JPH0524554Y2 - - Google Patents

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Publication number
JPH0524554Y2
JPH0524554Y2 JP1986111536U JP11153686U JPH0524554Y2 JP H0524554 Y2 JPH0524554 Y2 JP H0524554Y2 JP 1986111536 U JP1986111536 U JP 1986111536U JP 11153686 U JP11153686 U JP 11153686U JP H0524554 Y2 JPH0524554 Y2 JP H0524554Y2
Authority
JP
Japan
Prior art keywords
module
card
printed circuit
circuit board
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986111536U
Other languages
Japanese (ja)
Other versions
JPS6318277U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986111536U priority Critical patent/JPH0524554Y2/ja
Publication of JPS6318277U publication Critical patent/JPS6318277U/ja
Application granted granted Critical
Publication of JPH0524554Y2 publication Critical patent/JPH0524554Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】 〔考案の技術分野〕 本考案はICチツプ及び外部接続端子を具える
ICモジユールをカード本体に取り付けて成るIC
カードに関する。[Detailed description of the invention] [Technical field of the invention] The invention includes an IC chip and an external connection terminal.
IC consisting of an IC module attached to the card body
Regarding cards.

〔従来技術〕[Prior art]

従来、IC等を装着するプリント基板にはハー
ドプリント基板（HPC）と呼ばれる、所謂硬い
基板が使われてきた。そこで第２図に示される様
に、ICカードに取り付けられるICモジユール８
にもガラスエポキシ樹脂等の硬い基板７が使われ
ており、またICチツプ４とボンデイングワイヤ
５の接続を固定する為にエポキシ樹脂６でこれら
が封止され、これにより取り扱い上の折り曲げや
ねじりからICチツプを保護する。第３図で示す
ように、ICカードはこのICモジユール８をセン
ターコア層２に埋め込み、このコア層の両面に塩
化ビニールから成るオーバーシート層１を積層す
る形態をとつている。また、他のICカードの形
態としてICモジユール８をカード本体に設けら
れた穴に嵌め込む、所謂嵌め込み型ICカードも
知られている。 Conventionally, a so-called hard printed circuit board called a hard printed circuit board (HPC) has been used as a printed circuit board on which ICs and the like are mounted. Therefore, as shown in Figure 2, an IC module 8 attached to the IC card is installed.
A hard substrate 7 made of glass epoxy resin or the like is also used in this case, and in order to fix the connection between the IC chip 4 and bonding wires 5, they are sealed with epoxy resin 6, which prevents them from being bent or twisted during handling. Protect the IC chip. As shown in FIG. 3, the IC card has an IC module 8 embedded in a center core layer 2, and an oversheet layer 1 made of vinyl chloride laminated on both sides of the core layer. Furthermore, as another type of IC card, a so-called insert-type IC card in which the IC module 8 is inserted into a hole provided in the card body is also known.

〔考案が解決しようとする問題点〕[Problem that the invention attempts to solve]

しかし、ICカードに繰り返し、折り曲げやね
じり等の変形を加えると、第４図に示される様に
硬いICモジユール８の周縁部で、オーバーシー
ト層１である柔らかい塩化ビニールを損傷した
り、また嵌め込み型のICカードにおいても同様
の位置から、モジユールとカード本体の間で剥離
が生じてしまうことがある。 However, if the IC card is repeatedly deformed, such as by bending or twisting, it may damage the soft vinyl chloride that is the oversheet layer 1 at the periphery of the hard IC module 8, as shown in FIG. In other types of IC cards, peeling may occur between the module and the card body from a similar position.

〔考案の目的〕[Purpose of invention]

従つて、本考案の目的とするところはICカー
ドに、折り曲げ、ねじり等の変形を加えた場合で
もICモジユールがオーバーシート層に損傷を与
えたり、またICモジユールがカード本体から剥
離することのないICカードを提供することを目
的とする。 Therefore, the purpose of the present invention is to prevent the IC module from damaging the oversheet layer or peeling off from the card body even when the IC card is deformed by bending, twisting, etc. The purpose is to provide IC cards.

〔考案の概要〕[Summary of the idea]

本考案はICカードにおいて、ICモジユールの
プリント基板として、フレキシブルプリント基板
（以下はFPCと略する）に属する素材を用いて、
IC基板に柔軟性を持たせ、なおかつ硬い基板に
匹敵するICチツプ保護機能を有するように工夫
したものである。 This invention uses a material belonging to flexible printed circuit boards (hereinafter abbreviated as FPC) as the printed circuit board of the IC module in IC cards.
The IC board was devised to be flexible and yet have an IC chip protection function comparable to that of a rigid board.

〔考案の詳述〕[Details of the idea]

以下に本考案を詳細に説明する。 The present invention will be explained in detail below.

第１図イは本考案にかかるICカードの平面図
であり、同図ロはこのICカードのICモジユール
を含むＩ−Ｉ線における断面図である。第１図に
おけるICモジユールは従来技術で説明した第２
図に示すICモジユールと同様の構造であり、同
一部分については同一の番号が付されている。本
考案にれば、ICモジユールのプリント基板３は
FPCを用いる。 FIG. 1A is a plan view of an IC card according to the present invention, and FIG. The IC module in FIG.
It has the same structure as the IC module shown in the figure, and the same parts are numbered the same. According to the present invention, the printed circuit board 3 of the IC module is
Use FPC.

このFPCの素材としては、ポリイミドや変性
エポキシ樹脂を用いることが好ましい。 As the material for this FPC, it is preferable to use polyimide or modified epoxy resin.

