JPS60189587A - Ic card - Google Patents

Abstract

PURPOSE:To provide an IC card resistant to bending, by providing a connecting terminal exposed to a surface of a card base material and an IC module embedded in the card base material, and by containing a metallic sheet or a plastic sheet as a core material, or both of them. CONSTITUTION:An IC card 1 is provided with a card base material 2, a core material 3 embedded in the card base material, and an IC module 4 embedded in said material. The IC module 4 has a connecting terminal 5 exposed to the surface of the card base material 2. A resin obtained by irradiating a light on a photosensitive resin to harden it, a resin obtained by hardening a thermosetting resin by heating it, or a resin obtained by irradiating an electron beam on an electron beam hardening resin to harden it is used as the card base material 2. A plastic sheet or a metallic sheet is used as the core material 3. Also the plastic sheet and the metallic sheet which are laminated together can be used as the core. In consideration of the strength of the obtained IC card 1 with respect to bending, it is desirable to use a type where only the connecting terminal 5 of the IC module 4 is exposed to the card base material 2's surface.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an industrial card equipped with or having an IC chip installed therein.

[Technical background of the invention and its problems] In recent years, cards called chip cards, memory cards, microcomputer cards, electronic cards, etc. (hereinafter simply referred to as IC cards) equipped with or built-in industrial C chips such as microcomputers and memories have become popular. Research is underway.

These IC cards have a larger storage capacity than conventional magnetic strip cards, so they are used by banks to store the history of deposits and savings in their passbooks, and by credit cards to store transaction history such as shopping. It is thought that Such an IC card must necessarily include connection electrodes for electrically and mechanically connecting the IC circuit to an external data processing device or the like. This connection electrode is provided either on the card surface or on the card end surface. The method of providing connection electrodes on the end face of the card requires forming a circuit pattern inside the card base material, which complicates the manufacturing process and does not allow sufficient contact area of the electrodes with the connection terminals of the external data processing device. ,
The drawback is that it is unreliable. For this reason, it is desirable to provide the connection terminals on the card surface.

IC cards with connection terminals on the card surface generally have a chip embedded in the card base material, a chip C completely surrounded by the card base material, and an electrode inserted into the card base material. After processing and molding the conductive pattern of l
O-tep and card base material such as vinyl chloride /60″C
It is manufactured by applying pressure to approximately JKP/m under heating conditions of approximately

However, in the case of industrial C cards whose card base material is made of hinyl chloride, the built-in IC module is made of a material that does not have elasticity, and may break if bent strongly. It has a drawback that it does not have sufficient mechanical strength against bending, such as failure to recover from bending caused by bending. In addition, since the built-in module is made of a material that does not have much elasticity, when the IC card is strongly bent, a large load is applied to the adhesive surface between the module and the base material. Therefore, there was a drawback that peeling between the IC module and the base material occurred. Such problems tended to become particularly noticeable when the IO card thickness was reduced.

[Object of the invention and its outline]

The present invention aims to solve all of the drawbacks associated with the prior art, and has the following objects.

(a) To provide an IC card that does not exhibit many phenomena such as breakage or failure to recover from bending when it is strongly bent, and has sufficient mechanical strength against bending.

(1)) To provide an engineered C card that has an excellent property of being resistant to peeling between an IC module and a base material when it is strongly bent.

(c) To provide an IC card that has excellent mechanical strength and can be made thin.

An IC card according to the present invention includes a card base material and an IC module having connection terminals exposed on the surface of the card base material and embedded in the card base material, wherein the card base material has a core The material includes a paulownia wood sheet, a plastic sheet, or both, and these core materials are characterized by being strong against bending as well as the card base material.

In a particularly preferred IC card according to the present invention, a core material in which a metal sheet is sandwiched between plastic sheets is provided in a card base material. As the plastic sheet, polyethylene terephthalate (pgT) is preferred, and as the metal sheet, a Nosene steel sheet is preferred.

[Detailed description of the invention]

Hereinafter, the present invention will be explained with reference to embodiments shown in the drawings. As shown in FIG. , the Lug embedded in this card base material is the card base material λ
Connection terminals exposed on the surface! With this, the IC module 1/4t and an external electrode (not shown) can be electrically connected via a connection terminal j.

In the IC card shown in FIG. 1, the card base material 2 may be a resin obtained by curing a photosensitive resin by irradiating it with light, a resin obtained by curing a thermosetting resin by heating, or an electron beam. A resin obtained by curing a curable resin by irradiating it with an electron beam is used.

A core material 3 is embedded in the card base material 2 as described above. The core material 3 is preferably embedded in the center of the card base material 2, but may be embedded in the bottom or top surface of the card base material. As the core material 3, polyethylene tele-7 tallate film, polypropylene film, nylon film, cellulose diacetate film, cellulose triacetate film, polystyrene film,
Metal sheets such as polyimide films, polycarbonate films, and stainless steel sheets are used. Also,
The core material can also be made by laminating a plastic sheet and a metal sheet as described above.

