JP2002157561A - Ic card and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a yield. SOLUTION: In this IC card, an antenna board where an IC chip and an antenna circuit are mounted on a board is inserted between at least, one pair of films. At least, one or more through holes are formed on the board in one pair of films, a recessed part and a projecting part are respectively formed on planes facing the antenna board, and the antenna board is fixed to one pair of films in such a manner that the projecting part is fitted into the recessed part through the through holes formed on the board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC card and a method for manufacturing the same.

[0002]

2. Description of the Related Art An ID (identit) for identifying an individual has been conventionally used.
y) As a card, a magnetic or optical reading method has been widely used in credit cards and the like. However, due to the popularization of technology, falsification of data and forgery cards have become available, and the number of people who are actually affected by forgery cards has increased. For this reason, in recent years, attention has been paid to managing personal data from the viewpoint that an IC card containing an IC chip has a large information capacity and can carry encrypted data.

This IC card has a connection terminal for electrical and mechanical connection for information exchange between an IC circuit and an external data processing device. Therefore, there have been various problems such as securing airtightness inside the IC circuit, countermeasures against electrostatic breakdown, poor electrical connection of terminal electrodes, and complicated mechanism of the read / write device. In addition, since a human operation of inserting or attaching an IC card to a read / write device is eventually required, and it is inefficient and complicated depending on the application field, so that a remote data processing device that can be used in a portable state without any trouble is required. There has been a demand for a non-contact IC card capable of exchanging information.

[0004] Therefore, a non-contact IC card having an antenna for utilizing electromagnetic waves and an IC chip having a memory and an arithmetic function in a plastic card base has been developed. This is the induced electromotive force excited by the antenna in the card by the external electromagnetic wave from the reader / writer.
C is driven, and it is not necessary to have a battery power supply inside the card, and it is possible to provide a card having excellent activity.

As described above, the necessity of an IC card which has a visible recognition display function and is confidentially managed by electronic information is increasing.

[0006] Such an IC card is shown in FIG.
As shown in the figure, the antenna substrate 101 on which the IC chip 100 is mounted is sandwiched between a pair of exterior members 102a and 102b, and is bonded and sealed with, for example, a thermoplastic adhesive.

In card manufacturing, a card size of 8
Using a so-called single sheet size sheet of 18 to 18 sheets,
Using an antenna substrate sheet having a sheet size of 8 to 18 sheets, lamination and bonding were performed by a hot press after the step of collating the laminated constituent sheets.

In this case, usually, prior to the lamination process, an IC chip operation test and a transmission / reception signal electric characteristic test for the antenna substrate are performed.

[0009]

However, in the conventional laminating method using a sheet-size sheet, the IC
Even if a defective antenna substrate is generated in the chip operation test or the signal electric characteristic test, the defective antenna substrate cannot be excluded from the sheet.

That is, when collating is performed using a single-sheet size sheet, even if there is at least one defective antenna substrate, the defective antenna substrate cannot be removed.
The antenna substrate sheet containing the defective product is also laminated and adhered, which naturally becomes a defective product. Then, all the other components laminated with the defective antenna substrate are wasted, and the productivity is reduced.

In addition, in order to prevent a defective product from being mixed, it is necessary to remember the defective portion of the antenna substrate, and to remove the card at the defective portion later, which is very complicated in the process. .

Further, when collation is performed using a single-sheet-size component member sheet, there is a case where a positional shift occurs between the antenna substrate and the component film sandwiching the antenna substrate, which also hinders an improvement in yield. Had become.

The present invention has been proposed in view of such a conventional situation, and has as its object to provide an IC card with an improved yield and a method of manufacturing the same.

[0014]

The IC card according to the present invention comprises:
An IC card in which an antenna substrate on which an IC chip and an antenna circuit are mounted is sandwiched between at least a pair of films, wherein the substrate has at least one or more through-holes formed therein. On a pair of films, a concave portion and a convex portion are respectively formed on a surface facing the antenna substrate, and by fitting the concave portion and the convex portion through a through hole formed in the substrate,
The antenna substrate is fixed to the pair of films.

In the IC card according to the present invention as described above, the antenna substrate is fixed to the pair of films by fitting the concave portion and the convex portion through the through hole formed in the substrate. Therefore, the antenna substrate is sandwiched between the pair of films without displacement.

Further, the method of manufacturing an IC card according to the present invention comprises:
An IC card manufacturing method in which an antenna substrate is sandwiched between at least a pair of films, wherein an antenna substrate manufacturing step of mounting an IC chip and an antenna circuit on a substrate having a through hole to manufacture an antenna substrate; Inspection is performed on the antenna substrate produced in the antenna substrate production process, the defective antenna substrate is removed, and only the non-defective antenna substrate is selected and taken out. On the surface facing the antenna substrate, a concave / convex portion forming step of forming a concave portion and a convex portion, respectively, and the antenna substrate selected in the selecting step, one of the films so that the through hole and the convex portion are aligned. Mounting on the film, a temporary fixing step of fixing the antenna substrate mounted on the film to the film at the portion of the through hole, In square of film, and a sealing step of sealing by sandwiching the antenna substrate.

