JPH01136792A - Ic card - Google Patents

Abstract

PURPOSE: To protect an over sheet against cracking by providing a reinforcing sheet for the basic material of card beneath an IC card module disposed therein. CONSTITUTION: A first over sheet 21, a core sheet 22 having a printed matter 24, and a second over sheet 23 having a reinforcing sheet 26 and a printed matter 25 are laminated sequentially and hot pressed to produce the basic material 20 of card. A recess 27 of specified shape and size is then made in the basic material 20 of card. An adhesive layer 16 is provided on the bottom face of the recess 27 and an IC module 10 is inserted into the recess 27. Only the surface of an external terminal 12 is then hot pressed by means of a hot stamper and the IC module 10 is bonded to the recess 27 thus obtaining an IC card. Since a reinforcing sheet 26 is provided beneath the IC card module 10 in the basic material 20 of card, strength of the basic material 20, especially of the second over sheet 23, is enhanced and cracking is prevented. Furthermore, the IC module 10 is protected against removal from the recess 27 in the basic material 20.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an IC card equipped with an IC module, and more particularly to an IC card with increased strength.

(Prior Art) In recent years, various studies have been conducted on cards called chip cards, memory cards, microcomputer cards, or electronic cards (hereinafter simply referred to as IC cards) equipped with IC modules having IC chips such as microcomputers and memories. ing.

Compared to conventional magnetic cards, such IC cards have
Because of their large storage capacity, banks are considering using them to replace savings passbooks with the history of deposits and savings, and credit cards are considering storing the history of transactions such as shopping.

Such an IC card usually has an I
It is constructed by mounting the C module in a recessed part of a card base material made of synthetic resin.

Among these, the IC module has an external terminal provided on one side of the support, an IC chip mounted on the other side, and the necessary wiring connected to the external terminal via a circuit button (not shown). , is constructed by resin molding around the IC chip.

On the other hand, the card base material is constructed by laminating oversheets on both sides of a core sheet and press laminating them.

(Problems to be Solved by the Invention) As mentioned above, an IC card is constructed by mounting an IC module having an IC chip into a recess in a synthetic resin card base material. There may be some effects. If this bending action is strong, cracks may appear in the oversheet on the lower surface of the IC module, and the card base material may bend significantly, causing the IC module to fall off from all four parts.

In such a case, it is advantageous to be able to increase the strength of the card base material, as this will prevent the oversheet from cracking and the IC module from falling off.

The present invention has been made in consideration of these points,
An object of the present invention is to provide an IC card that can increase the strength of the card base material.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides an IC module having an IC chip, and an IC module having an IC chip.
An IC card comprising a synthetic resin card base material having four parts to which a C module is attached, and a reinforcing sheet for reinforcing the strength of the card base material is provided below the IC module in the card base material. It is characterized by

(Function) Since a reinforcing sheet is provided inside the card base material to reinforce the strength of the card base material, even if bending action is applied to the IC card, the card base material will not be significantly deformed, and the card base material will not be significantly deformed. The shear strength of the material also increases.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

1 and 2 are diagrams showing a first embodiment of an IC card according to the present invention. In Figures 1 and 2,
Support body 11 made of a material with excellent flexibility and strength
An external terminal 12 is provided by patterning on one surface of a material (for example, glass epoxy, glass BT resin, polyimide, etc.). Further, an IC chip 13 is mounted on the other surface of the support 11, and necessary wiring is performed between the IC chip 13 and the external terminal 12 via a circuit button (not shown) using a bonding wire 14. Furthermore, the periphery of the wiring section including the IC chip 13 and the bonding wires 14 is resin-molded with a molding resin to form a resin mold section 15, thus configuring the IC module 10. This resin mold part 15
covers the entire surface of the support 11. In this case, the resin molding is preferably carried out by the trasins far molding method, and the dimensions and shape of the resin molded part 15 are
It is determined appropriately according to the C chip 13 and the card base material 20 described later.

Further, as shown in FIG. 4, the IC module 10 may have a structure having a sealing frame 18 of the same size as the support body 11.

On the other hand, the card base material 20 is made by laminating a first oversheet 21 with a thickness of about 0.1 mm and a second oversheet 23 with a thickness of about 0.1 mm on both sides of a core sheet 22 with a thickness of about 0.6+++e, and press laminating them. It is composed of: This card base material 2o is made of ABS resin, polyester, polypropylene, styrene resin, vinyl chloride, acrylic, polycarbonate, polyester, vinyl chloride/
It is made of synthetic resin such as vinyl acetate copolymer. In this case, by forming the second oversheet 23 with an opaque material, it is possible to prevent the IC module 10 from appearing on the back side of the card base material 2o.

