JPH0327982A - Laminate - Google Patents

Abstract

PURPOSE:To prevent the generation of difference in level on the surface of a laminate and to prevent the levitation of a protective layer even when the laminate is bent by providing an adhesive layer bonding the B-layer and C-layer of the laminate on the outside of the end part on the side including the projection-like body of the B-layer. CONSTITUTION:A laminate has fundamental constitution wherein a layer (A- layer) composed of a sheet-like material having a projection-like body, the spacer layer 3 (B-layer) provided so as to surround the projection-like body 2 of the A-layer and the protective layer 5 (C-layer) on the B-layer are laminated to a base material layer 1 through adhesive layers 4 in the order of A-layer/ B-layer/C-layer. Herein, it is necessary that the adhesive layer 4 bonding the B-layer and the C-layer is provided on the outside of the end part on the side including the projection-like body 2 of the B-layer 3. By this constitution, the difference in level generated at the part of the projection-like body 2 built in the laminate or at the boundary part of the spacer layer 3 and the projection- like body 2 can be eliminated and the laminate having a smooth surface prevented from the levitation of the protective layer 5 at the time of bending can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a laminate. For more details,
The present invention relates to a laminate including a sheet-like material layer having protrusions, a spacer layer surrounding the protrusions, and a protective layer.

[Prior art] In recent years, there have been many laminates such as the one shown in Figure 6, in which electronic components such as ICs, diodes, and batteries are mounted on printed circuit boards, such as IC cards and anti-theft labels, and are laminated with spacers. being developed.

Conventionally, such a laminate has been used in which a spacer is provided around a protruding object such as an IC, a diode, or a battery, and a protective base material is further laminated on the top and bottom of the laminate via an adhesive. .

[Problems to be Solved by the Invention] However, in the conventional laminate, when a protective layer is provided on the top of the spacer layer, the sixth layer is formed at the protrusion or the end of the spacer layer containing the protrusion. There was a problem that a difference in level as shown in the figure occurs. When such a step occurs on the surface of the laminate,
The type and shape of the protrusions built into the laminate may be easily identified from the outside, and printing on the laminate may be difficult. Furthermore, if the area of the protrusions increases or if a thin protective layer is provided to reduce the total thickness of the laminate, the above-mentioned step will become even larger, which will reduce the thickness of the laminate and the included protrusions. There was a limit to the size of things.

The present invention solves these problems, and even if the area of the protrusions becomes large or the thickness of the protective layer becomes thin, there will be no steps on the surface of the laminate, and the protective layer will not lift up even when bent. The purpose is to provide a laminate with no

[Means for Solving the Problems] The present invention provides a layer (A
A laminate having a laminate structure in which a spacer layer (layer B) surrounding the protrusion is provided on the layer), and a protective layer (layer C) is further provided on top of the B layer, the laminate comprising: The laminate is characterized in that an adhesive layer for bonding layer B and layer C is provided outside the end of layer B on the side that includes the protrusion.

The laminate of the present invention has a base material layer 1 as shown in FIG.
A layer (A layer) consisting of a sheet-like material having protrusions 2 on the surface, a spacer layer 3 (B layer) provided so as to surround the protrusions on the A layer, and a protective layer 5 on the top of the B layer ( The basic structure is that layer C) is laminated in the order of layer A/layer B/layer C with an adhesive layer 4 interposed therebetween.

In addition, the protrusions 2 refer to those that have a certain height and are partially present on the upper and/or lower part of the base material layer 1 of layer A, and their size, shape, and number. is not particularly limited. Further, the protrusion 2 may be integrated with the base material layer 1 of layer A, or may be bonded with adhesive, solder, or the like. Specific examples of such protrusions include plastics, paper, metals, composites thereof, electronic parts, and the like.

Further, the height of the protrusion is not particularly limited, but is 0.1
~3 mm is preferred.

Furthermore, the base material layer 1 of layer A is for supporting the above-mentioned protrusions, and is made of a plastic sheet such as a film, a paper or fibrous sheet, a metal foil, or a paper or fibrous sheet with epoxy or polyimide. Examples include those impregnated with resin such as polyester. Further, an electric circuit may be formed on at least one side of the base material layer using a metal film or a conductive paint. Further, the thickness of the base material layer of the A layer is not particularly limited, but is 10 μm to 300 μm.
A range of is preferred.