これをISO（国際標準化機構）規格案に則つて、
折り曲げやねじり等の変形を加えたところ、オー
バーシート層に損傷を与えないことが確認され
た。 In accordance with the ISO (International Organization for Standardization) standard draft,
When deformations such as bending and twisting were applied, it was confirmed that the oversheet layer was not damaged.

また上記の如く、ICモジユールにFPCを使用
したために、折り曲げやねじり等の変性を直接受
けて、ICチツプが損傷する恐れがあり、これを
防止するため本考案によればICチツプは、外側
から塩化ビニール１、FPC３、封止樹脂６、そ
してICチツプ４の順で硬くなるように構成され
ており、この結果カードに折り曲げやねじりが生
じてもその影響を受けず、ICチツプを良好に保
護することが可能となる。 Furthermore, as mentioned above, since FPC is used for the IC module, there is a risk that the IC chip will be damaged due to direct deterioration such as bending or twisting.In order to prevent this, according to the present invention, the IC chip is The structure is such that the vinyl chloride 1, the FPC 3, the sealing resin 6, and the IC chip 4 become hard in this order, and as a result, even if the card is bent or twisted, it is not affected and the IC chip is well protected. It becomes possible to do so.

〔考案の効果〕 以上に述べたように本考案によれば、従来技術
と比較して下記の如くの効果を奏する。[Effects of the Invention] As described above, the present invention provides the following effects compared to the prior art.

即ち、ICモジユールのプリント基板をハード
プリント基板（HPC）からフレキシブルプリン
ト基板（FPC）としたことにより、折り曲げや
ねじり等の変性に対し、埋め込み型のICカード
においては、オーバーシート層１である塩化ビニ
ールを痛めず、また嵌め込み型のICカードにお
いてはカード本体からICモジユールが剥離する
こともなく、さらにICチツプの保護機能を損う
ことのないICカードを提供することができる。 In other words, by changing the printed circuit board of the IC module from a hard printed circuit board (HPC) to a flexible printed circuit board (FPC), it is possible to prevent deterioration such as bending or twisting by changing the printed circuit board of the IC module from a hard printed circuit board (HPC) to a flexible printed circuit board (FPC). It is possible to provide an IC card that does not damage the vinyl, does not cause the IC module to peel off from the card body in the case of a built-in IC card, and does not impair the protection function of the IC chip.

【図面の簡単な説明】[Brief explanation of drawings]

第１図イは本考案にかかるICカードの平面図、
同図ロは第１図イのICモジユールを含むＩ−Ｉ
線における断面図、第２図は従来のICモジユー
ルの説明図、第３図はICモジユールをICカード
のセンターコア層２に埋め込んだ断面図、第４図
は従来のICモジユールにより、折り曲げでオー
バーシート層１が破断したところを示す説明図で
ある。 ３……フレキシブルプリント基板（FPC）、４
……封止樹脂。 Figure 1A is a plan view of the IC card according to the present invention.
Figure B shows I-I, which includes the IC module in Figure 1A.
Figure 2 is an explanatory diagram of a conventional IC module. Figure 3 is a cross-sectional diagram of an IC module embedded in the center core layer 2 of an IC card. Figure 4 is a cross-sectional view of a conventional IC module that is folded over the center core layer 2 of an IC card. FIG. 3 is an explanatory diagram showing a place where the sheet layer 1 is broken. 3...Flexible printed circuit board (FPC), 4
...Sealing resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] カード本体にICモジユールを取り付けてなる
ICカードにおいて、前記ICモジユールはフレキ
シブルプリント基板上にICチツプを装着すると
ともに封止樹脂により封止されてなり、カード本
体、フレキシブルプリント基板、封止樹脂の順に
硬くなるように設定されてなることを特徴とする
ICカード。 An IC module is attached to the card body.
In the IC card, the IC module has an IC chip mounted on a flexible printed circuit board and is sealed with a sealing resin, and the card body, the flexible printed circuit board, and the sealing resin are set to become harder in this order. characterized by
IC card.
JP1986111536U 1986-07-21 1986-07-21 Expired - Lifetime JPH0524554Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986111536U JPH0524554Y2 (en) 1986-07-21 1986-07-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986111536U JPH0524554Y2 (en) 1986-07-21 1986-07-21

Publications (2)

Publication Number Publication Date
JPS6318277U JPS6318277U (en) 1988-02-06
JPH0524554Y2 true JPH0524554Y2 (en) 1993-06-22

Family

ID=30991545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986111536U Expired - Lifetime JPH0524554Y2 (en) 1986-07-21 1986-07-21

Country Status (1)

Country Link
JP (1) JPH0524554Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276044U (en) * 1985-11-01 1987-05-15
JPH0519243Y2 (en) * 1989-09-27 1993-05-20

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2920012C2 (en) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Identification card with IC component and method for producing such an identification card
DE3029667A1 (en) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München CARRIER ELEMENT FOR AN IC COMPONENT
JPS58118297A (en) * 1981-12-31 1983-07-14 共同印刷株式会社 Identification card manufacturing method
JPS58210646A (en) * 1982-06-02 1983-12-07 Kyodo Printing Co Ltd IC chip molded product
JPS60104960U (en) * 1983-12-19 1985-07-17 ソニー株式会社 memory card
JPS6163498A (en) * 1984-09-05 1986-04-01 株式会社東芝 IC card
JPH0324310Y2 (en) * 1984-09-12 1991-05-27

Also Published As

Publication number Publication date
JPS6318277U (en) 1988-02-06

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