JPH03121583A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH03121583A JPH03121583A JP1257911A JP25791189A JPH03121583A JP H03121583 A JPH03121583 A JP H03121583A JP 1257911 A JP1257911 A JP 1257911A JP 25791189 A JP25791189 A JP 25791189A JP H03121583 A JPH03121583 A JP H03121583A
- Authority
- JP
- Japan
- Prior art keywords
- opening
- card
- opening part
- adhesive
- core material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 18
- 239000011162 core material Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000003475 lamination Methods 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract description 13
- 230000006378 damage Effects 0.000 abstract description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920005594 polymer fiber Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229920001410 Microfiber Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＩＣチップを内蔵するＩＣカードに関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC card incorporating an IC chip.
従来のこの種のＩＣカードｌとしては、例えば第４図（
特開平１−１０５７９号参照）に示すように、厚さ１５
０μｍの透明オーバーレイ２とデザイン８、を印刷した
厚さ２８０μｍの不透明コア材３゜と別のデザイン８．
を印刷した厚さ２８０μｍの不透明コア材３□と厚さ３
０μｍの透明オーバーレイ４とを準備し、これらを重ね
合わせ、１００〜１５０℃に熱すると同時に１５〜３５
ｋｒ／−で加圧して数十分間ラミネートし、次に切削加
工等でＩＣモジュール６を装着するための凹状の開口部
５を透明オーバーレイ２側力）ら不透明コア材３□の残
り厚みが８０μｍとなるように形成し、さらにこの開口
部５の底部に２０μｍの接着剤層７を形成すると共に、
厚さ６３０μｍのＩＣモジュール６を外部接続端子部６
１がカードの外に出るように装着し、前記接着剤７で固
定するものが知られている。For example, a conventional IC card of this type is shown in Fig. 4 (
As shown in Japanese Unexamined Patent Publication No. 1-10579), the thickness is 15
A 280 μm thick opaque core material 3° printed with a 0 μm transparent overlay 2 and a design 8 and another design 8.
Opaque core material 3□ with a thickness of 280 μm printed with
Prepare a transparent overlay 4 of 0 μm, overlap these, heat to 100 to 150°C, and at the same time heat to 15 to 35°C.
The remaining thickness of the opaque core material 3 is cut from the transparent overlay 2 by cutting and laminating for several tens of minutes under pressure with kr/-. A 20 μm thick adhesive layer 7 is formed at the bottom of the opening 5, and
The IC module 6 with a thickness of 630 μm is connected to the external connection terminal part 6.
It is known that the card is attached so that the card 1 protrudes from the outside of the card and is fixed with the adhesive 7.
〔発明が解決しようとする！！ｌ！題〕ところで、この
従来のＩＣカードでは、ＩＣカードの厚みが７６０μｍ
要求されること、及びＩＣモジュールの厚みが６３０μ
ｍ程度要求されることに鑑み、開口部５の底下の不透明
コア材３□の肉厚を８０μｍとし、その下の透明オーバ
ーレイ４の厚みを３０μｍとしているが、これではＩＣ
カードに曲げ応力がかかったときＩＣモジュール開口部
の底部付近の曲げ強度が弱く、また開口部底部のエツジ
部が鋭角のためそのエツジ部に沿った部分に亀裂が生じ
やす＜ＩＣモジュールがＩＣカードから離脱する危険が
あった。[Invention tries to solve it! ! l! By the way, in this conventional IC card, the thickness of the IC card is 760 μm.
requirements and the thickness of the IC module is 630μ
In view of the fact that the IC
When bending stress is applied to the card, the bending strength near the bottom of the IC module opening is weak, and the edge at the bottom of the opening is at an acute angle, so cracks tend to occur along the edge. There was a risk of leaving.
本発明は、この従来の欠点を排除しようとするもので、
簡単な構成で曲げ強度の強いＩＣカードを提供しようと
するものである。The present invention seeks to eliminate this conventional drawback,
The present invention aims to provide an IC card with a simple structure and high bending strength.
本発明は、透明オーバーレイと不透明コア材で多層ラミ
ネートされたカード基体に、凹状開口部を設け、該開口
部底部にｔＣモジュールを接着剤で固定したＩＣカード
において、前記透明オーバーレイと不透明コア材との間
であって、該開口部の底下に対応する部分に、前記開口
部面積より若干大きい補強フィルムの両面に接着剤を塗
布したものをラミネートの際にはさみ込んで一体化した
ことを特徴とするＩＣカードである。The present invention provides an IC card in which a concave opening is provided in a card base made of a multilayer laminate of a transparent overlay and an opaque core material, and a tC module is fixed to the bottom of the opening with an adhesive. A reinforcing film slightly larger than the area of the opening, coated with adhesive on both sides, is sandwiched between the opening and the part corresponding to the bottom of the opening during lamination. It is an IC card.