The spacer layer 3, which is the B layer of the present invention, is provided so as to surround the protrusions of the A layer as shown in FIG. It is used to protect protrusions from stress and other stresses. Further, the thickness of the spacer layer is equal to or greater than the height of the protrusion, and is usually the height of the protrusion plus 10
Preferably it is up to 0 μm. The spacer is usually made of a plastic film or sheet, paper, a fiber sheet, paper or fiber sheet impregnated with another resin, metal, or the like. Furthermore, the spacer layer may be processed to have electrical conductivity, air permeability, coloration, and the like. Further, the shape of the portion of the spacer into which the protrusion is inserted is not particularly limited, such as circular, square, or triangular. Further, it is not necessary to have the same shape as the protrusion. Further, the gap between the spacer layer and the protrusion is preferably within the range of 0.2 to 5 mm at the closest distance between the spacer layer and the protrusion in terms of laminating the spacer layer and processing the laminate of the present invention. Further, the spacer layer may be provided so as to surround each of the plurality of protrusions separately, as shown in FIG. 7, or may be provided so as to surround the plurality of protrusions collectively. .

Further, as shown in FIG. 8, several spacer layers may be provided to sandwich the protrusion without punching out the portion into which the protrusion is to be inserted.

Furthermore, the protective layer 5, which is the C layer of the laminate of the present invention, is a layer provided to cover the upper surfaces of the protrusions and the spacer layer, and to protect the protrusions. The thickness of the layer is not particularly limited, but is 30 μm to 300 μm.
A range of m is preferred.

Further, as the material, a plastic film or sheet, paper, fiber sheet, etc. are usually used. Further, the surface of the layer may be subjected to various processes such as printing, coating, vapor deposition, etc., or may be colored.

The laminate of the present invention has a basic structure in which the above-described layers A, B, and C are laminated in this order via an adhesive. That is, when the protrusions referred to in the present invention are present on both surfaces of layer A, the above laminated structure is taken on both surfaces centering on layer A. Also,
In this case, the laminated thickness, material, shape, etc. of both sides centering on layer A do not necessarily have to be the same.

Further, the adhesive used for the above-mentioned lamination is not particularly limited, but in view of the flexibility of the laminate, pressure-sensitive adhesives, rubber-based adhesives, etc. are preferable, and the coating thickness is preferably in the range of 5 to 50 μm.

Furthermore, in the laminate of the present invention, as shown in FIG.
It is necessary that the above-mentioned adhesive for bonding the layer and the C layer is provided outside the end of the B layer on the side that includes the protrusion. If the adhesive is applied continuously to the end or even to the top surface of the protrusion, when the C layer is laminated, a step will occur on the surface of the C layer, and the surface smoothness will be significantly lost. This is not desirable because it can cause damage. Here, the end of the B layer on the side that includes the protrusion refers to the side surface of the B layer facing the protrusion in the B layer provided so as to surround the protrusion as shown in FIG. This refers to the corner on the C layer side among the upper and lower corners of . Further, the term "outside the end" means the outside of the end when viewed from the protrusion as shown in FIG. 1, and does not include the end. Therefore, the adhesive layer provided between layer B and layer C is provided so as to surround the punched portion of layer B, as shown in FIG. 10, and at a certain distance from the end of the punched portion of layer B. There must be no adhesive layer present.

Here, when layer C is provided with an adhesive layer over its entire surface and laminated with layer B, a step is created on the surface of layer C at the boundary between layer B and the protrusions, as shown in FIG. Further, in a laminate in which the adhesive layer is provided up to the end of the B layer on the side that includes the protrusion, a level difference occurs at the end of the B layer.

Therefore, it is important to set the position of the adhesive between layer B and layer C as specified in the present invention in order to reduce the level difference.

Here, the distance from the end of layer B on the side containing the protrusion to the adhesive layer is not particularly limited, but is 0.3 to 7n+
The range is preferably +++, more preferably 0. 5～
It is 5 mm. If it is smaller than 0.3 mm, it will be close to the conventional product, and the effect of the present invention will be reduced.

On the other hand, if it is larger than 7 mm, it becomes difficult to stack.

It is preferable that the distance is within the above range because the smoothness of the surface of the laminate is further improved.

