JP2006053833A - Rfid tag and its manufacturing method - Google Patents

Rfid tag and its manufacturing method Download PDF

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JP2006053833A
JP2006053833A JP2004236155A JP2004236155A JP2006053833A JP 2006053833 A JP2006053833 A JP 2006053833A JP 2004236155 A JP2004236155 A JP 2004236155A JP 2004236155 A JP2004236155 A JP 2004236155A JP 2006053833 A JP2006053833 A JP 2006053833A
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rfid tag
dielectric member
ic chip
antenna pattern
antenna
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JP4653440B2 (en
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Shunji Baba
Hiroyuki Hayashi
Manabu Kai
Toru Maniwa
Takashi Yamagajo
尚志 山ケ城
宏行 林
学 甲斐
俊二 馬場
透 馬庭
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Fujitsu Ltd
富士通株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00Antennas with active circuits or circuit elements integrated within them or attached to them
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07771Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2216Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in interrogator/reader equipment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/15165Monolayer substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

<P>PROBLEM TO BE SOLVED: To provide an RFID tag capable of suppressing reduction of communication distance even when the RFID tag is used adjacent to a wave absorber in order to ensure reliability of communication. <P>SOLUTION: The RFID tag 5 comprises a rectangular parallelepiped dielectric member 10 having the predetermined dielectric constant, an antenna pattern 30 for transmission and reception formed in looped shape on a surface of the dielectric member 10 by etching etc., and an IC chip electrically connected to the antenna pattern 30 via a chip loading pad 32. When the RFID tag 5 is used for a wave absorber such as a bottle including liquid and the human body, a minute loop antenna is formed around the dielectric member 10 with an antenna pattern 30 and a current loop is also formed in the wave absorber. Thus, a larger current loop is formed, thereby improving the loop antenna gain to increase a communication distance. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、非接触で外部機器から電力供給および情報を受け、当該外部機器へ情報を送出する非接触ICカード等のRFID(RADIO FREQUENCY IDENTIFICATION)タグおよびその製造方法に関し、更に詳しくは、RFIDタグが電波吸収体に対し近接して使用される場合であっても通信距離の低下を抑制することができ、通信の信頼性を確保することができるRFIDタグおよびその製造方法に関する。 The present invention receives power supply and information from an external device in a noncontact relates RFID (RADIO FREQUENCY IDENTIFICATION) tag and its manufacturing method such as a non-contact IC card for sending information to the external device, more particularly, RFID tags there it is possible to suppress the reduction of the communication distance even when used in proximity to the wave absorber, an RFID tag and a manufacturing method thereof capable of ensuring the reliability of communication. なお、本願技術分野における当業者間では、本願明細書で使用する「RFIDタグ」を、「RFIDタグ」用の内部構成部材(インレイ(inlay))であるとして「RFIDタグ用インレイ」と呼ぶこともある。 Incidentally, among those skilled in the present art, the use herein of "RFID tag" is referred to as "RFID tag inlay" as an internal constituent member for the "RFID tag" (inlay (inlay)) there is also. また、「RFIDタグ」を、「無線ICタグ」と呼ぶこともある。 Also, the "RFID tag" may also be referred to as a "wireless IC tag".

近年、電波を用いることにより非接触でリーダライタ等の外部機器から電力供給および情報を受け、当該外部機器へ情報を送出する非接触ICカード等のRFIDタグが提供されている。 Recently, receiving power supply and information from an external device such as a reader-writer in a non-contact by using radio waves, RFID tags such as a non-contact IC card for sending information to the external device is provided. このRFIDタグは、プラスチックや紙等の基材に設けた送受信用のアンテナパターンとICチップとからなり、当該アンテナパターンと当該ICチップに内蔵された容量素子とにより共振回路を形成し、当該アンテナパターンを通じて無線で外部機器と交信することができるように構成されている。 The RFID tag is composed of an antenna pattern and an IC chip for transmission and reception provided on the base material of plastic or paper, by a capacitance element built in the antenna pattern and the IC chip form a resonance circuit, the antenna and it is configured to be able to communicate with external devices wirelessly through pattern.

ところで、このようなRFIDタグは、たとえばワイン入りのビンや人体等の電波吸収体に対し近接して使用される場合がある。 However, such RFID tags may be used near example to the wave absorber of the bottle or a human body or the like containing wine. この電波吸収体は、RFIDタグの送受信に必要な電波(たとえば、UHF帯の電波)を吸収するため、通信に悪影響を及ぼす虞がある。 The wave absorber, electromagnetic wave necessary for the transmission and reception of the RFID tag (e.g., radio waves in the UHF band) for absorbing, there is a possibility of adversely affecting the communication. 一般に、アンテナの利得を向上させる手段としては、たとえば、図26や図27に示す手段が公知である。 Generally, as means for improving the gain of the antenna, for example, it is known means shown in FIG. 26 and FIG. 27. ここで、図26は、電波吸収体に平面アンテナを設けた従来技術を示す断面図、図27は、電波吸収体にループアンテナを設けた従来技術を示す断面図である。 Here, FIG. 26 is a sectional view showing a prior art provided with a planar antenna in the radio wave absorber 27 is a sectional view showing a prior art loop antenna provided on the radio wave absorber.

図26に示すように、電波吸収体100には平面アンテナ120を有する基板110が接着剤140を介して設けられている。 As shown in FIG. 26, a substrate 110 having a plane antenna 120 is provided through the adhesive 140 in the radio wave absorber 100. また、この平面アンテナ120は、別の基板に設けられたICチップ(図示せず)と給電点130によって接続されている。 Further, the planar antenna 120 is connected to the IC chip provided on another substrate (not shown) by the power supply point 130.

また、関連する従来技術として、平面コイルアンテナを備えたRFIDタグが公知である(たとえば、特許文献1参照)。 Further, as a related prior art, RFID tags is known having a flat coil antenna (e.g., see Patent Document 1). すなわち、図示を省略するが、このRFIDタグは、誘電体からなるアンテナ基板と、このアンテナ基板の一方の面に形成される複数の第1コイル、およびその他方の面に形成される複数の第2コイルからなるアンテナコイルとを備え、これら第1コイルおよび第2コイルとは、上記アンテナ基板を挟んでその一部が対向するように交互に配置させ、かつ、上記各コイルは所定の順序で一連に接続するようにしたものである。 That is, although not shown, the RFID tag, a plurality of formed and an antenna substrate made of a dielectric, the surface of the antenna a plurality of first coils formed on one surface of the substrate, and its other second and an antenna coil formed of two coils, and these first and second coils, a part across the antenna substrate is disposed alternately to face, and the coils in a predetermined order it is obtained so as to connect to a series.

また、図27に示すように、電波吸収体100には、板金形成されたループアンテナ160が接着剤140を介して設けられている。 Further, as shown in FIG. 27, the radio wave absorber 100, a loop antenna 160 that is a sheet metal formed is provided with an adhesive 140. このループアンテナ160の内方は空間150となっている。 The inside of the loop antenna 160 has a space 150. また、このループアンテナ160は、別の基板に設けられたICチップ(図示せず)と給電点130によって接続されている。 Further, the loop antenna 160 is connected IC chip provided on another substrate (not shown) by the power supply point 130. このような技術は、ポケットベル等において広く採用されている。 Such techniques are widely used in pagers and the like.

特開2004−206479号公報 JP 2004-206479 JP

しかしながら、上記図26に示した平面アンテナ120の給電点130にICチップを搭載してRFIDタグを構成する場合には、平面アンテナ120を微細なRFIDタグに形成するため、アンテナパターンの面積をきわめて小さくしなければならず、通信距離が短くなるうえ、電波吸収体100によって電波が吸収されるので、更にアンテナ感度が低下してしまうという課題があった。 However, in the case of forming the RFID tag by mounting an IC chip to a feed point 130 of the planar antenna 120 shown in FIG. 26, in order to form a planar antenna 120 in fine RFID tag, extremely the area of ​​the antenna pattern It must be reduced, upon the communication distance becomes short, since the radio waves are absorbed by the wave absorber 100, a problem that further antenna sensitivity is lowered.

また、上記特許文献1に係る従来技術も平面コイルアンテナを用いているため、電波吸収体100によって電波が吸収されるとアンテナ感度が低下しやすく、通信距離が低下してしまうという課題があった。 Further, since the prior art according to Patent Document 1 uses a planar coil antenna, a radio wave is absorbed by the radio wave absorber 100 antenna sensitivity tends to decrease, the communication distance is a problem that deteriorates .

更に、上記図27に示した従来のループアンテナ160を用いてRFIDタグを構成する場合には、ループアンテナ160が板金形成されているので、アンテナの小型・薄型化が困難である。 Further, when configuring the RFID tag using a conventional loop antenna 160 shown in FIG. 27, since the loop antenna 160 is a sheet metal formed, compact and thin antenna is difficult. このため、当該ループアンテナ160を、小型・薄型化が要求されるRFIDタグに適用するのは困難である。 Therefore, it is difficult to apply the loop antenna 160, the RFID tag smaller and thinner is required.

また、このループアンテナ160をRFIDタグに適用したとしても、ループアンテナ160の内方は空間150となっているので、外力を受けるとループアンテナ160が潰れやすい。 Further, even when applying the loop antenna 160 to the RFID tag, since the inside of the loop antenna 160 has a space 150, the loop antenna 160 is easily crushed when subjected to external force. したがって、この従来技術を、外力を受けやすいRFIDタグにそのまま適用すると、通信の信頼性が低下する虞があるという課題もあった。 Therefore, the prior art, when it is applied to a susceptible RFID tag to an external force, communication reliability was also a problem that may be decreased.

このように、RFIDタグが電波吸収体に対し近接して使用される場合であっても通信距離の低下を抑制することができ、通信の信頼性を確保することができるRFIDタグおよびその製造方法の提供が望まれていた。 Thus, it is possible to suppress the reduction of an a even communication distance when the RFID tag is used in proximity to the wave absorber, an RFID tag and a manufacturing method thereof capable of ensuring the reliability of communication providing it has been desired.

この発明は、上記に鑑みてなされたものであって、RFIDタグが電波吸収体に対し近接して使用される場合であっても通信距離の低下を抑制することができ、通信の信頼性を確保することができるRFIDタグを提供することを目的とする。 The present invention was made in view of the above, it is possible to suppress the reduction of an a even communication distance when the RFID tag is used in proximity to the wave absorber, the communication reliability and to provide a RFID tag that can be secured.

また、この発明は、RFIDタグが電波吸収体に対し近接して使用される場合であっても通信距離の低下を抑制することができ、通信の信頼性を確保することができるRFIDタグの製造方法を提供することを目的とする。 Further, the invention can suppress a decrease in a was also communication distance when the RFID tag is used in proximity to the wave absorber, the manufacture of RFID tags that can ensure the reliability of communication an object of the present invention to provide a method.

上述した課題を解決し、目的を達成するために、本発明(請求項1)は、少なくとも、誘電体部材と、前記誘電体部材の表面に設けられループアンテナを形成する送受信用のアンテナパターンと、通信回路と記憶回路を内蔵し前記アンテナパターンに電気的に接続されたICチップと、を備えたことを特徴とするものである。 To solve the above problems and achieve the object, the present invention (claim 1) comprises at least a dielectric member, and antenna patterns for transmission and reception to form a loop antenna provided on a surface of the dielectric member and it is characterized by comprising an IC chip incorporating a communication circuit memory circuitry electrically connected to the antenna pattern.

