JP2009110263A - Rf-id medium and production method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance adhesive strength of a plurality of layers even as materializing a broadband without reducing communication performance, in an RF-ID medium wherein the plurality of layers are laminated, performing communication by an electric wave system. <P>SOLUTION: In a non-contact type IC tag 100 wherein writing and/or reading of information is performed to an IC chip 110 by the electric wave system, an antenna part 120 is formed on a base material 130, and an inlet 101 mounted with the IC chip 110 such that the IC chip 110 is connected to the antenna part 120 is joined to surface sheets 103a, 103b with an adhesive 102. Conductor parts 120a, 120b constituting the antenna part 120 are each formed in a closed loop state, and the base material 130 has through-holes 131a, 131b inside closed loops of the conductor parts 120a, 120b. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an RF-ID medium such as a non-contact type IC tag that performs communication using a radio wave system, and a method for manufacturing the same, and more particularly to a technique for enhancing the adhesive strength of a plurality of layers in a configuration in which a plurality of layers are laminated and bonded. .

  In recent years, with the progress of the information society, information is recorded on a card, and information management and settlement using the card are performed. Information is recorded on a label or tag attached to a product or the like, and the product or the like is managed using the label or tag. In information management using such a card, label, or tag, a contactless IC chip on which information can be written to and read from the card, label, or tag in a contactless state is mounted. IC cards, non-contact type IC labels, or non-contact type IC tags are rapidly spreading due to their excellent convenience.

  In a non-contact type IC tag that can write and read information in a non-contact state, an electromagnetic induction method using an induced electric power generated by dielectric flux of two coils, or a current generated by resonance with radio waves is used. There is something by the radio system to do. Such a non-contact type IC tag includes an inlet on which an IC chip on which information is written is mounted on a base substrate made of resin or the like and an antenna for writing and reading information on the IC chip is formed. A layer called is sandwiched between a plurality of layers.

  Conventionally, in the electromagnetic induction type non-contact type IC tag described above, a plurality of through holes are formed in a region inside the coiled antenna of the inlet, and a pair of adhesive layers stacked on the front and back of the inlet are penetrated. Patent Document 1 discloses a technique for strengthening the adhesive force of a plurality of layers by providing a convex portion and a concave portion in a region facing a hole and fitting the convex portion into the concave portion through a through hole. The through hole formed in the inlet as described above needs to be formed avoiding the IC chip and the antenna. However, in the electromagnetic induction type non-contact type IC tag, the antenna is in a coil shape. By forming the through hole, the adhesive strength of the plurality of layers can be enhanced without reducing the shape of the antenna. Moreover, when the layer laminated | stacked on the front and back of an inlet consists of PVC, when an inlet and its layer are adhere | attached by heat-melting the layer laminated | stacked on the front and back of an inlet, without using an adhesive layer However, when the inlet is made of PET, the compatibility between the PVC and the PET is not good, so it is preferable to form such a through hole.

  By the way, in recent years, in the non-contact type IC tag as described above, in order to ensure downsizing and a communicable distance, those using a radio wave system as described above are often used. In a non-contact type IC tag using a radio wave system, information is written to and read from an IC chip by using a fine IC chip and connecting a conductive antenna to the IC chip. However, such a non-contact type IC tag using the radio wave method requires finer adjustment of the frequency at which information can be written and read as compared with a non-contact type IC tag using the electromagnetic induction method. Conventionally, a bow tie antenna is used in which two conductors made of isosceles triangles are arranged so that their vertices face each other through a gap.

  7A and 7B are diagrams showing an example of a non-contact type IC tag having a general bow-tie antenna. FIG. 7A is a plan view showing an internal structure, and FIG. 7B is a cross-sectional view taken along line AA ′ shown in FIG. FIG.

  In this example, as shown in FIG. 7, two surface sheets 503a and 503b are laminated on the front and back of the inlet 501, and these are bonded by adhesives 502a and 502b. The inlet 501 is made of PET resin or the like. On the base substrate 530, the two conductor portions 520a and 520b having the shape of an isosceles triangle form a straight line connecting vertices formed by equal sides of the isosceles triangle with respect to each of the bases of the isosceles triangle. An antenna portion 520 is formed so that the vertices are perpendicular to each other and have a gap between the vertices. Information is transmitted in a non-contact state so as to be connected to the two conductor portions 520a and 520b. An IC chip 510 that can write and read data is mounted.

