JPH0417550B2 - - Google Patents
Info
- Publication number
- JPH0417550B2 JPH0417550B2 JP59208795A JP20879584A JPH0417550B2 JP H0417550 B2 JPH0417550 B2 JP H0417550B2 JP 59208795 A JP59208795 A JP 59208795A JP 20879584 A JP20879584 A JP 20879584A JP H0417550 B2 JPH0417550 B2 JP H0417550B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- holes
- chip
- frame
- cover sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000011162 core material Substances 0.000 description 8
- 239000000945 filler Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011796 hollow space material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は、カード基材の内部にICチツプが実
装されてなるICカードに関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an IC card in which an IC chip is mounted inside a card base material.
［発明の技術的背景］
従来から、例えば金融機関における金銭出入時
の証明用のデータカードとして、合成樹脂製のカ
ード基材の表面にストライプ状に磁気コートを施
し、この部分に口座番号や暗唱番号等のデータを
磁気記録した磁気カードが広く用いられている。[Technical Background of the Invention] Conventionally, for example, as a data card for proving the receipt or withdrawal of money at a financial institution, a magnetic coating is applied in a striped manner to the surface of a card base material made of synthetic resin, and an account number or a recitation is written on this part. Magnetic cards on which data such as numbers are magnetically recorded are widely used.
磁気カードは構造が単純で耐久性が高く、しか
も大量生産に向いていることから、特にサービス
産業分野に幅広く用いられている。 Magnetic cards have a simple structure, high durability, and are suitable for mass production, so they are widely used, especially in the service industry field.
しかしながら、このような磁気カードは記憶容
量が小さいために、極少数の情報しか記録するこ
とができず、多数の情報は、金融機関における預
金通帳のような別個の記録手段に記録する必要が
あり、情報処理の高能率化に対する障害となつて
いた。 However, due to the small storage capacity of such magnetic cards, only a small amount of information can be recorded, and a large amount of information must be recorded in a separate recording means such as a bankbook at a financial institution. , which had become an obstacle to increasing the efficiency of information processing.
また、この磁気カードは外部から情報を比較的
簡単に読取れるため、機密保持や盗用防止等の点
で問題があつた。 In addition, since information on this magnetic card can be read relatively easily from the outside, there have been problems in maintaining confidentiality and preventing theft.
このような事情から近年、メモリおよびマイク
ロプロセツサ等のICチツプを内蔵し、記憶容量
を飛躍的に高めたICカードと呼ばれるデータカ
ードが開発された。 Under these circumstances, data cards called IC cards have been developed in recent years, which have built-in IC chips such as memory and microprocessors, and have dramatically increased storage capacity.
第３図は、このICカードの構造を示す一部透
視図を含んだ平面図、第４図はそのＡ−A′線に
沿う横断面図である。 FIG. 3 is a plan view including a partially transparent view showing the structure of this IC card, and FIG. 4 is a cross-sectional view taken along the line A-A'.
同図において１は表面に導体パターン２が形成
され所定部分に孔１ａ，１ａが形成された、例え
ばポリイミド樹脂製のフレキシブル基板を示して
いる。 In the figure, reference numeral 1 denotes a flexible substrate made of polyimide resin, for example, on which a conductive pattern 2 is formed and holes 1a, 1a formed in predetermined portions.
このフレキシブル基板１は、例えば塩化ビニル
樹脂製の表側カバーシート３に固着され、ICチ
ツプ４，４がフレキシブル基板１の孔１ａ，１ａ
内で表側カバーシート３に固着されている。な
お、表側カバーシート３の一部からは導体パター
ン２と電気的に接続された金属端子５が露出して
いる。 The flexible substrate 1 is fixed to a front cover sheet 3 made of, for example, vinyl chloride resin, and the IC chips 4 are inserted into the holes 1a, 1a of the flexible substrate 1.
It is fixed to the front cover sheet 3 inside. Note that a metal terminal 5 electrically connected to the conductive pattern 2 is exposed from a part of the front cover sheet 3.
