JP2004110141A - Rf-id media and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the possibility of an IC module being separated from a base material when external force is applied to RF-ID media in a bending direction, without increasing the thickness of the RF-ID media, causing no increase in cost. <P>SOLUTION: The RF-ID media has at least an inlet 10 formed by bonding the IC module 11 capable of writing and reading information in a non-contact state, onto a resin sheet 15 by an adhesive 16 supplied onto the resin sheet 15. In this case, a plurality of recessed parts 17 are formed in a region, to which the adhesive 16 is supplied, of the resin sheet 15. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an RF-ID medium capable of writing and reading information in a non-contact state, and a method for manufacturing the same.
[0002]
[Prior art]
In recent years, with the progress of the information society, information is recorded on a card, and information management, settlement, and the like using the card are performed.
[0003]
Cards used for such information management and settlement include IC cards with built-in IC chips and magnetic cards on which information is written by magnetism. Information can be written and read using a dedicated device. Is
[0004]
Further, in the IC card, a contact type IC card which performs writing and reading of information by contacting with a dedicated device, and a non-contact type IC which can perform writing and reading of information only by approaching the dedicated device. There is a card. These IC cards have higher security and a larger amount of writable information than magnetic cards, and one card can be used for a variety of purposes, so that its popularity in the market is ever increasing. . Among them, a non-contact type IC card is convenient for handling because it is not necessary to take out the card and insert it into a dedicated device when writing or reading information. The device for reading the information is rapidly spreading.
[0005]
6A and 6B are diagrams showing an example of the structure of a conventional non-contact type IC card, wherein FIG. 6A is a diagram showing an internal structure, and FIG. 6B is a sectional view.
[0006]
As shown in FIG. 6, the non-contact type IC card according to this conventional example has an IC module 111 capable of externally writing and reading information on a resin sheet 115 and a connection terminal 114 of the IC module 111. Is supplied to the IC module 111 through electromagnetic induction from an externally provided information writing / reading device (not shown) to write and read information to and from the IC module 111. The inlet 110 in which the conductive antenna 112 for performing the contact state is formed is laminated and sandwiched between the core materials 120a and 120b and the topsheets 130a and 130b. The IC module 111 is bonded to the resin sheet 115 by an adhesive 116 in a state where the IC module 111 is connected to the antenna 112 by the connection terminal 114.
[0007]
In the non-contact type IC card configured as described above, the antenna 112 is connected to the IC module 111 by electromagnetic induction from the information writing / reading device by approaching the information writing / reading device provided outside. An electric current is supplied, whereby information is written from the information writing / reading device to the IC module 111 in the non-contact state, or information written to the IC module 111 is read by the information writing / reading device. Or
[0008]
Hereinafter, a method for manufacturing the above-mentioned non-contact type IC card will be described.
[0009]
FIG. 7 is a view for explaining a method of manufacturing the non-contact type IC card shown in FIG.
[0010]
First, the coil-shaped antenna 112 is formed on the resin sheet 115 by etching, vapor deposition, silk printing, or the like (FIG. 7A).
[0011]
Next, an adhesive 116 is dropped on a region of the resin sheet 115 where the IC module 111 is mounted by a method such as a potting method using a dispenser or a silk screen printing method (FIG. 7B).
[0012]
Next, the IC module 111 is mounted on the area of the resin sheet 115 where the adhesive 116 has been dropped, and the connection terminals 114 of the IC module 111 and the antenna 112 are connected. , Heat is applied thereto, thereby bonding the IC module 111 and the resin sheet 115 with the adhesive 116 to complete the inlet 110 (FIG. 7C). Here, as the adhesive 116, a thermosetting resin that is cured by applying heat, an ultraviolet curable resin that is cured by irradiating ultraviolet rays, or the like is used. When a thermosetting resin is used as the adhesive 116, heat is applied while applying pressure to the IC module 111, thereby curing the adhesive 116 and using an ultraviolet curable resin as the adhesive 116. Irradiates ultraviolet rays while applying pressure to the IC module 111, thereby curing the adhesive 116.