In the non-contact type IC tag 500 configured as described above, the antenna unit 520 receives radio waves from the information writing / reading device by being close to an information writing / reading device (not shown) provided outside. Resonates and a current flows, and this current is supplied to the IC chip 510, whereby information is written to the IC chip 510 from the information writing / reading device or written to the IC chip 510 in a non-contact state. Information is read out by the information writing / reading device via the antenna unit 520. At this time, the length of the antenna unit 520 is different between BB ′ and CC ′ in the figure, and changes steplessly from BB ′ to CC ′. Therefore, the resonance point of the antenna unit 520 ranges from the length between BB ′ to the length between CC ′, thereby realizing a wideband antenna.
JP 2002-157561 A

  In the non-contact type IC tag using the radio wave system as described above, the one having a bow-tie antenna for realizing a wide band is described in Patent Document 1 in order to enhance the adhesive force between the front and back surface sheets. Thus, when the through hole is formed in the inlet, since the area of the conductor portion in the bow tie antenna is large, it is difficult to say that the total area of the through hole is reduced and the adhesive force is enhanced. In addition, if the total area of the through holes is increased in order to strengthen the adhesive force, the area of the conductor part of the bow tie antenna is reduced, and there is a problem that communication characteristics are deteriorated.

  The present invention has been made in view of the problems of the conventional technology as described above, and in an RF-ID medium in which a plurality of layers are stacked and performs communication by a radio wave system, communication performance is not deteriorated. An object of the present invention is to provide an RF-ID medium that can reinforce the adhesive force of a plurality of layers while realizing a wide band, and a method for manufacturing the same.

In order to achieve the above object, the present invention provides:
An antenna part is formed on a base substrate, and an inlet on which an IC chip is mounted so as to be connected to the antenna part is sandwiched and bonded between a plurality of layers. In an RF-ID medium in which information is written and / or read out,
The antenna part has a conductor part formed in a closed loop shape,
The base substrate has a through hole inside the closed loop of the conductor portion.

  In the present invention configured as described above, the antenna portion is formed and the base substrate on which the IC chip is mounted has a through hole, but the conductor portion constituting the antenna portion is in a closed loop shape. Since the through hole is formed inside the closed loop of the conductor portion, the size of the through hole can be increased without reducing the outer shape of the antenna portion. Thereby, a part of several layer which pinches | interposes an inlet, or an adhesive layer penetrates into this through-hole, and the adhesive force is strengthened. Further, since the conductor portion constituting the antenna portion is formed in a closed loop shape, a wide band is realized, and it is not necessary to reduce the outer shape of the antenna portion as described above, so that the communication performance is not deteriorated. .

Such RF-ID media is, for example,
Forming the antenna portion on the base substrate so that the conductor portion has a closed loop shape;
Mounting the IC chip to be connected to the antenna unit on the base substrate;
Forming the inlet by forming the through hole inside the closed loop of the conductor portion of the base substrate; and
It is conceivable to manufacture by a manufacturing method including a step of sandwiching the inlet between a plurality of layers and bonding the inlet and the plurality of layers.

  In this case, it is conceivable that the conductor portion constituting the antenna portion is formed by screen printing or the like using conductive ink. However, since the conductor portion is formed in a closed loop shape, the amount of conductive ink used can be reduced.

A step of forming a conductor region having the outer shape of the closed loop conductor portion on the base substrate;
Mounting the IC chip so as to be connected to the conductor region on the base substrate;
Forming the through hole in the region where the conductor region of the base substrate is formed so that the outer portion of the conductor region remains, thereby forming the conductor part in a closed loop shape, and producing the inlet; ,
It is also conceivable to manufacture by a manufacturing method including a step of sandwiching the inlet between a plurality of layers and bonding the inlet and the plurality of layers.

  In this case, of the conductor region formed on the base substrate, the region that does not become the antenna portion can be removed by the through hole forming step.

  As described above, in the present invention, since the conductor portion constituting the antenna portion is formed in a closed loop shape and the base substrate has a through hole inside the closed loop of the conductor portion, the outer shape of the antenna portion is reduced. Without increasing the size of the through-hole, thereby enhancing the adhesive strength of the multiple layers and avoiding a decrease in communication performance. Also, the conductor portion constituting the antenna portion Is formed in a closed loop shape, a wide band can be realized.