In the IC card shown in FIG. 1, the surface of the IC module Z was exposed on the surface of the card base material, but as shown in FIG. Only the terminal j may be exposed on the surface of the card base material λ. Considering the bending strength of the resulting IC card l, the IO module as shown in Fig. 2≠
It is preferable to use a type in which only the connection terminals j are exposed to the surface of the card base material λ.

A sectional view of one example of the IC module 3 used in the present invention is shown in FIG. 3, and FIG.
B) shows a perspective view of the lower part thereof, and FIG. 2(0) shows a perspective view of the same after molding. This process-0 module can be manufactured, for example, as follows. First, thickness o, 1
35μ on the glass epoxy film board B of about yyb
After etching to obtain the desired pattern using a printed wiring film laminated with m-thick copper foil,
After performing nickel and gold plating to form an electrode pattern 7 for connection with the outside and a circuit pattern, it is punched out to a desired size. Connection electrode pattern 7 and circuit pattern ♂
and are airtightly connected by through-halters at necessary points. Then, die bond the IO chip/θ to a predetermined position on this circuit pattern g, and
The electrodes// on the circuit pattern g are connected to the conductor 12 by wire bonding (see Figure 03). This part can also be done using a face bonding method that does not use wires, in which case a thinner I
C module can be obtained. After making the necessary connections between Step 10 and circuit pattern g, the potting frame /3 made of hard polyvinyl chloride is used to prevent the flow of epoxy resin when potting.
Attach it to the glass epoxy film substrate B using an acrylic adhesive or the like, and mold it by pouring the epoxy resin (see Figure (C)).

At this time, if you first cover the through halter with epoxy resin that has a relatively high viscosity (about 10'CP8) and then pour in the epoxy resin with a low viscosity (about lθ3 cps) after confirming that it has sufficiently hardened, you can It is possible to prevent the epoxy resin/4' for botting from coming out through the halter to the connection electrode pattern 7 side which is the surface.

Although the IC module for the SIE 0 card can be obtained by the method described above, the method described here, including the method for forming the circuit pattern ♂ and the connection electrode pattern 7, and the method for bonding the IC chip, Each of the
This can be handled using current technology in related industries.

Next, a method of manufacturing the IC card shown in FIG. 1 or 2 will be explained.

As shown in FIG. 5, a space 15 corresponding to the desired card thickness is formed inside the jig 7g, and an inlet/6 and an outlet/7 for resin liquid are provided in the jig 7g. Fix the core material 3 and the IC module. The jig 13 is composed of a jig upper plate/ga and a jig lower plate/A"t+, and can be removed in number.As a resin liquid,
When photosensitive resin or electron beam curable resin is used, either or both of the jig upper plate/&a or the jig lower plate/g'b should be protected against ultraviolet &! Alternatively, it must be made of a material that transmits electron beams. Further, when a thermosetting resin is used as the resin liquid, it is preferable to provide the jig upper plate/ga 6 or the jig lower plate/ffE with a heater for heating the resin injected inside.

Next, resin liquid is injected into the space inside this jig.

If a curing agent is required when curing the resin, it is preferable to mix the resin and curing agent before injecting into space /3. The resin liquid is 0. /~3Q/cd
Either apply pressure to a certain degree and press fit, or press the inside of the jig to /~s.
It may be injected by suctioning with a suction pressure of Kp/cr/l. In either case, it is preferable that the space 1S be a closed system.

When injecting the resin liquid into this space 1S, air bubbles may be mixed into the resin liquid. By injecting it into the filling, you can prevent air bubbles from getting mixed in.

As a resin liquid, the viscosity is not very high (lO ~, 2O
Opoise), those that harden quickly by light irradiation, electron beam irradiation, or heating are preferred, and after curing,
It is required to have appropriate rigidity and elasticity and satisfy various physical properties as a card.

Photosensitive resins with the above-mentioned physical properties include unsaturated polyester photosensitive resins, unsaturated urethane photosensitive resins, etc., and thermosetting resins include epoxy resins, phenolic resins, unsaturated resins, etc. Examples of electron beam curable resins include acrylic polymers dissolved in acrylic monomers, unsaturated polyesters, acryloyl groups, acrylamide groups, acryl groups, vinyl ether groups, and vinyl at the end of the side chain or main chain. Examples include compounds containing a thioether group and the like.

After the resin liquid is injected into the space/left side, light irradiation, electron beam irradiation, or heating operation is applied to harden the resin liquid and form the card base material 2.

After the resin is cured in this way, it is taken out from the jig and punched into a desired shape if necessary, to obtain a workpiece card 1.

