JP3529420B2 - IC card - Google Patents
IC cardInfo
- Publication number
- JP3529420B2 JP3529420B2 JP05388094A JP5388094A JP3529420B2 JP 3529420 B2 JP3529420 B2 JP 3529420B2 JP 05388094 A JP05388094 A JP 05388094A JP 5388094 A JP5388094 A JP 5388094A JP 3529420 B2 JP3529420 B2 JP 3529420B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- circuit board
- printed circuit
- adhesive
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011241 protective layer Substances 0.000 claims description 19
- 230000003014 reinforcing effect Effects 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 8
- 241000255925 Diptera Species 0.000 claims 1
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、たとえば、キャシュカ
ードあるいはクレジットカードとして適用されるＩＣカ
ードに関する。BACKGROUND OF THE INVENTION The present invention relates to an IC card applied as a cash card or a credit card, for example.
Regarding the mode .
【０００２】[0002]
【従来の技術】ＩＣカ−ドはそのカ−ド基材の凹所にＩ
Ｃモジュ−ルを備えている。前記ＩＣモジュ−ルはプリ
ント基板を有し、このプリント基板の表面側には端子が
配設され、裏面側にはＩＣチップが取り付けられてい
る。前記ＩＣチップはモ−ルド樹脂により保護されてい
る。2. Description of the Related Art IC cards have an I-shaped recess in the card substrate.
Equipped with a C module. The IC module has a printed circuit board, terminals are arranged on the front surface side of the printed circuit board, and IC chips are mounted on the rear surface side. The IC chip is protected by a mold resin.
【０００３】ところで、ＩＣカ−ドはその使用時等にプ
リント基板の端子に外力を受けることがあるが、この場
合には、ＩＣチップを保護するモ−ルド樹脂に引っ張り
力が作用する。By the way, the IC card may be subjected to an external force on the terminals of the printed circuit board when it is used. In this case, a pulling force acts on the mold resin for protecting the IC chip.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記モ
−ルド樹脂は軟質材であるため、モ−ルド樹脂に引っ張
り力が作用すると、モ−ルド樹脂にクラックが生じ、Ｉ
Ｃチップが破壊されてしまう虞があった。However, since the mold resin is a soft material, when a tensile force acts on the mold resin, cracks are generated in the mold resin, and I
There was a risk that the C chip would be destroyed.
【０００５】なお、モ−ルド樹脂の弾性率は金属板の弾
性率の１０分の１程度であり、モジュ−ル全体でも、２
分の１から３分の１に圧力により、モ−ルド樹脂とＩＣ
チップにクラックが発生する。The modulus of elasticity of the molded resin is about 1/10 of the modulus of elasticity of the metal plate.
Mold resin and IC by pressure from 1/3 to 1/3
Cracks occur on the chip.
【０００６】そこで、本発明はプリント基板の端子が外
力を受けても、モ−ルド樹脂にクラックを生じさせるこ
となく、ＩＣチップの破壊を防止できるようにしたＩＣ
モジュ−ルおよびこのＩＣモジュ−ルを備えるＩＣカ−
ドを提供することを目的とする。Therefore, the present invention is designed to prevent the destruction of the IC chip without causing cracks in the molded resin even when the terminals of the printed circuit board receive an external force.
Module and IC card equipped with this IC module
The purpose is to provide the code.
【０００７】[0007]
【課題を解決するための手段】本発明は上記課題を解決
するため、プリント基板と、このプリント基板の一面側
に設けられた接触端子と、前記プリント基板の他面側に
設けられたＩＣチップと、このＩＣチップと前記プリン
ト基板とを接続する接続ワイヤと、この接続ワイヤおよ
び前記１Ｃチップを被覆する軟質の保護層と、この保護
層に設けられ該保護層を補強する補強部材とからなるＩ
Ｃモジュールと、このＩＣモジュールを収納する凹所を
有する樹脂製のカード基材と、前記保護層に補強部材を
接着する第１の接着剤と、前記１Ｃモジュールのプリン
ト基板をカード基材に接着する第２の接着剤とを具備
し、前記第１の接着剤の弾性率を前記第２の接着剤の弾
性率より大とする。In order to solve the above problems, the present invention solves the above problems by providing a printed circuit board, contact terminals provided on one side of the printed circuit board, and an IC chip provided on the other side of the printed circuit board. from the a connecting wire connecting this IC chip and the printed circuit board, and the protective layer of the soft covering the connecting wires and the 1C chip, a reinforcing member for reinforcing the vignetting setting the protective layer on the protective layer Naru I
C module and the recess that stores this IC module
A resin card base material and a reinforcing member on the protective layer.
