JP2009064145A - Rfid tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a new RFID tag capable to be placed on a flat or curved installation surface, irrespective of a conductive or non-conductive substance, without reducing communication distance and hardly having a risk of causing damage to an IC chip on the surface of the RFID tag. <P>SOLUTION: An RFID tag capable to be placed on a curved surface with a given curvature is characterized by comprising: a dielectric substrate having a hole in the central portion of one major surface and being hard enough to be bent to at least the prescribed curvature; a ground conductor pattern formed on the other major surface of the dielectric substrate; a conductor pattern formed on the dielectric substrate at a prescribed distance from the edges of the dielectric substrate and inside them; and an IC chip inserted in the hole of the dielectric substrate and electrically connected to the conductor pattern through a long narrow slot which is formed inside the conductor pattern. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an RFID (Radio Frequency Identification) tag. The RFID tag receives a command signal transmitted from a reader / writer, updates tag information stored in a memory according to information of the command signal, and additionally writes the tag information. Alternatively, the tag information is transmitted as a read signal to the RFID reader / writer, and is used for living / article entry / exit management, logistics management, and the like.

  The RFID system performs wireless communication between an RFID tag having an IC chip and an RFID reader / writer. RFID tags include a so-called active type tag that is mounted with a battery and driven by the electric power, and a so-called passive type tag that receives electric power from a reader / writer and drives it as a power source. The active tag has a battery compared to the passive type, so it has advantages in terms of communication distance and communication stability, but has a complicated structure and disadvantages such as an increase in size and cost. There is also. And with recent improvements in semiconductor technology, IC chips have become smaller and higher performance for passive tags, and the use of passive tags in a wide range of fields has been expanded by extending communication distance and improving communication stability. This is an expected situation.

  In the passive induction tag, in the electromagnetic induction method applied to the RFID tag of the long wave band and the short wave band, a voltage is applied to the RFID tag by the electromagnetic induction action between the transmission antenna coil of the reader / writer and the antenna coil of the RFID tag. The IC chip is activated by this voltage to enable communication. Therefore, the RFID tag operates only within the induction electromagnetic field by the RFID reader / writer, and the communication distance becomes about several tens of centimeters. In addition, in radio frequency RFID tags such as UHF band and microwave band, the radio wave communication method is applied, and power is supplied to the IC chip of the RFID tag by radio waves, so the communication distance is about 1 to 8 m. And has improved significantly. Accordingly, RFID tags in high frequency bands such as UHF band and microwave band are collectively read and moved by a plurality of RFID tags that are difficult to realize in long wave band and short wave band RFID systems with short communication distances. RFID tags can be read, and the range of use is expected to expand significantly in the future. Then, as a passive tag of high frequency, such as a UHF band or a microwave band, there existed what was described in patent documents 1-5, for example.

  Regarding a conventional RFID tag, FIG. 3 of Patent Document 1 includes a half-wavelength microstrip line resonator 13, a dielectric substrate 14, and a ground conductor plate 15. By connecting the IC chip to the ground conductor plate 15, even if there is a metal object (conductor) on the ground conductor plate 15 side, the metal object (conductor) is hardly affected by the radiation characteristics of the antenna. An RFID tag that can be installed and pasted is disclosed. As for the details of the IC chip, FIG. 17 of Patent Document 1 shows that the dielectric material on the ground conductor side on the back surface of the ground line 104 where the IC 106 is connected to the central portion of the antenna conductor 100 by a technique such as wire bonding. In FIG. 18 to FIG. 21, similarly, the IC 121 is disposed so as to be buried in the dielectric material on the ground conductor side. As disclosed in paragraph No. 0028 of Patent Document 1, any bonding wire 122, 12, 2 can be used as long as the grounding surface can be formed on the side opposite to the surface on which the connection pad of IC 121 is formed. There is a description that one bonding wire 122 is unnecessary.

  In FIG. 1 of Patent Document 2, a terminal portion 3 formed on the surface of the substrate 1 and an IC chip disposed in an IC chip placement region 9 formed on a part of the substrate 1 and connected to the terminal portion 3 are shown. An RFID tag with a chip 6 is disclosed. For this purpose, it is not necessary to embed the IC chip 6 in the base material 1 and it can be mounted on the upper surface of the antenna. Therefore, an RFID tag having a simple structure can be manufactured by simply processing the surface of the base material 1, thereby reducing yield. It has been disclosed that manufacturing costs can be reduced.

  FIG. 19 of Patent Document 3 shows an RFID tag 5 having a dielectric member 10, an IC chip recess 10b, a film base 20, an antenna pattern 30, and an IC chip 40, and the dielectric member 10 has an IC chip. IC chip recess 10b in which IC chip 40 can be embedded is provided, IC chip 40 is embedded in this IC chip recess 10b, and antenna pattern 30 formed on the inner surface side of film substrate 20 is electrically connected to IC chip 40. As described above, there is disclosed a loop antenna in which a film substrate 20 is wound around a dielectric member 10 and configured by an antenna pattern 30 to suppress a decrease in communication distance even in the vicinity of a radio wave absorber.

  In FIG. 4 of Patent Document 4, an opening 31 for exposing a part of the dielectric 20 is formed on the antenna surface 30, and the opening includes a pair of first slits 31 a extending in parallel so as to face each other, and the pair. There is disclosed an RFID tag that includes a slit 31a and a second slit 31b that communicates with the pair of slits 31a, and the second slit 31b is positioned at an intermediate portion of the pair of first slits 31a. In the transmission / reception element (IC chip), the first and second feeding points are connected to 41 and 42.

  FIG. 1 and FIG. 2 of Patent Document 5 disclose an RFID tag in which an IC chip 13 is mounted on a slot antenna 10 formed by providing a slot 12 in the central longitudinal direction of a rectangular conductor plate 11. Yes.

Japanese Patent Laid-Open No. 2000-332523 (FIGS. 3, 17 to 21)

JP 2002-197434 (FIG. 1)

Japanese Patent Laying-Open No. 2006-53833 (FIG. 19)

Japanese Patent Laying-Open No. 2006-237664 (FIG. 4)

JP 2002-358494 A (FIGS. 1 and 2)

  However, although the RFID tag described in Patent Document 1 can be installed on a metal object (conductor), an IC chip is connected between the half-wavelength microstrip line resonator and the ground conductor plate. Because of the configuration, it is necessary to embed an IC chip inside the dielectric substrate. For this reason, there exists a subject that a structure is complicated and manufacture becomes difficult.

  The RFID tag described in Patent Document 2 is thicker than the antenna pattern and the conductor thickness of the terminal portion, and the IC chip is mounted on the surface of the base material even if the IC chip is downsized. As a result, a protrusion is formed on the surface of the RFID tag. Therefore, as described in Paragraph No. 0023 of Patent Document 2, it is necessary to cover and protect the entire mounting portion or a part of the IC chip to flatten the surface of the RFID tag. That is, when an antenna pattern and an IC chip are mounted on a substrate, the IC chip may be damaged due to an impact or the like, and it becomes difficult to directly print on the surface (upper surface) of the RFID tag using a label printer. There is a problem. Further, when a film on which an antenna pattern and an IC chip are mounted is bonded to a base material, the film bulges (protrusions) due to the IC chip is generated, so that there is still the above-described problem.

  The RFID tag described in Patent Document 3 is attached to or near a conductive object (conductor) such as a metal object, although the film (film base) bulges (projections) of the IC chip hardly occur. In such a case, there is a problem that the loop antenna does not operate due to the influence of the conductive object or the communication distance is extremely reduced.

  The RFID tag described in Patent Document 4 can be installed on a metal object (conductor) in the same manner as the RFID tag described in Patent Document 1. However, since the IC chip is provided outside the dielectric 20, even if the IC chip is miniaturized, the thickness of the IC chip is thicker than the antenna pattern and the conductor thickness of the terminal portion, and the IC chip is Since it is mounted on the surface of the substrate, a protrusion is formed on the surface of the RFID tag. For this reason, like the RFID tag described in Patent Document 2, there is a possibility that the IC chip may be damaged by impact or the like, and it is difficult to directly print on the surface (upper surface) of the RFID tag using a label printer. There is. Further, when a film on which an antenna pattern and an IC chip are mounted is bonded to a base material, the film bulges (protrusions) due to the IC chip is generated, so that there is still the above-described problem. In addition to this, it has a pair of first slits 31a extending in parallel so that the openings face each other, the pair of slits 31a, and a second slit 31b communicating with the pair of slits 31a. 31 is configured such that regions 36 and 37 defined by the dielectric 20 exposed through the opening 31 in the antenna surface 30 form a matching circuit for the transmitting and receiving elements, so that the feeding direction is in the lateral direction. On the other hand, the pair of slits 31a have a horizontally long shape, and the electric field of the cross polarization component in the vertical direction is generated in the pair of slits 31a together with the electric field of the positive polarization in the horizontal direction in the second slit 31b. There is a problem that decreases.

  In addition, the generated cross-polarized light is radiated in a direction different from the direction originally intended for the positive-polarized wave, so there may be a case where a tag is in a place where communication is not desired when communicating with a reader / writer. There is also a problem that the installation and operation method of the tag becomes difficult. Further, the patch antenna of the RFID tag described in Patent Document 5 is basically arranged such that the feeding points 41 and 42 are located around the center of the antenna surface 30 but the slit is shifted from the center of the antenna surface 30. As a result, the pattern of the positive polarization is also asymmetrical, which affects the symmetry of the radiation pattern of the antenna. From these problems, it can be seen that the patch antenna disclosed in Patent Document 5 is centered on matching between the regions 36 and 37 and the transmitting / receiving element (IC chip).