[0013]
Thereafter, the core members 120a, 120b and the topsheets 130a, 130b are laminated so as to sandwich the inlet 110, and these are pressed by heat to complete a non-contact type IC card (FIG. 7D). In addition, the inlet 110, the core members 120a, 120b, and the topsheets 130a, 130b are not limited to the case where they are pressure-bonded by heat as described above, but may be between the inlet 110 and the core members 120a, 120b, and the core member 120a. , 120b and the topsheets 130a, 130b may be provided with an adhesive layer, and the adhesive may be used for bonding.
[0014]
Here, in the non-contact type IC card as described above, since it is almost always carried and used, there is a high possibility that an external force will be applied in the direction in which the IC card is bent. From the resin sheet 115 and the IC module 111 and the antenna 112 may be disconnected. Although the resin sheet 115 is subjected to an easy-adhesion treatment in order to increase the adhesive strength, it has excellent surface flatness. Therefore, when the compatibility between the adhesive 116 and the resin sheet 115 is not good, as described above. Troubles are likely to occur. For this reason, an adhesive having a high adhesiveness to the resin sheet 115 must be used as the adhesive 116, which takes time and increases the cost in some cases.
[0015]
Therefore, the IC module 111 shown in FIG. 6 is mounted on the resin sheet 115 via an elastic material, so that when an external force is applied to the non-contact type IC card in a bending direction, the IC module 111 It has been considered to reduce the possibility that 111 will peel off from the resin sheet 115.
[0016]
8A and 8B are diagrams showing another example of the structure of the conventional non-contact type IC card, wherein FIG. 8A is a diagram showing the internal structure, and FIG. 8B is a sectional view.
[0017]
As shown in FIG. 8, the non-contact type IC card in this conventional example has an IC module 211 that can write and read information from the outside mounted on a resin sheet 215 via an elastic material 217. It is connected to the IC module 211 via the connection terminal 214 of the IC module 211 and the elastic material 217, and supplies a current to the IC module 211 by electromagnetic induction from an information writing / reading device (not shown) provided outside. The inlet 210 in which the conductive antenna 212 for writing and reading information to and from the IC module 211 in a non-contact state is formed so that the inlet 210 is sandwiched between the core materials 220a and 220b and the top sheets 230a and 230b. It is configured to be laminated. The IC module 211 is bonded to the resin sheet 215 by an adhesive 216 in a state where the IC module 211 is connected to the antenna 212 via the connection terminal 214 and the elastic material 217.
[0018]
In the non-contact type IC card configured as described above, when an external force is applied to the non-contact type IC card in a bending direction, the external force is absorbed by the elastic material 217, and thereby the IC module The possibility that the 211 is peeled off from the resin sheet 215 is reduced (for example, see Patent Document 1).
[0019]
In addition, a through-hole is formed in the resin sheet, and the adhesive is sucked from the side opposite to the surface of the through-hole on which the adhesive is applied, so that the adhesive flows into the through-hole and is bonded. A technique for increasing the adhesive strength between the agent and the IC module has also been considered (for example, see Patent Document 2).
[0020]
[Patent Document 1]
JP 2000-200331 A [Patent Document 2]
Japanese Patent Application Laid-Open No. 7-228084
[Problems to be solved by the invention]
However, in the conventional non-contact type IC card as described above, there is a problem that the thickness of the non-contact type IC card is increased by the amount of the elastic material and the cost is increased.
[0022]
Here, in addition to a non-contact type IC card, a non-contact type IC tag, a non-contact type IC label, or a non-contact type IC module is incorporated as a recording medium on which information can be written and read in a non-contact state. Postcards and the like are mentioned, but it is preferable that these are as thin as possible, and it is necessary to avoid thickening as much as possible.