  In addition, an RF chip is mounted on the base substrate so that the antenna portion is formed on the base substrate so that the conductor portion is in a closed loop shape, and an IC chip is mounted on the base substrate. Manufactured by forming a through hole inside the closed loop of the conductor portion of the base substrate, sandwiching the inlet with a plurality of layers, and bonding the inlet and the plurality of layers In what to do, when the conductor part which comprises an antenna part is formed by screen printing etc. which used conductive ink, the usage-amount of conductive ink can be reduced.

  Also, an IC chip is mounted on the base substrate so that the RF-ID medium is connected to the conductor region on the base substrate, and a step of forming a conductor region having a closed loop-shaped conductor on the base substrate. A step of forming an inlet by forming a through-hole in the region where the conductor region of the base substrate is formed so that the outer portion of the conductor region remains in the closed loop shape, In what is manufactured by sandwiching the inlet with a plurality of layers and bonding the inlet and the plurality of layers, a through hole is formed in a region of the conductor formed on the base substrate that does not become the antenna portion. It can be removed by the process, and the efficiency of the manufacturing process can be improved.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B are diagrams showing a first embodiment of a non-contact type IC tag that is an RF-ID medium of the present invention. FIG. 1A is a plan view showing an internal structure, and FIG. It is AA 'sectional drawing shown.

  In this embodiment, as shown in FIG. 1, two surface sheets 103 a and 103 b are laminated on the front and back of the inlet 101, and these are adhered by an adhesive 102. In the inlet 101, a straight line connecting the vertices formed by equal sides of the isosceles triangle on the base substrate 130 made of PET resin or the like is formed by an isosceles triangle. An antenna part 120 is formed so as to be perpendicular to each of the bottom sides and the apexes having a gap, and connected to the two conductor parts 120a and 120b. An IC chip 110 capable of writing and reading information in a non-contact state is mounted. Since the conductor parts 120a and 120b are only composed of an isosceles triangle as described above, each of them has a closed loop shape, and the base substrate 130 has the conductor parts 120a and 120b inside the closed loop. Through holes 131a and 131b penetrating the front and back sides having an outer shape along 120b are formed.

  In the non-contact type IC tag 100 configured as described above, the antenna unit 120 receives radio waves from the information writing / reading device by being brought close to an information writing / reading device (not shown) provided outside. Resonates and a current flows, and this current is supplied to the IC chip 110, whereby information is written to the IC chip 110 from the information writing / reading device or written to the IC chip 110 in a non-contact state. Information is read out by the information writing / reading device via the antenna unit 120.

  Below, the manufacturing method of the non-contact type IC tag 100 mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of manufacturing the non-contact type IC tag 100 shown in FIG.

  First, on the base substrate 130 made of PET resin or the like, the straight line connecting the vertices formed by the equal sides of the isosceles triangles on the conductor portions 120a and 120b having only the outer shape of the isosceles triangle is the bottom of the isosceles triangle. It forms by screen printing using conductive ink so that it may become perpendicular | vertical with respect to each and a vertex may have a space | gap (FIG. 2 (a)). Thereby, the conductor parts 120a and 120b which comprise the antenna part 120 on the base base material 130 are each formed in a closed loop shape.

  Next, the IC chip 110 is mounted on the base substrate 130 so as to be connected to the regions that are the vertices of the isosceles triangles of the conductor portions 120a and 120b (FIG. 2B). A region serving as a vertex of an isosceles triangle of the conductor portions 120a and 120b to which the IC chip 110 is connected becomes a feeding point (not shown).

  Next, through-holes 130a and 131b penetrating front and back along the inner circumference of the conductor portions 120a and 120b are formed inside the conductor portions 120a and 120b in the base substrate 130, respectively, thereby producing the inlet 101 (FIG. 2 (c)).

  Thereafter, the adhesive 102 is applied to the front and back of the inlet 101 manufactured as described above, the inlet 101 to which the adhesive 102 is applied is sandwiched between the top sheets 103a and 103b, and the inlet 101 and the top sheets 103a and 103b are attached. It adheres with the agent 102 (FIG.2 (d)). At this time, the adhesive 102 applied to the front and back of the inlet 101 enters the through holes 131 a and 131 b, whereby the adhesive 102 applied from the front side of the inlet 101 and the adhesive applied from the back side of the inlet 101. 102 is bonded. Since the top sheets 103a and 103b are bonded to the inlet 101 while being leveled by rollers (not shown), the region where the through holes 131a and 131b are formed does not become depressed due to the absence of the inlet 101. .