In addition, in the laminate of the present invention, when the surface of layer A having the protrusions is on one side, a protective layer 6 is further added to the side of the laminate that does not have the protrusions of layer A as shown in FIG. (D layer) can also be provided.

In this case, as shown in FIG. 2, the adhesive layer for bonding layer A and layer D is provided outside the end of layer B on the side containing the protrusions, so that the present invention This is preferable because the effects of the above can be obtained even more.

Note that the end of layer B on the side that includes the protrusions refers to the end of layer B provided so as to surround the protrusions in FIG.
Among the upper and lower corners of the side surface of layer B facing the protrusion, it refers to a corner on the layer A side and a location located symmetrically with respect to layer A. It is preferable that the adhesive layer that joins layer A and layer D does not include this area and is located outside of the area, similarly to the adhesive layer between layer B and layer C described above.

Note that the thickness of the D layer is not particularly limited, but is 30 μm.
A range of ~300 μm is preferred. Further, as the material, a plastic film or sheet, paper, fiber sheet, etc. are usually used. Furthermore, the surface of the layer may be subjected to various processes such as printing, coating, vapor deposition, etc., or may be colored.

Furthermore, in the laminate of the present invention, if the area of the protrusions is large or the protective layer (C layer) is thin, the ends of the protrusions may be placed between the protrusions and the C layer as shown in FIG. It is preferable to provide an adhesive layer inside the portion.

The inner side of the end of the protrusion means, as shown in FIG. 3, the center side of the end of the surface of the protrusion facing the C layer, and does not include the end.

When the area of the protrusions is large and the thickness of the C layer is thin, when the laminate is bent, the C layer above the protrusions lifts up, causing the type and shape of the protrusions built into the laminate to change. easily identified. Furthermore, if the adhesive layer is provided continuously up to the end of the protrusion or to the outside thereof, a step will occur on the surface of the C layer when the C layer is laminated. Therefore, it is not preferable that the adhesive layer between the protrusions and the C layer of the laminate exist within a distance range from the end of the protrusions to the center of the protrusions, as shown in FIG. .

Here, the distance from the end of the protrusion to the adhesive layer between the protrusion and the C layer is not particularly limited, but may be 0. 5～
The range is preferably 12 mm, and the area of the adhesive layer is preferably 1/5 or more of the area of the surface of the protrusion facing the C layer. If the above distance is smaller than 0.5 mm, steps will easily occur when the C layer is laminated.
On the other hand, if it is larger than 12 mm, it becomes difficult to laminate the C layer, or when the laminate is bent after the C layer is laminated, the portions of the C layer where there is no adhesive are lifted up. Furthermore, when the area of the adhesive layer is less than 1/5 of the area of the protrusions, the C layer of the laminate tends to lift up.

Therefore, in the present invention, between the B layer and the C layer, and between the protrusion and the C layer,
Setting the position of the adhesive between the layers to the position specified in the present invention reduces the level difference and reduces the C of the upper part of the protrusion.
This is important in preventing the layer from lifting.

In such a case, if the surface of the layer A having the protrusions is one side, a protective layer 6 (layer D) is further provided on the side of the laminate that does not have the protrusions of the layer A as shown in FIG. It is also possible to provide In this case, as shown in FIG.
The adhesive layer that joins the layer and the D layer is provided only on the outside of the end of the B layer on the side containing the protrusion, and in the part where the protrusion is present, only on the inside of the end of the protrusion. It is preferable that the effect of the present invention be further obtained.

In all of the above cases, the adhesive layer between layer A and layer B also includes the protrusions of layer B, as shown in FIG. 5, similar to the adhesive layer between layer B and C described above. It is preferable that it be provided outside the end on the side where it is used, since the effects of the present invention can be further obtained.

Note that the end of the B layer on the side that includes the protrusion as used herein refers to the side surface of the B layer facing the protrusion in the B layer provided so as to surround the protrusion in FIG. Among the upper and lower corners, this refers to the corner on the A layer side. Furthermore, the term "outside the end" means the outside of the end when viewed from the protrusion as shown in FIG. 5, and does not include the end.

