JPH09277766A - Non-contact type ic card and its manufacture - Google Patents

Non-contact type ic card and its manufacture

Info

Publication number
JPH09277766A
JPH09277766A JP8088383A JP8838396A JPH09277766A JP H09277766 A JPH09277766 A JP H09277766A JP 8088383 A JP8088383 A JP 8088383A JP 8838396 A JP8838396 A JP 8838396A JP H09277766 A JPH09277766 A JP H09277766A
Authority
JP
Japan
Prior art keywords
core sheet
card
vinyl chloride
communication
hard vinyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP8088383A
Other languages
Japanese (ja)
Inventor
Kazuo Matsuda
一夫 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Priority to JP8088383A priority Critical patent/JPH09277766A/en
Publication of JPH09277766A publication Critical patent/JPH09277766A/en
Withdrawn legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact type IC card of a structure of fixing a communication circuit and a communication coil on a card base without using a bonding agent or an adhesive tape and also provide its manufacturing method. SOLUTION: A third core sheet 8 and a fourth core sheet 9 are overlapped together on both faces of a core sheet laminate 14 formed by pinching a communication circuit 3 and a communication coil 4 by a first core sheet 6 and a second core sheet 7, clamping a body thus formed by mirror face metal plates, heating the body up to the hard polyvinyl chroride fusion welding temperature and fixing by pressure thereon, and the communication circuit 3 and the communication coil 4 are fusion fixed on a hard polyvinyl chloride laminate formed by overlapping sheets 10 on pattern printed faces formed by the above arrangement to manufacture a card base.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、銀行用キャッシュ
カード、各種クレジットカード、各種プリペードカ−
ド、医療カード、ID(身分証明用)カードに適したI
Cカードとその製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bank cash card, various credit cards, and various prepaid cards.
Suitable for computer, medical card, ID (for identification) card
The present invention relates to a C card and its manufacturing method.

【0002】[0002]

【従来の技術】従来、ICカードは銀行用キャッシュカ
ードに代表される信用取引の分野におけるID(身分証
明用)カードや、或いは交通、通信、娯楽等の分野にお
ける前払い式のICカードとして普及している。通常I
Cカードは、ICチップを内蔵し通信用接触端子を具備
したICモジュールを、硬質塩化ビニルシートを加熱圧
着し積層することによって得られる厚さ0.76mmの
硬質塩化ビニル積層体に、ICモジュール用の凹部を座
ぐり、貼付けることによって得られている。
2. Description of the Related Art Conventionally, IC cards have been widely used as ID (identification) cards in the field of credit transactions represented by bank cash cards, or as prepaid IC cards in the fields of transportation, communication, entertainment and the like. ing. Normal I
The C card is used for the IC module in a 0.76 mm-thick rigid vinyl chloride laminate obtained by stacking an IC module with a built-in IC chip and equipped with communication contact terminals by thermocompression bonding a hard vinyl chloride sheet. It is obtained by spotting and sticking the concave part of.

【0003】[0003]

【発明が解決しようとする課題】上記ICカードは接触
型ICカードと呼ばれ、情報の読みだし、書き込みがI
Cモジュールの通信用接触端子を介して行われている。
しかしながら、この情報伝達方式では該通信用接触端子
が常に外界に曝されている為に、該通信用接触端子部の
損傷またはICモジュールに内蔵したICチップを破壊
してしまう危険性が高く、近年コイル等を用いた非接触
情報伝達方式による非接触型ICカードが検討されてい
る。
The above-mentioned IC card is called a contact type IC card, and reading and writing of information is performed by I
This is performed via the communication contact terminal of the C module.
However, in this information transmission method, since the communication contact terminal is always exposed to the outside world, there is a high risk of damaging the communication contact terminal portion or destroying the IC chip built in the IC module. A contactless IC card based on a contactless information transmission method using a coil or the like is under study.

