JPS6153096A - Identification card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an IC card in which an IC chip is mounted inside a card base material.

[Technical Background of the Invention] Conventionally, for example, as a data card for proving money when depositing or withdrawing money at a financial institution, a card base material made of synthetic resin is coated with a magnetic stripe on the surface, and an account number or a recitation is written on this part. Magnetic cards on which data such as numbers are magnetically recorded are widely used.

Magnetic cards have a simple structure, are highly durable, and are suitable for human production, so they are widely used, especially in the service industry field.

However, due to the small storage capacity of such magnetic cards, only a small amount of information can be recorded, and a large amount of information must be recorded in a separate recording means such as a bankbook at a financial institution. , which was an obstacle to increasing the efficiency of information processing.

Furthermore, since information on this magnetic card can be read relatively easily from the outside, there have been problems in maintaining confidentiality and preventing theft.

Under these circumstances, in recent years, a data card called an IC card has been developed which has a built-in storage element and its control element and has a dramatically increased storage capacity.

For example, as shown in FIG. 3, an IC card includes a memory chip 2 that stores information inside a card base material 1 made of resin.
A microprocessor chip 3 that performs processing is mounted, and the input/output terminals 4 are exposed from the surface of the card base material 1.It is set in the card mounting section of a predetermined processing device, and the input/output terminals 4 are connected to the processing device. By connecting it to the input/output terminal on the side, information can be written and read.

By the way, the above-mentioned IC card, like the above-mentioned magnetic card, is often carried around at all times, and is required to have considerable durability against external forces.

[Problems with the background technology] However, currently developed IC cards are
As can be seen from the figure, the memory chip 2 and the microprocessor chip 3 are mounted almost in the center of the card base material 1, and the material of the card base material 1 covers the entire area (if the card base material 1 has a multilayer structure, (for each layer), external forces, especially "bending" forces, are easily transmitted to the memory chip 2 and microprocessor chip 3, and there is a risk that these IC chips may be damaged if excessive external force is applied. There is.

Furthermore, since the connection between these IC chips and the conductor pattern formed on the flexible substrate 5 inserted into the inner layer of the card base material 1 is performed using ultrafine wires such as gold wires, There is also a risk of connection failure due to bending force.

[Object of the invention] The present invention was made under the circumstances as described above,
The object of the present invention is to provide a highly reliable IC card in which the transmission of external force to the IC chip and its connection portion with a conductor pattern is reduced as much as possible.

[Summary of the invention] That is, the IC card of the present invention has an I/O inside the card base material.
The IC card having a C chip mounted thereon is characterized in that a part of the card base material where the IC chip is not mounted is made softer than a part where the IC chip is mounted.

[Embodiments of the Invention] Details of the present invention will be described below based on embodiments shown in the drawings.

FIG. 1 is a plan view including a partially transparent view showing the configuration of an embodiment of the present invention.

In the figure, 6 is a memory chip for storing information; 7 is a memory chip for storing information;
indicates a microprocessor chip that performs the control, and the conductor pattern of the flexible substrate 9 is inserted into the inner layer of the card base material 8 at a position where the central portion is removed (in this embodiment, the position is biased to the left side). It is connected to the. Here, 10 indicates an input/output terminal connected to the conductive pattern of the flexible substrate 9 and exposed on the surface of the card base material 8, and 11 indicates a magnetic stripe.

Furthermore, the card base material 8 of the IC card of this embodiment has a multilayer structure, and the inner layer part Δ where the IC chip 6.7 is not mounted is the part B where the IC chip 6.7 is mounted. It is made softer than.

FIG. 2 is a sectional view of the IC card shown in FIG. 1 taken along line T-I.

An example of the method for manufacturing the IC card described in F will be described in detail based on this figure.

For example, a flexible substrate 9 made of polyimide resin and having holes 9a formed in the mounting portions of the memory chip 6 and the microprocessor chip 7 is pressure-bonded to the inner sheet 12 made of vinyl chloride resin, and then the inner sheet 1
2 a memory chip 6 and a microprocessor chip 7
and perform the prescribed bonding. The surface of the flexible substrate 9 opposite to the surface to be crimped to the inner sheet 12 (the side on which the conductor pattern to which the IC chip is connected) corresponds to the hole 9a made in the flexible substrate 9. A center core sheet 13 made of, for example, vinyl chloride resin and having holes 13a at the positions to be pressed is pressed. Furthermore, a reinforcing material sheet 14 made of aluminum or copper and having holes 14a at positions corresponding to the holes 13a is crimped onto the center sheet 13, and further holes 9a, 13a are attached.
, 14a are filled with a sealing material 15 such as epoxy resin.