Further, in the laminate of the present invention, in particular, the A layer has a circuit formed with a metal layer or a conductive paint, and one or more types of electronic components such as an IC, a diode, a capacitor, and a battery are incorporated on the circuit. It is preferable to use an electronic circuit board in which the effects of the present invention can be fully utilized. However, the base material of the A layer in this case is preferably a heat-resistant film or sheet material such as polyester, polyphenylene sulfide, or polyimide. Further, the present invention also includes a device in which the electronic component is mounted with a film or the like to prevent moisture absorption, block gas, or the like.

Further, the total thickness of the laminate of the present invention is not particularly limited, but is usually 0. A range of 3-5 mm is used.

Next, a method for manufacturing the laminate of the present invention will be described.

Here, the case where the A layer is an electronic circuit board will be explained as an example, but the present invention is not limited to this.

First, an electric circuit is formed on the above-mentioned sheet material (for example, polyimide film) using conductive paint or metal foil such as copper foil. Here, when forming a circuit using the conductive paint, silk printing or the like is normally used, and if necessary, the conductive paint is thermally cured. On the other hand, when forming a circuit using metal foil (for example, copper foil), the copper foil and the sheet-like material described above are laminated via a heat-resistant adhesive such as epoxy, and the desired layer is formed using a ferric chloride aqueous solution or the like. A method of etching a circuit pattern is usually used. A layer A having protrusions is prepared by connecting electronic components such as ICs, diodes, batteries, and resistors to the circuit thus obtained by soldering or using a conductive adhesive.

Next, as a spacer layer, the height of the protrusions (for example, electronic parts, etc.) of the above layer A or several 10 to 100 μm
Adhesive (
For example, epoxy, urethane, polyester, etc.)
Apply. The application method here is the gravure roll method,
Well-known methods such as a reverse coater method, a part coat method, and a screen printing method can be used. If provided on the outside, use a method such as a part coating method or a screen printing method to coat the area 0.0 mm from the end of the area to be punched out, which will be described later. It is preferable to apply it to the outside by about 3 to 7 mm. The film or sheet-like material coated with the adhesive in this way has a size that accommodates the protrusions of layer A;
Layer B is prepared by punching out the shape with a Thomson blade or the like.

Layer A and layer B thus produced are laminated by a method such as roll pressing or hot plate pressing with the adhesive interposed so that the protrusions and the punched portions of layer B match.

In this case, the lamination temperature is preferably slightly higher than the softening point of the adhesive (for example, about 10 to 30° C. above the softening point), and the lamination pressure is preferably in the range of 0.5 to 3 kg/ad.

Next, layer C is coated with 0.000000
．． The adhesive as described above is applied to a portion corresponding to about 3 to 7 mm outside and, if necessary, about 0.5 to 12 mm inside from the end of the protrusion. Subsequently, Layer C is laminated on Layer B so that the adhesive surrounds the punched portion of Layer B and the adhesive layer is positioned inside the protrusion. In this case, the lamination method and conditions are A.
This is similar to the case of stacking the layer and the B layer.

In addition, in the above laminate, if the thickness of the sheet-like material of layer A is thin (for example, 50 μm or less) or if the area of the protrusions is large, another layer may be added on the side of layer A that does not have the protrusions. It is desirable to laminate a protective layer (D layer). As for the method of providing the D layer, it is preferable to use the same method as for the above C layer.

[Effects of the Invention] Since the laminate of the present invention has the above-described structure, it is possible to eliminate the level difference that occurs at the part of the protrusion built into the laminate or at the boundary between the spacer layer and the protrusion. Moreover, it is possible to obtain a laminate with a smooth surface in which the protective layer does not lift even when bent.

[Application] The laminate of the present invention can be applied to, for example, a laminate incorporating an electronic circuit board such as an IC card or an anti-theft label. It is also particularly effective when the area of the protrusion is large.

[Example] Next, a detailed explanation will be given with reference to examples.

Example 1 (1) Preparation of the base material constituting the laminate A polyimide film (
"Kapton"' 100H1 (manufactured by DuPont Toray) was prepared. In addition, a polyester film ("Lumirror" H10, 250μm 1 manufactured by Toray Industries, Ltd.) was prepared as a base material for the spacer layer of the B layer.A polyester film ("Lumirror" TIO, 125μm) was also prepared as a protective base material for the C and D layers.
m) was prepared.

(2) Production of layer A A 35 μm electrolytic copper foil was laminated on one side of the polyimide film using the following epoxy adhesive.