In the above-mentioned IC card, no pressurization process is applied during the manufacturing process, the connection between the module and the connection terminal is not broken, and the IC card is
It is also possible to prevent the adverse effects of pressure on the O chip, and there is also the additional effect that unevenness on the card surface due to irregularities in the thickness of the IO chip does not occur. Furthermore, there is no need to form a recess for embedding the C module in the card base material, the manufacturing process can be simplified, and changes in the shape of the IC module can be easily accommodated.

In order to further increase the mechanical strength of the card 1 according to the present invention, an oversheet /q can be provided on both sides or one side of the card as shown in FIG. As the oversheet/9-bind, a plastic film such as vinyl chloride or polyethylene terephthalate, or a metal sheet can be used. Oversheet with /9
Since a desired pattern can be easily printed on the IC card, there is also the advantage that necessary visible information can be easily provided to the resulting IC card. Also, Oatskushi)/
If a magnetic recording layer is formed on 9 in advance, the obtained I
It is also possible to provide magnetic recording capability to the C card.

Note that the IC module embedded in the IC card is not limited to a circular shape, but may have any shape such as a rectangular shape.

Another specific example of the industrial C card/ according to the present invention is shown in FIG. The IC card 1 according to this specific example includes a vinyl chloride sheet, 2a, 2b, xc, and the card base λ.
2d is used, and the IC module is embedded in a recess formed in the card base material λ. 2a and 2
d is a transparent PVC sheet 2'o and 2c are milky white PVC center cores.

As the core material 3, a polyethylene terephthalate film is used, and between this core material and the PVC center core, a polyester sheet adhesive (Toshi Photo)/nt-no+zub-+ is used.
-+a Lee xa-y', -7-zS44#d;-呵1-
After laminating sheets in L111L□ configuration, /30'
C2! Press lamination is performed under heat and pressure conditions of rKf /CFd, finishing and punching to obtain a processed C card.

In addition to PET film, core materials include plastic sheets such as polypropylene film, nylon film, cellulose diacetate film, cellulose triacetate film, polystyrene film, polyimide film, polycarbonate film, and FRP film, nonone steel sheet, and stainless steel. Metal sheets such as sheets can also be used. Moreover, the core material can also be made by laminating a plastic sheet and a metal sheet as described above. In the above specific example, it would be even more effective if spring steel was used instead of PET for the core material, and PET, which is strong against bending, could be used instead of PVC for the card base material.
It is even more effective if spring steel is used as the core material. However, when PFiT is used as the base material, it is necessary to sandwich a polyester sheet adhesive (Stafix, manufactured by Fuji Photo Film) between the PKT films as well.

The card base material can also be selected from the core plastic sheets mentioned above. When selecting a material for the core material, it is necessary to choose one that is strong and resilient against bending, as well as the card base material. In this way, the core material is more resistant to bending than the card base material. Materials with high tensile strength, tensile modulus of elasticity, bending strength, bending modulus of elasticity, and bending stiffness are generally selected because they are strong against bending and have high resilience. 1. You can say that you have a strong back. Test methods for each of the above numerical values are specified in AsTM.

〔Effect of the invention〕

Since the IC card according to the present invention has a metal sheet, a plastic sheet, or both embedded as a core material in the card base material, it has the following effects.

(a) It is possible to obtain an x'c card with improved mechanical strength against bending, which is less prone to phenomena such as failure to recover from the bending when it is bent strongly.

(b) An IC card having an excellent property that peeling between the IC module and the card base material is unlikely to occur when it is strongly bent can be obtained.

(C) 10 cards that can be made thinner are obtained.

[Brief explanation of the drawing]

1 and 2 are cross-sectional views of an IC card according to the present invention, and FIG. 3 is a cross-sectional view of an IC module used in the present invention. The perspective view, the lower perspective view, and the lower perspective view after mold processing are shown in detail, Figure 5 is a cross-sectional view of the jig used for making the IO card (6'), Figure 6, and Figure 7 are related to the present invention. It is a sectional view of the engineering C card concerning other examples. /...IC card, λ...card base material, 3...core material, G...IC module,!・Connection terminal. Applicant's agent Kiyoshi Inomata Figure 1 Figure 2 Figure 3 Figure 4 (A) (B) 0

Claims (1)

[Scope of Claims] 1. A card base material and an IC having a connection terminal exposed on the surface of the card base material and embedded in the card base material.
O module, and the card base material includes a metal sheet, a plastic sheet, a plastic sheet, or both as a core material, and the core material is resistant to bending as well as the card base material. 0 card. The IC card according to claim 1, wherein the plastic sheet serving as the core material is a polyethylene terephthalate sheet. 3. The IC card according to claim 1, wherein the metal sheet as the core material is a nonone steel sheet. The IC card according to claim 1, wherein the core material is a laminated body of a plastic sheet and a metal sheet.