Then, an inner sheet 16 made of, for example, vinyl chloride resin is pressure-bonded to the surface of the reinforcing material sheet 14.

After the above, the front oversheet 1 is placed on the inner sheet 12.
7 is applied, and the back side oversheet 18 is applied to the inner sheet 16.

That is, from the front side, this IC card includes a front oversheet 17, an inner sheet 12, a flexible substrate 9,
It has a multilayer structure in which a center core sheet 13, a reinforcing material sheet 14, an inner sheet 16, and a back side oversheet 18 are laminated in this order.

In this embodiment, the inner layer portion of the card base material 8 having such a multilayer structure, for example, the center core sheet 13,
The physical properties of any or all of the inner sheets 12, 16 are partially changed.

In other words, as shown in FIG.
Make it softer.

For example, when changing the physical properties of the center core sheet 13, the center core sheet 13 is divided into two parts, a part B where an IC chip is mounted and a part where no IC chip is mounted. The part where the IC chip is not mounted is replaced with a soft member, such as a rubber sheet. The same applies when changing the physical properties of the inner sheets 12 and 16.

However, in the IC card of this embodiment, the physical properties of the inner layer of the multi-layered card base material 8 have been changed, so that the entire card base material 8 is subjected to "bending" force. The force is absorbed by the soft part A of the inner layer. Furthermore, since the IC chip is mounted at a position outside the central portion of the card base material 8, it is difficult for "bending" forces in the longitudinal direction to be transmitted from the IC to the chip.

In addition, in the above-mentioned embodiment, the portion A in which the IC chip is not mounted in any or all of the center core sheet 7-13 and the inner sheet 12.16 is replaced with a rubber sheet, etc. Instead of replacing it, it is also possible to use a sheet made by joining two vinyl chloride sheets with different physical properties with different addition ratios of plasticizers into one sheet.

Furthermore, in the above-described embodiment, the mounting position of the IC chip is closer to the left side than the center part of the card base material.
The mounting position of the chip may be on the right side, on the upper side, or on the lower side.

Further, the physical properties may be partially changed not only in the inner layer portion of the card base material 8 but also in the entire card base material including the front oversheet 17 and the back oversheet 18.

Furthermore, even if the card base material 8 does not have a multilayer structure as described above, the parts A and I where the IC chip is not mounted.
The present invention is applicable as long as the physical properties can be made different from the portion B on which the C chip is mounted.

[Effects of the Invention] As explained above, in the IC card of the present invention, especially in the inner layer portion of the card base material having a multilayer structure, the portion where the IC chip is not mounted is larger than the portion where the IC chip is mounted. Since it is made soft, even if an external force, especially a bending force, is applied, the force is absorbed by the soft part, and there is no risk of excessive force being applied to the IC chip or its connection parts, resulting in high reliability.

[Brief explanation of the drawing]

FIG. 1 is a plan view including a partially transparent view showing the structure of the IC card of the present invention, FIG. 2 is a cross-sectional view taken along line 1-1,
FIG. 3 is a plan view including a partial perspective view of a general IC card. 1.8...Card base material 2.6...Memory chip 3.7...Microprocessor chip 4.10
...Input/output terminal 5.9...Flexible board 12.16...Inner sheet 13...Rental core sheet 14
......Reinforcement sheet 17...
......Front side oversheet 18...
...Back side oversheet representative patent attorney Su
Yamasa - Figure 3

Claims (5)

[Claims] (1) In an IC card in which an IC chip is mounted inside a card base material, a portion of the card base material where the IC chip is not mounted is made softer than a portion where the IC chip is mounted. IC characterized by
card. (2) The IC card according to claim 1, wherein the card base material has a multilayer structure. (3) I according to claim 1 or 2, wherein at least the inner layer portion of the card base material is made of vinyl chloride resin.
C card. (4) The IC card according to claim 2 or 3, wherein the physical properties are partially changed in a member constituting the inner layer portion of the card base material. (5) The IC card according to any one of claims 1 to 4, wherein the IC chip is mounted at a position outside the central portion of the card base material.