JPS6282095A - Integrated circuit card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to an IC card.

[Technical background of the invention and its problems]

Conventionally, for credit cards and bank cards, the owner code and the old device owned are displayed in embossed letters, and the information such as the owner code and other specific coded information are magnetically recorded on a striped magnetic recording section. So-called magnetic cards with recorded data have been widely used;
Since the recorded information can be easily read, there is a risk that a third party other than the owner may read the recorded information on the magnetic card and misuse it. Therefore, recently, IC cards have been used which have a built-in IC chip that operates in response to external input signals and outputs pre-installed identification information.

In conventional IC cards, the IC chip stored inside is only covered by the upper and lower exterior films, so when pressed with a ballpoint pen, etc., the IC chip can be easily removed.
The chip was damaged.

Therefore, various structures for protecting IC chips have been studied, and protection using metal bodies has been considered. However, if the IC chip is simply protected by a metal body, there are problems such as a short circuit between the IC chip and the metal body or warping of the IC card body. The thickness is ISO standard 0.76±0.
There was also the problem that it was difficult to keep the distance within the range of 0.8 mm.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned conventional problems, and its purpose is to provide a metal body to protect an IC chip. To provide an IC card which can prevent short-circuiting of patterns and can almost eliminate warping of the IC card body even if it is provided with such a short-circuit protection structure.

[Summary of the invention]

In order to achieve the above object, the present invention protects the IC chip by arranging a thin upper metal body and a thin upper metal body above and below the IC chip inside, respectively.
An insulating sheet member is placed between the IC chip and each of the metal bodies to prevent a short circuit between the IC chip and each of the metal bodies, and the thickness is within the allowable thickness range according to ISO standards. It is configured as an IC card that fits inside the device.

[Embodiments of the invention]

An embodiment of the present invention will be described using an IC card as an example, which has both of the functions required when transitioning from a magnetic card with a magnetic stripe to an IC card.

FIG. 3 is an overall perspective view showing an example of an IC card to which the present invention is applied.

The IC card 1 has a thickness that complies with ISO standards and is rectangular in shape. A striped magnetic stripe 2 is provided on the top surface of the IC card 1 near one long side of the IC card 1 . An IC module 3 is housed inside the IC card 1 at a position facing the magnetic stripe 2 and in the vicinity thereof. This IC module 3 includes a wiring board 4, a CPU chip 5 and a memory chip 6 mounted on the wiring board 4 while avoiding the center of the IC card 1.
and a plurality of external terminals 7 provided on the wiring board 4. The memory chip 6 is, for example, an inadvertent E.
It is formed by P-ROM or EEP-ROM. The CPU chip 5 has the function of comparing the password input from the external terminal 7 side with the personal identification information stored in the memory chip 6, and outputting the result of the comparison. At this time, it is desirable that the personal identification information stored in the memory chip 6 is not transmitted to the terminal side. In addition, the memory chip 6 has an individual 1[&
In addition to other information, personal credit and transaction history are recorded.
q and held.

FIG. 1 is an enlarged sectional view taken along the line III--III in FIG. 3, and FIG. 2 is an exploded perspective view of the IC cart '1, showing that the IC card 1 has a seven-layer structure.

The wiring board 4 constituting the IC module 3 is made of flexible L-shaped bismaleimide-triazine resin or glass epoxy resin with a thickness of 200 μm, and has a length of I.
It is slightly shorter than the long side of the c-card 1 and wider than the CPU chip 5 and memory chip 6. Wiring board 4
An opening 43 for the CPU chip 5 is provided at the intersection of the receiving portion 41 and the neck portion 42, and an opening 44 for the memory chip 6 is provided near the edge of the receiving portion 41. Also, the wiring board 4
There are two rows of 4 in each row along the upper edge of the nuchal portion 42, a total of 8 external) 5f:'I pins 7. A predetermined lead pattern 8 is formed from a conductor between the CPU chip 5, the external 1st metal plate 7, and the memory chip 6. The lead pattern 8 and the external terminal 7 are formed by laminating copper foil on the wiring board 4 and etching the external terminal 7.
This portion is further plated with copper to a predetermined thickness to make it protrude, and the back side of the joint portion 81 with the CPU chip 5 and memory chip 6 is finished with tin plating. C
PU chip 5 and memory chip 7 each have CPI
The electrode anchor 51, which is a gold hump, is fitted into the opening 43 for the J chip 5 and the opening 44 for the memory chip 6, and the joint portion 81 of the lead pattern 8 is bonded thereto. This connection is made by welding gold and tin using pulse heating. Further, the CPU chip 5 and the memory chip 6 are mounted on the ij substrate 4 by solidifying the joint part 8I of the upper electrode 51 and the lead pattern 8 with a sealing resin 52 formed by partial molding. , the lower part protrudes slightly from the lower surface of the wiring board 4.

