TW201011657A - FRID tag - Google Patents

Abstract

An FRID tag is disclosed, whose feature is that the tag includes a dielectric substrate, which has hole part on its main surface; a grounding wire, which is equipped on the other main surface; conduction wire, which is equipped on the main surface of the abovementioned dielectric substrate and is installed on the inner side merely at a predetermined distance form the end parts of the dielectric substrate; and IC chip, which is inserted inside the hole part of the dielectric substrate and is electrically connected to the conduction wire through a trough hole that is formed inside the conduction wire.

Description

201011657 IX. Description of the Invention: [Technical Field] The present invention relates to an RFID (Radio Frequency Identification) tag that receives a command signal transmitted from a reader/writer and updates and supplements the information according to the command signal. The information stored in the memory is recorded or transmitted as a signal read on the RFID reader, and is used for access control and logistics management of the biological item. [Prior Art] The RFID system performs wireless communication between an RFID tag including an IC chip and an RFid reader. The RFID tag houses a so-called active tag that mounts a battery and is driven by its electric power, and a so-called passive tag that receives power from the reader and drives it as a power source. Compared with passive tags, active tags have advantages in terms of communication distance and communication stability due to the installation of batteries, but they also have disadvantages such as complicated structure, large size, and high cost. • In recent years, the use of semiconductor technology has been promoted to promote the miniaturization and performance of 1C chips for passive tags, and the expansion of communication distance and the improvement of communication stability have been made in the broad field of passive type standards. The use is expected. In passive tags, the electromagnetic induction method applied to RFID private tags with long-band and short-band bands is based on the electromagnetic induction between the transmitting antenna line of the reader and the antenna coil of the RFID tag. The induced voltage is applied through which the IC chip can be activated for communication. Therefore, the 'coffee tag is only in the induced electromagnetic field of the RFID reader (4), 2275-10007 - PF 5 201011657 v The communication distance is about tens of centimeters. Further, in the RFID tag of the high frequency band such as the UHF band and the microwave band, since the radio wave communication method is applied and the power is supplied to the IC chip of the RFID tag via the radio wave, the communication distance is greatly increased to about 1 to 8 meters. Therefore, high-band RFID tags such as UHF band and microwave band make it difficult to read multiple RFID tags and read mobile RFID tags that are difficult to implement in long-band, short-band RFID systems with short communication distances. The scope of its use will be greatly expanded in the future. Then, as a high-frequency passive tag of the UHF band or the microwave band, for example, it is described in Patent Documents 1 to 6. Regarding the conventional RFID tag, in the third drawing of Patent Document 1, an RFID tag including a 1/2 wavelength microstrip line resonator 13, an electric substrate 14, and a grounded conductor plate 15 is transmitted through 1/2. The 微c wafer is connected between the wavelength microstrip line resonator 13 and the grounded conductor plate 15, and even if there is a metal object (conductor) on the side of the grounded conductor plate 15, it can be disposed without affecting the radiation characteristics of the antenna. Adhering to a metal object (conductor) The β-related fine chip of the Ic wafer is disclosed in Fig. 17 of Patent Document 1 by a technique such as wire bonding or the like, and the IC 106 is disposed on the back surface of the ground line 104 connected to the central portion of the antenna conductor 100 to be buried. In the dielectric material on the grounding conductor side, and similarly, in the 18th to 21st drawings of Patent Document 1, 1C 121 is disposed to be buried in the dielectric material on the ground conductor side, in Patent Document 1 Paragraph No. 0028 indicates that if the Ic structure is formed on the opposite side of the face on which the connection pads of κ 121 are formed, one of the weld lines 122 is not required among the weld lines 122, 12, 2. In the first drawing of Patent Document 2, an RFID tag is disclosed, the 2275-10007-PF 6 201011657 4 including the terminal portion 3 formed on the surface of the substrate 1, and the substrate 1 disposed on the portion The wafer arrangement region 9 formed thereon is connected to the IC wafer 6 of the terminal portion 3. It is revealed that since it is not necessary to embed the IC chip 6 inside the substrate 1, it can be mounted on the antenna, and the surface of the substrate 1 can be processed only by the 'RFII' label which can be manufactured with a simple structure, and the yield can be reduced and Reduce production costs. In Fig. 19 of Patent Document 3, an RFID tag 5 is disclosed, which includes a dielectric material 1 〇, a recess 1 〇b for a 1C wafer, a film substrate 20, an antenna pattern 30, and The 1C wafer 40 is provided with a recess i 〇 b for a 1 C wafer in which a 1 C wafer 40 can be buried, and an ic wafer 40 is embedded in the recess for the 1 C wafer, and the film substrate 20 is wound around the dielectric. The antenna pattern 3 type and the ic wafer 40 formed on the inner surface side of the film substrate 20 are electrically connected to each other, and the loop antenna formed of the antenna field type 30 is transmitted through the material, thereby suppressing even in the vicinity of the radio wave absorber. The communication distance is reduced. In Fig. 1 and Fig. 2 of Patent Document 4, an rFid label in which a 1C wafer 21 is fitted to a concave portion 15 of a substrate U (substrate) and formed by screen printing using conductive ink is disclosed. Both ends of the antenna field type 丨3 are electrically connected to the 1C wafer 21. Further, in the fourth drawing of Patent Document 4, an antenna field type pair 13A, 13B having two pieces is disclosed. In the fourth drawing of Patent Document 5, an rfID tag is disclosed in which an opening 31 exposing a portion of the dielectric material 2 is formed on the antenna surface 30, and the opening has a pair of second slot holes 31a extending in parallel with each other. a pair of slots 31a and a second slot 31b that communicates with the pair of slots 31a, and the slots 2275-10007-PF 7 201011657 2 are located in the middle of the pair of first slots 31a . In the transmission/reception element (1C wafer), the first and second feed points are connected to 41 and 42 °. In FIGS. 1 and 2 of Patent Document 6, an RFID tag is disclosed which is along a rectangular shape. The slot antenna 1 in which the center of the conductor plate 11 is disposed in the longitudinal direction and which constitutes the slot 12 is mounted with an ic crystal; [Patent Document 1] JP-A-2000-332523 (Patent 3, FIG. 17 to FIG. 21) [Patent Document 2] JP-A-2002-197434 (Patent 1) [Patent Document 3] Japanese Laid-Open Patent Publication No. 2003-223626 (Patent Document No. 2003-223626) (Patent Document No. 2, FIG. 4, and FIG. 4) [Patent Document 5] ❼ JP-A-2006-237674 (Patent No. 2006-237674) 4)) [Patent Document 6] JP-A-2002-358494 (Picture No. 2, Fig. 2) Patent Document 1 RFID tags 1 to A " f show Ί δ 罝 ^; ^ metal objects ( On the conductor). However, since it is a structure in which a 1C wafer is connected between a 1/2 wavelength microstrip line resonator and a ground conductor plate, it is necessary to bond the IC chip by wire bonding or to embed the Ic wafer into the inside of the dielectric substrate. : Although the possibility of damage to the wafer caused by collision or the like is reduced, there is a structure

2275-l〇〇〇7-PF 8 201011657 4 Complex and manufacturing (production) difficult problems. In the RFID tag described in Patent Document 2, even if the size of the ic wafer is promoted, the thickness of the 1C wafer is thicker than the antenna field type and the thickness of the conductor of the terminal portion, and the 1C wafer is mounted on the surface of the substrate. Therefore, it can protrude to the surface of the RFID tag. Therefore, as described in paragraph 0023 of Patent Document 2, it is necessary to cover all or a part of the portion where the Ic wafer is mounted and to flatten the surface of the RFID tag. That is, when the antenna field type ❿ and the 1C chip are mounted on a substrate, there is a possibility that the IC chip is broken due to impact or the like, and it is difficult to directly use the standard printer on the surface (above) of the RFID tag. Printing problems. Further, when the film on which the antenna field type and the ic wafer are mounted is adhered to the substrate, the above problem is caused by the expansion (protrusion) of the film by the Ic wafer.

In the RFID tag described in Patent Document 3, the film (film substrate) caused by the IC wafer hardly expands (protrusion), and is attached to a conductive object (conductor) such as a metal object and is provided in the vicinity thereof. At this time, the loop antenna is stopped by the influence of the conductive object, and there is a problem that the communication distance is extremely shortened. In the RFID tag described in Patent Document 4, the expansion (protrusion) caused by the wafer is hardly generated, and is attached to a conductive object (conductor) such as a metal object in the same manner as in Patent Document 3, and is disposed in the vicinity thereof. The loop antenna or the dipole antenna is stopped by the influence of the conductive object, and the communication distance is extremely shortened. The RFID tag described in Patent Document 5 can be provided on a metal object (conductor) in the same manner as the RFID tag described in the patent document. However, since the 2275-10007-PF 9 201011657 4 IC wafer is disposed outside the dielectric 20, even if the miniaturization of the IC chip is promoted, the thickness of the 1C wafer is thicker than the antenna field type and the conductor thickness of the terminal portion. The 'and' 1C wafer is mounted on the surface of the substrate. Therefore, it can protrude to the surface of the RFID tag. Therefore, similarly to the RFID tag described in Patent Document 2, there is a possibility that the 1C wafer is broken by a collision or the like, and it is difficult to directly print on the surface (upper surface) of the RFID tag using a label printer. Further, when the film on which the antenna pattern and the ic wafer are mounted is adhered to the substrate, the above problem is caused by the expansion (protrusion) of the film caused by the 1C wafer. In addition, since the opening has a pair of second slot holes 31a extending in parallel with each other, the pair of slots 31a, and the second slot 31b communicating with the pair of slots 31a, the opening 31 is configured The matching circuits for transmitting the receiving elements are formed such that the regions 36, 37 drawn by the dielectric exposed through the openings 31 in the antenna face 30 are oriented with respect to the lateral direction, and the pair of slots 31 & become rectangular, and In addition to the electric field of the main polarization in the lateral direction in the second slot 31b, the electric field of the longitudinally and repolarized component is also generated in the pair of slots 31 & and the gain of the main polarization component is lowered. . In addition, since the generated cross-polarized wave system is radiated in a direction different from the original direction of the main polarized wave, in the case of communication with the reader/writer at a position where communication is not desired, there is also a label setting. Methods and methods of application are difficult. Further, in the patch antenna of the RFID tag described in Patent Document 5, since the feeding points 41 and 42 are arranged around the center of the antenna surface 30, the slots are basically arranged on the antenna surface 50. At the centrally moved position, the dominant polarization field pattern also becomes asymmetrical, and there is a problem that affects the symmetry of the radiation field pattern of the antenna. According to the above problem, it is understood that the patch antenna of Patent Document 6 mainly considers the integration of the regions 36, 3? and the transmission receiving element (IC chip). The RFID tag described in the first and second aspects of the patent document 6 is applied to a slot antenna in which a slot is provided in a conductor pattern, and is attached to a conductive object such as a metal object in the same manner as in Patent Document 3. When it is placed in the vicinity thereof, the loop antenna or the dipole antenna is stopped by the influence of the conductive inertia object, and the communication distance is extremely shortened. Furthermore, 'the magnetic %' is generated in the longitudinal direction of the slot shown in the first figure of Patent Document 5, and is radiated by this length and radiated. For efficient emission, the slot length must be about λ/2. There is also a problem with miniaturization of RFID tags. Therefore, in order to solve the above problems, an object of the present invention is to provide a new RFID tag which is an RFID tag which can be disposed independently of a conductive object or a non-conductive object without shortening the communication distance, in addition to the function ❹ Since the protrusion caused by the IC wafer does not occur on the surface of the RFID tag, the possibility of breakage of the Ic wafer on the surface of the RFII) tag is small, and post-processing (adjustment) after the manufacturing is easy. Further, it is an object of the present invention to provide a new RFID tag which can be set on a plane or a curved surface without being shortened in communication distance, irrespective of a conductive object or a non-conductive object, and because it is included in the rFid mark. The protrusion caused by the 1C wafer does not occur on the surface, so that the possibility of π wafer damage caused by punching or the like is small. 2275-10007-PF 11 201011657 [Invention] The RFID tag of the present invention comprises: a dielectric substrate having a hole portion on a main surface; a grounding wire disposed on the other main surface of the dielectric substrate; 'on the dielectric substrate, and disposed on the inner side thereof from the end of the dielectric substrate by a predetermined distance; and a 1C wafer in which a slot is formed inside the wire, through which the slot is Electrically connected to the aforementioned wires and inserted into the aforementioned hole portions of the aforementioned dielectric substrate. The RFID tag of the present invention comprises: a dielectric substrate having a hole portion on a main surface; a grounding wire disposed on the other main surface of the dielectric substrate, the wire 'on being disposed on the dielectric substrate, And an ic wafer is formed from the end of the dielectric substrate with a predetermined distance therebetween; and an ic wafer is formed inside the wire to form an elongated slot through which the wire is electrically connected to the wire. And inserted into the aforementioned hole portion of the dielectric substrate. The radio frequency identification tag of the present invention comprises: a dielectric substrate having a hole portion on a main surface; a ground wire 'on the other main surface of the dielectric substrate; and a wire disposed on the dielectric substrate a main surface, and is disposed on the inner side thereof only from a predetermined distance from an end portion of the dielectric substrate; an electrical connection portion, a slot is formed inside the wire, and the aforementioned wire constituting the slot The two sides extend to the inner side of the slot, respectively; and the IC chip is electrically connected to the electrical connection portion and is inserted into the hole portion of the dielectric substrate. The radio frequency identification tag of the present invention comprises: a dielectric substrate having a hole portion on a main surface; a ground wire 'on the other main surface of the dielectric substrate; and a wire disposed on the dielectric substrate Mainly, and from the foregoing

