JPS63214492A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPS63214492A JPS63214492A JP62047613A JP4761387A JPS63214492A JP S63214492 A JPS63214492 A JP S63214492A JP 62047613 A JP62047613 A JP 62047613A JP 4761387 A JP4761387 A JP 4761387A JP S63214492 A JPS63214492 A JP S63214492A
- Authority
- JP
- Japan
- Prior art keywords
- card
- module
- circuit board
- base material
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 13
- 239000004033 plastic Substances 0.000 claims description 11
- 229920003023 plastic Polymers 0.000 claims description 11
- 238000005452 bending Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プラスチック製のカードの内部にＩＣを実装
した回路基板に樹脂封止して成るＩＣモジュールを有す
るＩＣカードの構造の改良に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an improvement in the structure of an IC card having an IC module formed by resin-sealing a circuit board in which an IC is mounted inside a plastic card. It is.
近年、プラスチック製のカードの内部にＩＣを実装し外
部との接続コンタクトを有するＩＣカードの多目的利用
が各方面で検討されている。In recent years, the multipurpose use of IC cards, which have an IC mounted inside a plastic card and have external connection contacts, has been studied in various fields.
これに伴ってＩＣカードの信頼性に関する要求も非常に
高まっている。その中でもＩＣカードの曲げやねじりに
対する強度はＩＣカードの構造に依るものが多く、耐曲
げ性、耐ねじり性の勝れたＩＣカードの構造の開発が重
要視されている。Along with this, demands regarding the reliability of IC cards have also increased significantly. Among these, the strength against bending and twisting of an IC card largely depends on the structure of the IC card, and importance is placed on developing an IC card structure with excellent bending and torsion resistance.
従来のＩＣカードの構造ゆ２つのタイプに集約されてい
るがどちらのタイプも回路基板にＩＣを実装し樹脂封止
して成るＩＣモジュールを作成し該ＩＣモジエールをプ
ラスチック製のカードに挿入するという基本的な考え方
は同じである。The structure of conventional IC cards is divided into two types.In both types, an IC module is created by mounting an IC on a circuit board and sealing it with resin, and then inserting the IC module into a plastic card. The basic idea is the same.
以下、第３図および第４図により従来のＩＣカードの構
造を説明する。The structure of a conventional IC card will be explained below with reference to FIGS. 3 and 4.
第３図は前記ＩＣモジエールをプラスチック製のカード
の中に内蔵するタイプのＩＣカードの要部断面図である
。ＩＣモジエール１と同等な大きさの穴を明けたカード
基材２に該ＩＣモジエール１を埋め込み、接触電極６の
外部露出部分を除いたＩＣＣモジ−ル１およびカード基
材の表裏両面にプラスチック製のオーバーンート４を熱
圧着等によりラミネー）ｔ、ＩＣカードとしていた。FIG. 3 is a sectional view of a main part of an IC card of the type in which the IC module is built into a plastic card. The IC module 1 is embedded in a card base material 2 with a hole of the same size as the IC module 1, and the ICC module 1 excluding the externally exposed portion of the contact electrode 6 and both the front and back of the card base material are made of plastic. The overrun route 4 was laminated by thermocompression bonding, etc., and was made into an IC card.
第４図は前記ＩＣモジュール１をプラスチック製のカー
ドの表面にセットするタイプのＩＣカードの要部断面図
である。両面にプラスチック製のオーバーシート４をラ
ミネートしたカード基材２に該ＩＣモジュール１より若
干大きな穴を明け、紋穴にＩＣモジュール１を接着剤に
て接着しＩＣカードとしていた。′
第３図および第４図に示したいずれの場合においても定
められた接触電極乙の領域内で可能な限りＩＣモジュー
ル１を小型化しようと努めており必然的に回路基板５も
小型化の方向に進んでいた。FIG. 4 is a sectional view of a main part of an IC card of the type in which the IC module 1 is set on the surface of a plastic card. A hole slightly larger than the IC module 1 was made in a card base material 2 with plastic oversheets 4 laminated on both sides, and the IC module 1 was adhered to the hole with an adhesive to form an IC card. ' In both cases shown in FIGS. 3 and 4, efforts are being made to make the IC module 1 as small as possible within the area of the contact electrode B, and the circuit board 5 is also inevitably made smaller. was moving in the direction.
第３図に示す従来のＩＣモジュール１をプラスチック裂
のカードの中に内蔵するタイプおよび第４図に示すＩＣ
モジュール１をプラスチック製のカードの表面にセット
するタイプのＩＣカードにおいては、ＩＣモジュール１
がＩＣカードの中心線Ａ付近に位置するため曲げ、ねじ
り等の機械的衝撃に対してＩＣあるいはワイヤーポンデ
ィング等の配線を保護する目的で硬化後の硬度が高い封
止樹脂を使用している。The conventional IC module 1 shown in Fig. 3 is built into a plastic card, and the IC shown in Fig. 4
In the case of an IC card in which module 1 is set on the surface of a plastic card, IC module 1
Since the IC card is located near the center line A of the IC card, a sealing resin with high hardness after curing is used to protect the IC or wiring such as wire bonding from mechanical shocks such as bending and twisting. .