The method of manufacturing an IC card according to the present invention comprises:
In the sealing step, the concave and convex portions respectively formed in the pair of films are fitted through the through holes formed in the antenna substrate, whereby the antenna substrate is fixed to the pair of films. It is characterized by that.

In the method for manufacturing an IC card according to the present invention as described above, in the sealing step, the concave portions and the convex portions respectively formed in the pair of films may be formed with the through holes formed in the antenna substrate. Since the antenna substrate is fixed to the pair of films by fitting through the antenna, the antenna substrate is sandwiched between the pair of films without displacement.

[0019]

Embodiments of the present invention will be described below.

FIGS. 1 and 2 show an example of the configuration of an IC card 1 according to the present invention. In this IC card 1, the antenna substrate 2 is provided with a pair of exterior members 4a,
4b.

The antenna substrate 2 is formed by patterning a capacitor and an antenna circuit 5 on a film made of, for example, PET (polyethylene terephthalate) resin, polyimide resin or the like. The antenna circuit 5 is made of, for example, aluminum or the like. The thickness of the antenna substrate 2 is, for example, 15 μm.

The antenna substrate 2 has two shapes, a half size as shown in FIG. 3 and a full size as shown in FIG. The half-sized antenna substrate 2 is formed into a half-sized substrate having a required antenna shape when the antenna substrate is manufactured. By manufacturing a substrate with a half size of a required antenna shape, material cost can be reduced. On the other hand, the full-size antenna substrate 2
The antenna characteristics are improved by forming individual antenna circuits 5 on both sides of a card-size substrate film.

In the IC card 1 shown in FIGS. 1 and 2, a full-size antenna substrate 2 is used. As will be described later, a through hole 40 for fixing the antenna substrate is formed in the antenna substrate 2. An IC chip 7 is attached to a predetermined position of the antenna substrate 2 via an ACF conductive film 6.

As the ACF conductive film 6, an anisotropic conductive film having a double-sided adhesive layer is used. The thickness of the ACF conductive film 6 is, for example, 15 μm. The IC chip 7 has a rectangular shape of, for example, 4.3 mm × 4.0 mm and a thickness of, for example, 175 μm.

The IC chip 7 stuck on the antenna substrate 2 is sealed with adhesives 8 from both sides of the substrate in order to guarantee its conduction characteristics. Have been.

The adhesive 8 is made of, for example, a bisphenol-type epoxy adhesive, a filler-containing adhesive, or another sealing material. The thickness of the adhesive 8 is, for example, 70 μm. The reinforcing plate 9 is made of, for example, a stainless disk, a ceramic disk, or another reinforcing material. The thickness of the reinforcing plate 9 is, for example, 50 μm.

The adhesive sheets 3a and 3b are made of, for example, a thermoplastic resin sheet, a thermoplastic adhesive, a two-part epoxy adhesive, or the like. The thickness of the adhesive sheets 3a, 3b is, for example, 120 μm. Here, although specifically described later, in the IC card 1 of the present invention, the adhesive sheets 3a, 3b
In the position corresponding to the through hole 40 formed in the antenna substrate 2 described above, one of the adhesive sheets 3a has a protrusion 41
However, a concave portion 42 is formed in the other adhesive sheet 3b. A convex portion 41 formed on the adhesive sheet 3a;
The recess 42 formed in the adhesive sheet 3b is fitted through the through-hole 40 formed in the antenna substrate 2 so that the antenna substrate 2 is connected to the pair of adhesive sheets 3a and 3a.
3b.

Further, as described later, in the IC card 1, it is preferable that the adhesive sheets 3a and 3b have a pattern of irregularities for deaeration.

The exterior members 4a and 4b are made of, for example, PET-G,
It is made of ABS resin, vinyl chloride and the like. This exterior material 4a,
The thickness of 4b is, for example, 125 μm. Printing layer 10
Is composed of, for example, a pigment ink transparent varnish-based top coat material, a thermosensitive leuco printing layer, and the like. The thickness of the printing layer 10 is, for example, 2 μm.

The IC card 1 having such a configuration is
The exterior materials 4a, 4b and the adhesive sheets 3a,
3b, the antenna substrate 2 on which the IC chip 7 is mounted,
By laminating the adhesive sheets 3a, 3b and the outer packaging materials 4a, 4b and hot pressing, these components are bonded to each other to produce a product.

Here, in the present invention, as shown in FIGS. 1 and 4, a through hole 40 is formed in the antenna substrate 2 which is a component of the IC card, and is disposed on one surface of the antenna substrate 2. On the side facing the antenna substrate 2 of the adhesive sheet 3a, a convex portion 41 is formed at a position corresponding to the through hole 40, and on the side facing the antenna substrate 2 of the other adhesive sheet 3b, A recess 42 is formed at a position corresponding to the through hole 40.