【0004】上記した非接触型ICカードは、加熱圧着
し積層することによって得られる硬質塩化ビニル積層体
に、通信用回路及び通信用コイル用の凹部を座ぐった厚
さ0.76mmのカード基体、あるいは通信用回路及び
通信用コイルの凹部を具備したABS樹脂の射出成形体
からなる厚さ0.76mmのカード基体に、通信用回路
及び通信用コイルを接着剤または接着テープで固定し、
さらに前記カード基体上にプラスチックフィルムを接着
剤または接着テープで貼付けることで得られる。カード
基体上にプラスチックフィルムを接着シートで貼付けた
例を図3に示す。図3において、21はプラスチックフ
ィルムで、22は接着シートで、3は通信用コイルで、
4は通信用回路で、25はカード基体である。
The above-mentioned non-contact type IC card is a card body having a thickness of 0.76 mm, in which a hard vinyl chloride laminate obtained by thermocompression bonding and laminating is provided with recesses for a communication circuit and a communication coil. Alternatively, the communication circuit and the communication coil are fixed with an adhesive or an adhesive tape to a 0.76 mm-thick card base made of an injection-molded body of ABS resin having a recess for the communication circuit and the communication coil,
Further, it can be obtained by pasting a plastic film on the card base with an adhesive or an adhesive tape. FIG. 3 shows an example in which a plastic film is attached to a card base with an adhesive sheet. In FIG. 3, 21 is a plastic film, 22 is an adhesive sheet, 3 is a communication coil,
Reference numeral 4 is a communication circuit, and 25 is a card base.

【0005】しかしながら、上記した構成の非接触型I
Cカードでは、接着剤または接着テープの劣化によるプ
ラスチックフイルムの剥離や通信用コイルの断線という
問題が生じる。そのため種々、技術改良が検討されてい
るがこの問題点を解決するには至っていない。
However, the non-contact type I having the above structure
In the C card, problems such as peeling of the plastic film and disconnection of the communication coil occur due to deterioration of the adhesive or the adhesive tape. Therefore, various technical improvements have been investigated, but this problem has not been solved yet.

【0006】本発明の課題は、上記問題点を解消すべく
なされたものであり、問題点の原因となる接着剤または
接着テープを用いずに通信用回路及び通信用コイルをカ
ード基体に固定する構造の非接触型ICカード及びその
製造方法を提供することである。
An object of the present invention is to solve the above problems, and to fix the communication circuit and the communication coil to the card base without using an adhesive or an adhesive tape which causes the problems. A contactless IC card having a structure and a method for manufacturing the same.

【0007】[0007]

【課題を解決するための手段】本発明によれば、一対の
乳白色硬質塩化ビニルからなるコアシートに、該コアシ
ートを挟むようにして一対の透明硬質塩化ビニルからな
るオーバーシートが積層されてなる硬質塩化ビニル積層
体をカード基体とする非接触型ICカードにおいて、通
信用回路及び通信用コイルが前記カード基体の内部に硬
質塩化ビニルで融着固定されていることを特徴とする非
接触型ICカードが得られる。
According to the present invention, a hard chloride formed by laminating a pair of core sheets made of milky white hard vinyl chloride with a pair of oversheets made of transparent hard vinyl chloride sandwiching the core sheets. A non-contact type IC card having a vinyl laminated body as a card base, wherein a communication circuit and a communication coil are fused and fixed with hard vinyl chloride inside the card base. can get.