  In the non-contact type IC tag 100 manufactured as described above, the adhesive 102 serving as an adhesive layer enters the through holes 131a and 131b formed in the base substrate 130, so that the adhesive force of the topsheets 103a and 103b is increased. In addition to being strengthened, the inlet 101 is fixed between the two topsheets 103a and 103b, but the through holes 131a and 131b are formed inside the conductor portions 120a and 120b having only an isosceles triangular shape. Therefore, the size of the through holes 131a and 131b can be increased without reducing the outer shape of the antenna unit 120, and the adhesive force between the inlet 101 and the top sheets 103a and 103b can be further strengthened. it can. In addition, since it is not necessary to reduce the outer shape of the antenna unit 120, the communication distance is not shortened. Furthermore, when the antenna part 120 is formed using conductive ink as described above, the conductor parts 120a and 120b constituting the antenna part 120 have only an isosceles triangular outer shape, thereby reducing the amount of conductive ink used. be able to.

  Below, the communication characteristic by which the conductor parts 120a and 120b which comprise the antenna part 120 are only an isosceles triangle external shape is demonstrated.

  FIG. 3 is a view showing an example of a non-contact type IC tag in which a plurality of through holes are provided in a bow tie antenna, (a) is a view showing an internal structure, and (b) is an A-shown in (a). It is A 'sectional drawing.

  In the non-contact type IC tag 200 in this example, as shown in FIG. 3, a bow tie-shaped antenna section 220 composed of conductor sections 220 a and 220 b having isosceles triangles is formed on a base substrate 230 and an IC chip 210 is formed. Surface sheets 203a and 203b are bonded to the front and back of the installed inlet 201 with an adhesive 202, and a plurality of through holes 231a and 231b are formed in regions where the conductor portions 220a and 220b of the base substrate 230 are formed. Is provided.

  FIG. 4 is a diagram for explaining the communication characteristics of the non-contact type IC tag 100 shown in FIG.

  In the non-contact IC tag 100 as shown in FIG. 1, the resonance point of the radio wave differs depending on the material of the object to be attached, that is, the difference in the dielectric constant of the object to be attached. Therefore, it is necessary to realize a broadband as described above.

  The graph shown in FIG. 4 shows the stickers to which the non-contact type IC tag is attached on the horizontal axis, showing in order from the lowest dielectric constant, and the vertical axis shows the non-contact type IC tag. On the other hand, the output attenuation value of the reader device that reads information is shown, and the attenuation value at which information can be read at the same distance is shown as a graph.

  In the figure, the solid line is the communication characteristic of the non-contact type IC tag 100 shown in FIG. 1, the broken line is the communication characteristic of the non-contact type IC tag 200 shown in FIG. 3, and the alternate long and short dash line is the non-contact type IC tag shown in FIG. 500 communication characteristics are shown.

  As shown in FIG. 4, the non-contact type IC tag 100 shown in FIG. 1 is different from the non-contact type IC tag 200 shown in FIG. 3 and the non-contact type IC tag 500 shown in FIG. Even if the output attenuation value is large, it is possible to read out information at the same distance, and even if the dielectric constant changes, the output attenuation value of the reader device that can read out information at the same distance is too small. It has not changed.

  That is, the non-contact type IC tag 100 shown in FIG. 1 can realize a wide band compared to the non-contact type IC tag 200 shown in FIG. 3 and the non-contact type IC tag 500 shown in FIG. ing.

  As described above, in the non-contact type IC tag 100 shown in FIG. 1, a wide band is realized by forming the conductor portions 120a and 120b constituting the antenna portion 120 in a closed loop shape.

(Second Embodiment)
FIG. 5 is a diagram showing a second embodiment of a non-contact type IC tag which is an RF-ID medium of the present invention, (a) is a plan view showing an internal structure, and (b) is a diagram in (a). It is AA 'sectional drawing shown.