このためＩＣモジュール１のカードからの剥離あるいは
カード基材２、オーバーシート４、接着剤の割れ等の損
傷が発生し実用上問題であった。This caused problems in practice, such as peeling of the IC module 1 from the card or damage such as cracking of the card base material 2, oversheet 4, and adhesive.
本発明の目的は、以上のような問題点を解消させ曲げ、
ねじり等の機械的衝撃に対して高い信頼性を有するＩＣ
カードを提供することにある。The purpose of the present invention is to solve the above-mentioned problems and to bend the
IC with high reliability against mechanical shocks such as torsion
The purpose is to provide cards.
上記目的を達成するための本発明の要旨は、プラスチッ
ク製のカードの内部にＩＣを実装した回路基板に樹脂封
止して成るＩＣモジュールを有するＩＣカードにおいて
、該回路基板の端辺に集中する局部応力を分散しＩＣカ
ードの破損をさけるべ（回路基板の面積をＩＣ樹脂封止
部より太き（し、また回路基板の端辺を中央付近から離
れた位置に設定することにある。The gist of the present invention to achieve the above object is to provide an IC card having an IC module formed by resin-sealing a circuit board in which an IC is mounted inside a plastic card. To disperse local stress and avoid damage to the IC card, the area of the circuit board must be larger than the IC resin sealing part, and the edges of the circuit board must be set away from the center.
すなわち本発明におけるＩＣカードの構造は、回路基板
の端辺をカードの中心近辺から逃がすべく回路基板の面
積を広（することにより曲げ、ねじり等の機械的衝撃に
対してＩＣモジュールの剥離あるいはカード基材、オー
バーシート等の損傷が無い信頼性に優れたＩＣカードを
得ることができるＯ
〔実施例〕
以下図面により本発明の実施例を詳述する。In other words, the structure of the IC card in the present invention is such that the area of the circuit board is widened so that the edge of the circuit board escapes from the vicinity of the center of the card (by doing so, the IC module is prevented from peeling off or the card is protected against mechanical shocks such as bending and twisting). A highly reliable IC card without damage to the base material, oversheet, etc. can be obtained. [Examples] Examples of the present invention will be described in detail below with reference to the drawings.
第１実施例
第１図は本発明の第１実施例を示すＩＣカードの断面図
である。導体をプリントしたガラスエポキン積層板、ポ
リイミドフィルム、ポリエステルフィルム等から成る極
薄の回路基板５ａに金線あるいはアルミ線等を用いたサ
イヤーボンディング方式あるいはテープキャリア方式に
より１個あるいは２個以上のＩＣを実装し、さらにエポ
キシ樹脂等の封止樹脂を使用しボッティング法あるいは
トランスファーモールド法によりＩＣを封止したＩＣモ
ジ−−ル１を該ＩＣモジュール１の樹脂封止部分と同等
の大きさの穴を明けた塩化ビニル等からなるカード基材
２とを接着剤により接着し、外部との電気的接触を行う
ための接触電極６の一部を除＜ＩＣモジュール１および
カード基材２の表裏両面に樹脂からなるオーバーシート
４を熱圧着等によりラミネートをしてＩＣカードを形成
する。First Embodiment FIG. 1 is a sectional view of an IC card showing a first embodiment of the present invention. One or more ICs are mounted on an ultra-thin circuit board 5a made of a glass Epoquine laminate with printed conductors, polyimide film, polyester film, etc., using the syer bonding method or tape carrier method using gold wire, aluminum wire, etc. Then, an IC module 1 in which an IC is sealed using a sealing resin such as an epoxy resin by a botting method or a transfer molding method is inserted into a hole of the same size as the resin-sealed part of the IC module 1. The IC module 1 and the card base material 2 made of vinyl chloride or the like are bonded together with an adhesive, and a part of the contact electrode 6 for making electrical contact with the outside is removed. An oversheet 4 made of resin is laminated by thermocompression bonding or the like to form an IC card.
本実施例では回路基板５ａの大きさはＩＣカードと同等
の大きさにしである。In this embodiment, the size of the circuit board 5a is the same as that of an IC card.