【0008】又、本発明によれば、通信用回路及び通信
用コイルを乳白色硬質塩化ビニルからなる第1のコアシ
ートと第2のコアシートで挟み、該第1のコアシートと
該第2コアシートを鏡面金属板で挟持し、硬質塩化ビニ
ル融着温度まで加熱した後、圧着して得られたコアシー
ト積層体の両面に、予め絵柄印刷を施した第3のコアシ
ートと第4のコアシートを印刷の無い面が接するように
重ね合わせ、該第3のコアシートと第4のコアシートの
絵柄印刷面に透明硬質塩化ビニルからなるオーバーシー
トを重ね合わせてなる硬質塩化ビニル積層体を鏡面金属
板で挟持し、加熱圧着し、硬質塩化ビニル積層体内部に
前記通信用回路及び前記通信用コイルを硬質塩化ビニル
で融着固定してカード基体を得ることを特徴とする非接
触型ICカードの製造方法が得られる。
Further, according to the present invention, the communication circuit and the communication coil are sandwiched between the first core sheet and the second core sheet made of opalescent hard vinyl chloride, and the first core sheet and the second core are sandwiched. A core sheet laminated body obtained by sandwiching the sheet with a mirror-finished metal plate, heating it to a hard vinyl chloride fusion temperature, and then pressure-bonding the same onto the both surfaces of a third core sheet and a fourth core sheet. The sheets are stacked so that the non-printed surfaces are in contact with each other, and a rigid vinyl chloride laminate obtained by stacking an oversheet made of transparent rigid vinyl chloride on the pattern printed surfaces of the third core sheet and the fourth core sheet is a mirror surface. A non-contact type IC card characterized by being sandwiched between metal plates, heat-pressed, and fused and fixed to the inside of a rigid vinyl chloride laminate with the communication circuit and the communication coil with hard vinyl chloride to obtain a card base. of Production method can be obtained.

【0009】さらに、本発明によれば、予め前記通信用
回路及び前記通信用コイル搭載位置を印刷した前記第1
のコアシートに、前記通信用回路及び前記通信用コイル
を前記搭載位置に合わせ、接着剤で固定し、前記第2の
コアシートを前記通信用回路及び前記通信用コイルの上
にあてがい、前記第1のコアシートと前記第2のコアシ
ートを鏡面金属板で挟持し、硬質塩化ビニル融着温度ま
で加熱した後圧着して、コアシート積層体を得ることを
特徴とする非接触型ICカードの製造方法が得られる。
Further, according to the present invention, the communication circuit and the communication coil mounting position are printed in advance.
On the core sheet, the communication circuit and the communication coil are aligned with the mounting position and fixed with an adhesive, and the second core sheet is applied on the communication circuit and the communication coil, A core sheet laminate is obtained by sandwiching the core sheet No. 1 and the second core sheet with a mirror-finished metal plate, heating to a rigid vinyl chloride fusion temperature, and then pressure-bonding the core sheet laminate. A manufacturing method is obtained.

【0010】ここで、前記コアシート積層体は、予め通
信用回路及び通信用コイル位置を印刷した乳白色硬質塩
化ビニルからなる第1のコアシートに、通信用回路及び
通信用コイルを該通信用回路及び通信用コイル位置に合
わせ接着剤で固定し、乳白色硬質塩化ビニルからなる第
2のコアシートを該通信用回路及び通信用コイルの上に
あてがい、該第1のコアシートと該第2のコアシートを
鏡面金属板で挟持し融着温度まで加熱した後、圧着し、
該コアシート積層体を得ることが望ましい。
In the core sheet laminate, the communication circuit and the communication coil are provided on the first core sheet made of milky white hard vinyl chloride in which the positions of the communication circuit and the communication coil are printed in advance. And a second core sheet made of opalescent hard vinyl chloride, which is fixed to the position of the communication coil with an adhesive and applied onto the communication circuit and the communication coil, and the first core sheet and the second core. The sheet is sandwiched between mirror-finished metal plates and heated to the fusion temperature, then pressure-bonded,
It is desirable to obtain the core sheet laminate.

【0011】[0011]

【作用】本発明では、通信用回路及び通信用コイルを硬
質塩化ビニルシートで挟持した後、加熱圧着したので、
硬質塩化ビニルを通信用回路及び通信用コイルの周りに
融着させ、通信用回路及び通信用コイルを硬質塩化ビニ
ル積層体内部に融着固定することができる。従って、従
来の非接触型ICカードで問題のプラスチックフィルム
の剥離や、通信用コイルの断線の原因となる接着剤また
は接着テープを用いずに、通信用回路及び通信用コイル
をカード基体に固定する構造の非接触型ICカードを提
供することが可能となる。
In the present invention, since the communication circuit and the communication coil are sandwiched between the hard vinyl chloride sheets and then heat-pressed,
The hard vinyl chloride can be fused around the communication circuit and the communication coil, and the communication circuit and the communication coil can be fused and fixed inside the hard vinyl chloride laminate. Therefore, the communication circuit and the communication coil are fixed to the card base without using an adhesive or an adhesive tape that causes peeling of the plastic film and disconnection of the communication coil, which are problems in the conventional non-contact type IC card. It is possible to provide a contactless IC card having a structure.