That is, via the through hole 40 formed in the antenna substrate 2, the convex portion 41 formed on one adhesive sheet 3 a and the concave portion 4 formed on the other adhesive sheet 3 b
2, the antenna substrate 2 is positioned and fixed to the pair of adhesive sheets 3a and 3b,
The antenna substrate 2 is sandwiched between the pair of adhesive sheets 3a and 3b without displacement.

By forming the through holes 40 in the antenna substrate 2, the adhesive sheet 3 a and the adhesive sheet 3 b come into contact with each other at the through holes 40. Here, when the constituent members are stacked and bonded, the adhesiveness between the antenna substrate 2 and the adhesive sheets 3a and 3b made of different materials is smaller than that of the adhesive sheets 3a and 3b.
The adhesiveness between the adhesive sheets 3a and 3b made of the same material is higher. That is, by bonding the adhesive sheet 3a and the adhesive sheet 3b at the portion of the through-hole 40 formed in the antenna substrate 2, the adhesiveness at this portion becomes high. Thereby, the IC card has a high adhesive strength between the constituent members.

The number of the through holes 40 formed in the antenna substrate 2 is not particularly limited, but it is an object of the present invention to improve the fixing property of the antenna substrate 2 and the adhesiveness of the laminated components. Considering the effect, it is preferable to form a plurality of antenna circuits and IC chips so as not to affect the operation characteristics.

The protrusions 4 formed on the adhesive sheet 3a
The shape 1 is not particularly limited. For example, the shape 1 may be formed in an arc shape as shown in FIG.
It may be formed in a cone shape as shown in FIG. As shown in FIG. 7, the shape may be flat. Further, as shown in FIG. 8, a shape in which a step is further added to the convex portion may be employed. Also. A relief portion is provided in the convex portion 41 shown in FIG. 7 and FIG. 8, and this relief portion becomes flat after laminating and pressing the constituent members. On the other hand, the shape of the concave portion 42 formed in the adhesive sheet 3b is not shown, but is a concave shape corresponding to the convex shape of the convex portion 41 described above.

Further, in this IC card, it is preferable that an uneven pattern for the purpose of degassing is formed on both surfaces of the adhesive sheets 3a and 3b. Adhesive sheets 3a, 3b
By forming the concavo-convex pattern on both surfaces, air remaining between the laminated components during the hot pressing is discharged to the outside through the concave portion of the concavo-convex pattern. As a result, air remaining between the constituent members during hot pressing is eliminated, and a smooth IC card 1 without swelling of the card surface due to bubbles can be obtained.

Here, in the following description of the shape of the deaeration concave / convex pattern, only the adhesive sheet 3a on which the temporary fixing projections 41 are formed will be described as an example. Is formed on the other adhesive sheet 3b, which is similar to the adhesive sheet 3a.

As the concavo-convex pattern formed on the adhesive sheet 3a, for example, a so-called satin pattern as shown in FIG. 9 formed on the surface of the adhesive sheet 3a can be mentioned. By forming the matte pattern on the surface of the adhesive sheet 3a, the air remaining between the component laminations is discharged to the outside through the concave portion of the matte pattern.

In addition to the matte pattern, the uneven pattern formed on the surface of the adhesive sheet 3a includes, for example,
Ground patterns as shown in FIGS. 10 to 15 are exemplified. FIG. 10 is a Teflon (registered trademark) fiber surface transfer adhesive sheet (etched pattern No. 2, N
o. 6). FIG. 11 shows a Teflon fiber surface cross pattern transfer adhesive sheet (manufactured by Nippon Etching Co., Ltd.
Etching pattern No. 9, HN451). FIG.
2 is a striped etching pattern transfer adhesive sheet (Nippon Etching Co., Ltd., etching pattern No. 7, N
o. 9). FIG. 13 shows a polygonal line pattern surface transfer adhesive sheet (corresponding to an etched pattern HN463 manufactured by Nihon Etching Co., Ltd.).

FIG. 14 shows a streamline pattern surface transfer adhesive sheet (etched pattern N manufactured by Nippon Etching Co., Ltd.).
o. 8). In the streamline pattern shown in FIG.
The eye pattern is fine in a portion corresponding to the IC chip 7. As described above, air is particularly likely to remain around the IC chip 7. By making the pattern of the portion corresponding to the IC chip 7 fine, air remaining in the peripheral portion of the IC chip 7 can be efficiently removed. Further, as shown in FIG. 15, an antenna circuit surface transfer sheet having a pattern conforming to various antenna circuits may be formed.

Further, it is preferable that a stripe-shaped groove 11 is formed on the adhesive sheet 3a in addition to the ground pattern such as the above-described satin pattern as an uneven pattern.
Since the striped grooves 11 are formed in the adhesive sheet 3a as a concavo-convex pattern, degassing efficiency is increased, air remaining between the constituent members is eliminated, and the smooth IC card 1 without swelling of the card surface due to bubbles. Can be obtained.