  The RFID tag described in FIG. 1 and FIG. 2 of Patent Document 5 employs a slot antenna having a slot provided inside a conductor pattern. Similar to Patent Document 3, a conductive object (conductor) such as a metal object is used. ) Or installed in the vicinity thereof, there is a problem that the loop antenna or the dipole antenna does not operate due to the influence of the conductive object, or the communication distance is extremely reduced. Furthermore, since a magnetic field is generated in the longitudinal direction of the slot shown in FIG. 1 of Patent Document 5 and radiates by resonating at this length, the slot length needs to be about λ / 2 in order to radiate with high efficiency. Thus, there is a problem in miniaturization of the RFID tag.

  Therefore, the present invention has been made to solve the above-described problems, and can be installed on a flat or curved installation surface regardless of conductive or non-conductive objects without reducing the communication distance. The object of the present invention is to provide a novel RFID tag that is unlikely to be damaged by an impact or the like because no protrusion due to the IC chip is generated on the surface of the RFID tag.

  The RFID tag according to claim 1 is an RFID tag that can be installed on a curved surface having a predetermined curvature, and has a dielectric substrate having a hole at the center of one main surface and having a hardness that bends to the predetermined curvature. A grounding conductor pattern provided on the other main surface of the dielectric substrate; a conductor pattern provided on the dielectric substrate; provided at a predetermined distance from an end of the dielectric substrate; An elongated slot is formed inside the pattern, and the IC chip is electrically connected to the conductor pattern through the slot and inserted into the hole of the dielectric substrate. To do.

  The RFID tag according to claim 2 is an RFID tag that can be installed on a curved surface having a predetermined curvature, and has a dielectric substrate having a hole at the center of one main surface and having a hardness that bends to the predetermined curvature. A grounding conductor pattern provided on the other main surface of the dielectric substrate, a film base, and a conductor provided on the film base and provided on the inner side of the film base at a predetermined distance from the end. A slot having an elongated shape inside the conductor pattern, and an IC chip electrically connected to the conductor pattern through the slot and inserted into the hole of the dielectric substrate. It is characterized by that.

  An RFID tag according to a third aspect is the RFID tag according to the first or second aspect, wherein the dielectric substrate has a higher hardness around the IC chip than at a place other than the periphery of the IC chip.

  The RFID tag according to claim 4 is an RFID tag that can be installed on a curved surface having a predetermined curvature, and has a first dielectric substrate having a recess at a central portion of one main surface and having a hardness that bends to the predetermined curvature. A second dielectric substrate provided in the recess, having a hole on one main surface side of the first dielectric substrate, and having a hardness higher than that of the first dielectric substrate; A grounding conductor pattern provided on the other main surface of one dielectric substrate, and an end portion of the first dielectric substrate provided on the first dielectric substrate and the second dielectric substrate; A conductive pattern provided on the inner side of the conductor pattern at a predetermined distance, and an elongated slot formed in the conductor pattern, electrically connected to the conductor pattern through the slot, and IC chip inserted into the hole of the dielectric substrate And it is characterized in that there was example.

  The RFID tag according to claim 5 is an RFID tag that can be installed on a curved surface having a predetermined curvature, and has a first dielectric substrate having a recess at the center of one main surface and having a hardness that bends to the predetermined curvature. A second dielectric substrate provided in the recess, having a hole on one main surface side of the first dielectric substrate, and having a hardness higher than that of the first dielectric substrate; A grounding conductor pattern provided on the other main surface of one dielectric substrate, a film base, and a film base provided on the film base, provided at a predetermined distance from an end of the film base and provided on the inside thereof. The conductor pattern and an elongated slot formed inside the conductor pattern, electrically connected to the conductor pattern through the slot, and inserted into the hole of the second dielectric substrate Also provided with an IC chip It is.

  The RFID tag according to claim 6 is an RFID tag that can be installed on a curved surface having a predetermined curvature, and has a through hole penetrating from one main surface to another main surface in a central portion and having a hardness that bends to at least the predetermined curvature. A first dielectric substrate and a second dielectric layer provided in the through hole, having a hole on one main surface side of the first dielectric substrate, and having a hardness higher than that of the first dielectric substrate; A dielectric substrate, a grounding conductor pattern provided on the other main surface of the first dielectric substrate, the first dielectric substrate and the second dielectric substrate, and the first dielectric substrate. A conductor pattern provided on the inner side of the dielectric substrate at a predetermined distance from the end of the dielectric substrate, and an elongated slot is formed inside the conductor pattern, and the conductor pattern is electrically connected to the conductor pattern via the slot. Connected to the hole of the second dielectric substrate. It is characterized in that a input is an IC chip.

  The RFID tag according to claim 7 is an RFID tag that can be installed on a curved surface having a predetermined curvature, and has a through hole penetrating from one main surface to another main surface in a central portion and having a hardness that bends to at least the predetermined curvature. A first dielectric substrate and a second dielectric layer provided in the through hole, having a hole on one main surface side of the first dielectric substrate, and having a hardness higher than that of the first dielectric substrate; A dielectric substrate, a grounding conductor pattern provided on the other main surface of the first dielectric substrate, a film base, and a film substrate provided on the film base, a predetermined distance from an end of the film base A conductor pattern provided on the inner side of the conductor pattern and an elongated slot formed inside the conductor pattern, and electrically connected to the conductor pattern via the slot, the second dielectric substrate IC chip inserted into the hole of And it is characterized in that there was example.

  The RFID tag according to claim 8 is an RFID tag that can be installed on a curved surface having a predetermined curvature, and has a through hole penetrating from one main surface to another main surface in a central portion and having a hardness that bends to at least the predetermined curvature. A first dielectric substrate and a second dielectric layer provided in the through hole, having a hole on one main surface side of the first dielectric substrate, and having a hardness higher than that of the first dielectric substrate; A dielectric substrate, a ground conductor pattern provided on the other principal surface of the first dielectric substrate and the other principal surface of the second dielectric substrate, and the first dielectric substrate. A conductor pattern provided on the dielectric substrate and the second dielectric substrate, and provided inside the conductor pattern at a predetermined distance from an end of the first dielectric substrate; and inside the conductor pattern An elongated slot is formed, and the conductor is passed through the slot. Is electrically connected to the turn, it is characterized in that a second dielectric IC chip that is inserted into the hole of the substrate.

  The RFID tag according to claim 9 is an RFID tag that can be installed on a curved surface having a predetermined curvature, and has a through hole penetrating from one main surface to another main surface in a central portion and having a hardness that bends to at least the predetermined curvature. A first dielectric substrate and a second dielectric layer provided in the through hole, having a hole on one main surface side of the first dielectric substrate, and having a hardness higher than that of the first dielectric substrate; A dielectric substrate, a ground conductor pattern provided on the other principal surface of the first dielectric substrate and the other principal surface of the second dielectric substrate, a film base material, A conductive pattern provided on the film base and provided on the inner side of the end of the film base by a predetermined distance; and a slot having an elongated shape inside the conductive pattern. Electrically connected to the conductor pattern via And it is characterized in that a second IC chip that is inserted into the hole of the dielectric substrate.

  The RFID tag according to claim 10 is provided with a fixing means for fixing the conductor pattern formed on the film base and one main surface of the dielectric substrate. Or any one of claims 9 to 10.

  The RFID tag according to claim 11 is the one according to any one of claims 4 to 10, wherein the concave portion or the through hole is circular or polygonal.

  The RFID tag according to a twelfth aspect is the one according to any one of the fourth to eleventh aspects, wherein the second dielectric substrate is a solidified mold material.

  The RFID tag according to a thirteenth aspect is the one according to any one of the first to twelfth aspects, wherein at least one of the conductor pattern and the ground conductor pattern is formed of a metal fiber sheet.

  The RFID tag according to a fourteenth aspect is the RFID tag according to any one of the first to thirteenth aspects, wherein the ground conductor pattern has a cutout part of which is cut out.

  The RFID tag according to a fifteenth aspect is the one according to any one of the first to thirteenth aspects, wherein the ground conductor pattern is a lattice pattern or a meander pattern.

  The RFID tag according to claim 16 is characterized in that the IC chip is electrically connected to an electrical connection portion extending inward of the slot from both sides in the width direction of the conductor pattern constituting the slot. 15. Any one of 15.

  As described above, in the RFID tag according to the present invention, since the electric field direction generated in the slot and the electric field direction of the patch antenna coincide with each other, the cross polarization component can be suppressed to be extremely low, and the conductor pattern constituting the slot is the patch. Since it acts as a radiation part of the antenna, it is hardly affected by the radiation characteristics of the antenna even when it is installed not only in a non-conductive but also in a conductive installation. Since it is configured to be electrically connected to the conductor pattern, it is possible to reduce power supply loss, and therefore the communication distance is not shortened, and the IC chip is placed in the hole of the dielectric substrate. Since the structure to be inserted, that is, built in the dielectric substrate, does not bulge due to the IC chip, damage to the IC chip due to impact, etc. When printing by printer, there is an effect that the IC chip is damaged IC chip due to catch on the roller or drum is reduced. In addition, a dielectric substrate having a hardness that bends to a predetermined curvature is used for the base material of the RFID tag, and the IC chip is installed around the center of the RFID tag, so that not only a flat surface but also a curved surface having a predetermined curvature is installed. There is an effect that it can be installed on the surface.

