JP2001066990A - Protective filter and protection method of ic tag - Google Patents

Protective filter and protection method of ic tag

Info

Publication number
JP2001066990A
JP2001066990A JP24426699A JP24426699A JP2001066990A JP 2001066990 A JP2001066990 A JP 2001066990A JP 24426699 A JP24426699 A JP 24426699A JP 24426699 A JP24426699 A JP 24426699A JP 2001066990 A JP2001066990 A JP 2001066990A
Authority
JP
Japan
Prior art keywords
ic tag
protective film
tag
ic
protection method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24426699A
Other languages
Japanese (ja)
Inventor
Arihiro Kaneda
Junji Tanaka
Masaru Yoshida
優 吉田
順二 田中
有弘 金田
Original Assignee
Sumitomo Bakelite Co Ltd
住友ベークライト株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd, 住友ベークライト株式会社 filed Critical Sumitomo Bakelite Co Ltd
Priority to JP24426699A priority Critical patent/JP2001066990A/en
Publication of JP2001066990A publication Critical patent/JP2001066990A/en
Application status is Pending legal-status Critical

Links

Abstract

PROBLEM TO BE SOLVED: To provide a protective film which is excellent in heat resistance, water resistance and solvent resistance for the purpose of protection of an IC tag and a protection method therefor.
SOLUTION: The protective film 2 for protecting the tag for management (IC tag 1) packaged with an IC readable without contact is formed of a polyether ether ketone (PEEK), polyether sulfone (PES), polyether imide (PEI), polysulfone (PSF), polyamide (PA), polyimide (PI), polyamide amide (PAI) or polytetrafluoroethylene (PTFE) material.
COPYRIGHT: (C)2001,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、例えばクリーニングやレンタルユニフォームなどの管理を目的として使用される非接触型のICタグを保護する材料及び保護方法に関する。 The present invention relates to relates to, for example, materials and protection method for protecting a non-contact type IC tag used for the purpose of management, such as cleaning and rental uniforms.

【0002】 [0002]

【従来の技術】近年、非接触型のICカードやICタグが普及してきており、情報や製品の個別管理に活用されている。 In recent years, IC card and IC tag of the non-contact type are becoming popular, are utilized in the individual management of information and products. 特に非接触型のICタグは大幅なコストダウンにより広い範囲でその用途を検討されているが、クリーニングやレンタルユニフォームなどの管理を目的とした用途もその一つである。 In particular IC tag of the non-contact type it is considering its use in a wide range by significant cost reduction, but applications for the purpose of management of the cleaning and rental uniforms is one of them.

【0003】従来のレンタルユニフォームでは、バーコードの印刷されたタグを貼り付けて使用頻度など個別の管理を行っていたが、バーコードをいちいち読み取る作業を行うことは実際には難しく、決められたクリーニング回数又は使用期間に満たないものが消却されることがあるなど、製品の管理が不安定であった。 [0003] In the conventional rental uniforms, it had carried out the bar code printed tag pasted to the individual, such as the use frequency management of, to perform the task of reading a bar code one by one is actually difficult, was determined etc. may those less than the number of times of cleaning or use period is canceled, the management of the product was unstable.

【0004】従って上記用途に非接触型のICタグを使用することは、読み取り作業の効率も良く非常に有用である。 [0004] Therefore the use of IC tag of the non-contact with the application is very useful may effectively read operations. しかしその用途上、常に衣服に貼り付いていなければならないため、クリーニングの際の熱、水、溶剤及び圧力が繰り返し加わってくることになり、ICタグが正常に作動しなくなる恐れが非常に大きかった。 But its application, because it is always must be stuck to clothes, heat at the time of cleaning, water, will be solvent and pressure comes applied repeatedly, a possibility that the IC tag can not operate normally was very large .

【0005】ICタグの構造は、アンテナの形成されたPET等のフレキシブルな基板上にICが実装されており、接着剤を介して保護フィルムが貼り合わされているため、水や溶剤などに浸かると接着界面から浸漬して故障の原因になったり、熱が直接タグにかかるためそこでも故障の原因になっていた。 [0005] Structure of the IC tag is an IC is implemented on a flexible substrate of PET or the like formed of an antenna, since the protective film via an adhesive is bonded, when soaked in water or a solvent or the cause of the failure was immersed from the bonding interface, the heat had caused the failure, even there it takes to tag directly.

【0006】 [0006]

【発明が解決しようとする課題】本発明の目的は、IC An object of the present invention is to solve the above, IC
タグの保護のため、耐熱性、耐水性及び耐溶剤性に優れた保護フィルム及び保護方法を提供することにある。 For the protection of the tag is to provide a protective film and protection method excellent in heat resistance, water resistance and solvent resistance.