A first adhesive to be adhered and the 1C module pudding
A second adhesive for adhering the substrate to the card substrate
The elastic modulus of the first adhesive to the elasticity of the second adhesive.
Greater than sex rate .
【０００８】第２の発明はプリント基板と、このプリン
ト基板の一面側に設けられた接触端子と、前記プリント
基板の他面側に設けられたＩＣチップと、このＩＣチッ
プと前記プリント基板とを接続する接続ワイヤと、この
接続ワイヤおよび前記ＩＣチップを被覆する軟質の保護
層と、この保護層に設けられ該保護層を補強する補強部
材とからなるＩＣモジュ−ルと、このＩＣモジュ−ルを
収納する凹所を有する樹脂製のカ−ド基材と、前記保護
層に補強部材を接着する第１の接着剤と、前記ＩＣモジ
ュ−ルのプリント基板をカ−ド基材に接着する第２の接
着剤と、を具備し、前記第１の接着剤の弾性率を前記第
２の接着剤の弾性率より大とした。According to a second aspect of the present invention, there is provided a printed circuit board, a contact terminal provided on one surface side of the printed circuit board, an IC chip provided on the other surface side of the printed circuit board, and the IC chip and the printed circuit board. An IC module comprising a connecting wire for connection, a soft protective layer covering the connecting wire and the IC chip, and a reinforcing member provided on the protective layer to reinforce the protective layer, and the IC module A resin-made card base material having a recess for accommodating therein, a first adhesive for adhering a reinforcing member to the protective layer, and a printed circuit board of the IC module adhered to the card base material. A second adhesive, and the elastic modulus of the first adhesive is set to be higher than the elastic modulus of the second adhesive.
【０００９】[0009]
【作用】第１の発明はＩＣチップを被覆する保護層に補
強部材を設け、保護層に作用する引張力を前記補強部材
で受けることにより、保護層におけるラックの発生を防
止する。According to the first aspect of the present invention, a reinforcing member is provided on the protective layer that covers the IC chip, and the tensile force acting on the protective layer is received by the reinforcing member, thereby preventing the occurrence of a rack on the protective layer.
【００１０】第２の発明は保護層に補強部材を接着する
第１の接着剤の弾性率を、前記ＩＣモジュ−ルのプリン
ト基板をカ−ド基材に接着する第２の接着剤の弾性率よ
り大とすることにより、ＩＣカ−ドに曲力が加わった場
合、その変形をプリント基板の外周接着部で吸収しＩＣ
チップに加わる力を低減させる。According to a second aspect of the present invention, the elastic modulus of the first adhesive for adhering the reinforcing member to the protective layer is the elastic modulus of the second adhesive for adhering the printed circuit board of the IC module to the card substrate. When the bending force is applied to the IC card, the deformation is absorbed by the outer peripheral adhesive portion of the printed circuit board so that the IC card is bent.
Reduces the force applied to the tip.
【００１１】[0011]
【実施例】以下、本発明を図１および図２に示す一実施
例を参照して説明する。図１はＩＣカ−ドを示すもの
で、図中１ＡはＩＣモジュ−ルである。このＩＣモジュ
−ル１Ａはカ−ド基材８に設けられた凹所８ａ内に収納
されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to an embodiment shown in FIGS. FIG. 1 shows an IC card, in which 1A is an IC module. The IC module 1A is housed in a recess 8a provided in the card base 8.
【００１２】上記ＩＣモジュ−ル１ＡはＩＣチップ１を
有し、このＩＣチップ１はプリント基板３の裏面側に取
り付けられ、上記ＩＣチップ１とプリント基板３とは接
続ワイヤとしての金ワイヤ１３を介して接続されて保護
層としてのモ−ルド樹脂２により覆われている。上記プ
リント基板３の表面側には配線パタ−ン４が設けられて
おり、この配線パタ−ン４は外部リ−ダライタとの接触
端子になっている。The IC module 1A has an IC chip 1, which is attached to the back side of the printed circuit board 3. The IC chip 1 and the printed circuit board 3 have a gold wire 13 as a connecting wire. It is connected through and is covered with the mold resin 2 as a protective layer. A wiring pattern 4 is provided on the front surface side of the printed circuit board 3, and the wiring pattern 4 serves as a contact terminal with an external reader / writer.