2275-10007-PF 201011657 The end of the dielectric substrate is disposed on the inner side thereof only by a predetermined distance; the electrical connection portion, the inside of the wire constitutes an elongated slot, and from the width direction constituting the slot The opposite sides of the opposite wires extend to the inner sides of the slots, respectively; and the IC chips are electrically connected to the electrical connections and are inserted into the holes of the dielectric substrate. The RFID tag of the present invention is a radio frequency identification tag that can be disposed on a curved surface of a predetermined curvature, and includes: a dielectric substrate having a hole portion φ on a central portion of a main surface and having a hardness of at least the aforementioned predetermined curvature; a grounding wire is disposed on the other main surface of the dielectric substrate; the wire is disposed on the dielectric substrate, and is disposed on the inner side thereof from the end of the dielectric substrate by a predetermined distance And an IC chip in which an elongated slot is formed inside the wire, through which the wire is electrically connected to the wire and inserted into the hole portion of the dielectric substrate. The RFID tag of the present invention is a radio frequency identification tag that can be disposed on a curved surface of a predetermined curvature, and includes: a dielectric substrate having a hole portion at a central portion of a main surface and having a hardness of at least the aforementioned predetermined curvature; a grounding wire disposed on the other main surface of the dielectric substrate; a film substrate; a wire disposed on the film substrate, and disposed at a predetermined distance from an end of the film substrate On the inner side thereof; and an IC chip, an elongated slot is formed inside the wire, through which the wire is electrically connected to the wire and inserted into the hole portion of the dielectric substrate. In the RFID tag of the present invention, the dielectric substrate has a higher hardness than a periphery of the wafer than the periphery of the Ic wafer. The RFID tag of the present invention can be disposed on a curved surface of a predetermined curvature. The 2275-10007-PF 13 201011657 m radio frequency identification tag includes: a first dielectric substrate having a recess on a central portion of the main surface, and having at least The second dielectric substrate having a predetermined curvature curvature is provided inside the concave portion, and has a hole portion ' on a main surface side of the front dielectric substrate and has a hardness higher than that of the second dielectric substrate; a grounding conductor is disposed on the other main surface of the ith dielectric substrate, and the wiring is disposed on the first dielectric substrate and the second dielectric slab, and from the end of the first dielectric substrate The portion is disposed on the inner side only by a predetermined distance; and the 1C wafer, the inside of the wire is formed as an elongated slot through which the wire is electrically connected to the wire and inserted into the second layer The aforementioned hole portion of the electric substrate. The RFID tag of the present invention is a radio frequency identification tag which is disposed on a curved surface of a predetermined curvature, and includes: a first dielectric substrate having a concave portion at a central portion of the main surface and having a hardness of at least the aforementioned predetermined curvature; a dielectric substrate provided on the inner side of the concave portion and having a hole portion on a main surface side of the second dielectric substrate, and having a hardness higher than that of the first electric plate; the grounding wire is provided in the foregoing The other main surface of the second dielectric substrate; the film substrate; the wire 'on which is disposed on the film substrate, and is disposed on the inner side thereof only from the end of the film substrate by a predetermined distance: and IC The wafer is configured to have a bait or an elongated slot inside the wire, through which the wire is electrically connected to the wire, and the m I of the rape a is inserted into the hole of the second dielectric substrate unit. The RFID tag of the present invention is a radio frequency identification tag which is disposed at a predetermined curvature, and includes: a U-th electric substrate, the central portion of the crucible is penetrated from one main surface to the other main surface;

2275-10007-PF 14 201011657 m curvature is substantially curved and hardness; the second dielectric substrate 'is provided in the through hole, and has a hole portion on one main surface side of the first dielectric substrate, and The first dielectric substrate is high; the grounding wire is disposed on the other main surface of the first dielectric substrate, and the wire is disposed on the first dielectric second dielectric substrate 'and the inner surface of the first dielectric substrate is disposed on the inner side thereof only by a predetermined distance; and the 1C wafer is formed in the inner side of the meandering wire to form an elongated slot through which the ground hole is electrically The above-mentioned hole of the present invention is inserted into the aforementioned second dielectric substrate. The RFID tag of the present invention is a radio frequency identification tag which is disposed on a curved surface of a predetermined curvature, and includes: the first dielectric substrate 'in the center The portion has a through hole from the main portion to the other surface, and has a hardness of at least the predetermined curvature of the tube; the second dielectric substrate is disposed inside the through hole, and one of the first dielectric substrates The main surface side has a hole portion, and the hard f is higher than the aforementioned ith dielectric substrate; the grounding wire is And disposed on the other main surface of the first dielectric substrate; the film substrate; the wire is disposed on the film substrate, and is further disposed at a predetermined distance from the end of the film substrate The inner side and the JC wafer have an elongated slot formed inside the lead wire, and are electrically connected to the lead via the slot and inserted into the hole portion of the second dielectric substrate. The RFID tag of the present invention is a radio frequency identification tag that can be disposed on a curved surface of a predetermined curvature, and includes: a first dielectric substrate having a through hole penetrating from the main surface to the other main surface at the central portion, and having at least The hardness of the predetermined curvature curvature; the second dielectric substrate is disposed in the through hole

2275-10007-PF 15 201011657 Internal, and having a hole portion on the main surface side of the first dielectric plate, and a second substrate r, _ ground wire of the dielectric substrate In the second dielectric substrate, the first dielectric surface of the first dielectric substrate is on the first main surface side of the first dielectric substrate; and the lead wires are provided on the second dielectric layer and the (1) second dielectric substrate. And the inner surface of the first dielectric substrate is disposed on the inner side thereof only by a predetermined distance; the & ic wafer has an elongated slot formed therein, and (4) the slot is electrically connected

The above-mentioned hole portion □ is inserted into the aforementioned second dielectric substrate. The RFID tag of the present month is a radio frequency identification tag which can be placed on a curved surface of a predetermined curvature.

The m dielectric device includes a first dielectric substrate having a through hole formed in a central portion from a main surface to the other surface and having a hardness that is curved at least in the predetermined curvature. The second dielectric substrate is disposed in the through-hole a hole portion having a hole portion on a main surface side of the first dielectric substrate and having a higher hardness than the first dielectric substrate; and a ground lead wire provided on the other main surface of the first dielectric substrate And on the other main surface side of the ith dielectric substrate in the second dielectric substrate; a film substrate; a wire disposed on the film substrate ′ and separated from the end of the film substrate a predetermined distance is disposed on an inner side thereof; and an IC chip, wherein an elongated slot is formed inside the wire, through which the wire is electrically connected to the wire, and is inserted into the second dielectric substrate The aforementioned hole portion. The RFID tag of the present invention includes a fixing means for fixing the lead wire formed on the film substrate and a main surface of the dielectric substrate. In the RF ID tag of the present invention, the recess or the through hole is 2275-10007-PF 16 201011657 shaped or polygonal. In the RFID tag of the present invention, the second dielectric substrate is formed by curing a molding material. In the RFID tag of the present invention, at least one of the wire and the ground wire is made of a metal fiber plate. In the RFID tag of the present invention, the grounding wire has a notch portion from which a part thereof is cut. In the RFID tag of the present invention, the grounding conductor has a lattice pattern or a P-fold pattern. In the RFID tag of the present invention, the IC chip is electrically connected to an electrical connection portion extending from the both sides in the width direction of the other wire constituting the slot to the inside of the slot. According to the present invention, since the direction of the electric field generated by the slot coincides with the direction of the electric field of the patch antenna, the cross-polarized component is suppressed to be relatively low and since the wire constituting the slot is used as the radiating portion of the patch antenna, not only the non-wire • The property, even in the case of providing a conductive article, does not affect the radiation characteristics of the antenna, but is a structure in which the ic wafer is electrically connected to the wire via the slot, so that the feed loss can be reduced, and thus, The effect of the communication distance is not shortened, and in addition, since the IC wafer is inserted into the hole portion of the dielectric substrate, that is, through the built-in dielectric substrate, the expansion caused by the ic wafer does not occur, and the impact is caused by the impact. In the case where the Ic is broken or printed by the 2 printer, 1 (the wafer is sandwiched on the roller or the roller, and the resulting ic wafer is less damaged. Further, according to the present invention, In the structure in which the film substrate is not used, the thickness of the entire RFID tag of 2275-10007-pp 17 201011657 can be made thinner. Since the conductor of the slot portion is not covered by the size of the slot, it becomes easy to adjust. That is, the impedance is easily adjusted. Since the film substrate is not used, the cost of the RFID tag is lowered, etc. Further, according to the present invention, a dielectric substrate having a hardness bent at a predetermined curvature is used. In the base material of the RFID tag, and the IC chip is provided at the center of the RFID tag, it is possible to obtain an effect of not only a flat surface but also a curved surface-shaped mounting surface having a predetermined curvature. 实施 [Embodiment] BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail with reference to the accompanying drawings. The plan view of Fig. 1(a) is a cross-sectional view taken along line AA of Fig. 1(a), and Fig. 1(c) is a plan view showing the vicinity of the slot of the RFID tag not shown by circle 1(a). In the figure, 'the main surface (surface) of the dielectric substrate 1 is provided with a wire 2. As shown in Fig. 1(a), the wire 2 is separated from the longitudinal and lateral ends of the dielectric substrate μ by a distance. d is formed on the inner side thereof, as shown in Fig. 1(a), An elongated slot 3 is formed in the central portion of the slot 2. The slot 3 can be formed into a wire 2 by etching, grinding, evaporation, printing, etc. The length and width of the slot 3 can then be used according to the frequency of use. It is determined that a hole portion (concave portion) is formed on one main surface of the dielectric substrate ί. 4 〇 IC wafer 5 is 2275-10007-PF 18 201011657 which will be described later. The 1C wafer 5 is electrically connected to the via hole 3 through the slot 3 The same reference numerals are given to the same or corresponding parts, and the connection structure of the 1C wafer 5 and the wires 2 is explained here. As shown in Fig. 1 (a) and =, the protruding electrical connecting portions 6, 6 are constructed. The two sides of the opposite conductors 2, 2 in the width direction of the slot 3 extend to the inner side of the slot 3, respectively, and are continuously connected to electrically connect the two sides of the slot 3, respectively.

Wires 2, 2. These electrical connections 6&6 can be formed simultaneously with the formation of the wires 2. Terminals (not shown) of the IC chip 5 are connected to these electrical connections 邠 6, 6. When the size of the ic wafer 5 is the same as or smaller than the width of the slot 3, 'although it will be within the width of the slot 3, at this time, the two terminals (not shown) of the Ic wafer 5 are connected to the electrical connection portion 6. , 6 connections. When the size of the sheet 5 is larger than the width of the slot 3, the terminal (not shown) of the κ wafer can be electrically connected to the portion of the lead 2 passing through the slot near the slot 3. Therefore, in this case, it is not necessary to provide the electrical connection portion 6, as described above.

Memory and other components. Wire 2. In the figure, a detailed description is given. Further, in Fig. 1(a), the Ic wafer 5 is disposed in the center portion in the longitudinal direction of the slot 3, but may not be disposed at the center portion thereof, but may be placed along the setting in Fig. 1 (a). The end of the slot 3 in which the arrow of the slot 3 moves in the longitudinal direction. Since the hole portion 4 of the dielectric substrate i is formed for insertion of the k wafer 5, the depth and the width thereof correspond to the size of the IC wafer. However, when using molding materials or adhesives for fixing the c-chip, it is necessary to make up those volumes. The position at which the hole portion 4 is formed is of course determined depending on which position of the slot 3 the 1C wafer 5 is placed. In any case, the shape and size of the slot 3 must match the installed I. The number of the electrical connection portions 6 of the wafer 5 2275-10007-PF 19 201011657 and the characteristic resistance match 'except for the shape of the micro-adjustment slot 3' in the case where the number of pins of the impedance-connecting terminal is two, the IC chip 5 Two electrical connections 6 of the degree of connection. Further, the grounding conductor 7 is provided on the wide side of the impedance matching. The other main surface of the dielectric substrate 1 (the back view 2 is the basic consideration of the RFID system)