Further, a recess 27 for mounting the IC module 1° is formed in the card base material 2o. The four parts 27 are slightly larger than the IC module 1o (0.05 to 0.0
．． (about 1mm width).

Further, a reinforcing sheet 26 is interposed between the core sheet 22 and the second oversheet 23 of the card base material 2o.

The material and shape of the reinforcing sheet 26 to be laid are not particularly limited as long as it imparts the above-mentioned mechanical strength and flexibility to the IC card. A mesh layer consisting of a shaped sheet, a non-woven fabric,
It can be composed of a continuous sheet, rubber, thermoplastic elastomer, rubber adhesive layer, adhesive tape, etc.

(+) Mesh-like sheet It can be composed of a mesh-like knitted fabric or a porous sheet, and its material is nylon (nylon 66, nylon 6, nylon 11, nylon 610, nylon 4, nylon 7, nylon 9, nylon 12). ), polyester, acrylic, vinylon, rayon, polypropylene,
Polyvinylidene chloride, polyethylene, polyvinylidene chloride, polyurea, polystyrene, polyurethane,
Synthetic fibers such as polyfluoroethylene (Teflon), cellulose fibers such as acetate, triacetate, and ethyl cellulose, semi-synthetic fibers such as chlorinated rubber and hydrochloric acid rubber, wool, cotton,
Natural fibers such as silk, glass fibers, carbon fibers, metal meshes, various plastic films, metal sheets with holes, etc. can be widely used.

(if) Arranging the nonwoven fibers in a thin cotton or mat shape by an appropriate method,
A sheet-like material obtained by bonding fibers together using the fusing force of an adhesive or the like may be used.

(111) Continuous sheet Metal foil such as stainless steel, copper, iron, aluminum, etc., or polyester, polyimide, polypropylene, nylon, polyethylene, EVA, acrylic, polycarbonate, polyvinylidene chloride, acetate, polyurethane, Teflon, polyvinyl alcohol, polystyrene etc. plastic sheets.

(Iv) Rubber sheet Natural rubber (NR), styrene-butadiene rubber (SB
R), butadiene rubber (BR), butyl rubber, ethylene-brobylene-diene-methylene-bolymer (EPD)
M), chloroprene rubber (CR), nitrile rubber (NB
R), chlorosulfonated polyethylene (CSM), polysulfide rubber (T), urethane rubber (U), epichlorohydrin rubber (CHC), acrylic rubber (AM).

ANM), fluororubber, (FPM), silicone rubber (SI), etc. sheets.

(V) Thermoplastic elastomer A sheet of thermoplastic SBR elastomer, thermoplastic polyurethane, etc.

(vi) Rubber adhesives Polychloroprene-based, nitrile rubber-based, recycled rubber-based, butadiene-styrene copolymer (SBR)-based or natural rubber-based adhesives, etc.

(vll) An adhesive or adhesive sheet having an adhesive layer on one or both sides of a sheet base material.

The mesh-like sheet of 1), the nonwoven fabric of 11), 111
A rubber adhesive, a pressure-sensitive adhesive, a thermosetting resin adhesive, a composite adhesive such as polyvinyl formal phenolic, or an epoxy resin is applied to at least one surface of the base sheet such as the continuum sheet of ) and the rubber sheet of iv). Adhesive or adhesive sheet formed with a layer of thermosetting resin adhesive such as.

This reinforcing sheet 26 is disposed below the recess 27 for mounting the IC module 10, and has a larger area than the bottom surface of the recess 27.

Also, the upper surface of the core sheet 22 of the card base material 20 and the second
Necessary printed matter 24 and 25 are printed on the lower surface of the oversheet 23, respectively.

The IC module 10 is attached to the four parts 27 of the card base material 20 to form an IC card.

Next, a specific method for manufacturing an IC card will be explained.

First, as shown in FIG. 2, a first oversheet 21,
a core sheet 22 with a printed matter 24, a reinforcing sheet 26,
and the second oversheet 23 having the printed matter 25 are laminated and heat pressed (for example, 150° C., 20 kg/cd, 2
0 minutes) to create the card base material 20.

Next, a concave portion 27 is formed in the card base material 20 by cutting it into a predetermined shape and size using an engraving machine or the like.