【００１３】上記モ−ルド樹脂２の下面部には第１の接
着剤６により補強部材としての金属板５が接着されてい
る。上記プリント基板３の外周部は第２の接着剤７を介
してカ−ド基材８に接着固定されている。上記第１の接
着剤６の弾性率は第２の接着剤７の弾性率より大きくさ
れている。また、上記金属板５はカ−ド基材８の凹所８
ａの底部から離間されている。A metal plate 5 as a reinforcing member is adhered to the lower surface of the mold resin 2 with a first adhesive 6. The outer peripheral portion of the printed circuit board 3 is adhesively fixed to the card base material 8 via the second adhesive 7. The elastic modulus of the first adhesive 6 is set to be higher than that of the second adhesive 7. In addition, the metal plate 5 is formed in the recess 8 of the card substrate 8.
It is separated from the bottom of a.
【００１４】しかして、図２に示すように、ＩＣカ−ド
に対しその配線パタ−ン４側から圧力が作用すると、Ｉ
Ｃモジュ−ル１Ａの中央部に圧力が加わり、反対面側に
引張力が生じる。しかし、モ−ルド樹脂２の下面部には
上記したように金属板５が設けられているため、金属板
５により引張力が受け止められモ−ルド樹脂２、および
ＩＣチップ１に直接、加わらない。これにより、モ−ル
ド樹脂２、およびＩＣチップ１におけるクラックの発生
が防止されることになる。However, as shown in FIG. 2, when pressure acts on the IC card from the side of the wiring pattern 4, I
Pressure is applied to the central portion of the C module 1A, and tensile force is generated on the opposite surface side. However, since the metal plate 5 is provided on the lower surface of the mold resin 2 as described above, the tensile force is received by the metal plate 5 and is not directly applied to the mold resin 2 and the IC chip 1. . This prevents the mold resin 2 and the IC chip 1 from being cracked.
【００１５】また、上記第１の接着剤６の弾性率を第２
の接着剤７の弾性率より大きくするため、ＩＣカ−ドに
曲げ力が加わった場合、その変形をプリント基板３の外
周接着部１０で吸収することができ、ＩＣチップ１に加
わる力を低減させることができる。The elastic modulus of the first adhesive 6 is set to the second
When the bending force is applied to the IC card, the deformation can be absorbed by the outer peripheral bonding portion 10 of the printed circuit board 3 to reduce the force applied to the IC chip 1. Can be made.
【００１６】また、上記金属板５はカ−ド基材８の凹所
８ａの底面部から離間されているため、ＩＣカ−ドの曲
力がＩＣチップ１に伝わることもない。なお、本発明は
上記一実施例に限られるものではなく、図３〜図５に示
すようなものであっても良い。Further, since the metal plate 5 is separated from the bottom of the recess 8a of the card base 8, the bending force of the IC card is not transmitted to the IC chip 1. The present invention is not limited to the above-mentioned one embodiment, and may be as shown in FIGS.
【００１７】また、上記一実施例と同一部分について
は、同一番号を付してその説明を省略する。図中１１
は、モ−ルド樹脂２の下面部に接着剤６を介して接着さ
れた金属板で、この金属板１１には、複数個の開口部１
２…が穿設されている。前記開口部１２…内にはモ−ル
ド樹脂２および金ワイヤ１３の一部が挿入され、この挿
入によりＩＣモジュ−ル１全体の厚さ寸法を減じること
ができ、薄形化が図られている。Further, the same parts as those in the above-mentioned embodiment are designated by the same reference numerals, and the description thereof will be omitted. 11 in the figure
Is a metal plate adhered to the lower surface of the mold resin 2 with an adhesive 6, and the metal plate 11 has a plurality of openings 1
2 ... is drilled. A part of the mold resin 2 and the gold wire 13 is inserted into the openings 12, ... By this insertion, the thickness of the entire IC module 1 can be reduced, and the thickness can be reduced. There is.
【００１８】また、上記金属板１１の外形寸法はモ−ル
ド樹脂２の外形の寸法よりわずかに大きくされ、上記金
属板１１の外周部はモ−ルド樹脂２の外周部から突出さ
れている。これにより、モ−ルド樹脂２の下面部に金属
板１１を接着する際に、第１の接着剤６が金属板１１か
ら流れ落ちるを防止できるとともに、金属板１１の外周
には、ほとんど力が作用しないため、金属板１１の外周
の剥がれを防止できるようになっている。The outer dimension of the metal plate 11 is slightly larger than the outer dimension of the mold resin 2, and the outer peripheral portion of the metal plate 11 projects from the outer peripheral portion of the mold resin 2. As a result, when the metal plate 11 is bonded to the lower surface of the mold resin 2, the first adhesive 6 can be prevented from flowing down from the metal plate 11, and almost no force acts on the outer periphery of the metal plate 11. Therefore, peeling off of the outer periphery of the metal plate 11 can be prevented.
