JPS6325096A - Ic card and manufacture thereof - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to an IC card and a manufacturing method thereof.

[Prior art]

2. Description of the Related Art In recent years, a system that uses an IC card having an IC-based data processing unit and an IC-based memory to perform product transactions, deposits, and record personal information has been attracting attention.

As shown in FIGS. 5 and 6, the IC card used in such a system includes an IC chip 32 that has a data processing section integrated into an IC and a memory section integrated into an IC, in a part of a card body 31. The input/output terminals 34 formed on the IC module 33 are buried.
is exposed on one side of the card body 31, and a magnetic stripe 35 is formed on the input/output terminal exposed side of the card body 31 for recording a password etc.
-34687).

As shown in FIG. 6, the card body 31 includes a transparent hard vinyl chloride sheet 31a, a milky white hard vinyl chloride sheet 31b with desired printing on the outer surface, and the IC module 33 embedded in a desired position. The IC module 33 is formed by laminating a stack 31e of vinyl chloride sheets with holes 36 formed therein, and the buried portion 37 of the IC module 33 is constituted by the buried holes 36 and the opalescent hard vinyl chloride sheet 31b.

As shown in detail in FIG. 7, the IC module 33 mainly has input/output terminals 34 patterned on one side for electrical connection with electrodes attached to an IC card reader/writer (not shown). A wiring board 40 is patterned with a circuit pattern 39 having a desired bonding terminal electrically connected to the input/output terminal 34 via a through hole 38 on the other surface; It consists of an IC chip 32 fixed on the forming surface side. After the IC chip 32 is fixed to the wiring board 40, the electric current wA32 formed on the IC chip 32 is fixed to the wiring board 40.
A and a predetermined bonding terminal of the circuit pattern 39 formed on the wiring board 40 are connected by a lead 41 to form a required IC@path. Further, the wiring board 40
A potting frame 42 made of a material such as glass epoxy (an epoxy resin mixed with glass fiber) is attached around the IC chip setting part 5 to prevent the sealing resin from flowing. A thermosetting resin 44 such as epoxy resin is potted into the sealing portion formed by the wiring board 40 and the IC chip 32 . lead 41
．． The potting frame 42 is integrally sealed.

When embedding the IC module 33 in the card body 31, as shown in FIG. A method is adopted in which the IC module 33 is bonded under pressure and heat.

[Problem that the invention seeks to solve]

As described above, conventional IC cards use a thermosetting resin such as epoxy as the sealing resin for the IC chip 32 mounted on the IC module 33, and also use an I/O resin in the card body 31.
Since thermosetting resin such as epoxy is also used as the adhesive member 43 for fixing the C module 33, the IC chip 32 mounted on the IC module 33 is heated at least twice. In general, thermosetting resins undergo relatively large deformations when cured, and this deformation causes stress to act on the leads 41, causing the leads 34 to break or break.
There is a problem in that short circuits are likely to occur.

In addition, since the thermosetting resin must be heat-treated at least twice, it takes a long time to cure the resin, and the manufacturing process becomes complicated, resulting in poor productivity.

[Means for solving problems] The present invention eliminates the problems of the prior art described above.

In order to provide IC cards with excellent reliability and productivity,
An IC consisting of an IC module embedded in a part of the card body
In the card, the card body and the IC module are photocurable! It is characterized by being glued with fat.

Further, in an IC card manufacturing method including a step of embedding an IC module in a embedding part formed in a card body, when embedding the IC module in the embedding part, first, a photocurable resin is potted in the embedding part. 1. Next, an IC module formed by bonding the fl pole of the IC chip and a predetermined bonding terminal patterned on the wiring board is inserted into the buried part, and then the resin is hardened into the photocurable resin through the card body. Irradiate the light.

It is characterized in that the photocurable resin is cured.

[Effect]

Since photocurable resins have small shrinkage during curing, they do not cause breakage or short circuits of leads due to shrinkage during curing, unlike when thermosetting resins are used. Since it is rapidly cured when irradiated with light of a predetermined wavelength, the curing time of the resin can be significantly shortened compared to the case where a thermosetting resin is used as the sealing resin.

Further, in the S-adic method for IC cards according to the present invention, when embedding the IC module in the embedding part formed in the card body, first, a photocurable lubricant is potted into the embedding part, and then, the IC chip An IC module formed by bonding the ft pole of the ft electrode with a predetermined bonding terminal patterned on a wiring board is inserted into the buried part, and then resin curing light is irradiated to the photocurable resin through the card body, and the photocurable resin is exposed to light. Since the curable resin is cured, the above I
The resin sealing of the C chip and the adhesion of the IC chip and the card body can be performed at the same time, and the productivity of the IC card can be improved accordingly.

〔Example〕

First, a first embodiment of an IC card according to the present invention will be described based on FIGS. 1 to 4.

