JPS62290594A - Ic card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] 3. Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to
Regarding cards.

[Technical aspects of the invention and its problems]

In recent years, microcomputers (hereinafter referred to as MPUs),
Deep cards with R&II IC chips such as memory,
Research is underway on cards called memory cards, microcomputer cards, or electronic cards (hereinafter simply referred to as IC cards).

Compared to conventional magnetic cards, such IC cards have
Because of their large storage capacity, banks are considering using them to store the history of deposits and savings in place of passbooks, and credit cards are considering storing the history of transactions such as shopping.

Such an IC card usually includes a card-shaped center core in which an IC module is embedded, and an oversheet laminated on both or one side of the center core to increase the mechanical strength of the card.

However, in such conventional IC cards, the built-in IC module is made of a material that does not have elasticity, so if it is strongly bent, it may break or crack at the boundary between the IC module and the card base material. In extreme cases, there is a problem that the IC module may fall off from the card.

[Summary of the invention]

The present invention has been made in view of the above points, and an object of the present invention is to provide an IC card having sufficient mechanical strength and flexibility against bending.

In order to achieve such an object, the IC card according to the present invention is an IC card in which an IC module in which an IC chip, a circuit board, etc. are embedded in a base material is built into the card material.
In the card, an adhesive sheet consisting of a plastic film and polyolefin adhesive layers formed on both sides is used as an adhesive sheet.
It is characterized in that it is laid so as to cover at least the boundary edge between the card base material and the IC module in the plane direction of the C card.

[Embodiments of the invention]

Hereinafter, the present invention will be explained in more detail with reference to the drawings.

As shown in FIG. 1, the IC card of the present invention basically includes center cores 1a, 1b, an oversheet 2a,
An IC module 4 is embedded in a card base material 3 made of an 8% layer of 2b, and an adhesive having an area slightly larger than the bottom surface of the IC module is attached to the surface of the IC module 4 opposite to the connection terminals 5. Sheet 6 is laid. Further, in this example, in order to improve the mechanical strength against bending of the card, at least a portion of the side portion of the IC module may include a reinforcing body 4a extending in the outer circumferential direction. Reference numeral 5 is a terminal for electrical connection with the outside.

FIG. 2 is an enlarged sectional view of the adhesive sheet 6. In the present invention, the adhesive sheet 6 is the plastic film 2
A polyolefin adhesive layer 22 is laminated on both sides of 1. The adhesive layer 22 may be of the same type or different types.

As the plastic film 21, polyester, polycarbonate, cellulose polyimide film, etc. may be used, but polyester film is particularly preferred in terms of reinforcing effect. In addition, plastic film 2
The thickness of 1 is preferably in the range of 3 to 50 μm. If the thickness is less than 3 μm, a good reinforcing effect cannot be obtained, while if it exceeds 50 μm, it becomes too thick, which is disadvantageous.

As the material for the adhesive layer 22, polyolefin thermal adhesives are preferably used, and ethylene-acrylic acid copolymer adhesives and ethylene-vinyl acetate copolymer adhesives are particularly preferably used. Further, the thickness of the adhesive layer 22 is suitably 1 to 80 μm in consideration of obtaining good adhesive force and not disadvantageous card thickness.

Note that by making the plastic film 21 opaque white or a color similar to that of the IC module, it has the effect of hiding the shadow of the IC module when the IC card is viewed from the actual side, which improves the printability on the back side of the card. , it is possible to improve the aesthetics and the anti-counterfeiting effect. Examples of whitening methods include kneading a white pigment into the film material and separately coating a white layer.

An actual manufacturing example will be described below with reference to FIGS. 3 and 4.

Example 1 FIGS. 3(a) to 3(m) are perspective views of each component of the IC card of the present invention.

First, using a transfer method, an ethylene-acrylic acid copolymer thermal adhesive (
AC2000, manufactured by Mitsubishi Yuka Fine Co., Ltd.), and on the other side, an ethylene-vinyl acetate copolymer thermal adhesive (EC1200, manufactured by Mitsubishi Yuka Fine Co., Ltd.) was formed to a thickness of 2 μm each. Then, an adhesive sheet 6 was prepared.

Next, the adhesive sheet 6 was cut to have a larger area than the IC module 4, and temporarily adhered on a hot plate with the adhesive layer Ac2000 oriented toward the IC module. Next, this was laminated together with center cores ia and ib in which punch holes were provided in the IC module embedding portions, and oversheets 2a and 2b, and integrated by a hot press method to obtain an IC card.

In the IC card thus obtained, the adhesive sheet 6 exhibits both a good adhesion reinforcing effect, and problems such as peeling of the IC module and cracking of the oversheet during card bending are avoided. There wasn't. Furthermore, since white polyester was used, it had an excellent effect of hiding the IC module.

Example 2 As shown in Figure 4, first apply thermal adhesive (E
CI 200, manufactured by Mitsubishi Yuka Fine Co., Ltd.) was formed to a thickness of 20 μm by a roll coating method,
An adhesive sheet 6a was created.

Next, the IC module is inserted into the center cores Ia and 1b, which have punched holes in the IC module corresponding parts, and the oversheet 2a, an adhesive sheet 6a having the same shape as the card is placed on the back side, and an oversheet 2b is placed on top of the other. , an IC card was manufactured by hot pressing.

When the thus obtained IC card was subjected to a bending test (according to ISO standards), no problems such as peeling off of the IC module end or cracking of the oversheet occurred.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of the IC card of the present invention, FIG. 2 is a cross-sectional view of the adhesive sheet, and FIGS. 3 and 4 are perspective views of each component of the IC card of the present invention. 1... Center core, 2... Oversea h, 4.
...IC module, 6...adhesive sheet. ro 1 figure death 2 figure also 3 figure

Claims (4)

[Claims] 1. I, which is made by embedding IC chips, circuit boards, etc. in the base.
In an IC card in which a C module is built into a card base material, an adhesive sheet consisting of a polyolefin adhesive layer formed on both sides of a plastic film is used as an IC card.
At least the card base material and I
An IC card characterized by being installed so as to cover the peripheral edge of the boundary with the C module. 2. The IC according to claim 1, wherein the polyolefin adhesive layer is a thermal adhesive made of an ethylene-acrylic acid copolymer or an ethylene-vinyl acetate copolymer.
card. 3. The IC according to claim 1 or 2, wherein the plastic film is made of a polyester film.
card. 4. the plastic film is opaque white;
I of any one of claims 1 to 3
C card.