したがって、この発明によれば、誘電体部材の表面にループ状に形成されたアンテナパターンによってループアンテナの利得が向上し、通信距離が伸びる。 Therefore, according to the present invention improves the gain of the loop antenna by the antenna pattern formed in a loop on the surface of the dielectric member, the communication distance increases. また、アンテナパターンが誘電体部材に形成されているので、外力を受けても当該アンテナパターンが潰れる虞はない。 Further, since the antenna pattern is formed on the dielectric member, there is no possibility that the antenna pattern collapse even by an external force.

また、本発明(請求項2)は、少なくとも、誘電体部材と、送受信用のアンテナパターンを有し前記誘電体部材の表面に設けられることによりループアンテナを形成するフィルム基材と、通信回路と記憶回路を内蔵し前記アンテナパターンに電気的に接続されたICチップと、を備えたことを特徴とするものである。 Further, the present invention (claim 2) comprises at least a dielectric member, and the film substrate to form a loop antenna by provided on the surface of the dielectric member has an antenna pattern for transmitting and receiving, a communication circuit an IC chip electrically connected to the built-mentioned antenna pattern memory circuit, is characterized in that it comprises a.

したがって、この発明によれば、誘電体部材の表面に設けられることによりループアンテナを形成するフィルム基材を備えているので、容易かつ安価にループアンテナを形成することができ、ループアンテナの利得を向上させ、通信距離を伸ばすことができる。 Therefore, according to the present invention is provided with the film base material to form the loop antenna by provided on the surface of the dielectric member, it can be formed easily and inexpensively loop antenna, the gain of the loop antenna improved, it is possible to extend the communication distance. また、アンテナパターンを有するフィルム基材が誘電体部材に形成されているので、外力を受けても当該アンテナパターンが潰れる虞はない。 Further, since the film substrate having an antenna pattern is formed on the dielectric member, there is no possibility that the antenna pattern collapse even by an external force.

また、本発明(請求項3)は、前記フィルム基材は、前記ICチップを搭載し前記アンテナパターンと電気的に接続するためのチップ搭載パッドを備えたことを特徴とするものである。 Further, the present invention (claim 3), the film substrate, is characterized in that it comprises a chip mounting pad for mounting the IC chip connecting the antenna pattern electrically.

したがって、この発明によれば、ICチップの搭載とアンテナパターンとの導通とが同時かつ容易に実現される。 Therefore, according to the present invention, the conduction between the mounting and the antenna pattern of the IC chip are simultaneously and easily realized.

また、本発明(請求項4)は、前記誘電体部材は、前記ICチップを搭載し前記アンテナパターンと電気的に接続するためのチップ搭載パッドを備えたことを特徴とするものである。 Further, the present invention (Claim 4), the dielectric member is characterized in further comprising a chip mounting pad for mounting the IC chip connecting the antenna pattern electrically.

したがって、この発明によれば、ICチップの搭載とアンテナパターンとの導通とが同時かつ容易に実現される。 Therefore, according to the present invention, the conduction between the mounting and the antenna pattern of the IC chip are simultaneously and easily realized.

また、本発明(請求項5)は、前記誘電体部材は、前記ICチップを埋設するための凹部を備え、当該凹部に当該ICチップを埋設したことを特徴とするものである。 Further, the present invention (Claim 5), the dielectric member comprises a recess for embedding the IC chip, is characterized in that embedded the IC chip to the recess.

したがって、この発明によれば、実装されたICチップが凹部内に収まり、誘電体部材の外表面から出っ張らないので、外力の集中を受けにくい。 Therefore, according to the present invention, implemented IC chip fits into the recess, so does not project from the outer surface of the dielectric member, less subject to intensive external force.

また、本発明(請求項6)は、前記チップ搭載パッドは、前記誘電体部材の一の側面部に向けて延設され、当該一の側面部に前記ICチップを位置させたことを特徴とするものである。 Further, the present invention (Claim 6), the chip mounting pads, and wherein the extending toward the one side surface of the dielectric member was positioned the IC chip on the side surface of the one it is intended to.

したがって、この発明によれば、ICチップが誘電体部材の側面部以外の表面から出っ張らないので、外力の集中を受けにくい。 Therefore, according to the present invention, since the IC chip it does not project from the surface other than the side surface of the dielectric member, less subject to intensive external force.

また、本発明(請求項7)は、前記チップ搭載パッドは、前記ICチップの給電点位置を調整できるように前記アンテナパターンに沿って長手状に併設されたことを特徴とするものである。 Further, the present invention (Claim 7), the chip mounting pad is characterized in that the juxtaposed longitudinally shape along the antenna pattern to calibrate their feeding point position of the IC chip.

したがって、この発明によれば、チップ搭載パッド上でICチップの搭載位置を変更することによって給電点位置が容易に調整され、アンテナの特性を容易に調整することができる。 Therefore, according to the present invention, the feed point position by changing the mounting position of the IC chip on the chip mounting pads are easily adjusted, the characteristic of the antenna can be easily adjusted.

また、本発明(請求項8)は、少なくとも、誘電体部材と、前記誘電体部材を挿脱自在に支持する誘電体支持部材と、送受信用のアンテナパターンを有し前記誘電体支持部材の表面に設けられることによりループアンテナを形成するフィルム基材と、通信回路と記憶回路を内蔵し前記アンテナパターンに電気的に接続されたICチップと、を備えたことを特徴とするものである。 Further, the present invention (Claim 8), at least, the dielectric member and the surface of the dielectric member and the dielectric support member for removably supporting said dielectric supporting member has an antenna pattern for transmitting and receiving a film substrate to form a loop antenna by being provided, is characterized in that a built-in communication circuit memory circuit and a IC chip that is electrically connected to the antenna pattern.

したがって、この発明によれば、誘電体支持部材に対して誘電体部材を挿脱することによりアンテナの感度調整が容易に行われる。 Therefore, according to the present invention, the sensitivity adjustment of the antenna is easily performed by inserting and removing the dielectric member to the dielectric support members.

また、本発明(請求項9)は、前記誘電体部材は、誘電率および誘電損失が異なる複数の誘電体部材を組み合わせてなることを特徴とするものである。 Further, the present invention (Claim 9), the dielectric member is characterized in that the dielectric constant and dielectric loss is a combination of different dielectric member.

したがって、この発明によれば、誘電率および誘電損失が異なる複数の誘電体部材を組み合わせることにより、誘電率および誘電損失が任意に調整され、アンテナの感度調整が容易に行われる。 Therefore, according to the present invention, by combining a plurality of dielectric members dielectric constant and dielectric loss are different, dielectric constant and dielectric loss are arbitrarily adjusted, sensitivity adjustment of the antenna can be easily performed.

また、本発明(請求項10)は、送受信用のアンテナパターンを有したフィルム基材を誘電体部材の表面に設けループアンテナを形成するループアンテナ形成工程と、少なくとも通信回路と記憶回路を内蔵したICチップを前記アンテナパターンに電気的に接続するICチップ実装工程と、からなることを特徴とするものである。 Further, the present invention (claim 10) includes a loop antenna forming a loop antenna is provided a film substrate having an antenna pattern for transmitting and receiving on the surface of the dielectric member, a built-in at least the communication circuit memory circuit an IC chip mounting step of electrically connecting the IC chip to the antenna pattern and is characterized in that it consists of.

したがって、この発明によれば、ループアンテナ形成工程により誘電体部材の表面にフィルム基材を設ければ、容易にループアンテナが形成される。 Therefore, according to the present invention, by providing the film substrate on the surface of the dielectric member by a loop antenna formation step, easily loop antenna is formed. このループアンテナにICチップをICチップ実装工程により実装すれば、容易かつ安価にRFIDタグが製造される。 If the IC chip on the loop antenna mounting the IC chip mounting process, easily and inexpensively RFID tag is manufactured.

この発明(請求項1)によれば、誘電体部材の表面に形成されたループアンテナによってアンテナの利得を向上することができ、通信距離を伸ばすことができる。 According to the present invention (Claim 1), it is possible to improve the antenna gain by the loop antenna formed on the surface of the dielectric member, it is possible to extend the communication distance. また、アンテナパターンが誘電体部材に形成されているので、外力を受けても当該アンテナパターンが潰れる虞がなく、通信の信頼性を確保することができる。 Further, since the antenna pattern is formed on the dielectric member, there is no possibility that the antenna pattern collapse even by an external force, it is possible to ensure the reliability of communication.

また、この発明(請求項2)によれば、誘電体部材の表面に設けられることによりループアンテナを形成するフィルム基材を備えているので、容易かつ安価にループアンテナを形成することができ、ループアンテナの利得を向上させ、通信距離を伸ばすことができる。 Further, according to the invention (claim 2), can be is provided with the film base material to form the loop antenna by provided on the surface of the dielectric member to form easily and inexpensively loop antenna, the gain of the loop antenna is improved, it is possible to extend the communication distance. また、アンテナパターンを有するフィルム基材が誘電体部材に形成されているので、外力を受けても当該アンテナパターンが潰れる虞がなく、通信の信頼性を確保することができる。 Further, since the film substrate having an antenna pattern is formed on the dielectric member, there is no possibility that the antenna pattern collapse even by an external force, it is possible to ensure the reliability of communication.

また、この発明(請求項3)によれば、ICチップの搭載とアンテナパターンとの導通とを同時かつ容易に実現することができる。 Further, according to the invention (claim 3), it is possible to simultaneously and easily realize the conduction between the mounting and the antenna pattern of the IC chip.

また、この発明(請求項4)によれば、ICチップの搭載とアンテナパターンとの導通とを同時かつ容易に実現することができる。 Further, according to the present invention (Claim 4), it is possible to simultaneously and easily realize the conduction between the mounting and the antenna pattern of the IC chip.

また、この発明(請求項5)によれば、 実装されたICチップが凹部内に収まり、誘電体部材の外表面から出っ張らないので、外力の集中を受けにくい。 Further, according to the present invention (Claim 5), implemented IC chip fits into the recess, so does not project from the outer surface of the dielectric member, less subject to intensive external force. このため、RFIDタグを破損しにくくすることができる。 Therefore, it is possible to hardly damage the RFID tag.

また、この発明(請求項6)によれば、ICチップが誘電体部材の側面部以外の表面から出っ張らないので、外力の集中を受けにくい。 Further, according to the present invention (Claim 6), the IC chip does not project from the surface other than the side surface of the dielectric member, less subject to intensive external force. このため、RFIDタグを破損しにくくすることができる。 Therefore, it is possible to hardly damage the RFID tag.

また、この発明(請求項7)によれば、チップ搭載パッド上でICチップの搭載位置を変更することによって給電点位置を容易に調整することができ、アンテナの特性を容易に調整することができる。 Further, according to the present invention (Claim 7), the mounting position of the IC chip on the chip mounting pads the feeding point position can be easily adjusted by changing the, is possible to easily adjust the characteristics of the antenna it can.

また、この発明(請求項8)によれば、誘電体支持部材に対して誘電体部材を挿脱することによりアンテナの感度調整を容易に行うことができる。 Further, according to the present invention (Claim 8), it is possible to easily perform the sensitivity adjustment of the antenna by inserting and removing the dielectric member to the dielectric support members.

また、この発明(請求項9)によれば、誘電率および誘電損失が異なる複数の誘電体部材を組み合わせることにより、誘電率および誘電損失を任意に調整することができ、アンテナの感度調整を容易に行うことができる。 Further, according to the invention (claim 9), by combining a plurality of dielectric members dielectric constant and dielectric loss are different, it is possible to arbitrarily adjust the dielectric constant and dielectric loss, the sensitivity adjustment of the antenna easily it can be carried out in.

また、この発明(請求項10)によれば、ループアンテナ形成工程により誘電体部材の表面にフィルム基材を設けることにより、容易にループアンテナを形成することができる。 Further, according to the present invention (Claim 10), by providing the film substrate on the surface of the dielectric member by a loop antenna formation step, it is possible to easily form the loop antenna. そして、このループアンテナにICチップをICチップ実装工程にて実装することにより、容易かつ安価にRFIDタグを製造することができる。 By mounting the IC chip on the loop antenna at the IC chip mounting process, easily and inexpensively can be manufactured RFID tag.

以下に、この発明に係るRFIDタグおよびその製造方法の実施例を図面に基づいて詳細に説明する。 It will be described below in detail with reference to examples of RFID tags and a manufacturing method thereof according to the invention with reference to the drawings. なお、この実施例によりこの発明が限定されるものではない。 It should be understood that the present invention is not limited by this embodiment.

図1は、この発明の実施例1に係るRFIDタグを示す斜視図、図2は、RFIDタグを電波吸収体に設けた状態を示す断面図、図3は、大きな電流ループが形成される原理を示す概念図である。 Figure 1 is a principle perspective view of the RFID tag according to a first embodiment of the present invention, FIG. 2 is a sectional view showing a state in which a RFID tag in the radio wave absorber, Figure 3, a large current loop is formed it is a conceptual diagram showing a. 図1および図2に示すように、本実施例1に係るRFIDタグ5は、直方体状の誘電体部材10と、この誘電体部材10の表面に設けられループアンテナを形成する送受信用のアンテナパターン30と、このアンテナパターン30にチップ搭載パッド32を介して電気的に接続されたICチップ40と、を備えている。 As shown in FIGS. 1 and 2, RFID tag 5 according to the first embodiment, the antenna pattern for reception of forming a rectangular parallelepiped-shaped dielectric member 10, the loop antenna provided on the surface of the dielectric member 10 30, and includes an IC chip 40 that is electrically connected via the chip mounting pads 32 to the antenna pattern 30, a.

直方体状の誘電体部材10は、所定の誘電率を有する誘電体からなっており、ガラス等を含んだ樹脂により形成された、いわゆる高周波用基板を用いることができる。 Rectangular shaped dielectric member 10 is formed of a dielectric having a predetermined dielectric constant, is formed of a resin containing glass, etc., it can be used a so-called high-frequency board. 誘電体部材10の平面部分のアンテナパターン30は、導体(たとえば、銅等の金属導体)をエッチングすることにより形成されている。 The antenna pattern 30 of the planar portion of the dielectric member 10, the conductor (e.g., metal conductor such as copper) and is formed by etching a.

また、ICチップ40を搭載しアンテナパターン30と電気的に接続するための一対のチップ搭載パッド32も、このアンテナパターン30とともに、上記エッチングにより同時形成されている。 Further, a pair of chip mounting pads 32 for connecting an IC chip 40 antenna pattern 30 and the electrically well, along with the antenna pattern 30 are simultaneously formed by the etching. また、誘電体部材10の側面部分(厚みを形成する部分)のアンテナパターン30は、公知のいわゆるメッキによる側面導通法によって形成されている。 Further, the antenna pattern 30 of the side surface portion of the dielectric member 10 (the portion forming the thickness) is formed by a side surface conduction method using a known so-called plating.

ICチップ40は、非接触で情報を記録し、かつ読み取るための通信回路とメモリおよび所定の制御回路を備えるとともに、アンテナパターン30に延設された上記チップ搭載パッド32と電気的に接続するためのチップ電極(図示せず)を備えている。 IC chip 40 records information in a non-contact, and provided with a communication circuit and the memory and a predetermined control circuit for reading, the chip mounting pads 32 that extend to the antenna pattern 30 and for electrically connecting and a tip electrode (not shown). なお、この制御回路は、必ずしもICチップ40内に設けられていなくてもよい。 This control circuit may not necessarily provided on the IC chip 40.

つぎに、RFIDタグ5の製造方法について説明する。 Next, a method for manufacturing the RFID tag 5. 先ず、誘電体部材10にアンテナパターン30およびチップ搭載パッド32をエッチング等により形成し、ループアンテナを形成する(ループアンテナ形成工程)。 First, the antenna pattern 30 and chip-mounting pads 32 are formed by etching the dielectric member 10 to form a loop antenna (loop antenna formation step).

つぎに、ICチップ40の実装工程が行われる。 Next, the mounting process of the IC chip 40 is performed. すなわち、上記チップ搭載パッド32にICチップ40の上記チップ電極が電気的に接続するように、当該ICチップ40を実装する。 That is, the chip electrodes of the IC chip 40 to the chip mounting pad 32 so as to be electrically connected, to implement the IC chip 40. この実装手段としては、たとえばいわゆるフリップチップ実装を採用することができる。 As the mounting means may be employed for example a so-called flip-chip mounting.

以上のように構成されたRFIDタグ5は、図2に示すように、たとえばワイン入りのビン等の電波吸収体100に接着剤(たとえば、両面テープ)140等を用いて貼付され、図示しない所定の保護フィルム等で被覆されて使用される。 Given the RFID tag 5 having the configuration described above, as shown in FIG. 2, for example adhesive wave absorber 100 bins, etc. containing wine (e.g., double-sided tape) is stuck with 140, etc., not shown which is the covered with a protective film or the like is used. なお、このRFIDタグ5は、使用する物品へ貼付するための上記接着剤140や上記保護フィルム等を予め備えて構成されていてもよい。 Incidentally, the RFID tag 5 may be configured with advance the adhesive 140 and the protective film or the like to be attached to an article to be used.

つぎに、RFIDタグ5により、大きな電流ループが形成される原理、すなわち従来技術の場合よりも通信距離が伸びる原理について図3に基づいて説明する。 Next, the RFID tag 5, the principle of a large current loop is formed, that will be described with reference to FIG. 3 the principle of communication distance increases than the prior art. 図3に示すように、誘電体部材10の周囲には、アンテナパターン30によって微小ループアンテナ30aが形成される。 As shown in FIG. 3, around the dielectric member 10, small loop antenna 30a is formed by the antenna pattern 30. そして、電波吸収体100にもこの微小ループアンテナ30aによりイメージ電流30bが形成される。 Then, in the radio wave absorber 100 image current 30b is formed by the small loop antenna 30a.

これらの微小ループアンテナ30aおよびイメージ電流30bによって、更に大きな電流ループ30cが形成され、この大きな電流ループ30cによりループアンテナの利得を向上させ、通信距離を伸ばすことができる。 These small loop antenna 30a and the image current 30b, is a larger current loop 30c is formed, the gain of the loop antenna is improved by the large current loop 30c, it is possible to extend the communication distance. すなわち、通信距離の低下を抑制することができる。 That is, it is possible to suppress a decrease in communication distance. また、アンテナパターン30が誘電体部材10に形成されているので、外力を受けてもアンテナパターン30が潰れる虞はない。 Further, since the antenna pattern 30 is formed on the dielectric member 10, there is no possibility that the antenna pattern 30 is crushed even by an external force.

したがって、このRFIDタグ5を用いたRFIDタグが非接触で外部機器(図示せず)から電力供給および情報を受け、当該外部機器へ情報を送出する際には、上記アンテナ利得の向上により当該外部機器に感度良く確実に電波情報を送出することができ、データ通信の信頼性を高めることができる。 Therefore, when the RFID tag using the RFID tag 5 is supplied with power and information from an external device (not shown) in a non-contact, and sends the information to the external device, the external by improving the above antenna gain sensitivity to the device may reliably be able to deliver the radio wave information, it is possible to increase the reliability of data communication. なお、上記実施例1においては、RFIDタグ5に直方体状の誘電体部材10を用いるものとして説明したが、これに限定されず、RFIDタグを使用する物品に応じて誘電体部材10を種々の形状(たとえば、円柱、三角柱、球等)とすることができる。 In the above embodiment 1, the RFID tag 5 rectangular has been described as using the dielectric member 10 is not limited thereto, the dielectric member 10 in response to an article using an RFID tag various shape (e.g., cylindrical, triangular prism, spherical, etc.) can be used.

図4は、この発明の実施例2に係るRFIDタグを示す斜視図、図5は、フィルム基材を示す平面図である。 Figure 4 is a perspective view of the RFID tag according to a second embodiment of the present invention, FIG 5 is a plan view showing a film substrate. 以下の説明において、すでに説明した部材と同一もしくは相当する部材には、同一の符号を付して重複説明を省略または簡略化する。 In the following description, already in the member and the same or corresponding members described will be omitted or simplified redundant description are denoted by the same reference numerals.

図4に示すように、本実施例2に係るRFIDタグ5は、誘電体部材10と、送受信用のアンテナパターン30が形成され誘電体部材10の表面に巻き付けられたフィルム基材20と、アンテナパターン30に接続されたICチップ40とを備えて構成されている。 As shown in FIG. 4, RFID tag 5 according to the second embodiment, the dielectric member 10, the film substrate 20 wound on the surface of the antenna pattern 30 for transmitting and receiving are formed dielectric member 10, an antenna It is constituted by an IC chip 40 connected to the pattern 30.

直方体状の誘電体部材10は、所定の誘電率を有する誘電体からなっており、ガラス等を含まない安価な樹脂のみにより形成することができる。 Rectangular shaped dielectric member 10 is formed of a dielectric having a predetermined dielectric constant, it can be formed only by inexpensive resin that does not contain glass or the like. たとえば、この誘電体部材10は、成形加工性、機械的性質等に優れた、ポリテトラフルオロエチレン(PTFE)、ポリフェニレンエーテル(PPE)等の樹脂により形成することができる。 For example, the dielectric member 10, moldability, excellent mechanical properties such as polytetrafluoroethylene (PTFE), may be formed of a resin of a polyphenylene ether (PPE) or the like.

また、図4および図5に示すように、フィルム基材20には、送受信用のループアンテナを形成するためのアンテナパターン30が印刷手段により形成されている。 Further, as shown in FIGS. 4 and 5, the film substrate 20, the antenna pattern 30 for forming a loop antenna for transmitting and receiving are formed by printing means. このフィルム基材20は、たとえば可撓性を有する熱可塑性プラスチックからなっている。 The film substrate 20 is made of a thermoplastic plastic with for example flexible. すなわち、フィルム基材20の材質としては、たとえばポリエチレンテレフタレート(以下、PETと略称する)、ポリイミド(PI)、ポリエチレンナフタレート(PEN)、ポリ塩化ビニル(PVC)を使用することができる。 That is, as the material of the film substrate 20, such as polyethylene terephthalate (hereinafter, abbreviated as PET), polyimide (PI), it is possible to use polyethylene naphthalate (PEN), polyvinyl chloride (PVC).

加工性、絶縁性、機械的強度、価格面を考慮すると、フィルム基材20の材質としては、PETが最適である。 Processability, insulating property, mechanical strength, considering the price point, as the material of the film substrate 20, PET is optimal. なお、フィルム基材20の大きさは、図4に示すように、アンテナパターン30によってループアンテナを形成できるように、誘電体部材10に過不足無く巻き付けられる程度である。 The size of the film substrate 20, as shown in FIG. 4, so as to form a loop antenna by the antenna pattern 30, is the degree to which wound without excess or deficiency in the dielectric member 10.

アンテナパターン30は、たとえば導線性ペーストをフィルム基材20上にスクリーン印刷することにより形成されている。 Antenna pattern 30 is formed by screen printing for example a conductor paste on the film substrate 20. また、フィルム基材20は、ICチップ40を搭載しアンテナパターン30と電気的に接続するための一対のチップ搭載パッド32を備えている。 The film substrate 20 is provided with a pair of chip mounting pads 32 for connecting an IC chip 40 antenna pattern 30 electrically. このチップ搭載パッド32も、導線性ペーストをフィルム基材20上にスクリーン印刷することにより上記アンテナパターン30とともに同時に形成することができる。 The chip-mounting pads 32 may be formed simultaneously with the antenna pattern 30 by screen printing a conductor paste on the film substrate 20. なお、このRFIDタグ5により、大きな電流ループが形成され、従来技術の場合よりも通信距離が伸びる原理は、上記実施例1で説明した内容と同様であるので、重複説明を省略する。 Incidentally, this RFID tag 5, a large current loop is formed, the principle that the communication distance increases than in the prior art are the same as described in Example 1, the duplicated description thereof is omitted.

つぎに、RFIDタグ5の製造方法について説明する。 Next, a method for manufacturing the RFID tag 5. 先ず、アンテナパターン30を有したフィルム基材20を、誘電体部材10の角部に対応した折り曲げ部22で折り曲げ、当該誘電体部材10に巻き付けて固定する。 First, the film substrate 20 having an antenna pattern 30 is bent at bent portion 22 corresponding to the corner portions of the dielectric member 10 is fixed by winding on the dielectric member 10. このフィルム基材20と誘電体部材10との固定は、接着剤や両面テープ等を用いて行うことができる。 Fixed with the film substrate 20 and the dielectric member 10 can be performed by using an adhesive or double-sided tape or the like. これにより、ループアンテナを形成することができる。 Thus, it is possible to form the loop antenna. 以上がループアンテナ形成工程である。 This is the loop antenna formation step.

つぎに、ICチップ40の実装工程が行われる。 Next, the mounting process of the IC chip 40 is performed. すなわち、チップ搭載パッド32にICチップ40のチップ電極が電気的に接続するように当該ICチップ40を実装する。 That is, the chip electrodes of the IC chip 40 to the chip mounting pads 32 to implement the IC chip 40 to be electrically connected. この実装手段としては、たとえばいわゆるフリップチップ実装を採用することができる。 As the mounting means may be employed for example a so-called flip-chip mounting.

以上のように、本実施例2に係るRFIDタグ5によれば、上記実施例1の場合と同様の効果を奏するほか、RFIDタグ5は、安価かつ加工性の良い誘電体部材10にアンテナパターン30を有したフィルム基材20を巻き付け、チップ搭載パッド32にICチップ40を実装することにより容易かつ安価に製造することができるので、更に安価なRFIDタグ5を提供することができる。 As described above, according to the RFID tag 5 according to the second embodiment, in addition to the same effects as in the above Example 1, the RFID tag 5 has an antenna pattern in a good dielectric member 10 with low cost and processability winding a film substrate 20 having a 30, it is possible to easily and inexpensively manufactured by mounting the IC chip 40 to the chip mounting pad 32 can provide a more inexpensive RFID tag 5.

なお、上記実施例2においては、RFIDタグ5に直方体状の誘電体部材10を用いるものとして説明したが、これに限定されず、RFIDタグ5を使用する物品に応じて誘電体部材10を、たとえば円柱、三角柱、球等、種々の形状とすることができる。 In the above embodiment 2 has been described as using rectangular shaped dielectric member 10 in the RFID tag 5 is not limited thereto, the dielectric member 10 in response to an article using an RFID tag 5, for example it is possible to cylindrical, triangular prism, spherical, etc., and various shapes.

たとえば、図6に示すように、円柱状の誘電体部材10にフィルム基材20を巻き付けてRFIDタグ5を構成してもよい。 For example, as shown in FIG. 6, it may constitute the RFID tag 5 by winding a film substrate 20 on the cylindrical dielectric member 10. あるいは、図7および図8に示すように、三角柱状の誘電体部材10にフィルム基材20を巻き付けてRFIDタグ5を構成してもよい。 Alternatively, as shown in FIGS. 7 and 8, it may constitute the RFID tag 5 by winding a film substrate 20 on the triangular prism shaped dielectric member 10. これらの場合も、上記実施例2の場合と同様の効果を期待できる。 In these cases, it can be expected the same effect as the above second embodiment. ここで、図6、図7および図8は、他のRFIDタグを示す斜視図である。 Here, FIG. 6, 7 and 8 are perspective views showing the other RFID tags.

図9は、この発明の実施例3に係るRFIDタグを示す斜視図、図10は、フィルム基材を示す平面図である。 Figure 9 is a perspective view of the RFID tag according to the third embodiment of the present invention, FIG 10 is a plan view showing a film substrate. 本実施例3は、図9および図10に示すように、アンテナパターン30へのICチップ40の給電点位置を調整できるように、チップ搭載パッド32を当該アンテナパターン30に沿って長手状に併設したものである。 The third embodiment, as shown in FIGS. 9 and 10, so as to adjust the feed point position of the IC chip 40 to the antenna pattern 30, parallel in the longitudinal shape along the chip mounting pads 32 to the antenna pattern 30 one in which the.

すなわち、チップ搭載パッド32は、アンテナパターン30と接続部32aで接続され、当該アンテナパターン30と平行に設けられている。 That is, the chip mounting pads 32 are connected by the connecting portion 32a and the antenna pattern 30 is provided in parallel with the antenna pattern 30. これらチップ搭載パッド32および接続部32aは、アンテナパターン30と同一材料にて形成されており、フィルム基材20にアンテナパターン30を印刷形成する時に同時に形成される。 These chip mounting pads 32 and the connecting portion 32a is formed at the antenna pattern 30 and the same material, is formed at the same time when printing forming the antenna pattern 30 on the film substrate 20.

また、図9に示すように、フィルム基材20は、アンテナパターン30がパッチアンテナとして機能するように誘電体部材10に巻き付けられ、貼付されている。 Further, as shown in FIG. 9, the film substrate 20 is wrapped dielectric member 10 so that the antenna pattern 30 functions as a patch antenna, is affixed. ICチップ40は、フィルム基材20が誘電体部材10に貼付された後に給電点位置を調整して実装される。 IC chip 40, the film substrate 20 is mounted by adjusting the feeding point position after being attached to the dielectric member 10.

すなわち、ICチップ40のチップ電極(図示せず)をチップ搭載パッド32とアンテナパターン30に電気的に接続させ、かつ、チップ搭載パッド32の長手方向(図中の矢印方向)にスライドさせて搭載位置を変更することによって給電点位置を調整する。 That is, the chip electrodes of the IC chip 40 (not shown) electrically connected to the chip mounting pad 32 and the antenna pattern 30, and, by sliding in the longitudinal direction of the chip mounting pads 32 (arrow direction in the drawing) mounted adjusting the feed point position by changing the position.

そして、この給電点位置の調整が終了したら、その位置にICチップ40を実装する。 Then, the adjustment of the feeding point position When finished, mounting the IC chip 40 at that position. この実装手段としては、上記実施例2と同様に、たとえばフリップチップ実装を採用することができる。 As the mounting means, in the same manner as in Example 2, for example, it can be employed flip chip mounting.

以上のように、本実施例3に係るRFIDタグ5によれば、上記実施例2の場合と同様の効果を奏するほか、ICチップ40の搭載位置を変更することによって給電点位置を容易に調整することができるので、アンテナの特性を容易に調整することができるという効果を奏する。 As described above, according to the RFID tag 5 according to the third embodiment, in addition to the same effects as in the above Example 2, easily adjust the feeding point position by changing the mounting position of the IC chip 40 it is possible to, an effect that the characteristics of the antenna can be easily adjusted.

図11は、この発明の実施例4に係るRFIDタグを示す斜視図、図12は、フィルム基材を示す平面図である。 Figure 11 is a perspective view of the RFID tag according to a fourth embodiment of the present invention, FIG 12 is a plan view showing a film substrate. なお、この図12においては、アンテナパターン30はフィルム基材20の裏面に形成されているが、説明の便宜上、アンテナパターン30を透視的に表示(フィルム基材20の表面側に記載)してある。 Incidentally, in this FIG. 12, the antenna pattern 30 is formed on the back surface of the film substrate 20, for convenience of explanation, perspectively view the antenna pattern 30 (according to the surface side of the film substrate 20) to is there.

本実施例4は、上記実施例3と同様に、ICチップ40の搭載位置を変更することによって給電点位置を容易に調整することができるように、フィルム基材20にチップ搭載パッド32を設けたものである。 The fourth embodiment, similarly to the third embodiment, as the feed point position can be easily adjusted by changing the mounting position of the IC chip 40, the chip mounting pads 32 provided on the film substrate 20 those were. すなわち、図11および図12に示すように、アンテナパターン30へのICチップ40の給電点位置を調整できるように、フィルム基材20に対して逆T字状のフィルム基材延設部20aを設け、このフィルム基材延設部20aにチップ搭載パッド32をアンテナパターン30に沿って長手状に併設したものである。 That is, as shown in FIGS. 11 and 12, so as to adjust the feed point position of the IC chip 40 to the antenna pattern 30, an inverted T-shaped film substrate extension portion 20a with respect to the film substrate 20 It provided, in which features a longitudinal shape the chip mounting pads 32 on the film substrate extension portion 20a along the antenna pattern 30.

また、図11に示すように、フィルム基材20およびフィルム基材延設部20aは、アンテナパターン30がいわゆるパッチアンテナとして機能するように、誘電体部材10に巻き付けられ、貼付されている。 Further, as shown in FIG. 11, the film substrate 20 and the film substrate extension portion 20a, as the antenna pattern 30 functions as a so-called patch antenna, wound around the dielectric member 10 is attached. その他の構成およびICチップ40の搭載位置の調整要領は、上記実施例3の場合と同様であるので、重複説明を省略する。 Adjustment procedure of mounting position of the other configurations and the IC chip 40 are the same as in the case of Example 3, a repeated explanation thereof.

以上のように、本実施例4に係るRFIDタグ5によれば、上記実施例2の場合と同様の効果を奏するほか、ICチップ40の搭載位置を変更することによって給電点位置を容易に調整することができるので、アンテナの特性を容易に調整することができるという効果を奏する。 As described above, according to the RFID tag 5 according to the fourth embodiment, in addition to the same effects as in the above Example 2, easily adjust the feeding point position by changing the mounting position of the IC chip 40 it is possible to, an effect that the characteristics of the antenna can be easily adjusted.

図13は、この発明の実施例5に係るRFIDタグを示す斜視図である。 Figure 13 is a perspective view of the RFID tag according to the fifth embodiment of the present invention. 図13に示すように、本実施例5は、誘電体部材10の外周面にフィルム基材20が係合可能な凹部10aを設け、誘電体部材10に対するフィルム基材20の位置合わせを容易にしたものである。 As shown in FIG. 13, the present embodiment 5, the the outer circumferential surface film substrate 20 is engageable recess 10a of the dielectric member 10 is provided, to facilitate alignment of the film substrate 20 to the dielectric member 10 one in which the.

また、凹部10aの深さは、フィルム基材20の厚みとICチップ40の厚みの合計とほぼ同程度としてある。 The depth of the recess 10a is as substantially the same as the sum of the thicknesses of the IC chip 40 of the film substrate 20. すなわち、実装されたICチップ40の上面が凹部10a内に収まり、誘電体部材10の外表面から出っ張らないようになっている。 That is, the upper surface of the IC chip 40 mounted fits in the recess 10a, so that the does not project from the outer surface of the dielectric member 10. その他の構成および製造方法は、上記実施例2の場合と同様であるので、重複説明を省略する。 Other configurations and manufacturing methods are the same as in the case of Example 2, the duplicated description thereof is omitted.

以上のように、本実施例5に係るRFIDタグ5によれば、上記実施例2の場合と同様の効果を奏するほか、誘電体部材10に凹部10aを設けたことにより、誘電体部材10に対するフィルム基材20の位置合わせを容易に行うことができるという効果を奏する。 As described above, according to the RFID tag 5 according to the fifth embodiment, in addition to the same effects as in Example 2 above, by providing the concave portion 10a on the dielectric member 10, relative to the dielectric member 10 an effect that the alignment of the film substrate 20 can be easily performed.

また、実装されたICチップ40の上面が凹部10a内に収まり、誘電体部材10の外表面から出っ張らないようになっているので、RFIDタグ5が電波吸収体等の物品に貼られ、保護フィルム等で被覆されてRFIDタグとして使用される際に当該RFIDタグに応力が集中しにくく、外力に対して耐久性が向上するという効果も奏する。 The upper surface of the IC chip 40 mounted fits in the recess 10a, since so does not project from the outer surface of the dielectric member 10, RFID tag 5 is affixed to an article of the radio wave absorber or the like, a protective film is hard to concentrate stress to the RFID tag when it is used as an RFID tag covered with like effect so that improved durability against an external force.

また、RFIDタグ5が平坦であれば、当該RFIDタグ5が人体に触れる場合(たとえば、衣類の裏地等にRFIDタグ5が設けられる場合)であっても、不快感が無く肌触りが良いという効果も奏する。 Further, if the flat RFID tag 5, if the RFID tag 5 touches the human body (for example, if the RFID tag 5 is provided on the lining or the like of the clothing) Even, effect is good without skin discomfort also to do so.

なお、本実施例5は、後述するすべての実施例(後述する実施例9については、上記凹部10aと同様の機能を有する凹部を後述する誘電体支持部材60に設ければよい)について適用することができ、同様の効果を期待できる。 The present embodiment 5, (for later-described Example 9, provided it may in the dielectric support member 60 to be described later a recess having the same function as the recess 10a) all the Examples described later to apply the it can be, can expect a similar effect.

図14は、この発明の実施例6に係るRFIDタグを示す斜視図、図15は、誘電体部材に形成されたチップ搭載パッドにICチップを実装した状態を示す斜視図である。 Figure 14 is a perspective view of the RFID tag according to a sixth embodiment of the present invention, FIG 15 is a perspective view showing a state of mounting the IC chip on the chip mounting pads formed on the dielectric member. 本実施例5に係るRFIDタグ5は、図15に示すように、予め誘電体部材10側にチップ搭載パッド12を設け、このチップ搭載パッド12にICチップ40を実装した後、図14に示すように、フィルム基材20の内面(裏面)に印刷されたアンテナパターン30が当該チップ搭載パッド12と電気的に接続するように当該フィルム基材20を誘電体部材10に巻き付けて構成したものである。 RFID tag 5 according to the fifth embodiment, as shown in FIG. 15, the chip mounting pads 12 provided in advance dielectric member 10 side, after mounting the IC chip 40 on the chip-mounting pads 12, shown in FIG. 14 as such, those antenna pattern 30 printed on the inner surface (back surface) of the film substrate 20 is constituted by winding the film substrate 20 so as to connect the chip mounting pad 12 and electrically to the dielectric member 10 is there.

チップ搭載パッド12は、誘電体部材10に、たとえば銅をエッチングして形成したり、導電性インキを印刷して形成したり、あるいは導電性部材を貼付することによって形成することができる。 Chip-mounting pads 12 can be formed by affixing the dielectric member 10, for example, or formed by etching the copper, it may be formed by printing a conductive ink, or a conductive member. また、このチップ搭載パッド12とアンテナパターン30の導通および固定は、たとえば当該接続面に導電性接着剤(銀ペースト)を塗布し、両者を貼り合わせた後に当該部分を加圧および加熱することによって行うことができる。 Further, conduction and fixed in the chip-mounting pads 12 and the antenna pattern 30, for example, a conductive adhesive (silver paste) was applied to the connecting surface, by the portion after bonding both to pressure and heat It can be carried out. なお、ICチップ40の実装方法およびフィルム基材20の巻き付け方法は、上記実施例2の場合と同様であるので、重複説明を省略する。 Incidentally, method of winding a mounting method and the film substrate 20 of the IC chip 40 are the same as in the case of Example 2, the duplicated description thereof is omitted.

以上のように、本実施例6に係るRFIDタグ5によれば、上記実施例2の場合と同様の効果を奏するほか、実装されたICチップ40の特性に最も適合したアンテナパターン30を有するフィルム基材20を選択して誘電体部材10に巻き付けることにより、送受信特性を調整することができるという効果を奏する。 As described above, according to the RFID tag 5 according to the sixth embodiment, a film having the above-described case of Example 2 and in addition to the same effect, the antenna pattern 30 that best fit the characteristics of the IC chip 40 mounted by wrapping the dielectric member 10 by selecting the substrate 20, an effect that it is possible to adjust the transmission and reception characteristics.

図16は、この発明の実施例7に係るRFIDタグを示す斜視図、図17は、フィルム基材を示す平面図である。 Figure 16 is a perspective view of the RFID tag according to a seventh embodiment of the present invention, FIG 17 is a plan view showing a film substrate. 本実施例7に係るRFIDタグ5は、図16に示すように、ICチップ40の搭載位置が誘電体部材10の側面部となるようにしたものである。 RFID tag 5 according to the seventh embodiment, as shown in FIG. 16, the mounting position of the IC chip 40 is obtained as a side surface of the dielectric member 10. 換言すれば、RFIDタグ5の最大平面部分にICチップ40の厚みによる出っ張りが生じないように構成したものである。 In other words, which is constituted so as not to cause bulge due to the thickness of the IC chip 40 to the maximum plane portion of the RFID tag 5.

ICチップ40をこのような位置に搭載できるようにするために、フィルム基材20は、図17に示すように形成されている。 The IC chip 40 in order to be able to mount such a position, the film substrate 20 is formed as shown in FIG. 17. すなわち、フィルム基材20には、当該フィルム基材20を誘電体部材10に巻き付けた際に、当該誘電体部材10の一の側面部に対向して延びる一対のフィルム基材延設部20bとチップ搭載パッド32が形成されている。 That is, the film substrate 20, the film substrate 20 when wrapped around the dielectric member 10, a pair of film substrate extended portion 20b extending opposite the one side surface portion of the dielectric member 10 chip mounting pads 32 are formed.

このチップ搭載パッド32は、フィルム基材延設部20b上にアンテナパターン30と連続して印刷されている。 The chip-mounting pads 32 are printed continuously with the antenna pattern 30 on a film substrate extended portion 20b. なお、ICチップ40の実装方法およびフィルム基材20の巻き付け方法は、上記実施例2の場合とほぼ同様であるので、重複説明を省略する。 Incidentally, method of winding a mounting method and the film substrate 20 of the IC chip 40 is substantially the same as the case of Example 2, the duplicated description thereof is omitted.

以上のように、本実施例7に係るRFIDタグ5によれば、上記実施例2の場合と同様の効果を奏するほか、ICチップ40を誘電体部材10の一の側面部に搭載とすることにより、RFIDタグ5の最大平面部分にICチップ40の厚みによる出っ張りが生じないようにすることができるという効果を奏する。 As described above, according to the RFID tag 5 according to the embodiment 7, in addition to the same effects as in the above Example 2, be mounted IC chip 40 on one side of the dielectric member 10 Accordingly, there is an effect that it is possible to prevent the occurrence bulges due to the thickness of the IC chip 40 to the maximum plane portion of the RFID tag 5.

したがって、上記実施例5に示した効果と同様に、RFIDタグ5が所定の被覆加工を施されて所定の物品に使用される際に、RFIDタグ5に応力が集中しにくく、外力に対して耐久性が向上する。 Therefore, similar to the effect shown in the above Example 5, when the RFID tag 5 is used for a given article is subjected to predetermined coating processing, stress is hardly concentrated on the RFID tag 5 against external force durability is improved. また、RFIDタグ5が人体に触れる場合には、出っ張りによる不快感が無く肌触りが良い。 In addition, if the RFID tag 5 touches the human body, there is no feel good discomfort by the ledge.

なお、本実施例7においては、RFIDタグ5に直方体状の誘電体部材10を用いるものとして説明したが、これに限定されず、RFIDタグ5を使用する物品に応じて誘電体部材10を種々の形状(たとえば、円柱、三角柱、球等)とすることができる。 In the present embodiment 7 has been described as using rectangular shaped dielectric member 10 in the RFID tag 5 is not limited thereto, the dielectric member 10 in response to an article using an RFID tag 5 Various can be shaped (e.g., cylindrical, triangular prism, spherical, etc.) to.

たとえば、図18に示すように、円柱状の誘電体部材10にフィルム基材20を巻き付け、当該円柱の円板部分にICチップ40を搭載することによってRFIDタグ5を構成してもよい。 For example, as shown in FIG. 18, wrapped around the film substrate 20 in the cylindrical dielectric member 10 may constitute the RFID tag 5 by mounting the IC chip 40 to the disc portion of the cylinder. ここで、図18は、他のRFIDタグを示す斜視図である。 Here, FIG. 18 is a perspective view showing another RFID tag.

図19は、この発明の実施例8に係るRFIDタグを示す断面図である。 Figure 19 is a cross-sectional view of the RFID tag according to an eighth embodiment of the present invention. 本実施例8に係るRFIDタグ5は、図19に示すように、誘電体部材10にICチップ40を埋設可能なICチップ用凹部(凹部)10bを設け、このICチップ用凹部10bにICチップ40を埋設し、かつフィルム基材20の内面側に形成されたアンテナパターン30と当該ICチップ40とが電気的に接続するように、当該フィルム基材20を誘電体部材10に巻き付けて構成したものである。 RFID tag 5 according to the eighth embodiment, as shown in FIG. 19, the implantable IC chip recess (recess) 10b of the IC chip 40 provided on the dielectric member 10, the IC chip to the IC chip recess 10b buried 40, and the antenna pattern 30 formed on the inner surface side of the film substrate 20 and the corresponding IC chip 40 so as to be electrically connected, constituted by winding the film substrate 20 to the dielectric member 10 it is intended. 換言すれば、RFIDタグ5の表面にICチップ40の厚みによる出っ張りが生じないように構成したものである。 In other words, which is constituted so as not to cause bulge due to the thickness of the IC chip 40 on the surface of the RFID tag 5.

ICチップ40は、そのチップ電極(図示せず)に予めバンプ50が設けられている。 IC chip 40 in advance bumps 50 are provided on the chip electrodes (not shown). このICチップ40は、上記バンプ50側を上方にしてICチップ用凹部10bの底面に熱硬化性接着剤や瞬間接着剤等によって固定される。 The IC chip 40 is fixed to the bottom surface of the IC chip recess 10b and the bumps 50 side upward by thermosetting adhesive or an instant adhesive or the like. また、バンプ50およびICチップ40を固定して保護するために、ICチップ40周囲の所定箇所にはアンダーフィル52が塗布される。 Further, in order to protect and secure the bump 50 and the IC chip 40, underfill 52 is applied to the predetermined portion of the peripheral IC chip 40. そして、アンテナパターン30とICチップ40のバンプ50とが電気的に接続するようにフィルム基材20を誘電体部材10に巻き付けて接着する。 Then, the bumps 50 of the antenna pattern 30 and IC chip 40 are bonded by winding film substrate 20 so as to be electrically connected to the dielectric member 10.

アンテナパターン30とバンプ50の導通および固定は、たとえば当該接続面に導電性接着剤(銀ペースト)を塗布し、両者を貼り合わせた後に当該部分を加圧および加熱することによって行うことができる。 Conduction and fixing of the antenna pattern 30 and the bumps 50 can for example be done by a conductive adhesive (silver paste) was applied to the connecting surface, the portion after bonding both to pressure and heat.

以上のように、本実施例8に係るRFIDタグ5によれば、上記実施例2の場合と同様の効果を奏するほか、ICチップ40を誘電体部材10のICチップ用凹部10bに埋設することにより、RFIDタグ5の表面にICチップ40の厚みによる出っ張りが生じないようにすることができるという効果を奏する。 As described above, according to the RFID tag 5 according to the eighth embodiment, in addition to the same effects as in the above Example 2, to embed the IC chip 40 to the IC chip recess 10b of the dielectric member 10 Accordingly, there is an effect that it is possible to prevent the occurrence bulges due to the thickness of the IC chip 40 on the surface of the RFID tag 5.

したがって、上記実施例5に示した効果と同様に、RFIDタグ5が所定の被覆加工を施されて使用される際に、RFIDタグ5に応力が集中しにくく、外力に対して耐久性が向上する。 Therefore, similar to the effect shown in the above Example 5, increase in the RFID tag 5 is used is subjected to predetermined coating processing, stress is hardly concentrated on the RFID tag 5, durability against external forces to. また、RFIDタグ5が人体に触れる場合には、出っ張りによる不快感が無く肌触りが良い。 In addition, if the RFID tag 5 touches the human body, there is no feel good discomfort by the ledge.

なお、上記実施例8においては、フィルム基材20の長手方向両端部がICチップ用凹部10bに位置するように当該フィルム基材20を誘電体部材10に巻き付ける場合について説明したが、これに限定されず、フィルム基材20の長手方向両端部がICチップ用凹部10b以外の箇所に位置するように当該フィルム基材20を誘電体部材10に巻き付けてもよい。 In the above embodiment 8, the description has been given of the case of winding the film substrate 20 so that the longitudinal direction both end portions of the film substrate 20 is positioned in the IC chip recess 10b in the dielectric member 10, limited to Sarezu, the film substrate 20 may be wrapped around the dielectric member 10 so that the longitudinal direction both end portions of the film substrate 20 is located at a position other than the IC chip recess 10b.

図20は、この発明の実施例9に係るRFIDタグを示す斜視図、図21は、誘電体部材を誘電体支持部材に固定したRFIDタグを示す斜視図である。 Figure 20 is a perspective view of the RFID tag according to a ninth embodiment of the present invention, FIG 21 is a perspective view showing an RFID tag with a fixed dielectric member in the dielectric support member. 本実施例9に係るRFIDタグ5は、図20に示すように、誘電体部材10と、この誘電体部材10を挿脱自在に支持する誘電体支持部材60と、アンテナパターン30が形成され誘電体支持部材10の表面に巻き付けられたフィルム基材20と、アンテナパターン30に電気的に接続されたICチップ40とを備えて構成されている。 RFID tag 5 according to the present embodiment 9, as shown in FIG. 20, a dielectric member 10, the dielectric support members 60 for supporting the dielectric member 10 removably, the antenna pattern 30 is formed a dielectric the body film substrate 20 wound on the surface of the support member 10 is configured by an IC chip 40 electrically connected to the antenna pattern 30.

プラスチック等の樹脂にて形成された誘電体支持部材60は、誘電体部材10を挿脱するための挿脱用孔62を備えており、誘電体支持部材60に対して誘電体部材10を図中の矢印方向にスライドさせることにより誘電率を調整し、アンテナの感度調整が容易に行えるようになっている。 Dielectric support member 60 formed of a resin such as plastic is provided with a insertion and removal hole 62 for inserting and removing the dielectric member 10, the dielectric member 10 with respect to the dielectric support member 60 FIG. adjust the dielectric constant by sliding in the direction of the arrow in, so that can be easily sensitivity adjustment of the antenna.

また、図21に示すように、調整した誘電体部材10の位置を保持するために、当該誘電体部材10と誘電体支持部材60とを固定用接着剤70によって固定してある。 Further, as shown in FIG. 21, in order to maintain the position of the adjusted dielectric member 10, it is fixed by the dielectric member 10 and the dielectric support member 60 and the fixing adhesive 70. この誘電体部材10の固定は、図21に示すように、固定用接着剤70を挿脱用孔62の開口縁部に付けて行うことができるが、挿脱用孔62の内部に付けて行ってもよい。 Fixing of the dielectric member 10, as shown in FIG. 21, although the fixing adhesive 70 can be performed with the opening edge of the insertion and removal hole 62, and attached to the inside of the insertion and removal hole 62 it may be carried out.

また、誘電体部材10の固定手段として、凹凸係合する係合用凸部および係合用凹部を備え、一定の外力を付加することにより当該係合位置を変更できるいわゆるノッチ手段等を採用してもよい。 Further, as the fixing means of the dielectric member 10, an engaging convex portion recess-projection engaging and provided with engagement recesses, even if a so-called notch means such as can change the engaging position by adding a predetermined external force good. なお、ICチップ40の実装方法およびフィルム基材20の巻き付け方法は、上記実施例2の場合と同様であるので、重複説明を省略する。 Incidentally, method of winding a mounting method and the film substrate 20 of the IC chip 40 are the same as in the case of Example 2, the duplicated description thereof is omitted.

以上のように、本実施例9に係るRFIDタグ5によれば、上記実施例2の場合と同様の効果を奏するほか、誘電体支持部材60に対して誘電体部材10を挿脱することにより誘電率を調整し、アンテナの感度調整を容易に行うことができるという効果を奏する。 As described above, according to the RFID tag 5 according to the embodiment 9, except that the same effects as in the above Example 2, by inserting and removing the dielectric member 10 with respect to the dielectric support member 60 adjust the dielectric constant, an effect that the sensitivity adjustment of the antenna can be easily performed.

また、ユーザーがRFIDタグを不活性化(交信不能化)したい場合には、上記固定用接着剤70を除去し、誘電体部材10を誘電体支持部材60から引き抜けばよく、当該不活性化を簡便に行うことができる。 Also, if the user wishes to deactivate the RFID tag (communication disabled) removes the fixing adhesive 70 may be pulled out of the dielectric member 10 from the dielectric support member 60, the inactivated it can be carried out easily.

図22は、この発明の実施例10に係るRFIDタグを示す斜視図である。 Figure 22 is a perspective view of the RFID tag according to the embodiment 10 of the present invention. 本実施例10に係るRFIDタグ5は、誘電率および誘電損失を調整するために、図22に示すように、誘電体部材10が、誘電率および誘電損失が異なる複数の誘電体部材10A,10Bを組み合わせて構成されていることを特徴とするものである。 RFID tag 5 according to the present embodiment 10, in order to adjust the dielectric constant and dielectric loss, as shown in FIG. 22, the dielectric member 10, a plurality of dielectric constant and dielectric loss are different dielectric member 10A, 10B and it is characterized in that it is constituted by combining.

たとえば、誘電率および誘電損失が高い誘電体部材10Aと、誘電率および誘電損失が低い誘電体部材10Bとを組み合わせる(両者を接着して一体化する)ことにより、これらの中間的な性質を持つ誘電体部材10を構成することができる。 Having for example, a dielectric constant and dielectric loss higher dielectric member 10A, by the dielectric constant and dielectric loss combined with the low dielectric member 10B (integrated by bonding them), these intermediate property It may constitute a dielectric member 10.

なお、図示例では、誘電体部材10A,10Bを左右方向に組み合わせたものを示したが、これに限定されず、たとえば上下方向(誘電体部材の厚み方向)に組み合わせてもよい。 In the illustrated example, it is shown a combination dielectric member 10A, and 10B in the lateral direction, not limited to this, for example, may be combined in the vertical direction (thickness direction of the dielectric member). ICチップ40の実装方法およびフィルム基材20の巻き付け方法は、上記実施例2の場合と同様であるので、重複説明を省略する。 Method of winding a mounting method and the film substrate 20 of the IC chip 40 are the same as in the case of Example 2, the duplicated description thereof is omitted.

以上のように、本実施例10に係るRFIDタグ5によれば、上記実施例2の場合と同様の効果を奏するほか、誘電率および誘電損失が異なる複数の誘電体部材10A,10Bを組み合わせて誘電体部材10を構成することにより、誘電率および誘電損失を任意に調整することができ、アンテナの感度調整を容易に行うことができるという効果を奏する。 As described above, according to the RFID tag 5 according to the embodiment 10, in addition to the same effects as in the above Example 2, in conjunction dielectric constant and dielectric loss different dielectric member 10A, and 10B by configuring the dielectric member 10, it is possible to arbitrarily adjust the dielectric constant and dielectric loss, an effect that the sensitivity adjustment of the antenna can be easily performed.

なお、本実施例10は、上述した実施例1〜8および後述する実施例12についても適用することができ、同様の効果を期待できる。 The present embodiment 10 can also be applied to Examples 1 to 8 and described below in Example 12 described above, can be expected a similar effect.

図23は、この発明の実施例11に係るRFIDタグを示す斜視図である。 Figure 23 is a perspective view of the RFID tag according to the embodiment 11 of the present invention. 本実施例11に係るRFIDタグ5は、図23に示すように、上記実施例2に係るRFIDタグ5の構成において誘電体部材10に空隙部80を備えたものである。 RFID tag 5 according to the present embodiment 11, as shown in FIG. 23, but with an air gap portion 80 in the dielectric member 10 in the configuration of the RFID tag 5 according to the second embodiment. この空隙部80は、誘電体部材10内に所定の空気層を形成させるための空間である。 The void portion 80 is a space for forming a predetermined air layer in the dielectric member 10. すなわち、誘電体部材10の誘電率は、この空隙部80に存在する空気の誘電率によって低下し、所望する値に設定される。 That is, the dielectric constant of the dielectric member 10 is reduced by the dielectric constant of the air present in the gap portion 80 is set to a desired value.

以上のように、本実施例11に係るRFIDタグ5によれば、上記実施例2の場合と同様の効果を奏するほか、誘電体部材10の空隙部80の容量を適宜変更することにより、誘電体部材10の誘電率を任意に調整することができ、アンテナの感度調整を容易に行うことができるという効果を奏する。 As described above, according to the RFID tag 5 according to the embodiment 11, in addition to the same effects as in Example 2 above, by appropriately changing the capacitance of the gap portion 80 of the dielectric member 10, dielectric it can be arbitrarily adjusted dielectric constant of the body member 10, an effect that the sensitivity adjustment of the antenna can be easily performed.

なお、本実施例11においては、上記実施例2に係るRFIDタグ5の構成において誘電体部材10に空隙部80を備えるものとして説明したが、これに限定されず、上記実施例1または実施例3〜実施例8のうちのいずれか一つの実施例に係る誘電体部材10に上記空隙部80を備えてもよい。 In this embodiment 11, the configuration of the RFID tag 5 according to the second embodiment has been described as the dielectric member 10 includes a gap portion 80 is not limited to this, Example 1 or Example 3 the dielectric member 10 according to any one of the embodiments of examples 8 may be provided with the gap portion 80. また、後述する実施例12に係る誘電体部材10に上記空隙部80を備えてもよい。 It is also provided with the above-mentioned gap portion 80 in the dielectric member 10 according to the embodiment 12 described later.

図24は、この発明の実施例12に係るRFIDタグを示す断面図、図25は、RFIDタグのラミネート工程を示す断面図である。 Figure 24 is a cross-sectional view of the RFID tag according to the embodiment 12 of the present invention, FIG 25 is a cross-sectional view illustrating a laminating process of the RFID tag. 上記実施例8では、図19に示したように、誘電体部材10の凹部10bにICチップ40を実装後、一枚のフィルム基材20を折り曲げ部22で折り曲げ、当該誘電体部材10に巻き付けることによってRFIDタグ5を構成した。 In Embodiment 8, as shown in FIG. 19, after mounting the IC chip 40 in the recess 10b of the dielectric member 10, bent at bent portion 22 of one film base material 20 is wound on the dielectric member 10 We configured the RFID tag 5 by.

これに対し、本実施例12では、図24および図25に示すように、2枚のフィルム基材20を誘電体部材10の表裏から貼付することによってRFIDタグ5を構成したものである。 In contrast, in Example 12, as shown in FIGS. 24 and 25, which is constituted of the RFID tag 5 by attaching the two film substrates 20 from front and back sides of the dielectric member 10.

すなわち、RFIDタグ5は、図25に示すように、一のフィルム基材20のアンテナパターン30に、ICチップ40を電気的に接続するICチップ実装工程と、このICチップ40が誘電体部材10に設けられた凹部10bに埋設されるように当該一のフィルム基材20を当該誘電体部材10の表面(一の面)に貼付する一方、他のフィルム基材20を誘電体部材10の裏面(他の面)に貼付し、更に両フィルム基材20のアンテナパターン30同士を銀ペースト等の導電性接着剤(導電性部材)24を介して接着し電気的に接続することによりループアンテナを形成するラミネート工程と、から製造されたものである。 That, RFID tag 5, as shown in FIG. 25, the antenna pattern 30 of one film substrate 20, an IC chip mounting process and, the IC chip 40 is dielectric member 10 for electrically connecting the IC chip 40 while attaching the one film substrate 20 so as to be buried in the concave portion 10b provided on the surface (one surface) of the dielectric member 10, the back surface of the dielectric member 10 the other film substrate 20 affixed to (another surface), the loop antenna by further connecting the antenna pattern 30 of both the film substrate 20 a conductive adhesive such as silver paste to adhere via the (conductive member) 24 electrically a laminating step of forming, it is those prepared from.

上記ICチップ実装工程では、たとえばいわゆるフリップチップ実装を採用することができる。 In the IC chip mounting step, it is possible to employ for example a so-called flip-chip mounting. また、上記ラミネート工程における両フィルム基材20の貼付およびアンテナパターン30の導通は、図25中に矢印で示すように、導電性接着剤24による接着部分を加圧および加熱することによって行うことができる。 Also, conduction of the adhesive and the antenna pattern 30 of both the film substrate 20 in the laminating process may be carried out by, as shown by the arrow, the adhered portion by the conductive adhesive 24 under pressure and heating it in 25 it can. なお、図示を省略するが、誘電体部材10とフィルム基材20の貼付面には、導電性接着剤24による接着面以外にも接着剤が用いられている。 Although not shown, the application surface of the dielectric member 10 and the film substrate 20, an adhesive other than the adhesive surface by the conductive adhesive 24 is used.

以上のように、本実施例12に係るRFIDタグ5によれば、上記実施例8の場合と同様の効果を奏するほか、上記ラミネート工程によってフィルム基材20の貼付およびアンテナパターン30の導通を、上記実施例8の場合(フィルム基材20を巻き付ける場合)よりも更に容易に行うことができるという効果を奏する。 As described above, according to the RFID tag 5 according to the present embodiment 12, in addition to the same effects as in the above Example 8, the continuity of the patch and the antenna pattern 30 of the film substrate 20 by the laminating process, an effect that can be carried out more easily than the case of example 8 (when winding the film substrate 20).

また、フィルム基材20によってICチップ40等がラミネートされているので、RFIDタグ5を保護するために別途の専用ラミネート部材(保護フィルム)を設ける必要がなく、部品点数を削減することができる。 Further, since the IC chip 40 or the like is laminated by the film substrates 20, it is unnecessary to provide a separate dedicated laminate member (protective film) for protecting the RFID tag 5, it is possible to reduce the number of parts.

(付記1)少なくとも、誘電体部材と、前記誘電体部材の表面にループ状に形成された送受信用のアンテナパターンと、通信回路と記憶回路を内蔵し前記アンテナパターンに電気的に接続されたICチップと、を備えたRFIDタグ。 (Supplementary Note 1) at least a dielectric member, an antenna pattern for transmitting and receiving which is formed in a loop shape on a surface of the dielectric member, which is a built-in communication circuit memory circuit electrically connected to said antenna pattern IC RFID tag having a chip, a.

(付記2)少なくとも、誘電体部材と、送受信用のアンテナパターンを有し前記誘電体部材の表面に設けられることによりループアンテナを形成するフィルム基材と、通信回路と記憶回路を内蔵し前記アンテナパターンに電気的に接続されたICチップと、を備えたRFIDタグ。 (Supplementary Note 2) at least incorporates a dielectric member, and the film substrate to form a loop antenna by provided on the surface of the dielectric member has an antenna pattern for transmitting and receiving, the communication circuit memory circuit said antenna RFID tag having an IC chip electrically connected to the pattern.

(付記3)前記フィルム基材は、前記ICチップを搭載し前記アンテナパターンと電気的に接続するためのチップ搭載パッドを備えたことを特徴とする付記2に記載のRFIDタグ。 (Supplementary Note 3) The film substrate, RFID tag according to Appendix 2, further comprising a chip mounting pad for mounting the IC chip connecting the antenna pattern electrically.

(付記4)前記誘電体部材は、前記ICチップを搭載し前記アンテナパターンと電気的に接続するためのチップ搭載パッドを備えたことを特徴とする付記2に記載のRFIDタグ。 (Supplementary Note 4) the dielectric member, RFID tag according to Appendix 2, further comprising a chip mounting pad for mounting the IC chip connecting the antenna pattern electrically.

(付記5)前記誘電体部材は、前記ICチップを埋設するための凹部を備え、当該凹部に当該ICチップを埋設したことを特徴とする付記2に記載のRFIDタグ。 (Supplementary Note 5) The dielectric member is provided with a recess for embedding the IC chip, RFID tag according to Appendix 2, characterized in that embedded the IC chip to the recess.

(付記6)前記チップ搭載パッドは、前記誘電体部材の一の側面部に向けて延設され、当該一の側面部に前記ICチップを位置させたことを特徴とする付記3に記載のRFIDタグ。 (Supplementary Note 6) the chip mounting pads, the extend toward the one side surface of the dielectric member, RFID according to appendix 3, characterized in that is positioned the IC chip on the side surface of the one tag.

(付記7)前記チップ搭載パッドは、前記ICチップの給電点位置を調整できるように前記アンテナパターンに沿って長手状に併設されたことを特徴とする付記3に記載のRFIDタグ。 (Supplementary Note 7) The chip mounting pads, RFID tag according to appendix 3, wherein the provided together longitudinally shape along the antenna pattern to calibrate their feeding point position of the IC chip.

(付記8)前記誘電体部材は、前記フィルム基材が係合可能な凹部を備えたことを特徴とする付記2〜4のいずれか一つに記載のRFIDタグ。 (Supplementary Note 8) The dielectric member, RFID tag according to any one of Appendices 2-4, characterized in that said film substrate comprising a engageable recess.

(付記9)前記誘電体部材は、複数の前記フィルム基材によって少なくとも表裏面を被覆されているとともに、当該フィルム基材の前記アンテナパターン同士は、導電性部材を介して電気的に接続されていることを特徴とする付記5に記載のRFIDタグ。 (Supplementary Note 9) the dielectric member, with being covered at least front and back surfaces of a plurality of the film substrate, the antenna patterns of the said film substrate are electrically connected via the conductive members RFID tag according to note 5, characterized in that there.

(付記10)前記凹部の深さは、前記アンテナパターンに接続された前記ICチップの頂面が前記誘電体部材の最外表面から突出しないように設定されていることを特徴とする付記8に記載のRFIDタグ。 Depth (Note 10) the recess, in appendix 8, characterized in that the top surface of the IC chip connected to the antenna pattern is set so as not to protrude from the outermost surface of the dielectric member RFID tag according.

(付記11)少なくとも、誘電体部材と、前記誘電体部材を挿脱自在に支持する誘電体支持部材と、送受信用のアンテナパターンを有し前記誘電体支持部材の表面に設けられることによりループアンテナを形成するフィルム基材と、通信回路と記憶回路を内蔵し前記アンテナパターンに電気的に接続されたICチップと、を備えたRFIDタグ。 (Supplementary Note 11) at least a dielectric member, said dielectric support member to the dielectric member to removably support, the loop antenna by provided on the surface of the dielectric support member has an antenna pattern for transmitting and receiving RFID tag having a film substrate to form a, an IC chip electrically connected to the built-mentioned antenna pattern and communication circuit memory circuit.

(付記12)前記誘電体支持部材に対して位置決めされた前記誘電体部材を当該誘電体支持部材に固定する誘電体部材固定手段を備えたことを特徴とする付記11に記載のRFIDタグ。 (Supplementary Note 12) RFID tag according to note 11, characterized in that said dielectric member positioned against the dielectric support member having a dielectric member fixing means for fixing to the dielectric support member.

(付記13)前記誘電体支持部材は、前記フィルム基材が係合可能な凹部を備えたことを特徴とする付記11または12に記載のRFIDタグ。 (Supplementary Note 13) The dielectric support member, RFID tag according to Appendix 11 or 12, characterized in that said film substrate comprising a engageable recess.

(付記14)前記誘電体部材は、誘電率および誘電損失が異なる複数の誘電体部材を組み合わせてなることを特徴とする付記1〜10のいずれか一つに記載のRFIDタグ。 (Supplementary Note 14) The dielectric member, RFID tag according to any one of Appendices 1 to 10, characterized in that dielectric constant and dielectric loss is a combination of different dielectric member.

(付記15)前記誘電体部材は、空隙部を備えたことを特徴とする付記1〜10のいずれか一つに記載のRFIDタグ。 (Supplementary Note 15) The dielectric member, RFID tag according to any one of Appendices 1 to 10, further comprising a void portion.

(付記16)送受信用のアンテナパターンを有したフィルム基材を誘電体部材の表面に設けループアンテナを形成するループアンテナ形成工程と、少なくとも通信回路と記憶回路を内蔵したICチップを前記アンテナパターンに電気的に接続するICチップ実装工程と、からなることを特徴とするRFIDタグの製造方法。 And the loop antenna formation step of forming a loop antenna provided (Supplementary Note 16) film substrate having an antenna pattern for transmitting and receiving on the surface of the dielectric member, the IC chip with a built-in at least the communication circuit memory circuit to the antenna pattern method of manufacturing the RFID tag, wherein the IC chip mounting step of electrically connecting, to be composed of.

(付記17)送受信用のアンテナパターンを誘電体部材の表面にループアンテナとなるように形成するループアンテナ形成工程と、通信回路と記憶回路を内蔵したICチップを前記アンテナパターンに電気的に接続するICチップ実装工程と、からなることを特徴とするRFIDタグの製造方法。 And the loop antenna formation step of forming such a loop antenna of the antenna pattern (Note 17) for transmission and reception on the surface of the dielectric member, to electrically connect the IC chip with a built-in communication circuit memory circuit to the antenna pattern method of manufacturing the RFID tag, wherein the IC chip mounting step, in that it consists.

(付記18)送受信用のアンテナパターンを有した一のフィルム基材の当該アンテナパターンに、通信回路と記憶回路を内蔵したICチップを電気的に接続するICチップ実装工程と、前記一のフィルム基材に実装された前記ICチップが誘電体部材に設けられた凹部に埋設されるように当該一のフィルム基材を当該誘電体部材の一の面に貼付する一方、送受信用のアンテナパターンを有した他のフィルム基材を前記誘電体部材の他の面に貼付し、更に前記一のフィルム基材と前記他のフィルム基材のアンテナパターン同士を導電性部材を介して接着し電気的に接続することによりループアンテナを形成するラミネート工程と、からなることを特徴とするRFIDタグの製造方法。 (Supplementary Note 18) to the antenna pattern of the one film substrate having an antenna pattern for transmitting and receiving, and the IC chip mounting step of electrically connecting the IC chip with a built-in communication circuit memory circuit, the one film group while the IC chip mounted on wood is affixed the one of the film substrate so as to be embedded in a recess provided in the dielectric member on one surface of the dielectric member, have the antenna pattern for transmitting and receiving electrically connecting the other of the film substrate is bonded through another affixed to a surface, further conductive member antenna patterns of the said other film substrate and the one film substrate of the dielectric member method of manufacturing the RFID tag of the lamination step of forming a loop antenna, characterized in that it consists by.

以上のように、この発明に係るRFIDタグおよびその製造方法は、RFIDタグが電波吸収体に対し近接して使用される場合であっても通信距離の低下を抑制することができ、通信の信頼性を確保することができるRFIDタグの提供に有用であり、特に、通信距離が短いRFIDタグに適している。 As described above, the RFID tag and a manufacturing method thereof according to the present invention, it is possible to suppress the reduction of an a even communication distance when the RFID tag is used in proximity to the wave absorber, the communication reliability it is useful in providing RFID tags that can be secured sex, particularly, the communication distance is suitable for short RFID tag.

この発明の実施例1に係るRFIDタグを示す斜視図である。 It is a perspective view of the RFID tag according to the first embodiment of the present invention. RFIDタグを電波吸収体に設けた状態を示す断面図である。 Is a cross-sectional view showing a state in which a RFID tag in the radio wave absorber. 大きな電流ループが形成される原理を示す概念図である。 Is a conceptual diagram illustrating the principle of a large current loop is formed. この発明の実施例2に係るRFIDタグを示す斜視図である。 It is a perspective view of the RFID tag according to a second embodiment of the present invention. フィルム基材を示す平面図である。 It is a plan view showing a film substrate. 他のRFIDタグを示す斜視図である。 It is a perspective view showing another RFID tag. 他のRFIDタグを示す斜視図である。 It is a perspective view showing another RFID tag. 他のRFIDタグを示す斜視図である。 It is a perspective view showing another RFID tag. この発明の実施例3に係るRFIDタグを示す斜視図である。 Is a perspective view showing an RFID tag according to the third embodiment of the present invention. フィルム基材を示す平面図である。 It is a plan view showing a film substrate. この発明の実施例4に係るRFIDタグを示す斜視図である。 It is a perspective view of the RFID tag according to a fourth embodiment of the present invention. フィルム基材を示す平面図である。 It is a plan view showing a film substrate. この発明の実施例5に係るRFIDタグを示す斜視図である。 It is a perspective view of the RFID tag according to the fifth embodiment of the present invention. この発明の実施例6に係るRFIDタグを示す斜視図である。 It is a perspective view of the RFID tag according to the sixth embodiment of the present invention. 誘電体部材に形成されたチップ搭載パッドにICチップを実装した状態を示す斜視図である。 It is a perspective view showing a state of mounting the IC chip on the chip mounting pads formed on the dielectric member. この発明の実施例7に係るRFIDタグを示す斜視図である。 It is a perspective view of the RFID tag according to a seventh embodiment of the present invention. フィルム基材を示す平面図である。 It is a plan view showing a film substrate. 他のRFIDタグを示す斜視図である。 It is a perspective view showing another RFID tag. この発明の実施例8に係るRFIDタグを示す断面図である。 It is a cross-sectional view of the RFID tag according to an eighth embodiment of the present invention. この発明の実施例9に係るRFIDタグを示す斜視図である。 It is a perspective view of the RFID tag according to a ninth embodiment of the present invention. 誘電体部材を誘電体支持部材に固定したRFIDタグを示す斜視図である。 The dielectric member is a perspective view of the RFID tag is fixed to the dielectric support member. この発明の実施例10に係るRFIDタグを示す斜視図である。 It is a perspective view of the RFID tag according to the embodiment 10 of the present invention. この発明の実施例11に係るRFIDタグを示す斜視図である。 It is a perspective view of the RFID tag according to the embodiment 11 of the present invention. この発明の実施例12に係るRFIDタグを示す断面図である。 It is a cross-sectional view of the RFID tag according to the embodiment 12 of the present invention. RFIDタグのラミネート工程を示す断面図である。 It is a cross-sectional view illustrating a laminating process of the RFID tag. 電波吸収体に平面アンテナを設けた従来技術を示す断面図である。 Is a sectional view showing a conventional art in which a planar antenna to the radio wave absorber. 電波吸収体にループアンテナを設けた従来技術を示す断面図である。 Is a sectional view showing a conventional art in which a loop antenna in the radio wave absorber.

符号の説明 DESCRIPTION OF SYMBOLS

5 RFIDタグ 10 誘電体部材 10A,10B 誘電体部材 10a 凹部 10b ICチップ用凹部(凹部) 5 RFID tag 10 dielectric member 10A, 10B dielectric member 10a recess 10b IC chip recess (concave portion)
12 チップ搭載パッド 20 フィルム基材 20a,20b フィルム基材延設部 22 折り曲げ部 24 導電性接着剤 30 アンテナパターン 30a ループアンテナ 32 チップ搭載パッド 32a 接続部 40 ICチップ 50 バンプ 52 アンダーフィル 60 誘電体支持部材 62 挿脱用孔 70 固定用接着剤 80 空隙部 100 電波吸収体 12 chip-mounting pads 20 film substrate 20a, 20b film substrate extended part 22 bent portion 24 conductive adhesive 30 antenna patterns 30a loop antenna 32 chip mount pad 32a connecting portion 40 IC chip 50 bumps 52 underfill 60 dielectric support member 62 insertion and removal hole 70 fastening adhesive 80 gap portion 100 wave absorber

Claims (10)

  1. 少なくとも、誘電体部材と、前記誘電体部材の表面に設けられループアンテナを形成する送受信用のアンテナパターンと、通信回路と記憶回路を内蔵し前記アンテナパターンに電気的に接続されたICチップと、を備えたRFIDタグ。 At least a dielectric member, and antenna patterns for transmission and reception to form a loop antenna provided on a surface of the dielectric member, and an IC chip electrically connected to the built-mentioned antenna pattern and communication circuit memory circuit, RFID tag with.
  2. 少なくとも、誘電体部材と、送受信用のアンテナパターンを有し前記誘電体部材の表面に設けられることによりループアンテナを形成するフィルム基材と、通信回路と記憶回路を内蔵し前記アンテナパターンに電気的に接続されたICチップと、を備えたRFIDタグ。 At least a dielectric member, electrically and incorporates a film substrate to form a loop antenna by provided on the surface of the dielectric member has an antenna pattern for transmitting and receiving, the communication circuit memory circuit and the antenna pattern RFID tag having connecting an IC chip, to.
  3. 前記フィルム基材は、前記ICチップを搭載し前記アンテナパターンと電気的に接続するためのチップ搭載パッドを備えたことを特徴とする請求項2に記載のRFIDタグ。 The film substrate, RFID tag according to claim 2, further comprising a chip mounting pad for mounting the IC chip connecting the antenna pattern electrically.
  4. 前記誘電体部材は、前記ICチップを搭載し前記アンテナパターンと電気的に接続するためのチップ搭載パッドを備えたことを特徴とする請求項2に記載のRFIDタグ。 It said dielectric member, RFID tag according to claim 2, further comprising a chip mounting pad for mounting the IC chip connecting the antenna pattern electrically.
  5. 前記誘電体部材は、前記ICチップを埋設するための凹部を備え、当該凹部に当該ICチップを埋設したことを特徴とする請求項2に記載のRFIDタグ。 It said dielectric member, RFID tag according to claim 2, wherein the includes a recess for embedding the IC chip, are embedded the IC chip to the recess.
  6. 前記チップ搭載パッドは、前記誘電体部材の一の側面部に向けて延設され、当該一の側面部に前記ICチップを位置させたことを特徴とする請求項3に記載のRFIDタグ。 The chip mounting pad, said toward the one side surface of the dielectric member is extended, RFID tag according to claim 3, characterized in that by positioning the IC chip on the side surface of the one.
  7. 前記チップ搭載パッドは、前記ICチップの給電点位置を調整できるように前記アンテナパターンに沿って長手状に併設されたことを特徴とする請求項3に記載のRFIDタグ。 The chip mounting pads, RFID tag according to claim 3, characterized in that along said antenna pattern can be adjusted feed point position of the IC chip are parallel in the longitudinal form.
  8. 少なくとも、誘電体部材と、前記誘電体部材を挿脱自在に支持する誘電体支持部材と、送受信用のアンテナパターンを有し前記誘電体支持部材の表面に設けられることによりループアンテナを形成するフィルム基材と、通信回路と記憶回路を内蔵し前記アンテナパターンに電気的に接続されたICチップと、を備えたRFIDタグ。 At least, the film forming a dielectric member, a dielectric support member for supporting the dielectric member removably, the loop antenna by provided on the surface of the dielectric support member has an antenna pattern for transmitting and receiving RFID tag having a substrate, an IC chip incorporating a communication circuit memory circuitry electrically connected to the antenna pattern.
  9. 前記誘電体部材は、誘電率および誘電損失が異なる複数の誘電体部材を組み合わせてなることを特徴とする請求項1〜8のいずれか一つに記載のRFIDタグ。 It said dielectric member, RFID tag according to any one of claims 1 to 8, wherein the dielectric constant and dielectric loss is a combination of different dielectric member.
  10. 送受信用のアンテナパターンを有したフィルム基材を誘電体部材の表面に設けループアンテナを形成するループアンテナ形成工程と、少なくとも通信回路と記憶回路を内蔵したICチップを前記アンテナパターンに電気的に接続するICチップ実装工程と、からなることを特徴とするRFIDタグの製造方法。 And the loop antenna formation step of forming a loop antenna is provided a film substrate having an antenna pattern for transmitting and receiving on the surface of the dielectric member, electrically connecting the IC chip with a built-in at least the communication circuit memory circuit to the antenna pattern IC chip mounting process and method of manufacturing a RFID tag, comprising the to be.
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US11/006,731 US7342498B2 (en) 2004-08-13 2004-12-08 Radio frequency identification (RFID) tag and manufacturing method thereof
TW093138133A TWI267788B (en) 2004-08-13 2004-12-09 Radio frequency identification (RFID) tag and manufacturing method thereof
EP04257704A EP1626364B1 (en) 2004-08-13 2004-12-10 Radio frequency identification (RFID) tag and manufacturing method thereof
EP20100152269 EP2190060A3 (en) 2004-08-13 2004-12-10 Radio frequency identification (RFID) tag and manufacturing method thereof
DE602004028462T DE602004028462D1 (en) 2004-08-13 2004-12-10 Rfid label and process for its manufacture
EP08155290A EP1947733A1 (en) 2004-08-13 2004-12-10 Radio frequency identification (RFID) tag and manufacturing method thereof
KR1020040115995A KR100799140B1 (en) 2004-08-13 2004-12-30 Radio frequency identificationrfid tag and manufacturing method thereof
CNA2004100821762A CN1734478A (en) 2004-08-13 2004-12-31 Radio frequency identification (RFID) tag and manufacturing method thereof
US12/017,887 US7916032B2 (en) 2004-08-13 2008-01-22 Radio frequency identification (RFID) tag and manufacturing method thereof

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US7342498B2 (en) 2008-03-11
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