そして導体パターン２とICチツプ４，４とは
金ワイヤ６によりボンデイングされており、フレ
キシブル基板１にはボンデイング部分を外囲する
程度の孔７ａ，７ａを有する例えば塩化ビニル樹
脂製のセンターコアシート７が固着されている。
さらにフレキシブル基板１の孔１ａ，１ａ内およ
びセンターコアシート７の孔７ａ，７ａ内には、
例えばエポキシ樹脂等の充填材８が充填され、セ
ンターコアシート７を覆うように裏側カバーシー
ト９が固着されている。 The conductor pattern 2 and the IC chips 4, 4 are bonded with a gold wire 6, and the flexible substrate 1 has a center core sheet 7 made of vinyl chloride resin, for example, which has holes 7a, 7a, which are large enough to surround the bonding portion. is fixed.
Furthermore, in the holes 1a, 1a of the flexible substrate 1 and in the holes 7a, 7a of the center core sheet 7,
For example, a filler 8 such as epoxy resin is filled, and a back cover sheet 9 is fixed to cover the center core sheet 7.
このように構成されるICカードは、所定の処
理装置のカード装着部にセツトし、金属端子５を
処理装置側の端子と接続させれば情報の書込みお
よび読出しを行なうことができる。 The IC card configured as described above can be set in the card mounting section of a predetermined processing device, and by connecting the metal terminal 5 to a terminal on the processing device side, information can be written and read.
ところで、ICカードは先に述べた磁気カード
と同様に常時携帯される場合が多く、外力に対し
て相当の耐久性が要求されている。 Incidentally, like the magnetic cards mentioned above, IC cards are often carried around all the time, and are required to have considerable durability against external forces.
［背景技術の問題点］
しかしながら、現在開発されているICカード
は、第３図および第４図からも明らかなように、
ICチツプを外囲し、カードの芯材となるセンタ
ーコアシートが単一の板状体であるため、特に
「曲げ」の力が加わるとそれに伴なう内部応力が
ICチツプ自体およびボンデイング部分に直接伝
わつてしまい、最悪の場合にはICチツプに亀裂
が入つたり、ボンデイング部分が破断しなりする
おそれがあるという問題があつた。[Problems with the Background Art] However, as is clear from FIGS. 3 and 4, currently developed IC cards have
Since the center core sheet that surrounds the IC chip and serves as the core material of the card is a single plate-shaped body, internal stress is generated especially when bending force is applied.
The problem was that the damage was transmitted directly to the IC chip itself and the bonding part, and in the worst case, the IC chip could crack or the bonding part could break.
［発明の目的］
本発明はこのような事情によりなされたもの
で、「曲げ」の力が加わつてもICチツプやそのボ
ンデイング部分が損われることのない構成とされ
た信頼度の高いICカードの提供を目的としてい
る。[Purpose of the Invention] The present invention was made under these circumstances, and provides a highly reliable IC card that has a structure in which the IC chip and its bonding portion are not damaged even when "bending" force is applied. intended to provide.
［発明の概要］
すなわち本発明のICカードは、一組のカバー
シートと、多角形状、楕円状、あるいは円状の空
〓部を複数個構成するものであり、前記空〓部が
前記カバーシートの全面に渡り設けられるよう
に、前記一組のカバーシートの間に介挿される枠
体とからなり、前記空〓部の一部にICチツプが
実装されるとともに、前記空〓部に充填材が充填
されることを特徴とする。[Summary of the Invention] That is, the IC card of the present invention comprises a set of cover sheets and a plurality of polygonal, elliptical, or circular hollow portions, and the hollow portions are connected to the cover sheet. a frame body inserted between the set of cover sheets so that the IC chip is mounted in a part of the hollow space, and a filler is placed in the hollow space. It is characterized by being filled with.
［発明の実施例］
以下本発明の詳細を図面に示す実施例に基づい
て説明する。[Embodiments of the Invention] Details of the present invention will be described below based on embodiments shown in the drawings.
第１図は本発明の一実施例の構成を示す一部透
視図を含んだ平面図、第２図はそのＢ−B′線に
沿う横断面図である。 FIG. 1 is a plan view including a partially transparent view showing the structure of an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line B-B'.
これらの図において１０は表面に導体パターン
１１が形成され所定の部分に孔１０ａ，１０ａが
形成された、例えばポリイミド樹脂製のフレキシ
ブル基板を示している。 In these figures, reference numeral 10 indicates a flexible substrate made of, for example, polyimide resin, on which a conductive pattern 11 is formed and holes 10a, 10a are formed in predetermined portions.