Subsequently, the adhesive layer 16 is provided on the bottom surface of the four parts 27, and the IC module 10 is inserted into the four parts 27. Subsequently, only the surface of the external terminal 12 is locally heated using a hot stamper (not shown) (e.g., 100-170°C, 5-15°C).
kg/c for 4.5 seconds) and place the IC module 10 in the recess 2.
An IC card is obtained by adhesively fixing the card in the container 7.

The adhesive layer 16 can be formed, for example, from a double-sided adhesive tape coated with an acrylic adhesive on both sides of a nonwoven fabric. Further, in order to obtain stronger adhesion, for example, a polyester-based thermal adhesive seal is also preferably used.

In addition, when using an adhesive or pressure-sensitive adhesive of a room temperature curing type, for example, a room temperature effect type urethane adhesive, a hot stamper is not necessary and pressing at room temperature can be performed.

As explained above, according to this embodiment, the card base material 20
Since the reinforcing sheet 26 is provided below the IC module 10 inside, the card base material 2 below the IC module 10
0, in particular the strength of the second oversheet 23 is increased. Therefore, even if the IC card is bent and subjected to a strong bending action, cracks in the card base material 20, particularly in the second oversheet 23, can be prevented. Also, IC
Since the card is prevented from being bent significantly, the IC module 10 is prevented from falling out of the recess 27 of the card base material 20.

Furthermore, when a metal foil such as stainless steel is used as the reinforcing sheet 26, the bending stress of the card base material 20 can be improved, thereby making it possible to prevent deformation of the card base material 20.

Next, referring to FIG. 3, a second embodiment of the IC card according to the present invention will be described.

As shown in FIG. 3, the periphery of the wiring section including the IC chip 13 and the bonding wires 14 is resin-molded with a molding resin to form a resin mold section 15. Since this resin mold portion 15 covers only a portion of the support body 11, the IC module 10 as a whole has a convex cross section.

Note that in order to further improve the flexibility and bending followability of the IC module 10, it is preferable that the support body 11 of the IC module 10 is as thin as possible.

On the other hand, the recess 27 of the card base material 20 is formed to correspond to the shape of the convex IC module 10, and the four parts 27 mainly include a first four part 27a into which the support 11 is inserted;
It consists of a second four part 27b into which the resin mold part 15 is inserted. Further, the second fourth portion 27b has a depth such that a predetermined space is formed between the bottom surface of the second fourth portion 27b and the resin molded portion 15.

In addition, in each of the above embodiments, the four parts 2 of the card base material 20
7 is formed by cutting with an engraving machine.
1 and the core sheet 22, and the second oversheet 23 which does not have an opening are laminated, a dummy module (not shown) having the same shape as the IC module is fitted into the opening, and breath lamination is performed. .

Further, although an example in which the reinforcing sheet 26 is provided between the core sheet 22 and the second oversheet 23 has been shown, the reinforcing sheet 26
6 may be directly exposed from the four parts 27 and provided continuously. In this case, the IC module 10 may be adhesively fixed to the reinforcing sheet 26.

Furthermore, the card base material 20 includes a first oversheet 21,
Instead of the three-layer structure of the core sheet 22 and the second oversheet 23, a single structure may be used.

〔Effect of the invention〕

Since a reinforcing sheet for reinforcing the strength of the card base material is provided, even if a bending action is applied to the IC card, the card base material will not be significantly deformed, and the shear strength of the card base material will also increase. This prevents the card base material from cracking and the IC module from falling off.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view showing the first embodiment of the IC card according to the present invention, FIG. 2 is an exploded sectional view showing the method of manufacturing the IC card, and FIG. 4 is a side sectional view showing an embodiment, and FIG. 4 is an IC of the structure of the sealing frame 18.
FIG. 2 is a side sectional view showing an IC card having a module. 10... IC module, 11... Support body, 12.
...External terminal, 13...IC chip, 14...Bonding wire, 15...Resin mold part, 16...
- Adhesive layer, 20... Card base material, 26... Reinforcement sheet, 27... Recessed portion. Applicant's representative Mr. Sato Figure 1 Figure 2 +1"1 Figure 3

Claims (1)

[Claims] In an IC card comprising an IC module having an IC chip and a synthetic resin card base material having a recess into which the IC module is mounted, the strength of the card base material is increased below the IC module within the card base material. An IC card characterized by having a reinforcing sheet for reinforcement.