JP2002304613A - Non-contact type ic card and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact IC card whose surface can be made smooth and its manufacturing method. SOLUTION: This IC card is constituted by integrating an IC card substrate 2, IC card electronic circuit components 11 and 20 including an IC chip 11 mounted at least on one surface of the substrate 2, a 1st step buffer layer 4 which is formed on the other surface of the substrate 2 and has an opening at the part facing the IC chip 11 across the substrate 2, and protection layers 5 and 6 which are disposed outside the substrate 2 and 1st step buffer layer 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a non-contact type IC card having a built-in IC chip and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, IC cards equipped with semiconductor elements (IC chips) for recording and processing data have become widespread from the viewpoint of efficiency of information processing and security. Such IC cards include, for example, toll tickets, prepaid cards, tickets, admission tickets, ID cards, game cards, point cards, bank cards, credit cards,
Used as a telephone card, boarding pass, etc.

[0003] The IC card includes a contact type IC card for transmitting and receiving data by connecting an external terminal of the card and a terminal of an external processing device, an antenna coil for transmitting and receiving data by electromagnetic waves, and a semiconductor for data processing. Built-in element,
Reading and writing to and from an external processing device can be realized by a so-called wireless method, a driving power of an IC circuit is supplied by electromagnetic induction, and a non-contact type IC card (non-contact type IC card) without a built-in battery has been developed. I have.

The non-contact type IC card generally includes a resin substrate, a metal antenna coil provided on the resin substrate, and an IC chip connected to the antenna coil.

[0005] When an electromagnetic wave is emitted from the reader to the non-contact type IC card, an induced voltage is generated in the antenna coil, and the IC chip is operated.

[0006]

However, in the conventional non-contact type IC card, when the IC card is formed by laminating, the surface of the card is not smooth and the IC
There is a problem that the thickness of the place where the chip or the IC module is built becomes thicker than the surrounding area.

[0007] If the thickness of the place where the IC chip is built is larger than the surrounding area, the position of the IC chip is easily specified, and there is a security problem.

In addition, since the surface of the card is not smooth, the inclination is large when the cards are piled up, so that there is a problem that a conveyance failure easily occurs at the time of issuing a ticket or the like.

Further, unevenness in the thickness of the card may cause poor printing after the card is formed, and a non-contact type IC card determined as good in the communication characteristic test may be defective due to a printing error. However, there is a problem that an expensive internal IC chip is wasted.

As a method for solving the above problem, the present applicant has filed Japanese Patent Application No. 2000-065 filed in 2000.
No. 445 provides a non-contact data carrier in which a buffer layer for protecting an IC chip is provided on an antenna coil.

The present invention provides a further improvement of the above-mentioned invention, and accordingly, the present invention aims to provide a non-contact type IC card capable of smoothing the surface of the card and a method of manufacturing the same. And

[0012]

In order to achieve the above object, a non-contact type IC card according to the present invention comprises an IC card substrate and an IC mounted on at least one surface of the substrate.
An electronic circuit component for an IC card including a chip, a first step reduction layer formed on the other surface of the substrate and having an opening in a portion facing the IC chip with the substrate interposed therebetween;
The substrate and a protective layer located outside the first step relaxation layer are integrally formed.

Preferably, the semiconductor device further includes a second step reduction layer formed on one surface of the substrate and having an opening for accommodating the IC chip in a portion corresponding to the IC chip.

For example, the first step relief layer is formed of an adhesive sheet. Further, for example, the second step relaxation layer is formed of an adhesive sheet.

According to the non-contact type IC card of the present invention, at least one surface of the IC card substrate has
An electronic circuit component for an IC card including a C chip is mounted, and a first step reduction layer having an opening in a portion opposed to the IC chip with the substrate interposed is provided on the other surface of the substrate for the IC card. Because of this, the thickness of the card at the IC chip mounting portion can be reduced, the IC chip mounting portion does not protrude from the IC card surface, and the card surface can be smoothed.

Further, in order to achieve the above object, a method for manufacturing a non-contact type IC card according to the present invention comprises mounting an IC card electronic circuit component including an IC chip on at least one surface of an IC card substrate. And a step of stacking, on the other surface of the substrate, a first step reduction layer having an opening at a portion facing the IC chip with the substrate interposed therebetween,
A step of laminating a protective layer on the outside of the substrate and the first step reduction layer, and forming a laminate of the substrate, the first step reduction layer, and the protection layer; And a configuring step.