このフレキシブル基板１０は、例えば塩化ビニ
ル樹脂製の表側カバーシート１２に固着され、
ICチツプ１３，１３がフレキシブル基板１０の
孔１０ａ，１０ａ内で表側カバーシート１２に固
着されている。なお、表側カバーシート１２の一
部からは導体パターン１１と電気的に接続された
金属端子１４が露出している。 This flexible substrate 10 is fixed to a front cover sheet 12 made of, for example, vinyl chloride resin,
IC chips 13, 13 are fixed to the front cover sheet 12 within the holes 10a, 10a of the flexible substrate 10. Note that a metal terminal 14 electrically connected to the conductive pattern 11 is exposed from a part of the front cover sheet 12.
そして導体パターン１１とICチツプ１３，１
３とは金ワイヤ１５によりボンデイングされてお
り、フレキシブル基板１０にはICチツプ１３，
１３と対応する位置に少なくともボンデイング部
分を外囲する程度の大きさの方形状の孔１６ａ，
１６ａおよびその周囲に多数の方形状の孔１６
ｂ，１６ｂ，…を有する例えば銅、アルミニウム
等の金属製の枠体１６の一方の側が固着されてい
る。 And conductor pattern 11 and IC chip 13,1
3 is bonded with a gold wire 15, and the flexible substrate 10 has an IC chip 13,
A rectangular hole 16a having a size that at least surrounds the bonding portion is provided at a position corresponding to 13,
16a and many rectangular holes 16 around it.
One side of a frame 16 made of metal such as copper or aluminum is fixed.
また、孔１６ａ，１６ａおよび孔１６ｂ，１６
ｂ，…の内部はシリコン樹脂やエポキシ樹脂等の
軟質の充填材１７により充填されている。さらに
枠体１６の他方の側には、裏側カバーシート１８
が固着されている。 In addition, holes 16a, 16a and holes 16b, 16
The insides of b, . . . are filled with a soft filler 17 such as silicone resin or epoxy resin. Further, on the other side of the frame 16, a back cover sheet 18 is provided.
is fixed.
しかして、上述したように構成された本実施例
のICカードは、従来、単一の板状体であつたセ
ンターコアシートが多数の孔を有する枠体１６に
置き換えられ、しかも孔それぞれの内部が充填材
１７により充填されてなるので、「曲げ」の力が
加わつた場合でも、内部応力が各孔内の充填材１
７に吸収されて、ICチツプ１３，１３および金
ワイヤ１５の部分に伝わらない。 Therefore, in the IC card of this embodiment configured as described above, the center core sheet, which was conventionally a single plate-like body, is replaced with a frame body 16 having a large number of holes. are filled with the filler 17, so even if a "bending" force is applied, internal stress will be applied to the filler 1 in each hole.
7 and is not transmitted to the IC chips 13, 13 and the gold wire 15.
本実施例では、枠体１６に形成する孔１６ａ，
１６ａおよび孔１６ｂ，１６ｂ，…を方形状にし
ているが、本発明はこれに限定されるものではな
く、孔を円形状、楕円状あるいは多角形状にして
もよい。 In this embodiment, holes 16a formed in the frame 16,
16a and the holes 16b, 16b, . . . have a rectangular shape, but the present invention is not limited to this, and the holes may have a circular, elliptical, or polygonal shape.
また本実施例では枠体１６を金属製にしている
が、硬質の樹脂製にしてもよい。 Furthermore, although the frame body 16 is made of metal in this embodiment, it may be made of hard resin.
なお、本実施例のように枠体１６を金属製にし
た場合には、文字記号等を記録するいわゆるエン
ボスエリアに枠部分が位置しないようにする必要
がある。 In addition, when the frame body 16 is made of metal as in this embodiment, it is necessary to prevent the frame portion from being located in a so-called embossed area where characters and symbols are recorded.
また枠体を金属製にした場合には、これにIC
チツプのグランドラインを接続しておくことも可
能である。 Also, if the frame is made of metal, it can be
It is also possible to connect the ground line of the chip.
またさらに枠体をハニカム構造にし、その空〓
部をすべて軟質の充填材で充填するようにすれ
ば、非常にしなやかで耐久性の高いICカードを
得ることができる。 Furthermore, the frame is made into a honeycomb structure, and the sky is
By filling all parts with a soft filler, an extremely flexible and highly durable IC card can be obtained.