As shown in FIG. 16, the groove 11 has a thickness (T) of 100 μm to 300 μm, for example.
The groove 11 having a width (w) of 20 μm to 300 μm and a depth (d) of 10 μm to 50 μm is 1 mm to 5 mm with respect to a.
Is preferably formed at the pitch (p).

If the width and depth of the groove 11 are smaller than the above ranges, deaeration cannot be performed sufficiently, and air may remain between constituent members. If the width or depth of the groove 11 is larger than the above range, the stiffness (rigidity) of the adhesive sheet 3a when the groove 11 is formed.
Will decrease. Therefore, by setting the width and depth of the groove 11 within the above ranges, air between the laminated components can be sufficiently deaerated, and even when the groove 11 is formed, the rigidity of the adhesive sheet 3a can be increased. (Rigidity) can be maintained as much as possible. In addition, handling becomes easy when the grooves 11 are formed in the adhesive sheet 3a by transfer.

In particular, the depth of the groove 11 is 10 μm
If it is shallower, when the components are laminated and hot pressed,
The groove 11 may be crushed. When the groove 11 is crushed, there is no gap for deaeration, and it is not possible to sufficiently deaerate the air remaining between the laminated components. Groove 1
By setting the depth of 1 to be in the range of 10 μm to 50 μm, the grooves 11 are not completely crushed even when the constituent members are stacked and hot pressed, and a gap for deaeration can be secured. it can.

The groove 11 is preferably formed so as to be substantially perpendicular to the wiring of the antenna circuit 5 formed on the antenna substrate 2. By forming the groove 11 so as to be substantially perpendicular to the wiring of the antenna circuit 5, deaeration can be performed efficiently. As shown in FIG. 4, the antenna circuit 5 is formed substantially along the outer shape of the substantially rectangular antenna substrate 2. Therefore, in this IC card 1, the longer of the antenna circuit 5 formed along the long side of the antenna substrate 2 and the antenna circuit 5 formed along the short side of the antenna substrate 2, that is, the antenna substrate 2 The groove 11 is formed so that the antenna circuit 5 formed along the long side of the arrow and the groove 11 formed in the adhesive sheet 3a are substantially orthogonal.

Further, as shown in FIG. 16, it is preferable to form the grooves 11 on both surfaces of the adhesive sheet 3a so as to be staggered. By displacing the grooves 11 on both sides of the adhesive sheet 3a, the depth of the grooves 11 can be increased, and the degassing effect is improved.

Further, as shown in FIG.
It is also effective to make the groove 11 inclined so that the groove depth is shallower at the center of the card and deeper toward the outside. By providing the groove 11 with an inclination, during the hot pressing of the laminated component, the air remaining between the components is gradually discharged from the center toward the outside, that is, is discharged to the outside along the inclination of the groove 11, Removed. At this time, since the air is discharged to the outside along the slope of the groove 11, the air remaining inside can be easily guided, and the remaining air can be removed effectively.

The apex of such an inclined groove 11, that is, the portion having the shallowest groove depth is not always the center of the card. In order to perform efficient degassing, it is also possible to appropriately change the inclined shape of the groove 11 as required for the characteristic design such as the arrangement of the IC chip 7 and the antenna circuit 5 on the antenna substrate 2. .

As described above, the adhesive sheet 3
By forming the ground pattern or the concave / convex pattern of the groove 11 on a, air remaining between the laminated components can be released. As a result, after the constituent members are bonded by the hot press, the generation of bubbles due to the remaining air can be prevented, the swelling that appears on the card surface due to the bubbles can be eliminated, and the IC card 1 with excellent surface properties can be obtained. it can.

However, between the laminated constituent members, the convex portion I mounted on the antenna substrate 2 is formed.
The peripheral portion of the C chip 7 is where air is most likely to remain. The air remaining around the IC chip 7 is
The ground pattern or groove 11 formed on the adhesive sheet 3a as described above cannot be completely removed.

Therefore, as shown in FIGS. 18 and 19,
In addition to the ground pattern or groove 11 described above, it is preferable to form a recess 12 in a portion of the adhesive sheet 3a corresponding to the IC chip 7. By forming the recess 12 in the portion of the adhesive sheet 3a corresponding to the IC chip 7, air remaining in the peripheral portion of the IC chip 7, which is most difficult to remove, can be removed. Thereby, the air remaining between the laminated components can be almost completely escaped, and after the components are bonded by hot pressing, the swelling that appears on the card surface due to air bubbles due to the remaining air can be almost completely eliminated. Thus, an IC card 1 having excellent surface properties can be obtained.

The recess 12 of the IC chip 7 is
In order to achieve the purpose of removing the air remaining in the peripheral portion of the IC chip 7 as described above, it is necessary that the IC chip 7 be connected to the outside by the groove 11.