Preferably, the method further includes a step of laminating a second step reduction layer having an opening for accommodating the IC chip in a portion corresponding to the IC chip on one surface of the substrate.

For example, an adhesive sheet having the opening is laminated as the first step relief layer. Also, for example,
An adhesive sheet having the opening is laminated as the second step reduction layer.

According to the method of manufacturing a non-contact type IC card of the present invention, an IC card electronic circuit component including an IC chip is mounted on at least one surface of the IC card substrate, and the IC card substrate is mounted on the IC card substrate. On the other surface, the first step reducing layer having an opening at a portion facing the IC chip with the substrate interposed therebetween is laminated and laminated, so that the IC chip fits into the opening together with the IC card substrate. ,
Since the thickness of the card at the IC chip mounting portion can be reduced, the IC chip mounting portion does not protrude from the IC card surface, and the surface of the card can be smoothed.

[0020]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

[0021] First Embodiment FIG. 1 (a), which shows a block diagram of a contactless IC card according to this embodiment, FIG. 1 (b), A-A in FIG. 1 (a) ' It is sectional drawing in a line.

As shown in FIGS. 1 (a) and 1 (b), the IC card 1 according to the present embodiment has a five-layer laminate structure, and a core sheet is provided on both sides of a center sheet 2 with adhesive sheets 3 and 4 interposed therebetween. Sheets 5 and 6 are stacked. The size of the IC card 1 only needs to satisfy the international standard of the non-contact type IC card.
The width may be 85.6 mm and the thickness may be within a range of 0.76 mm ± 10%.

The center sheet 2 is made of, for example, acrylonitrile-butadiene-styrene copolymer (ABS), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), acrylic resin, polycarbonate (PC), amorphous polyester resin (for example, , Manufactured by Eastman Kodak Company, Inc., "PET-G"), polyvinyl chloride (PVC), polypropylene (PP), and other plastic materials.

FIG. 2 is a plan view of the center sheet 2.
On the surface of the center sheet 2, a loop-shaped antenna coil 20 composed of a wiring 21 and a bridge wire 22 is formed.
Is attached to the intersection of the antenna coils 20, and an insulating layer 23 for insulating between the intersecting wiring 21 and the bridge wire 22.
Are formed. The IC chip 11 has a built-in CPU, memory and the like for performing signal processing, and has a thickness of, for example, about 300 μm.

FIG. 3 is a sectional view taken along the line BB 'of FIG. As shown in FIG. 3, connection terminals 11 a and 11 b are provided on the IC chip 11, and the connection terminals 21 a and 21 of the antenna coil 20 formed on the center sheet 2 are provided.
b and the anisotropic conductive film 24, the IC chip 11
And the antenna coil 20 are electrically connected. The IC chip 11 is formed by connecting a substrate on which an IC circuit using a semiconductor element or the like and other electronic components are mounted to a connection terminal 11.
An IC module configured by resin molding so that a and 11b are exposed may be used. Hereinafter, the IC chip 11 includes an IC module.

The adhesive sheet 4 is provided with an IC chip hole 4a on the back surface of the center sheet 2 provided with the IC chip 11 in order to reduce a step on the card surface due to the thickness of the IC chip 11. Hole 4 for the IC chip
“a” is formed to be slightly larger than the area of the IC chip 11 in consideration of the fact that the adhesive sheet flows at the time of subsequent pressing. The adhesive sheets 3 and 4 are made of, for example, a sheet mainly composed of a polyester resin, an epoxy resin, or the like, and the thickness thereof is not particularly limited as long as it satisfies the above-mentioned international standard after forming the card. For example, in order to reduce a step due to the thickness of the IC chip,
It can be about 00 μm.

The core sheets 5 and 6 can be made of the same material as the center sheet, for example, acrylonitrile-butadiene-styrene copolymer (ABS), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), acrylic Resin, polycarbonate (P
C), an amorphous polyester resin (for example, “PET-G” manufactured by Eastman Kodak Co., Ltd.), a plastic material such as polyvinyl chloride (PVC) and polypropylene (PP). Although not shown, printing may be performed on the surfaces of the core sheets 5 and 6 which are outside the card.

Although not shown, an oversheet may be further laminated outside the core sheets 5 and 6. For example, as the oversheet, an amorphous polyester resin (for example, “PET-G” manufactured by Eastman Kodak Co., Ltd.), polyvinyl chloride (PVC), or the like can be used. When the non-contact type IC card also has a function as a magnetic card for magnetically recording data, a magnetic tape is transferred to the oversheet.