Adhesive: “Chemit Epoxy” TE-5920
(Manufactured by Toray Industries) The above adhesive was applied by a gravure roll method, and the coating thickness was adjusted to 15 μm after drying. Drying conditions were a temperature of 100° C. for 2 minutes. The lamination conditions were as follows: using heated press rolls at a temperature of 120°C;
The pressure was set at 2 kg/aA.

Furthermore, it was thermally cured at a temperature of 150° C. for 1 hour.

Next, the obtained copper-clad film was etched with a ferric chloride aqueous solution to form an electronic circuit. Furthermore, 4 is added to the electronic circuit.
A rectangular resistor with a size of cm x 2 cm and a thickness of 200 μm was joined with solder, and an electronic circuit of layer A was added to a 8c
It was cut into a rectangle of m x 5 cm.

(3) Lamination of spacer layer (B layer) An adhesive (KR-100, manufactured by Shin-Etsu Chemical Co., Ltd.) was applied to one side of a 250 μm thick polyester film by screen printing on a 5.7 cm x 3.7 cm rectangular area. The film was coated to a thickness of 30 tlm after drying, and laminated with a silicone-coated polyester film (25 μm) for mold release. The drying conditions during application are 10
It was for 3 minutes at a temperature of 0°C. Furthermore, the part of the above film that is not covered with adhesive is 4. 5 cm
2. A 5 cm square was punched out using a Thomson blade. Next, the silicone-coated polyester film was peeled off, and the resistor of the electronic circuit produced in step (2) was aligned with the punched portion and roll pressed at a temperature of 40°C.

(4) Protective layer (C layer, D layer) laminated with 5.7 μm on one side of a 125 μm thick polyester film.
The adhesive used in (3) was applied by screen printing, controlling so that a rectangle of cm x 3.7 cm was not coated. The drying conditions and coating amount were the same as in (3). The resulting film was laminated on the spacer layer side of the laminate prepared in step (3) by aligning the part of the film to which no adhesive was applied to match the punched part of the spacer layer. Furthermore, the above film was laminated on the A layer side of the laminate in the same manner.

(5) The laminated body for evaluation had a smooth surface, with no steps occurring in the portion of the built-in resistor and the boundary portion between the spacer layer and the resistor.

Comparative Example 1 In the same manner as in Example 1, an adhesive was applied to the entire surface of the film used as the protective layer, and layer C and layer D were laminated under the conditions of Example 1.

On the surface of the laminate, a large step was generated in the resistor portion.

Comparative Example 2 Layer B was created by punching out a 4.5 cm x 2.5 cm rectangle with a Thomson blade under the same conditions as in Example 1, except that the adhesive was applied to the entire surface of both sides of the spacer layer. Further, this layer was laminated with Layer A prepared under the conditions of Example 1, and then a 125 μm thick polyester film (Layer C) was laminated on the spacer layer side of the laminate. Furthermore, an adhesive was applied in the same manner as in Example 1 so that the adhesive did not get on the punched part of the spacer layer (the inside of the 4.5 cm x 2.5 cm rectangle).
A 5 μm thick polyester film (D layer) was laminated on the A layer side with alignment. Each lamination condition was the same as in Example 1.

In the laminate thus obtained, a step was generated at the boundary between the spacer layer and the resistor.

Example 2 (1) Preparation of Layer A A polyphenylene sulfide film ("Torelina" type 3000, 75 μm thick, manufactured by Toray Industries, Ltd.) was used as the base material for the A layer, and a conductive paint ("Hisole" KO-010) was used as the base material for the A layer.
3. (manufactured by Toray Industries) was silk-printed to form an electronic circuit. Further, the paint was heat cured at a temperature of 150°C for 30 minutes. Next, a resistor measuring 10 mm x 20 mm and having a height of 270 μm was bonded to the electronic circuit board using a conductive adhesive (“Hisole” TD-6203, manufactured by Toray Industries). Furthermore, 10
It was thermally cured at a temperature of 0° C. for 30 minutes to obtain an electronic circuit board.

Furthermore, the electronic circuit board was cut into a size of 5.3 cm x 3 cm.