Embodiment 1 FIG.
FIG. 1 is a configuration diagram of an RFID tag according to the first embodiment. 1A is a plan view of the RFID tag, and FIG. 1B is a cross-sectional view taken along the line AA ′ in FIG. 1A (the film substrate is formed on the conductor pattern and the ground conductor pattern). FIG. 1C is a cross-sectional view taken along the line AA ′ in FIG. In FIG. 1, reference numeral 1 denotes a dielectric substrate made of, for example, a low hardness (for example, JIS-A55) olefinic thermoplastic elastomer. As a molten fluid resin, a molten organic material such as plastic is used. There is no need to be an inorganic fluid or reactive fluid using the thixotropy of magnesium alloy, etc. However, it can be bent according to the curvature of the curved surface on which the RFID tag is installed. Select a material with low hardness. Of course, there is a limit to the curvature of the curved surface that can be installed. In other words, it depends on the limit value of curvature (predetermined curvature) that the low-hardness material used can bend. 2 is a film base material provided on the conductor pattern 3 provided on one main surface (front surface) of the dielectric substrate 1 and on the ground conductor pattern 8 provided on the other main surface (back surface) of the dielectric substrate 1 described later. is there.

  The film substrate 2 can be made of film polyethylene terephthalate (PET), polyimide, polyethylene naphthalate, polyvinyl chloride, etc., and the conductor pattern 3 or the ground conductor pattern 8 is formed by vacuum deposition or plating. Formed by a printing method or the like. The film substrate 2 may be a flexible substrate or a substrate that is not, and may be transparent or colored and translucent. Further, as shown in FIG. 1B, without forming the conductor pattern 3 and the ground conductor pattern 8 on the film base 2, the conductor pattern 3 and the ground conductor pattern are directly printed on the dielectric substrate 1 by printing or the like. 8 may be formed. 1A shows a state in which the dielectric substrate 1 can be seen through the film base 2 when the film base 2 is transparent. Hereinafter, the description will be made with reference to the drawings in which the film substrate 2 is used only for the conductor pattern 3, but the present invention (Embodiment 1 and Embodiment 2) has the conductor pattern 3 not having the film substrate 2. The present invention can also be applied to an RFID tag having the ground conductor pattern 8 or an RFID tag in which the film substrate 2 is provided only on the ground conductor pattern 8.

  Here, the film base 2 and the dielectric substrate 1 have the same dimensions in a plane. 3 is a conductor pattern provided on the film substrate 2. As shown in FIG. 1A, the conductor pattern 3 is formed on the inner side of the film base 2 with a distance d from the vertical and horizontal ends. In this case, it can be said that the conductor pattern 3 is formed at a distance d from the vertical and horizontal ends of the dielectric substrate 1. On the other hand, the film base 2 can be disposed on one main surface of the dielectric substrate at a distance d from the vertical and horizontal ends of the dielectric substrate 1. In this case, the conductor pattern 3 can also be provided on the entire surface of the film substrate 2. An elongated slot 4 is formed at the center of the conductor pattern 3 as shown in FIG. The slot 4 can be formed by etching or milling the conductor pattern 3. Of course, the slot 4 may be formed simultaneously with the formation of the conductor pattern 3 by etching, vacuum deposition, plating, printing, or the like. The length and width of the slot 4 can be determined by the frequency used. Reference numeral 5 denotes a hole formed in one main surface of the dielectric substrate 1. Reference numeral 6 denotes an IC chip, which is composed of a memory or the like as described later. The IC chip 6 is electrically connected to the conductor pattern 3 through the slot 4.

  Here, a connection configuration between the IC chip 6 and the conductor pattern 3 will be described. 7 and 7, as shown in FIGS. 1A and 1B, projecting electrical connection portions respectively extending from both sides of the opposing conductor patterns 3 and 3 constituting the slot 4 to the inside of the slot 4. Thus, the conductor patterns 3 and 3 on both sides of the slot 4 are continuously connected and electrically connected. These electrical connection portions 7 and 7 may be formed simultaneously with the formation of the conductor pattern 3 by etching. Terminals (not shown) of the IC chip 6 are connected to the electrical connection portions 7 and 7. If the size of the IC chip 6 is the same as or smaller than the width of the slot 4, it will fall within the width of the slot 4, but at this time, the terminals (not shown) of the IC chip 6 are electrically connected. Connected to the units 7 and 7. However, when the size of the IC chip 6 is larger than the width of the slot 4, the terminal (not shown) of the IC chip may be electrically connected to a portion near the slot 4 of the conductor pattern 3 through the slot. Therefore, in this case, it is not necessary to provide the electrical connection portions 7 and 7 as described above.

  Further, in FIG. 1A, the IC chip 6 is arranged at the center in the length direction of the slot 4, but the arrow attached to the slot 4 in FIG. If the RFID tag is valley-folded or mountain-folded from the line along the length direction of the slot 4 even if it is disposed at the end of the slot 4 moved along the length direction, the dielectric substrate 1 is The tensile stress applied to the conductor pattern 3 (IC chip 6) caused by bending increases from the line along the length direction of the slot 4 toward the end of the RFID tag, that is, the tensile stress applied to the IC chip 6 is small. So there is no problem. However, when the RFID tag is valley-folded or mountain-folded with respect to a line along the width direction of the slot 4 or an arbitrary line other than the length direction as a base point, the conductor pattern 3 (IC Since the tensile stress on the chip 6) increases toward the end of the RFID tag from a line along the width direction of the slot 4 or from any line other than the length direction, the IC chip 6 moves away from the center of the RFID tag. As a result, the reliability of the connection between the IC chip 6 and the conductor pattern 3 may be reduced by tensile stress.

  Since the hole portion 5 of the dielectric substrate 1 is formed to insert the IC chip 6, the depth and the width thereof correspond to the size of the IC chip. Of course, when the molding material is arranged around the IC chip 6, the hole 5 is necessarily larger than the outer shape of the IC chip 6. Of course, the position where the hole 5 is formed is determined according to the position in the slot 4 where the IC chip 6 is placed. In any case, the shape and dimensions of the slot 4 must be matched to the number and characteristic impedance of the electrical connection portions 7 of the IC chip 6 to be mounted. For example, in order to achieve impedance matching, in addition to fine adjustment of the shape of the slot 4, in the case where there are two connection terminals of the IC chip 6, two electrical connection portions 7 having a width capable of impedance matching are formed. do it. Next, 8 is a ground conductor pattern provided on the other main surface (back surface) of the dielectric substrate 1. Reference numeral 9 denotes an adhesive sheet for bonding the dielectric substrate 1 and the film substrate 2 on which the conductor pattern 3 or the ground conductor pattern 8 is formed. The adhesive sheet 9 is provided in a portion corresponding to a portion other than the IC chip 6 (hole portion 5) on the surface (one main surface) of the dielectric substrate 1 on which the conductor pattern 3 is formed. 2 can be bonded and fixed. Note that an adhesion method other than the adhesive sheet 9 may be employed.

  FIG. 2A is a conceptual diagram schematically showing how transmission / reception is performed between an RFID tag and an RFID reader / writer. FIG. 2B is a configuration diagram of the RFID tag, and in particular, a block configuration diagram functionally showing the internal configuration of the IC chip 6. 2A and 2B, reference numeral 10 denotes an RFID tag having the configuration shown in FIG. Reference numeral 11 denotes an antenna portion provided in the RFID tag 10, which corresponds to the conductor pattern 3 in which the slot 4 is formed in FIG. As shown in FIGS. 1A and 1B described above, the antenna portion 11 of the RFID tag 10 is provided with the conductor pattern 3 having the slots 4 on one main surface (front surface) of the dielectric substrate 1, and the dielectric substrate. Since the ground conductor pattern 8 is provided on the other main surface (back surface) of the one, the RFID tag 10 functions as a patch antenna. That is, the conductor pattern 3 having the slot 4 functions as an antenna pattern (radiating portion). The conductor pattern 3 and the slot 4 are adjusted so as to obtain impedance matching between the operating frequency of the RFID system and the IC chip 6 so as to be excited. Since this adjustment is greatly related to the thickness and relative dielectric constant of the dielectric substrate 1, a desired radiation pattern and gain can be obtained by adjusting and designing these conditions together. As described above, the slot 4 is formed in the central portion of the conductor pattern 3 so that the radiation pattern of the conductor pattern 3 is good. By adjusting and designing in accordance with such conditions, a desired radiation pattern and gain in the RFID tag 10 can be obtained, and without increasing the size of the RFID tag 10, that is, the dielectric substrate 1, for example, 1 to 1 A communication distance of about 8 m can be obtained.

  Reference numeral 12 denotes an RFID reader / writer, and reference numeral 13 denotes an antenna unit provided in the RFID reader / writer 12, which performs wireless communication with the antenna unit 11 of the RFID tag 10. Reference numeral 6 denotes the IC chip described in FIG. 1, and the specific configuration thereof is as shown in FIG. An analog unit 14 receives a transmission wave from the RFID reader / writer 12 by the antenna unit 11 of the RFID tag 10 and outputs the received wave to the digital circuit 21 at the subsequent stage. Reference numeral 15 denotes an A / D converter that performs A / D conversion on the transmission wave, and reference numeral 16 denotes a power that is generated by smoothing the transmission wave received by the antenna unit 11 with a rectifier circuit. It is a power supply control part which performs control. A memory unit 17 is mounted on the RFID tag 10 and stores tag information such as individual identification information. Reference numeral 18 denotes a demodulation unit that demodulates the transmission wave, and reference numeral 19 denotes a control unit that controls a circuit in the IC chip 6 including the memory unit 17 by the transmission wave demodulated by the demodulation unit 18. A modulation unit 20 modulates information extracted from the memory unit 17 by the control unit 19. 21 is a digital unit composed of the demodulation unit 15, the control unit 16 and the modulation unit 17, and 22 is a D / A conversion which D / A converts the signal transmitted from the modulation unit 20 and outputs it to the analog unit 14. Part.