【0007】 [0007]

【課題を解決するための手段】本発明は、非接触で読み取り可能なICを実装した管理用タグ(ICタグ)を保護する保護フィルムであって、該保護フィルムがポリエーテルエーテルケトン(PEEK)、ポリエーテルサルフォン(PES)、ポリエーテルイミド(PEI)、ポリサルフォン(PSF)、ポリアミド(PA)、ポリイミド(PI)、ポリアミドイミド(PAI)、又はポリテトラフロロエチレン(PTFE)材で形成されているICタグの保護フィルムである。 The present invention SUMMARY OF] is a protective film for protecting the tag management implement readable IC in a non-contact (IC tag), the protective film is polyetheretherketone (PEEK) , polyether sulfone (PES), polyetherimide (PEI), polysulfone (PSF), polyamide (PA), polyimide (PI), polyamideimide (PAI), or formed of polytetrafluoroethylene (PTFE) material a protective film of the IC tag you are. 更に本発明は、上記保護フィルムにより小袋を形成し、その中にICタグを挿入後、密封するICタグの保護方法である。 The present invention forms a pouch with the protective film, after insertion of the IC tag therein, a method of protecting IC tag sealed.

【0008】 [0008]

【発明の実施の形態】本発明に使用する保護フィルムとしては、熱可塑性の樹脂で耐熱性及び耐薬品性に優れた樹脂が適しており、ポリエーテルエーテルケトン(PE The protective film used in the Detailed Description of the Invention The present invention is suitable heat resistance and chemical resistance to a resin excellent in thermoplastic resins, polyether ether ketone (PE
EK)、ポリエーテルサルフォン(PES)、ポリエーテルイミド(PEI)、ポリサルフォン(PSF)、ポリアミド(PA)、ポリイミド(PI)、ポリアミドイミド(PAI)、又はポリテトラフロロエチレン(PT EK), polyether sulfone (PES), polyetherimide (PEI), polysulfone (PSF), polyamide (PA), polyimide (PI), polyamideimide (PAI), or polytetrafluoroethylene (PT
FE)材である。 FE) is a material.

【0009】本発明のICタグの保護方法としては、I [0009] As a method of protection IC tag of the present invention is, I
Cタグより一回り大きい上下2枚の保護フィルムを4方で熱溶着して密封しても良いし、半折した保護フィルムにICタグを挟み3方を熱溶着して密封しても良い。 It large upper and lower protective films slightly from C tag may be sealed by thermal welding with four sides may be a three-way clamp the IC tag to the protective films Han'ori sealed by heat welding.

【0010】本発明では、耐熱性、耐水性及び耐溶剤性に優れた熱可塑性のプラスチックフィルムを熱溶着等の方法で外装袋を予め形成し、その中へICタグを挿入後密封する事が好ましい。 [0010] In the present invention, heat resistance, a plastic film of a thermoplastic having excellent water resistance and solvent resistance of the protective bag preformed by a method such as thermal welding, is possible to seal after insertion of the IC tag into the preferable.

【0011】上記手段により、クリーニング又はレンタルユニフォームの管理に使用するICタグを熱、水及び溶剤から守り、ICタグの長寿命化の実現を可能にすることができる。 [0011] By the above means, protect IC tag used to manage the cleaning or rental Uniform heat, water and solvent, it is possible to allow the realization of long life of the IC tag. クリーニング時にかかる条件としては、 As the conditions applied at the time of cleaning,
洗濯時に70℃の温水に数分、乾燥時に180℃で10 A few minutes in hot water at 70 ° C. during the washing, at 180 ° C. during the drying 10
分、プレス時に200℃で5〜10分程度が考えられる。 Minute, about 5 to 10 minutes at 200 ℃ at the time of press is considered.

【0013】又、クリーニング時の溶剤としては、塩素系、フロン系等のが挙げられるが、本発明の保護フィルムによりICタグが直接溶剤に触れることを防ぐ。 [0013] As the solvent during the cleaning, chlorine, including but the freon and the like, prevent the IC tag is exposed to the solvent directly by the protective film of the present invention.

【0014】 [0014]

【実施例】以下に本発明の実施例について図面を参照しながら説明する。 Be described with reference to the accompanying drawings embodiments of the present invention to EXAMPLES below. 本発明は実施例により、特に限定されるものではない。 The present invention embodiments are not limited in particular. 図1は本発明の第1の実施例における非接触型ICタグの保護形態である。 Figure 1 is a protected form of a non-contact IC tag according to a first embodiment of the present invention. ICタグ1は保護フィルム2を熱溶着シールにより溶着シール部3を形成することにより密封包装されており、外部からの水や溶剤などがICタグに直接触れないように保護している。 IC tag 1 is hermetically sealed package by forming a welded seal portion 3 by thermal welding seal protective film 2, such as water or solvents from the outside are protected against direct contact with the IC tag.
保護フィルム2としては、熱可塑性の樹脂で耐熱性及び耐薬品性に優れたポリエーテルエーテルケトン(PEE The protective film 2, a thermoplastic resin with heat resistance and chemical resistance excellent polyetheretherketone (PEE
K)を使用する。 Using the K). 包装方法としては、ICタグより一回り大きい上下2枚の保護フィルムを4方で熱溶着して密封する。 As a packaging method will be sealed by heat welding the large upper and lower protective films slightly from the IC tag 4-way.

