能形成天= 及元成覆晶之方法皆不脫離本案的保護範圍。 於上述RFID電子標籤結構形成後，一第二高分子樹 ❹脂層Μ接著形成於該RFID電子標籤結構之晶片15、天 線13及該第一高分子樹脂層12上，如第一圖e所示。該 第二高分子樹脂層16較佳為環氡樹脂層，但不以此為限， 亦可為其他例如橡膠、矽膠及壓克力膠等高分子樹脂層。 該第二高分子樹脂層16可藉由例如印刷製程之方式塗佈 覆蓋於該RFID電子標籤結構之晶片15、天線13及該第 一高分子樹脂層12上，但不以該印刷製程為限。 最後，以一纖維材質17含浸於該第二高分子樹脂層 © 16中，在含&過程中，第二尚分子樹脂16會滲透入纖維 材質17中，再施以壓力處理後，所形成之結構如第一圖F 所示。在一些實施例中，該纖維材質可為不織布、防靜電 布、尼龍或樹脂纖維等，但不以此為限。 本案之RFID電子標籤之封裝方法可使得纖維材質、 第二南分子樹脂層、第一高分子樹脂層及基材等緊密結 合，進而保護其中之天線及晶片等RFID電子標籤結構， 避免其受到外力破壞而失效，且可達到耐彎折及耐水洗的 200950016 功效，使RF!D可應祕高減環境，並提高其可靠度及 使用壽命。 另-方面，本案亦提供一電子標藏之封装結構，其中 該電子標籤係為-RFID電子標籤。如第―圖f所示，該 電子標籤之封裝結構包含〜基材u、—第—高分子樹脂層 12、-電子標籤結構、1二高分子樹脂^ 16及含浸於 ❹200950016 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a packaging method and a package structure of an electronic tag, and more particularly to a packaging method and a package structure suitable for an RFID electronic tag. [Prior Art] The RFID tag (Radio Frequency Identification, referred to as RFID) is a generic term for a component composed of a chip (IC) and an antenna, which uses an ultra high frequency (UHF) band ( A wireless signal of about 86 〇 to 960 MHz can be read or written from the outside with a dedicated reader (writer/writer). Since RFm can identify specific targets and read or write relevant data through radio signals without establishing mechanical or optical contact between the recognition system and a specific target, the user can correctly grasp the movement of the items to achieve logistics. Efficiency, so RFID has gradually replaced the trend of traditional commodity barcodes and magnetic cards φ. Although RFID has been widely used in the material storage management system, it has the advantage of being 4 bergs and convenient. However, it is limited to the method of labeling iron. It is easy to cause damage and failure of the label due to external force. It can be used in other harsh environments, such as in high humidity environment or water, it is easy to fall off or oxidize and fail. In the application of access control and personnel access control, the RHD label is packaged in the card. However, the user still needs to actively carry the card sensor. When a critical situation occurs, it is inconvenient and cannot accurately grasp the number of personnel entering and leaving. 6 200950016 In view of this, the inventor of the present invention further considered how to improve the packaging method and package structure of the RFID electronic tag to expand the application range of RFID and improve the reliability. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide a packaging method and a package structure of an RFID electronic tag, so that the RFID electronic tag can be applied to a high-humidity environment, and has the advantages of bending resistance and water washing resistance.另一 Another purpose of this case is to provide an RFID electronic tag packaging method and package structure to expand the application range of RFID electronic tags, such as clean room personnel control, leather bag anti-counterfeiting and shoe anti-counterfeiting. In order to achieve the above object, a broader aspect of the present invention provides a method for packaging an electronic label, comprising the steps of: providing a substrate; forming a first polymer resin layer on the substrate; forming an electron a label structure is formed on the first polymer resin layer; a second polymer resin layer is formed on the electronic label structure and the first polymer resin layer; and a fiber material is impregnated into the second polymer resin layer . According to the above concept of the present invention, the electronic tag is an RFID electronic tag. According to the above concept of the present invention, the substrate is made of a paper material or a plastic material. According to the above concept, the step of forming the first polymer resin layer on the substrate is performed by applying the first polymer resin layer to the substrate in a printing process. According to the above concept of the present invention, the step of forming an electronic tag structure further includes an antenna forming step and a flip chip step, wherein the antenna forms a small number of processes to apply a conductive ink to the first polymer resin in a printing process. On the layer, the flip chip step is first applied to the rounding end of the antenna by a printing process or a pinhole nozzle to apply an anisotropic conductive paste or a non-conductive paste to the wafer. Conductive adhesive or the non-conductive adhesive. According to the above concept, the first polymer resin layer and the & ❹ polymer resin layer are each selected from the group consisting of epoxy resin, rubber, silicone rubber and acrylic rubber. Preferably, the first polymer resin layer and the second polymer resin layer are both epoxy layers. According to the above concept of the present invention, the fiber material is selected from the group consisting of non-woven fabrics, antistatic fabrics, nylon and resin fibers. Another broad aspect of the present invention provides a package structure for an electronic