JP2009157742A - Contactless ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contactless IC card having structure in which tilt generated on the upper surface side of the contactless IC card is maintained as minimum. <P>SOLUTION: In the contactless IC card formed by at least arranging: a core sheet (C) constituted by forming an antenna sheet (2), an IC chip (3A), a reinforcing plate (4), an intermediate sheet (6), a through-hole (9) on a substrate (1); an exterior sheet (A) for surface; and an exterior sheet (B) for backside on both sides of the core sheet (C), respectively, and performing heat lamination at predetermined temperature, it is characterized in that a spacer (10) for thickness adjustment is formed inside or outside the exterior sheet (A) for surface or the exterior sheet (B) for backside. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a non-contact type IC card incorporating an IC chip. More specifically, the non-contact type IC card has a uniform thickness, and a plurality of the IC cards (about 100 to 500) are stacked. The present invention relates to a non-contact type IC card having a structure in which the inclination generated on the upper surface side is kept to a minimum even when it is placed in a card issuing machine in a state, and the card can be transported smoothly.

  Conventionally, in the fields of credit cards, cash cards, etc., as an alternative to a magnetic card, an IC card having an IC module including an IC memory such as a microprocessor (MPU) or a data memory on a card substrate has an information storage capacity. Is attracting attention because it is very large and has high security.

  In particular, in recent years, the amount of information on IC cards is much larger than that of magnetic cards, and security is also high, which has led to rapid growth in the financial, distribution, transportation, administrative, and communications fields. The use of IC cards has been studied or put into practical use in various fields.

  The types of IC cards are also diversified. For example, classification can be made based on whether or not a CPU (central processing unit) is built in the IC card, or by a method of transmitting and receiving data between an IC chip mounted on the IC card and an external device. .

  In an IC card, an IC chip is embedded in a plastic card made of a material and shape similar to that of a magnetic card. Since the IC chip incorporates a CPU and has an arithmetic function, it is possible to determine whether or not access is correct when reading and writing data, thereby realizing high security.

  In order to read and write data in the IC chip, an interface with the outside is necessary. Further, since the IC card does not contain a battery, it is necessary to supply power for operating the IC chip from the outside.

  For this reason, IC cards include contact type IC cards and non-contact type IC cards due to differences in interface with external devices such as reader / writers, in addition to the classification based on the presence or absence of a CPU.

  Contact type IC cards are the most common type of IC cards that receive power supply by directly contacting the external connection terminals exposed on the card surface with the terminals on the reader / writer side, or perform data communication with external devices. It is a kind.

  On the other hand, the non-contact type IC card is an IC card that has been rapidly spread in recent years. There is no external connection terminal for exchanging data with an external device on the card surface, and an IC chip and a coil antenna are built in the card so that information can be exchanged with a reader / writer by radio waves.

  The non-contact type IC card has not only a built-in antenna in the IC card but also a built-in antenna in the reader / writer. The IC card is supplied with power using radio waves from the reader / writer and also has data etc. Exchange information.

  By the way, the conventional non-contact type IC card is generally formed by thermal lamination. First, as shown in FIG. 9, the layer structure of the core sheet (C), the front exterior sheet (A), and the back exterior sheet (B) that constitute the non-contact IC card before thermal lamination will be described.

  First, the core sheet (C) is formed by laminating an antenna sheet (2) having an antenna pattern formed by etching on a metal foil on the surface of a substrate (1) such as polyethylene terephthalate (PET). An IC chip (3A) is mounted in connection with the antenna part of (2), the IC chip (3A) is sealed with a mold resin (5), and a reinforcing plate (SUS plate) is placed on the IC chip. (4) is placed, and this is heat-cured to form an inlet. Further, it is made of a thermoplastic resin that melts at the time of lamination at a low melting point such as polyvinyl chloride (PVC) and amorphous polyester resin (for example, “PET-G” manufactured by Eastman Kodak Co., Ltd.) so as to sandwich the inlet. An intermediate sheet (6) is arranged. Furthermore, a through hole (9) is formed at the position of the IC chip (3A) of the inlet of the intermediate sheet (6) and the reinforcing plate (4).

  Next, the front exterior sheet (A) and the rear exterior sheet (B) laminated on the front and back of the core sheet (C) are the core sheet (C) of the base material (7) such as polyethylene terephthalate (PET). It is the structure which provided the contact bonding layer (8) in the side which touches.

  Such a front exterior sheet (A) and a rear exterior sheet (B) are arranged on the front and back of the core sheet (C) and thermally laminated at a predetermined temperature, as shown in FIG. It is a contact IC card. Although the above has been described on the assumption of a single card, in the case of mass production, a multi-sided sheet is produced and then cut into a single card to obtain a non-contact type IC card.