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Fig. 2(b) is a block diagram showing the internal structure of the 1C wafer 6 in a functional form of the RFID tag. In a solid Z(a), (b), the RFID tag 8 is the RFID tag of the structure shown in Figure 1. The antenna portion 9 provided on this foot tag 8 corresponds to the wire 2 in which the slot 3 is formed in Fig. i. As the antenna portion 9 of the RFID tag 8, as shown in the foregoing figure (the wire 2 having the slot 3 is provided on one main surface (surface) of the dielectric substrate 1 and the other main body of the dielectric substrate 1 The grounding wire 7 is provided on the surface (back surface), so the RFID tag 8 is used as a patch antenna. That is, the wire 2 having the slot 3 is used as an antenna field type (radiation portion). The wire 2 and the slot 3 are adjusted. The frequency of use of the RFID system for excitation is matched with the impedance of the IC chip 5. Since this adjustment is also significantly related to the thickness and relative dielectric constant of the dielectric substrate 1, it is adjusted and designed by meeting these conditions. The desired radiation pattern and gain are obtained. Further, the slot 3 is formed in the central portion of the wire 2 so that the radiation pattern of the wire 2 is improved as described above. The RFID tag is obtained by adjusting and designing in accordance with these conditions. The desired radiation field type and gain can be obtained without increasing the size of the RFID tag 8 (that is, the dielectric substrate 1), for example, a communication distance of about 1 to 8 m. 2275-10007-PF 20 201011657 The antenna portion u is disposed on the device l, and the antenna portion 11 is connected to the RFID tag 8 The antenna unit 9 performs wireless communication. The ic chip 5 is a 1C wafer described in Fig. 1, and its specific structure is as shown in Fig. 2(b). The analog portion 12 is received from the RFID portion 9 through the antenna portion 9 of the RFID tag 8. The transmission wave of the reader/writer 1〇 is output to the analog portion of the digit unit 19 in the subsequent stage. The A/D conversion unit 13 converts the A/D conversion unit that converts the A/D conversion. The power supply control unit 14 is a rectification circuit. The transmission wave received by the antenna unit 9 is smoothed to generate electric power, and a power supply control unit that supplies and supplies power to each circuit of the RFID tag 8 is mounted. The memory unit 15 is mounted on the RF ID tag 8 and stores solid identification. The demodulation unit 16 is a demodulation unit that demodulates the transmission wave, and the control unit 17 controls the ic chip including the memory unit 15 based on the transmission wave demodulated by the demodulation unit 16. The control unit of the circuit in 5. The modulation unit 18 is a modulation unit that changes information extracted from the storage unit 15 via the control unit i7. The digital unit 19 is composed of a demodulation unit 15, a control unit 16, and a modulation unit 17. The D/A conversion unit 2 converts the signal D/A transmitted from the modulation unit 18 and outputs it to the class. The same reference numerals are used to designate the same or equivalent parts, and the detailed description thereof is omitted. Here, the basic operation of such an RFID system will be described. According to the use of such an RF ID system The use (biological. Access control and logistics management of the item) is tagged as the information stored in the memory part 15 of the RF ID tag 8. The RF ID reader/writer 10 can be attached to the (4) tag 8 in its own transmission and reception area (attached) Update, write or read the tag information when it exists or moves on the biological object that is the object of access control management and logistics management.叮(7)Reading and writing 2275-10007-pp 21 201011657 The command signal for instructing the RFID tag 8 to be updated, written or read is transmitted as a transmission wave from the antenna portion u of the RFID reader/writer 10 to the 卯(7) tag 8. Antenna portion 9. The antenna unit 9 of the RFID tag 8 receives the transmission wave, and the transmission wave is detected by the power supply control unit 14. The power is stored (smoothed) to generate an operation power of the RFID device 8, and the operation power is supplied to each circuit of the rfid tag 8. . Further, the transmission wave demodulates the command signal via the demodulation unit 16. The control unit 17 performs the processing of the command information of the demodulated command signal and instructs the memory unit 15 to perform the update, writing, or § of the tag information, and the memory is instructed by the control unit 17 based on the instruction. The read signal outputted by the unit 15 is modulated into a reply wave via the modulation 胄18, and the echo signal is transmitted from the antenna unit 9 via the analog unit 12 to the antenna unit U' RFID reader/writer 1 of the rfid reader/writer 1 〇 Receive the readout signal and get the desired information. In the figures, the same reference numerals are used to refer to the same or equivalent parts, and the detailed description is omitted. Further, when the operation of the RFID φ system using the RFID tag of Embodiment 1 is explained in detail, the RFID reader/writer 10 commands the command to update the writing or reading of the RFID tag 8 as a transmission wave to read from the RFID. The = line portion 11 of the writer 10 is fed to the antenna portion 9 of the RFID tag. The wire 2 constituting the radiation portion of the radio wave of the dielectric substrate 1 of the standard 8 receives a transmission wave, and a potential difference is generated between the opposite portions of the slot 3 to supply the transmission wave with Pa μ r , ' 曰曰As described above, the transport wave f supplied to the ic chip 5 is detected by the power supply control unit 14. The power is stored (smoothed) to generate an operation power supply of the KFID, and the operation power is supplied to the RFID tag. 8 (CB slice 5), the command signal is demodulated from the transmitted wave, and the command content of the command signal modulated by the solution 2275-10007-pp 22 201011657 is used to update the tag information of the memory unit 、5, writing the person Or any of the read-out or both, the readout signal outputted by the memory_15 is used as the reply wave followed by the same path as the transmission wave to the ^5 chip, from the wire 2 as the radiation portion The echo wave is transmitted to the RFID sequel 10, and the antenna portion u of the RFID reader/writer 1 receives the reply wave to obtain desired information. The content of the data of the wireless communication performed by the RF 丨D system = the old or the new 'Because the grounding wire 7 is formed on the back surface of the dielectric substrate ,, the back side of the dielectric substrate 1 is oriented toward the surface of the setting object because It is cheap to manufacture and install RFID tags that are easy to install and set up. It can be used in a wide range of fields such as logistics management, warehouse management, machine management, and vehicle entry and exit management, which require a large number of Rm tags. Even if the surface of the setting object or the setting object is a conductor such as a conductive object, it can be set. The manufacturing method of the difficult label of the first embodiment may be a method of manufacturing an RFID tag as described in the above Patent Documents 1 to 5 (the patent document 6 is a method of opening a slot in a conductor plate). An example of the manufacturing method will be described briefly using Figs. 3 and 4 . The third substrate forms a dielectric substrate for inserting the hole portion 4 of the 1C crystal #5 on one main surface of the dielectric substrate 1! A plan view (a configuration diagram of a dielectric substrate 1 having a hole portion formed therein). Further, the hole portion 4 is formed on the substrate by cutting or the like, and if the substrate is formed by the injection molding method, it is formed at the time of molding. Figure 4 is a fertilizer that will be an embodiment. The manufacturing method of the label is divided into manufacturing diagrams of (W) ~ (H), (& - 2 Bu (d 2), (H) ~ (d 3). Among the three manufacturing methods, Figure 4 ( a 1), Fig. 4 (a-2), and Fig. 4 (a-3) show the beginning of each manufacturing method.

2275-10007-PF 23 201011657 stage, the respective structures are common, and a hole portion 4 is provided on one main surface (surface) of the dielectric substrate 1, and a ground wire 7 is provided on the other main surface (back surface). status. As a method of forming the grounding wire 7, a method of manufacturing a general substrate can also be used. Further, in Fig. 4, the completed RFID tag is the same as Fig. 1(b), and is shown in a cross-sectional view corresponding to the line A-A' cut in the drawing. In the drawings, the same or corresponding parts are designated by the same symbols, and the detailed description is omitted.

The manufacturing method shown in Fig. 4 (a-1) to Fig. 4 (c-1) will be described. The 1C wafer 5 is placed in the above-mentioned Fig. 4 (a-1), that is, in the hole portion 4 of the dielectric substrate 1 in the initial state, and is in a state of 4 (b-1). Next, a wire 2 (including the slit 3 and the electrical connection portion 6) is formed on the surface of the dielectric substrate 1 by printing and vapor deposition. When the wire 2 is formed, two terminals (not shown) of the 1C wafer 5 are connected to those of the electrical connections 6, 6. Thereby, the RFID tag shown in Fig. 4 (c-1) is completed. Next, the manufacturing method shown in Fig. 4 (a-2) to Fig. 4 (d-2) will be described. This method is to form the conductor layer 21 on the surface of the dielectric substrate 1 after the 1C wafer 5 is placed on the hole portion 4 of the dielectric substrate 1_ to become the state of FIG. 4(b-2) (FIG. 4 (c) -2)), then the wire 2 (including the slot 3 and the electrical connection 6) is formed on the dielectric substrate 1 by etching and grinding the conductor layer 21'. Thereby, the RFID tag shown in FIG. 4 (d_2) is completed. Further, when the conductor layer 21 is formed, the terminal (not shown) of the 1C wafer 5 is connected to the conductor layer 2 corresponding to the position at which the electrical connection portions 6, 6 are finally formed. FIG. 4(a-3) ~ Manufacturing method shown in Figure 4 (d-3). This method is compared with the method of FIG. 4 (a-2) to FIG. 4 (d-2). Since the procedures of 2275-10007-PF 24 201011657 (d-2) and (d-3) are almost the same, Different procedures (b - and (c-3) are explained. Initially, the surface of the conductor flute 22 is opposed to the dielectric substrate ι (Fig. 4 (b-3)). At this time, the IC wafer 5 is mounted on the conductor case 22. The two terminals (not shown) of the wafer 5 are connected to the conductor foil 22 corresponding to the position where the electrical connections 邛6, 6 are finally formed. Then, the positions of the hole portion 4 and the Ic wafer 5 are matched to sway the conductor. Placed on the surface of the dielectric substrate i% Figure 4 (c-3)). Further, even in the case of such a general substrate processing method or a method other than the ruthenium label production method, there is no particular limitation on the manufacturing method as long as the configuration of the coffee slab of the embodiment is realized. As described above, the RFID tag of the embodiment i is a structure in which the ic wafer 5 is inserted into the hole portion 4 formed on one main surface of the dielectric substrate i, and the 1C wafer 5 is electrically connected to the wire 2 through wafer bonding. Even when a collision is applied to the RFID tag or the like, the damage of the Ie wafer 5 or the electrical connection failure of the 1C wafer 5 and the electrical connection portion 6 or the breakage of the connection can be greatly reduced. Further, the size of the hole portion of the dielectric substrate 1 is set such that the yield of the IC wafer 5 inserted into the hole portion * can be set with respect to the volume of the 1C wafer 5. Fig. 5 is a view showing an electric field of an electric field (in arrow I: in) of the RFID tag of the embodiment i. Also shown in Fig. 5 is a partial enlarged view of the periphery of the Ic wafer 5, in which the enlarged image of the figure shows the electric field in an arrow. The arrow shown in Fig. 5 shows the electric field between the grounding conductor 7 and the conductor 2 because these electric fields are formed between the conductors, and an electric field is made between the opposite portions of the slot 3 to generate a potential difference. The position at which the electric field is zero in the thickness of the dielectric substrate 做 is used as the feeding point of the c-chip. As shown in FIG. $j 2275-l〇〇〇7-pp 25 201011657 In the interior of the dielectric substrate 1, since the left and right electric fields cancel each other, in the longitudinal direction along the slot 3 (depth in FIG. 5) The position of the axis of the direction, the intensity of the electric field is zero. When the electrical connection portion 6 of the IC wafer 5 is disposed at this position, the feed loss can be greatly reduced. Therefore, when constructed in this way, the direction of the electric field generated on the slot 3 and the direction of the electric field of the patch antenna are suppressed to be relatively low. In addition, since the slot 3 is provided in the center of the patch antenna (wire 2) as the basis of the field 1 of the forward depolarization becomes symmetrical, the symmetry of the radiation pattern of the wire 2 can be made so good. The adverse effect of the symmetry of the radiation pattern of the wire 2 is small, which can greatly extend the distance that can be communicated, and even if the structure is simple, the effect of obtaining an RFID tag with greatly improved performance can be achieved. In the drawings, the same or corresponding parts are designated by the same reference numerals, and the detailed description thereof is omitted. Fig. 6 is a characteristic diagram showing a state of variation in characteristic impedance in the RFID tag of the first embodiment. In the above description, it is described that the wire 2 is formed only from the end portion of the dielectric substrate i with a predetermined distance d. This is because the ground wire 7 is formed over the entire other surface of the dielectric substrate 1 . As shown in FIG. 5, the predetermined distance d may be a dimensional difference in the four corners of the wire 2 and the grounding wire 7. If so, even if the grounding conductor 7 is not formed over the entire other surface of the dielectric substrate 1, the predetermined distance d can be similarly regarded as the size in the four corners of the conductor 2 and the grounding conductor 7. difference. In Fig. 6, the horizontal axis indicates the wavelength ratio of the frequency of use of the RFID tag with respect to the predetermined distance or the size difference d, and the vertical axis Κ [Ω] & Ω [Ω] indicates the real part and the imaginary part of the characteristic impedance, respectively. However, the λ system of the horizontal axis uses the frequency of 2275-10007-PF 26 201011657: long. According to the characteristic diagram of Fig. 6, the characteristic impedance of the ID tag 8 in the 'month: middle' of the predetermined distance " 〇ΐ 3λ or more is almost fixed. Therefore, by making the predetermined distance d upper, the object of the col Regardless of the state of floating in the air, since the characteristic impedance of the listening tag is almost fixed, it is possible to make wireless communication with the RFID reader 10 $ without making the performance of the rfid worse, and because the hole of the dielectric substrate 1 is made. The position where the electric field strength is zero in the position of the portion 4 can be said to be the same as the rfid label in the case where the hole portion 4 is not provided, that is, the state in which the 1C crystal 4 is not interpolated into the dielectric substrate w, and The shape of the wire of the radiating portion of the patch antenna is almost the same as the change in the characteristic impedance of the tag as in the wire 2. Embodiment 2 Embodiment 2 of the present invention will be described using Fig. 7. Fig. 7 shows the RFID of the fourth embodiment. A plan view of the structure of the standard. Figure (8) is a plan view showing the vicinity of the slot of the coffee label shown in Figure 7(a). The same symbol is used to indicate the same or Quite part 'and omitted Here, in the case of carrying out (6), two terminals (not shown) of the 1C wafer 5 are described, that is, 1 using two pins (the case of the wafer is installed at 4) In the case of the electrical connection portion 6 described in the embodiment, the two empty pads 23 and 23 are provided inside the slot 3 and are provided in the vicinity of the electrical connection portions 6, 6. These empty pads 23, 23 are formed simultaneously with the formation of the electrical connections 6, 6 and the empty pads & 23 are used as the simple 2275 for the electrical connection wires 2 and the electrical connections. 6,6 -100Q7-PF 27 201011657 Solder pad of the empty pad. Thus, since the specification of the 1C wafer 5 mounted on the RFID can be flexibly adapted, the RFID tag of simple construction can be manufactured inexpensively. The number of empty pads is not In addition, in the following third embodiment, an RFID tag having an empty pad 23 will be described. Embodiment 3 Embodiment 3 of the present invention will be described with reference to Figs. 8 to 10. Fig. 8 shows a related embodiment. Figure 3 (a) is a plan view of the RFID tag, and Figure 8 (b) is the RFID of the embodiment 3. Figure 9 is a block diagram of the RFID tag of the third embodiment, and Figure 1 is a block diagram of the RFID tag of the third embodiment. In Figures 8 to 10, the tapered slot 24 is The formation is widened in the opposite direction from the position where the IC wafer 5 is disposed, and the electrical length adjustment portion 25 is provided at the end of the wire 2 in a cut-away manner. The slot 26 is formed at an angle with respect to the side of the wire 2. And use the perturbation mode for the wire 2 to emit a circularly polarized wave slot. The same reference numerals are used to designate the same or corresponding parts in the drawings, and the detailed description thereof will be omitted. The following describes the embodiment using FIGS. 8 to 10. The structure and operation of the 3 RFID tag. In the third embodiment, the transmission and reception of the circularly polarized waves caused by the widening of the RFID tag, the method of adjusting the electrical length, and the disturbance are performed, and the basic configuration and effects of the invention are the same as those of the first and second embodiments. 8(a) and 8(b) show the widening of the label of the 1/11), and the slot 24 is tapered in a direction opposite to the position at which the 1C wafer 5 is placed. When compared with the slot 3 of Fig. 1, the opposite portions of the slot 3 are removed from the electrical connection portion 6, and a fixed width is formed in the opposite direction. Thus, by making the slot 24 tapered, it is possible to achieve a wide frequency of the frequency of use of the 卯1]} tag 2275-10007-PF 28 201011657 banding and the frequency band can be selected by adjusting the size of the taper expansion. Therefore, 'because the communication possible frequency band of the RFID system can be changed into a wide frequency band, not only the impedance can be easily matched to reduce the yield of the manufacturing error, but also the surrounding environment set via the RFID tag can be attached to the water droplet or the dirt. An RFID tag that has a strong environmental resistance to impedance changes. There is also a case where the number of pins of the terminals provided on the 1C wafer 5 is not required, and the dummy pads 23 are not required. Fig. 9 is a diagram showing a method for adjusting the electrical length of the RFID tag, and the difference between the figure and the RFID tag is as shown in the figure, the wire 2 of the electrical length adjusting portion 25 having the shape of a notch formed on the side of the wire 2 as shown. > Since the electrical length adjusting portion 25 is disposed at a position perpendicular to the slot 3, the effective electrical length of the wire 2 becomes longer than the length of the outer surface, and even if the frequency of use of the RFI] system is fixed, the wire 2 can be made The size of the RFID tag 8 is reduced as the size of the RFID tag 8 is reduced. If it is smaller than the length of the wire 2, the length of the electrical length adjusting portion 25 can be changed, and the length of the RFID tag can be adjusted to the size of the business card or the size of the matching setting object. Within the scope of the degree is possible. Therefore, because the degree of freedom of the size and shape of the label (in other words, the limitation is improved), the degree of freedom of the installation place can be made larger than before and the same as the embodiment 1 except for the adjustment of the electric length adjustment portion 25. Since the thickness of the dielectric substrate and the relative dielectric constant of the wire 2 and the size of the slot 3 are greatly related to each other by matching and adjusting these conditions, the size of the _8 and the desired radiation field can be obtained. Type and gain. Further, it may be provided only on the side of the wire 2. 2275-10007-PF 29 201011657 Figure 10 is related to the transmission and reception of circular polarized waves caused by the disturbance of the RFID tag, and the significant difference from the RFID tag of Figure i is as shown in Figure 1, the slot 26 The position is set obliquely with respect to the wire 2. When compared with the slot 3 of the soil, the slot 26 is inclined by about 45 around the IC wafer 5. It is formed (the direction of the tilt is determined by whether the radio wave received and received is dextrorotatory or left-handed). Since it is placed at such a position, the slot 26 acts as a disturbance element (the perturbation element) of the wire 2. That is, approximately, a circularly polarized wave of a radiation field type of a radiation field type which can be transmitted and received with a radiation field type which is close to the radiation field type of the RFID tag of FIG. The RFI β is classified, and even if the circularly polarized wave is used for wireless communication of the RFII) system, a correspondence is possible. Additionally, in general, although the disturbance element is inclined about 45 relative to the wire 2. However, in order to obtain a good radiation field type by the influence of the feeding point, the inclination angle is not , 'spoon 45', and the crucible must be finely adjusted. However, since the present invention sets the feed point (1C wafer 5) at a position where the electric field is 〇, the width of the fine adjustment is narrowed toward the ground' and the adjustment becomes easy. Further, in the third embodiment, the electric length adjustment method by the RFID tag, the wide band, and the transmission and reception of the circular polarization caused by the disturbance can be combined and implemented. Embodiment 4 FIG. 11 shows the structure of an RFID tag of Embodiment 4. Figure U(a) is a plan view of the RFID tag, and Figure ii(b) is a cross-sectional view taken along line a-a' in Figure u(a) (the state in which there is no film substrate on the wire and the ground wire) Fig. 11 (c) is a cross-sectional view taken along line AA of Fig. 11 (a). In Fig. 1*1, the dielectric substrate is a dielectric substrate composed of, for example, a low-hardness (e.g., 2275-10007-PF 30 201011657 J I S-A5 5) thin-smoke thermoplastic 5 to rubber. As the molten fluid resin, although it is not necessarily a molten organic substance such as plastic, it may be a thixotropy inorganic fluid or active fluid having a town alloy or the like, but the selection may have an approximately corresponding RFID setting. A low-hardness material with curved curvature of the surface. Of course, the curvature of the surface that can be set is bounded. In other words, it depends on the limit value of the curvature of the low-hardness material to be used (the predetermined curvature film substrate 2 is disposed on the wire 3 provided on one main surface (surface) of the dielectric substrate ,, and The grounding lead 8 provided on the other main surface (back surface) of the dielectric substrate 后 will be described later. Φ The film substrate 2' can be made of a film of polyethylene terephthalate (PET) or polyamine. Polyethylene naphthalene dicarboxylate, polyethylene gas, etc., the wire 3 or the ground wire 8' is formed by vacuum evaporation, electroplating, printing, etc. Further, the film substrate 2 may have other softness. The person may also be a substrate which is not so, and may be transparent or colored translucent. As shown in FIG. 11(b), the wire 3' and the grounding wire 8 may not be formed on the film substrate 2. ', the wire, 3 and the grounding wire 8 are formed directly on the dielectric substrate 丨' by printing, etc. Moreover, in the case where the film substrate 2' is transparent in the figure u(a), the film substrate is passed through the film substrate. 2, see the dielectric substrate Γ (four) state. Below 'Although the film substrate is used only on the wire 2 The illustration of the invention is also applicable to the foot strap of the grounding conductor 8. or the RFID label of the film substrate 2 only on the = line 8. It is assumed here that the film substrate 2' and Electrical substrate 1, in the plane

