JPS6282094A - Integrated circuit card with magnetic stripe - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an IC card with a magnetic stripe.

[Technical background of the invention and its problems]

Conventionally, for credit cards and bank cards, the owner code and the old device owned are displayed in embossed letters, and the information such as the owner code and other specific coded information are magnetically recorded on a striped magnetic recording section. So-called magnetic cards with recorded information were widely used;
Since the recorded information can be easily read, there is a risk that a third party other than the owner may read the recorded information on the magnetic card and misuse it. Therefore, recently, IC cards have been used which have a built-in IC chip that operates in response to input signals from the outside and outputs pre-installed identification information.

Various studies have been made regarding the structure of IC cards. In this case, the most important problem is the reliability against damage to internal parts because the IC chip and the like are mounted inside the thin card body, which is about 0.8 fl thick.

In some types of IC cards, the IC card is placed approximately at the center of the width of the card body, so a large external force is applied to the IC chip due to the bending of the IC card, causing damage to the IC chip and breakage of the lead wires. There was a problem that occurred. Furthermore, in some types of IC cards, the IC chip is covered only with an exterior film, so there is a problem that the IC chip breaks when pressed with something with a sharp tip such as a ballpoint pen.

[Purpose of the invention]

The present invention has been made in view of the above conventional problems, and its purpose is to prevent large external forces from acting on the IC chip due to the bending of the IC card, thereby preventing damage to the IC chip and lead wires. To provide an IC card in which the IC chip is not cut and the IC chip is not damaged even when pressed with a sharp tip of a ballpoint pen or the like.

(Summary of the Invention) In order to achieve the above object, the present invention disposes an IC chip inside the card body and near the end of the card body corresponding to the magnetic stripe formed on the outer surface, and This IC card is constructed by disposing a substantially non-magnetic metal body between the stripe and the IC chip to protect the IC chip.

[Embodiments of the invention]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 3 is an overall perspective view showing an example of an IC card with a magnetic stripe to which the present invention is applied.

The IC card 1 has a thickness that conforms to the Is○ standard and is rectangular in shape. On the top of IC card 1, the
0. A striped magnetic stripe 2 is provided near one long side of the card 1. The IC card 1 has an IC card at a position facing the magnetic stripe 2 inside and in the vicinity thereof.
Module 3 is stored. The IC module 3 is composed of a wiring board 4, a CPU chip 5 and a memory chip 6 mounted on the wiring board 4 while avoiding the center of the IC card 1, and a plurality of external terminals 7 provided on the wiring board 4. has been done. The memory chip 6 is, for example, a non-volatile EP-
It is formed by ROM or EEP-ROM. The CPU chip 5 has the function of comparing the password input from the external terminal 7 side with the personal identification information stored in the memory chip 6, and outputting the result of the comparison. At this time, it is desirable that the personal identification information stored in the memory chip 6 is not transmitted to the terminal side. In addition to personal identification information, the memory chip 6 also stores and maintains personal credit and transaction history.

FIG. 1 is an enlarged sectional view taken along the line mm in FIG. 3, and FIG. 2 is an exploded perspective view of the IC card 1, showing that the IC card 1 has a seven-layer structure.

The wiring board 4 constituting the IC module 3 is made of flexible L-shaped bismaleimide-triazine resin or glass epoxy resin with a thickness of 200 μm, and has a length of I.
It is slightly shorter than the long side of the C card 1 and wider than the CPU chip 5 and memory chip 6. Wiring board 4
An opening 43 for the CPU chip 5 is provided at the intersection of the section 41 and the neck section 42, and an opening 44 for the memory chip 6 is provided near the edge of the section 41. Also, the wiring board 4
A total of eight external terminals 7, four each in two rows, are provided along the upper edge of the nape 42. A predetermined lead pattern 8 made of a conductor is formed between the CPIJ chip 5, the external terminal 7, and the memory chip 6. The lead pattern 8 and the external terminal 7 are formed by laminating copper foil on the wiring board 4 and etching it, and the external terminal 7 is further plated with copper to a predetermined thickness to make it protrude. The back side of the joint portion 81 with the memory chip 6 is finished by tin plating. The CPU chip 5 and the memory chip 6 fit into the opening 43 for the CPU chip 5 and the opening 44 for the memory chip 6, respectively.
Electrode terminal 51 made of gold bumps Held pattern 8
The joint portion 81 is joined. This connection is made by welding gold and tin using pulse heating.