The center sheet 10 is made of hard vinyl chloride resin with a thickness of 200 μm, and has an L into which the IC module 3 is inserted.
It has a letter-shaped opening 10a. This L-shaped opening 10
In FIG. 1A, the receiving portion 10b is located at a position facing the magnetic stripe 2 of the IC card 1, and the neck portion 10c is extended to a position corresponding to the external terminal 7.

The upper sheet 11 and the lower sheet 12 cover the upper and lower surfaces of the center sheet 10, respectively, and are bonded to each other with an adhesive, and are made of hard vinyl chloride resin having insulating properties and having a thickness of 40 μm. C on the upper surface of the lower sheet 12
The lower surfaces of the PU chip 5 and the memory chip 6 face each other. The space between the upper sheet 11 and the lower sheet 12 at the positions corresponding to the opening 43 for the CPU chip 5 and the opening 44 for the memory chip 6 of the wiring board 4 is filled with a two-component mixed type filler 9, for example, an epoxy resin type filler. is filled with C
PU chip 5 and memory cheerleader are fixed. An opening 11a provided in the upper seat 11 is for inserting an external component 7 provided on the wiring board 4.

The upper sheet 13 and the lower sheet 14 respectively cover the upper surface of the upper sheet 11 and the F side of the lower sheet 12, are polymerized and bonded with adhesive, and are made of hard vinyl chloride resin with a thickness of 100 μm. A rectangular opening 13a having an area facing at least the side chip at a position corresponding to the CPU chip 5 and memory chip 6.
, 14a are formed, and the openings 13a, 14. a
a square lower metal body 17 and a lower metal body 1, respectively.
8 is inserted to protect both chips. The upper metal body 17 and the lower metal body 18 are both made of stainless steel thin plates, and are thinner than the upper sheet 13 and the lower sheet 14, and this difference in thickness allows the CP
The protrusion of the U-chip 5 and the memory chip 6 from the wiring board 4 in the thickness direction is absorbed and dealt with. Further, the upper surface seam)-13 has eight openings 13b arranged in parallel at positions corresponding to the external terminals 7 through which the external +jijF7 passes.

The upper exterior film 15 and the lower exterior film 16 are polymerized to cover the upper surface of the upper sheet 13 and the lower surface of the lower sheet 14, respectively, and are bonded with an adhesive 19, and have a thickness of 1.
It is made of 00μm soft vinyl chloride resin. The upper exterior film 15 has a plurality of openings 15a arranged in parallel at positions corresponding to the external terminals 7, through which the external terminals 7 pass, and a magnetic stripe 2 is formed on the top surface along the long sides, avoiding the center in the width direction. It is formed by applying fine powder such as iron oxide.

Next, a method for using the IC card 1 according to the above embodiment of the present invention will be explained. Above the center sheet 10 is an upper sheet 11. A top sheet 13 and an upper exterior film 15, and a lower sheet 12 below center sea 1-10.
The lower sheet 14 and the lower exterior film 16 are stacked and arranged in this order, and both have predetermined openings 10a,
13a, etc., small holes 11a, 13b, etc. are processed in advance, and the material is wound into a roll. 1 and 2, ■ The lower exterior film 16 and the lower sheet 14 are bonded with adhesive 1.
9, fit the lower metal body 18 into the opening 14a of the lower sheet 14, and apply adhesive 1 to the upper surface of the lower exterior film 16.
Glue in step 9. In parallel with this, the upper exterior film 15 and the top sheet 13 are adhered with adhesive 19, and the top sheet 13
The upper metal body 17 is fitted into the opening 13a and adhered to the lower surface of the upper exterior film 15 with an adhesive 19.

