JPS61154938A - Integrated circuit card and manufacture thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an IC card in which an IC chip is mounted inside a card base material, and a method for manufacturing the same.

[Technical Background of the Invention] Conventionally, card base materials made of synthetic resin such as vinyl chloride resin have been coated with a magnetic stripe in a stripe pattern as data cards for proof of money withdrawals and withdrawals at financial institutions. So-called magnetic cards, in which various data such as account numbers and passwords are magnetically recorded on the magnetic stripe, are widely used.

This magnetic card has a simple structure, high durability, and is suitable for mass production, so it is widely used in the service industry and the like.

However, since such magnetic cards have a small information storage capacity, they can only record a small amount of information such as account numbers and PIN numbers, and therefore cannot be used for many purposes, such as recording deposits and withdrawals. In order to record different types of information, it is necessary to set up a separate ledger like a bankbook in a financial institution, which has been an obstacle to increasing the efficiency of information processing.

Furthermore, since information on this magnetic card can be read relatively easily from the outside, there are problems in maintaining airtightness and preventing theft.

Under these circumstances, in recent years, data cards called IC cards have been developed, which have a storage element and its control element built into the card to dramatically improve its information storage capacity.

For example, as shown in FIG. 5, this IC card has an IC chip 2 for storing and processing information mounted inside a card base material 1 made of electrically insulating synthetic resin, and input/output terminals 3.
is exposed from the surface of the card, and by setting it in the card processing section of a card reader/writer installed at a financial institution, it connects to the input/output terminal in the card processing section and IC.
Electrically connect the input/output terminals of the card and install the built-in t
This allows information to be written to or read from the C chip 2.

Note that the reference numeral 4 in the figure indicates a magnetic stripe.

Conventionally, the card base material 1 has a multilayer structure as shown in FIG. 6, which is made by laminating layers made of a wiring board and a thermoplastic resin. Manufactured. That is, in the conventional IC card, the fixing plate 6 is applied from the back side to the hole-drilled die-bonding position of the multilayer wiring board 5, and the IC chip 7 is die-bonded thereon.
The upper conductor pattern is connected with a bonding wire 8 and sealed with a thermosetting sealant 9, and a substrate 10 made of a thermoplastic resin and a thermoplastic resin powder 11 are coated on both sides of the thermoplastic resin. It has a structure in which an inner sheet 12 and a cover sheet 13 are laminated in this order, and is manufactured in this manner. Further, in manufacturing such an IC card, the lamination of the thermoplastic resin substrate 10 and the inner sheet 12, which have approximately the same melting point, and the lamination of the inner sheet 12 and the cover sheet 13 are performed by heating and pressurizing (e.g., 140 to 160°C, 1.2 kg/d) and fuse them together, whereas the multilayer wiring board 5, sealing material 9, thermoplastic resin board 10, etc. can be laminated by heating and pressing alone. Since adhesion is not possible, this is accomplished by applying a thermosetting adhesive between the layers and adhering them via this layer 14.

[Problems of the Background Art] However, the IC cards manufactured in this manner have various problems as shown below.

That is, (a) when the inner sheet 12 and the cover sheet 13 are stacked, the inner layer stacked first moves, and at the same time, the mounted IC chip 7 also moves and may be damaged.

(b) If two or more types of thermosetting adhesives with different melting points and hardening points are laminated in one operation using appropriate methods, the entire card may become distorted due to the difference in shrinkage rate of these thermosetting adhesives during the cooling process. or deformation may occur.

(c) The layers constituting the card base material 1 are largely misaligned, resulting in poor relative positional accuracy and non-uniform thickness.

(d) Because a liquid thermosetting adhesive is used,
The coating process requires one step and requires a hot wire to coat to a uniform thickness.

(e) Adhesive or the like may flow into the contact area of the card, covering this area and rendering it unusable.

There were various problems such as.

[Purpose of the Invention] The present invention has been made to solve these problems, and it eliminates delamination between each layer constituting the card base material and movement of mounted IC chips, etc., and eliminates distortion and deformation of the entire card. It is an object of the present invention to provide an IC card of excellent quality without any oxidation, and a method of manufacturing such an IC card.

[Summary of the Invention] In other words, the present invention provides an integrated circuit (IC) inside a card base material having a multilayer structure.
In an IC card in which a chip is mounted, the layers constituting the card base material are bonded via a thermosetting adhesive layer, and the layer located near the center in the thickness direction is The present invention relates to an IC card and a method for manufacturing the same, characterized in that the IC card is bonded via a layer of a thermosetting adhesive having a higher melting point and hardening point than layers located close to each other.

[Embodiments of the invention] Embodiments of the present invention will be described below based on the drawings.

FIG. 1 is a sectional view of one embodiment of the IC card of the present invention. In this figure, the same parts as in FIG. 6 are given the same reference numerals, and redundant explanation will be omitted.

In this embodiment, between the thermoplastic resin substrate 10 and the thermoplastic resin powder 11 and the front inner sheet 12,
And between the multilayer wiring board 5 and fixing plate 6 on the back side and the back inner sheet 12, the multilayer wiring board 5, the sealing material 9, the thermoplastic resin substrate 10, and the thermoplastic resin powder 11 are arranged.
A layer 15 of a thermosetting adhesive having a melting point and curing point lower than that of the thermosetting adhesive used for adhesion is inserted, and the respective layers are completely adhered via this layer.