【0012】[0012]

【発明の実施の形態】以下、本発明の一実施の形態を図
1及び図2を参照して説明する。図1は、本発明の製造
方法による非接触型ICカードの分解斜視図であり、図
3は本発明の製造方法による第1のコアシートを示す概
略図である。あらかじめ、厚さ0.2mmの乳白色硬質
塩化ビニルシート、厚さ0.13mmの乳白色硬質塩化
ビニルシート、及び厚さ0.05mmの透明硬質塩化ビ
ニルシートを、長さ120mm、幅90mmの外形寸法
に切り揃えておく。まず、厚さ0.2mmの乳白色硬質
塩化ビニルからなる第1のコアシート6に、打ち抜き基
準点13からJIS規格に準拠して、長さ85.60m
m、幅53.98mm、コーナーのR(曲率半径)3.
10mmにカード打ち抜き範囲12(図中の破線部分)
を設定する。カード打ち抜き範囲12の内側には通信回
路3及び通信用コイル4が搭載される回路搭載領域11
(図1の黒塗りの位置)を設定し、その領域を黒インキ
で印刷する。
BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is an exploded perspective view of a non-contact type IC card manufactured by the manufacturing method of the present invention, and FIG. 3 is a schematic view showing a first core sheet manufactured by the manufacturing method of the present invention. A 0.2 mm thick milky white hard vinyl chloride sheet, a 0.13 mm thick milky white hard vinyl chloride sheet, and a 0.05 mm thick transparent hard vinyl chloride sheet are preliminarily prepared to have external dimensions of 120 mm in length and 90 mm in width. Cut them out. First, on the first core sheet 6 made of milky white hard vinyl chloride having a thickness of 0.2 mm, a length of 85.60 m from the punching reference point 13 in accordance with JIS standard.
m, width 53.98 mm, corner R (radius of curvature) 3.
Card punching range 12 to 10 mm (broken line in the figure)
Set. A circuit mounting area 11 in which the communication circuit 3 and the communication coil 4 are mounted inside the card punching area 12
(Black position in FIG. 1) is set, and the area is printed with black ink.

【0013】次に、外形が70mm×40mm×0.3
mmの通信用コイル4と外形が7mm×4mm×0.3
mmの通信用回路3を第1のコアシート6の回路搭載領
域11にシアノクリレート系接着剤で固定する。次に、
通信用コイル4と通信用回路3の上に厚さ0.2mmの
乳白色硬質塩化ビニルからなる第2のコアシート7を重
ね合わせ、第1のコアシート6と第2のコアシート7を
鏡面金属板(図示せず)で挟持して加熱する。
Next, the outer shape is 70 mm × 40 mm × 0.3.
mm communication coil 4 and outer shape 7 mm x 4 mm x 0.3
The mm communication circuit 3 is fixed to the circuit mounting area 11 of the first core sheet 6 with a cyanoacrylate adhesive. next,
A second core sheet 7 made of milky white hard vinyl chloride having a thickness of 0.2 mm is overlaid on the communication coil 4 and the communication circuit 3, and the first core sheet 6 and the second core sheet 7 are mirror-finished metal. It is sandwiched between plates (not shown) and heated.