【００１９】[0019]
【発明の効果】以上説明したように、第１の発明によれ
ば、軟質の保護層に補強部材を設けたから、ＩＣモジュ
−ルが外部から圧力を受けた際に、ＩＣチップに加わる
応力を前記補強部材により受け止めることができ、ＩＣ
チップの破壊を確実に防止することができる。As described above, according to the first aspect of the present invention, since the reinforcing member is provided on the soft protective layer, the stress applied to the IC chip when the IC module receives a pressure from the outside is applied. IC can be received by the reinforcing member
It is possible to reliably prevent damage to the chip.
【００２０】また、第２の発明によれば、ＩＣカ−ドに
曲げ応力が加わった場合にはその変形をプリント基板の
外周接着部で吸収することができ、ＩＣチップに加わる
力を減じてＩＣチップの破壊を確実に防止することがで
きる。Further, according to the second aspect of the present invention, when bending stress is applied to the IC card, the deformation can be absorbed by the outer peripheral adhesive portion of the printed circuit board, and the force applied to the IC chip is reduced. It is possible to reliably prevent the destruction of the IC chip.
【図１】本発明の一実施例であるＩＣカ−ドの一部を示
す断面図。FIG. 1 is a sectional view showing a part of an IC card according to an embodiment of the present invention.
【図２】図１のＩＣカ−ドに外力が作用した状態を示す
説明図。2 is an explanatory view showing a state where an external force acts on the IC card of FIG. 1. FIG.
【図３】本発明の他の実施例であるＩＣカ−ドを示す平
面図。FIG. 3 is a plan view showing an IC card according to another embodiment of the present invention.
【図４】図３中Ａ−Ａ線に沿って示す断面図。FIG. 4 is a sectional view taken along the line AA in FIG.
【図５】図４中Ｂ部を拡大して示す断面図。5 is a cross-sectional view showing an enlarged part B in FIG.
１…ＩＣチップ、２…モ−ルド樹脂（保護層）、３…プ
リント基板、４…配線パタ−ン（接触端子）、５，１１
…補強部材（金属板）。1 ... IC chip, 2 ... Mold resin (protective layer), 3 ... Printed circuit board, 4 ... Wiring pattern (contact terminal), 5, 11
... Reinforcing member (metal plate).
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−9691（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) G06K 19/00 - 19/18 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-2-9691 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) G06K 19/00-19/18
Claims (2)
イヤと、 この接続ワイヤおよび前記１Ｃチップを被覆する軟質の
保護層と、 この保護層に設けられ該保護層を補強する補強部材とか
らなるＩＣモジュールと、 このＩＣモジュールを収納する凹所を有する樹脂製のカ
ード基材と、 前記保護層に補強部材を接着する第１の接着剤と、 前記１Ｃモジュールのプリント基板をカード基材に接着
する第２の接着剤とを具備し、 前記第１の接着剤の弾性率を前記第２の接着剤の弾性率
より大とした ことを特徴とするＩＣカード。1. A printed circuit board, a contact terminal provided on one surface side of the printed circuit board, an IC chip provided on the other surface side of the printed circuit board, and a connection for connecting the IC chip and the printed circuit board. or wire and a protective layer of a soft covering the connecting wires and the 1C chip, a reinforcing member for reinforcing the protective layer kicked set in the protective layer
And Ranaru IC module, mosquito resin having a recess for accommodating the IC module
A card substrate , a first adhesive for bonding a reinforcing member to the protective layer, and a printed circuit board of the 1C module bonded to a card substrate
A second adhesive for controlling the elastic modulus of the first adhesive to the elastic modulus of the second adhesive.
An IC card characterized by a larger size .
から離間させたことを特徴とする請求項１記載のＩＣカ
ード。2. The reinforcing member is a bottom surface of a recess of a card substrate.
2. The IC card according to claim 1, wherein the IC card is separated from the IC card.
Mode .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05388094A JP3529420B2 (en) | 1994-03-24 | 1994-03-24 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05388094A JP3529420B2 (en) | 1994-03-24 | 1994-03-24 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07262334A JPH07262334A (en) | 1995-10-13 |
| JP3529420B2 true JP3529420B2 (en) | 2004-05-24 |
Family
ID=12955067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05388094A Expired - Lifetime JP3529420B2 (en) | 1994-03-24 | 1994-03-24 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3529420B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19618101A1 (en) * | 1996-05-06 | 1997-11-13 | Siemens Ag | Carrier element with at least one integrated circuit and method for producing such a carrier element |
-
1994
- 1994-03-24 JP JP05388094A patent/JP3529420B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07262334A (en) | 1995-10-13 |
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