tag, comprising: a substrate; a first polymer resin layer formed on the substrate, an electronic tag structure formed on the substrate a first polymer tree layer; and a second polymer resin layer formed on the electronic tag structure and the first polymer resin layer, wherein the second polymer resin layer has a fiber material impregnated therein 'The package structure of the electronic tag is resistant to washing and bending. In a broader aspect of the present invention, a control method for a dust-free person is provided, which sews the above-mentioned electronic label packaging structure into a dust-free garment, and uses electronic label technology to achieve control of the clean room personnel. [Embodiment] 8 200950016 Some exemplary embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention is capable of various modifications in various embodiments and is not intended to limit the scope of the invention. Please refer to the first figure A-F, which is a schematic diagram of the packaging method of the electronic label of the preferred embodiment of the present invention. The electronic label is an electronic tag of a radio frequency identification (RFID) technology. As shown in the first figure a, the packaging method of the electronic label in the present case first provides a substrate 11 which can be a paper material or a plastic material such as polyethylene terephthalate (Polyethylene). Terephthalate, PET)' and forming a first polymer resin layer 12 on the substrate η, the first polymer resin layer 12 is preferably an epoxy layer 'but not limited thereto, It is a polymer resin layer such as rubber, shijiao and acryl glue. The first polymer tree layer 12 can be applied to the substrate 11 by a printing process, and can of course be formed on the substrate 11 by other means. ® Figure B-D shows the step of forming an RFID electronic tag structure on the first polymer layer 11. The RFID electronic tag mainly includes an antenna and a wafer structure. Therefore, the method for forming the RFID electronic tag structure includes an antenna forming step and a flip chip step, and the antenna forming step applies a conductive ink 13 to the first high in a printing process. The molecular resin layer 12 (as shown in the first figure B) serves as an antenna structure of the RFID, and the flip chip step first applies a colloid 14 by a printing process or a pinhole nozzle, for example, an anisotropic conductive adhesive. Or a non-conductive adhesive, applied to the input end of the antenna (as shown in FIG. C), and then attaching a wafer 15 to the anisotropic conductive 9 200950016 glue or the non-conductive adhesive (as shown in the first figure) D is shown) to complete _曰+. Of course, due to the rapid development of RFID technology, there are various implementation methods for the formation of RFID electronic==, and this case ^ = I want to encapsulate the RFID electronic tag, so the formation of the rfid structure is not limited. In the above embodiments, as long as the method of forming the sky = and the element is formed, the method of the present invention does not deviate from the scope of protection of the present invention. After the RFID electronic tag structure is formed, a second polymer resin layer is formed on the wafer 15 of the RFID electronic tag structure, the antenna 13 and the first polymer resin layer 12, as shown in FIG. Show. The second polymer resin layer 16 is preferably a cyclic resin layer, but not limited thereto, and may be other polymer resin layers such as rubber, silicone, and acrylic. The second polymer resin layer 16 can be coated on the wafer 15, the antenna 13 and the first polymer resin layer 12 of the RFID electronic tag structure by, for example, a printing process, but not limited by the printing process. . Finally, a fiber material 17 is impregnated into the second polymer resin layer 16 , and during the process of containing & the second molecular resin 16 penetrates into the fiber material 17 and is subjected to pressure treatment. The structure is as shown in the first figure F. In some embodiments, the fiber material may be a non-woven fabric, an antistatic cloth, a nylon or a resin fiber, or the like, but is not limited thereto. The RFID electronic label packaging method of the present invention can tightly combine the fiber material, the second south molecular resin layer, the first polymer resin layer and the substrate, thereby protecting the RFID electronic tag structure such as the antenna and the wafer, thereby avoiding the external force. Destruction and failure, and can achieve the bending and washing resistance of 200950016, so that RF!D can reduce the environment and improve its reliability and service life. In another aspect, the present invention also provides an electronic tag package structure, wherein the electronic tag is an RFID tag. As shown in Fig. f, the package structure of the electronic tag comprises a substrate u, a first polymer resin layer 12, an electron tag structure, a polymer resin 16 and an impregnation layer.