The center sheet 2, the adhesive sheet 3,
4. The core sheets 5 and 6 may all be the same sheet having the fusibility, for example, polyvinyl chloride, copolyester, or the like.

According to the non-contact type IC card according to the present embodiment, the adhesive sheet 4 is formed on the center sheet 2 on which the IC chip 11 is mounted in order to reduce a step on the card surface due to the thickness of the IC chip 11. Since the IC chip hole 4a is formed on the back surface, the thickness of the card on the IC chip mounting portion can be reduced, and the IC chip mounting portion does not protrude on the IC card surface, and the surface of the card does not protrude. Can be smoothed. Therefore,
Since the thickness of the IC chip mounting portion of the IC card is uniform with the surroundings, it is difficult to specify the position of the IC chip, and the reliability of the non-contact type IC card can be improved. In addition, since the in-plane uniformity of the thickness of the IC card can be improved, the inclination is small even when the cards are stacked, so that it is possible to prevent a defect in the card issuing machine and to handle the non-contact type IC card. Performance can be improved.

Next, the non-contact type I according to the above embodiment is described.
The method for manufacturing the C card will be described with reference to the flowchart shown in FIG.

First, on the surface of the center sheet 2 made of the above-described material, a conductive paste containing, for example, a polyester resin containing silver particles or silver powder as a conductive metal as a binder component is used as a conductive ink, and a screen is formed. The wiring 21 is formed together with the connection terminals 21a and 21b by printing.

Next, an insulating ink is screen-printed on a portion where a bridge line is to be formed later to form an insulating layer 23.

Next, the bridge line 22 is formed by screen printing of the above-mentioned conductive paste, and the bridge line 22 is formed.
And the wiring 21, and the bridge wire 22 and the wiring 21 are connected.
(Step S)
T1). Here, the material of the coil, the resistance value, the number of turns, and the like can be set in accordance with the specifications of the IC chip, the reader / writer, the communication distance, and the like.

Next, the anisotropic conductive film 24 is transferred to the connection terminals 21a and 21b at the ends of the antenna coil 20 so that the connection terminals 11a and 11b of the IC chip 11 are on the lower surface. The IC chip 11 is placed on the film 24 and pressed by heat from above to connect and fix the IC chip 11 to the antenna coil 20, and the IC chip 11 and the antenna coil 20 are electrically connected (step ST2).

The anisotropic conductive film 24 is, for example, a material obtained by dispersing and blending conductive fine particles in an adhesive. The film itself is insulative, but when the film is compressed, the conductive fine particles come into contact with each other to form a conductive film. Is manifested.
Therefore, the connection between the connection terminals and the bonding of the IC chip 11 can be performed simultaneously by sandwiching the anisotropic conductive film and applying pressure so that the connection terminals of the IC chip 11 and the antenna coil 20 face each other. Further, between the connection terminals 21a and 21b and between the connection terminals 11a and 1b.
1b can maintain insulation.

Next, adhesive sheets 3 and 4 made of the above-mentioned materials are prepared, and the IC sheet is formed on the adhesive sheet 4 formed on the back surface of the surface on which the IC chip is mounted, at a position corresponding to the mounting portion of the IC chip 11. A chip hole 4a is formed. As a method for forming the IC chip hole 4a, a punching process using a die, a counterbore process (NC), a laser process, or the like can be used.

Further, core sheets 5 and 6 made of the above-mentioned materials are prepared. Here, as described above, the materials and thicknesses of the center sheet 2, the adhesive sheets 3, 4, and the core sheets 5, 6 can be arbitrarily changed depending on the thickness of the IC chip. Since it is necessary to satisfy the international standard of the IC card, the thickness is within a range of 0.76 mm ± 10%, that is, 0.684 mm.
mm to 0.836 mm. In addition, it is preferable that the same material and the same thickness be used, since warpage hardly occurs when the card is formed.

Next, the center sheet 2 and the core sheets 5 and 6 are laminated via the adhesive sheets 3 and 4 and are temporarily bonded (step ST3). In this temporary bonding step, for example, an ultrasonic welder is used and the four corners of the laminated sheet are temporarily fused so that the laminated sheet does not shift.

Next, the laminated body of the center sheet 2, the adhesive sheets 3 and 4, and the core sheets 5 and 6 temporarily bonded is pressed together with heat by a press tool such as a press plate (not shown) to be laminated (step). ST4). In addition,
An oversheet made of the above-described material may be further laminated on the outside of the core sheets 5 and 6, and in this case, a magnetic stripe may be provided at a predetermined position on the oversheet.