The shape of the recess 12 in the IC chip 7 is preferably a conical shape in which a substantially central portion is raised as shown in FIG. 20, for example. By forming the recess 12 of the IC chip 7 into a conical shape in which the center is raised, the air remaining in the peripheral portion of the IC chip 7 during the hot pressing of the laminated component is directed outward from the center of the recess 12. It is discharged and removed gradually toward the outside, that is, along the slope of the conical portion.

The size of the recess 12 depends on the size of the IC chip 7, but for example, the depth of the bottom outer shape is 50 μm.
The depth of the recess 12 at the apex of the cone is in the range of about 0 to 50 μm.

The shape of the recess 12 is not limited to a cone as shown in FIG. 20, but may be any shape having a pyramid shape such as a quadrangular pyramid or a triangular pyramid. In addition, the position of the apex of the cone is not limited to the center of the recess 12 but may be any point other than the center within the shape of the recess 12.

Further, as shown in FIG. 21, the groove 11 for discharging the residual air in the recess 12 to the outside can be inclined. When the groove 11 is inclined, the air remaining in the recess 12 is discharged to the outside along the inclination of the groove 11, so that the air remaining in the recess 12 can be easily guided to the outside, and the residual air Can be effectively removed.

FIG. 22 shows such an IC card.
It is manufactured as follows using a hot press device as shown in FIG.

First, the sheet-like adhesive sheet material 3 to be transferred and formed with an uneven pattern is placed on the upper plate 2.
0a and the lower plate 20b are inserted and set between the concave and convex pattern transfer plate 20. The adhesive sheet 3 is made of, for example, a thermoplastic adhesive (hot melt) or a thermoplastic resin. Further, the adhesive sheet material 3 of the upper plate 20a and the lower plate 20b is provided.
On the side opposite to the above, a convex part 41 for temporary fixing to be formed on the adhesive sheet material 3, a concave part 42, and a desired concave-convex pattern corresponding to the concave-convex pattern for deaeration are formed. Further, at least two sides of the lower plate 20b are formed with a gap abutment portion 21 made of a metal tape having a thickness substantially equal to a desired thickness of the adhesive sheet material 3, and the adhesive sheet material 3 It is set at a position corresponding to the butting portion 21. Then, the concavo-convex pattern transfer plate 20 into which the adhesive sheet material 3 is inserted is set at a desired position of the hot press section 23 according to the plate guide 22.

After the concave / convex pattern transfer plate 20 is set on the hot press section 23, the operation start button on the hot press section 23 is pressed.
4, the adhesive sheet 3 and the concave / convex pattern transfer plate 20 are brought into pressure contact with the entire surface by the pressure cylinder 25. The hot press plate 24 is controlled to a hot press temperature set in the control box 26 in advance. The hot press temperature and pressure are transmitted to the uneven pattern transfer plate 20, and the desired uneven pattern is transferred to the adhesive sheet material 3 by the hot press.

At this time, in the pressed concavo-convex pattern transfer plate 20, the upper plate 20a is abutted against the gap abutting portion 21 formed on the lower plate 20b. The adhesive sheet material 3 is made of the lower plate 2
0b and the upper plate 20a to form an adhesive sheet material 3 having a required thickness.

According to the method in which the upper plate 20a and the lower plate 20b abut against each other, the structure is simpler and less affected by heat conduction and accuracy in temperature cycling as compared with the conventional plate lot guide type press method. An uneven pattern transfer sheet having a uniform thickness can be produced.

Next, the hot-pressed concavo-convex pattern transfer plate 20 is cooled by the plate guide 22 into the cooling section 27.
The slide is transported. The concavo-convex pattern transfer plate 20 conveyed to the cooling unit 27 is sandwiched from above and below by a cooling plate 29 by a cylinder 28, and is rapidly cooled by contacting the entire surface of the cooling plate 29. The cooling plate 29 is cooled to a predetermined temperature by the control box 30 and the cooler 31.

The quenched concave / convex pattern transfer plate 20
Is opened, the adhesive sheet material 3 has a desired thickness, and the temporary fixing protrusions 41, the concave portions 42, and the deaeration uneven pattern are transferred and formed, and the adhesive sheets 3a and 3b are obtained.

FIG. 23 shows a single-sheet-size adhesive sheet 3a, 3b in which stripe-shaped grooves are formed as an uneven pattern.
An example is shown below. In FIG. 23, 3 × 6 = 18 card patterns 3c are formed on one sheet-size adhesive sheet 3a, and the temporary fixing protrusions 41 and An irregular pattern for deaeration is formed independently. Here, as a concave / convex pattern for deaeration, a ground pattern and a stripe-shaped groove 11 formed on the surface, and a depression 12 at a portion corresponding to the IC chip are formed. The concavo-convex pattern is formed in a range about 3 mm to 5 mm larger than the card punching dimension, and is formed at a dimensional pitch that matches the card punching position.