2275-10007-PF 31 201011657

Same size. The wire 3' is a wire provided on the film substrate 2'. As shown in Fig. 11 (a), the lead wire 3' is formed on the inner side of the film substrate 2' from the longitudinal direction and the lateral direction of the film substrate 2' with only a distance d therebetween. In this case, it can be said that the lead wire 3' is formed on the inner side thereof only from the end portion of the dielectric substrate 纵向 in the longitudinal direction and the lateral direction with a distance d therebetween. On the other hand, the film substrate 2 can be placed on one main surface of the dielectric substrate with a distance d from the longitudinal and lateral ends of the dielectric substrate 1'. At this time, the wire 3 can also be disposed on the entire film substrate 2'. As shown in Fig. 11 (a), an elongated slot 4' is formed in the center portion of the wire 3, and the slot 4 is formed by etching the wire 3, etching, and grinding. Of course, the wire 3 may be formed by etching, vacuum evaporation, plating, printing, or the like, while forming the slit 4'. Then, the length and width of the slot 4 can be determined according to the frequency of use. The hole portion 5 is formed in a hole portion on one main surface of the dielectric substrate 1. The 1C wafer 6' is composed of a memory or the like which will be described later. This Ic wafer 6 is electrically connected to the wire 3' via the slot 4. Here, the connection structure of the 1C wafer 6 and the wires 3 will be described. As shown in Figs. 11(a) and (b), 7' and 7 are formed from the width of the slot 4.

Inwardly opposite sides of the wires 3, 3, respectively, extend to the inner protruding protruding electrical connection portions of the slot 4, and are continuously connected to electrically connect the slots 4' (four) side (four) wires 3, 3,. These electrical connecting portions 7, 7 can be connected to the electrical connecting portions 7, 7, by a terminal (not shown) which forms a "c crystal" while forming a wire 3' by etching.

The size of the wafer 6' is the same as the slot 4, @width U will be within the width of the slot, at this time, the IC chip 6, (four) sub (not shown y') 2275-10007-pp 32 201011657 is connected to the electrical connection portion 7, , Γ connect. However, when the size of the 1C wafer 6' is larger than the width of the slot 4, the terminal (not shown) of the 1C wafer can be electrically connected to the portion of the lead 3' passing through the slot close to the slot 4'. Therefore, in this case, it is not necessary to provide the electrical connecting portions 7, Ί' as described above. Further, although the center portion is disposed in the longitudinal direction of the 1C crystal in Fig. 11(a), it may be disposed along the slot 4 provided in Fig. 11(a) instead of being disposed at the center portion thereof. The end portion of the slot 4 in which the arrow moves in the longitudinal direction is formed by bending the dielectric substrate 1' when the RFID tag is folded or folded in the line along the longitudinal direction of the slot 4'. The tensile stress on the wire 3, (IC crystal ",) becomes larger toward the end of the RFID tag from the line along the length direction of the slot 4, in other words, the tensile stress applied to the IC chip 6 is small. Therefore, there is no problem. However, in the line along the width direction of the slot 4, or any line other than the length direction, only the HD mark is folded or the mountain is not good. The tensile stress on the wire 3' (IC chip 6,) generated by the bending becomes larger toward the end of the RFID tag from any line on the line along the width direction of the slot hole or other than the length direction. When the 1C wafer 6 is separated from the central portion of the RFII) tag, the 1C wafer 6 is connected. And the possibility of the wire 3. There is a decrease in the hole portion 5 due to the tensile stress due to the tensile stress, and its depth and its wide production, "" into the 曰 片 6 in ic曰", the size of the iC chip. Of course, when the molding material is placed around the c-strip 6 ^ ^ 1 峙 'hole 5 must become

2275-l〇〇〇7^PF 33 201011657 is larger than the shape of the 1C wafer 6'. Regarding the position at which the hole portion 5 is formed, it is determined depending on which position of the slot 4 is placed in the 1C wafer 6. In any case, the shape and size of the slot 4 must match the number and characteristic impedance of the electrical connection 7 of the mounted 1C wafer β'. For example, in order to obtain impedance matching, in addition to the shape of the micro-adjusting slot 4, in the case where the connection terminal of the 1C wafer 6' is two, two electrical circuits having an impedance matching width can be formed. Connection portion 7'. Moreover, the grounding conductor ❹8 is a grounding conductor disposed on the other main surface (back surface) of the dielectric bonding: the adhesive sheet 9' is adhered to the dielectric substrate 卩 and the wire 3, or the film base forming the grounding wire 8 Adhesive sheet of 2'. The adhesive sheet 9 is provided with a portion corresponding to a portion other than the κ wafer (hole portion 5) on the surface (a main surface) of the dielectric substrate 形成 on which the wire 3' is formed to adhere and fix the dielectric substrate 1 and Film substrate 2'. Further, an adhesive method other than the adhesive sheet 9' can also be employed. Fig. 12(a) is a conceptual diagram showing a case where φ transmission reception is performed between the rFID tag and the RFII) reader/writer. Fig. 12 (b) is a block diagram of an RFID tag. Fig. 4 is a block diagram showing the internal structure of the IC chip 6 in a functional manner. In Fig. 12 (a) and (b), the RFID tag 1 〇 ' is an RFID tag of the structure shown in Fig. 11. The antenna portion u provided in the rFIE) tag 1 is equivalent to the wire 3 in which the slot 4 is formed in Fig. 11. As shown in the above-mentioned FIGS. 11 and 11(b), in the antenna portion 11 of the rfid tag, the lead wire 3'' having the slot 4' is provided on one main surface (surface) of the dielectric substrate 且. A ground lead 8 is provided on the other main surface (back surface) of the dielectric substrate 1, so that the RFID tag 1 〇' is used as a patch antenna. That is, having the slot 34