  Here, the basic operation of such an RFID system will be described. The tag information is stored in the memory unit 17 of the RFID tag 10 in accordance with the use (biological / article entry / exit management and logistics management) using the RFID system, and the RFID reader / writer 12 itself The tag information can be updated, written, or read when the RFID tag 10 is present or moved (attached to a living body / article subject to entry / exit management or physical distribution management) in the transmission / reception area it can. The RFID reader / writer 12 transmits a command signal for instructing the RFID tag 10 to update, write, or read from the antenna unit 13 of the RFID reader / writer 12 to the antenna unit 11 of the RFID tag 10 as a transmission wave. The antenna unit 11 of the RFID tag 10 receives the transmission wave, and the transmission wave is detected and stored (smoothed) by the power supply control unit 16 to generate an operation power supply for the RFID tag 10, and the operation power supply to each circuit of the RFID tag 10. Supply. Further, the command signal of the transmission wave is demodulated by the demodulator 18. The control unit 19 performs data processing from the instruction content of the demodulated command signal, and instructs the memory unit 17 to update or write tag information, or to read the tag information. A return wave obtained by modulating the read signal output from the unit 17 by the modulation unit 20 is transmitted from the antenna unit 11 to the antenna unit 13 of the RFID reader / writer 12 via the analog unit 14, and the RFID reader / writer 12 receives the read signal. Thus, desired information is obtained.

  Further, the operation of the RFID system using the RFID tag according to the first embodiment will be described in detail. The RFID reader / writer 12 uses a command signal for instructing the RFID tag 10 to perform update / write or read as a transmission wave. The data is transmitted from the antenna unit 13 of the RFID reader / writer 12 to the antenna unit 11 of the RFID tag 10. The conductor pattern 3, which is a radio wave radiation portion of the dielectric substrate 1 constituting the RFID tag 10, receives the transmission wave, generates a potential difference between the opposing portions of the slot 4, and the transmission wave is supplied to the IC chip 6. As described above, the transmission wave supplied to the IC chip 6 is detected and stored (smoothed) by the power supply control unit 16 to generate an operating power supply for the RFID tag 10, and each circuit (IC chip 6) of the RFID tag 10. To supply the operation power, the command signal is demodulated from the transmission wave, the tag information is updated / written and / or read from / to the memory unit 17 from the instruction content of the demodulated command signal, and the memory unit The readout signal output from the circuit 17 traces back the same path as the transmission wave supplied to the IC chip 6 as a return wave, and returns to the RFID reader / writer 12 from the conductor pattern 3 that is the radiation section. Waves are transmitted, the antenna unit 13 of the RFID reader-writer 12 receives the reply wave, it comes to obtaining the desired information. Note that the content of wireless communication data performed by the RFID system may be conventional or new, and since the ground conductor pattern 8 is formed on the back surface of the dielectric substrate 1, By directing the back side to the installation target surface, it is possible to manufacture a simple structure RFID tag that can be installed regardless of whether the installation target is a conductor or non-conductor. It can be used in a wide range of fields such as management, equipment management, and car entrance / exit management, and can be installed even if the installation target or installation target surface is a conductor such as a conductive object.

  Next, FIGS. 3A to 3D are diagrams showing manufacturing methods of the conductor pattern 3 and mounting method of the IC chip 6 among manufacturing methods of the RFID tag according to the embodiment, based on the sectional views. The process will be described. FIG. 3A shows a conductor layer forming step of forming the conductor layer 23 on the film substrate 2 (the back side of the film substrate 2). Then, as shown in FIG. 3B, the region where the conductor pattern 3 is to be formed and the region where the electrical connection portions 7 are to be formed inside the slot 4 are masked, and the conductor pattern 3 and the electrical connection are formed by etching or the like. The conductor pattern formation process which forms the parts 7 and 7 simultaneously is shown. In addition, you may form a conductor pattern in a film base material, without performing a conductor layer formation process in the film base material 2. FIG. 3C and 3D, in the IC chip connection step, the connection terminals 24 and 24 of the IC chip 6 are electrically connected to the electrical connection portions 7 and 7 by soldering. The electrical connection method is generally thermocompression bonding by reflow, but may be connected by other methods. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  FIG. 4 is a plan view in which a conductor layer is formed on the entire surface of the film substrate. FIG. 5A is a rear view of the film substrate 2 after the conductor pattern 3 and the slot 4 are formed. As shown in FIG. 4, the conductor layer 23 is entirely formed on the back surface side of the film base 2, and a peripheral portion separated from the end of the film base 2 (dielectric substrate 1) by a predetermined distance d. A configuration of the conductor pattern 3 is shown in which the conductor layer in the slot 4 portion excluding the electrical connection portions 7 and 7 is removed by, for example, etching. The configuration of the film base 2 when viewed from the surface of the film base 2 at this time is shown in FIG. This is a case where the film substrate 2 is transparent or translucent. FIG. 6A is a back view of the IC chip 6 attached to the inside of the slot 4 on the film substrate 2. FIG. 6B is a state diagram when the IC chip is attached to the film base 2 when viewed from the front side of the film base 2, and the electrical connection portions 7 and 7 and the IC chip 6 are transparent or translucent. Visible through the film base 2. As shown in FIG. 7, a dielectric substrate 1 having holes 5 formed by etching, milling or the like (projections corresponding to the holes 5 in the injection mold at the time of injection molding) is prepared. The RFID tag may be manufactured by attaching to the hole portion 5). FIG. 7 is a surface view (top view) of a dielectric substrate having a hole, and shows the dielectric substrate 1 in which a hole 5 for inserting the IC chip 6 is formed on one main surface of the dielectric substrate 1. . In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  In order to form the conductor pattern 3 on the dielectric substrate 1 without using the film base 2, the IC chip 6 is placed in the hole 5 of the dielectric substrate 1 and then one main surface of the dielectric substrate 1. The conductor pattern 3 may be provided by printing or vapor deposition. In addition, after the IC chip 6 is mounted on a conductive thin film such as a copper foil, the conductive thin film is fixed to one main surface of the dielectric substrate 1, and the conductive thin film is etched to form the conductor pattern 3. May be. In this case, it goes without saying that the IC chip 6 needs to be mounted at a position where the conductive thin film finally becomes the slot 4 (electrical connection portion 7) by etching or the like. In addition, if the process which removes the film base material 2 from an RFID tag is provided after completion of an RFID tag, even if it does not use said method, the RFID tag without the film base material 2 can be manufactured.

  FIG. 8 is an electric field diagram showing an electric field (indicated by an arrow) of the RFID tag according to the embodiment. FIG. 8 also shows a partial enlarged view around the IC chip 6 and shows the state of the electric field with arrows in the partial enlarged view. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. The arrows shown in FIG. 8 indicate the electric field between the ground conductor pattern 8 and the conductor pattern 3. Since such an electric field is formed between the conductors, the electric field runs between the opposing portions of the slot 4. A potential difference occurs. A position where the intensity of the electric field in the thickness direction of the dielectric substrate 1 is zero is used as a feeding point of the IC chip. As shown in FIG. 8, since the left and right electric fields cancel each other out inside the dielectric substrate 1, the electric field strength is at a position along the longitudinal axis of the slot 4 (the depth direction in FIG. 8). Becomes zero. Therefore, if the electrical connection portion 7 of the IC chip 6 is arranged at this position, the power feeding loss can be greatly reduced. Therefore, with this configuration, the symmetry of the radiation pattern of the conductor pattern 3 is hardly adversely affected, the communication distance can be greatly extended, and even if the configuration is simple, the performance is greatly improved. There is an effect that an improved RFID tag can be obtained.

  FIG. 9 is a characteristic diagram illustrating a change in characteristic impedance in the RFID tag according to the embodiment. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. As described above, it has been described that the conductor pattern 3 is formed at a predetermined distance d from the end of the film substrate 2, but this means that the ground conductor pattern 8 is formed on the entire other main surface of the dielectric substrate 1. Therefore, it can be said that the predetermined distance d is a dimensional difference at the four corners of the conductor pattern 3 and the ground conductor pattern 8, as shown in FIG. In this way, the predetermined distance d is the same at the four corners of the conductor pattern 3 and the ground conductor pattern 8 even when the ground conductor pattern 8 is not formed on the entire other main surface of the dielectric substrate 1. It can be considered as a dimensional difference. Therefore, in FIG. 9, the horizontal axis represents a predetermined distance or the above-described dimensional difference d and the wavelength ratio of the used frequency of the RIFD tag, and the vertical axes R [Ω] and X [Ω] are the real parts of the characteristic impedance, respectively. And the imaginary part. Where λ on the horizontal axis is the wavelength of the operating frequency. According to the characteristic diagram of FIG. 9, when the predetermined distance d is 0.13λ or more, the characteristic impedance of the RFID tag 10 is substantially constant. Therefore, by setting the predetermined distance d to be 0.13λ or more, the characteristic impedance of the RFID tag can be obtained regardless of whether the RFID tag is installed in the air, regardless of whether it is a conductor or a non-conductor object. Therefore, the RFID performance does not deteriorate, and wireless communication with the RFID reader / writer 12 can be achieved. Since the electric field strength at the position of the hole portion 5 of the dielectric substrate 1 is zero, it can be said that it is almost the same as the change in characteristic impedance of the RFID tag when there is no hole portion 5.