該第二高分子樹脂層16中之纖維材f 17。該基材u係為 紙製材質或塑膠類材質’該第一高分子樹脂層12係形成 於該基材11上’且該第-高分子樹脂層12較佳為環氣樹 脂（epoxy)層，但不以此為限，亦可為其他例如橡膠、矽 膠及壓克力膠等高分子樹脂層。該電子標籤結構包含形成 於該第一高分子樹脂層12上之天線13及覆蓋於該天線13 之輸入端點上之晶片15。該第二高分子樹脂層16係形成 於該天線13、晶片15及該第一高分子樹脂層12上，且診 第二咼分子樹脂層16較佳為環氧樹脂層，但不以此為限 亦可為其他例如橡膠、矽膠及壓克力膠等高分子樹脂層。 此外’該含浸於該第二高分子樹脂層16中之纖維材質 可為不織布、防靜電布、尼龍或樹脂纖維等，但不以此 限。 ‘、、、 由於利用本案之RFID電子標籤之封裝方法所封较$ 成之RFID封裝結構具有耐彎折及耐水洗的功效，使 電子標籤可應用於高濕度環境，不但増加了 RFid電子枳 籤之可靠度及使用壽命，更擴大了 RFID電子標籤之應^ 範圍。舉例而言，由於本案之RFID電子標籤封裝結才誇具The fiber material f 17 in the second polymer resin layer 16. The substrate u is a paper material or a plastic material. The first polymer resin layer 12 is formed on the substrate 11 and the first polymer resin layer 12 is preferably an epoxy layer. However, it is not limited thereto, and may be other polymer resin layers such as rubber, silicone and acrylic. The electronic tag structure includes an antenna 13 formed on the first polymer resin layer 12 and a wafer 15 covering the input end of the antenna 13. The second polymer resin layer 16 is formed on the antenna 13, the wafer 15 and the first polymer resin layer 12, and the second molecular layer resin layer 16 is preferably an epoxy resin layer, but this is not It may also be other polymer resin layers such as rubber, silicone and acrylic. Further, the fiber material impregnated in the second polymer resin layer 16 may be a nonwoven fabric, an antistatic cloth, a nylon or a resin fiber, etc., but is not limited thereto. ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The reliability and service life have further expanded the range of RFID electronic tags. For example, because the RFID electronic tag package in this case is a boast
II 200950016 有τ 洗的功效’同時配合纖維材質之特性，可 將封裝完成之RFID電子標籤縫製於無塵衣中，以進行: 塵室人員之管控，且在無塵衣高潔淨度之要求下 頻 繁的清洗無塵衣，並在洗衣過程 頻 作，也不會破壞RFID電子標籤^ τ、摔、揉折等動 讀取，故可達到無塵室人員管控戴之之目；^仍能被讀取器所II 200950016 has the effect of τ washing. At the same time, with the characteristics of fiber material, the packaged RFID electronic label can be sewn into the dust-free clothing to carry out: control of the dust room personnel, and under the requirement of high cleanliness of dust-free clothes Frequent cleaning of dust-free clothes, and frequent in the washing process, will not damage the RFID electronic tags ^ τ, falls, smashing, etc., so that it can be controlled by the clean room personnel; ^ can still be Reader
電子標籤係缝製在無塵衣中，。要 I者’^RFID ❹ Ο /、聲在感應範圍内即可被 取’而無需由使用人員另外持卡感應，在危 發生時，更能掌握無塵室人員之進出。 為=-步測試利用本案之RFID電子標鐵之封裝方法 所封裝完叙RFID封裝結構之耐彎折及耐水洗的功效， 兹將未經封裝之RFID標籤相杨封裝方法完成封裝之 RFID標籤㈣置人無塵衣洗衣機巾進行清洗其中該主 洗模式包括於55。(：溫水中洗n分鐘，於賊冷水中= 務50分鐘，於贼熱風下供烤3〇分鐘，以及於耽冷 風下烘烤20分鐘。清洗結果如第二圖所示，其中未經封 裝之RFID標籤21因晶>}脫落造成失效，且天線線路發生 氧化及凹折，而以本案封裝方法完成封裝之RFID標籤22 則無失效現象，且高分子樹脂層未發生裂痕。 另外，以本案封裝方法完成封裝之RFID標籤在經過 多次重複清洗後，仍能有效被讀取。表一顯示以本案封裝 方法完成封裝之RFID標籤及未經封裝之RFID標籤之讀 取距離與清洗次數的對照表，從表中可知，以本案封裝方 法完成封裝之R FID標籤在清洗3 6次後依然可以在原設計 12 200950016 之5m讀取距離下被讀取。換言之，、 封裝之RFID標籤可以有效抵抗在^^^案封裝方法定戍 泡，亦可有效抵抗在熱風7(TC及冷風^機中的揉折及燙 破壞，確實具有耐彎折及耐水洗的功敦2。〇<：之烘烤而不焚 表一 組別 經封裝之RFID^ 清洗次數 36 〜 設計讀取距離 5m 實際讀取距離 ~^〜 之 RFID 標 織The electronic label is sewn in a dust-free garment. If you want to use the device, you can get the sound in the sensing range without the need for the card to be sensed by the user. In the event of a crisis, you can get in and out of the clean room personnel. For the =-step test, the RFID electronic standard package method of the present invention is used to encapsulate the anti-bending and water-washing effect of the RFID package structure, and the unpackaged RFID tag phase Yang packaging method is used to complete the packaged RFID tag (4) The washing machine towel is cleaned and the main washing mode is included at 55. (: Wash in warm water for n minutes, in cold water of thief = 50 minutes, bake for 3 minutes