本発明は、透明オーバーレイ４と不透明コア材３ｚとの
間であって、開口部５の底下に対応する部分に、前記開
口部５面積より若干大きい補強フィルムの両面に接着剤
を塗布したものをラミネートの際にはさみ込んで一体化
したことにより、弾性率が高く抗張力の高い部材で開口
部５底下の肉厚の薄い部分を補強することとなるから、
ＩＣカードの曲げに対する強度を強（［、することがで
きる。In the present invention, adhesive is applied to both sides of a reinforcing film that is slightly larger than the area of the opening 5 in a portion between the transparent overlay 4 and the opaque core material 3z and corresponding to the bottom of the opening 5. By sandwiching and integrating them during lamination, the thin part under the bottom of the opening 5 is reinforced with a material with a high elastic modulus and high tensile strength.
It is possible to increase the strength of the IC card against bending.
また、前記開口部５の底部周囲を曲率半径路０．１〜０
．３ ｗの２曲面５Ｉで形成した場合、該周囲の曲げ応
力集中の排除が図られ、前記開口部５のエツジ部の破断
を防止することができる。Further, a curvature radius path of 0.1 to 0 is formed around the bottom of the opening 5.
．． When formed with two curved surfaces 5I of 3W, concentration of bending stress around the opening 5 can be eliminated, and breakage of the edge portion of the opening 5 can be prevented.
本発明の一実施例を第１図及び第２図に基づいて説明す
ると、まず厚さ１５０μｍの透明オーバーレイ２とデザ
イン８１を上面に印刷した厚さ２８０μｍの不透明コア
材３１と該不透明コア材３Ｉと同厚の不透明コア材３．
と両面に接着剤を塗布した後述する開口部５の面積より
若干大きい厚さ２５μｍのポリエチレンテレフタレート
（ＰＥＴ）フィルム９又はポリイミドフィルムと別のデ
ザイン８□を上面に印刷した透明オーバーレイ４とを準
備し、次にこれらを前記ＰＥＴフィルム９又はポリイミ
ドフィルムが前記透明オーバーレイ４と不透明コア材３
．との間にはさみ込まれるように重ね合わせ、そして１
００〜１５０℃に熱すると同時に１５〜３５ｋｇ／ｃｄ
で加圧して数十分間ラミネートし、前記透明オーバーレ
イ２の加工面に微粘着フィルム（例えばポリエチレンテ
レフタレート、ポリエチルメタクリレート等のアクリル
樹脂。An embodiment of the present invention will be described based on FIGS. 1 and 2. First, a transparent overlay 2 with a thickness of 150 μm, an opaque core material 31 with a thickness of 280 μm on which a design 81 is printed on the upper surface, and the opaque core material 3I with a thickness of 280 μm Opaque core material of the same thickness as 3.
A polyethylene terephthalate (PET) film 9 or a polyimide film with a thickness of 25 μm, which is slightly larger than the area of the opening 5 described later and coated with adhesive on both sides, and a transparent overlay 4 with another design 8 □ printed on the top surface are prepared. Then, the PET film 9 or the polyimide film forms the transparent overlay 4 and the opaque core material 3.
．． 1.
15-35kg/cd while heating to 00-150℃
After laminating for several minutes under pressure, a slightly adhesive film (for example, an acrylic resin such as polyethylene terephthalate or polyethyl methacrylate) is applied to the processed surface of the transparent overlay 2.
ポリ塩化ビニル、ポリエーテルサルフォン等のポリサル
フォン樹脂、ポリメチルペンテン等の樹脂フィルムに微
粘着剤加工したもの）で再ラミネートしてエンドミル、
フライス盤等の加工性を向上させてＩＣカード表面をき
す、はこり等から保護し、そしてエンドミル、フライス
盤等でＩＣモジュール６を装着するための凹状開口部５
をカード基体のオーバーレイ２の側から開口部５の底下
の厚みが９０〜１）０ μｍとなるように形成し、さら
にこの開口部５底部に高分子繊維質を含有した、例えば
２液硬化型アクリル樹脂系の接着剤７を塗布すると共に
、６３０μｍ厚のＩＣモジュール６を外部接続端子部６
．がカードの外に出るように装着し、前記接着剤７で固
定し、透明オーバーレイ２の加工面に貼着した微粘着フ
ィルムを剥離して、ＩＣカード１が得られる。Re-laminated with polysulfone resin such as polyvinyl chloride, polyether sulfone, or resin film treated with a slight adhesive such as polymethylpentene, and then used as an end mill.