(2) Lamination of spacer layer (B layer) A urethane adhesive ("Adcoat" 76P1, manufactured by Toyo Morton Co., Ltd.) is applied on one side of a 300 μm thick polyester film ("Lumirror" H10, manufactured by Toray Industries) using the gravure roll method. The coating thickness was adjusted to 20 μm after drying. Drying conditions were a temperature of 80° C. for 2 minutes. This was cut into two pieces of 3 cm x 2 CIl1, and two spacer layers were laminated by hot pressing in the shape shown in FIG. 8 so as to sandwich the resistor of the electronic circuit board produced in (1) above.

Lamination conditions were 3 kg/cm2 at a temperature of 80 °C.

Further, the distance between the two spacers was 13 mm, and the distance between the end of the spacer layer and the end of the resistor was 1.5 mm.

(3) Lamination of protective layer (C layer) The urethane adhesive used in (2) was applied to the 125 μm thick polyester film used in Example 1 using a screen printing method to form only 17 mm wide slits. It was applied in a controlled manner so that it did not get coated. Next, Example 1
As in the case of lamination, the adhesive layer was laminated on the outside of the electronic component side end surface of layer B. Lamination was 2 kg/am2 at a temperature of 80 °C in a roll press. Also, the distance between the end of layer B on the electronic component side and the adhesive layer is 2 mm each.
Met.

(4) There was no difference in level between the electronic component built into the evaluation laminate and the boundary between the electronic component and the spacer layer.

It can be seen that the object of the present invention can also be achieved with the configuration shown in FIG.

Example 3 (1) Preparation of the base material constituting the laminate A polyester film ("Lumirror 810 100 μm thick, manufactured by Toray Industries, Ltd.) was used as the base material for the C layer and D layer, and the others were the A layer and B layer used in Example 1. A layer of substrate was used.

(2) Manufacturing of layer A An electronic circuit is formed under the conditions of Example 1, and a resistor with a size of 6 cm x 3.5 cm and a height of 200 μm is bonded to the electronic circuit with solder, and then an electronic circuit board of layer A is formed. 8.5
It was cut to cm x 5.5 cm.

(3) Lamination of Spacer Layer (B Layer) An adhesive was applied on one side of a 250 μm thick polyester film under the conditions of Example 1. At this time, 6.8cmx
I made sure not to get any adhesive on the 4.3cm square part. Furthermore, the area without the above adhesive is 6.2cm x 3
．． Punch out a 7cm square using a Thomson blade. Furthermore, as in Example 1, it was laminated on an electronic circuit board.

(4) Production of C layer and D layer and lamination of 11 layers on one side of a 100 μm thick polyester film.
As shown in the figure, C layer, B layer and protrusions (resistor)
The adhesive was applied under the conditions of Example 1 by screen printing, controlling the position of the adhesive layer between the two. At this time, in the area to which no adhesive was applied, the distance between the adhesive between the C layer and the B layer and between the C layer and the resistor was 10 mm on each side.

Further, the C layer was aligned and laminated under the conditions of Example 1. At this time, the adhesive layer between layer C and layer B is located 3 mm on each side outward from the end of layer B on the resistor side.
The adhesive layer between the layer and the resistor was located 6 mm on each side from the end of the resistor.

For layer D, the same polyester film as for layer C was used, the same adhesive was applied as for layer C, and the layer was laminated on the surface of layer A, which did not have a resistor, to create a laminate as shown in Figure 4. did.

There was no step difference in the electronic component built into the laminate or the interface between the electronic component and the spacer layer, and the protective layer did not lift up even when the laminate was bent.

Comparative Example 3 A laminate was produced in the same manner as in Example 3, except that the adhesive between the resistor and the protective layer of the laminate of Example 3 was applied to the ends of the resistor.

In the laminate, a large step was generated at the end portion of the resistor. Here, it can be seen that the position of the adhesive layer between the resistor and the protective layer is also important.

Example 4 (1) Creation of layer A An electronic circuit was created on the base material of Example 2 under the conditions of Example 2. Next, the size of 4 cm x 5 am is 280 μm.
A resistor having a height of 6. is bonded under the conditions of Example 2, and 6.
An electronic circuit board of 5 cm x 5 cm was obtained.

(2) Lamination of spacer layer (B layer) Apply adhesive to one side of a 300 μm thick polyester film (used in Example 2) under the conditions of Example 2, cut two sheets to 1.1 cm x 5 cm, and then Two spacer layers were hot-pressed and laminated to sandwich the resistor of the electronic circuit board prepared in (1). Lamination conditions were 3 kg/cm2 at a temperature of 80 °C. Further, the distance between the two spacers was 4.3 cm, and the distance between each spacer and the resistor was 1.5 mm.

