JPS59193596A - Ic module for ic card - Google Patents

Abstract

PURPOSE:To obtain an IC module for an IC card which has a small size conformed to the standard of the IC card with no visual wiring on the surface and can cope with the advancement of IC technology by constituting a multi-layer with the IC module which is fitted into the recessed part of a card material to form the IC card and connecting the pad of an IC chip to a lead on the rear side of an intermediate substrate by means of a wire. CONSTITUTION:An input/output terminal 15 is set on the surface of a plastic substrate 14, and a lead wire 17 is provided on the rear side of the substrate 14 via a through hole 16. In addition, an IC chip 18 of a CPU and an IC chip 18 are fixed to the rear side of the substrate 14. Then an intermediate substrate 24 which has the same size as the substrate 14 as well as an opening part 23 larger than chips 18 and 19 and contains the wire 17 on both sides is adhered to the substrate 14. Furthermore an outer substrate 26 having the same size as the substrate 24 and an opening part 25 larger than the opening 23 is adhered to the substrate 24. Then the pad 20 of chips 18 and 19 is connected to the wire 17 on the rear side of the substrate 24 with a wire 21. Then a protecting layer 22 of ultraviolet ray transmission type is formed. Thus an IC module is obtained, and the erasion is possible for the write data. In addition, the wire 17 is provided to the rear side of the substrate 14 as well as to both sides of the substrate 24. These wires 17 are moved up and down through the hole 16 to ensure the complicaed and cubic wiring with use of the rear side of the substate 14 and the both sides of the substrate 24.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an IC module used for an IC card such as an identification card, and more particularly to an IC module for an IC card with a small size that meets ID card standards.

It is not subject to disturbances from the outside world such as magnetism, making it extremely difficult for others to read the contents, and is highly reliable.Furthermore, the storage capacity is several tens to hundreds of times larger than that of magnetic stripes, so it has recently been used for identification cards, etc. IC cards began to be used instead of magnetic cards. To manufacture an IC card, as shown in FIG. 1, an IC module 3 with a substrate IKIC chip 2 mounted thereon is assembled by fitting it into a recess 5 previously provided in a card material 4.

To explain an example of the manufacturing process of IC module B, first, a front surface electrode 6 is provided at a predetermined position on a plastic substrate 1, a lead 7 is provided at a position on the back side of this surface electrode 6, and a through hole 8 is inserted between the two. Connect electrically.

Next, the IC chip is fixed approximately in the center of the back surface of the board 1, and the I
Bonding is performed by connecting pads 9 of C chip 2 and leads 7 with wires 10. Thereafter, a protective layer 11 is formed on the plastic to complete the IC module 3.

On the other hand, the completed I
Insert the C module 6. The filler fills the void as a filler layer 12 and adheres closely to the card material 4, completing the IC card.

Conventional IC modules for IC cards are constructed from one-chip film carrier substrates using custom ICs in order to make IC cards sized to meet international standards (ISO standards), etc. With current IC manufacturing technology, custom Even if I manufacture an IC, I
Since C chips cannot be mass-produced with a thickness of 0.25 tm or less, IC modules are manufactured using chips with a thickness of 0.25 to 0.3, and these IC modules meet the international standard for ID cards with a thickness of 0. It was extremely difficult to accommodate the device within .76 fi without any problems due to its characteristics.

Furthermore, the degree of integration of IC technology is currently improving rapidly,
For this reason, even if you manufacture a custom IC for an IC card, it will only take 2 to 3 seconds.
Years later, with more advanced IC technology, it will become necessary to manufacture custom ICs again, and therefore custom ICs will need to be manufactured each time.
It took a lot of time and money to manufacture the product and inspect it.

Therefore, when manufacturing ID cards suitable for various systems, unless a general-purpose IC is used, a large amount of cost is required, and the ID cards cannot be compatible with each system.

In order to eliminate such drawbacks, the CPU portion constituting the IC module can be made independent with one chip of IC, and only the memory IC, which has significantly improved integration, can be replaced.

Conventionally, there have been IC modules constructed of two IC chips, a CPU and a memory, as shown in FIGS. 2(a) and 2(b). FIG. 2(a) is a sectional view of a conventional IC module, and FIG. 2(b) is a partial perspective view thereof.

Assuming that the bottom surface is the front surface and the top surface is the back surface in FIG. 2, the external input/output terminal 15 is provided at a predetermined position on the front surface (the bottom surface in FIG. 2) of the plastic board 14, and the lead wire 17 is passed through the through hole 16 to the back surface. (the top surface in FIG. 2), and the CPU IC chip 1 is provided on the back surface of the substrate 14.
8 and memory IC chip 19 are placed and fixed, and the IC chip 19 is placed and fixed.
This is an IC module in which bonding is performed by connecting the pads 20 of chips 18 and 19 and lead wires 17 with wires 21, and then a protective layer 22 is formed of plastic.