(2) Bond the lower sheets 1 to 12 onto the bottom sheet 14 and the center sheet 10 onto the bottom sheet 12 using adhesive 19.

■ Insert the IC module 3 manufactured separately in advance into the L-shaped opening 10a of the center seat T-10, and apply the adhesive 1 to the bottom surface.
It is glued to the lower sheet 12 with the help of the following steps.

(2) Fill the area around the CPU chip 5 and memory chip 6 of the IC module 3 with the filler 9.

(2) The upper sheet 11 is adhered to the upper surface of the center sheet 10 and the IC module 3, and the lower surface of the upper sheet 13 is adhered to the upper surface of the two-part sheet 1-11 using an adhesive 19 to integrate the whole. At this time, the upper surface of the external terminal 7 and the upper surface of the upper exterior film 15 are flush with each other.

■ Cut the outer periphery to the specified size of the IC card.

(2) A magnetic stripe 2 is formed on the upper surface of the upper exterior film 15.

The thickness of the adhesive layer between each sheet is approximately 20 μm, and thus an IC card 1 having an average thickness of approximately 800 μm is completed.

According to the above embodiment of the present invention, since the insulating upper sheet 11 is inserted between the CPU chip 5 and the memory chip 6 and the lower metal body 17, each electrode terminal of the CPU chip 5 and the memory chip 6 is The bonding portions 81 of the lead patterns 8 to be bonded can be reliably prevented from being short-circuited by the upper metal body 17. Moreover, center seat 10
The upper sheet 11, the lower sheet 12, the upper sheet 13, the lower sheet 14, the upper exterior film 15, and the lower exterior film 16 are arranged vertically symmetrically with respect to Since the IC card 1 is balanced in direction, deformation due to warping can be prevented.

Although the above embodiment shows the case where the CPU chip 5 and the memory chip 6 are separated, it is of course possible to integrate both chips and put them in one place. In this case, it is desirable that the IC chip be placed near the external terminal 7. Further, the magnetic stripe 2 can be omitted, and in this case, the manufacturing process can be further simplified. Further I
Since the c-car 1'1 is vertically symmetrical with respect to the center seat 10, it may be manufactured by reversing the vertical order of the above embodiment.

〔Effect of the invention〕

According to the present invention, a thin lower metal body and a thin lower metal body are respectively disposed above and below a jC chip housed inside, and an insulating sheet is provided between the IC chip and the upper and lower metal bodies, respectively. Since the members are arranged, the IC chip is reliably protected by the lower metal body and the lower metal body, and the IC chip is further protected by the insulating sheet member.
It is possible to prevent the occurrence of short circuits between the chip and the upper gold mud body, and the lower metal body and the upper and lower insulating sheet members can be arranged symmetrically along the thickness direction, so that warping does not occur. It is possible to provide an IC card.

[Brief explanation of drawings]

The drawings all relate to embodiments of the present invention, and FIG. 1 is an enlarged vertical sectional view taken along the line II[-11I in FIG.
The figure is an exploded perspective view, and Figure 3 is an overall perspective view. 1... IC card, 2... Magnetic stripe, 3... IC module, 4... Wiring board, 5... CPU chip, 6... Memory chip, 7... External terminal, 8... Lead pattern, 9... Filler, 10... Center sheet, 10a... Opening, 11... Upper sheet, 12... Lower sheet, 13... Top sheet, 13a... ... Opening, 14... Bottom sheet, 14a... Opening, 15... Upper exterior film, 16... Lower exterior film, 17... Upper gold mud body, 18... Lower metal body.

Claims (1)

[Claims] In an IC card having an IC chip inside, the I
A thin upper metal body is placed above the C chip, a thin lower metal body is placed below the C chip, and an insulating sheet member is placed between the IC chip and the upper metal body and between the IC chip and the lower metal body. An IC card that is characterized by