[0023]
Further, a through hole is formed in the resin sheet, and the adhesive is sucked from the side opposite to the surface on which the adhesive of the through hole is applied, whereby the adhesive flows into the through hole, and the adhesive and the IC In the case of enhancing the adhesive strength to the module, it is necessary to leave a sufficient amount of adhesive on the surface on which the IC module is mounted, while securely sucking the adhesive into the through hole, while adhering the IC module. Therefore, it is necessary to finely adjust the suction force, and there is a problem that labor and cost increase for the adjustment.
[0024]
The present invention has been made in view of the above-mentioned problems of the conventional technology, and has been made without increasing the thickness of the RF-ID medium and without increasing the cost. An object of the present invention is to provide an RF-ID medium and a method for manufacturing the same, which can reduce the possibility that the IC module will peel off from the base material when an external force is applied to the ID medium in a direction in which the medium is bent. I do.
[0025]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides
An antenna having conductivity is formed on a base material, and an IC module capable of writing and reading information in a non-contact state via the antenna is provided on the base material by bonding means. In an RF-ID medium having at least an inlet configured to be adhered to the base material in a state of being electrically connected to the antenna,
The base substrate has a plurality of recesses in a region where the bonding unit is supplied.
[0026]
Further, the recess is formed so as to avoid the antenna and has a groove shape.
[0027]
Further, the recess is formed so as to avoid the antenna and has a hole shape.
[0028]
Further, the concave portion is formed so that a depth direction is oblique to a surface of the base substrate.
[0029]
Further, the recess is formed so as to penetrate the base substrate.
[0030]
Also, the method for manufacturing the RF-ID media,
Forming the antenna on the base substrate,
Forming the concave portion so as to avoid the antenna in an area on the base material where the bonding means is supplied,
Supplying the bonding means to an area of the base material on which the IC module is mounted;
A step of mounting the IC module in an area on the base substrate to which the bonding unit is supplied, and electrically connecting the IC module and the antenna;
And a step of bonding the IC module and the base substrate by the bonding means.
[0031]
Further, the recess is formed by irradiating a laser beam.
[0032]
(Action)
In the present invention configured as described above, the IC module capable of writing and reading information in a non-contact state is configured to be bonded to the base substrate by the bonding unit supplied on the base substrate. In the RF-ID media having at least the inlet, the plurality of recesses are formed in the region of the base material to which the bonding means are supplied, so that the bonding means supplied on the base material is , The contact area between the bonding means and the base material is increased, and a wedge effect is generated between the bonding means and the base material. As a result, the adhesive force between the bonding means and the base material is increased, so that the thickness of the non-contact type IC card is not increased, and the cost is not increased. In addition, when an external force is applied in the direction in which the IC module is bent, the possibility that the IC module is peeled off from the base substrate together with the bonding means is reduced.
[0033]
In addition, when the concave portion is formed in a groove shape, bubbles generated between the bonding means and the base material can easily escape along the groove.
[0034]
Further, when the concave portion is formed so that its depth direction is oblique to the surface of the base material, when an external force is applied to the RF-ID medium in a direction in which the RF-ID medium is bent, The resistance of the bonding means to the force of peeling off from the base substrate is increased, thereby making it more difficult for the IC module to peel off from the base substrate.
[0035]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0036]
FIG. 1 is a view showing an example of the structure of a non-contact type IC card which is an embodiment of the RF-ID medium of the present invention, (a) showing an internal structure, and (b) a sectional view. FIG. 3C is a partially enlarged view of a region where the IC module 11 is mounted.
[0037]
In this embodiment, as shown in FIG. 1, an IC module 11 capable of externally writing and reading information is mounted on a resin sheet 15 serving as a base material, and is connected to a connection terminal 14 of the IC module 11. A current is supplied to the IC module 11 by electromagnetic induction from an external information writing / reading device (not shown) connected to the IC module 11 to write and read information to and from the IC module 11 in a non-contact state. Is formed by laminating an inlet 10 having a conductive antenna 12 to be sandwiched between core materials 20a and 20b and top sheets 30a and 30b. The IC module 11 is bonded to the resin sheet 15 with an adhesive 16 while being connected to the antenna 12 via the connection terminal 14. Further, in a region of the resin sheet 15 to which the adhesive 16 is supplied, a plurality of fine concave portions 17 formed by irradiating a laser beam are provided.