【0014】次に、第1のコアシート6と第2のコアシ
ート7の温度が融着温度150℃に達したのを確認し、
圧力5Kg/cm2 で2分間保持した後、冷却し、コア
シート積層体14を得た。次に、厚さ0.13mmの乳
白色硬質塩化ビニルからなる第3のコアシート8に絵柄
印刷を施し、厚さ0.13mmの乳白色硬質塩化ビニル
からなる第4のコアシート9に文字印刷を施した。
Next, it was confirmed that the temperatures of the first core sheet 6 and the second core sheet 7 reached the fusion temperature of 150 ° C.,
After holding at a pressure of 5 kg / cm 2 for 2 minutes, it was cooled to obtain a core sheet laminate 14. Next, a pattern is printed on the third core sheet 8 made of milk-white hard vinyl chloride having a thickness of 0.13 mm, and characters are printed on the fourth core sheet 9 made of milk-white hard vinyl chloride having a thickness of 0.13 mm. did.

【0015】次に、コアシート積層体14の一方の面
に、第3のコアシート8を第3のコアシート8の未印刷
面が接するようにあてがい、更にコアシート積層体14
のもう一方の面に、第4のコアシート9を第4のコアシ
ート9の未印刷面が接するようにあてがう。
Next, the third core sheet 8 is applied to one surface of the core sheet laminate 14 so that the unprinted surface of the third core sheet 8 is in contact, and the core sheet laminate 14 is further applied.
The other side of the sheet is applied with the fourth core sheet 9 so that the unprinted side of the fourth core sheet 9 is in contact.

【0016】次に、第3のコアシート8の印刷面と第4
のコアシート9の印刷面に厚さ0.05mmの透明硬質
塩化ビニルからなるオーバーシート10をあてがい、鏡
面金属板で挟持し、温度150℃、圧力25Kg/cm
2 、加熱加圧保持時間5分間で加熱加圧し、硬質塩化ビ
ニル積層体を得た。
Next, the printed surface of the third core sheet 8 and the fourth
The oversheet 10 made of transparent hard vinyl chloride having a thickness of 0.05 mm is applied to the printed surface of the core sheet 9 of No. 3, sandwiched between mirror-finished metal plates, and the temperature is 150 ° C. and the pressure is 25 Kg / cm.
2. Heat and pressure were applied for 5 minutes to obtain a rigid vinyl chloride laminate.

【0017】次に、以上のようにして作成した硬質塩化
ビニル積層体から、予めシート外形より設定したカード
打ち抜き範囲12を打抜機で打ち抜き、JIS規格に準
拠した長さ85.60mm、幅53.98mm、コーナ
ー3.10mm、厚さ0.76mmの非接触型ICカー
ドを得た。
Next, from the hard vinyl chloride laminate produced as described above, a card punching range 12 preset from the outer shape of the sheet was punched by a punching machine, and a length of 85.60 mm and a width of 53. A non-contact type IC card having a size of 98 mm, a corner of 3.10 mm and a thickness of 0.76 mm was obtained.

【0018】次に、上述の方法で作成した本発明の非接
触型ICカードの機能を以下の要領で確認した。まず、
非接触型ICカード用カードリーダーライターで情報の
書き込み、読み出しを行った結果、正常に行うことがで
きた。
Next, the function of the non-contact type IC card of the present invention produced by the above method was confirmed in the following manner. First,
As a result of writing and reading information with the card reader / writer for the non-contact type IC card, it was possible to perform normally.

【0019】次に、従来の非接触ICカードと本発明に
よる非接触型ICカードにJIS規格に準拠し、カード
のひねり試験を10,000回行った結果、従来の非接
触ICカードはプラスチックフイルム1(図3参照)の
剥離が生じ、専用のカードリーダーライターで情報の書
き込み、読み出しができなかったのに対し、本発明によ
る非接触型ICカードは外観に変化が認められず、専用
のカードリーダーライターで情報の書き込み、読み出し
を正常に行うことができた。
Next, the conventional non-contact IC card and the non-contact type IC card according to the present invention were subjected to the twist test of the card 10,000 times in accordance with the JIS standard. As a result, the conventional non-contact IC card was a plastic film. 1 (see FIG. 3) was peeled off and information could not be written or read by a dedicated card reader / writer, whereas the non-contact type IC card according to the present invention showed no change in appearance and was a dedicated card. I was able to write and read information normally with a reader / writer.