FIG. 1 is a sectional view showing an example of an IC card according to the present invention, in which l indicates a card body, 2 indicates an IC module, and 3 indicates a sealing resin.

As shown in FIG. 1, the card body 1 includes a first center core 4 and a second center core 5, which are formed into a desired shape by punching out a polyvinyl chloride SGI sheet with a predetermined thickness. It is formed by laminating a first transparent sheet 6 and a second transparent sheet 7. Among the card parts, the first and second center cores 4.
5 and the first transparent sheet 6 are provided with a through hole 10 at a desired buried portion forming position, and a through hole 10 is formed in the recessed buried portion 11 formed by the through hole 10 and the second transparent sheet 7. The IC module 2 is embedded.

The IC module 2 mainly consists of a wiring board 12 and an IC chip 13, as shown in FIG. The wiring board 12 is formed of an insulating film such as glass epoxy or polyimide, and has contact terminals (input terminals) on one side for electrical connection with electrodes (not shown) attached to the IC card reader/writer. An output terminal (output terminal) 14 is patterned, and a wiring pattern 15 having a bonding terminal for connecting an IC chip 13, which will be described in detail later, is patterned on the other side. These contact terminals 14
The wiring pattern 15 is formed by etching the copper foil laminated on the wiring board 12. In addition, the reference numeral 16 in the figure is an ICM setting part for embedding the IC chip 13, and the reference numeral 17 is a protective frame provided around the IC chip setting part 16. It can be formed separately from the wiring board 12 and bonded to a predetermined position on the wiring board 12, or it can be formed integrally with the wiring board 12.

The IC chip 13 consists of, for example, an IC-based data processing section and an IC-based memory section, and electrodes 18 are formed at predetermined positions on the surface. This one! [18 may be used as an aluminum pad or may be a bump formed by metallizing the aluminum pad. This IC chip 13 is fixed to the IC setting section 16, and the electrode 18 and the bonding terminal in the wiring pattern 15 patterned on the wiring board 12 as the lead 1.
By connecting at 9, a required IC circuit is constructed.

As the lead 19, in addition to a gold wire, a copper wire, an aluminum wire, a wire formed of copper foil and plated on the wiring base Fi12 can be used.

Further, as a means for forming the leads 19, wire bonding, Guyang bonding, etc. can be used.

As the sealing resin 3, a photocurable resin is applied.

An example of the method for manufacturing the IC card is shown in FIG. 3(a) below.
The explanation will be based on (b) and (c).

First, as shown in FIG. 3(a), a predetermined amount of photocurable resin is potted as the sealing resin 3 into the embedded portion 11 recessed in the card body 1. As shown in FIG.

Next, as shown in FIG. 3(b), the IC module 2 is inserted into the buried portion 11, and a photocurable resin is applied around the IC chip 13 and the area of the wiring board 12 excluding the contact terminal 14 forming surface. spread the word.

Around the IC chip 13 and contact terminals 14 on the wiring board 12
After the photocurable resin has sufficiently spread around the surrounding area except for the forming surface, as shown in FIG. harden. The curing conditions for the photocurable resin 14 need to be adjusted appropriately depending on the type and amount of the photocurable AT resin used.
The resin curing light is irradiated in an amount that exceeds the appropriate exposure amount in multiple cycles, such as six cycles of 10 seconds each after a pause of 2 seconds. In this case, I
It is also possible to press the contact terminal 14 surface of the IC module 2 with a suitable jig so that the C module 2 is set parallel.

Since the IC card of the first embodiment uses a photocurable resin that shrinks little when cured as the sealing resin, breakage or short circuit of the leads due to shrinkage of the resin does not occur, and Since the photocurable resin is rapidly cured when irradiated with light of a predetermined wavelength, the curing time of the resin can be shortened compared to when a thermosetting resin is used as the sealing resin.

Therefore, the yield and productivity of IC cards are improved, and highly reliable IC cards can be provided at low cost.

Further, in the method for manufacturing an IC card according to the above embodiment, when embedding the IC module in the embedding part recessed in the card body, first, a photocurable i-based resin is potted into the embedding part, and then a wiring board is placed. An IC module in which bonding terminals patterned in a pattern and electrodes of an IC chip are bonded is buried in the buried portion, and then resin curing light is irradiated onto the photocurable resin through a transparent card part 6°7. Therefore, the resin sealing of the IC chip and the adhesion of the IC chip and the card body can be performed at the same time, and the productivity of the IC card can be improved accordingly.

Next, a second embodiment of the present invention will be described.

A second embodiment of the present invention is characterized in that an IC module is used in which a through hole is provided in the IC chip setting portion of a wiring board and an IC chip is set within the through hole.

FIG. 4 is a sectional view of an IC module applied to the IC card of the second embodiment, in which 21 indicates a wiring board, and other members similar to those shown in FIG. ing.