Further, the C20 chip 5 and the memory chip 6 are attached to the wiring board 4 by hardening the joint part 81 of the upper molded terminal 51 and the lead pattern 8 with a sealing resin 52 by partial molding, and the lower part is attached to the wiring board 4. It protrudes slightly from the bottom surface.

The center sheet 10 is made of hard vinyl chloride 4M resin with a thickness of 200 μm, and has an L-shaped opening 10a into which the IC module 3 is inserted. This L-shaped opening 1
0a, the section 10b is located at a position facing the magnetic stripe 2 of the IC card 1, and the neck section 10c is extended to a position corresponding to the external terminal 7.

The upper sheet 11 and the lower sheet 12 cover the upper and lower surfaces of the centersy 1-10, respectively, are polymerized and adhered with an adhesive, and are made of hard vinyl chloride resin with a thickness of 40 μm. A CPU chip 5 is mounted on the upper surface of the lower sheet 12.
and the lower surfaces of the memory chips 6 face each other. Opening 43 for CPU chip 5 of wiring board 4 and memory chip 6
The space between the upper sheet 11 and the lower sheet 12 at the position corresponding to the opening 44 for the CPU chip 5 is filled with a two-component mixture type filler 9 made of, for example, an epoxy resin.
and the memory chip 6 is fixed.

The opening 11a provided in the upper sheet 11 is for inserting the external terminal 7 provided in the wiring board 4.

The upper sheet 13 and the lower sheet 14 cover the upper surface of the upper sheet 11 and the lower surface of the lower sheet 12, respectively, are polymerized and bonded with adhesive, and are made of hard vinyl chloride resin with a thickness of 100 μm. A rectangular opening 13a at a position corresponding to the chip 5 and the memory chip 6 and having an area facing at least the chips.
, 14a are formed, and a rectangular upper metal body 17 and a rectangular lower metal body 18 are fitted into the openings 13a and 14a, respectively, to protect both chips. Both the upper metal body 17 and the lower metal body 18 are made of substantially non-magnetic stainless steel thin plates, and are thinner than the upper sheet 13 and the lower sheet 14, and this difference in thickness allows the CPU chip 5 to Also, the protrusion of the memory chip 6 from the wiring board 4 in the thickness direction is absorbed and dealt with. Further, the top sheet 13 has eight openings 13b arranged in parallel at positions corresponding to the external terminals 7, through which the external terminals 7 pass.

The upper exterior film 15 and the lower exterior film 16 are polymerized to cover the upper surface of the upper sheet 13 and the lower surface of the lower sheet 14, respectively, and are bonded with an adhesive 19, and have a thickness of 1.
It is made of 00μm soft vinyl chloride resin. The upper exterior film 15 has a plurality of openings 15a arranged in parallel at positions corresponding to the external terminals 7, through which the external terminals 7 pass, and a magnetic stripe 2 is formed on the top surface along the long sides, avoiding the center in the width direction. It is formed by applying fine powder such as iron oxide.

Next, a method of molding the IC card 1 according to the above embodiment of the present invention will be explained. Above the center sheet 10 is an upper sheet 11. The upper sheet 13 and the upper exterior film 15 are stacked in this order, and the lower sheet 12, the lower sheet 14, and the lower exterior film 16 are arranged below the center sheet 10 in this order.
3a, etc., small holes 11a, 13b, etc. are processed in advance and wound into a roll shape. 1 and 2, ■ The lower exterior film 16 and the lower sheet 14 are bonded with adhesive 1.
9, the lower metal body 18 is fitted into the opening 14, a of the lower sheet 14, and is adhered to the upper surface of the lower exterior film 16 with an adhesive 19. In parallel with this, the upper exterior film 15
and the top sheet 13 are glued together with the adhesive 19, and the top sheet 1
The upper metal body 17 is fitted into the opening 13a of No. 3, and adhered to the lower surface of the upper exterior film 15 with an adhesive 19.