[0038]
In the non-contact type IC card configured as described above, the antenna 12 is moved from the antenna 12 to the IC module 11 by electromagnetic induction from the information writing / reading device by approaching the information writing / reading device provided outside. An electric current is supplied, whereby information is written to the IC module 11 from the information writing / reading device in the non-contact state, or information written to the IC module 11 is read by the information writing / reading device. Or
[0039]
Hereinafter, a method for manufacturing the above-mentioned non-contact type IC card will be described.
[0040]
FIG. 2 is a diagram for explaining a method of manufacturing the non-contact type IC card shown in FIG.
[0041]
First, the coil-shaped antenna 12 is formed on the resin sheet 15 by etching, vapor deposition, silk printing, or the like (FIG. 2A).
[0042]
Next, in a region where the adhesive 16 is supplied on the resin sheet 15, a laser beam is irradiated so as to avoid the antenna 12, thereby forming a plurality of concave portions 17 (FIG. 2B).
[0043]
Next, an adhesive 16 is dropped onto a region of the resin sheet 15 where the IC module 11 is to be mounted by a method such as a potting method using a dispenser or a silk screen printing method (FIG. 2C). At this time, the adhesive 16 dropped on the resin sheet 15 enters the inside of the concave portion 17 formed on the resin sheet 15.
[0044]
Next, the IC module 11 is mounted on the area of the resin sheet 15 where the adhesive 16 has been dropped, and the connection terminals 14 of the IC module 11 and the antenna 12 are connected. Is applied while applying heat, thereby bonding the IC module 11 and the resin sheet 15 to complete the inlet 10 (FIG. 2D). Here, as the adhesive 16, a thermosetting resin that is cured by applying heat, an ultraviolet curable resin that is cured by irradiating ultraviolet rays, or the like is used. When a thermosetting resin is used as the adhesive 16, heat is applied while applying pressure to the IC module 11, whereby the adhesive 16 is cured, and when an ultraviolet curable resin is used as the adhesive 16. Irradiates ultraviolet rays while applying pressure to the IC module 11, thereby curing the adhesive 16.
[0045]
Thereafter, the core members 20a and 20b and the surface sheets 30a and 30b are laminated so as to sandwich the inlet 10 as shown in FIG. 2D, and these are pressed by heat to complete a non-contact type IC card. (FIG. 2 (e)). In addition, the inlet 10, the core members 20a, 20b, and the topsheets 30a, 30b are not limited to the case where they are pressure-bonded by heat as described above, but may be between the inlet 10 and the core members 20a, 20b, and the core member 20a. , 20b and the topsheets 30a, 30b may be provided and bonded by this adhesive layer.
[0046]
In the non-contact type IC card manufactured by the above-described process, a plurality of recesses 17 are formed on the resin sheet 15 on which the IC module 11 is mounted, and the IC module 11 and the resin sheet 15 are formed in the recesses 17. Since the adhesive 16 for adhering the adhesive 16 has entered, the contact area between the adhesive 16 and the resin sheet 15 increases, and a wedge effect occurs between the adhesive 16 and the resin sheet 15, whereby the adhesive 16 And the resin sheet 15 increase in adhesive strength. As a result, the contactless IC card can be bent without increasing the thickness of the contactless IC card and without increasing the cost by limiting the type of the adhesive 16. When external force is applied in the direction, the possibility that the IC module 11 peels off from the resin sheet 15 together with the adhesive 16 can be reduced.
[0047]
Hereinafter, the shape of the concave portion 17 formed on the resin sheet 15 and the effect thereof will be described.
[0048]
3A and 3B are diagrams for explaining an example of the shape of the concave portion 17 shown in FIG. 1, wherein FIG. 3A is a diagram of the resin sheet 15 viewed from the surface, and FIG. 3B is a cross-sectional diagram.