【0020】[0020]

【発明の効果】以上述べたように、本発明による非接触
型ICカードの製造方法を用いれば、硬質塩化ビニルを
通信用回路及び通信用コイルの周りに融着させることが
でき、通信用回路及び通信用コイルを硬質塩化ビニル積
層体に融着固定したカード基体を具備した非接触型IC
カードが得られる。
As described above, by using the method for manufacturing a non-contact type IC card according to the present invention, hard vinyl chloride can be fused around the communication circuit and the communication coil, and the communication circuit can be fused. And a non-contact type IC having a card substrate in which a communication coil is fused and fixed to a rigid vinyl chloride laminate
You get a card.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の製造方法による非接触型ICカードの
分解斜視図である。
FIG. 1 is an exploded perspective view of a non-contact type IC card according to a manufacturing method of the present invention.

【図2】本発明の製造方法による第1のコアシートを示
す概略図である。
FIG. 2 is a schematic view showing a first core sheet according to the manufacturing method of the present invention.

【図3】従来の非接触型ICカードの分解斜視図であ
る。
FIG. 3 is an exploded perspective view of a conventional non-contact type IC card.

【符号の説明】[Explanation of symbols]

1 プラスチックフィルム 2 接着シート 3 通信用回路 4 通信用コイル 6 第1のコアシート 7 第2のコアシート 8 第3のコアシート 9 第4のコアシート 10 オーバーシート 11 回路搭載領域 12 カード打ち抜き範囲 13 打ち抜き基準点 14 コアシート積層体 25 カード基体 1 Plastic Film 2 Adhesive Sheet 3 Communication Circuit 4 Communication Coil 6 First Core Sheet 7 Second Core Sheet 8 Third Core Sheet 9 Fourth Core Sheet 10 Oversheet 11 Circuit Mounting Area 12 Card Punching Area 13 Punching reference point 14 Core sheet laminate 25 Card base