  FIG. 10 is a plan view showing the configuration of the RFID tag according to Embodiment 1, and FIG. 11 is an enlarged plan view of the periphery of the slot shown in FIG. FIG. 11A is a plan view when the IC chip is not mounted, and FIG. 11B is a plan view when the IC chip is mounted. So far, the case where two connection terminals 24, that is, two IC chips are used has been described, but when the connection terminal 24 mounts four IC chips, the electrical connection portions 7 and 7 In addition, two dummy pads 25 and 25 are provided inside the slot 4 and in the vicinity of the connection terminals. The dummy pads 25 and 25 are formed at the same time as the electrical connection portions 7 and 7 are formed. Moreover, the dummy pads 25 and 25 seen through the film base 2 from FIGS. 10 and 11 are mere dummy pads that are not electrically connected to the conductor pattern 3 and the electrical connection portions 7 and 7. As described above, since it is possible to flexibly cope with a change in the specification of the IC chip 6 mounted on the RFID, it is possible to manufacture an RFID tag having a simple structure at a low cost. Note that the number of dummy pads 25 is not limited to two. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  As described above, the RFID tag according to the first embodiment has an effect that the IC chip 6 does not bulge and can be installed not only on a flat surface but also on a curved installation surface having a predetermined curvature. The configuration for improving the performance will be described with reference to FIGS. FIG. 12 is a shape diagram of a ground conductor pattern of the RFID tag according to the first embodiment, FIG. 12A is a shape diagram of a ground conductor pattern of a lattice pattern, and FIG. 12A is a ground shape of a meander pattern. FIG. 13 is a shape diagram of the metal fiber sheet for grounding conductor pattern of the RFID tag according to the first embodiment, FIG. 13A is a surface view of the metal fiber sheet, and FIG. FIG. 13A is a cross-sectional view taken along the line AA ′, FIG. 13C is a schematic diagram in which an external force is applied to the metal fiber sheet of FIG. 13B, and FIG. FIG. 14A is a shape diagram of a ground conductor pattern of a grid pattern, and FIG. 14A is a ground conductor pattern of a meander pattern. 26 is a shape diagram of Is a ground conductor pattern having a grid pattern, 27 is a notched portion of the ground conductor pattern 26, 28 is a ground conductor pattern having a meander pattern in which the conductor is notched in a meander pattern, 29 is a notch portion of the ground conductor pattern 28, 30 is a metal fiber sheet used for an electromagnetic shield and an antistatic sheet such as a stainless steel fiber sheet having a thickness of several μm, and 31 is a metal fiber sheet 30. Are grounded conductor patterns having a grid pattern, 32 is a notched portion of the ground conductor pattern 31, and 33 is a grounding having a meander pattern in which the metal fiber sheet 30 is notched. The conductor pattern 34 is a cutout portion of the ground conductor pattern 33. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  So far, the reliability of the electrical connection between the conductor pattern 3 (electrical connection portion 7), which is an antenna pattern when the RFID tag 10 is bent, and the IC chip 6 has been described, but the RFID tag 10 is bent. In addition to the electrical connection between the conductor pattern 3 (electrical connection portions 7 and 7) and the IC chip 6, the conductor pattern 3 and the dielectric substrate 1 and the ground conductor pattern 8 and the dielectric substrate are affected. 1 is also adversely affected by the tensile stress generated by bending the dielectric substrate 1 (RFID tag). In particular, it adversely affects the ground conductor pattern 8 that is often provided on the entire other main surface (back surface) of the dielectric substrate 1. For example, when the RFID tag is bent so that the ground conductor pattern 8 side (the other main surface side of the dielectric substrate 1) is a valley, the ground conductor pattern is directed from the end of the dielectric substrate 1 to the outside of the dielectric substrate 1. A large tensile stress is applied to 8, and the ground conductor pattern 8 at the end of the dielectric substrate 1 may be broken or peeled off from the dielectric substrate 1.

  When the RFID tag is bent so that the ground conductor pattern 8 side (the other main surface side of the dielectric substrate 1) is a mountain, the ground conductor pattern is directed from the end of the dielectric substrate 1 toward the center of the dielectric substrate 1. A large tensile stress is applied to 8, and the ground conductor pattern 8 at the center of the dielectric substrate 1 is loosened. Depending on the possibility of peeling from the dielectric substrate 1 and the adhesion state of the ground conductor pattern 8 to the substrate, the ground conductor pattern 8 As in the case where the RFID tag is bent so that the side is a valley, the ground conductor pattern 8 at the end of the dielectric substrate 1 may be broken or peeled off from the dielectric substrate 1. Hereinafter, instead of the ground conductor pattern 8 as described above, the ground conductor patterns 26 and 28, the metal fiber sheet 30, and the ground conductor patterns 31 and 33 formed of the metal fiber sheet 30 are used as the ground conductor of the RFID tag. It will be described that the occurrence of various problems that occur in the ground conductor of the RFID tag when bent can be reduced.

  12A and 12B, the ground conductor pattern 26 in which the grid pattern is formed and the ground conductor pattern 28 in which the meander pattern is formed are notched in which a part of the ground conductor pattern 8 is cut out. It has parts 27 and 29. Due to the notches 27 and 29, the tensile stress applied to the entire surface of the ground conductor is released by the notches 27 and 29, and the ground conductor from the dielectric substrate 1 may be peeled off due to breakage or slack. Is greatly reduced. The shape of the notch is not limited to that shown in FIGS. 12 (a) and 12 (b), and protects the ground conductor from the adverse effects of tensile stress, and operates sufficiently as the ground conductor of the patch antenna of the RFID tag. Any material that is electrically equivalent to the ground conductor pattern 8 may be used. In addition, it is not necessary that the shapes of the plurality of notches are the same, and “a notch with a large area is arranged at a location where a large tensile stress is applied.”, “Slowly cut toward a location where the tensile stress increases. “Increase the area of the notch”, “Shape with a round shape other than a rectangle”, such as the hardness of the dielectric substrate 1, the position and size of the IC chip 6, and the RFID tag are installed (attached) What is necessary is just to select the thinning amount and thinning shape of the conductor of the ground conductor pattern by making trade-offs from factors such as the curvature of the surface. In addition, expressions such as “notch” and “notch” are used to indicate the shape, and are not limited to those actually formed by cutting out the conductor pattern after the formation of the ground conductor pattern. Various methods are conceivable, such as the method of forming the pattern such as the slot 4 of the conductor pattern 3 described above.

  Moreover, you may use the metal fiber sheet 30 shown to Fig.13 (a)-(c) instead of the grounding conductor pattern 8 without forming a notch part. The metal fiber sheet 30 is a sheet-like conductor in which metal fibers are woven, has a small thickness (cross-sectional length), can be used as a ground conductor of an RFID tag, and as shown in FIG. In addition, it has sufficient flexibility against deformation due to external force, and can be used as a buffer material for tensile stress in place of the notch. Furthermore, since it is in the form of a sheet, the shape can be freely changed by die cutting or the like, so that the notch as shown in FIG. 12 can be applied to the metal fiber sheet, and the performance as a buffer material for tensile stress can be improved. It is possible to reduce the weight of the metal fiber sheet. Further, the description of the metal fiber sheet 31 on which the grid pattern shown in FIG. 14 is formed and the metal fiber sheet 33 on which the meander pattern is formed is that features other than the metal fiber sheet are grounding on which the grid pattern shown in FIG. 12 is formed. Since it is the same as the description of the conductor pattern 26 and the ground conductor pattern 28 in which the meander pattern is formed and the paragraph number “0051” in the preceding paragraph, the description is omitted. Further, since the shape of the metal fiber sheet 30 can be freely changed by die-cutting as described above, it can be used not only for the ground conductor pattern 8 but also for the conductor pattern 3. In addition, since it is easy to provide a hole at a desired position at the time of manufacturing (weaving), the metal fiber is provided with a shape and a number of holes that serve as a buffer material for tensile stress at the time of manufacturing. These may be substituted for the notch.

  A process of actually attaching the RFID tag according to the first embodiment to a curved surface will be described with reference to FIGS. FIG. 15 is a configuration diagram of the RFID tag according to the first embodiment. 15A is a cross-sectional view taken along line AA ′ in FIG. 1A, and FIG. 15B is shown in FIG. 1B in which a double-sided tape is formed on the ground conductor pattern. In FIG. 15, reference numeral 8x denotes a ground conductor pattern 8, a ground conductor pattern (grid shape) 26, a ground conductor pattern (meander shape) 28, a metal fiber sheet 30, a ground conductor pattern (lattice shape) 31, and a ground. The ground conductor pattern (ground conductor layer) 35 of the conductor pattern (meander shape) 33 is a double-sided tape provided under the ground conductor pattern 8x. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. When the RFID tag according to the first embodiment is attached to an object to be managed, radio waves from the RFID reader / writer are received on one main surface side of the dielectric substrate 1 on which the conductor pattern 3 that is an antenna pattern is formed. In order to be directed outwards, it is necessary to provide a member (adhesive layer) for fixing to the installation surface of the object to be managed on the other main surface side of the dielectric substrate 1 on which the ground conductor pattern 8x is formed. The member to be fixed depends on the material of the installation surface, but it is often sufficient to use a commercially available double-sided tape. In addition to the double-sided tape, it may be an adhesive sheet or a fluid adhesive resin. Furthermore, if a conductive layer is used for the adhesive layer, an RFID tag that operates with sufficient performance after installation can be obtained even when the conductor pattern 8x has a notch, even if the area of the notch is large. In some cases, the RFID tag can be operated without providing the conductor pattern 8x on the dielectric substrate 1. However, in this case, the operation of the RFID tag before installation is not guaranteed.