However, just using two chips, one for the CPU and the other for memory, makes the IC module too large.
It is not possible to manufacture IC cards that meet the standards.

In other words, IC cards conform to the international standard (ISO) ID card standard, and also include magnetic cards, embossed cards, and CC cards.
Since it must be compatible with R cards and the like, it cannot be expected to become popular unless the dimensions are below the standard.

Therefore, according to international standards, the space for embedding an IC that does not affect the magnetic stripe and embossing is set at 14.13 mm (vertical x width) x 30 m + n or less, and the standard for the thickness of ID cards is usually 0. .7
6 van, the IC module has a thickness of 0.66 m when the overcoat layers are placed above and below, and the maximum dimensions of the IC module are 14.13 m x 30 m x 0.6 m.
6 mg.

The conventional IC module for IC cards has a CP on the board 14.
In order to provide wiring between U, memory, and external input/output terminals, the board 14 has IC chips 18 and 19 for the CPU and memory.
It requires a large area other than the part to fix the I
It becomes a C module, and the IC in the ID card
This has the disadvantage that the embedding space exceeds the above-mentioned standard. In other words, if the two chips, CPU and memory, were simply installed on a two-layer carrier film substrate, the wiring to the IC and the through-holes to the external input/output terminals would be approximately 0.05 m larger than the 5 x 5 + II + Il IC chip. However, due to the required die pond area, etc., the maximum module size described above is exceeded. Therefore, even if a two-chip IC module is simply manufactured for use in an IC card, it is difficult to satisfy the card specifications.

Furthermore, card standards include an embossed area and a magnetic stripe area, and the former is used to mechanically create irregularities on the card.
If there is an IC module in this part, there is a high possibility of damage to the IC chip, which is fatal to the IC card. Even if there is, the smoothness of the back surface of the magnetic stripe will be lost, causing shearing when reading magnetic data, and compatibility with conventional magnetic stripe cards will be lost.

Furthermore, conventional IC modules for IC cards require a large amount of space on the board 14 in order to provide wiring between the CPU, memory, and external input/output terminals. Chip 18.
If the parts other than the part that fixes 19 are insufficient, wiring will also be placed on the surface of the board 14, and this wiring will appear on the surface of the card along with the external input/output terminals, damaging the wiring or significantly changing the appearance. There was a drawback that it was a loss. If an overcoat layer is further provided to protect and hide the wiring appearing on the surface of such a card, the thickness will increase, resulting in a drawback that the card cannot comply with the card standards.

The present invention is an IC module for IC cards that uses a plurality of general-purpose ICs, and can easily accommodate future improvements in IC technology at a low cost without using custom ICs for IC cards that require a large initial investment. To provide an IC module for an IC card that is small in size and conforms to IC card standards, and in which no wiring appears on the surface.

The present invention is an IC module that is fitted into a recess in a card material to form an IC card, in which a plurality of IC chips are fixed to a substrate, and an opening larger than the fixed IC chips is formed. The intermediate substrate having the above-mentioned I
An IC for an IC card in which a magnetic board having an opening larger than a C chip is stacked on an inner board, lead wires are provided on both sides of the middle board, and the pads of the IC chip and the leads on the back side of the middle board are connected with wires. It is a module.

FIGS. 3(a) and 3(b) K show an embodiment of the present invention. FIG. 3(a) is a sectional view, and FIG. 3(b) is an exploded perspective view of each substrate according to an embodiment of the present invention.

Assuming that the bottom surface is the front surface and the top surface is the back surface in FIG. 3, the external input/output terminal 15 is provided at a predetermined position on the front surface (the bottom surface in FIG. 3) of the substrate 14 made of plastic such as epoxy resin, and the through hole 16 is completely passed through. A lead wire 17 is provided on the back surface (top surface in FIG. 3), and a CPU IC chip 18 and a memory IC chip 19 are fixed to the back surface of the substrate 14 with adhesive.
．． A middle substrate 24 having an opening 26 larger than 19 and having predetermined lead wires 17 on both sides is adhered to the substrate, and an opening 2 of the middle substrate 24 having the same size as the vaginal inner substrate 24 is attached.
A substrate 26 having an opening 25 larger than 6 is bonded to the middle substrate 24, and a wire 21 is connected between the pads 20 of the IC chips 18 and 19 and the lead wires 17 on the back surface of the middle substrate 24 (top surface in the figure). After that, a protective layer 22 of ultraviolet-transparent plastic is formed, and the I
C module. This makes it possible to erase the written data after a complete inspection of the memory in the IC module using the ultraviolet erase type EPROM as the built-in memory by the write operation.