Concave opening 5 for improving processability with a milling machine, etc., protecting the IC card surface from scratches, chips, etc., and for mounting the IC module 6 with an end mill, milling machine, etc.
is formed so that the thickness below the bottom of the opening 5 from the side of the overlay 2 of the card base is 90 to 1) 0 μm, and the bottom of the opening 5 contains a polymer fiber, for example, a two-component curing type. While applying an acrylic resin adhesive 7, a 630 μm thick IC module 6 is attached to the external connection terminal portion 6.
．． The IC card 1 is obtained by attaching the card so that it protrudes from the card, fixing it with the adhesive 7, and peeling off the slightly adhesive film stuck to the processed surface of the transparent overlay 2.
なお、高分子繊維としては０．０５ｄ（デニール）程度
で長さが約１０μｍのナイロン、ポリエステルの超極細
繊維、例えば東し−のトレーシー等が使用される。As the polymer fiber, ultrafine fibers of nylon or polyester having a diameter of about 0.05 d (denier) and a length of about 10 μm, such as Toshi Tracy, etc., are used.
前記不透明コア材３□３２は、厚さ５６０μｍのコア材
１枚で代用してもよい。これによって作業性が向上する
ものとなる。The opaque core material 3□32 may be replaced by one core material having a thickness of 560 μm. This improves workability.
また、前記ＰＥＴフィルム９又はポリイミドフィルムを
前記透明オーバーレイ４と不透明コア材３．の間であっ
て、前記開口部５の底下に対応する部分にはさみ込んだ
ことにより、弾性率が高く抗張力の高い部材で肉厚の薄
い部分（開口部５底下の９０〜１００μｍ厚の部分）を
補強することになるから、ＩＣモジュール開口部の底部
近傍の曲げ強度が強化されたものとなる。したがって、
ＩＣモジュール開口部エツジ部の破断を防止することが
でき、ＩＣモジュールの飛び出しをも防止できるもので
ある。Further, the PET film 9 or the polyimide film is combined with the transparent overlay 4 and the opaque core material 3. By inserting it into the part between the holes corresponding to the bottom of the opening 5, a thin part made of a material with high elastic modulus and high tensile strength (90 to 100 μm thick part below the bottom of the opening 5) As a result, the bending strength near the bottom of the IC module opening is strengthened. therefore,
This can prevent the IC module opening edge from breaking and can also prevent the IC module from popping out.
さらに、前記開口部５の底部に塗布したＩＣモジュール
接着剤７が高分子繊維質を含有したものであるから、接
着剤７自体の曲げ抗力が高いものとなり、ＩＣカードの
開口部の底部近傍の曲げ強度がより一層強化されたもの
となっている。Furthermore, since the IC module adhesive 7 applied to the bottom of the opening 5 contains polymeric fibers, the adhesive 7 itself has a high bending resistance, and the adhesive 7 near the bottom of the opening of the IC card has a high bending resistance. The bending strength has been further strengthened.
次に本発明の他の実施例を第３図に基づいて説明すると
、第１図に示す実施例の凹状開口部５の底部周囲を丸味
をもつフライスで加工し、該周囲を曲率半径略０．１〜
０．３鰭の８曲面５１で形成したものである。Next, another embodiment of the present invention will be described based on FIG. 3. The bottom periphery of the concave opening 5 of the embodiment shown in FIG. .1～
It is formed of eight curved surfaces 51 with 0.3 fins.
これにより、該周囲部分における曲げ応力集中の排除を
図り、開口部５の下端エツジ部の破断を防止するもので
ある。This eliminates bending stress concentration in the surrounding area and prevents the lower edge of the opening 5 from breaking.
本発明は、透明オーバーレイと不透明コア材との間であ
って、開口部の底下に対応する部分に、前記開口部面積
より若干大きい補強フィルムの両面に接着剤を塗布した
ものをラミネートの際にはさみ込んで一体化したことに
より、弾性率が高く抗張力の高い部材で肉厚の薄い部分
を補強することになるから、ＩＣカードの開口部の底部
近傍の曲げ強度が強化されたものになるので凹状開口部
裏面の破断及びＩＣチップの破壊やＩＣモジュールの飛
び出し等が防止されるものである。In the present invention, adhesive is applied to both sides of a reinforcing film that is slightly larger than the area of the opening in a portion between the transparent overlay and the opaque core material and corresponds to the bottom of the opening during lamination. By sandwiching and integrating, the thin wall part is reinforced with a material with high elastic modulus and high tensile strength, which strengthens the bending strength near the bottom of the IC card opening. This prevents the back surface of the concave opening from breaking, the IC chip from breaking, and the IC module from popping out.