  FIG. 16 is a configuration diagram of the RFID tag and the RFID tag installation target according to the first embodiment, and FIG. 16A is the RFID tag shown in FIG. 15B. FIG. 16B shows an RFID tag installation object (installation surface convex type), and FIG. 16C shows an RFID tag installation object (installation surface concave type). ing. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. Note that the RFID tag installation objects 36 and 37 may or may not be conductors due to the nature of the RFID tag according to the present invention. Installation is carried out by placing the surface opposite to the surface of the double-sided tape 35 of the RFID tag shown in FIG.

  Next, a state where RFID is installed on the RFID tag installation objects 36 and 37 will be described with reference to FIG. FIG. 17 is a configuration diagram of the RFID tag and the RFID tag installation target according to the first embodiment, and FIG. 17A is an RFID tag installed on the RFID tag installation target (installation surface convex type). (B) is installed in the RFID tag installation object (installation surface concave type). In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. As shown in FIG. 17, the RFID tag according to the first embodiment can be easily installed in the same manner as a plane regardless of whether the installation surface is convex or concave, and the conductor pattern 3 is bent. However, since the electrical length does not change, the radiation pattern is slightly deformed, but the conductor pattern 3 does not hinder the operation of the RFID tag as a radio wave radiation portion. In addition to those shown in FIGS. 17 (a) and 17 (b), an RFID tag installation object having both unevenness (undulations) on the installation surface can be installed as long as it has some unevenness (undulations). .

  As described above, in the first embodiment of the present invention, the dielectric substrate 1 is manufactured using an olefin-based thermoplastic elastomer having a low hardness (for example, JIS-A55), thereby having flexibility. Since a flexible RFID tag using a dielectric substrate can be manufactured, an RFID tag that can be installed along the curved surface of a curved object such as a drum can can be obtained. In addition, for resin-molded substrates, it is better to use a dielectric substrate that is injection-molded with a resin (thermoplastic resin) compared to a multilayer dielectric substrate that is made by laminating several printed circuit boards. ) Can be significantly reduced, and the dielectric (material) of the dielectric substrate used in the RFID tag is polytetrafluoroethylene (fluororesin), ceramic, glass epoxy used in general printed circuit boards. With dielectric materials such as, it is difficult to produce a substrate with an arbitrary thickness, and it is difficult to flexibly respond to changes in the required dimensions depending on the installation position of the RFID tag. Since the thickness and shape can be easily changed, various variations of RFID tags can be easily manufactured. Also, by using an olefin polymer resin with a low dielectric loss tangent among the resins (thermoplastic resins) as a dielectric substrate for RFID tags, radiation efficiency is improved and high-gain RFID tags can be manufactured. It is.

  Further, the specific gravity of the olefin polymer resin is about half that of a general printed circuit board, and the RFID tag can be reduced in weight. Further, the IC chip 6 is mounted on a hard and thick material such as a dielectric substrate made of polytetrafluoroethylene (fluorine resin), ceramic, glass epoxy, etc. used in a general printed circuit board. In this case, there is no dedicated equipment for mounting, and it takes time to mount one by one. On the other hand, there are many equipment for mounting the IC chip 6 on the film base 2 on the market. Therefore, mass production is possible at a time, and the manufacturing time and cost including the formation of the hole 5 can be greatly reduced. The same is true for the second embodiment below.

Embodiment 2. FIG.
In the first embodiment, the RFID tag that can be attached to a curved surface by the position of the IC chip 6 and the shape and material of the ground conductor pattern has been described. However, in the second embodiment, the IC chip An RFID tag that can be attached to a curved surface with improved reliability of electrical connection with a conductor pattern (slot, electrical connection portion) will be described with reference to FIGS. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. In the second embodiment, the periphery of the IC chip 6 is configured to have a higher hardness than the periphery of the IC chip 6 (the low-hardness dielectric substrate 1 shown in the first embodiment), and the IC chip and the conductor pattern are separated from each other. The substrate portion (the end portion of the RFID tag) having a large adverse effect such as a grounding conductor pattern of tensile stress caused by bending the RFID tag while improving the reliability of electrical connection uses the countermeasure described in the first embodiment. The present invention relates to an RFID tag that is more resistant to bending. In other words, a low-hardness substrate is used for the part that is strongly affected by the bending of the RFID tag, and a high-hardness substrate is used for the part that is weakly affected by the bending of the RFID tag. It can be said that an electrical connection portion between the weak IC chip and the conductor pattern is arranged.

  Although a specific structure will be described below, the RFID tag according to the second embodiment has the same apparent dimensions (RFID tag outer shape and slot dimensions) as those of the RFID tag according to the first embodiment. However, this is because priority has been given to ease of understanding in the description, and in fact, the material constants (dielectric constant, dielectric loss tangent, etc.) of the dielectric substrate 1 in the first embodiment and the second embodiment. Since the effective material constants of the composite dielectric substrate (using two types of substrates, that is, the dielectric substrate 1 and another dielectric substrate) are not the same, the RFID tag according to the second embodiment is used as an RFID tag. In order for the tag to obtain performance equivalent to that of the RFID tag according to Embodiment 1, it is necessary to readjust the dimensions of the RFID tag (conductor or substrate). Of course, the predetermined distance d also changes. Therefore, the dimensions of the RFID tag are different between the first embodiment and the second embodiment. The same can be said for some RFID tags described in the second embodiment.

  18 is a configuration diagram of the RFID tag according to the second embodiment, FIG. 18A is a plan view of the RFID tag, and FIG. 18B is a cross-sectional view taken along the line AA ′ in FIG. 19 is a configuration diagram of the RFID tag according to the second embodiment, FIG. 19A is a plan view of the RFID tag, and FIG. 19B is A in FIG. 19A. FIG. 18 is a cross-sectional view taken along line -A ′. In FIGS. 18 and 19, reference numeral 38 denotes an RFID tag, 39 denotes a first dielectric substrate made of the same material as the dielectric substrate 1, and 40 denotes a first dielectric substrate. A circular concave portion 41 provided on one main surface of one dielectric substrate 39 is inserted into the concave portion 40 (or a concave portion 44, a concave portion 46, a concave portion 48, a through hole 50, a through hole 52, and a step portion 54, which will be described later). , A second dielectric substrate having a hardness higher than that of the first dielectric substrate 39, and 42 is a first dielectric substrate. In the hole portion formed in the second dielectric substrate 41 in one principal surface of the substrate 39 is equivalent to the hole 5 in the first embodiment. 43 is an RFID tag, and 44 is a rectangular recess provided on one main surface of the first dielectric substrate 39.

  As shown in FIGS. 18 and 19, the second dielectric substrate 41 in which the hole 42 on which the IC chip 6 is placed is formed uses a substrate having a hardness higher than that of the first dielectric substrate 39. Therefore, the influence of the bending of the RFID tag 38 or the RFID tag 43 on the electrical connection between the IC chip 6 and the conductor pattern 3 (electrical connection portions 7 and 7) can be reduced. The cross-sectional shapes of the recesses 40 and 44 and the second dielectric substrate are not limited to a circle or a rectangle, but may be an ellipse, a cross, a star, or a polygon. If the first dielectric substrate 39 and the second dielectric substrate 41 are manufactured by resin molding, each substrate can be manufactured in an arbitrary shape, so the shape can be changed according to the bending method and the bending direction of the RFID tag. Just choose. Furthermore, it is not necessary to have the same cross-sectional shape from the top to the bottom of the recesses 40 and 44 or the second dielectric substrate. For example, instead of the cylindrical recesses 40 and 44 and the second dielectric substrate as shown in FIG. 18, a cone that tapers from the top to the bottom may be used. The RFID tags 38 and 44 can be manufactured by fitting the second dielectric substrate 41 to the first dielectric substrate 39 after the first dielectric substrate 39 and the second dielectric substrate 41 are manufactured. Since it is the same as the RFID tag 10 described in Embodiment 1 except that the bonding is performed, the description thereof is omitted. In the first embodiment, the hole 5 on which the IC chip 6 is placed is expanded to form a recess 40 or 44, and a mold material is injected into the recess 40 or 44 instead of the second dielectric substrate. 18 and FIG. 19 may be implemented.

  FIG. 20 is a configuration diagram of an RFID tag according to the second embodiment. 20A is a plan view of the RFID tag, FIG. 20B is a cross-sectional view taken along line AA ′ in FIG. 1A, and FIG. 21 relates to the second embodiment. It is a block diagram of an RFID tag. 21A is a plan view of the RFID tag, FIG. 21B is a cross-sectional view taken along the line AA ′ in FIG. 21A, and in FIGS. The RFID tag 46 is a circular recess having a diameter larger than the length in the length direction of the slot 4, 47 is an RFID tag, and 48 is a rectangular recess having a side length longer than the length in the length direction of the slot 4. . Although the basic configuration and the function as an RFID tag are the same as the RFID tag shown in FIGS. 18 and 19, the RFID tag shown in FIGS. 20 and 21 has a pattern in which the slot 4 is only on the second dielectric 41. Therefore, when the RFID tag is bent, a load applied to the contact surface (fitting surface / bonding surface) between the first dielectric substrate 39 and the second dielectric substrate 41 is applied to the side edge of the slot 4. The load is suppressed not only by the film base 2 but also by the conductor pattern 3 and the film base 2, and the effect of preventing the pattern from being peeled off or loosened from the substrate by the pattern of the slot 4 is higher. It is different.