  In this embodiment, as shown in FIG. 5, two surface sheets 303a and 303b are laminated on the front and back of the inlet 301, and these surface sheets 303a and 303b are thermally melted, so that the inlet 301 and the surface sheets 303a and 303b It is composed by bonding. In the inlet 301, a straight line connecting the vertices formed by equal sides of an isosceles triangle on the base substrate 330 made of PET resin or the like is formed by an isosceles triangle. An antenna part 320 is formed so as to be perpendicular to each of the bottom sides and the apexes having a gap, and is connected to the two conductor parts 320a and 320b. An IC chip 310 that can write and read information in a non-contact state is mounted. Since the conductor parts 320a and 320b are only composed of an isosceles triangular outline as described above, each of the conductor parts 320a and 320b has a closed loop shape, and the base substrate 330 has a conductor part 320a on the inner side of the closed loop shape. , 320b having through-holes 331a and 331b having an outer shape along 320b are formed.

  In the non-contact type IC tag 300 configured as described above, the antenna unit 320 receives radio waves from the information writing / reading device by being brought close to an information writing / reading device (not shown) provided outside. Resonates and a current flows, and this current is supplied to the IC chip 310, whereby information is written to the IC chip 310 from the information writing / reading device or written to the IC chip 310 in a non-contact state. Information is read out by the information writing / reading device via the antenna unit 320.

  Below, the manufacturing method of the non-contact type IC tag 300 mentioned above is demonstrated.

  FIG. 6 is a diagram for explaining a method of manufacturing the non-contact type IC tag 300 shown in FIG.

  First, on the base substrate 330 made of PET resin or the like, straight lines connecting the vertices formed by the equal sides of the isosceles triangles on the conductor regions 321a and 321b having an isosceles triangle shape are the bases of the isosceles triangles, respectively. Are formed by etching so that the vertices have a gap between them (FIG. 6A).

  Next, the IC chip 310 is mounted on the base substrate 330 so as to be connected to the regions that are the vertices of the isosceles triangles of the conductor regions 321a and 321b (FIG. 6B). A region serving as a vertex of an isosceles triangle of the conductor regions 321a and 321b to which the IC chip 310 is connected becomes a feeding point (not shown).

  Next, through holes 330a and 331b penetrating front and back are formed so that the outer portions of the conductor regions 321a and 321b remain in the region of the base substrate 330 where the conductor regions 321a and 321b are formed. The inlet 301 is manufactured by using the conductor portions 320a and 320b constituting 320 (FIG. 6C). As a result, the conductor portions 320a and 320b constituting the antenna portion 320 are formed on the base substrate 330 in a closed loop shape.

  Thereafter, the inlet 301 produced as described above is sandwiched between the surface sheets 303a and 303b, and the surface sheets 303a and 303b are thermally melted to bond the inlet 301 and the surface sheets 303a and 303b (FIG. 6D). ). At this time, the heat-melted surface sheets 303 a and 303 b enter the through holes 331 a and 331 b, whereby the two surface sheets 303 a and 303 are bonded to each other with the inlet 301 interposed therebetween. Since the top sheets 303a and 303b are bonded to the inlet 301 while being leveled by a roller (not shown), the region where the through holes 331a and 331b are formed does not become depressed due to the absence of the inlet 301. .

  In the non-contact type IC tag 300 manufactured in this way, the surface sheets 303a and 303b that are thermally melted enter through holes 331a and 331b formed in the base substrate 330, and the surface sheets 303a and 303b are directly bonded to each other. As a result, the adhesive force between the top sheets 303a and 303b is strengthened, and the inlet 301 is fixed between the two top sheets 303a and 303b, but the through holes 331a and 331b are isosceles triangles. Are formed inside the conductor portions 320a and 320b having only the outer shape, the size of the through holes 331a and 331b can be increased without reducing the outer shape of the antenna portion 320, and the inlet 301 and the surface sheet 303a. , 303b can be further strengthened. Further, since it is not necessary to reduce the outer shape of the antenna unit 320, the communication distance is not shortened. Furthermore, when the antenna part 320 is formed by etching as described above, it is necessary to apply a resist to the inside of the conductive regions 321a and 321b in order to make the conductor parts 320a and 320b constituting the antenna part 320 into a closed loop shape. However, in the present embodiment, the conductive portions 321a and 321b having the shape of an isosceles triangle are formed, and then the through holes 331a and 331b are formed in the base substrate 330, whereby the conductor portions 320a and 320b are in a closed loop shape. In addition, without applying resist to the inside of the conductive regions 321a and 321b, it is possible to remove regions of the conductor regions 321a and 321b formed on the base substrate 330 that do not become the antenna portion 320.