2275-10007-PF 201011657 4, the wire 3 is used as the antenna field type (radiation part). The wire 3, and the slot 4, are adjusted to match the impedance of the π-wafer 6 to the frequency of use of the rfid system for excitation. Since this adjustment is also related to the thickness of the dielectric substrate = = relative dielectric constant, the desired radiation field type and gain can be obtained by adjusting and designing in accordance with these conditions. Further, the slot 4 is shaped f in the central portion of the wire 3 so that the radiation pattern of the wire 3 is improved as described. By adjusting and designing in accordance with these conditions, the desired radiation pattern and gain in the RFID tag can be obtained, and the RFID tag 10 (that is, the dielectric substrate 1) can be enlarged, and a communication distance of, for example, about i8 mm can be obtained. Further, the antenna unit 13 is provided on the RFID reader/writer 12', and the antenna 13 is connected to the antenna unit 11 of the RFID tag 10 to perform wireless communication. The 1C wafer 6' is an Ic wafer described in Fig. π, and its specific structure is as shown in Fig. 12(b). The analogy unit ι4 receives the transmitted wave from the RFID reader/writer 12' via the antenna portion 11' of the rFII) tag 1〇' and outputs it to the digital circuit 21 of the subsequent stage, analogous portion. The a/D conversion unit 15' A/D conversion unit that converts the A/D conversion of the sinusoidal transmission wave, and the power supply control unit 16 smoothes the transmission wave received by the analog unit 1Γ by the rectification circuit to generate electric power, and performs the RFID tag.电源10's the power supply control unit for the feeding and power control of each circuit. The memory unit 17' is attached to the RFID tag 10 and stores a memory portion of tag information such as solid identification information. The demodulation unit 18' is a demodulation unit that demodulates the transmission wave, and the control unit 19' controls the circuit in the 1C chip 6' including the memory unit 17' based on the transmission wave demodulated by the demodulation unit 18'. Control department. The modulation unit 20' is a modulation unit that changes information extracted from the storage unit 2275-10007-PF 35 201011657 17,' via the control unit 19. The digital unit 2i is composed of a demodulation unit 15'' control unit 16' and a modulation unit 17. The D/A conversion unit converts the transmitted signal β/Α from the modulation unit 20, and rotates it to the D/A conversion unit of the analog unit 14'. Here, the basic operation of such an RF D system is explained. According to the use of such an RFID system (access control and logistics management of biological items), the tag information is stored in the memory unit 17 of the RFID tag 1 , and the RFID reader 12 ′ is in its own transmission and reception area. The tag information can be updated, written or read out when the rfid tag β 10' (attached to the object being used as the object of access control management and logistics management) is present or moved. The RFID reader/writer 12' transmits a command signal for instructing the RFID tag 1〇, updating, writing, or reading as a transmission wave from the antenna portion 13 of the RFID reader/writer 12 to the antenna portion of the KFID tag 1〇.天线, eRFI]) The antenna unit U of the tag 10 receives the transmission wave, and the transmission wave is detected by the power supply control unit 16. The battery is stored (smoothed) to generate an RFI]) tag, and the operation power is supplied and operated. The power is supplied to each circuit of the RFID tag. Further, the transmission wave is demodulated by the demodulation unit 丨8. The control unit 19 performs data processing on the command content of the demodulated command signal, and instructs the memory unit 17' to perform either or both of updating, writing, or reading of the tag information, according to the control unit 19 The readout signal outputted from the memory unit 17 is modulated into a reply wave via the modulation unit 2, and the analogy portion is transmitted from the antenna unit to the antenna unit 13 of the RFID reader/writer, ..., RFID The reader/writer 12 receives the readout signal and obtains the desired information. 2275-10007-PF 36

201011657 In the operation of the system of 'in detail using the RFII of the embodiment 4', the reader/writer 12 will command the RFID tag 10 to update, write or read the command signal as a transmission wave. The antenna portion 13' of the reader/writer 12 is transmitted to the antenna portion 11 of the RFID tag 10. The wire 3' of the radiation portion of the radio wave constituting the dielectric substrate 构成 constituting the RFID tag 1 receives a transmission wave 'a potential difference Between the opposite portions of the slot 4' to supply the transmission wave to the IC wafer 6', As described above, the transmission wave supplied to the IC chip 6' is detected and stored (smoothed) via the power supply control unit 16, and the operation power of the RFID tag 1 is generated, and the operation power is supplied to the RFID tag. Each of the circuits GC chip 6) command 彳5 is demodulated from the transmission wave, and the command information of the demodulated command signal is used to update, write or read the tag information to the memory unit 17. Either or both, the readout signal outputted by the memory unit 17 is used as a reply wave and the transmission wave is supplied to the IC chip 6, and the same path is transmitted from the wire 3' serving as the radiation portion to the return wave. The RFID reader/writer 12, the antenna portion 13' of the RFID reader/writer 12 receives the echo wave to obtain a desired μ signal. The content of the data of the wireless communication performed by the RFID system may be old or new. Since the grounding wire 8 is formed on the back surface of the dielectric substrate, the back side of the dielectric substrate 1 is oriented toward the surface of the object to be placed because It is cheap to manufacture and design a simple RFID tag with a conductor or a non-conductor. Therefore, logistics management, warehouse management, machine management, and car entry and exit management are required in a large number of tags. It can be used in a wide range of fields, even if the surface of the setting object or the setting object is a conductor such as a conductive object. 2275—10007-PF 37 201011657 Next, FIGS. 13( a ) to 13 ( d ) show a method of forming the lead 3 ′ and a method of mounting the 1 C wafer 6 in the method of manufacturing the RFID tag according to the embodiment, based on a cross-sectional view thereof. Each manufacturing step. In Fig. 13 (a), a conductor layer forming step of forming the conductor layer 23 on the film substrate 2' (the back side of the film substrate 2') is shown. As shown in FIG. 13(b), it is shown that the region where the wire 3' should be formed and the inner portion of the slot 4' should be shielded by the electrical connection portions 7', 7', and the wire 3' is formed by etching or the like. The wire forming step of the electrical connections 7', 7'. Further, the conductor layer forming step may not be performed on the film β substrate 2', and a wire may be formed on the film substrate. As shown in Figs. 13(c) and 13(d), in the 1C wafer connection step, the connection terminals 24' and 24 of the 1C wafer 6' are electrically connected to the electrical connection portions 7' and 7' via soldering. To do this electrical connection method, although it is generally a thermocompression bonding by reflow, it can be connected by other methods. In the drawings, the same or corresponding parts are designated by the same reference numerals, and the detailed description is omitted. Further, Fig. 14 is a plan view showing the formation of a conductor layer on the entire surface of the film substrate. Fig. 15 (a) is a rear view showing the wire 3' and the slit 4, and the film substrate 2' thereafter. As shown in Fig. 14, it is shown that the conductor layer 2' is entirely formed on the back side of the film substrate 2, and the end portion of the film substrate 2' (dielectric substrate 透过) is transmitted through a residual process or the like. The structure of the wire 3' after the conductor layer of the portion of the slot 4' except the electrical connection portions 7, 7' is separated only by the peripheral portion of the predetermined distance d. The structure of the film substrate 2' when viewed from the surface of the film substrate 2' at this time is shown in Fig. 15(b). The film substrate 2' is transparent or translucent. Further, Fig. 16(a) 2275-10007-PF 38 201011657 is a rear view showing a state in which the 1C wafer 6' is attached to the inside of the slit 4 on the film substrate 2. Fig. 16 (b) is a view showing a state in which the 1C wafer 6 is attached to the film substrate 2' as viewed from the surface side of the film substrate 2, and electrical connection can be seen through the transparent or translucent film substrate 2'. Part 7, 7, and 1C wafer 6'. As shown in FIG. 17, the film substrate 2' thus produced is attached to a dielectric substrate factory which is formed into a hole portion 5 by etching, grinding, or the like (it can also be provided on the injection molding die at the time of injection molding). The protrusions of the hole portion 5 are formed to form the hole portion 5, for manufacturing the 叮11) label. 17 is a surface view (top view) of a dielectric substrate having a hole portion, which is formed with a dielectric substrate 1 for inserting a 1C wafer 6 into a hole portion 5' of a main surface of a dielectric substrate 丨', . In the drawings, the same or corresponding parts are designated by the same reference numerals, and the detailed description is omitted. The lead 3' may be formed on the dielectric substrate without using the film substrate 2', and the 1C wafer 6 may be placed on the hole portion 5' of the dielectric substrate, and then printed, vapor-deposited, etc. The wire 3 is disposed on a main surface of the dielectric substrate 。. Further, after the IC wafer 6 is attached to a conductive film such as a copper junction, the conductive film may be fixed to one main surface of the dielectric substrate, and the conductive film may be etched to form the wires 3. In this case, it is not necessary to say that the 1C wafer 6' must be mounted at a position where the conductive film finally becomes the slot 4' (electrical connection portion 7,) by etching or the like. After the completion of the 叮(7) label, if the film substrate 2 is removed from the RFID package, the rfid label without the film substrate 2 can be produced without using the above method. Figure 18. is an electric field diagram showing the electric field of the RFID tag of the embodiment (in arrows 2275-10007 - Pf 39 201011657). Also shown in Fig. 18 is a 1C wafer 6, a partial enlarged view of the periphery, and an electric field is indicated by an arrow in the enlarged view. In the drawings, the same or corresponding parts are designated by the same symbols, and the detailed description is omitted. The arrows shown in Fig. 18 show the electric field between the grounding conductor 8 and the conductor 3' because these electric fields are formed between the conductors, and the electric field is made between the opposite portions of the slots 4' to generate a potential difference. A position at which the electric field is zero in the thickness direction of the dielectric substrate 做 is used as a feeding point of the ic wafer. As shown in FIG. 18, in the interior of the dielectric substrate ,, since the left and right electric fields cancel each other 'in the position along the slot 4, the long axis direction (the depth direction in FIG. 18), the electric field The intensity is zero. Therefore, if the electrical connection portion 7 of the 1C wafer 6' is disposed at this position, the feed loss can be greatly reduced. Thus, when configured in this way, the adverse effect on the symmetry of the radiation pattern of the wire 3 becomes small. It can greatly extend the distance that can be communicated. 'And even if the structure is simple, it can achieve the effect of greatly improving the performance of the standard iron. Fig. 19 is a characteristic diagram showing the appearance of a characteristic impedance change in the RFID tag of the embodiment. In the drawings, the same symbols are used to designate the same or equivalent, and the P-cut is omitted. In the foregoing, although it is described that the guide is formed only from the end portion of the thin 2' by a predetermined distance d, this is because the other main surface of the AA £+ board 1 is on the medium. As shown in FIG. 18, the predetermined distance d can be four corners of the wire 3, and the grounding wire 8, and the other two of the dielectric substrate 即使In the case where the grounding conductor 8 is formed over the entire surface, the predetermined distance d can be regarded as the conductor 3 and the grounding conductor

2275-10007-PF 40 201011657 The difference in size between the four corners of 8'. In Fig. 19, the horizontal axis indicates the wavelength ratio of the frequency of use of the RFID tag with a predetermined distance or size difference d, and the vertical axes R[Q] and χ[Ω] indicate the real part and the imaginary part of the characteristic impedance, respectively. However, the λ of the horizontal axis uses the wavelength of the frequency. According to the characteristic diagram of Fig. 19, in the case where the predetermined distance d is 0.13λ or more, the characteristic impedance of the RFID tag 1〇 is almost fixed. Therefore, by making the predetermined distance 4 〇ΐ3λ or more, regardless of the object to which the RFID tag is set to be a conductor or a non-conductor, even if it is floating in the air, since the characteristic impedance of the RFID tag is almost fixed, the RFID can be prevented. The performance is degraded, making wireless communication with the rfid reader possible. Further, since the electric field intensity is zero at the position of the hole portion 5' of the dielectric substrate p, it can be said that the characteristic impedance of the RFID tag is almost the same in the case where the hole portion 5' is not provided. Fig. 20 is a plan view showing the structure of the RFID tag of the embodiment 4. Fig. 21 is a plan view showing the periphery of the slot shown in Fig. 20. Fig. 2 (&) is a plan view when the 1C wafer is not mounted, and Fig. 21(b) is a plan view when the 1C wafer is mounted. Heretofore, although two connection terminals 24 have been described, that is, a case where two pins of a 1C wafer are used, in the case where four connection 1C wafers are mounted, in the electrical connection portion 7, On one of the 7's, the two empty pads 25, 25 are placed inside the slot 4 and are disposed in the vicinity of the connection terminal. These empty pads 25, 25 are formed simultaneously with the formation of the electrical connections 7', 7'. Further, from Fig. 20 and Fig. 21, the empty pads 25, 25 which can be seen through the film substrate are used as the unconnected wires 3, and the electrical connecting portions 7', 7 and η are smeared twice. Solder pad pads. Thus, since the specification of the 1C wafer 6 mounted on the upper 2275-1 〇 41 201011657 can be flexibly adapted, the RFID tag having a simple structure can be manufactured inexpensively. The number of empty pads is not limited to two. In the drawings, the same or corresponding parts are designated by the same reference numerals, and the detailed description is omitted. As described above, the RFID tag of the fourth embodiment has the advantages of not causing expansion by the wafer 6', not only a flat surface, but also a curved surface-shaped mounting surface having a predetermined curvature, and further, the lifting is illustrated by Figs. The structure of the performance. Fig. 22 is a view showing the shape of the grounding conductor of the RF ID tag of the fourth embodiment, and Fig. 22(a) is a view showing the shape of the grounding conductor of the lattice pattern, and Fig. 22(a) is a view showing the shape of the grounding conductor of the meandering pattern. Fig. 23 is a view showing the shape of a metal fiber board for a grounding conductor of the RFID tag of the fourth embodiment. Fig. 23 (a) is a surface view of a metal fiber board, Fig. 23 (b) is a cross-sectional view taken along line A-A' in Fig. 23 (a), and Fig. 23 (c) is shown in Fig. 23 (b) A pattern diagram of an external force applied to a metal fiberboard. Figure 24 is a view showing the shape of a metal fiber board for a grounding conductor of the RFID tag of Embodiment 4, Figure 24 (3) is a shape diagram of a grounding conductor of a lattice pattern, and Figure 24 (a) is a shape diagram of a grounding conductor of a meandering pattern. The grounding wire 26' is a grounding wire 'notch portion 27 having a lattice pattern in a lattice shape, and is a notch portion of the grounding wire 26'. The grounding wire 28' has a meandering shape by a notch portion 29'. A zigzag pattern. The metal fiber board 3 is a metal fiber board which is usually used for electromagnetic shielding or static electricity prevention plates, such as a number of thick stainless steel fiberboard. The grounding wire 31 cuts the metal fiber board 3' in a lattice shape and has a lattice pattern. The notch portion 32 is a notch portion of the grounding wire 31. The grounding wire 33 is formed by meandering the metal fiber board 3〇, the grounding wire having a meandering pattern, 34, the grounding wire 33, and (4) the mouth. In the figure, 2275-10007-ρρ 42 201011657 are denoted by the same reference numerals, and the description thereof will be omitted.砰, 田, so far, although the electrical connection has been described as the reliability of the antenna 3, (electrical connection 7,) and ^6' of the antenna field type when bending the r-label 10', the RFID tag is bent through 1〇,, not only the electrical connection wires 3, (electrical connections 7, 7, 7) and /1 (: the wafer 6'' also affects the wires 3' and the dielectric substrate [, and the grounding conductor 8, The adhesion of the dielectric substrate 1' is adversely affected by the tensile stress generated by the bending of the dielectric substrate r (RFID tag). In particular, the grounding is generally provided on the entire other main surface (back surface) of the dielectric substrate The wire 8 causes a bad influence. For example, the #RFID tag f is curved so that the ground wire 8' side (the other main surface side of the dielectric substrate 1') becomes a valley, from the end of the dielectric substrate 朝向 toward the dielectric The outer side of the substrate 丨' causes a large tensile stress on the grounding conductor 8, and there is a possibility that the grounding conductor 8 of the end of the dielectric substrate 丨' is broken or peeled off from the dielectric substrate 。. The label is bent so that the grounding wire 8 is on the side (the other of the dielectric substrate is When the surface side becomes a mountain, a large tensile stress is generated on the ground lead 8 from the end of the dielectric substrate 朝向 toward the center of the dielectric substrate ', and the ground lead 8 of the dielectric substrate , is loosened. The possibility of the dielectric substrate being peeled off or the grounding wire 8, the adhesion to the substrate, and the bending of the RFID tag such that the grounding wire 8 is turned into the same valley as the grounding wire 8 having the end of the dielectric substrate 1 'The possibility of breaking or peeling off from the dielectric substrate. The following description replaces the grounding conductor 8'' through the use of the grounding conductors 26' and 28', the metal fiberboard 3〇, 2275-10007-PF 43 201011657 = = 3 (The grounding conductors 3ι' and ^ caused by r, as the grounding body of the state d ' can reduce the problems caused by the grounding conductor of the _ standard when bending the RFID tag. : 22(a) and (b) The grounding conductors and the grounding conductors 28' of the zigzag pattern are shown with the grounding conductors 8', and the notched portions 27, 29 of the blades are passed through the notched portions W and attached to the grounding conductors. The overall tensile stress is released through the notch 27, ❹ However, the possibility of the grounding conductor plate 1 being broken by the breaking or loosening is greatly reduced. Moreover, the shape of the notch portion is not limited to the one shown in Figs. 22U) and (8), and the protective grounding conductor is not subjected to tensile stress.

