JPH11115355A - Composite ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a crack of an IC chip by forming a recess on an antenna card body having an antenna coil provided with a soft conductive base material layer embedded therein, and connecting a connecting terminal of an IC module of the recess to a connecting terminal of the coil via the base material layer formed at an end of the recess at the bottom side. SOLUTION: A card body 30 having an antenna coil board 10 for thickly placing soft conductive base material layers 15 of a conductive adhesive or the like on connecting terminals 12 of both front ends of an antenna coil 11 and covered on both surfaces with card base materials to be embedded is formed. And, recesses 14 for containing a spot facing IC module 20 are formed on the layers 15 of the body 30. And, connecting terminals 13 of the module 20 are connected to connecting terminals 12 of the coil 11 via the layers 15 at both ends of the bottoms of the recesses 14. As the layers 15, in addition to a conductive adhesive, conductive rubber, solder or the like is preferably used. And, as the card base material, an insulating synthetic resin is used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card which realizes a non-contact function and a contact function with one chip, and more particularly, to a composite IC card in which a non-contact type IC card and a contact type IC card are integrated, and a composite IC card therefor. It relates to a manufacturing method.

[0002]

2. Description of the Related Art Conventionally, in the fields of credit cards, ID cards, cash cards, and the like, as a card replacing a magnetic card, an IC module including a semiconductor memory such as a microprocessor, RAM, and ROM is mounted on a card material. A so-called IC card has been developed because of its extremely large information recording capacity and high security.

[0003] These IC cards are roughly classified into a type of reading by a contact type and a type of reading by a non-contact type.
The contact type performs power supply and information communication by directly contacting and connecting a reader-side terminal to an external terminal exposed on the surface of the card. Most current IC card types fall into this category. In the reading of this contact-type card, the error rate for a good card is extremely low, but if the external terminals are dirty or damaged by abrasion, electrical conductivity may be lost and reading may not be possible. . Further, in a dry environment, the surface of the card is easily charged with static electricity, which causes a reading error.

Therefore, in recent years, an IC card using a non-contact type IC module including an IC chip for a memory and a coil having a function as a power supply and communication antenna has been developed. The non-contact type IC module used for this card does not need to expose the communication terminal to the card surface when making the card because the communication is performed in a non-contact manner. Don't worry. Such non-contact type IC modules have different shapes depending on the amount of stored information, the transmission medium system, the read / write distance, and the like. Above all, there are a wide variety of coil shapes such as a circular type and a polygonal shape with a rectangle as the center, depending on the difference in the transmission medium system.

Further, at present, a composite IC card has been proposed in which the above-mentioned non-contact type IC card and contact type IC card are combined to realize a non-contact function and a contact function with one chip. In other words, by combining the ease of use of contactless type with the security of contact type, it is suitable for, for example, fee payment operation and billing in bank ticket systems, bank transactions, various identity confirmation operations, etc., and realizes convenient applications This is a composite IC card manufactured for the purpose of

[0006] The method of manufacturing the composite IC card varies depending on the form of the module. The method for manufacturing the composite IC card includes the case of an inlet (the antenna coil and the module are electrically connected) and the case of a separate module and the antenna coil. It can be roughly divided into two. That is, as one method, carding of the inlet is, as shown in FIG. 4, an inlet 18 in which the IC module 20 and the antenna coil 11 are already electrically connected.
The antenna coil 11 may be mounted on the antenna substrate 10 or may be wound. However, in many cases, the connection between the antenna coil 11 and the IC module 20 in this mode is unstable, and in particular, in the case of the wound antenna coil 11, there is a concern about disconnection at the time of conveyance. In the case where the antenna coil 11 is mounted on the substrate 10, when the card is formed, it is necessary to expose the substrate portion of the IC module 20 to the outermost surface and to mount the antenna coil substrate 10 on the card base material without increasing the thickness. Is difficult to manufacture because of the inability to control

[0007] In order to mount the inlet 18 on the card base material, as a general method, there are a method in which the inlet 18 is sandwiched by a thermoplastic resin base material and thermocompression bonding (thermal lamination) and a method in which the periphery is formed by injection molding of a molten resin. There is a sealing method etc.,
In any case, since a large pressure is applied to the IC module 20, there is a concern that the IC chip may be cracked. Therefore, carding by the inlet 18 is inevitably a method lacking in mass productivity.