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 一対の乳白色硬質塩化ビニルからなるコ
アシートに、該コアシートを挟むようにして一対の透明
硬質塩化ビニルからなるオーバーシートが積層されてな
る硬質塩化ビニル積層体をカード基体とする非接触型I
Cカードにおいて、通信用回路及び通信用コイルが前記
カード基体の内部に硬質塩化ビニルで融着固定されてい
ることを特徴とする非接触型ICカード。
1. A hard vinyl chloride laminate comprising a pair of core sheets made of opalescent hard vinyl chloride and a pair of oversheets made of transparent hard vinyl chloride laminated with the core sheets sandwiched therebetween, as a card substrate, and not contacting. Type I
In the C card, a non-contact type IC card in which a communication circuit and a communication coil are fused and fixed to the inside of the card base with hard vinyl chloride.
【請求項2】 通信用回路及び通信用コイルを乳白色硬
質塩化ビニルからなる第1のコアシートと第2のコアシ
ートで挟み、該第1のコアシートと該第2コアシートを
鏡面金属板で挟持し、硬質塩化ビニル融着温度まで加熱
した後、圧着して得られたコアシート積層体の両面に、
予め絵柄印刷を施した第3のコアシートと第4のコアシ
ートを印刷の無い面が接するように重ね合わせ、該第3
のコアシートと第4のコアシートの絵柄印刷面に透明硬
質塩化ビニルからなるオーバーシートを重ね合わせてな
る硬質塩化ビニル積層体を鏡面金属板で挟持し、加熱圧
着し、硬質塩化ビニル積層体内部に前記通信用回路及び
前記通信用コイルを硬質塩化ビニルで融着固定してカー
ド基体を得ることを特徴とする非接触型ICカードの製
造方法。
2. A communication circuit and a communication coil are sandwiched between a first core sheet and a second core sheet made of milk-white hard vinyl chloride, and the first core sheet and the second core sheet are mirror-finished metal plates. Both sides of the core sheet laminate obtained by sandwiching and heating to the vinyl chloride fusion temperature and then pressure bonding,
The third core sheet and the fourth core sheet, which have been preliminarily printed with a pattern, are superposed so that the non-printed surfaces are in contact with each other.
The inner surface of the hard vinyl chloride laminate is sandwiched between the hard vinyl chloride laminates made by stacking transparent hard vinyl chloride oversheets on the printed surfaces of the core sheet of No. 4 and the fourth core sheet with mirror-finished metal plates, and heat-pressed. A method for manufacturing a non-contact type IC card, wherein the communication circuit and the communication coil are fused and fixed with hard vinyl chloride to obtain a card substrate.
【請求項3】 請求項2記載の非接触型ICカードの製
造方法において、予め前記通信用回路及び前記通信用コ
イル搭載位置を印刷した前記第1のコアシートに、前記
通信用回路及び前記通信用コイルを前記搭載位置に合わ
せ、接着剤で固定し、前記第2のコアシートを前記通信
用回路及び前記通信用コイルの上にあてがい、前記第1
のコアシートと前記第2のコアシートを鏡面金属板で挟
持し、硬質塩化ビニル融着温度まで加熱した後圧着し
て、コアシート積層体を得ることを特徴とする非接触型
ICカードの製造方法。
3. The method for manufacturing a non-contact type IC card according to claim 2, wherein the communication circuit and the communication are provided on the first core sheet on which the communication circuit and the communication coil mounting position are printed in advance. The coil for use is aligned with the mounting position and fixed with an adhesive, and the second core sheet is applied on the communication circuit and the communication coil,
The core sheet and the second core sheet are sandwiched between mirror-finished metal plates, heated to a rigid vinyl chloride fusion temperature and then pressure-bonded to obtain a core sheet laminate, which is a non-contact type IC card. Method.
JP8088383A 1996-04-10 1996-04-10 Non-contact type ic card and its manufacture Withdrawn JPH09277766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8088383A JPH09277766A (en) 1996-04-10 1996-04-10 Non-contact type ic card and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8088383A JPH09277766A (en) 1996-04-10 1996-04-10 Non-contact type ic card and its manufacture

Publications (1)

Publication Number Publication Date
JPH09277766A true JPH09277766A (en) 1997-10-28

Family

ID=13941281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8088383A Withdrawn JPH09277766A (en) 1996-04-10 1996-04-10 Non-contact type ic card and its manufacture

Country Status (1)

Country Link
JP (1) JPH09277766A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000012026A (en) * 1998-07-28 2000-02-25 니시무로 타이죠 Wireless ic card and method of manufacturing the same wireless ic card, data reader writer, and wireless tag and method of manufacturing the same wireless tag
JP2002042076A (en) * 2000-07-21 2002-02-08 Dainippon Printing Co Ltd Non-contact data carrier and booklet therewith
US6484775B2 (en) 1999-12-28 2002-11-26 Nissei Plastic Industrial Co., Ltd. IC-card manufacturing apparatus
US6913057B2 (en) 2001-10-19 2005-07-05 Nissei Plastic Industrial Co., Ltd. IC-card manufacturing apparatus
KR200445875Y1 (en) * 2007-06-05 2009-09-08 (주) 네톰 Apparatus for identifying rfid tag

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000012026A (en) * 1998-07-28 2000-02-25 니시무로 타이죠 Wireless ic card and method of manufacturing the same wireless ic card, data reader writer, and wireless tag and method of manufacturing the same wireless tag
US6484775B2 (en) 1999-12-28 2002-11-26 Nissei Plastic Industrial Co., Ltd. IC-card manufacturing apparatus
JP2002042076A (en) * 2000-07-21 2002-02-08 Dainippon Printing Co Ltd Non-contact data carrier and booklet therewith
US6913057B2 (en) 2001-10-19 2005-07-05 Nissei Plastic Industrial Co., Ltd. IC-card manufacturing apparatus
KR200445875Y1 (en) * 2007-06-05 2009-09-08 (주) 네톰 Apparatus for identifying rfid tag

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