The adverse effects caused by the ancient eight A swear to operate as a grounding conductor for the RFID tag. In other words, it can be electrically connected to the ground conductor 8, which is equivalent. Further, the shape of the plurality of notch portions need not be the same, and the "notch portion having a large tensile stress and a large vertical arrangement area" and "the area of the notch portion is gradually increased toward a position where the tensile stress is increased" and "outside the rectangle" The shape of the circular shape, such as a circular shape, etc., the hardness of the dielectric substrate 1, the position and size of the κ crystal, and the curvature of the surface on which the RFID tag (attach) is placed are weighed to select the grounding wire. The amount of thinning or thinning of the conductor. The expressions such as "cut" and "notch" are used to refer to the shape, and are not limited to those formed by actually cutting the wire after the grounding wire is formed, and may be formed as described above. The slot 4 of the wire 3, the various techniques of the pattern of the statue. Further, instead of forming the notch portion, the metal fiber plate 30' shown in Figs. 23(a) to (c) may be used instead of the ground wire 8. The metal fiber board is a plate-shaped conductor of woven metal fiber, and the thickness (long section) is thin, except that it can be made. 2275-10007-PF 44 201011657 is the grounding conductor of the RFID tag, as shown in Fig. 23(c), The deformation caused by the external force has sufficient flexibility to replace the notch portion as a cushioning material for tensile stress. Further, since it is in the form of a thin plate, the shape can be freely changed by die cutting or the like 'as shown in FIG. 2', a notch portion can be added to the metal fiber board to improve the performance of the cushioning material as the tensile stress and to make the metal fiber board. Lighten. Further, the characteristics other than the metal fiber board and the grounding wire 26 forming the lattice pattern shown in Fig. 22, and the grounding wire 28 forming the meandering pattern or the above contents in Fig. 18 (the description of the paragraph number "〇〇75") Since they are the same, the description of the metal fiber sheet 31 forming the lattice pattern and the metal fiber sheet 33' forming the meander pattern shown in Fig. 24 will be omitted. Further, since the shape can be freely changed by die cutting or the like as described above, the metal fiber board 30 can be used not only for the grounding wire 8' but also for the wire 3. Since the metal fiber is easily provided with a hole at a desired position during the manufacturing (braiding), it is possible to provide the opening and the number of holes of the cushioning material which is a tensile stress at the time of manufacture, and replace the notch portion with it. The procedure of actually attaching the RFID tag of the fourth embodiment to a curved surface will be described with reference to Figs. Figure 25 is a view showing the configuration of an RFID tag of the fourth embodiment. Figure 25 (a) is a cross-sectional view taken along line A_A' in Figure u (a) ' Figure 25 (b) is the RFID shown in Figure n (b) of the double-sided tape formed on the grounding wire Label, in Figure 25, grounding conductor belly grounding conductor 8', grounding conductor (grid) 26, grounding conductor (zigzag) 28, metal fiberboard 30, grounding conductor (grid) 31, grounding conductor Ground wire (grounding conductor layer) of any of (zigzag) 33'. The double-sided tape 35' is placed on the lower portion of the grounding wire 8'. In the drawings, the same or equivalent parts are designated by the same symbols 2275-10007-PF 45 201011657, and the detailed description thereof is omitted. When the RFID tag of the fourth embodiment is attached to the object to be managed, since the wire 3 as the antenna field type is formed, one main surface side of the dielectric substrate 1' faces outward to be easily received from the RFID reading. The radio wave of the writer must be provided with a material (adhesive layer) fixed to the installation surface of the object to be managed on the other main surface side of the dielectric substrate 1 on which the grounding conductor 8x is formed. Depending on the material of the setting surface, this fixed material is usually sufficient using commercially available double-sided tape. Further, in the case where the conductive layer is used for the adhesive layer and the notch portion is provided on the lead wire 8χ, even if the area of the notch portion is increased, the rFID mark which is operated with sufficient performance after the setting can be obtained, depending on the case, The RFID tag can be operated even if the wire 8x is not placed on the dielectric substrate. However, the operation of the rFID tag before the setting is not guaranteed at this time. Fig. 26 is a view showing the configuration of the RFID tag and the RFID tag setting object of the fourth embodiment, and Fig. 26(a) is the RFID tag shown in Fig. 25(b). 26(b) is an RFID tag setting object (the mounting surface is convex), and FIG. 26(c) _ is an RFiD tag setting object (the setting surface is concave), which are respectively provided with symbols 36', 37' . In the drawings, the same or corresponding parts are designated by the same reference numerals, and the detailed description is omitted. In the nature of the RFID tag of the present invention, the RFID tag setting objects 36' and 37' may or may not be conductors. The surface of the rfID tag shown in Fig. 26(a) opposite to the face to which the RFID tag is attached is placed on the RFID tag setting object 36' or 37'. Next, the installation of the RFID tag setting object 36 will be described using FIG.