As shown in FIG. 24, each card pattern 3c is formed in a convex state, and each card pattern has a groove 11 as an uneven pattern.
Is formed to have a thickness lower than the compression bonding height in the hot press. Air passages 3d are provided on all sides of the card pattern 3p for deaeration.

As described above, the temporary fixing protrusions 41,
The sheet-size adhesive sheets 3a and 3b to which the concave portions 42 and the concave / convex pattern for deaeration are transferred are obtained.

On the other hand, as shown in FIG. 25, a sheet-sized antenna substrate sheet on which an antenna circuit 5 and the like are formed and an IC chip is mounted and 18 card patterns are formed is manufactured. In this antenna substrate sheet, a through hole 40 for temporarily fixing the antenna substrate 2 is formed.

Although the number of through holes 40 formed in the antenna substrate 2 is not particularly limited, the purpose of the present invention is to improve the fixing property of the antenna substrate 2 and the adhesiveness of the laminated components. Considering the effect, it is preferable to form a plurality of antenna circuits and IC chips so as not to affect the operation characteristics.

Then, an IC operation test is performed on the antenna substrate 2 of the manufactured antenna substrate sheet.
The optimum transmission frequency is obtained by adjusting the pattern condenser trimming. Then, the card patterns are punched out one by one to form the antenna substrate 2, and only the antenna substrate 2 which is determined to be non-defective in the IC operation inspection is selected.

Next, the non-defective antenna substrate 2 is arranged in accordance with the card pattern of the single-sheet-size adhesive sheet 3a to which the temporary fixing protrusions 41 have been transferred. At this time, the antenna substrate 2 is arranged on the adhesive sheet 3a such that the temporary fixing protrusions 41 of the adhesive sheet 3a and the through holes 40 of the antenna substrate 2 are fitted.

Next, the antenna substrate 2 is temporarily fixed on the adhesive sheet 3a. That is, the portion where the outer periphery of the convex portion 41 of the adhesive sheet 3a and the inner periphery of the through hole 40 of the antenna substrate 2 are in contact with each other by heat caulking and discharging an adhesive or press caulking, so that the adhesive sheet 3a and the antenna substrate Fix it so that it does not deviate from 2. FIG. 26 is an enlarged view of an example of a state in which the protrusion 41 of the adhesive sheet 3a and the through hole 40 of the antenna substrate 2 are temporarily fixed.

By performing the temporary fixing, the antenna substrate 2 can be fixed to the adhesive sheet 3a. Even when the component members are laminated or hot pressed in the next step, the antenna substrate 2 is not displaced and the pair of adhesive sheets 3a is not displaced. 3a and 3b.

Further, only non-defective products that have passed the inspection test are cut out of the sheet-size sheet on which the plurality of antenna substrates 2 are formed, and rejected products are removed. By disposing only the adhesive sheet 3a on the adhesive sheet 3a, the yield can be improved.

Then, as shown in FIG. 27, the adhesive sheet 3b is placed on the sheet-sized adhesive sheet 3a on which the antenna substrate 2 is disposed, and the antenna substrate 2 is collated and sandwiched from both sides. At this time, as shown in FIG. 28 on an enlarged scale, the convex portion 41 formed on the adhesive sheet 3a and the adhesive sheet 3b
Is fitted through the through hole 40 formed in the antenna substrate 2. Further, as shown in FIG. 27, the outside of the adhesive sheets 3a and 3b is collated and sandwiched between the single-sheet-sized exterior sheet 4a and the exterior sheet 4b. This is referred to as a laminated component.

Next, as shown in FIG. 29, the laminated component is set at a desired position on the laminated adhesive plate 32. The laminated component set on the laminated adhesive plate 32 is preheated to, for example, 120 ° C. by the preheating unit 33. After the preheating is completed, the laminated adhesive plate 32 is set directly below the hot press section 23.

Then, the hot press plate 24 descends and is arranged so as to be in full contact with the upper and lower surfaces of the laminated adhesive plate 32. The hot press plate 24 is controlled in advance to a set hot press temperature. And
The hot press plate 24 presses the laminated constituent members by pressing the laminated adhesive plate 32, and the laminated press is performed by the hot press.

At this time, the air remaining between the components is
It is discharged and removed to the outside by the uneven pattern formed on the adhesive sheet material 3. In addition, immediately before the hot pressing step, the degassing effect can be further enhanced by evacuating the laminated components between 2 seconds and 10 seconds.

The laminated adhesive plate 32, which has been completed in the hot press section 23, is conveyed to the cooling section 27, is sandwiched from above and below by the cooling plate 29, is rapidly cooled by contacting the entire surface of the cooling plate 29, and is laminated. Is completed.