(3) Production and lamination of C layer and D layer A 100 μm thick polyester film (used in Example 3) was slit to a width of 65 mm, and a 7 mm width was cut in the width direction from both ends of the film, and in the center. 30mm
The urethane adhesive used in Example 2 was applied by screen printing only to the width (15 mm from the center line of the film to the left and right in the width direction). The coating conditions were the same as in Example 2.

Cut the film into two pieces of 5 cm in the length direction, and perform the above (
The laminate prepared in 2) was laminated on the spacer layer side and the A layer side under the conditions of Example 2 (layer C, layer D). At this time, the position of the adhesive layer between layer C and layer B of the laminate is 4 mm outward from the end of layer B on the resistor side. The layers were laminated while controlling the position of the adhesive layer between the C layer and the resistor so that it existed at a distance of 5 mm inward from the end of the resistor.

The laminate also did not have any steps, and the protective layer did not lift up even when bent.

Comparative Example 4 In the laminate of Example 4, the adhesive between the resistor and the protective layer was provided up to the end of the resistor. A layered layer difference occurred at the end of the resistor.

[Brief explanation of drawings]

FIG. 1 is a sectional view of one embodiment of the laminate of the present invention, and FIG.
The figure is a sectional view of another embodiment of the laminate of the present invention, FIG. 3 is a sectional view of still another embodiment of the laminate of the invention, and FIG. 4 is a sectional view of still another embodiment of the laminate of the invention. FIG. 5 is a sectional view of yet another embodiment of the laminate of the present invention, and FIG. 6 is a sectional view of a conventional laminate. 7 is a plan view showing an example of the arrangement of protrusions and the shape of the spacer layer; FIG. 8 is a plan view showing another example of the arrangement of protrusions and the shape of the spacer layer; FIG. The figure is a plan view showing yet another example of the arrangement of protrusions and the shape of the spacer layer, and FIG. 10 shows the position of the adhesive layer provided between the spacer layer and the protective layer (C layer). A plan view showing an example, FIG. 11, shows the position of the adhesive layer between the spacer layer and the protective layer (C layer), and
FIG. 3 is a plan view showing an example of the position of an adhesive layer provided between a protective layer (C layer) and a protrusion. 1: Base material layer of layer A 2: Protrusion 3: Spacer layer (layer B) 4: Adhesive layer 5: Protective layer (layer C) 6: Protective layer (layer D)

Claims (6)

[Claims] (1) Layer consisting of a sheet-like material having protrusions (layer A)
A laminate having a laminate structure in which a spacer layer (layer B) surrounding the protrusion is provided on top, and a protective layer (layer C) is further provided on top of the B layer, A laminate characterized in that an adhesive layer for bonding the layer C and the layer C is provided outside the end of the layer B on the side that includes the protrusion. (2) A protective layer (D
layer), wherein the layer A and layer D of the layer
2. The laminate according to claim 1, wherein the adhesive layer for bonding the layers is provided outside the end of layer B on the side that includes the protrusion. (3) Layer consisting of a sheet-like material having protrusions (layer A)
A laminate having a laminate structure in which a spacer layer (layer B) surrounding the protrusion is provided on top, and a protective layer (layer C) is further provided on top of the B layer, An adhesive layer for bonding the C layer and the C layer is provided outside the end of the B layer on the side containing the protrusion, and an adhesive layer for bonding the protrusion and the C layer is provided on the outside of the B layer on the side that includes the protrusion. A laminate characterized in that the laminate is provided inside from the end. (4) A protective layer (D
layer), wherein the layer A and layer D of the layer
The adhesive layer that joins the layers is provided only on the outside of the end of layer B on the side containing the protrusion, and in the part where the protrusion is present, on the inside of the end of the protrusion. The laminate according to claim (3), characterized in that: (5) Claims (1) to (4) characterized in that the adhesive layer that joins layer A and layer B is provided outside the end of layer B on the side that includes the protrusion. The laminate according to any of the above. (6) The laminate according to any one of claims (1) to (5), wherein the A layer is an electronic circuit board.