And the state after 37'. 27 is a configuration diagram of an RFID tag and an RFID 2275-10007-PF 46 201011657 tag of the fourth embodiment, and FIG. 27(a) is a device for setting an RFID tag (the mounting surface is convex). In the RFID tag, FIG. 27(b) is provided in the RFID tag setting object (the mounting surface is concave). In the drawings, the same or corresponding portions are designated by the same reference numerals, and the detailed description thereof is omitted. As shown in Fig. 27, the RFII of the present embodiment 4 has a convex or concave surface, which is as easy as a flat surface. It is set that even if the wire 3, the bending 'has not changed due to the electrical length, although the radiation field type is slightly deformed, the operation of the radio wave radiating portion of the wire 3' as the RFID tag is unobstructed. Further, in addition to the (FIG. 27 (a) and (b)), the RFID tag setting object in which the undulations (fluctuations) are present on the installation surface can be set if the undulations (fluctuations) are to some extent. In the fourth embodiment of the present invention as described above, an olefin-based thermoplastic elastomer or the like having a low hardness (for example, JIS-A55) is used to manufacture a dielectric substrate Γ 'since a flexible dielectric substrate can be manufactured The resulting flexible RFID tag 'is available in RFII that can be placed along the φ surface of an object having a curved surface such as a steel drum. In addition, the resin-molded substrate can be used not only for a dielectric substrate that is molded by a resin (thermoplastic resin) but also for a dielectric substrate that is formed by laminating a plurality of printed substrates, thereby reducing the substrate cost (manufacturing cost). The dielectric material (material) of the dielectric substrate of the RFID tag is difficult to manufacture in any thickness in the case of a dielectric such as polytetrafluoroethylene (fluororesin), ceramic, or epoxy glass which is generally used for a printed circuit board. The substrate can be flexibly adapted to the change in the size required by the RFID-set mounting position. Since the thickness and shape can be easily changed by merely changing the mold in the resin-molded substrate, various changes can be easily made 2275- 10007-PF 47 201011657 RFID tag. In addition, Leisho uses a thin-type polymer resin having a low dielectric dissipating factor in a resin (thermoplastic resin) as a dielectric substrate labeled with milk D to improve radiation efficiency and produce high gain. Standard. The thinner &amplifier& resin has a specific gravity of about half that of a general printed substrate, so that the RFID tag can be made lighter. In addition, when mounted on a hard and thick material of a dielectric substrate made of polytetrafluoroethylene (fluororesin), ceramic enamel, epoxy glass or the like which is generally used on a printed substrate, the '1C label 6 does not have The special equipment to be installed has to be installed one by one and it takes time. As for the resin-molded substrate, many devices for mounting the 1C wafer 6' to the film substrate 2 are available on the market, and the hole portion 5 can be produced in large quantities at one time. 'The formation can greatly reduce manufacturing time and cost. Even in the following embodiment 5, the advantages can be said to be the same. [Embodiment 5] In Embodiment 4, an RFID tag attachable to a curved surface depending on the position of the 1C wafer 6, and the shape and material of the grounding conductor is described. In the fifth embodiment, the description will be further described with reference to FIGS. 28 to 35. The reliability of the electrical connection of the Ic chip and the wire (slot, electrical connection) can be attached to the curved RFID tag. In the drawings, the same or corresponding parts are designated by the same reference numerals, and the detailed description is omitted. In the fifth embodiment, a substrate having a higher hardness than the periphery of the IC wafer 6' (the low-hardness dielectric substrate shown in the embodiment 4) is formed to improve the electrical connection between the IC chip and the wires. The reliability of the substrate portion (the end portion of the RFID tag) in which the tensile stress caused by the curved RFID tag has a large adverse effect on the grounding wire or the like is more curved, using the countermeasures shown in Embodiment 4, 2275-10007-pf 48 201011657. Enhanced RFID tags. In other words, it is possible to use a substrate having a high hardness on a portion where a low-hardness substrate is affected by bending of the RFID tag due to bending of the RFID tag, and it can be said that a pair of substrates having a high hardness is disposed on a substrate having a high hardness. The position of the electrical connection of the IC wafer and the wire with weaker resistance to bending. Referring to the specific configuration, the size of the outer surface feature (the shape of the RFID tag and the size of the slot) on the surface of the rfID label of the embodiment 5 is the same as the RF ID label of the embodiment 4, because After comparison and explanation, it can be preferentially understood that, in fact, due to the material constant (dielectric constant, dielectric dissipation factor, etc.) of the dielectric substrate 实施 in Example 4 and the composite dielectric substrate in Example 5 (using dielectric The material constants of the substrate 丨 and other dielectric substrates are not the same. As the RFID tag, the RF ID tag of the embodiment 5 is equivalent to the rf ID tag & Performance 'The dimensions of the RFID tag (conductor and substrate) must be adjusted. Of course, the distance d. also changes. Therefore, in the fourth embodiment and the fifth embodiment, it can be said that the respective sizes of the RFID tags are different. In the embodiment 5, it can be said that these are the same in the specification of some kinds of rFII. 28 is a configuration diagram of the RFID tag of the fifth embodiment, and FIG. 28(3) is a plan view of the RFID tag. FIG. 28(b) is a front view when the line A-A' is cut in FIG. 28(a). Figure 29 is a configuration diagram of the RFID tag of Embodiment 5, Figure 29(a) is a plan view of the RFID tag, and Figure 29'(b) is in Figure 29(a) 2275 - 10007 - FT 49 201011657 by A_A' line Sectional view at the time of cutting. In the RFID tag 38 shown in FIG. 28, the first dielectric substrate 39 is made of the same material as the dielectric substrate, and the circular recess 40' is provided on the first dielectric substrate 39. On the main face. The second dielectric substrate 41 is inserted into the concave portion 40 (or the concave portion 44, the concave portion 46, the concave portion 48, the through hole 50, the through hole 52, and the step portion 54), which will be described later, and has a ratio The dielectric substrate 39 has a high hardness. The hole portion 42' is formed on the second dielectric substrate 41' on one main surface side of the i dielectric substrate 39, and is equal to the hole portion 5 of the fourth embodiment. In the RFID tag 43 shown in Fig. 29, a rectangular recess 44 is provided in a rectangular recess on one main surface of the second dielectric substrate 39. As shown in FIG. 28 and FIG. 29, the second dielectric substrate 41' of the hole portion 42 on which the IC wafer 6 is placed is formed by using a substrate having a higher hardness than the first dielectric substrate 39', thereby reducing the RFII) label. The bending of 38' or RFID tag 43, affects the electrical connection of 1C wafer 6' and wire 3, (electrical connections, 7,). Further, the cross-sectional shapes of the recessed portions 4A, 44' and the second dielectric substrate are not limited to a circular shape and a rectangular shape, and may be an elliptical shape, a cross shape, a star shape, or a polygonal shape. When the i-th dielectric substrate 39' and the second dielectric substrate 41' are formed by resin molding, each of the substrates can be manufactured in an arbitrary shape. Therefore, the shape can be selected in accordance with the bending manner and the bending direction of the RFID tag. Further, the recesses 40' and 44' and the top to bottom of the second dielectric substrate do not need to have the same cross-sectional shape. For example, as shown in Fig. 28, the cylindrical recesses 40' and 44' and the second dielectric substrate may not be tapered, and the cone may be tapered from the top to the bottom. RFID tag 38, and 44' 2275-100Q7-PF 50 201011657 manufacturing method, in addition to the manufacturing! After the dielectric substrate 39' and the second dielectric substrate 41', the second dielectric substrate 41 is fitted or adhered to the i-th dielectric substrate 39', and is the same as the RFID tag 1A described in the fourth embodiment. Therefore, the description is omitted. In the fourth embodiment, the hole portion 5' on which the Ic wafer 6 is placed is expanded as the concave portion 40' or 44, and the molding material is injected into the concave portion 4' or 44 instead of the second dielectric substrate. The structure of FIGS. 28 and 29 can be realized.构成 The diagram of the RF ID tag of the embodiment 5 is shown. 3(a) is a plan view of the RFID tag, FIG. 3(b) is a cross-sectional view taken along line a-a in FIG. u(a), and FIG. 31 is a configuration diagram of the RFID tag of the fifth embodiment. Figure 31 (a) is a plan view of the rfid tag, and Figure 31 (b) is a cross-sectional view taken along line A-A' in Figure 31 (a), and the RnD label " shown in Figure 3A, In the middle, the recess 46' is a circular recess having a diameter larger than the length of the slot 4' in the longitudinal direction. In the RFID tag 47 shown in Fig. 31, the concave portion 48 is a rectangular concave portion having a length larger than the length of the slit 4' in the longitudinal direction. The functions of the RFID tag shown in FIG. 28 and FIG. 29 are the same as the basic structure or the RFID tag, but the RFID tags shown in FIG. 30 and FIG. 31 are different in the following points, since the slot 4' is only in the The dielectric substrate 41 has a field type thereon, and when the RFID tag is bent, the load applied to the contact surface (fitting surface, adhesion surface) of the first dielectric substrate 39 and the second dielectric substrate 41' is not added. At the edge of the slot 4, the load is suppressed not only on the film substrate 2 but on the wire 3' and the film substrate 2, and is prevented from being broken or loosened by the field of the slot 4. The field type is more effective in peeling off from the substrate. Further, the cross-sectional shapes of the recesses 46, 48' and the second dielectric substrate are not limited to 2275-10007-pp 51 201011657. The circular and rectangular shapes may be elliptical, cross-shaped, star-shaped, and polygonal. When the first dielectric substrate 39 and the second dielectric substrate 41' are formed by resin molding, each of the substrates can be manufactured into an arbitrary shape. Therefore, the shape can be selected according to the bending method and the bending direction of the rFID label. Further, the recesses 46, 48' and the top to bottom of the second dielectric substrate do not need to have the same cross-sectional shape. For example, as shown in Fig. 30, the cylindrical recesses 46, 48' and the second dielectric substrate may not be tapered, but may be tapered from the top to the bottom. In the manufacturing method of the RFID tags 45' and 47, after the first dielectric substrate 39' and the second dielectric substrate 41' are manufactured, the second dielectric substrate 41' is bonded or adhered to the first dielectric. The substrate 39 is the same as the RFID tag 1A' described in the fourth embodiment, and thus the description thereof is omitted. Figure 32 is a view showing the configuration of an RFID tag of the fifth embodiment. 32(a) is a plan view of the RFID tag, FIG. 32(b) is a cross-sectional view taken along line AA of FIG. 32(a), and FIG. 33 is a block diagram of the RFID tag of the embodiment 5. 33(a) is a plan view of the RFID tag, and Fig. 33(b) is a cross-sectional view taken along line A-A' in Fig. 33(a), in the RFID tag 49' shown in Fig. 32, The through hole 50' is a circular through hole having a diameter larger than the length of the slot 4' in the longitudinal direction. In the rFID tag 51 shown in Fig. 33, the through hole 52' is a rectangular through hole having a length longer than the length of the slot 4 in the longitudinal direction. Although the RFID tag shown in FIGS. 30 and 31 has the same function as the basic structure or the RFID tag, the second dielectric substrate 41 of the rhd tag shown in FIG. 3 and FIG. 31 has a volume and area ratio as shown in FIG. The second dielectric substrate 41' of the RFID tag shown in FIG. 29 is large, and when the RFID tag is bent, the contact surface of the first dielectric substrate 39 and the second dielectric substrate 41 is 2275-10007-PF 52 201011657. (the fitting surface and the adhesive surface) are close to the end of the RFID tag, and the load attached to the contact surface is increased, and the first dielectric substrate 39 and the second dielectric substrate 41 are separated. In the rFid tag shown in FIG. 33 and FIG. 33, "the through hole 5" or the through hole 52' is provided in the first dielectric substrate 39, and the second dielectric substrate 41 is inserted and fixed thereto. The contact faces of the first dielectric substrate 39 and the second dielectric substrate 41 are increased, and the first dielectric substrate 39 and the second dielectric substrate 41 can be reduced and separated. Of course, a through hole may be formed in the j-th dielectric substrate 39 of the RFID tag shown in Figs. 28 and 29, and the second dielectric substrate 41 having a shape corresponding to the through hole may be inserted. Further, the cross-sectional shapes of the through holes 50' and 52 and the second dielectric substrate are not limited to a circular shape and a rectangular shape, and may be an elliptical shape, a cross shape, a star shape, or a polygonal shape. Since the first dielectric substrate 39' and the second dielectric substrate 41' are formed by resin molding on the right side, each of the substrates can be manufactured in an arbitrary shape. Therefore, the shape can be selected in accordance with the bending mode and the bending direction of the RFID tag. Further, the through holes 50' and 52' and the top to bottom of the second dielectric substrate do not need to have the same cross-sectional shape. For example, as shown in Fig. 32, the cylindrical through holes 5G' and 52' and the second dielectric substrate may not be tapered, and the cone may be tapered from the top to the bottom. In the method of manufacturing the RFID tags 49 and 51', the first dielectric substrate 39' and the second dielectric substrate 41 are manufactured, and then the second dielectric substrate 41' is fitted or adhered to the first dielectric substrate 39. The same as the RFID tag 〇 described in the fourth embodiment, the description is omitted. As described above, the electric field in the vicinity of the 1C wafer 6 is concentrated in the vicinity of the slot 4' (Fig. 18). The first electric power substrate 41' on the other main surface side of the dielectric substrate 39' may be provided with no grounding conductor 8χ. That is, this means that it is not necessary to provide the grounding conductor 8 before fixing (fitting, adhering) the first dielectric substrate 39 and the second dielectric substrate 41', and as a result, the effect of the variation of the alternative manufacturing method is increased. . Figure 34 is a view showing the configuration of an RFID tag of the fifth embodiment. Figure 34 (a) is a plan view of the RFID tag, and Figure 34 (b) is a cross-sectional view taken along line A-A' in Figure 34 (a). In the RFID tag 53, shown in Figure 34, the step is The portion 54' is a step portion provided on the side from the center of the first dielectric substrate 39' and the side opposite to the first dielectric substrate 39'. Unlike the RFID tag shown in FIGS. 28 to 33, the RFID tag 53 is provided on one main surface of the first dielectric substrate 39' instead of the opening of the first dielectric substrate 39' instead of the first dielectric substrate 39'. A structure in which the second dielectric substrate 41' is fitted or adhered to the concave portion 54 having an opening formed on one main surface and the side surface of the first dielectric substrate 39 is formed from the first dielectric substrate 39. The first dielectric substrate 41' is inserted into the main surface side, and the second dielectric substrate 41 is inserted from the side surface of the first dielectric substrate gg to obtain an easy-matching J-th dielectric substrate 39' and 2 The effect of the position of the dielectric substrate 41'. Further, it is not necessary to make the step portion 54 and the surface of the second dielectric substrate 41' flat, and it is also possible to provide a wave-like wave or a fitting unevenness on the surface to improve the first dielectric substrate 39 and the second. The bonding strength of the dielectric substrate 41 and the step portion 5 4 are not necessarily formed in parallel with respect to the slot 4, and may be selected according to the bending manner and the bending direction of the RFID tag. / Further, the top portion to the bottom of the second dielectric substrate do not need 2275-10007-PF 54 201011657 to have the same cross-sectional shape. For example, as shown in Fig. 34, the step portion 54 of the body and the second dielectric substrate are trapezoidal cones which are tapered from the top of the head. In the manufacturing method of the RFID tag 53, the first dielectric substrate 39' and the second dielectric substrate 41 are manufactured, and then the dielectric substrate 41 is fitted or (4) to the first! The dielectric substrate 39 is the same as the garden label 1 〇' described in the fourth embodiment, and thus the description thereof is omitted. Fig. 35 is a view showing the configuration of the RFID tag of the fifth embodiment. Fig. 3 is a plan view of the ❹_tag, and Fig. 35(b) is a cross-sectional view taken from the line a-a in Fig. 35(a). 55, towel, connecting surface %, 丨 dielectric substrate 39, xiao second dielectric substrate 39, (four) junction. RFiD label 55 is abolished by the segmentation of the RFID tag 53 shown in Figure 34; 54', via the connection surface 56 The first dielectric substrate 39 is placed on the side surface of the first dielectric substrate 41' to bond the first dielectric substrate 39, and the second dielectric substrate 41' is first formed in the second dielectric substrate. After 41', the second dielectric substrate 41 is placed in a mold for injection molding, and then _ is used as a dielectric substrate 39 _ resin. In a simple manner, the first dielectric can be separately manufactured. The substrate 39' and the second dielectric substrate 41 are adhered to each other by the connection surface 56'. Further, the first dielectric substrate 39 of the connection surface 56 and the second dielectric substrate 4 are not required to be flat. Wave-like fluctuations or fitting unevennesses may be provided on the surface to improve the strength of the first dielectric substrate 39, the second dielectric substrate 1, and the connection Φ56, and it is not necessary for the groove. 4, formed in parallel, may be selected according to the bending direction and the bending direction _ mode tag. Furthermore, the first dielectric substrate 39 in the connection surface 56' and the second 2275-10007-PF 55 201011657 dielectric substrate 41' from the top to the bottom ., on behalf of the main surface to the other main surface) Need to be the same cross-sectional shape. For example, as shown in Fig. 35, it may not be a vertical connecting surface 56, but a connecting surface which is tapered from one main portion to the other main surface. The RFID-based method for manufacturing the 诰 、 、 、 、 人 , , , , , , , , 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 RFID RFID RFID RFID RFID RFID RFID RFID RFID RFID RFID RFID RFID RFID RFID RFID The description of the RFID tag 1 〇 'same' is omitted.

As described above, in the fifth embodiment of the present invention, in the dielectric substrate of the label, the hardness of the periphery is increased by the H:wafer 6, and the hardness of the position other than the periphery of the core sheet 6' is also increased. In addition to the effect of the RFID tag of the fourth embodiment of the invention, it is achieved that the 1C wafer 6, and the wires 3, (electrical connections 7, 7, 7) are electrically connected when the rfi]) is placed on the curved surface. The effect of a more reliable RFID tag. BRIEF DESCRIPTION OF THE DRAWINGS Figures Ua) and (b) are diagrams showing the configuration of an RFII) tag according to a first embodiment of the present invention. 2(a) and 2(b) are diagrams showing the basic configuration of an RFID system. Fig. 3 is a view showing a configuration of a dielectric substrate in which a hole portion of the present invention is formed. ® 4U-1:)~(d-3) is a manufacturing procedure diagram of the RFID tag of the present invention. Fig. 5 is a view showing an electric field of an electric field of the RFID tag of the present invention. The ® 6 shows a characteristic diagram showing the state of change in the characteristic impedance in the RFII) tag of the present invention. 7(a) and 7(b) are diagrams showing the RFID tag of the embodiment 2 of the present invention.