Here, since the through hole 40 is formed in the antenna substrate 2, the convex portion 41 of the adhesive sheet 3 a and the concave portion 42 of the adhesive sheet 3 b come into contact with each other at the through hole 40. When the constituent members are laminated and bonded, the antenna substrate 2 and the adhesive sheets 3a, 3 made of different materials are used.
adhesive sheet 3a made of the same material,
The adhesiveness between the adhesive sheet and the adhesive sheet 3b is higher. That is, the through hole 40 formed in the antenna substrate 2
The adhesive sheet 3a and the adhesive sheet 3b adhere to each other at
This portion has high adhesiveness. As a result, an IC card having a high adhesive strength between the constituent members can be obtained.

[0096] The completed product of the card lamination adhesion completed
The IC card 1 is completed by punching out a single card using a card outline punching die.

Further, by forming a concavo-convex pattern on the adhesive sheet material 3, air remaining between the laminated structural members can be almost completely released during hot pressing, and after the structural members are bonded by hot pressing. In this case, the swelling appearing on the card surface due to the bubbles caused by the remaining air can be almost completely eliminated, and the IC card 1 excellent in surface properties can be obtained.

[0082]

According to the present invention, the antenna substrate is fixed to the adhesive sheet by fitting the through hole formed in the antenna substrate with the projection formed on one of the adhesive sheets. As a result, the antenna substrate is not displaced,
Handling of the component member laminated sheet after the antenna substrate is disposed becomes easy.

In the present invention, since the antenna substrate is temporarily fixed to the adhesive sheet at a plurality of locations, the antenna substrate is stuck to the entire surface of the adhesive sheet. This eliminates air entanglement between the laminated components due to the warpage or displacement of the antenna substrate, and improves the yield.

[Brief description of the drawings]

FIG. 1 is an exploded view showing a configuration example of an IC card according to the present invention.

FIG. 2 is a partially-stacked development view showing one configuration example of an IC card according to the present invention.

FIG. 3 is a perspective view showing an example of a half-size antenna substrate.

FIG. 4 is a perspective view showing an example of a full-size antenna substrate.

FIG. 5 is a cross-sectional view illustrating an example of a shape of a protrusion formed on an adhesive sheet.

FIG. 6 is a cross-sectional view illustrating an example of a shape of a protrusion formed on an adhesive sheet.

FIG. 7 is a cross-sectional view illustrating an example of a shape of a protrusion formed on an adhesive sheet.

FIG. 8 is a cross-sectional view illustrating an example of a shape of a protrusion formed on an adhesive sheet.

FIG. 9 is a perspective view showing an example of an uneven pattern formed on the surface of the adhesive sheet.

FIG. 10 is a perspective view showing an example of an uneven pattern formed on the surface of the adhesive sheet.

FIG. 11 is a perspective view showing an example of an uneven pattern formed on the surface of the adhesive sheet.

FIG. 12 is a perspective view showing an example of an uneven pattern formed on the surface of the adhesive sheet.

FIG. 13 is a perspective view showing an example of an uneven pattern formed on the surface of the adhesive sheet.

FIG. 14 is a perspective view showing an example of an uneven pattern formed on the surface of the adhesive sheet.

FIG. 15 is a perspective view showing an example of an uneven pattern formed on the surface of the adhesive sheet.

FIG. 16 is a perspective view showing a state in which a groove is formed on the surface of the adhesive sheet.

FIG. 17 is a sectional view taken along line X1-X2 in FIG. 16;

FIG. 18 is a perspective view showing a state in which a concave portion is formed in the adhesive sheet.

FIG. 19 is a perspective view showing a state in which a concave portion is formed in the adhesive sheet.

20 is a sectional view taken along line X3-X4 in FIG.

21 is a sectional view taken along line X5-X6 in FIG.

FIG. 22 is a diagram illustrating an example of a hot press apparatus for forming a concavo-convex pattern on an adhesive sheet.

FIG. 23 is a perspective view showing a state of an adhesive sheet on which an uneven pattern is formed.

24 is a sectional view taken along line X7-X8 in FIG.

FIG. 25 is a perspective view showing a state of an antenna substrate sheet in which a through hole for temporary fixing is formed.

FIG. 26 is a cross-sectional view showing, on an enlarged scale, an example of a state in which a protrusion of an adhesive sheet and a through hole of an antenna substrate are temporarily fixed.

FIG. 27 is a perspective view showing a state where sheet-size components are stacked.

FIG. 28 is an enlarged cross-sectional view showing a state in which convex portions and concave portions formed on the adhesive sheet are fitted together through through holes formed in the antenna substrate.

FIG. 29 is a diagram showing an example of a hot press device for bonding laminated structural members.

FIG. 30 is a cross-sectional view showing a configuration example of a conventional IC card.