［発明の効果］
以上説明したように本発明のICカードは、従
来、単一の板状体であつたセンターコアシートが
多数の孔を有する枠体に置き換えられ、その枠体
の空〓部が軟質の充填材に充填されてなるので、
「曲げ」の力が加わつても内部応力がICチツプや
ボンデイング部分に伝わらず、ICチツプに亀裂
が入つたりボンデイングが破断したりするおそれ
がない。[Effects of the Invention] As explained above, in the IC card of the present invention, the center core sheet, which was conventionally a single plate-like body, is replaced with a frame body having many holes, and the empty space of the frame body is replaced with a frame body having a large number of holes. is filled with soft filling material,
Even when "bending" force is applied, internal stress is not transmitted to the IC chip or bonding parts, so there is no risk of cracking the IC chip or breaking the bonding.
第１図は本発明の一実施例の構成を示す一部透
視図を含んだ平面図、第２図はそのＢ−B′線に
横沿う横断面図、第３図は従来のICカードの構
成を示す一部透視図を含んだ平面図、第４図はそ
のＡ−A′線に沿う横断面図である。
１，１０……フレキシブル基板、２，１１……
導体パターン、３，１２……表側カバーシート、
４，１３……ICチツプ、５，１４……金属端子、
６，１５……金ワイヤ、７……センターコアシー
ト、８，１７……充填材、９，１８……裏側カバ
ーシート、１６……枠体。
Fig. 1 is a plan view including a partially perspective view showing the configuration of an embodiment of the present invention, Fig. 2 is a cross-sectional view taken along line B-B', and Fig. 3 is a diagram of a conventional IC card. A plan view including a partially transparent view showing the structure, and FIG. 4 is a cross-sectional view taken along the line A-A'. 1, 10...Flexible board, 2, 11...
Conductor pattern, 3, 12...front cover sheet,
4,13...IC chip, 5,14...metal terminal,
6, 15... Gold wire, 7... Center core sheet, 8, 17... Filler, 9, 18... Back cover sheet, 16... Frame.
Claims (1)
数個構成するものであり、前記空〓部が前記カバ
ーシートの全面に渡り設けられるように、前記一
組のカバーシートの間に介挿される枠体とからな
り、 前記空〓部の一部にICチツプが実装されると
ともに、前記空〓部に充填材が充填されることを
特徴とするICカード。 ２ 前記枠体がハニカム構造である特許請求の範
囲第１項記載のICカード。 ３ 前記枠体が金属製である特許請求の範囲第１
項記載のICカード。[Claims] 1. A set of cover sheets and a plurality of polygonal, elliptical, or circular hollow parts, and the hollow parts are provided over the entire surface of the cover sheet. As shown in FIG. Features of IC cards. 2. The IC card according to claim 1, wherein the frame has a honeycomb structure. 3. Claim 1, wherein the frame is made of metal.
IC card listed in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59208795A JPS6186885A (en) | 1984-10-04 | 1984-10-04 | Identification card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59208795A JPS6186885A (en) | 1984-10-04 | 1984-10-04 | Identification card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6186885A JPS6186885A (en) | 1986-05-02 |
| JPH0417550B2 true JPH0417550B2 (en) | 1992-03-26 |
Family
ID=16562239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59208795A Granted JPS6186885A (en) | 1984-10-04 | 1984-10-04 | Identification card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6186885A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3420051A1 (en) * | 1984-05-29 | 1985-12-05 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | DATA CARRIER WITH IC COMPONENT AND METHOD FOR PRODUCING SUCH A DATA CARRIER |
| JPH0615273B2 (en) * | 1986-01-20 | 1994-03-02 | 株式会社アイテイテイキャノン | IC card |
| JPS62214998A (en) * | 1986-03-17 | 1987-09-21 | 三菱電機株式会社 | Thin-type semiconductor card |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5990184A (en) * | 1982-09-27 | 1984-05-24 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Data card and manufacture thereof |
| JPS59140591A (en) * | 1983-01-31 | 1984-08-11 | Sony Corp | Portable card |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5850457Y2 (en) * | 1981-11-29 | 1983-11-17 | 征一郎 相合 | verification card |
-
1984
- 1984-10-04 JP JP59208795A patent/JPS6186885A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5990184A (en) * | 1982-09-27 | 1984-05-24 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Data card and manufacture thereof |
| JPS59140591A (en) * | 1983-01-31 | 1984-08-11 | Sony Corp | Portable card |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6186885A (en) | 1986-05-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |