WO2011155402A1 - Method for producing antenna, antenna, and method for producing wireless ic device - Google Patents

Method for producing antenna, antenna, and method for producing wireless ic device

Info

Publication number
WO2011155402A1
WO2011155402A1 PCT/JP2011/062783 JP2011062783W WO2011155402A1 WO 2011155402 A1 WO2011155402 A1 WO 2011155402A1 JP 2011062783 W JP2011062783 W JP 2011062783W WO 2011155402 A1 WO2011155402 A1 WO 2011155402A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
electrode
antenna
surface
substrate
ic
Prior art date
Application number
PCT/JP2011/062783
Other languages
French (fr)
Japanese (ja)
Inventor
伸郎 池本
俊彦 井内
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/16Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/26Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength

Abstract

Disclosed are a method for producing an antenna, an antenna, and a wireless IC device, wherein an antenna which has a high reliability and maintains a stable property can be produced easily. An insulating base (mother substrate (21)) is provided with a through hole (25) penetrating the upper face and the lower face of the base (21) at a predetermined position, electrodes are formed on the entire face of the upper face and the lower face of the base (21), an electrode is also formed in the through hole (25), and the electrodes formed on the upper face and the lower face are electrically connected. Thereafter, the electrode (30) formed on the upper face of the base (21) is divided into electrodes (31, 32) by forming a slit (34). A wireless IC element (50) is mounted between the electrodes (31, 32) to extend over the slit (34), and the mother base (21) is divided to form a wireless IC device.

Description

Manufacturing method of the antenna, the antenna and a manufacturing method of a wireless IC device

The present invention relates to a method of manufacturing an antenna, a method of manufacturing an antenna and a wireless IC device, in particular RFID (Radio Frequency Identification) method for producing an antenna used in the system, the wireless IC device including the antenna and the antenna manufactured by the method It relates to a method for manufacturing.

Recently, as the information management system of the article, the reader-writer that generates an induced magnetic field communicates in a non-contact manner using electromagnetic field and a RFID tag attached to an article (also referred to as a wireless IC device), the predetermined information RFID systems for transmitting has been put to practical use. The RFID tag stores predetermined information, includes a wireless IC chip that processes a predetermined wireless signal, and an antenna (radiator) for transmitting and receiving RF signals.

As this kind of RFID tag, in Patent Document 1, cut along a conductor extending in a strip shape in a longitudinal direction, a manufacturing method for obtaining the IC tagged sheet is disclosed by placing the IC chip. In this manufacturing method, it is possible to reliably connect the electrode of the IC chip to the conductor. However, in Patent Document 1, it can be manufactured easily and does not mention to be reliable obtain higher antenna less stable characteristics variation.

JP 2006-318267 JP

An object of the present invention can be prepared easily, a manufacturing method of an antenna which can maintain a stable and reliable characteristics, is to provide a manufacturing method of an antenna and a wireless IC device.

The manufacturing method of the first antenna in the form of the invention,
A predetermined position of the insulating substrate, and a through hole forming step of forming a through hole penetrating the first main surface and second main surfaces facing each other of the substrate,
To form a first main surface and electrode on the second major surface of said substrate, said well to form an electrode in the through holes, the electrodes for connecting the electrodes formed on the first main surface and second main surface and the forming step,
A removal step of dividing the two electrodes of the electrode on the first major surface of the substrate is partially removed,
Characterized by comprising a.

Antenna is a second embodiment of the present invention,
An antenna obtained by the above method,
An insulating substrate,
An electrode formed on the first main surface and second main surface opposed to each other of the substrate,
An electrode formed in a through hole penetrating the first main surface and second main surface of the substrate, electrodes for connecting the first main surface and electrode formed on the second major surface of the substrate When,
Equipped with a,
Electrodes formed on the first main surface of the substrate, it is divided into two electrodes by a slit formed in a groove shape on the first main surface,
The features.

The third method of manufacturing the wireless IC device is in the form of the invention,
A predetermined position of the insulating substrate, and a through hole forming step of forming a through hole penetrating the first main surface and second main surfaces facing each other of the substrate,
To form a first main surface and electrode on the second major surface of said substrate, said well to form an electrode in the through holes, the electrodes for connecting the electrodes formed on the first main surface and second main surface and the forming step,
A removal step of dividing the two electrodes of the electrode on the first major surface of the substrate is partially removed,
An arrangement step of arranging a wireless IC device so as to straddle the divided portions of the electrode,
Characterized by comprising a.

Wherein in the antenna manufacturing method of a first embodiment, once an antenna electrode formed on the first main surface and second main surface facing each other of the substrate are connected with the electrode formed in the through holes can be easily produced in the electrode forming step, contact reliability by the through-hole electrode is high, it can maintain stable characteristics.

Method for producing a fourth antenna in the form of the invention,
A step of preparing an insulating substrate,
An electrode forming step of forming an electrode on the surface of the substrate,
An electrode dividing step of dividing the at least two electrodes the electrodes are partially removed,
Characterized by comprising a.

Antenna according to a fifth embodiment of the present invention,
An antenna obtained by the above method,
An insulating substrate,
An electrode formed on a surface of the substrate,
Equipped with a,
The electrodes that is divided into two electrodes by a slit formed in a groove shape on the surface of the substrate,
The features.

Method for producing a sixth wireless IC device according to the embodiment of the present invention,
A step of preparing an insulating substrate,
An electrode forming step of forming an electrode on the surface of the substrate,
An electrode dividing step of dividing the at least two electrodes the electrodes are partially removed,
An arrangement step of arranging a wireless IC device so as to straddle the divided portions of the electrode,
Characterized by comprising a.

Wherein in the fourth antenna manufacturing method of the form, can be easily manufactured antenna loop shape electrode formed on the surface of the base material is divided at least into two in a single electrode forming step, one contact reliability of the formed electrode at step higher, can maintain stable characteristics.

According to the present invention can be manufactured in a simple, reliable, antennas that can maintain stable characteristics can be obtained a wireless IC device.

It is a perspective view showing a wireless IC device having an antenna according to a first embodiment. Is an explanatory view showing an antenna of a manufacturing process (first example). It is a perspective view showing a wireless IC device having an antenna according to the second embodiment. It is a perspective view showing a wireless IC device having an antenna according to the third embodiment. It is a perspective view showing a wireless IC device having an antenna according to a fourth embodiment. It is a perspective view showing a wireless IC device having an antenna according to a fifth embodiment. It is a perspective view showing a wireless IC device having an antenna according to a sixth embodiment. It is a perspective view showing a wireless IC device having an antenna according to a seventh embodiment. It is a perspective view showing a wireless IC device having an antenna according to an eighth embodiment. Illustrates a wireless IC device having an antenna according to a ninth embodiment, (A) is a perspective view, (B) is a cross-sectional view. It is a perspective view showing a wireless IC device having an antenna according to the tenth embodiment. Is an explanatory view showing an antenna of a manufacturing process (second example). It is a perspective view showing a wireless IC device having an antenna which is an eleventh embodiment. Is an explanatory view showing an antenna of a manufacturing process (third example). It is a perspective view showing a wireless IC device having an antenna which is the twelfth embodiment. It is a perspective view showing a wireless IC device having an antenna which is a thirteenth embodiment. It is a perspective view showing a wireless IC device having an antenna which is fourteenth embodiment. It is a perspective view showing a wireless IC device having an antenna which is a fifteenth embodiment. It is a perspective view showing a wireless IC device having an antenna which is the sixteenth embodiment. It is a perspective view showing a wireless IC device having an antenna which is the seventeenth embodiment. It is a perspective view showing a wireless IC device having an antenna which is the eighteenth embodiment. It is a perspective view showing a wireless IC device having an antenna which is the nineteenth embodiment. It is a perspective view showing a wireless IC device having an antenna which is twentieth embodiment. Is an explanatory view showing an antenna of a manufacturing process (fourth example). It is a perspective view illustrating a wireless IC chip as a wireless IC device. Is a perspective view showing a state where the mounting the wireless IC chip on the feeder circuit board as a wireless IC device. Is an equivalent circuit diagram showing an example of the power supply circuit. It is a plan view showing a laminated structure of the power supply circuit board.

Hereinafter, a manufacturing method of an antenna according to the present invention will be described with reference to the accompanying drawings embodiments of the manufacturing method of the antenna and the wireless IC device. In the drawings, components common to, parts denoted by the same reference numerals, and redundant description will be omitted.

(First embodiment, see FIG. 1)
Antenna 10A is a first embodiment is intended to be used for communication in the UHF band, as shown in FIG. 1, configured as a wireless IC device by providing a wireless IC device 50.

Antenna 10A includes an insulating base material 20 forming a rectangular parallelepiped shape, an electrode 30 and 33 formed on the opposing surface of the workpiece 20 (first principal surface) and lower surface (second main surface), the substrate an electrode formed in a through hole 25 penetrating the upper and lower surfaces 20, and includes an electrode 35 for connecting the electrodes 30 and 33, the. Electrode 30 formed on the upper surface of the base member 20 is divided into two electrodes 31 and 32 by the slits 34 formed on the upper surface. Note that in the perspective view of FIG. 1 or less, the electrodes are hatched. This type of electrode is printed as a thick film conductor pattern made of a conductive paste containing powder of silver or copper, it is formed by dipping or metal plating.

Substrate 20, a thermoplastic resin such as a thermosetting resin or a polyimide such as epoxy or, a ceramic, such as LTCC, as long as it has an insulating property may be a dielectric or magnetic material, single and it is configured as a layer substrate or multilayer substrate.

The wireless IC device 50 is intended to process the RF signal, its detail will be described in detail below with reference to FIGS. 25 to 28. The wireless IC device 50, the feeding section 31a is opposite ends of the electrodes 31 and 32 are coupled to 32a. This coupling is an electrical direct coupling due to the electromagnetic coupling or solder bumps (DC connection).

The top surface of electrodes 31 and 32 are electrically connected via the lower surface of the electrode 33 by the electrode 35 provided in the through hole 25 to form a loop electrode for feeding power unit 31a, and 32a as a start point / end point .

Antenna 10A, when predetermined high-frequency signal is transmitted from the wireless IC device 50, the high-frequency signal current flows in a predetermined direction to the electrode 31,32,33,35, (RFID system electromagnetic field to the outside of the above construction of the reader-writer) is emitted. On the other hand, the high-frequency signal radiated from a reader-writer is received at the electrodes 31,32,33,35, it is supplied to the wireless IC device 50. This in, it is possible to communicate with the reader-writer. In the case that the proximity metal plate to the antenna 10A (when stuck antenna 10A on the metal plate), the loop plane is orbiting plane of the loop-shaped electrode formed by the electrode 31,32,33,35 because There is arranged perpendicularly to the metal plate (not shown), since the magnetic field to the surface of the metal plate is formed, it is possible to communicate with the reader-writer to function as an antenna even a metal plate.

The loop electrode 31,32,33,35 has a predetermined resonant frequency corresponding to the electrical length. Further, it is possible to function as a matching circuit for impedance for a wireless IC device 50, impedance matching by adjusting the its electrical length.

(Manufacturing method of the antenna, the first example, see Figure 2)
The antenna 10A is manufactured by the steps A1 ~ A6 shown in FIG. First, a mother substrate 21 as the substrate 20 (step A1), to form a plurality of through holes 25 in a predetermined position (step A2). Mother substrate 21 is made of polypropylene, non-conductive material such as PET or ceramic.

Then, a top surface and a bottom surface of the entire surface electrodes of the mother substrate 21 (step A3). At this time, also formed electrodes simultaneously in the through-hole 25, the upper surface of the electrode and the lower surface of the electrode are electrically connected. Electrodes printed as a thick film conductive pattern made of conductive paste containing powder of silver or copper, dipping, printing of metallic nanostructures, or is formed by a metal plating. For dipping or plating so that the electrode is formed to the side surface of the motherboard 21. For printing, the electrode is formed by flowing the paste into the through holes 25. Further, by previously roughening the surface of the mother substrate 21 by sandblasting process, it improves adhesion of the electrode by printing.

Next, scraping the electrodes 30 of the upper surface linearly in such a grinder or a dicer to form the slit 34 (step A4). It may be cut with a laser. It is also possible to form the slit 34 by etching in the case of forming the electrodes 30 by plating. This at the electrode 30 is divided into electrodes 31 and 32 at the slit 34.

Then, the wireless IC device 50, the feeding section 31a opposing each other via the slit 34, is mounted to 32a (step A5). Implementation of a wireless IC device 50 is performed by using a conductive paste or solder. In the case of using the power supply circuit board 65 described below, the power supply unit 31a, the electromagnetic coupling also possible for 32a, that case may be implemented by an adhesive.

Then divided to indicate the motherboard 21 by the dotted line (step A6) that is, as one unit of the antenna. At the same time so that the wireless IC device is completed. In the case where the electrodes had been formed up to the side surface of the mother substrate 21, the side surface electrodes are removed in this step A6.

According to the manufacturing method described above, a simple antenna 10A of electrodes 30 and 33 formed on the upper surface and a lower surface opposing the substrate 20 are connected by the electrode 35 formed in the through hole 25 in one electrode forming step can be prepared, contact reliability by the through-hole electrode 35 is high, it can maintain stable characteristics.

If the electrode 30 is to mechanically cutting, it is possible to divide the electrode 30 easily by partially removing. The through-hole 25 by plural number across the slit 34, it is possible to form the antenna loop. Further, a through hole 25 by a plurality formed on the mother substrate 21 along the width direction of the substrate 20 can be manufactured collectively a plurality of antennas by simply dividing the mother board 21. By forming the electrodes 30 and 33 on the entire surface of the upper and lower surfaces of the mother substrate 21, it is possible to form the electrodes 30 and 33 easily. In addition, by the electrodes 30 to form the slit 34 in the width direction of the substrate 20, it is possible to form a mounting portion of the wireless IC device 50 in a simple manner.

(Second Embodiment, see FIG. 3)
Antenna 10B according to the second embodiment, as shown in FIG. 3, when forming the slit in the electrode 30 is obtained by forming a groove-shaped slits 34 'cuts to the substrate 20. 'With the slit 34' slits 34 grooved creepage distances opposing portions of the electrodes 31 and 32 divided by the longer, the capacitance component of the antenna is reduced. At this, since also small inductance component having the opposite direction of the phase and the capacitance component, it is possible to shorten the electrical length of the antenna.

Other configurations in the second embodiment, the manufacturing method is the same as the first embodiment, the effects thereof are also the same as in the first embodiment.

(Third Embodiment, see FIG. 4)
Antenna 10C is a third embodiment, as shown in FIG. 4, obtained by dividing the electrodes 33 provided on the lower surface of the base material 20 to form two slit 34a electrodes 33a, 33b, to 33c, other the structure is the same as the first embodiment.

Electrodes 31,32,33 (33a, 33c), 35 alone to form a dipole antenna. On the other hand, when the metal plate is in proximity to the antenna 10C (when stuck antenna 10C on a metal plate), the electrodes 33a, 33b, for 33c to the metal plate capacitively coupled at a portion facing the slit 34a, high-frequency signal current flows through the metal plate as a current path through the capacitive coupling, magnetic field energy from the metal plate is emitted to the outside. This in can communicate with the reader-writer via the metal plate.

(Fourth Embodiment, see Fig. 5)
Antenna 10D is a fourth embodiment, as shown in FIG. 5, in which a protective layer 5 made of a resin material on the upper surface of the base member 20, the other components are similar to those of the first embodiment. By providing the protective layer 5, the electrode 30 and the wireless IC device 50 formed on the upper surface of the base member 20 is protected from the action force and the external environment from the outside.

(Fifth Embodiment, see Fig. 6)
Antenna 10E is a fifth embodiment, as shown in FIG. 6, in addition to providing a protective layer 5 made of a resin material on the upper surface of the base member 20, a protective layer also on the lower surface of the base material 20 made of a resin material 6 in which the provided, other configurations are the same as the first embodiment. By providing the protective layer 5 and 6, the electrode 30 and the wireless IC device 50 and the electrodes 33 formed on the lower surface of the substrate 20 formed on the upper surface of the base member 20 is protected from the action force and the external environment from the outside that.

(Sixth Embodiment, see FIG. 7)
Antenna 10F is a sixth embodiment, as shown in FIG. 7, the width of the electrode 30 (31, 32) and the electrode 33 is obtained by forming smaller than the width of the substrate 20, other configurations is the same as in the first embodiment. That is, by forming the electrodes 30, 33 on the inner side of the upper and lower surfaces of the edge portions of the substrate 20, when covering the electrodes 30, 33 in the protective layer 5 and 6, the side portions of the electrodes 30, 33 since not exposed from the protective layer 5 and 6, so that the electrodes 30 and 33 are reliably protected.

(Seventh Embodiment, see Fig. 8)
Antenna 10G according to a seventh embodiment, as shown in FIG. 8, the electrodes 33a to electrodes 33 provided on the lower surface of the base material 20 to form two slit 34a, 33b, as well as divided into 33c, the two in which at the electrode 36 filled in the through hole 26 connecting the electrodes 31,33b and the electrode 32,33b electrically, other components are similar to those of the first embodiment.

In this antenna 10G, electrode 31,32,36,33b via the electrode 36 formed in the through hole 26 has an antenna function as the first embodiment similarly to the loop electrode. The electrode 31,35,33a and electrode 32,35,33c act as a dipole type radiating element, a high-frequency signal is radiated as an electric field to the outside. On the other hand, when the metal plate is in proximity to the antenna 10G (when stuck antenna 10G on the metal plate), the electrode 33 is a metal plate capacitively coupled at a portion facing the slit 34a, the high-frequency signal current flows a metal plate as a current path through the capacitive coupling, magnetic field energy from the metal plate is emitted to the outside. This in can communicate with the reader-writer via the metal plate.

In this case, the loop formed by the electrodes 31,32,36,33b functions as a matching circuit for impedance. By adjusting the electrical length of the electrode 31,32,36,33B, it is possible to perform impedance matching between the wireless IC device 50 and the loop electrode, it is possible to determine the resonance frequency. Therefore, the degree of freedom in design of the antenna is increased, and characteristics can be improved.

(Eighth Embodiment, see FIG. 9)
Antenna 10H according to an eighth embodiment, as shown in FIG. 9, formed in the step of forming the slit 34, a further plurality of slits 34b from the side of the electrode 30 (31, 32), the electrode 30 (31, 32) is obtained by a meandering shape, other configurations are similar to those of the first embodiment, the effects thereof are also the same as in the first embodiment. In particular, by forming the slit 34b, it is possible to easily adjust the resonance frequency of the antenna.

(Ninth Embodiment, see FIG. 10)
Antenna 10I according to a ninth embodiment, as shown in FIG. 10 is obtained by forming an opening of the through hole 25 in a tapered shape, the other components are similar to those of the first embodiment. By opening and tapered, filling electrodes 35 becomes easy, and, since the cutting of the electrode 35 is less likely to occur, reliability is improved.

(Tenth Embodiment, see FIG. 11)
Antenna 10J according to the tenth embodiment, as shown in FIG. 11, forming to form a recess 22 in the portion where the wireless IC device 50 on the upper surface of the base material 20 is arranged, a groove-shaped slits 34 ' it is obtained by dividing the upper electrode 30 to the electrode 31 and 32. Other configurations are similar to those of the first embodiment, the effects thereof are also the same as in the first embodiment and the second embodiment. Recess 22 is preferably deeper than the thickness of the wireless IC device 50. The wireless IC device 50 for fit inside the substrate 20, are protected from the action force from the outside.

(Manufacturing method of the antenna, the second example, see Figure 12)
The antenna 10J is manufactured by the steps B1 ~ B6 shown in FIG. 12. 12, the left side is a perspective view, a right is a sectional view. In the production process herein, the matters not specifically described are the same as the manufacturing process described with reference to FIG.

First, a mother substrate 21 as the substrate 20 to form a plurality of through holes 25 in a predetermined position (step B1). Then, to form a recess 22 on the upper surface of the mother substrate 21 by using a grinder 200 (step B2). Then, a top surface and a bottom surface of the entire surface electrodes of the mother substrate 21 (step B3). In this case, the electrode also within and through hole 25 in the recess 22 is formed at the same time. In FIG 12, the electrode in the side surface of the mother substrate 21 is formed, which is not always necessary, the side electrode is removed in the following step B6.

Then, the electrodes 30 of the upper surface linearly cutting the like grinders and Dicer, to form a groove-shaped slits 34 '(step B4). This at the electrode 30 is divided into electrodes 31 and 32 at the slit 34 '.

Then, the wireless IC device 50, a the recess 22 is mounted to the power supply unit 31a, 32a which face each other with a slit 34 '(step B5). Then, it split as shown mother substrate 21 by the dotted line (step B6) that is, as one unit of the antenna. At the same time so that the wireless IC device is completed.

Above function and effect of the method of manufacturing is basically the same as the manufacturing process described with reference to FIG.

(Eleventh Embodiment, see FIG. 13)
Antenna 100A is a first 11 examples are used for communication in the UHF band, as shown in FIG. 13, configured as a wireless IC device by providing a wireless IC device 50.

Antenna 100A includes an insulating base material 120 which forms a rectangular parallelepiped shape, facing each other top (first main surface) of the substrate 120, a lower surface (second main surface) and formed on the two end-face electrodes 130, 133 , it is provided with a 134, a. Electrode 130 formed on the upper surface of the substrate 120 is divided into two electrodes 131 and 132 by a slit 135 formed on the upper surface. Note that in the perspective view shown in FIG. 13 or less, the electrodes are hatched. This type of electrode is printed as a thick film conductor pattern made of a conductive paste containing powder of silver or copper, it is formed by dipping or metal plating.

Substrate 120, a thermoplastic resin such as a thermosetting resin or a polyimide such as epoxy or, a ceramic, such as LTCC, as long as it has an insulating property may be a dielectric or magnetic material, single and it is configured as a layer substrate or multilayer substrate.

The wireless IC device 50 is intended to process the RF signal, its detail will be described in detail below with reference to FIGS. 25 to 28. The wireless IC device 50, the feeding portion 131a is opposed ends of the electrodes 131 and 132 are coupled to 132a. This coupling is an electrical direct coupling due to the electromagnetic coupling or solder bumps (DC connection).

Electrodes 131 and 132 of the upper surface, the electrode 134 formed on the end face of the base 120 through the lower surface of the electrode 133 are electrically connected to form a loop electrode for feeding power unit 131a, the 132a and start / end there.

Antenna 100A, when predetermined high-frequency signal is transmitted from the wireless IC device 50, the high-frequency signal current flows in a predetermined direction to the electrode 131, 132, 133 and 134, (RFID system electromagnetic field to the outside of the above construction of the reader-writer) is emitted. On the other hand, the high-frequency signal radiated from a reader-writer is received by electrodes 131-134 are supplied to the wireless IC device 50. This in, it is possible to communicate with the reader-writer. Metal If this antenna 100A to the metal plate are in close proximity (case of bonding the antenna 100A on the metal plate) is the loop plane is a circulating face of the loop electrode that is formed by electrodes 131 to 134 not shown because it is arranged perpendicular to the plate, since the magnetic field to the surface of the metal plate is formed, it is possible to communicate with the reader-writer to function as an antenna even a metal plate.

The loop-shaped electrodes 131 to 134 has a predetermined resonant frequency corresponding to the electrical length. Further, it is possible to function as a matching circuit for impedance for a wireless IC device 50, impedance matching by adjusting the its electrical length.

(Manufacturing method of the antenna, the third example, see FIG. 14)
The antenna 100A is manufactured by the steps C1 ~ C5 shown in FIG. 14. First, a mother substrate 121 as a substrate 120 (step C1). Mother substrate 121 is made of polypropylene, non-conductive material such as PET or ceramic.

Next, electrodes are formed on the entire surface of the mother substrate 121 (step C2). At this time, an upper surface, a lower surface, all the electrodes formed on the two end faces and two side are electrically connected. Electrodes printed as a thick film conductive pattern made of conductive paste containing powder of silver or copper, dipping, printing of metallic nanostructures, or is formed by a metal plating. By keeping roughened surface of the mother substrate 121 by sandblasting process, adhesion of the electrode can be improved by printing.

Next, scraping the upper surface of the electrode 130 linearly in such a grinder or a dicer to form the slits 135 (step C3). Slit 135 may be formed by cutting with a laser. It is also possible to form a slit 135 in etching when forming the electrode 130 by plating. This at the electrode 130 is divided into electrodes 131 and 132 at the slit 135.

Then, the wireless IC device 50, the feeding portion 131a opposed to each other via the slit 135, implemented in 132a (step C4). Implementation of a wireless IC device 50 is performed by using a conductive paste or solder. In the case of using the power supply circuit board 65 described below, the power supply unit 131a, the electromagnetic coupling also possible with respect 132a, case may be implemented by an adhesive.

Then divided to indicate the mother substrate 121 by the dotted line (step C5) that is, as one unit of the antenna. At the same time so that the wireless IC device is completed.

According to the manufacturing method described above, the simplified antenna 100A which electrodes 130 and 133 formed on the upper surface and a lower surface opposing the substrate 120 are connected by the electrode 134 formed on the two end faces in one electrode forming step can be produced, contact reliability by the electrode 134 is high, it can maintain stable characteristics.

If the electrode 130 is to mechanically cutting, it is possible to divide the electrode 130 simply by partially removing. Simply dividing the mother substrate 121, it is possible to form the antenna loop can be manufactured collectively a plurality of antennas. Further, by the electrode 130 forms a slit 135 in the width direction of the substrate 120, it is possible to form a mounting portion of the wireless IC device 50 in a simple manner.

(Twelfth Embodiment, see FIG. 15)
Antenna 100B is a twelfth embodiment, as shown in FIG. 15, when forming the slit in the electrode 130 is obtained by forming a groove-shaped slits 135 'cuts to the substrate 120. 'With the slit 135' groove-shaped slits 135 creepage distance opposing portions of the electrodes 131 and 132 divided by the longer, the capacitance component of the antenna is reduced. At this, since also small inductance component having the opposite direction of the phase and the capacitance component, it is possible to shorten the electrical length of the antenna.

Other configurations of the twelfth embodiment, the manufacturing method is the same as the eleventh embodiment, the effects thereof are also the same as the eleventh embodiment.

(13th Embodiment, see Fig. 16)
Antenna 100C is a thirteenth embodiment, as shown in FIG. 16, which was divided into electrodes 133 provided on the lower surface of the substrate 120 to form two slits 135a electrodes 133a, 133b, to 133c, the other the structure is the same as the eleventh embodiment.

Electrodes 131,132,134,133 (133a, 133c), alone to form a dipole antenna. On the other hand, when the metal plate is in proximity to the antenna 100C (when stuck antenna 100C on the metal plate), the electrodes 133a, 133b, because 133c is a metal plate and capacitively coupled to face the slits 135a, high-frequency signal current flows through the metal plate as a current path through the capacitive coupling, magnetic field energy from the metal plate is emitted to the outside. This in can communicate with the reader-writer via the metal plate.

(Fourteenth Embodiment, see FIG. 17)
Antenna 100D is a fourteenth embodiment, as shown in FIG. 17, in which a protective layer 105 made of a resin material on the upper surface of the base member 120, the other components are similar to those of the eleventh embodiment. By providing the protective layer 105, the electrode 130 and the wireless IC device 50 formed on the upper surface of the base material 120 is protected from the action force and the external environment from the outside.

(15th Embodiment, see FIG. 18)
Antenna 100E is a fifteenth embodiment, as shown in FIG. 18, in addition to providing a protective layer 105 made of a resin material on the upper surface of the substrate 120, a protective layer also on the lower surface of the base material 120 made of a resin material 106 in which the provided, other configurations are the same as the eleventh embodiment. By providing the protective layer 105, the electrode 133 formed on the lower surface of the electrode 130 and the wireless IC device 50 and substrate 120 formed on the upper surface of the substrate 120 is protected from the action force and the external environment from the outside that.

(16th Embodiment, see Fig. 19)
Antenna 100F is a sixteenth embodiment, as shown in FIG. 19, in addition to providing a protective layer 105, 106 made of a resin material on the upper surface and the lower surface of the substrate 120, also on the end surface and the side surface of the substrate 120 in which a protective layer 107 made of a resin material, the other components are similar to those of the eleventh embodiment. Protective layers 106-108 can be readily applied by dipping the wireless IC device obtained in the step C5 of FIG. 14 in the resin solution.

(17th Embodiment, see Fig. 20)
Antenna 100G is the seventeenth embodiment, as shown in FIG. 20, the electrode 130 (131 and 132), which was smaller than the width dimension of the width of the 133 and 134 base 120, other configurations is the same as the eleventh embodiment. That is, when covering the electrodes 130,133,134 upper surface of the substrate 120, by forming inside the edge of the lower surface and the end surface, the electrodes 130,133,134 in the protective layer 105-108, electrode 130 , since no sides of 133 and 134 are exposed from the protective layer 105-108, so that the electrodes 130,133,134 are reliably protected.

(18th Embodiment, see Fig. 21)
Antenna 100H is a 18th embodiment, as shown in FIG. 21, formed in the step of forming the slits 135, a further plurality of slits 135b from the side of the electrode 130 (131 and 132), the electrode 130 (131, 132) in which was used as a meandering shape, other configurations are similar to those of the eleventh embodiment, the effects thereof are also the same as the eleventh embodiment. In particular, by forming the slits 135b, it is possible to easily adjust the resonance frequency of the antenna.

(19th Embodiment, see Fig. 22)
Antenna 100I is a nineteenth embodiment, as shown in FIG. 22, chamfered upper and lower portions of the end surfaces of the substrate 120, electrodes 131 and 134 in the electrode formed by chamfer portion, the electrode 132, 134 , which was an electrode 133 and 134 are electrically connected, the other components are similar to those of the eleventh embodiment. By chamfering the edge line portion of the substrate 120, since the cutting electrode is less likely to occur, reliability is improved. Incidentally, the chamfer may be arcuate rather than straight.

(20th Embodiment, see Fig. 23)
Antenna 100J is a twentieth embodiment, as shown in FIG. 23, forming to form a recess 122 in the portion where the wireless IC device 50 on the upper surface of the substrate 120 is disposed, the groove-shaped slits 135 ' it is obtained by dividing the upper electrode 130 to the electrodes 131 and 132 and. Other configurations are similar to those of the eleventh embodiment, the effects thereof are also the same as the eleventh embodiment and the twelfth embodiment. Recess 122 is preferably deeper than the thickness of the wireless IC device 50. The wireless IC device 50 for fit inside the substrate 120 are protected from the action force from the outside.

(Manufacturing method of the antenna, the fourth example, see FIG. 24)
The antenna 100J is prepared by the steps D1 ~ D6 shown in FIG. 24. In Figure 24, the left side is a perspective view, a right is a sectional view. In the production process herein, the matters not specifically described are the same as the manufacturing process described with reference to FIG. 14.

First, a mother substrate 121 as a substrate 120 (step D1). Then, to form a recess 122 on the upper surface of the mother substrate 121 by using a grinder 200 (step D2). Then, an entire surface electrode of the mother substrate 121 (step D3). In this case, the electrode also in the recess 122 is formed at the same time.

Next, the upper surface of the electrode 130 linearly cut in such a grinder or a dicer to form a slit 135 'groove-shaped (step D4). This at the electrode 130 is divided into electrodes 131 and 132 at the slit 135 '.

Then, the wireless IC device 50, a the recess 122 mounted on the feeding portion 131a, 132a which face each other with a slit 135 '(step D5). Then, they split to show the mother substrate 121 by the dotted line (step D6) that is, as one unit of the antenna. At the same time so that the wireless IC device is completed.

Above function and effect of the method of manufacturing is basically the same as the manufacturing process described with reference to FIG. 14.

(Wireless IC device, see FIGS. 25 through 28)
The following describes a wireless IC device 50. The wireless IC device 50, as shown in FIG. 25 may be a wireless IC chip 51 that processes a high-frequency signal, or, as shown in FIG. 26, the resonant circuit having a predetermined resonant frequency and the wireless IC chip 51 it may be constituted by a power supply circuit board 65 including the.

Wireless IC chip 51 shown in FIG. 25, a clock circuit, a logic circuit, and the like memory circuit, the required information is the memory. Wireless IC chip 51, input-output terminal electrodes 52 and mounting terminal electrodes 53 and 53 are provided on the rear surface. Feeding part 31a shown input and output terminal electrodes 52, 52 In each Example, 32a, 131a, it is electrically connected via a 132a and the metal bumps. As the material of the metal bump, Au, or the like can be used solder.

As shown in FIG. 26, if included in the wireless IC device 50 in the wireless IC chip 51 and the feeder circuit board 65, the power supply circuit board 65 be provided with various feed circuit (including a resonance circuit / matching circuit) it can. For example, as shown as an equivalent circuit in FIG. 27, have different inductance values ​​from each other, and meet feeding circuit 66 including inductance elements L1, L2 that are magnetically coupled in opposite phase to each other (indicated by mutual inductance M) it may be. Feeding circuit 66, which has a predetermined resonant frequency, thereby achieving impedance matching between the impedance and the antenna of the wireless IC chip 51. Incidentally, the wireless IC chip 51 and the power supply circuit 66, may be electrically connected (DC connection), or may be bonded via an electromagnetic field.

Feed circuit 66 transmits a high frequency signal having a predetermined frequency transmitted from the wireless IC chip 51 to the antenna, and supplies the received RF signal to the wireless IC chip 51 via the antenna. Since the feeder circuit 66 has a predetermined resonant frequency, the impedance matching can easily aim, matching impedance, i.e., it is possible to shorten the electrical length of such electrodes 30,33,130,133 was looped.

Next, the configuration of the feeder circuit board 65. As shown in FIGS. 25 and 26, input and output terminal electrodes 52 of the wireless IC chip 51, the feeding terminal electrode 142a formed on the feed circuit board 65, in 142b, the mounting terminal electrodes 53, the mounting terminal electrodes 143a and 143b, are connected via a metal bump.

The power supply circuit board 65, as shown in FIG. 28, the laminated ceramic sheets 141a ~ 141h made of a dielectric or magnetic material, crimping, and firing. However, the insulating layer constituting the power supply circuit board 65 is not limited to the ceramic sheet, for example, it may be a resin sheet such as thermosetting resins and thermoplastic resins such as liquid crystal polymer. The uppermost sheet 141a, the feeding terminal electrode 142a, 142b, the mounting terminal electrodes 143a, 143b, the via-hole conductors 144a, 144b, 145a, 145b are formed. The second layer - eighth layer sheet 141b-141h, respectively, the wiring electrodes 146a constituting the inductance element L1, L2, 146b are formed, the via-hole conductors 147a as necessary, 147b, 148a, 148b are formed ing.

By laminating the sheets 141a ~ 141h, inductance wiring electrodes 146a are inductance elements L1 which is connected to the spiral formed by via-hole conductors 147a, the wiring electrodes 146b are connected spirally via hole conductors 147b element L2 is formed. The wiring electrodes 146a, capacitance is formed between 146b of the line.

End 146a-1 of the wiring electrode 146a on the sheet 141b is connected to the feeding terminal electrode 142a via the via-hole conductors 145a, the end portion 146a-2 of the wiring electrode 146a on the sheet 141h via hole conductors 148a, via 145b It is connected to the feeding terminal electrode 142b. End 146b-1 of the wiring electrode 146b on the sheet 141b is connected to the feeding terminal electrode 142b via the via-hole conductors 144b, the end portion 146b-2 of the wiring electrode 146b on the sheet 141h via hole conductor 148b, the 144a It is connected to the feeding terminal electrode 142a.

In the above power supply circuit 66, since the inductance elements L1, L2 are wound in opposite directions, the magnetic field generated by the inductance elements L1, L2 is offset. Since the magnetic field is canceled out, in order to obtain a desired inductance value wiring electrodes 146a, it is necessary to a certain long 146b. This at the Q value is low eliminates the steepness of the resonance characteristics, it will be widened in the vicinity of the resonance frequency.

Inductance elements L1, L2, when the power supply circuit board 65 in plan perspective, is formed on the left and right different positions. Further, magnetic fields generated by the inductance elements L1, L2 is reversed, respectively. This in, when coupled to the feeding circuit 66 to the antenna, the antenna current in the opposite direction is excited, the current can be generated in the metal plate adjacent radiating elements of the metal plate at a potential difference due to the current it can be operated as (antenna).

By incorporating a resonant / matching circuit power supply circuit board 65, it is possible to suppress characteristic variation due to the influence of external article, it is possible to prevent deterioration of communication quality. Moreover, if arranged to direct a wireless IC chip 51 included in the wireless IC device 50 to the center side in the thickness direction of the feeder circuit board 65, it is possible to prevent the destruction of the wireless IC chip 51, as a wireless IC device 50 mechanically it is possible to improve the strength.

(Other examples)
Note that a manufacturing method of an antenna according to the present invention, an antenna and a manufacturing method of a wireless IC device is not limited to the above embodiments, it is obvious that it can be modified within the scope of the gist.

As described above, the present invention relates to a method of manufacturing an antenna, useful in the method of manufacturing an antenna and a wireless IC device, in particular, the antenna can be easily manufactured, superior in that it can maintain a stable characteristic reliable ing.

10A ~ 10J ... antenna 20 ... base 21 ... mother substrate 22 ... recess 25, 26 ... through hole 30,31,32,33,35,36 ... electrodes 34, 34 '... slit 50 ... wireless IC device 51 ... wireless IC chip 65 ... power supply circuit board 66 ... feeder circuit 100A ~ 100 J ... antenna 120 ... substrate 121 ... mother substrate 122 ... recess 130,131,132,133,134 ... electrodes 135 and 135 '... slit

Claims (23)

  1. A predetermined position of the insulating substrate, and a through hole forming step of forming a through hole penetrating the first main surface and second main surfaces facing each other of the substrate,
    To form a first main surface and electrode on the second major surface of said substrate, said well to form an electrode in the through holes, the electrodes for connecting the electrodes formed on the first main surface and second main surface and the forming step,
    A removal step of dividing the two electrodes of the electrode on the first major surface of the substrate is partially removed,
    Method of manufacturing an antenna, characterized in that it comprises a.
  2. Antenna manufacturing method according to claim 1 in the removing step, characterized in that, to mechanically cutting the electrode on the first major surface of the substrate.
  3. The through hole is the antenna manufacturing method according to claim 1 or claim 2, characterized in that, to form a plurality across the removed portion of the electrode.
  4. The through hole forming step, the electrode forming step and the removing step, the substrate is carried out in the mother substrate state,
    Furthermore, it has a step of dividing the mother board for each of a plurality of substrates,
    Antenna manufacturing method according to any one of claims 1 to 3, characterized in.
  5. The through hole is the antenna manufacturing method according to claim 4, characterized in that, to be more formed along the width direction of the base material in the mother board state.
  6. Wherein in the electrode forming step, an antenna manufacturing method according to claim 4 or claim 5 to form the first and the entire surface electrode of the second major surface of the substrate in a mother substrate state, characterized by.
  7. Wherein in the removing step, an antenna manufacturing method according to any one of claims 4 to 6, characterized in that, to remove in a width direction of the substrate with the electrode on the mother substrate state.
  8. Antenna manufacturing method according to any one of claims 1 to 7, characterized in that, to form an opening of the through hole is tapered.
  9. An antenna obtained by the production method according to any one of claims 1 to 8,
    An insulating substrate,
    An electrode formed on the first main surface and second main surface opposed to each other of the substrate,
    An electrode formed in a through hole penetrating the first main surface and second main surface of the substrate, electrodes for connecting the first main surface and electrode formed on the second major surface of the substrate When,
    Equipped with a,
    Electrodes formed on the first main surface of the substrate, it is divided into two electrodes by a slit formed in a groove shape on the first main surface,
    Antenna according to claim.
  10. The first main surface electrodes formed on a width of the substrate, and / or the width of the electrode formed on the second major surface of the substrate, the narrower, than the width of the substrate the antenna according to claim 9, characterized.
  11. A predetermined position of the insulating substrate, and a through hole forming step of forming a through hole penetrating the first main surface and second main surfaces facing each other of the substrate,
    To form a first main surface and electrode on the second major surface of said substrate, said well to form an electrode in the through holes, the electrodes for connecting the electrodes formed on the first main surface and second main surface and the forming step,
    A removal step of dividing the two electrodes of the electrode on the first major surface of the substrate is partially removed,
    An arrangement step of arranging a wireless IC device so as to straddle the divided portions of the electrode,
    Method for manufacturing a wireless IC device, comprising the.
  12. Before the electrode forming step, the radio of claim 11, the first main surface of the electrode of said substrate further comprising a step of forming a concave portion including the portion to be partially removed, characterized by manufacturing method of the IC device.
  13. A wireless IC device obtained by the manufacturing method according to claim 12, the wireless IC device, wherein, to the arrangement of the wireless IC device in the recess.
  14. A step of preparing an insulating substrate,
    An electrode forming step of forming an electrode on the surface of the substrate,
    An electrode dividing step of dividing the at least two electrodes the electrodes are partially removed,
    Method of manufacturing an antenna, characterized in that it comprises a.
  15. Antenna manufacturing method according to claim 14 in the electrode dividing step, characterized in that, to mechanically cutting the electrode on the first major surface of the substrate.
  16. Antenna manufacturing method according to claim 14 or claim 15 in the electrode forming step, characterized in that, to form the electrodes on all surfaces of the substrate.
  17. The substrate is prepared as a mother substrate,
    In the electrode dividing step, fabrication of the antenna according to any one of claims 14 to 16 to remove the electrode along the width direction of the substrate partially in the mother substrate state, characterized by Method.
  18. The substrate is prepared as a mother substrate,
    Furthermore, it has a step of dividing the mother board for each of a plurality of substrates,
    Antenna manufacturing method according to any one of claims 14 to 17, characterized in.
  19. An antenna obtained by the production method according to any one of claims 14 to 18,
    An insulating substrate,
    An electrode formed on a surface of the substrate,
    Equipped with a,
    The electrodes that is divided into two electrodes by a slit formed in a groove shape on the surface of the substrate,
    Antenna according to claim.
  20. Antenna according to claim 19 the width of the electrode formed on the surface of the substrate, wherein the narrower, than the width of the substrate.
  21. A step of preparing an insulating substrate,
    An electrode forming step of forming an electrode on the surface of the substrate,
    An electrode dividing step of dividing the at least two electrodes the electrodes are partially removed,
    An arrangement step of arranging a wireless IC device so as to straddle the divided portions of the electrode,
    Method for manufacturing a wireless IC device, comprising the.
  22. Before the electrode forming step, the electrode on the surface of said substrate further comprising a step of forming a concave portion including the portion to be partially removed, the wireless IC device according to claim 21, wherein Production method.
  23. A wireless IC device obtained by the manufacturing method according to claim 22, the wireless IC device, characterized in, that it has placed a wireless IC device in the recess.
PCT/JP2011/062783 2010-06-09 2011-06-03 Method for producing antenna, antenna, and method for producing wireless ic device WO2011155402A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010-132383 2010-06-09
JP2010-132384 2010-06-09
JP2010132383 2010-06-09
JP2010132384 2010-06-09

Publications (1)

Publication Number Publication Date
WO2011155402A1 true true WO2011155402A1 (en) 2011-12-15

Family

ID=45098009

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/062783 WO2011155402A1 (en) 2010-06-09 2011-06-03 Method for producing antenna, antenna, and method for producing wireless ic device

Country Status (1)

Country Link
WO (1) WO2011155402A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104064861A (en) * 2014-07-01 2014-09-24 石松程 Unipolar high-gain microstrip oscillator

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037421A (en) * 2001-07-25 2003-02-07 Murata Mfg Co Ltd Surface mounting antenna, manufacturing method thereof, and wireless communication system with the antenna
JP2004165965A (en) * 2002-11-13 2004-06-10 Murata Mfg Co Ltd Surface mounted type antenna, its manufacturing method and communication equipment
JP2005176366A (en) * 2003-12-09 2005-06-30 Internatl Business Mach Corp <Ibm> Device and method which constitute antenna by using via formed as radiating element in substrate
JP2006053833A (en) * 2004-08-13 2006-02-23 Fujitsu Ltd Rfid tag and its manufacturing method
JP2009003829A (en) * 2007-06-25 2009-01-08 Nec Tokin Corp Radio tag

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037421A (en) * 2001-07-25 2003-02-07 Murata Mfg Co Ltd Surface mounting antenna, manufacturing method thereof, and wireless communication system with the antenna
JP2004165965A (en) * 2002-11-13 2004-06-10 Murata Mfg Co Ltd Surface mounted type antenna, its manufacturing method and communication equipment
JP2005176366A (en) * 2003-12-09 2005-06-30 Internatl Business Mach Corp <Ibm> Device and method which constitute antenna by using via formed as radiating element in substrate
JP2006053833A (en) * 2004-08-13 2006-02-23 Fujitsu Ltd Rfid tag and its manufacturing method
JP2009003829A (en) * 2007-06-25 2009-01-08 Nec Tokin Corp Radio tag

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104064861A (en) * 2014-07-01 2014-09-24 石松程 Unipolar high-gain microstrip oscillator

Similar Documents

Publication Publication Date Title
US20080143630A1 (en) Wireless ic device
US20090321527A1 (en) Wireless ic device and manufacturing method thereof
EP2148449A1 (en) Wireless ic device
US20090065594A1 (en) Wireless ic device and wireless ic device composite component
US20090262041A1 (en) Wireless ic device
WO2009110381A1 (en) Wireless ic device and wireless communication system
JP4069958B2 (en) Wireless ic device
WO2009128437A1 (en) Radio ic device, electronic device, and method for adjusting resonance frequency of radio ic device
US20090040734A1 (en) Semiconductor memory module incorporating antenna
WO2010079830A1 (en) Wireless ic device, wireless ic module and wireless ic module manufacturing method
US20090021446A1 (en) Wireless ic device and electronic device
WO2010050361A1 (en) Wireless ic device
US20100103058A1 (en) Radio ic device
GB2461443A (en) Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device,and their manufacturing methods
US20070164414A1 (en) Wireless ic device and component for wireless ic device
JP2008072243A (en) Wireless ic device
WO2010119854A1 (en) Component for wireless ic device and wireless ic device
US20090109102A1 (en) Antenna and radio ic device
WO2000021030A1 (en) Rfid transponder having improved rf characteristics
JP2009260758A (en) Radio ic device
US20090266900A1 (en) Wireless ic device and electronic apparatus
US20090021352A1 (en) Radio frequency ic device and electronic apparatus
US20120326931A1 (en) Wireless communication module and wireless communication device
US20110024510A1 (en) Wireless ic device
US20090051606A1 (en) Electronic circuit module with built-in antenna and method for manufacturing the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11792359

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase in:

Ref country code: DE

122 Ep: pct app. not ent. europ. phase

Ref document number: 11792359

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase in:

Ref country code: JP