  Also in the non-contact type IC tag 300 in this embodiment, the same communication characteristics as those shown in FIG. 1 can be obtained, and a wide band can be realized.

  It is also conceivable to combine the two embodiments described above. That is, in the case of using an adhesive as shown in FIG. 1, a through hole is formed after forming a conductor region as shown in FIG. 5, or the surface sheet is heated as shown in FIG. Combinations such as those in which the conductor portion is formed in a closed loop shape when the conductor portion is formed on the base substrate as shown in FIG.

  Further, in the above-described two embodiments, the example having the antenna units 120 and 320 including the two conductor units 120a, 120b, 320a, and 320b has been described as an example. However, the antenna unit including the single conductor unit is described. It may have.

  In the above-described two embodiments, the non-contact type IC tag is described as an example of the RF-ID medium. However, the present invention is an IC chip capable of writing and reading information in a non-contact state. In addition, a non-contact type IC label, a non-contact type IC card, or the like can be applied as long as it is an RF-ID medium that is connected to the conductor and mounted on the base substrate. In a non-contact type IC card, it is rare to be affixed to an object like the above-described non-contact type IC tag. However, when used in a wallet or a bag, In addition, since the resonance point may change depending on the material of an object in contact with the other, it is preferable to realize a wide band with the above-described configuration. Moreover, even when the card is taken out from a wallet or a bag or the like, the resonance point changes depending on the human body when used with a hand.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows 1st Embodiment of the non-contact-type IC tag used as RF-ID media of this invention, (a) is a top view which shows an internal structure, (b) is A- shown in (a). It is A 'sectional drawing. It is a figure for demonstrating the manufacturing method of the non-contact-type IC tag shown in FIG. It is a figure which shows an example of the non-contact-type IC tag which provided the several through-hole in the bowtie antenna, (a) is a figure which shows an internal structure, (b) is AA 'sectional drawing shown to (a) It is. It is a figure for demonstrating the communication characteristic of the non-contact-type IC tag shown in FIG. It is a figure which shows 2nd Embodiment of the non-contact-type IC tag used as RF-ID media of this invention, (a) is a top view which shows an internal structure, (b) is A- shown in (a). It is A 'sectional drawing. It is a figure for demonstrating the manufacturing method of the non-contact-type IC tag shown in FIG. It is a figure which shows an example of the non-contact-type IC tag which has a general bow-tie antenna, (a) is a top view which shows an internal structure, (b) is A-A 'sectional drawing shown to (a).

Explanation of symbols

100, 200, 300 Non-contact type IC tag 101, 201, 301 Inlet 102, 202 Adhesive 103a, 103b, 203a, 203b, 303a, 303b Surface sheet 110, 210, 310 IC chip 120, 220, 320 Antenna portion 120a, 120b, 220a, 220b, 320a, 320b Conductor portion 130, 230, 330 Base substrate 131a, 131b, 231a, 231b, 331a, 331b Through hole

Claims (3)

An antenna part is formed on a base substrate, and an inlet on which an IC chip is mounted so as to be connected to the antenna part is sandwiched and bonded between a plurality of layers. In an RF-ID medium in which information is written and / or read out,
The antenna part has a conductor part formed in a closed loop shape,
The RF-ID medium, wherein the base substrate has a through hole inside the closed loop of the conductor portion. It is a manufacturing method of RF-ID media of Claim 1,
Forming the antenna portion on the base substrate so that the conductor portion has a closed loop shape;
Mounting the IC chip to be connected to the antenna unit on the base substrate;
Forming the inlet by forming the through hole inside the closed loop of the conductor portion of the base substrate; and
A method of manufacturing an RF-ID media, comprising: sandwiching the inlet between a plurality of layers, and bonding the inlet and the plurality of layers. It is a manufacturing method of RF-ID media of Claim 1,
Forming a conductor region having the closed loop-shaped conductor portion as an outer shape on the base substrate;
Mounting the IC chip so as to be connected to the conductor region on the base substrate;
Forming the through hole in the region where the conductor region of the base substrate is formed so that the outer portion of the conductor region remains, thereby forming the conductor part in a closed loop shape, and producing the inlet; ,
A method of manufacturing an RF-ID media, comprising: sandwiching the inlet between a plurality of layers, and bonding the inlet and the plurality of layers.

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