また、前記開口部の底部周囲を曲率半径路０．１〜０．
３Ｎの８曲面で形成した場合、該周囲の曲げ応力集中が
排除され、前記開口部のエツジ部のＩＣカード破断が防
止されるので、ＩＣチップの破壊や開口部からのＩＣモ
ジュールの飛び出しは防止される。Further, a curvature radius path of 0.1 to 0.0 is applied around the bottom of the opening.
When formed with 8 curved surfaces of 3N, bending stress concentration around the opening is eliminated and breakage of the IC card at the edge of the opening is prevented, thereby preventing destruction of the IC chip or protrusion of the IC module from the opening. be done.
第１図は本発明の一実施例のカード基体製造プロセスを
示す説明図、第２図は本発明のＩＣカードの部分断面図
、第３図は本発明の他の実施例を示す部分断面図、第４
図は従来例を示す断面図である。
１・・・ＩＣカード、２．４・・・透明オーバーレイ、
３＋、３ｔ・・・不透明コア材、５・・・開口部、６・
・・ＩＣモジュール、６１・・・外部接続端子部、７・
・・ＩＣモジュール接着剤、８１．８ ｔ・・・デザイ
ン、９・・・ポリエチレンテレフタレートフィルム。FIG. 1 is an explanatory diagram showing a card substrate manufacturing process according to an embodiment of the present invention, FIG. 2 is a partial cross-sectional view of an IC card according to the present invention, and FIG. 3 is a partial cross-sectional view showing another embodiment of the present invention. , 4th
The figure is a sectional view showing a conventional example. 1...IC card, 2.4...Transparent overlay,
3+, 3t... Opaque core material, 5... Opening, 6.
...IC module, 61...external connection terminal section, 7.
...IC module adhesive, 81.8 t...Design, 9...Polyethylene terephthalate film.
Claims (3)
トされたカード基体に、凹状開口部を設け、該開口部底
部にＩＣモジュールを接着剤で固定したＩＣカードにお
いて、前記透明オーバーレイと不透明コア材との間であ
って、該開口部の底下に対応する部分に、前記開口部面
積より若干大きい補強フィルムの両面に接着剤を塗布し
たものをラミネートの際にはさみ込んで一体化したこと
を特徴とするＩＣカード。(1) In an IC card in which a concave opening is provided in a card base made of a multilayer laminate of a transparent overlay and an opaque core material, and an IC module is fixed to the bottom of the opening with an adhesive, the transparent overlay and the opaque core material are A reinforcing film that is slightly larger than the area of the opening, coated with adhesive on both sides, is sandwiched between the opening and the part corresponding to the bottom of the opening and integrated during lamination. IC card.
したものである請求項１記載のＩＣカード。(2) The IC card according to claim 1, wherein the IC module adhesive contains polymeric fibers.
３ｍｍのＲ曲面で形成したことを特徴とする請求項１又
は２記載のＩＣカード。(3) The radius of curvature around the bottom of the opening is approximately 0.1 to 0.
The IC card according to claim 1 or 2, characterized in that it is formed with a 3 mm radius curved surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1257911A JP2767140B2 (en) | 1989-10-04 | 1989-10-04 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1257911A JP2767140B2 (en) | 1989-10-04 | 1989-10-04 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03121583A true JPH03121583A (en) | 1991-05-23 |
| JP2767140B2 JP2767140B2 (en) | 1998-06-18 |
Family
ID=17312904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1257911A Expired - Fee Related JP2767140B2 (en) | 1989-10-04 | 1989-10-04 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2767140B2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62142695A (en) * | 1985-12-17 | 1987-06-26 | 株式会社東芝 | Integrated circuit card |
| JPS62227796A (en) * | 1986-03-31 | 1987-10-06 | 松下電器産業株式会社 | Integrated circuit card |
| JPS62290594A (en) * | 1986-06-11 | 1987-12-17 | 大日本印刷株式会社 | Ic card |
| JPH01105794A (en) * | 1987-10-19 | 1989-04-24 | Matsushita Electric Ind Co Ltd | Ic card |
-
1989
- 1989-10-04 JP JP1257911A patent/JP2767140B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62142695A (en) * | 1985-12-17 | 1987-06-26 | 株式会社東芝 | Integrated circuit card |
| JPS62227796A (en) * | 1986-03-31 | 1987-10-06 | 松下電器産業株式会社 | Integrated circuit card |
| JPS62290594A (en) * | 1986-06-11 | 1987-12-17 | 大日本印刷株式会社 | Ic card |
| JPH01105794A (en) * | 1987-10-19 | 1989-04-24 | Matsushita Electric Ind Co Ltd | Ic card |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2767140B2 (en) | 1998-06-18 |
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