Furthermore, on the front and back inner sheets 12, a thermoplastic resin having approximately the same melting point as the thermoplastic resin constituting the sheet, and an even lower melting point than the low melting point thermosetting adhesive, is used. Cover sheet consisting of 1
3 are laminated by heating and pressurizing.

The IC card of this embodiment having such a structure is manufactured by the following method.

That is, as shown in FIG. 2, after applying the fixing plate 6 from the back side to the hole-drilled die-bonding position of the multilayer wiring board 5, the 1C chip 7 is die-bonded onto the fixing plate 5, and the IC chip 7 and the wiring are connected. The conductive patterns on the substrate 5 are connected to each other by bonding wires 8, and then a thermosetting sealing material 9 is coated on the outside of these for thorough sealing. Next, as shown in FIG. 3, after applying a thermosetting adhesive with a high melting point and a high curing point on the sealing material 9 and the multilayer wiring board 5, the flatness of the melting point thermosetting adhesive layer 14 is A substrate 1o made of a thermoplastic resin is placed on top of the part and bonded by heating and pressing. Further, the recessed portion of the high-melting point thermosetting adhesive layer 14 provided on the sealing material 9 is filled with thermoplastic resin powder 11 and heated and pressed so that the surface is flat and integrated with the thermoplastic resin substrate 10. Form a filling part that becomes .

Next, as shown in FIG. 4, a thermosetting adhesive was applied to the flat-surfaced thermoplastic resin substrate 10 and the filling portion, the back surface of the multilayer wiring board 5, and the lower side of the fixing plate 6, compared to the previously used thermosetting adhesive. After applying a thermosetting adhesive having a low melting point and a hardening point, an inner sheet 12 having a low melting point is applied on the low melting point thermosetting adhesive layer 15.
are overlapped and heated and pressed to the curing point of the thermosetting adhesive to bond them. Finally, the inner sheet 1 glued in this way
A cover sheet 13 made of a thermoplastic resin having approximately the melting point is placed on the outside of each of these sheets and is heated and pressurized to fuse them together.

In this method, a layer 14 of thermosetting adhesive having a high melting point and hardening point is inserted between the multilayer wiring board 5 and the sealing material 9 and the thermoplastic resin substrate 10, etc., and the layer 14 is heated to a temperature corresponding to the hardening point. By heating, this thermosetting adhesive layer 1
After adhering the two through 4, the back surface of the thermoplastic resin substrate 10 etc. and the multilayer wiring board 5 and the inner sheet 12 on both the front and back sides are bonded.
and are bonded using a thermosetting adhesive having a lower melting point than the thermosetting adhesive, heated to a relatively low temperature corresponding to the curing point of this thermosetting adhesive, and finally further The inner sheet 12 and cover sheet 13 are laminated by heating and pressurizing at a low temperature.

Therefore, when laminating each layer, the thermosetting adhesive layer inserted and hardened first will not soften, and the layers and IC chip 7 bonded via this thermosetting adhesive layer will not move. There is no.

In addition, each layer is laminated one at a time, and after the distortion and deformation caused by the difference in shrinkage rate of each layer during cooling is released, the next layer is laminated, so an IC card without distortion or deformation is produced. can get.

In the above example, an example was explained in which a thermosetting adhesive layer was inserted by applying a liquid thermosetting adhesive. It is also possible to use a molded product.

In this case, the thermosetting adhesive layer can be inserted by simply inserting the adhesive cut into a desired size between predetermined layers, which has the advantage of good workability.

[Effects of the Invention] As is clear from the above description, the IC card of the present invention is capable of being bonded via a thermosetting adhesive layer having a higher melting point and hardening point as the layer is located closer to the center in the thickness direction. Since the card base material is made up of these materials, there is no delamination between each layer, no movement of IC chips, etc., each layer is completely bonded, and the card has excellent characteristics such as moisture resistance.

Further, by sequentially laminating the layers one at a time using the method of the present invention, it is possible to easily manufacture an IC card that has excellent properties and is free from deformation and distortion.

[Brief explanation of drawings]

Fig. 1 is a sectional view showing an embodiment of the present invention, Figs. 2 to 4 are sectional views for explaining the method of manufacturing this IC card, and Fig. 5 is a partially transparent view of a general IC card. FIG. 6 is a cross-sectional view of a conventional IC card. 2.7...IC chip 5...Multilayer wiring board 9...
...... Sealing material 10 ...... Thermoplastic resin substrate 12.
......Inner sheet 13...
・・・・・・Cover sheet 14・・・・・・・・・・
...High melting point thermosetting adhesive layer 15...
...Low melting point thermosetting adhesive layer Patent attorney Satoshi Suyama - Figure 1 Figure 3 Figure 4 Figure 5 Figure 6

Claims (3)

[Claims] (1) In an IC card in which an IC chip is mounted inside a card base material with a multilayer structure, each layer constituting the card base material is bonded via a thermosetting adhesive layer, and moreover, in the thickness direction An IC card characterized in that the layers located near the center of the IC card are bonded via a layer of thermosetting adhesive having a higher melting point and hardening point than those between the layers located near the surface. . (2) When laminating a plurality of layers on both sides of the IC chip after mounting the IC chip at a predetermined position on the wiring board, the layer disposed closer to the wiring board has a higher melting point and hardening point. A method for manufacturing an IC card, which comprises bonding using a mold adhesive and laminating one layer at a time. (3) A method for manufacturing an IC card according to claim 2, in which the thermosetting adhesive is formed into a thin sheet, which is sandwiched between predetermined layers and bonded by heating and pressing. .