JPH01105794A - Ic card - Google Patents

Abstract

PURPOSE: To provide an IC card superior in the workability and productivity without design limit by forming a recessed opening part for loading an IC module on a laminated vinyl chloride card by the cutting work or the pressing work, and remaining an opaque core material of a specific thickness on a bottom of the opening part. CONSTITUTION: An external connection terminal part side transparent oversheet 21, an opaque core material 22 and an opposite face transparent oversheet 23 are overlapped, heated and simultaneously pressed to be laminated. Then a recessed opening part 24 for loading an IC module is formed by the cutting work or the like, and a thickness A of the opaque core material remained on the bottom of the recessed opening part 24 is adjusted to be 80 μm. Then an adhesive layer 27 is formed, and the IC module 25 is loaded in such a manner that the external connection terminal part 26 is projected outside of the card, to be fixed by the adhesive agent 27.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an IC card incorporating an IC chip.

Conventional technology Identification cards that identify individuals have traditionally used magnetic or optical reading methods, but these lacked permanence and were changeable, resulting in low identification security. . For this reason, recently, so-called IC cards containing built-in IC chips such as microcomputers and memories are being put into practical use as identification cards.

This IC card has a larger storage capacity and better security than the magnetic stripe cards that are already widely used, so it is not only used for conventional magnetic stripe cards, but also used as a bank passbook. The history of substitute deposits and savings, and the history of transactions such as shopping in the case of credit,
In the medical field, the practical application of various application systems using IC cards, such as storing personal health data, is being considered.

Conventionally, this type of card has two sheets of opaque core material 21 with a thickness of 28 μm, as shown in FIGS. 9 to 12.
The one side design 9a of the card is printed on one side of one of the opaque core materials 2a of 2b, and these two opaque core materials 2
A through hole 11 having the size of the IC module 5 is formed using an end mill, a press mold, etc., with or without a design of 1L or 2b. On the other hand, print various designs on the transparent oversheet 3 on the opposite side of the external connection terminal section 9b
After that, as shown in FIG. 1Q, peta printing 13 is performed so that the back surface of the IC module 6 is not visible from the transparent oversheet 3 side. Next, as shown in FIG. 11, an IC module 6 with a thickness of 630 μm, which is almost the same as the combined thickness of the opaque core materials 2a and 2b and the transparent oversheet 1 on the external connection terminal side, and an adhesive layer 7 with a thickness of 30 μm are inserted through the through holes. 11
design printing 9b and solid printing 13 were applied to the external connection terminal side transparent oversheet 1 made of vinyl chloride or the like and having a thickness of about 100 μm and the transparent oversheet 3 on the side opposite to the external connection terminal portion and having a thickness of about 100 μm. The transparent oversheet 12 is superimposed on the opaque core material 2a12b, and if necessary, the magnetic stripe 10 is attached on the external connection terminal side transparent oversheet 1.
At the same time as heating to 0°C, pressurizing at 15 to 36 Kq/crl and laminating for several minutes to form the I shown in Figure 12.
A C card 14 is being produced.

As shown in FIG. 13, the IC module 5 includes external connection terminals 6 formed on the surface of an insulating substrate 1S using metal foil or plating, an IC chip 16 bonded to the opposite surface of the insulating substrate 150, and gold wires 1 The wiring pattern is connected to the wiring pattern on the insulating substrate 15 by bonding with a film carrier, inner lead bonding with a film carrier, etc., and a part of the wiring pattern is electrically connected to the external connection terminal part 6 through a through hole, etc., and the spacer 18 is It is made by pasting the IC chip 1θ on an insulating substrate 15 so as to surround it, and covering the IC chip 16 with a sealing resin 19 such as epoxy resin.

Problems to be Solved by the Invention In such a conventional configuration, a design is printed on the transparent oversheet 3 on the opposite side to the external connection terminal section 6, and a design is printed on top of the transparent oversheet 3 so that the back surface of the IC module 6 is not visible from the outside. Furthermore, the transparent oversheet 3 is thin at 100 μm and tends to curl depending on the printing ink, making it difficult to work with, and depending on the color, the back side of the IC module 6 may not be visible from the outside. The problem was that it was very difficult to do so, and the design of the card was restricted.

The present invention solves these problems by changing the concept from the conventional configuration in which solid printing is applied to the transparent oversheet on the opposite side of the external connection terminal section to hide the back side of the IC module. The purpose is to improve work efficiency, reduce man-hours, and free from design constraints.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a card base made of a multi-layer laminate of a transparent oversheet and an opaque core material, by cutting or processing the oversheet on the side where the external connection terminals are exposed. A concave opening for mounting an IC module containing a built-in C chip is provided by press working, the IC module is incorporated into this opening, and the thickness of the opaque core material is left at least 8 Q μm or more at the bottom of the concave opening. It has a similar structure.

Function: This configuration eliminates the need for solid printing to prevent the back side of the IC module from being seen after printing a design on the transparent oversheet on the opposite side of the external connection terminal area, as in the case of conventional magnetic stripes. It was laminated using the same process used to manufacture cards. By cutting a hole to attach an IC module to a vinyl chloride card and attaching an IC module,
Design constraints are eliminated, mass production is excellent, and a highly reliable engineered C card can be obtained.

EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.

That is, the present invention has devised the card layer structure and card formation. It has a thick opaque core material in the middle layer (1
A design can be printed on the front and back sides of this core material, and the transparent oat sheet on the opposite side of the external connection terminal section is laminated with a structure that is as thin as possible. Then, a concave opening for mounting an IC module containing an IC chip is provided by cutting with a drill or the like from the transparent oversheet surface on the external connection terminal side, and the IC module is adhered thereto. on the other hand,
IC cards are required to have a thickness of 760 μm, which is the same as conventional magnetic stripe cards, as is being considered for standardization by the International Organization for Standardization (I5O), so the thickness of the IC module and IC chip to be installed are Although IC modules are fabricated using the latest insulating substrate manufacturing technology, wire bonding technology, and IC chip manufacturing technology, and are reliable and mass-producible, the thickness is 560~ 630μm, and when this is attached to the card, the remaining thickness of the card material under the IC module is 210μm.
~130 μm. However, as the remaining thickness of the card material under the IC module becomes thinner, the bending strength of the card becomes weaker.

It is known that with current vinyl chloride cards, the remaining thickness of the card material under the IC module must be about 100 μm in order to pass the ISO standard card bending test. Here, we tried to connect the transparent oversheet and the back side of the module in order to prevent the back side of the IC module from being visible through the transparent oversheet without using methods such as solid printing when the remaining thickness of the card material under the IC module was small. The present invention provides an IC card having a structure in which an opaque core material is always present between the IC card and the opaque core material having a thickness of 80 μm or more.

Hereinafter, specific examples will be described.

[Example 1] Figs. 1 to 4 show the manufacturing process of an embodiment of the present invention and a cross section of a completed IC card.

In FIG. 1, a transparent oversheet 21 on the external connection terminal side of 160 μm and opaque core materials 22 and 3 of 660 μm are shown.
A transparent oversheet 23 on the opposite side to the 0 μm external connection terminal portion is prepared. Next, stack these sheets and
15-35 K9/ at the same time as heating to 0-150℃
By applying pressure at a pressure of 1.5 cm and laminating for several tens of minutes, a card with a thickness of 760 μm as shown in FIG. 2 is obtained. Next, as shown in FIG. 3, a concave opening 24 for mounting the IC module is formed by cutting or the like. At this time, the remaining thickness of the opaque core material at the bottom of the concave opening 24 was set to 80 μm. Next, as shown in FIG. 4, a 20 μm adhesive layer 27 is formed, a 630 μm IC module 25 is attached so that the external connection terminal portion 26 protrudes outside the card, and the card is fixed with the adhesive 27. An IC card 28 of the invention is obtained.