【0015】図2は本発明の第2の実施例における非接触型ICタグの保護形態である。 [0015] FIG. 2 is a protected form of a non-contact IC tag according to a second embodiment of the present invention. ICタグ1は保護フィルム2を熱溶着シールにより溶着シール部3を形成することにより密封包装されており、外部からの水や溶剤などがICタグに直接触れないように保護している。 IC tag 1 is hermetically sealed package by forming a welded seal portion 3 by thermal welding seal protective film 2, such as water or solvents from the outside are protected against direct contact with the IC tag. 保護フィルム2としては、熱可塑性の樹脂で耐熱性及び耐薬品性に優れたポリエーテルエーテルケトン(PEEK) The protective film 2, a thermoplastic resin with heat resistance and chemical resistance excellent polyetheretherketone (PEEK)
を使用する。 To use. 包装方法としては、ICタグより一回り大きい半折した保護フィルムにICタグを挟み3方を熱溶着して密封する。 As a packaging method, a three-way clamp the IC tag to the protective film that is half folded slightly larger than the IC tag sealed by heat welding.

【0016】 [0016]

【発明の効果】本発明によれば、ICタグを熱可塑性の樹脂で耐熱性及び耐薬品性に優れたプラスチックフィルムで密封することにより、ICタグをクリーニング時の水や溶剤から保護し、熱伝導も緩和させることで、IC According to the present invention, the IC tag by sealing a plastic film having excellent heat resistance and chemical resistance of a thermoplastic resin, to protect the IC tag from the cleaning when water or a solvent, heat conductivity also be alleviated, IC
タグの長寿命化を達成させたため、ICタグの信頼性が向上する。 Since was achieved a long life of the tag, the reliability of the IC tag is improved.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】 本発明のICタグの保護形態の第1の実施例 The first embodiment of the protected form of the IC tag of the present invention; FIG

【図2】 本発明のICタグの保護形態の第2の実施例 Second embodiment of the protected form of the IC tag of the present invention; FIG

【符号の説明】 DESCRIPTION OF SYMBOLS

1 非接触型ICタグ 2 保護フィルム 3 溶着シール部 1 the non-contact type IC tag 2 protective film 3 welded seal portion

Claims (2)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 非接触で読み取り可能なICを実装した管理用タグ(ICタグ)を保護する保護フィルムであって、該保護フィルムがポリエーテルエーテルケトン(P 1. A protective film for protecting the tag management implement readable IC in a non-contact (IC tag), the protective film is polyether ether ketone (P
    EEK)、ポリエーテルサルフォン(PES)、ポリエーテルイミド(PEI)、ポリサルフォン(PSF)、 EEK), polyether sulfone (PES), polyetherimide (PEI), polysulfone (PSF),
    ポリアミド(PA)、ポリイミド(PI)、ポリアミドイミド(PAI)、又はポリテトラフロロエチレン(P Polyamide (PA), polyimide (PI), polyamideimide (PAI), or polytetrafluoroethylene (P
    TFE)材で形成されていることを特徴とするICタグの保護フィルム。 Protective film of an IC tag which is characterized in that it is formed by TFE) material.
  2. 【請求項2】 請求項1記載の保護フィルムにより小袋を形成し、その中にICタグを挿入後、密封することを特徴とするICタグの保護方法。 2. A method according to claim 1 to form a pouch with a protective film according, the method of the protection IC tag, wherein the insertion post, sealing the IC tag therein.
JP24426699A 1999-08-31 1999-08-31 Protective filter and protection method of ic tag Pending JP2001066990A (en)

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JP2002297040A (en) * 2001-03-30 2002-10-09 Kawanishi Co Ltd Ic chip tag
JP2005304348A (en) * 2004-04-19 2005-11-04 Dainippon Printing Co Ltd Management label using ic tag and management system of gardening article and tree
JP2005316718A (en) * 2004-04-28 2005-11-10 Art Weld Co Ltd Production method for ic tag
JP2007148735A (en) * 2005-11-28 2007-06-14 Hasegawa Kagaku Kogyo Kk Ic tag
US7821398B2 (en) 2007-05-29 2010-10-26 Fujitsu Limited RFID tag and method of manufacturing RFID tag
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
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US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US8960561B2 (en) 2011-02-28 2015-02-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8960557B2 (en) 2008-05-21 2015-02-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
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