Next, the above-mentioned non-contact type IC card base material is aligned with a punching blade, and the non-contact type IC card is formed by punching out the finished dimensions of the card, 54 mm long × 85.6 mm wide. Can be performed (step ST5). In the subsequent steps, the above non-contact type IC card is inspected for communication characteristics and the like, and only the IC card determined to be non-defective is subjected to sublimation transfer of a picture, a face photograph, and other necessary display items by a thermal head printer. Printing can be performed by a combination of printing, sublimation transfer printing, and heat transfer printing of hot-melt ink, or offset printing or silk printing. In addition, other functions such as hologram and emboss may be provided. The printing of the card may be performed on a surface such as a core sheet that is outside the card before lamination.

According to the method for manufacturing a non-contact type IC card according to the present embodiment, the adhesive sheet 4 having the IC chip holes 4a formed on the back surface of the center sheet 2 provided with the IC chips 11 is formed. Fig. 1
(B) As shown in FIG.
1 fits into the hole 4a for the IC chip together with the center sheet 2 therebelow, and the IC chip 11 can move to the center side of the card. No protrusion occurs, and the surface of the card can be smoothed. Accordingly, with the improvement of the in-plane uniformity of the thickness of the IC card, an IC card excellent in printability can be manufactured. Therefore, after forming the IC card, a communication characteristic test is performed, and only a good IC card is inspected. Printing can be performed, and waste of cost due to poor printing can be reduced.

Second Embodiment FIG. 5 shows a configuration diagram of a non-contact type IC card according to this embodiment. The non-contact type IC card 1 ′ shown in FIG. 5 has the same structure as that of the first embodiment, and also has an IC sheet
IC for alleviating steps caused by the thickness of chip 11
A chip hole 3a is provided. The other parts are the same as those described in the first embodiment.

In the method of manufacturing the non-contact type IC card 1 ', in addition to the manufacturing method described in the first embodiment, a hole 3a for an IC chip is previously punched in the adhesive sheet 3 using, for example, a die. It can be manufactured by forming by processing, counterboring (NC) or laser processing, and then laminating.

According to the non-contact type IC card and the method of manufacturing the same according to this embodiment, the adhesive sheet 3 laminated on the side of the center sheet 2 on which the IC chip 11 is mounted is also provided with
I for reducing a step caused by the thickness of the C chip 11
By providing the C-chip hole 3a, a step caused by the thickness of the IC chip can be more effectively reduced. Therefore, even when the IC chip 11 having a large thickness is mounted, the surface of the non-contact type IC card can be reduced. Can be smoothed. Thereby, the same effect as in the first embodiment can be obtained.

The non-contact type IC card of the present invention is not limited to the above embodiment. For example, in the present embodiment, a non-contact type IC card is described, but a contact type IC chip (or IC module) is used.
And a hybrid IC card further having In the present embodiment, the antenna coil 20 is formed by screen printing using a conductive ink. However, the present invention is not limited to this. For example, a metal foil such as a copper foil or an aluminum foil may be used as a center sheet. 2, a method of forming a pattern obtained by patterning by etching, a method of attaching a wire wound in a coil shape to the center sheet 2, a method of attaching a metal foil formed in an antenna shape, and the like. A method can also be used.

The IC card of the present invention includes a rectangular medium and a coin-shaped medium, and can be applied to various shapes. Further, for example, in the present embodiment, the connection between the IC chip and the antenna coil is performed via the anisotropic conductive film, but a connection method using wire bonding, a conductive paste, or the like may be employed. In addition, various changes can be made without departing from the spirit of the present invention.

[0048]

FIG. 6 is a block diagram showing a non-contact type IC card according to this embodiment. A copper antenna coil 20 is formed by etching on a center sheet 2 made of PET having a thickness of 25 μm, and an IC chip 1 having a thickness of 6 × 4 × 0.28 mm is formed on the antenna coil via an anisotropic conductive film.
IC chip 1
1 was installed.

Then, adhesive sheets 3 and 4 mainly made of polyester resin and having a thickness of 140 μm are prepared, and 6.2 mm × 4.2 mm are placed at positions overlapping the IC chips on the upper and lower adhesive sheets 3 and 4. IC chip holes 3a, 4
It is formed by opening a in a mold.