(2) Glue the lower sheet 12 onto the lower sheet 14 and the center sheet 10 onto the lower sheet 12 using adhesive 19.

■ Insert the IC module 3 manufactured separately in advance into the L-shaped opening 10a of the center sheet 10, and apply the adhesive 19 to the bottom surface.
It is glued to the lower sheet 12 with.

(2) Fill the area around the CPU chip 5 and memory chip 6 of the IC module 3 with the filler 9.

(2) The upper sheet 11 is adhered to the upper surface of the center sheet 10 and the IC module 3, and the lower surface of the upper sheet 13 is adhered to the upper surface of the upper sheet 11 using an adhesive 19 to integrate the whole. At this time, the upper surface of the external terminal 7 and the upper surface of the upper exterior film 15 are made to be the same.

■ Cut the outer periphery to the specified size of the IC card.

(2) A magnetic stripe 2 is formed on the upper surface of the upper exterior film 15.

The thickness of the adhesive layer between each layer is about 20 μm, and thus the IC card 1 has an average thickness of about 800 μm.
is completed.

According to the above embodiment of the present invention, centering on the center sheet 10, the upper sheet 11, the lower sheet 12, and the upper sheet 1
3 and the lower sheet 14, the upper exterior film 15, and the lower exterior film 16 are arranged symmetrically in the vertical direction, so that the IC card 1 can be prevented from being deformed due to warping, and the IC module 3 can avoid the central part of the IC card 1. Therefore, even if a bending moment is applied to the IC card 1 due to an external force, it is unlikely that the CPU chip 5 or memory chip 6 will be damaged or the lead pattern 8 will be cut. Since the upper surface of the film 15 is flush, it is possible to prevent dust from accumulating on the external terminal 7 and causing poor contact. Further, an IC module 3 is inserted into an L-shaped opening 10a provided in the center seat 10.
Since the IC module 3 is inserted into the IC card 1, the positioning of the IC module 3 can be performed accurately and efficiently when manufacturing the IC card 1. Since a rolled sheet or film is used, it is easy to make the process continuous and mass-produce. Since it is equipped with an IC chip and a magnetic stripe 2, it can also meet the demands during the transition period when switching from magnetic cards to IC cards.

Although the above embodiment shows the case where the CPU chip 5 and the memory chip 6 are separated, it is of course possible to integrate both chips and put them in one place. In this case, it is desirable that the IC chip be placed near the external terminal 7. Further, since the IC card 1 is vertically symmetrical with respect to the center sheet 10, the IC card 1 may be manufactured with the vertical order reversed with respect to the above embodiment.

〔Effect of the invention〕

According to the present invention, an IC chip is disposed inside a magnetic stripe-attached IC card having a magnetic stripe on the outer surface near an end portion of the IC card corresponding to the magnetic stripe, and the magnetic stripe and the IC chip are connected to each other. Since a substantially non-magnetic metal body is placed between them, the IC chip will not be subjected to large external forces even if the IC card is bent, which can prevent breakage or lead wire breakage, and can be used for ballpoint pens, etc. This has the effect that it will not be damaged even if it is pressed.

[Brief explanation of drawings]

The drawings all relate to embodiments of the present invention, and FIG. 1 is an enlarged vertical sectional view taken along line m-rn in FIG. 3, FIG. 2 is an exploded perspective view, and FIG. 3 is an overall perspective view. 1...IC car 1-', 2...Magnetic stripe, 3...IC module, 4...Nishiki line base 1, 5...CPU chip, 6...memory chip, 7... External terminal, 8... Lead pattern, 9... Encapsulant, lO... Center sheet, 10a... Opening, 11... Upper sheet, 12... Lower sheet, 13 ... Top sheet, 13a... Opening, 14... Bottom sheet, 14a... Opening, 15... Upper exterior film, ], 5 a... Opening, 16... Lower exterior film , 17... Upper metal body, 18... Lower metal body.

Claims (1)

[Claims] In an IC card with a magnetic stripe that has an IC chip stored inside and a magnetic stripe on the outer surface, an IC chip is disposed inside the IC card near an end of the IC card corresponding to the magnetic stripe, and An IC card characterized in that a substantially non-magnetic metal body is disposed between the magnetic stripe and the IC chip.