On the other hand, as shown in FIG.
When the antenna coil 11 is separate from the card, the antenna coil 11 is built in the card base material in advance.
Methods of taking out the antenna coil side connection terminals 12 from both ends of the coil 11 have been devised and disclosed by various companies. However, there is little disclosure of a technique for exposing the connection terminal 12 to a space (for example, a concave portion) for storing the module 20.
Therefore, this technique has to be said to be quite difficult.

[0009]

SUMMARY OF THE INVENTION Accordingly, the present invention provides an antenna card body having a built-in antenna coil by laminating a card substrate / antenna coil / card substrate as a method utilizing the existing technology in card manufacturing. Then, a concave portion for accommodating the IC module is formed in the card body by counterbore, and an antenna coil side connection terminal is exposed on the bottom surface of the concave portion. A composite IC card in which the IC module is mounted in the concave portion and connected to the antenna coil is formed. To provide.

[0010]

In order to achieve the above object, according to the present invention, first, a contact type IC module is connected to an antenna coil for performing non-contact communication, and a card body is provided. A soft conductive base material layer such as a conductive adhesive is provided on each connection terminal at both ends of the antenna coil, and the antenna coil is embedded in the card base material. Forming an antenna card body, forming a recess for accommodating an IC module by piercing the antenna card body on the soft conductive substrate, and exposing a soft conductive base material layer at the bottom side end of the recess. The connection terminal on the IC module side and the connection terminal on the antenna coil side are connected via a soft conductive base material layer.

In a second aspect of the present invention, a contact type IC module is connected to an antenna coil for performing communication without contact.
A method of manufacturing a composite IC card having a contact function and a non-contact function in a single chip embedded in a card body, wherein a connection terminal at both ends of an antenna coil formed on the antenna coil substrate is provided. Potting a soft conductive base material such as a conductive adhesive to a thickness of 10 to 20 μm, vinyl chloride resin and AB so as to sandwich both sides of the antenna coil substrate.
An antenna coil main body is formed by burying an antenna coil substrate in a card base material made of S, PET, etc., and a concave portion serving as a module storage space is formed by digging a part of the card main body on the soft conductive base material. The soft conductive base material is exposed at both ends of the bottom surface of the concave portion, and the connection terminal on the IC module side and the connection terminal on the antenna coil side are connected and integrated via the soft conductive base layer. And

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in the drawing, the present invention provides a soft conductive base material layer such as a conductive adhesive on connection terminals at both ends of an antenna coil, and this antenna coil substrate is used as a card base material. By embedding the card body by thermocompression bonding (thermal lamination method) or injection molding method using a molten resin, a recess is formed in a partial area of the card body on the soft conductive substrate, and the bottom surface of the recess is formed. A composite IC in which a soft conductive base material layer is exposed at both ends and a connection terminal of an IC module and an antenna coil are connected through the soft conductive base material layer to be integrated.
It is a card and its manufacturing method.

Further, an embodiment will be described with reference to the drawings. FIG. 1 is an explanatory sectional view of a composite IC card according to an embodiment of the present invention. As shown in the figure, soft conductive base layers 15, 15 of conductive adhesive or the like are thickly provided on the connection terminals 12, 12 at both ends of the antenna coil 11, and the soft conductive base layers are thickly mounted. The antenna coil substrate 10 thus formed is covered with a card base material from both sides to form a card body 30 in which the antenna coil substrate 10 is buried, and a concave portion for accommodating a counterbore IC module on the soft conductive base material 15 of the card body. 14 are formed, and the soft conductive base layers 15, 15 are exposed at both ends of the bottom surface of the concave portion 14, and the connection terminals 13, 13 of the IC module 20 and the antenna are interposed via the soft conductive base layers 15, 15. A composite IC card is formed by connecting the connection terminals 12 and 12 of the coil.

The soft conductive substrates 15 are preferably made of a conductive adhesive, conductive rubber, solder or the like.
The conductive adhesive includes conductive powder (silver powder, copper powder, graphite powder, carbon black, nickel powder, etc.), resin binder (epoxy, phenol, melamine, urethane,
Acryl, saturated polyester, etc.) and a solvent, and which material to select for each depends on the purpose and application. The conductive rubber is made of polyorganosiloxane (generally called raw rubber), a π-electron transfer type conductive substance such as carbon flux, graphite, or carbon fiber, or a metal such as gold, silver, copper, nickel, zinc, or silicon. And an oxide, a carbide thereof, or a free electron transfer type conductive substance such as an alloy or metal fiber dispersed therein to make it conductive.

The card base material in which the antenna coil is embedded is made of polyvinyl chloride resin (PV) in terms of cost.
Insulating synthetic resins such as C) and ABS resins are often selected. Among them, PVC is most commonly used except for special applications.

FIG. 2 shows a composite I in one embodiment of the present invention.
It is process explanatory drawing which shows the manufacturing method of C card. FIG. 2 (A
D) show a manufacturing process of a composite IC card in which connection terminals on the IC module side and connection terminals on the antenna coil side are connected. First, as shown in FIG. 2A, conductive adhesives 15, 15, which are soft conductive base materials, are provided on connection terminals 12, 12 at both ends of the antenna coil formed on antenna coil substrate 10. To a thickness of 10 to 20 μm. That is, the terminal portion is formed higher by the conductive adhesive. Next, a card base 30a of a thickness A made of vinyl chloride resin or the like sandwiching both surfaces of the antenna coil substrate 10 and having the same thickness as the height A of the IC module (shown in FIG. 1) and the remaining card thickness. After laminating 30b,
The antenna card body 30 is formed by thermocompression bonding and burying the antenna coil substrate almost in the vicinity of the center (see FIG. 2B). Further, as shown in FIG.
A part of the card body on the buried conductive adhesive layers 15 and 15 is crossed from the surface to form a concave portion 14 of a storage space for the module 20. The recess 14 is formed in accordance with the module shape. In the case of the present embodiment, the recess 14 is formed with a step. 14
b is formed. At this time, the conductive adhesive layers 15 are exposed at the bottom end of the first recess 14a. Next, as shown in FIG. 2 (D), the exposed conductive adhesive layers 15 and 15 are attached so that the connection terminals 13 and 13 of the IC module 20 are in contact with each other. Coil connection terminals 12, 12
Was connected, and a composite IC card was obtained.

[0017] In addition, during the formation of the concave portion,
If it reaches the Acatena coil side connection terminal, there is a risk of damaging the blade of the counterbore machine or cutting the terminal itself, so apply a high conductive adhesive on the terminal so as not to damage the terminal directly, The counterbore was designed so that the counterbore was completed before reaching the terminal (thickness: 10 to 20 μm). Further, the degree of damage to the blade of the machine when the conductive adhesive is pierced is the same as that of a general card base material, and the blade is more reliably damaged than the metal terminal.

FIG. 3 is an explanatory diagram showing a manufacturing process of a composite IC card according to another embodiment of the present invention. FIG.
D) shows a manufacturing process of a composite IC card which is connected to the antenna coil side connection terminal when the connection terminal position of the IC module is different. First, as shown in FIG. 3A, conductive adhesives 15, 15 as a soft conductive base material are applied onto connection terminals 12, 12 at both ends of the antenna coil formed on antenna coil substrate 10. 10-20μ
Serve to a thickness of m. That is, the terminal portion is formed higher by the conductive adhesive. Next, card substrates 30a and 30b of different thicknesses made of vinyl chloride resin or the like are laminated so as to sandwich both surfaces of the antenna coil substrate 10,
The antenna card body 30 is formed by embedding the antenna coil substrate below the center of the card base material by thermocompression bonding (see FIG. 3B). Further, as shown in FIG. 3 (C), a partial area of the card body on the embedded conductive adhesives 15 and 15 is crossed from the surface, and the module 20 is removed.
The recess 14 is formed in the storage space, and the conductive adhesive layers 15 are exposed at the bottom end. Next, as shown in FIG. 3 (D), the exposed conductive adhesive layers 15 and 15 are mounted so that the connection terminals 13 and 13 provided on the lowermost surface of the IC module 20 are in contact with each other. The module connection terminal and the antenna coil connection terminals 12, 12 were connected, and a composite IC card was obtained. In the present embodiment, a method for manufacturing an antenna card body using two card base materials has been described. However, the present invention is not limited to this, and an injection molding method is also possible. The electrical connection of the IC module in the recess is made by connecting the connection terminals on the IC module side and the antenna coil side with a conductive adhesive, but the other portions are fixed to the physical card base material of the IC module. Is fixed with a general-purpose adhesive.

Further, similarly to the above-described embodiment, when the counterbore reaches the connection terminal on the antenna coil side when forming the recess, there is a risk that the blade of the counterbore machine may be damaged or the terminal itself may be cut. Therefore, in order not to damage the terminal directly, a conductive adhesive is applied on the terminal at a high level, and the counterbore is designed to be finished before reaching the terminal (thickness 10 to 10).
20 μm).

[0020]

As described above, the present invention has the following effects. The composite IC card of the present invention can produce a card body (a card in which an antenna coil is embedded in a card base material) by using an existing manufacturing technique for an antenna coil in which a soft conductive base material is thickly mounted on connection terminals. It is. That is, the antenna coil can be sealed in the card base material by a heat lamination method or an injection molding method, which is a conventional non-contact IC card technique. Furthermore, the conventional contact type I
C card manufacturing technology can be adopted. In other words, the soft conductive base material is piled high on the connection terminal on the antenna coil side and cut so that the cutting blade of the counterboring machine does not directly reach the terminal. Can be exposed. Therefore, according to the manufacturing process of the present invention, since the embedding of the module into the card base material can be performed in a separate process from the molding of the card body, no direct pressure is applied to the IC module, and the cracking of the IC chip can be prevented. Can be. In addition, the technique of forming a concave portion for storing a module has various excellent effects, such as mass production being possible by adopting the simplest counterbore method.

[Brief description of the drawings]

FIG. 1 is an explanatory sectional view of a composite IC card according to an embodiment of the present invention.

FIGS. 2A and 2B illustrate a method of manufacturing a composite IC card according to an embodiment of the present invention, wherein FIG. 2A is a diagram illustrating a state in which an antenna coil substrate is embedded by a card base material, and FIG. Is a cross-sectional explanatory view of a card body in which is embedded, (C) is a cross-sectional explanatory view showing a state in which a recess is provided in the card body by counterbore, and (D) is an explanatory view showing a state in which an IC module is mounted in the recess. is there.

3A and 3B show a method of manufacturing a composite IC card according to another embodiment of the present invention, wherein FIG. 3A is an explanatory view showing a state in which an antenna coil substrate is embedded by a card base material, and FIG.
FIG. 2 is a cross-sectional explanatory view of a card body in which an antenna coil substrate is embedded, (C) is a cross-sectional explanatory view showing a state in which a concave portion is provided in the card body by counterbore, and (D) is an IC in this concave portion.
FIG. 4 is an explanatory diagram showing a state in which a module is mounted.

FIG. 4 shows a composite IC in the case of an inlet according to the prior art.
It is an explanatory view showing a card.

FIG. 5 is an explanatory view showing the manufacture of a composite IC card in a case where a module and an antenna coil in the related art are separate.

[Explanation of symbols]

 10 antenna coil substrate 11 antenna coil 12 antenna connection terminal 13 module connection terminal 14 concave portion 14a first concave portion 14b second concave portion 15 soft conductive base material (conductive) 18) Inlet 20 ... IC module 20a Front side of module (contact terminal) 20b Back side of module 21 Resin sealing portion of IC chip 30 Card body 30a, 30b Card base material

Claims (2)

[Claims] 1. A composite IC card which is connected to an IC module having an external connection terminal and an antenna coil for performing communication in a non-contact manner and is embedded in a card body, wherein the IC chip is formed at both ends of the antenna coil. A soft conductive base layer is provided on each of the connection terminals, and the antenna coil is buried in the card base to form an antenna card main body. A concave portion for storing a module is provided, and a soft conductive base layer is exposed at both ends of a bottom surface of the concave portion, and an IC module connection terminal and an antenna coil connection terminal are connected via the soft conductive base layer. Composite IC card. 2. The manufacture of a composite IC card having a contact function and a non-contact function with a single chip connected to a contact type IC module and an antenna coil for performing communication in a non-contact manner and embedded in a card body. A method wherein the antenna coil is formed on a film substrate, and a soft conductive substrate is formed on each of the connection terminals formed at both ends of the antenna coil.
The antenna card is laminated to a thickness of about 20 μm, covered with a card base material so as to sandwich both sides of the antenna coil substrate, and an antenna card body having the antenna coil substrate embedded therein is formed. A recess is formed as a storage space for the IC module by passing through a partial area of the main body, and a soft conductive substrate is exposed at both ends of a bottom surface of the recess. A method for manufacturing a composite IC card, comprising connecting and integrating the connection terminal of (1) and the connection terminal of the antenna coil side.