227 5-10〇〇7-PF 56 201011657 The plan of the composition. Fig. 8 (a) and (b) are plan views showing the configuration of an RFID tag of a third embodiment of the present invention. Fig. 9 is a plan view showing the configuration of an RF1D tag of Embodiment 3 of the present invention. Fig. 10 is a plan view showing the configuration of an RFID tag of a third embodiment of the present invention. Figures 11(a) to (c) are views showing the structure of the RFID tag of the fourth embodiment of the present invention. Fig. 12 (a) and (b) are diagrams showing the basic configuration of the rFII system. Figures 13(a) through 13(d) are diagrams showing the steps of manufacturing an RFID tag manufactured by the method for manufacturing an RFID tag of the present invention. Fig. 14 is a view showing the configuration of a film substrate of the present invention. Fig. 15 (a) and (b) are diagrams of the wires formed on the film substrate of the present invention. Fig. 16 (a) and (b) are diagrams of the wiring formed on the film substrate of the present invention (the IC wafer is connected). Fig. 17 (a) and (b) are views showing the construction of a dielectric substrate in which the hole portion of the present invention is formed. Figure 18 is an electric field diagram of the 标签^ tag of the present invention. Figure 19 is a characteristic impedance diagram of the RFID tag of the present invention. Figure 20 is a configuration diagram of an RFID tag manufactured by the method for manufacturing a label of the embodiment i of the present invention (having an empty pad Fig. 21 (a) (b) is a groove 2275-10007 of the RFID tag of the embodiment 4 of the present invention - PF 57 201011657 An enlarged view of the periphery of the hole (with a blank weld). Fig. 22 (a) and (b) are diagrams showing the shape of the grounding conductor of the RFID tag of the fourth embodiment of the present invention. Fig. 23 (a) to (c) Fig. 24 (a) and (b) are views showing the shape of a metal fiber board for a grounding conductor of an RFID tag according to a fourth embodiment of the present invention. Fig. 25(a) is a diagram showing the configuration of an RFID tag according to a fourth embodiment of the present invention. Figs. 26(a) to 6(c) are diagrams showing an RFID tag and an RFID tag setting object according to a fourth embodiment of the present invention. Fig. 27 (a) and (b) are diagrams showing the configuration of an RFID tag and an ip tag setting object according to a fourth embodiment of the present invention. Figs. 28(a) and (b) are views showing a fifth embodiment of the present invention. Fig. 29(a) and Fig. 29(b) are diagrams showing the configuration of an RFID tag according to a fifth embodiment of the present invention. Figs. 30(a) and (b) are diagrams showing an RFID tag according to a fifth embodiment of the present invention. Fig. 31 (a) and (b) are diagrams showing the configuration of an RFID tag according to a fifth embodiment of the present invention. Fig. 32 (a) and (b) are views showing the configuration of an RFID tag according to a fifth embodiment of the present invention. 33(a) and (b) are diagrams showing the structure of the rFID tag of the embodiment of the present invention. 2275-10007-?58 201011657. Fig. 34(a) and (b) are the fifth embodiment of the present invention. Fig. 35 (a) and (b) are diagrams showing the configuration of an RFID tag according to a fifth embodiment of the present invention. [Description of main component symbols] 1. 1': dielectric substrate;

2': film substrate; 201: film substrate having a conductor (having a conductor layer (grounding wire 8')); 20 2: a film substrate having a conductor (having a wire 3'); 2, 3': a wire; 3, 4,: slot; hole; IC chip, electrical connection; 7, 8, grounding wire; 9': adhesive sheet; 8, 10': RFID tag; 9, 1 Γ: antenna (label) ; 10, 12' : RFID reader; 11, 13' antenna (reader); 12, 14': analogy; 2275-10007-PF 59 201011657

13, 15 A/D conversion unit; 14 '16 > power supply control unit; 15, 17, memory unit; 16 '18) demodulation unit; 17, 19 > control unit; 18, 20 > modulation unit; 19 ' 21 > digital part; 20 ' 22 9 D/A conversion part; 21 : conductor layer 9 22 : conductor foil f 23 , conductor layer; 24, • connection terminal; 23 ' 25 y • empty pad; 26 slot; 25: electrical length adjustment; 26, grounding conductor (grid); 27, missing σ; 28, grounding conductor (zigzag) 29, notched; 30' metal fiberboard; 31, grounding conductor 32) lacking σ; 33' grounding wire (zigzag) 34, lacking π; 2275—10007—PF 60 201011657 35': double-sided tape; 3 6' : RFID tag setting object (setting surface) 3): RFID tag setting object (setting surface is concave); 38' : RFID tag; 39': 1st dielectric substrate; 4 0 ' : recess (circular); 41': 2 dielectric substrate; 42': hole; ❹ 43,: RFID tag 44': recess (rectangular); 45': RFID tag; 46': recess (circular); 47': RFID tag; 48': recess (rectangular); 49': RFID tag; 50': through hole ( Round); 51': RFID tag; 52': through hole (rectangular); 53': RFID tag; 54': step section; 55': RFID tag; 5 6': connection face. 2275-10007-PF 61

Claims (1)

201011657 X. Patent application scope: 1. A radio frequency identification tag comprising: a dielectric substrate having a hole portion on a main surface; a grounding wire disposed on the other main surface of the dielectric substrate; the wire being set On one main surface of the dielectric substrate, and disposed on the inner side of the dielectric substrate from the end portion of the dielectric substrate by a predetermined distance; and a 1C wafer, the inside of the wire forms a slot through which the slot is formed. The wire is electrically connected to the wire and inserted into the hole portion of the dielectric substrate. 2. A radio frequency identification tag comprising: a dielectric substrate having a hole portion on a main surface; a ground wire disposed on the other main surface of the dielectric substrate; and a wire disposed on the dielectric substrate a main surface, and disposed on the inner side of the dielectric substrate only by a predetermined distance; and a 1C wafer, wherein the inside of the wire forms an elongated slot through which the electrical hole is electrically The ground wire is connected to the aforementioned wire and inserted into the aforementioned hole portion of the dielectric substrate. 3. A radio frequency identification tag comprising: a dielectric substrate having a hole portion on a main surface; a ground wire disposed on the other main surface of the dielectric substrate; and a wire disposed on the dielectric substrate a main surface, and is disposed on the inner side thereof only from a predetermined distance from an end portion of the dielectric substrate; an electrical connection portion, a slot is formed inside the wire, and the aforementioned wire constituting the slot The two sides extend to the inner side of the slot, respectively; and the 2275-10007-PF 62 201011657 ic chip is electrically connected to the electrical connection portion and is inserted into the aforementioned hole portion of the dielectric substrate. 4. A radio frequency identification tag comprising: a dielectric substrate having a hole portion on a main surface; a ground wire disposed on the other main surface of the dielectric substrate; and a wire 'disposed on the dielectric substrate a main surface, and is disposed on the inner side thereof only from a predetermined distance from an end portion of the dielectric substrate; an electrical connection portion in which an elongated slot is formed inside the wire, and from which the slot is formed The opposite sides of the opposite wires in the width direction extend to the inside of the slots, respectively; and the 1C wafer is electrically connected to the electrical connections and is inserted into the aforementioned holes of the dielectric substrate. 5. A radio frequency identification tag, which is disposed on a curved surface of a predetermined curvature, comprising: a dielectric substrate having a hole portion at a central portion of a main surface and having a hardness bent at least at the aforementioned predetermined curvature; the ground wire 'is Provided on the other main surface of the dielectric substrate; the wire 'is disposed on the dielectric substrate, and is disposed on the inner side thereof from the end of the dielectric substrate by a predetermined distance; and ΪC wafer An elongated slot is formed in the interior of the wire, through which the wire is electrically connected to the wire and inserted into the hole of the dielectric substrate. 6. The radio frequency identification tag according to claim 5, wherein the hardness of the dielectric substrate of the foregoing 1C wafer is greater than the hardness of the periphery of the 2275-10007-pp 63 201011657 ic wafer. high. 7. The radio frequency identification tag according to claim 5, wherein at least one of the aforementioned conductor and the grounding conductor is formed of a metal fiberboard. 8. The radio frequency identification tag of claim 5, wherein the aforementioned grounding conductor has a notch portion that cuts a portion thereof. 9. The radio frequency identification according to claim 5, wherein the grounding conductor is in a lattice pattern or a zigzag pattern. 10. The radio frequency identification tag according to claim 5, wherein the 'IC chip is an electrical connection portion extending from both sides in a width direction of the wire constituting the slot to an inner side of the slot. Electrically connected. 11. A radio frequency identification tag, which is disposed on a curved surface of a predetermined curvature, comprising: a dielectric substrate having a hole portion at a central portion of a main surface and having a hardness that is bent to a predetermined curvature of less than zero; a grounding wire Provided on the other main surface of the dielectric substrate; a film substrate; a wire disposed on the film substrate, and disposed on the inner side thereof at a predetermined distance from the end of the film substrate And the IC chip 'in the inside of the wire constitutes an elongated slot through which the wire is electrically connected to the wire and inserted into the aforementioned hole portion of the dielectric substrate. 12. The radio frequency identification tag according to claim 11, wherein the 2275-10007-PF 64 201011657 further comprises a front surface of the thin germanium substrate and a main surface of the dielectric substrate. 13. A radio frequency identification tag, which is disposed on a predetermined curvature, comprising: unloading a first dielectric substrate 'having a recess on a central portion of a main surface and having a hardness of at least the aforementioned predetermined curvature; 2nd a dielectric substrate disposed inside the recess, and in the foregoing The first dielectric substrate has a hole portion on one main surface side and has a higher hardness than the dielectric substrate; the ground wire 'is disposed on the other main surface of the second dielectric substrate; the wire is disposed in the foregoing The dielectric substrate and the second dielectric substrate are disposed on the inner side of the first dielectric substrate from each other with a predetermined distance therebetween; and the ic chip is formed in an elongated shape inside the wire. The slot is electrically connected to the lead via the slot, and is inserted into the hole portion of the second dielectric substrate. The radio frequency identification tag according to claim 13, wherein the concave portion is circular or polygonal. The radio frequency identification tag according to claim 13, wherein the second dielectric substrate is a curing material of the molding material. 16 . A radio frequency identification tag, which can be disposed on a curved surface of a predetermined curvature, comprising: a first dielectric substrate having a concave portion on a central portion of a main surface and having a hardness of at least the aforementioned predetermined curvature; 2275—10007— pF 65 201011657 The second dielectric substrate is provided inside the concave portion, and has a hole portion on the main surface side of the first dielectric substrate, and has a hardness higher than that of the first dielectric substrate; the ground wire is Provided on the other main surface of the second dielectric substrate. The film substrate; ^ wire ' is disposed on the thin substrate, and is disposed on the inner side thereof from the end of the film substrate only by a predetermined distance Up; and The ❹ 1C wafer has an elongated slot formed inside the lead, through which the lead is electrically connected to the lead and inserted into the hole of the second dielectric substrate. A radio frequency identification tag, which is disposed on a curved surface of a predetermined curvature, includes: a first dielectric substrate having a through hole penetrating from one main surface to the other main surface at the central portion, and having at least the foregoing predetermined The second dielectric substrate is provided inside the through hole, and has a hole portion on one main surface side of the first dielectric substrate, and has a hardness higher than that of the one dielectric substrate; 'grounding wire And being disposed on the other main surface of the second dielectric substrate; the wires are disposed on the second dielectric substrate and the second dielectric substrate, and only from the end of the first dielectric substrate And a 1C wafer, wherein the inside of the wire forms an elongated slot through which the wire is electrically connected to the wire and inserted into the second dielectric substrate The aforementioned hole portion. The radio frequency identification according to claim 17, wherein the through hole is circular or polygonal. 19. A radio frequency identification tag, which is disposed on a curved surface of a predetermined curvature, comprising: a first dielectric substrate having a through hole 'through a main surface to a main surface at a central portion and having at least the aforementioned predetermined curvature The hardness of the second dielectric substrate is provided inside the through hole, and has a hole portion on one main surface side of the first dielectric substrate, and has a higher hardness than the first dielectric substrate; Provided on the other main surface of the first dielectric substrate; a film substrate; a wire disposed on the film substrate, and disposed at a predetermined distance from an end portion of the film substrate On the inner side; and the ΪC wafer, an elongated slot is formed in the inside of the lead, and the slot is electrically connected to the lead via the slot and inserted into the hole portion of the second dielectric substrate. 20. A radio frequency identification target 'can be disposed on a curved surface of a predetermined curvature' comprising: a first dielectric substrate having a through hole 'through a main surface to a main surface at a central portion and having at least the foregoing predetermined The second dielectric substrate ′ is provided inside the through hole, and has a hole portion on one main surface side of the first dielectric substrate, and has a higher hardness than the first dielectric substrate; a wire disposed on the other main surface of the first dielectric substrate and the other main surface of the second dielectric substrate in the second dielectric substrate of 2275-10007-PF 67 201011657; On the second dielectric substrate and the second dielectric substrate 'and from the above! The end of the dielectric substrate is disposed on the inner side thereof only by a predetermined distance; and the 1C wafer, the inside of the wire is formed as an elongated slot through which the wire is electrically connected to the aforementioned wire and inserted The hole portion of the second dielectric substrate. 21. The radio frequency identification tag ′ can be disposed on a curved surface of a predetermined curvature, and includes: the first dielectric substrate ′ having a through hole passing through a main surface to the other main surface at the central portion and having at least the foregoing predetermined The hardness of the curvature is curved. The second dielectric substrate is disposed inside the through hole, and has a dielectric substrate height on one main surface side of the first dielectric substrate; and a hole portion i hardness ratio The aforementioned 接地 grounding wire is set in the aforementioned! a further main surface of the dielectric substrate and another main surface side of the first dielectric substrate in the second dielectric substrate, a film substrate; a lead wire is poured on the thin film substrate, and the film is formed from the film The immersed portion of the substrate is disposed on the inner side thereof only by a predetermined distance; and the IC chip is formed inside the wire, and an elongated slot is taken through which the wire is electrically connected to the wire, the substrate The aforementioned hole portion. Inserted into the second dielectric 2275-10007-PF 68