The wiring in FIG. 3(b) is, for example, an external input/output terminal 15.
The lead end 27 is connected to the lead wire 17 through the through hole 16, the lead end 2 is connected to the through hole 16, and the lead 29, and the lead 29 and the pad 20 are bonded.

The lead wires 17 are provided on the back surface of the substrate 14 as shown in FIG. the back surface, the surface of the middle substrate 24,
It is possible to wire in a complex three-dimensional manner using the back side.

It is preferable for the thickness of the middle substrate 24 to be greater than the thickness of the IC chips 18 and 19 in order to perform bonding.

Bonding is preferably carried out by ultrasonically applying M using a wedge bonder.

A through hole 16 is provided in the middle substrate 24 to connect lead wires 17 on both sides. Through hole 1 provided in the middle board 24
It is preferable that the through hole 6 is shifted from the through hole 16 provided in the substrate 14 in order to prevent liquid from entering.

Further, although two IC chips are used in this embodiment, three or more IC chips may be used as necessary.

As with the substrate 14, the middle substrate 24 and the sexual substrate 26 may be made of insulating plastic such as Epoquine resin.

Since the embodiment of the present invention has the above-described configuration, the dimensions of the IC embedding space where the IC does not affect the magnetic stripe and embossing according to the international standard are 14.13 x 30 x O,66+nm. In order to set general-purpose two-chip ICs in a predetermined volume, we can provide an IC module that can be housed in a large area.In order to set two general-purpose IC chips in a predetermined volume, we use a multilayer board to three-dimensionally wire the IC chips and the wiring between the IC chips and external terminals. Since overlapping of wiring is avoided, there is no overlapping of wiring caused by conventional planar wiring.

Therefore, the board does not take up a large space as in the conventional case, and no wiring other than external input/output terminals appears on the surface of the board 14, so that the appearance is not spoiled.

Moreover, the IC module for IC cards uses multiple general-purpose ICs.
- Since it is a standard IC, it is possible to easily respond to future improvements in IC technology at a low price without using a custom IC for an IC card that requires a large initial investment.

In addition, by using multiple layers, the exposure of the through holes to the module surface can be minimized, and the through holes 16 provided in the substrate 14 can be
By shifting the positions of the through holes 16 provided in the middle substrate 24, it is possible to effectively prevent infiltration of drugs from the outside through the through holes.

Furthermore, since the IC chip is buried in the multilayer substrate, external mechanical stress is dispersed to the substrate layers surrounding the IC chip, making the IC module resistant to bending stress and the like.

As described above, the IC module according to the embodiment of the present invention can be wired without worrying about the positions of external input/output terminals due to the multilayer structure. Further, since the flexible substrate plays the role of a frame, the protective layer formed of the molding material is protected by the flexible substrate, and the through holes serve as a strength member against compression.

Since it uses a general-purpose IC, it is inexpensive, easy to adapt to the system, and standardization of ID card manufacturing can be achieved.

As described above, the present invention can provide an IC module for an IC card with a small size, and can have extremely great practical effects.

[Brief explanation of drawings]

Figure 1 is a partial cross-sectional view of a conventional IC card, Figure 2 (a)
is a cross-sectional view of a conventional IC module, FIG. 2(b) is a partial perspective view thereof, FIG. 3(a) is a cross-sectional view of an embodiment of the present invention, and FIG. 3(b) is a cross-sectional view of a conventional IC module. FIG. 3 is an exploded perspective view of each substrate of one embodiment. 1... Board, 2... IC chip, 3... IC module
4... Card material, 5... Recess, 6... Surface electrode, 7... IJ-do, 8... Through pole, 9...
Pad, 10... Wire, 11... Protective layer, 12.
...Filling layer, 14...Substrate, 15...External input/output terminal, 16...Through hole, 17...Lead wire, 1
8.19...IC chip, 20...pad, 21...
・Wire, 22... Protective layer, 26... Opening, 24
... middle substrate, 25 ... opening, 26 ... gender substrate,
27...Lead end, 28...Lead end, 29...
Lead. Patent applicant: Kyodo Printing Co., Ltd. Representative Patent Attorney 1) Minoru Representative Patent Attorney Takao Maruyama Figure 3 (a) Figure 3 (b)

Claims (1)

[Claims] 1. An IC module for forming an IC card by fitting into a recess of a card material, the IC module having a plurality of ICs on a substrate.
A chip is fixed, a middle board having an opening larger than the fixed IC chip is placed on the substrate, an outer board having an opening larger than the IC chip is placed on the middle board, and both sides of the middle board are covered. I which has lead wires and connects the pads of the IC chip and the leads on the back surface of the middle board with the wires.
IC module for C card. 2. An IC module 3 for an IC card according to claim 1, characterized in that the thickness of the inner substrate is greater than the thickness of the IC chip; The IC module for an IC card according to claim 1, characterized in that the position of the IC module is shifted.