under hot air of thief, and bake for 20 minutes under cold air. The cleaning result is shown in the second figure, where it is not packaged. The RFID tag 21 is ineffective due to the falling off of the crystal, and the antenna line is oxidized and concavely folded, and the RFID tag 22 which is packaged by the packaging method of the present invention has no failure phenomenon, and the polymer resin layer is not cracked. The packaged RFID tag in this case can be effectively read after repeated cleaning. Table 1 shows the reading distance and cleaning times of the packaged RFID tag and the unpackaged RFID tag in the package method of this case. According to the comparison table, it can be seen from the table that the R FID label that has been packaged by the packaging method of the present invention can still be read after the cleaning of 36 times of the original design 12 200950016. In other words, the packaged RFID tag can effectively resist In the ^^^ case packaging method, the foam can also effectively resist the collapse and hot damage in the hot air 7 (TC and cold air machine), and it has the resistance to bending and washing. 2 〇 <: Baking without burning Table 1 Group Packed RFID^ Cleaning times 36 ~ Design reading distance 5m Actual reading distance ~^~ RFID marking
再者，以本案封裝方法完成封裝之奸1〇標藏亦可縫 製於皮包、鞋子或其他皮革製品’除用作人員及物流管控 外，亦可將RHD標籤視作物品身份證，達到防偽之目的。 此外’本案之RHD電子標籤之封裝方法可在一次製 程中完成大量之封裝結構，再裁切成個別之RFm電子標 籤，亦可大大降低封裝成本及增進產率。 下 縱上所述，本案係提供-種RFm電子標籤之封裝方 法及封裝賴’可使RFID電作㈣㈣彎折及耐水洗 之功效’且可進-步擴大RFID電子標籤之應用範圍，如 無塵室人S管控、皮包防偽及鞋子防偽料。因此，本案 之電子標籤之封裝方法及封裝結構具有極高之實用性，實 為一具產業價值之發明，爰依法提出申請。 只 13 200950016 本案得由熟知此技術之人士任施匠思而為諸般修 飾，然皆不脫如附申請專利範圍所欲保護者。In addition, the packaging of the package can be sewn to leather bags, shoes or other leather products. In addition to being used for personnel and logistics control, the RHD label can also be regarded as an item ID card to achieve anti-counterfeiting. purpose. In addition, the RHD electronic label packaging method in this case can complete a large number of package structures in one process, and then cut into individual RFm electronic labels, which can greatly reduce the packaging cost and increase the yield. As described above, the present invention provides a method for packaging RFm electronic tags and a package that can enable RFID (4) (4) bending and washing resistance, and can further expand the application range of RFID electronic tags, if none Dust room people S control, leather bag anti-counterfeiting and shoes anti-counterfeiting materials. Therefore, the packaging method and package structure of the electronic tag of the present invention have extremely high practicability, and it is an invention of industrial value, and the application is made according to law. Only 13 200950016 This case has been modified by people who are familiar with this technology, but it is not to be protected as claimed.
14 200950016 【圖式簡單說明】 第一圖A-F :係為本案較佳實施例之電子標籤之封裝方法 示意圖。 第二圖：係顯示未經封裝之RFID標籤及以本案封裝方法 完成封裝之RFID標戴之清洗結果。 f| 【主要元件符號說明】 11 :基材 12 :第一高分子樹脂層 13 .導電油墨、天線 14 :膠體 15 :晶片 16 :第二高分子樹脂層 17 :纖維材質 ❹ 21 :未經封裝之RFID標籤 22:以本案封裝方法完成封裝之RFID標籤 1514 200950016 [Simple description of the drawings] The first figure A-F is a schematic diagram of the packaging method of the electronic tag of the preferred embodiment of the present invention. The second figure shows the results of the cleaning of the unlabeled RFID tag and the RFID tag that is packaged in the package. f| [Main component symbol description] 11 : Substrate 12 : First polymer resin layer 13 . Conductive ink, antenna 14 : Colloid 15 : Wafer 16 : Second polymer resin layer 17 : Fiber material ❹ 21 : Not packaged RFID tag 22: The RFID tag 15 is packaged in the package method of the present invention.