Further, the thickness of PET-G is 180
The oversheets 7 and 8 each having a thickness of 50 μm and including the core sheets 5 and 6 having a thickness of PET and PET-G are prepared. Here, the magnetic tape is transferred to the oversheet 7 on the front side of the card, and the core sheets 5 and 6 are printed on the front and back sides.

Each of the sheets 2 to 8 is temporarily attached after being stacked so that the position of the IC chip 11 does not deviate from the position of the IC chip holes 3a and 4a.
Press lamination was performed at 0 Kg / cm ² for 12 minutes, and after releasing by pressure bonding, an IC card was prepared by punching a sheet into a predetermined size.

In the above-mentioned non-contact type IC card, when the thickness is measured, both the position on the IC chip 11 and other positions on the card are 0.1 mm.
It was within the range of 78 mm ± 0.015 mm, and it was confirmed that the thickness unevenness in the plane of the card was extremely small. When a communication characteristic test was performed and printing was performed on a non-defective card, no phenomenon occurred such that the printed pattern was distorted in the peripheral portion of the IC chip or characters could not be read.

[0053]

According to the present invention, it is possible to provide an IC card which can make the surface of the card smooth and which has excellent reliability and handleability.

[Brief description of the drawings]

FIG. 1A is a non-contact type IC according to the present embodiment.
FIG. 1B is a configuration diagram of the card, and FIG.
It is sectional drawing in the -A 'line.

FIG. 2 is an enlarged plan view of the center sheet shown in FIG.

FIG. 3 is a sectional view taken along line B-B 'of FIG.

FIG. 4 is a flowchart for explaining a manufacturing process of the method for manufacturing a non-contact type IC card according to the embodiment.

FIG. 5 is a configuration diagram of a non-contact type IC card according to a second embodiment.

FIG. 6 is a configuration diagram of a non-contact type IC card in an embodiment.

[Explanation of symbols]

1, 1 '... non-contact type IC card, 2 ... center sheet,
3, 4 ... adhesive sheet, 3a, 4a ... hole for IC chip,
5, 6 ... core sheet, 7, 8 ... over sheet, 11 ...
IC chip, 11a, 11b connection terminal, 20 antenna coil, 21 wiring, 21a, 21b connection terminal, 2
2: bridge wire, 23: insulating layer, 24: anisotropic conductive film.

 ──────────────────────────────────────────────────の Continued on the front page F term (reference) 2C005 MA13 MA14 MB01 MB02 MB07 MB08 MB10 NA09 NA31 PA03 PA04 PA14 PA17 PA19 PA21 PA29 PA40 RA04 RA15 5B035 AA08 BA04 BA05 BB09 CA03 CA23

Claims (8)

[Claims] 1. An IC card substrate, an IC card electronic circuit component including an IC chip mounted on at least one surface of the substrate, and an IC card component formed on the other surface of the substrate and sandwiching the substrate A non-contact type IC card, comprising: a first step reduction layer having an opening in a portion facing the IC chip; and a protection layer located outside the substrate and the first step reduction layer. 2. The semiconductor device according to claim 1, wherein said substrate is formed on one surface of said substrate, and
The non-contact type IC card according to claim 1, further comprising a second step relief layer having an opening for accommodating the IC chip in a portion corresponding to the C chip. 3. The non-contact type IC card according to claim 1, wherein said first step relief layer is formed of an adhesive sheet. 4. The non-contact type IC card according to claim 2, wherein said second step relief layer is formed of an adhesive sheet. 5. A step of mounting an electronic circuit component for an IC card including an IC chip on at least one surface of an IC card substrate; and mounting the IC chip on the other surface of the substrate with the substrate interposed therebetween. Laminating a first step reduction layer having an opening in an opposing portion, laminating a protective layer outside the substrate and the first step reduction layer, and forming the substrate, the first step reduction layer, A method for manufacturing a non-contact type IC card, comprising: a step of forming a laminate of a protective layer; and a step of laminating the laminate to form an integral structure. 6. The method according to claim 5, further comprising the step of laminating, on one surface of the substrate, a second step reduction layer having an opening for accommodating the IC chip at a portion corresponding to the IC chip. A method for manufacturing a contact type IC card. 7. The method for manufacturing a non-contact type IC card according to claim 5, wherein an adhesive sheet having the opening is laminated as the first step relief layer. 8. The non-contact type I according to claim 6, wherein an adhesive sheet having the opening is laminated as the second step relief layer.
Manufacturing method of C card.