The wiring board 21 is similar to the wiring board described in the first embodiment, and is made of an insulating film such as glass epoxy or polyimide, and contact terminals 14 are patterned at desired positions on one side. terminal 1
A through hole 22 for setting an IC chip is provided apart from the hole 4. The wiring pattern 15 is patterned on the other surface of the wiring board 21 so that its tip extends into the through hole 22, and a bonding terminal 23 is formed at the tip of the wiring pattern 15. There is.

The IC chip 13 is similar to that described in the first embodiment, and is inserted into the through hole 22, and by bonding the W1 pole 18 of the IC chip 13 and the bonding terminal 23, The desired IC circuit is constructed.

The IC module having the desired IC circuit configured as described above is embedded in the card body by the same method as shown in the first embodiment.

The IC card of the second embodiment has the same effects as the IC card of the first embodiment, and also has the IC chip 13 inserted into the through hole.
2, and the IC module was formed into a thin shape.
Accordingly, the IC card can be made thinner.

The gist of the present invention is that, in an IC card in which an IC module is embedded in a part of the card body, the card body and the IC module are bonded together using a photocurable resin. The configurations of the IC module and the IC module are not limited to those shown in the embodiments described above, and it goes without saying that they can be appropriately designed as necessary.

〔Effect of the invention〕

As explained above, since the IC card of the present invention uses a photocurable resin that has a small shrinkage rate during curing as the sealing resin, breakage or short circuit of the leads due to the shrinkage of the resin is avoided. Not again.

Since the photocurable resin is rapidly cured when irradiated with light of a predetermined wavelength, the curing time of the resin can be significantly shortened compared to the case where a thermosetting resin is used as the sealing resin. Therefore, the yield and productivity of IC cards are improved, and highly reliable IC cards can be provided at low cost.

Further, in the method for manufacturing an IC card according to the present invention, first, when embedding the IC module in the embedding part.

A photocurable resin is potted into the buried part recessed in the card body, and then the bonding terminal patterned on the wiring board and the left electrode of the IC chip are bonded.
The module is buried in the embedding section, and then the photocurable resin is irradiated with resin curing light through the card body, so that the resin sealing of the IC chip and the I
Since the C-chip and the card body can be bonded at the same time, the productivity of IC cards can be improved accordingly.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an IC card according to a first embodiment of the present invention, FIG. 2 is an initial screen of an IC module embedded in the IC card of the first embodiment, and FIG. 3(a). (b) and (c) are process explanatory diagrams showing an example of an IC card manufacturing method, FIG. 4 is a cross-sectional view of an IC module embedded in an IC card according to a second embodiment of the present invention, and FIG. FIG. 6 is a plan view showing an example of a conventionally known IC card, FIG. 6 is a sectional view taken along line AA in FIG. 5, and FIG. 7 is a sectional view of an IC module embedded in the IC card shown in FIG. 1: Card body, 2: IC module, 3: Sealing resin,
4: first center core, 5: second center core, 6
: 1st printed sheet, 7: 2nd printed sheet, 8: 1st
overlay, 9: second overlay, 10: through hole, 11: buried part. 12.21: Wiring board, 13: IC chip, 14: Contact terminal, 15: Wiring pattern, 16: IC setting section, 17;
Protective frame, 18: Electrode, 19 2 leads 1 Figure 1: Card, no, 2: ICC thin z -1 3: Keio, Chomachi - A! 11: Riban-ne Figure 3 (a) 4th

Claims (6)

[Claims] (1) An IC card comprising an IC module embedded in a part of a card body, characterized in that the card body and the IC module are bonded together with a photocurable resin. (2) The IC card according to claim 1 uses an IC module in which a protective frame formed separately from the wiring board is attached around the IC chip setting section of the wiring board. An IC card that is characterized by (3) The IC card according to claim 1, which uses an IC module in which a protective frame is integrally formed with the wiring board around the IC chip setting section of the wiring board. . (4) In the IC card according to claims 1 to 3, an IC chip is fixed to one side of a wiring board,
An IC card characterized in that it uses an IC module formed by bonding electrodes of the IC chip and predetermined bonding terminals patterned on the wiring board. (5) In the IC card according to claims 1 to 3, an IC chip is inserted into a through hole formed in an IC chip setting portion of a wiring board, and the electrodes of the IC chip and the wiring board 1. An IC card characterized by using an IC module formed by bonding a predetermined bonding terminal patterned with a predetermined bonding terminal. (6) In an IC card manufacturing method including a step of burying an IC module in a buried part formed in a card body, when burying the IC module in the buried part,
First, potting a photocurable resin into the buried part,
Next, an IC module formed by bonding the electrodes of the IC chip and predetermined bonding terminals patterned on the wiring board is inserted into the buried part, and then resin curing light is irradiated to the photocurable resin through the card body. A method for manufacturing an IC card, characterized in that the photocurable resin is cured.