第２実施例
第２図は本発明の第２実施例を示すＩＣカードの断面図
である。第１実施例と同一番号の構成要素には同一名称
を付して説明を省略する。第２実施例ではカード基材２
に極薄の回路基板５ｂを埋め込めるように該カード基材
２に段引き加工を施し接着剤にて該カード基材２と回路
基板５ｂを接着し第１実施例と同様にオーバーシート４
をラミネートしＩＣカードを形成する。Second Embodiment FIG. 2 is a sectional view of an IC card showing a second embodiment of the present invention. Components having the same numbers as those in the first embodiment are given the same names and their explanations will be omitted. In the second embodiment, the card base material 2
The card base material 2 is stepped so that an ultra-thin circuit board 5b can be embedded in the card base material 2, and the card base material 2 and the circuit board 5b are bonded together with an adhesive, and an oversheet 4 is formed in the same manner as in the first embodiment.
are laminated to form an IC card.
本実施例における極薄の前記回路基板５ｂの大きさは該
回路基板５ｂの端部がＩＣカードの中央線Ａ付近より５
１１以上離れていれば曲げ、ねじり等の機械的衝撃に対
してＩＣカードあるいはＩＣモジエールが支障を受けな
いという実験結果が出ているため、その程度であれば良
い。The size of the ultra-thin circuit board 5b in this embodiment is such that the edge of the circuit board 5b is approximately 5.5 cm from the center line A of the IC card.
Experiments have shown that if the distance is 11 or more, the IC card or IC module will not be affected by mechanical shocks such as bending or twisting, so it is sufficient that the distance is 11 or more.
以上の説明で明らかなように、本発明によればＩＣカー
ドにおいてＩＣを実装する極薄の回路基板を、該ＩＣカ
ードに曲げ、ねじりを加えた時に最も応力がかかるＩＣ
カードの中心近辺迄延長して設けるとともに、ＩＣモジ
ニールをＩＣカードの中心部から避けてＩＣカードに埋
め込むことによりＩＣモジュール、回路基板にかかる応
力が分散され前記ＩＣモジュール、回路基板の剥離ある
いはオーバーシート、カード基材、接着剤の損傷を防止
することができＩＣカードの曲げ、ねじり等の機械的衝
撃に対する信頼性を高める効果がある。As is clear from the above explanation, according to the present invention, when an ultra-thin circuit board on which an IC is mounted in an IC card is bent and twisted, the IC is subjected to the highest stress.
By extending the IC module to the vicinity of the center of the card and embedding it in the IC card avoiding the center of the IC card, the stress applied to the IC module and circuit board is dispersed, and the IC module and circuit board can be peeled off or oversheeted. This has the effect of preventing damage to the card base material and adhesive, and increasing the reliability of the IC card against mechanical impacts such as bending and twisting.
第１図は本発明の第１実施例を示すＩＣカードの断面図
、第２図は本発明の第２実施例を示すＩＣカードの断面
図、第３図および第４図は従来のＩＣカードの断面図で
ある。
１・・・・・・ＩＣモジュール、
２・・・・・・カード基材、
６・・・・・・接触電極、
４・・・・・・オーバーシート、
５．５ａ、５ｂ・・・・・・回路基板。
第１図
第２図
第３図
第４図Fig. 1 is a sectional view of an IC card showing a first embodiment of the present invention, Fig. 2 is a sectional view of an IC card showing a second embodiment of the invention, and Figs. 3 and 4 are conventional IC cards. FIG. 1...IC module, 2...card base material, 6...contact electrode, 4...oversheet, 5.5a, 5b... ...Circuit board. Figure 1 Figure 2 Figure 3 Figure 4
Claims (1)
路基板を有するＩＣカードにおいて、該回路基板の面積
をＩＣ樹脂封止部より大きく形成し少なくともＩＣカー
ドの中心付近においては該回路基板が直接カード基材に
接着されていることを特徴とするＩＣカード。In an IC card having a circuit board in which an IC is resin-sealed inside a plastic card, the area of the circuit board is formed larger than the IC resin-sealed part, and the circuit board is directly connected to the card at least near the center of the IC card. An IC card characterized by being adhered to a base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62047613A JPS63214492A (en) | 1987-03-04 | 1987-03-04 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62047613A JPS63214492A (en) | 1987-03-04 | 1987-03-04 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63214492A true JPS63214492A (en) | 1988-09-07 |
Family
ID=12780074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62047613A Pending JPS63214492A (en) | 1987-03-04 | 1987-03-04 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63214492A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009064145A (en) * | 2007-09-05 | 2009-03-26 | Mitsubishi Electric Corp | Rfid tag |
| US8672230B2 (en) | 2007-09-04 | 2014-03-18 | Mitsubishi Electric Corporation | RFID tag |
-
1987
- 1987-03-04 JP JP62047613A patent/JPS63214492A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8672230B2 (en) | 2007-09-04 | 2014-03-18 | Mitsubishi Electric Corporation | RFID tag |
| JP2009064145A (en) * | 2007-09-05 | 2009-03-26 | Mitsubishi Electric Corp | Rfid tag |
| JP4715823B2 (en) * | 2007-09-05 | 2011-07-06 | 三菱電機株式会社 | RFID tag |
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