  The cross-sectional shapes of the recesses 46 and 48 and the second dielectric substrate are not limited to a circle or a rectangle, but may be an ellipse, a cross, a star, or a polygon. If the first dielectric substrate 39 and the second dielectric substrate 41 are manufactured by resin molding, each substrate can be manufactured in an arbitrary shape, so the shape can be changed according to the bending method and the bending direction of the RFID tag. Just choose. Furthermore, it is not necessary to have the same cross-sectional shape from the top to the bottom of the recesses 46 and 48 or the second dielectric substrate. For example, instead of the cylindrical recesses 46 and 48 and the second dielectric substrate as shown in FIG. 20, a cone that tapers from the top to the bottom may be used. The RFID tags 45 and 47 can be manufactured by fitting the second dielectric substrate 41 to the first dielectric substrate 39 after the first dielectric substrate 39 and the second dielectric substrate 41 are manufactured. Since it is the same as the RFID tag 10 described in Embodiment 1 except that the bonding is performed, the description thereof is omitted.

  FIG. 22 is a configuration diagram of the RFID tag according to the second embodiment. 22A is a plan view of the RFID tag, FIG. 22B is a cross-sectional view taken along the line AA ′ in FIG. 22A, and FIG. 23 relates to the second embodiment. It is a block diagram of an RFID tag. 23A is a plan view of the RFID tag, FIG. 23B is a cross-sectional view taken along the line AA ′ in FIG. 23A, and 49 in FIG. 22 and FIG. RFID tag 50 is a circular through-hole having a diameter larger than the length in the length direction of the slot 4, 51 is an RFID tag, 52 is a rectangular through-hole having a side length larger than the length in the length direction of the slot 4 It is. Although the basic configuration and the function as an RFID tag are the same as those of the RFID tag shown in FIGS. 20 and 21, the second dielectric substrate 41 of the RFID tag shown in FIGS. 20 and 21 is shown in FIGS. Since the volume and area of the RFID tag are larger than those of the second dielectric substrate 41 of the RFID tag, the contact surface (fitting) between the first dielectric substrate 39 and the second dielectric substrate 41 when the RFID tag is bent. (Surface / adhesive surface) is close to the end of the RFID tag, the load applied to the contact surface becomes large, and the first dielectric substrate 39 and the second dielectric substrate 41 may be separated. However, in the RFID tag shown in FIG. 22 or FIG. 23, the first dielectric substrate 39 is provided with a through hole 50 or a through hole 52, and the second dielectric substrate 41 is inserted and fixed therein. Many contact surfaces between the dielectric substrate 39 and the second dielectric substrate 41 Ri, a first dielectric substrate 39 and the second dielectric substrate 41 can reduce the possibility of separating. Of course, the first dielectric substrate 39 of the RFID tag shown in FIGS. 18 and 19 may also be provided with a through hole, and the second dielectric substrate 41 corresponding to the shape of the through hole may be inserted and fixed. .

  The cross-sectional shapes of the through holes 50 and 52 and the second dielectric substrate are not limited to a circle or a rectangle, but may be an ellipse, a cross, a star, or a polygon. If the first dielectric substrate 39 and the second dielectric substrate 41 are manufactured by resin molding, each substrate can be manufactured in an arbitrary shape, so the shape can be changed according to the bending method and the bending direction of the RFID tag. Just choose. Furthermore, it is not necessary for the through holes 50 and 52 and the second dielectric substrate to have the same cross-sectional shape from the top to the bottom. For example, instead of the cylindrical through holes 50 and 52 and the second dielectric substrate as shown in FIG. 22, a cone that tapers from the top to the bottom may be used. The RFID tags 49 and 51 can be manufactured by fitting the second dielectric substrate 41 to the first dielectric substrate 39 after the first dielectric substrate 39 and the second dielectric substrate 41 are manufactured. Since it is the same as the RFID tag 10 described in Embodiment 1 except that the bonding is performed, the description thereof is omitted. Furthermore, since the electric field around the IC chip 6 is concentrated in the vicinity of the slot 4 as described above (FIG. 8), the first dielectric substrate 39 on the other main surface side immediately below the portion where the electric field concentrates. The second conductor substrate 41 may not be provided with the ground conductor pattern 8x. That is, this means that it is not necessary to provide the ground conductor pattern 8x before the first dielectric substrate 39 and the second dielectric substrate 41 are fixed (fitted / adhered), and a manufacturing method that can be selected as a result. This has the effect of increasing variations.

  FIG. 24 is a configuration diagram of the RFID tag according to the second embodiment. 24A is a plan view of the RFID tag, FIG. 24B is a cross-sectional view taken along the line AA ′ in FIG. 24A, and in FIG. 24, 53 is the RFID tag. , 54 are step portions provided in the center of the first dielectric substrate 39 and from the opposite sides of the first dielectric substrate 39 to the sides. The RFID tag 53 is different from the RFID tag shown in FIGS. 18 to 23 in that an opening such as a recess or a through hole is provided in the first dielectric substrate 39 instead of an opening on one main surface of the first dielectric substrate 39. Since the second dielectric substrate 41 is fitted or bonded to a concave stepped portion 54 provided on one main surface and side surface of the first dielectric substrate 39, the first dielectric substrate 39 is used. Whether the second dielectric substrate 41 is inserted from one main surface side of the substrate 39 or the second dielectric substrate 41 is inserted from the side surface of the first dielectric substrate 39, the first dielectric substrate is used. There is an effect that the alignment of 39 and the second dielectric substrate 41 becomes easy.

  Further, it is not necessary to flatten the surface of the stepped portion 54 or the second dielectric substrate 41, and the first dielectric substrate 39 and the second dielectric substrate are provided by providing wavy undulations and fitting irregularities on the surface. The strength of the coupling with 41 may be increased, and the stepped portion 54 does not need to be formed in parallel with the slot 4, and the direction may be selected according to the bending method and the bending direction of the RFID tag. Furthermore, it is not necessary to have the same cross-sectional shape from the top part to the bottom part of the stepped part 54 or the second dielectric substrate. For example, instead of a cubic stepped portion 54 and a second dielectric substrate as shown in FIG. 24, a trapezoidal cone that tapers from the top to the bottom may be used. The RFID tag 53 is manufactured by fitting or adhering the second dielectric substrate 41 to the first dielectric substrate 39 after the first dielectric substrate 39 and the second dielectric substrate 41 are manufactured. Since it is the same as that of the RFID tag 10 described in Embodiment 1 except that it is performed, the description is omitted.

  FIG. 25 is a configuration diagram of the RFID tag according to the second embodiment. 25A is a plan view of the RFID tag, FIG. 25B is a cross-sectional view taken along line AA ′ in FIG. 25A, 55 is the RFID tag, and 56 is the first tag. This is a connecting surface between the dielectric substrate 39 and the second dielectric substrate 39. The RFID tag 55 eliminates the step portion 54 of the RFID tag 53 shown in FIG. 24, and the first dielectric substrate 39 is disposed on the side surface of the second dielectric substrate 41 via the connecting surface 56. Since the dielectric substrate 39 and the second dielectric substrate 41 are combined with each other, first, the second dielectric substrate 41 is formed, and then the second dielectric substrate 41 is put into an injection mold. This is manufactured by adding a resin to be a substitute dielectric substrate 39. Alternatively, the first dielectric substrate 39 and the second dielectric substrate 41 may be manufactured separately and bonded together at the connecting surface 56.

  In addition, the first dielectric substrate 39 and the second dielectric substrate 41 on the connecting surface 56 do not need to be flat, and the surface of the first dielectric substrate 39 is provided with wavy undulations and fitting irregularities. The strength of the coupling with the second dielectric substrate 41 may be increased, and the connecting surface 56 does not need to be formed in parallel to the slot 4, and the direction depends on the bending method and the bending direction of the RFID tag. Just choose. Furthermore, the first dielectric substrate 39 and the second dielectric substrate 41 on the connecting surface 56 do not have to have the same cross-sectional shape from the top to the bottom (from one main surface to the other main surface). For example, instead of the vertical connecting surface 56 as shown in FIG. 25, a connecting surface that tapers from one main surface to the other main surface may be used. The manufacturing method of the RFID tag 55 is the same as that of the RFID tag 10 described in the first embodiment after the second dielectric substrate 41 and the first dielectric substrate 39 are coupled, and the description thereof is omitted.

  As described above, in the second embodiment of the present invention, in the dielectric substrate of the RFID tag, the hardness around the IC chip 6 is made higher in the places other than the periphery of the IC chip 6. In addition to the effect of the RFID tag according to the first embodiment of the invention, the reliability of electrical connection between the IC chip 6 and the conductor pattern 3 (electrical connection portions 7 and 7) when the RFID tag is stretched on the curved surface is There is an effect that a higher RFID tag can be obtained.