[0049]
As shown in FIG. 3A, the concave portion 17 in this example is formed in a groove shape along the antenna 12 in a region where the adhesive 16 is supplied on the resin sheet 15. Further, since the concave portion 17 in this example is formed by irradiating a laser beam from an oblique direction so as to have a predetermined angle with respect to the surface of the resin sheet 15, as shown in FIG. The depth direction is formed so as to be inclined at a predetermined angle with respect to the surface of the resin sheet 15.
[0050]
In the non-contact type IC card in which the recess 17 is formed as shown in FIG. 3, the recess 17 is formed so as to be inclined at a predetermined angle with respect to the surface of the resin sheet 15. When an external force is applied to the contact-type IC card in a direction in which the IC module 11 is bent, the resistance to the force that the adhesive 16 tends to peel off from the resin sheet 15 increases. From the surface.
[0051]
Further, since the concave portion 17 is formed in a groove shape, bubbles generated between the adhesive 16 and the resin sheet 15 when the IC module 11 is mounted after the adhesive 16 is supplied to the resin sheet 15 are formed in the groove. It is easy to miss along.
[0052]
4A and 4B are diagrams for explaining another example of the shape of the concave portion 17 shown in FIG. 1, wherein FIG. 4A is a diagram of the resin sheet 15 viewed from the surface, and FIG. 4B is a cross-sectional diagram.
[0053]
As shown in FIG. 4A, the concave portion 17 in this example is formed in a plurality of holes so as to avoid the antenna 12 in a region where the adhesive 16 is supplied on the resin sheet 15. Further, the concave portion 17 in the present example is formed so as to penetrate the resin sheet 15 as shown in FIG. In this case, when the adhesive 16 enters the recess 17, the viscosity of the adhesive 16 and the hole diameter of the recess 17 prevent the adhesive 16 entering the recess 17 from flowing out from the other surface of the resin sheet 15. And must be set.
[0054]
FIG. 5 is a view for explaining another example of the shape of the concave portion 17 shown in FIG.
[0055]
As shown in FIG. 5, the concave portion 17 in this example is formed in a groove shape in a region where the adhesive 16 is supplied on the resin sheet 15, avoiding the antenna 12 and in a region corresponding to an edge of the adhesive 16. .
[0056]
In the non-contact type IC card in which the concave portion 17 is formed as shown in FIG. 5, since the concave portion 17 is formed in the region corresponding to the edge of the adhesive 16, the adhesive 16 and the resin The sheet 15 is firmly adhered to the non-contact type IC card, so that when an external force is applied to the non-contact type IC card in a bending direction, the IC module 11 is hardly peeled off from the resin sheet 15. it can.
[0057]
It is also possible to combine the shapes of the concave portions 17 shown in FIGS. For example, a groove-shaped recess 17 as shown in FIG. 3A may be formed so as to penetrate the resin sheet 15 as shown in FIG. 4B, or a plurality of grooves 17 as shown in FIG. It is conceivable to form the hole-shaped recess 17 such that its depth direction is oblique as shown in FIG. Further, as shown in FIG. 4B, a concave portion 17 penetrating the resin sheet 15 may be formed so that its depth direction is oblique as shown in FIG. 3B. It is also conceivable to form a combination of the groove shape shown in FIG. 3 and the hole shape shown in FIG.
[0058]
If the area of the recess 17 formed on the resin sheet 15 is too large, when the core material 20a and the top sheet 30a are laminated, the recess 17 is formed in the region of the surface of the top sheet 30a where the recess 17 is formed. Therefore, a groove shape as shown in FIG. 3 or FIG. 5 or a hole shape as shown in FIG. 4 is preferable.
[0059]
In this embodiment, a non-contact IC card capable of writing and reading information in a non-contact state as an RF-ID medium has been described as an example, but a non-contact IC tag and a non-contact IC label are described. Etc. can also apply the present invention.