[Embodiment 2] FIGS. 5 to 8 show the manufacturing process of another embodiment of the present invention and a cross section of a completed IC card.

In FIG. 6, the external connection terminal side transparent oversheet 21 of 150 μm and the thickness 28 printed with the design 29a are shown.
A core material 22& having a thickness of 0 μm, a core material 22b having a thickness of 280 μm printed with another design 29b, and a transparent oversheet 23 on the side opposite to the external connection terminal portion of 301 tm are prepared.

Next, these sheets are stacked on top of each other, heated to 100-150°C and simultaneously pressurized at 16-36 Kr/ca, and laminated for several minutes to form a layer with a thickness of 760 μm as shown in Figure 6.
card can be made. Next, as shown in FIG. 7, a concave opening 24 is formed by cutting or the like to mount the IC module.
form. At this time, the remaining thickness of the opaque core material at the bottom of the concave opening 24 was set to 80 μm. Next, as shown in FIG. 8, a 20 μm adhesive layer 27 is formed, a 630 μm IC module 25 is attached so that the external connection terminal portion 26 protrudes outside the card, and the card is fixed with the adhesive 27. An IC card 28 of the invention is obtained.

Comparative Example In Examples 1 and 2, the remaining thickness of the opaque core material at the bottom of the concave opening 24 was set to 703 m, and an IC card was produced.

Specific examples, conventional examples, and comparative examples of the present invention are shown in the table below to supplement the explanation of the present invention.

Table 1 shows the evaluation of the module visibility from the oversheet surface of the IC card, productivity, workability, and card design constraints in the examples, comparative examples, and conventional examples.

As shown in Table 1, in the IC card of the present invention, the back side of the IC module 25 is no longer visible from the transparent oversheet 23, there are no design restrictions, and workability is improved, and productivity is doubled compared to the conventional method. It is clear that this is effective in improving the productivity and appearance quality of the IC card.

(Hereinafter referred to as "margin") Effects of the Invention As described above, according to the present invention, there is no need for solid printing to prevent the back side of the IC module from being seen from the outside.
Moreover, the design is printed on a thick sheet rather than a thin transparent oversheet, which has excellent workability, and there are no restrictions on design.This IC card and its manufacturing method has excellent workability and productivity. It is a dog with great utility value.

[Brief explanation of the drawing]

FIGS. 1 to 4 show an IC according to a first embodiment of the present invention.
FIG. 6 to FIG. 8 are cross-sectional views of the IC card manufacturing process according to the second embodiment of the present invention, and FIGS. 9 to 13 are cross-sectional views of the IC card manufacturing process according to the conventional IC card manufacturing method. , an exploded perspective view and a sectional view showing the configuration and how to make it. 21... External connection terminal side transparent oversheet, 22... Opaque core material, 23... Transparent oversheet, 24... Opening, 25...・
...IC module, 26...External connection terminal section, 27...Adhesive, 28...Work 0
Card, 29 a, 2 e b °-----Tesai 7, mm °°・°゛ Remaining thickness of opaque core material. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Entrance Figure 3 ZCV-, Mur Figure 5 Castle

Claims (3)

[Claims] (1) A concave shape for mounting an IC module containing an IC chip is formed by cutting or pressing from the oversheet on the side where the external connection terminals are exposed on the card base, which is multi-layer laminated with a transparent oversheet and an opaque core material. An IC card comprising an opening, an IC module is assembled in the opening, and an opaque core material having a thickness of at least 80 μm remains at the bottom of the concave opening. (2) A design is printed on at least one of the front and back surfaces of the opaque core material, and the opaque core material with the design printed and a transparent oversheet are laminated in multiple layers. IC card listed. (3) The IC card according to claim 1, wherein the opaque core material is composed of a multilayer sheet having two or more layers.