It is a block diagram of the RFID tag which concerns on Embodiment 1 of this invention. 1 is a basic configuration diagram of an RFID system. It is a RFID tag manufacturing process figure manufactured with the manufacturing method of the RFID tag concerning this invention. It is a block diagram of the film base material which concerns on this invention. It is a conductor pattern figure formed in the film base material concerning this invention. It is a conductor pattern figure (IC chip connection completed) formed in the film base material which concerns on this invention. It is a dielectric substrate block diagram in which the hole which concerns on this invention was formed. It is an electric field diagram of the RFID tag according to the present invention. It is a characteristic impedance figure of the RFID tag which concerns on this invention. It is a RFID tag block diagram (with a dummy pad) manufactured by the manufacturing method of the RFID tag which concerns on Embodiment 1 of this invention. FIG. 3 is an enlarged view of the periphery of the slot of the RFID tag according to Embodiment 1 of the present invention (with a dummy pad). It is a shape figure of the grounding conductor pattern of the RFID tag which concerns on Embodiment 1 of this invention. It is a shape figure of the metal fiber sheet for grounding conductor patterns of the RFID tag which concerns on Embodiment 1 of this invention. It is a shape figure of the metal fiber sheet for grounding conductor patterns of the RFID tag which concerns on Embodiment 1 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 1 of this invention. It is a block diagram of the RFID tag and RFID tag installation target object concerning Embodiment 1 of this invention. It is a block diagram of the RFID tag and RFID tag installation target object concerning Embodiment 1 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 2 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 2 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 2 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 2 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 2 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 2 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 2 of this invention. It is a block diagram of the RFID tag which concerns on Embodiment 2 of this invention.

Explanation of symbols

1 ... dielectric substrate, 2 ... film substrate,
201 ... Film substrate with conductor (with conductor layer (grounding conductor pattern 8)),
202 ... Film substrate with conductor (with conductor pattern 3), 3 ... Conductor pattern,
4 ... Slot, 5 ... Hole, 6 ... IC chip, 7 ... Electrical connection, 8 ... Grounding conductor pattern,
9 ... Adhesive sheet, 10 ... RFID tag, 11 ... Antenna part (tag),
12 ... RFID reader / writer, 13 ... antenna unit (reader / writer), 14 ... analog unit,
15 ... A / D conversion unit, 16 ... power supply control unit, 17 ... memory unit, 18 ... demodulation unit,
DESCRIPTION OF SYMBOLS 19 ... Control part, 20 ... Modulation part, 21 ... Digital part, 22 ... D / A conversion part,
23 ... Conductor layer, 24 ... Connection terminal, 25 ... Dummy pad,
26: Grounding conductor pattern (lattice), 27 ... Notch,
28: Grounding conductor pattern (meander shape), 29 ... Notch, 30 ... Metal fiber sheet,
31 ... Grounding conductor pattern (lattice), 32 ... Notch,
33 ... Grounding conductor pattern (meander shape), 34 ... notch, 35 ... double-sided tape,
36 ... RFID tag installation target (installation surface convex type),
37 ... RFID tag installation target (installation surface concave type), 38 ... RFID tag,
39 ... 1st dielectric substrate, 40 ... Concave (circular), 41 ... 2nd dielectric substrate, 42 ... Hole part,
43 ... RFID tag, 44 ... concave portion (rectangular), 45 ... RFID tag, 46 ... concave portion (circular),
47 ... RFID tag, 48 ... recess (rectangular), 49 ... RFID tag,
50 ... through hole (circular), 51 ... RFID tag, 52 ... through hole (rectangular),
53 ... RFID tag, 54 ... step, 55 ... RFID tag, 56 ... joint surface.

Claims (16)

An RFID tag that can be placed on a curved surface having a predetermined curvature, and is provided on a dielectric substrate having a hole at the center of one main surface and having a hardness that bends to the predetermined curvature, and on the other main surface of the dielectric substrate. A grounding conductor pattern, a conductor pattern provided on the dielectric substrate, provided at a predetermined distance from an end of the dielectric substrate, and an elongated slot inside the conductor pattern. And an IC chip that is electrically connected to the conductor pattern through the slot and inserted into the hole of the dielectric substrate. An RFID tag that can be placed on a curved surface having a predetermined curvature, and is provided on a dielectric substrate having a hole at the center of one main surface and having a hardness that bends to the predetermined curvature, and on the other main surface of the dielectric substrate. A grounding conductor pattern, a film base material, a conductor pattern provided on the film base material, provided at a predetermined distance from an end of the film base material, and on the inside of the conductor pattern. An RFID tag comprising an elongated slot, an IC chip electrically connected to the conductor pattern through the slot, and inserted into the hole of the dielectric substrate. The RFID tag according to claim 1 or 2, wherein the dielectric substrate has a hardness around the IC chip higher than a hardness at a place other than the periphery of the IC chip. An RFID tag that can be installed on a curved surface of a predetermined curvature, provided at least in the first dielectric substrate having a recess at the center of one main surface and having a hardness that bends to the predetermined curvature, and inside the recess. A second dielectric substrate having a hole on one principal surface side of the first dielectric substrate and having a hardness higher than that of the first dielectric substrate; and the other principal surface of the first dielectric substrate. A grounding conductor pattern provided on the first dielectric substrate and the second dielectric substrate, and spaced from the end of the first dielectric substrate by a predetermined distance to the inside thereof. An elongated conductor-shaped slot is formed inside the conductor pattern, and is electrically connected to the conductor pattern through the slot, and is inserted into the hole of the second dielectric substrate. Characterized by comprising an integrated IC chip Grayed. An RFID tag that can be installed on a curved surface of a predetermined curvature, provided at least in the first dielectric substrate having a recess at the center of one main surface and having a hardness that bends to the predetermined curvature, and inside the recess. A second dielectric substrate having a hole on one principal surface side of the first dielectric substrate and having a hardness higher than that of the first dielectric substrate; and the other principal surface of the first dielectric substrate. A grounding conductor pattern provided on the film substrate, a conductor pattern provided on the film substrate, and provided on the inner side of the film substrate at a predetermined distance from the end of the film substrate; and An elongated slot is formed inside, and an IC chip electrically connected to the conductor pattern through the slot and inserted into the hole of the second dielectric substrate is provided. RFID tag. An RFID tag that can be installed on a curved surface having a predetermined curvature, having a through-hole penetrating from one main surface to another main surface in a central portion, at least a first dielectric substrate having a hardness that bends to the predetermined curvature, A second dielectric substrate provided in a through hole, having a hole on one main surface side of the first dielectric substrate, and having a hardness higher than that of the first dielectric substrate; A grounding conductor pattern provided on the other principal surface of the dielectric substrate, and provided on the first dielectric substrate and the second dielectric substrate, from an end of the first dielectric substrate. A conductor pattern provided on the inner side of the conductor pattern at a predetermined distance, and an elongated slot is formed inside the conductor pattern, and is electrically connected to the conductor pattern through the slot. And an IC chip inserted into the hole of the body substrate. RFID tags, wherein the door. An RFID tag that can be installed on a curved surface having a predetermined curvature, having a through-hole penetrating from one main surface to another main surface in a central portion, at least a first dielectric substrate having a hardness that bends to the predetermined curvature, A second dielectric substrate provided in a through hole, having a hole on one main surface side of the first dielectric substrate, and having a hardness higher than that of the first dielectric substrate; A grounding conductor pattern provided on the other main surface of the dielectric substrate, a film base material, provided on the film base material, and provided on the inner side of the film base material at a predetermined distance from the end portion. A conductor pattern and an elongated slot formed inside the conductor pattern, an IC electrically connected to the conductor pattern through the slot, and inserted into the hole of the second dielectric substrate RFID characterized by comprising a chip Grayed. An RFID tag that can be installed on a curved surface having a predetermined curvature, having a through-hole penetrating from one main surface to another main surface in a central portion, at least a first dielectric substrate having a hardness that bends to the predetermined curvature, A second dielectric substrate provided in a through hole, having a hole on one main surface side of the first dielectric substrate, and having a hardness higher than that of the first dielectric substrate; A ground conductor pattern provided on the other principal surface side of the first dielectric substrate and the second dielectric substrate on the other principal surface side of the first dielectric substrate, and the first dielectric substrate and the second dielectric substrate. A conductive pattern provided on a dielectric substrate, and provided inside the first dielectric substrate at a predetermined distance from the end of the first dielectric substrate, and an elongated slot is formed inside the conductive pattern; It is electrically connected to the conductor pattern through this slot, and the front RFID tag, characterized in that an IC chip that is inserted into the hole portion of the second dielectric substrate. An RFID tag that can be installed on a curved surface having a predetermined curvature, having a through-hole penetrating from one main surface to another main surface in a central portion, at least a first dielectric substrate having a hardness that bends to the predetermined curvature, A second dielectric substrate provided in a through hole, having a hole on one main surface side of the first dielectric substrate, and having a hardness higher than that of the first dielectric substrate; A grounding conductor pattern provided on the other principal surface of the first dielectric substrate and the second dielectric substrate on the other principal surface side of the first dielectric substrate, a film base material, and the film base material. A conductive pattern provided on the inner side of the film substrate at a predetermined distance from the end of the film base, and an elongated slot is formed inside the conductive pattern, and the conductive pattern is electrically connected to the conductive pattern through the slot. Connected to the second dielectric substrate RFID tag, characterized in that an IC chip that is inserted into section. 10. The device according to claim 2, further comprising a fixing unit that fixes the conductor pattern formed on the film base and one main surface of the dielectric substrate. RFID tag. The RFID tag according to any one of claims 4 to 10, wherein the recess or the through hole is circular or polygonal. The RFID tag according to any one of claims 4 to 11, wherein the second dielectric substrate is obtained by solidifying a molding material. The RFID tag according to claim 1, wherein at least one of the conductor pattern and the ground conductor pattern is formed of a metal fiber sheet. The RFID tag according to any one of claims 1 to 13, wherein the ground conductor pattern has a notch partly cut away. The RFID tag according to claim 1, wherein the ground conductor pattern is a lattice pattern or a meander pattern. 16. The RFID tag according to claim 1, wherein the IC chip is electrically connected to an electrical connection portion extending from both sides in the width direction of the conductor pattern constituting the slot to the inside of the slot. .

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