[0060]
【The invention's effect】
As described above, in the present invention, an IC module in which a conductive antenna is formed on a base substrate and in which information can be written and read in a non-contact state via the antenna is provided. In an RF-ID medium having at least an inlet configured to be adhered to a base material in a state where the base material is electrically connected to the antenna by a bonding means supplied on the material, the base material may be bonded to the antenna. Is provided with a plurality of recesses in the area where the base material is supplied, so that the bonding means supplied on the base material enters the recesses of the base material, thereby increasing the adhesive force between the bonding means and the base material. Without bending the RF-ID media without increasing the thickness of the non-contact type IC card and without increasing the cost. IC module can be reduced possibly be peeled from the base material together with the adhesive means when an external force is applied to that direction.
[0061]
In the case where the concave portion is formed in a groove shape, air bubbles generated between the bonding means and the base material can be easily escaped along the groove.
[0062]
Further, in the case where the concave portion is formed so that its depth direction is oblique to the surface of the base material, when an external force is applied to the RF-ID medium in a direction in which the medium is bent. In addition, the resistance of the bonding means to the force of peeling off from the base material is increased, thereby further preventing the IC module from being peeled off from the base material.
[Brief description of the drawings]
FIG. 1 is a diagram showing an example of the structure of a non-contact type IC card which is an embodiment of the RF-ID medium of the present invention, (a) showing an internal structure, and (b) a sectional view. FIG. 2C is a partially enlarged view of an area where an IC module is mounted.
FIG. 2 is a view for explaining a method of manufacturing the non-contact type IC card shown in FIG.
3A and 3B are views for explaining an example of the shape of a concave portion shown in FIG. 1, wherein FIG. 3A is a view of a resin sheet viewed from the surface, and FIG. 3B is a cross-sectional view.
4A and 4B are views for explaining another example of the shape of the concave portion shown in FIG. 1, wherein FIG. 4A is a view of the resin sheet viewed from the surface, and FIG. 4B is a cross-sectional view.
FIG. 5 is a view for explaining another example of the shape of the recess shown in FIG. 1;
6A and 6B are diagrams showing an example of the structure of a conventional non-contact type IC card, wherein FIG. 6A is a diagram showing an internal structure, and FIG. 6B is a sectional view.
FIG. 7 is a diagram for explaining a method of manufacturing the non-contact type IC card shown in FIG.
8A and 8B are diagrams showing another example of the structure of a conventional non-contact type IC card, wherein FIG. 8A is a diagram showing an internal structure, and FIG. 8B is a sectional view.
[Explanation of symbols]
Reference Signs List 10 inlet 11 IC module 12 antenna 14 connection terminal 15 resin sheet 16 adhesive 17 recess 20a, 20b core material 30a, 30b top sheet

Claims (7)

An antenna having conductivity is formed on a base material, and an IC module capable of writing and reading information in a non-contact state via the antenna is provided on the base material by bonding means. In an RF-ID medium having at least an inlet configured to be adhered to the base material in a state of being electrically connected to the antenna,
The RF-ID medium, wherein the base material has a plurality of concave portions in a region where the bonding unit is supplied. The RF-ID medium according to claim 1,
The recess is formed in a groove shape so as to avoid the antenna and is formed in a groove shape. The RF-ID medium according to claim 1,
The recess is formed in a hole shape so as to avoid the antenna and is formed in a hole shape. The RF-ID medium according to any one of claims 1 to 3,
The concave portion is formed so that a depth direction is oblique to a surface of the base substrate. The RF-ID medium according to any one of claims 1 to 4,
The concave portion is formed so as to penetrate the base material. It is a manufacturing method of the RF-ID media as described in any one of Claims 1 thru | or 5, Comprising:
Forming the antenna on the base substrate,
Forming the concave portion so as to avoid the antenna in an area on the base material where the bonding means is supplied,
Supplying the bonding means to an area of the base material on which the IC module is mounted;
A step of mounting the IC module in an area on the base substrate to which the bonding unit is supplied, and electrically connecting the IC module and the antenna;
Bonding the IC module and the base substrate by the bonding unit. The method for manufacturing an RF-ID medium according to claim 6,
The method of manufacturing an RF-ID medium, wherein the recess is formed by irradiating a laser beam.

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