[Explanation of symbols]

1 IC card, 2 antenna board, 3a, 3b
Adhesive sheet, 4a, 4b exterior material, 5 antenna circuit, 6 ACF conductive film, 7 IC chip, 8 adhesive material, 9 reinforcing plate, 10 groove, 11 dent, 40
Through-hole, 41 convex, 42 concave

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 2C005 MA14 MA19 MA21 MA40 NA09 NB27 PA03 PA04 PA15 PA19 PA21 PA25 PA26 PA27 PA29 RA04 RA06 5B035 AA04 BA04 BA05 BB09 CA23

Claims (21)

[Claims] An IC card in which an antenna substrate having an IC chip and an antenna circuit mounted thereon is sandwiched between at least a pair of films, wherein at least one or more through holes are formed in the substrate. In the pair of films, a concave portion and a convex portion are respectively formed on a surface facing the antenna substrate, and the concave portion and the convex portion are formed through a through hole formed in the substrate. An IC card, wherein the antenna substrate is fixed to the pair of films by fitting. 2. The IC card according to claim 1, wherein the antenna substrate is fixed to the film at the portion of the through hole. 3. The IC card according to claim 1, wherein an uneven pattern for degassing is formed on at least a surface of the pair of films facing the antenna substrate. 4. The antenna substrate according to claim 1, wherein the antenna substrate is sandwiched between a pair of exterior films via a pair of adhesive films, and as the film, an uneven pattern is formed on both surfaces of the adhesive film. Item 3. The IC card according to Item 3. 5. The IC card according to claim 3, wherein the concave / convex pattern is formed so as to be substantially orthogonal to the antenna circuit. 6. The method according to claim 3, wherein the uneven pattern is a ground pattern formed on a surface of the film.
The described IC card. 7. The IC according to claim 3, wherein said concave / convex pattern is a groove formed in a stripe shape.
card. 8. The IC card according to claim 7, wherein the grooves are formed on both sides of the film, and are formed so as to be alternated on both sides. 9. The IC card according to claim 7, wherein the groove is formed so as to be inclined so that the depth gradually increases from the inside to the outside. 10. The IC card according to claim 1, wherein a recess is formed in a portion of the film corresponding to the IC chip. 11. The IC card according to claim 10, wherein the recess is formed in a conical shape such that the depth gradually increases from the inside to the outside. 12. A method for manufacturing an IC card comprising an antenna substrate sandwiched between at least a pair of films, wherein the antenna substrate is manufactured by mounting an IC chip and an antenna circuit on a substrate having a through hole. A manufacturing process, an inspection is performed on the antenna substrate manufactured in the antenna substrate manufacturing process, the defective antenna substrate is removed, and only a non-defective antenna substrate is selected and taken out. Forming a concave and convex portion on each of the films at least on the surface facing the antenna substrate, and forming the concave and convex portions, and combining the antenna substrate selected in the selecting step with the through hole and the convex portion. And mounting the antenna substrate mounted on the film to the film at the portion of the through hole. A temporary fixing step, and a sealing step of sandwiching and sealing the antenna substrate with the other film. In the sealing step, the concave portions and the convex portions respectively formed on the pair of films are formed as described above. A method for manufacturing an IC card, wherein the antenna substrate is fixed to the pair of films by fitting through a through hole formed in the antenna substrate. 13. In the step of forming a concavo-convex pattern,
At least a surface of the pair of films opposed to the antenna substrate is formed with a concavo-convex pattern for deaeration. In the sealing step, air remaining between the antenna substrate and the film is formed on the film. 13. The gas is discharged to the outside through the concave and convex pattern.
The manufacturing method of the described IC card. 14. An uneven pattern for deaeration is formed on both surfaces of a pair of adhesive films as the film in the uneven portion forming step, and the uneven pattern is formed on both surfaces in the sealing step. Through a pair of adhesive films
14. The method for manufacturing an IC card according to claim 13, wherein the sealing is performed by sandwiching between a pair of exterior films. 15. The method for manufacturing an IC card according to claim 13, wherein, in the step of forming an uneven portion, the uneven pattern is formed so as to be substantially orthogonal to the antenna circuit. 16. The method for manufacturing an IC card according to claim 13, wherein in the step of forming the uneven portion, the uneven pattern is a ground pattern formed on a surface of the film. 17. The method for manufacturing an IC card according to claim 13, wherein in the step of forming the uneven portion, the uneven pattern is a groove formed in a stripe shape. 18. The method for manufacturing an IC card according to claim 17, wherein, in the step of forming the concave and convex portions, the grooves are formed on both surfaces of the film so that the grooves are alternately formed on both surfaces. 19. The method according to claim 17, wherein in the step of forming the concave and convex portions, the groove is formed so as to be inclined so that the depth gradually increases from the inside to the outside.
The manufacturing method of the described IC card. 20. The method for manufacturing an IC card according to claim 12, wherein in the step of forming the concave and convex portions, a recess is formed in a portion of the film corresponding to the IC chip. 21. The IC card according to claim 20, wherein in the concave / convex portion forming step, the concave portion is formed in a conical shape so that the depth gradually increases from the inside to the outside. Production method.