  As described above, in the conventional method of manufacturing a non-contact type IC card, a method of forming the non-contact type IC card by heat lamination is generally used, and the intermediate sheet (6) constituting the card is the above-mentioned method. Because it is made of a thermoplastic resin that melts at the time of lamination with a low melting point, such as vinyl chloride (PVC), amorphous polyester resin (for example, “PET-G” manufactured by Eastman Kodak Co., Ltd.), thermal lamination The thickness of the outer sheet (A, B), the SUS plate reinforcing plate (4), and the IC chip (3A) formed of polyethylene terephthalate (PET) having a relatively high heat resistance temperature, although sometimes softening and thickness changes. Since the thickness of the portion does not change at a heating temperature that is about the same as that of the thermal lamination, a difference in thickness may occur between the portion of the IC chip (3A) and its peripheral portion. In the case of a non-contact type IC card, in particular, the IC part (3) is complicated in structure, so it is thicker than the periphery and tends to have a convex shape (11) as a card.

  Therefore, when the IC portion (3) is formed thick, when the IC card is placed in the card issuing machine in a state where a plurality of IC cards (about 100 to 500) are stacked, for example, as shown in FIG. Thus, for example, when 250 conventional IC cards (K) are stacked, the top surface is inclined and the stacking inclination (N) is about 5 mm, and the card cannot be handled and conveyed smoothly. Occurs.

As a technique for solving such a problem, as shown in FIG. 12, an IC card substrate (2 ′) and IC card electronic circuit components (11 ′, 20) mounted on the IC card substrate (2 ′). '), A thickness adjusting member (2a') for adjusting the thickness of the peripheral portion of the IC card substrate (2 '), and both sides of the IC card substrate (2') and the thickness adjusting member (2a '). Non-contact type IC card (1 ') in which an adhesive layer (3', 4 ') and a protective sheet (5', 6 ') located outside the adhesive layer (3', 4 ') are integrally formed Has been proposed. (For example, refer to Patent Document 1). In this case, as the thickness adjusting member (2a ′), polyvinyl chloride having a thickness of 100 to 150 μm or a copolymerized polyester sheet is sandwiched, and the thickness is adjusted by thermal lamination.

  However, when the thickness adjusting member (2a ′) as described above is used, the thickness difference in the card which is actually a problem is a problem when it is stacked at about 10 to 20 μm. In order to improve this, even if the thickness adjusting member (2a ') is partially provided as described above, it is difficult to control with the thermal laminate around it, and conversely, a recess is likely to occur. Problem occurs and is not a complete solution.

Prior art documents are shown below.
JP 2002-279281 A

  The present invention is intended to solve such problems of the prior art, ensuring uniformity of the thickness of the non-contact type IC card, and stacking a plurality of the IC cards (about 100 to 500). To provide a non-contact type IC card having a structure in which the inclination generated on the upper surface side is kept to a minimum even when it is placed in a card issuing machine in a state, and the card can be transported smoothly. Objective.

  The present invention has been made to solve the above-described problems. The invention according to claim 1 of the present invention includes a substrate (1) and a metal foil etched on the surface of the substrate (1). An antenna sheet (2) on which the formed antenna pattern is arranged, and an IC chip (3A) attached to the antenna portion of the antenna sheet (2) are mounted. The IC chip (3A) is molded resin (5 ), And a reinforcing plate (SUS plate) (4) is placed on the IC chip. The inlet is formed by heating and curing the thermoplastic resin so as to sandwich the inlet. A core sheet (C) composed of an intermediate sheet (6) in which a through hole (9) is formed at the position of the IC chip (3A) of the inlet and the reinforcing plate (4), and the core sheet On the front and back of (C) A front exterior sheet (A) and a rear exterior sheet (B) made of a base material (7) provided with an adhesive layer (8) on the side in contact with the core (C) are respectively disposed and laminated at a predetermined temperature. In the non-contact type IC card formed as described above, a thickness adjusting spacer (10) is formed on the inner side or the outer side of the outer surface sheet (A) or the outer surface sheet (B). It is a non-contact type IC card.

  The invention according to claim 2 of the present invention is the non-contact type IC card according to claim 1, wherein the spacer (10) is formed of printing ink by a printing method such as silk screen printing. It is a contact type IC card.

  The invention according to claim 3 of the present invention is the non-contact type IC card according to claim 2, wherein the printing ink is a vinyl chloride-based or urethane-based ink. .

  The invention according to claim 4 of the present invention is the non-contact type IC card according to any one of claims 1 to 3, wherein the thickness of the spacer (10) is in the range of 10 to 20 μm. It is a non-contact type IC card.

The invention according to claim 5 of the present invention is the non-contact type IC card according to any one of claims 1 to 4, wherein the edge portion of the spacer (10) is gentle. IC card.

  The invention according to claim 6 of the present invention is the non-contact type IC card according to any one of claims 1 to 5, wherein the spacer (10) is continuous so as to circulate to a predetermined position on the outer periphery of the card. It is a non-contact type IC card characterized by being formed in a strip shape.

  The invention according to claim 7 of the present invention is the non-contact type IC card according to any one of claims 1 to 5, wherein the spacer (10) is a strip-shaped intermittently at a predetermined position on the outer periphery of the card. It is a non-contact type IC card characterized by being formed in a U-shape.

  The invention according to claim 8 of the present invention is the non-contact type IC card according to any one of claims 1 to 5, wherein the spacer (10) is L at a predetermined position in at least one corner of the card. It is a non-contact type IC card characterized by being formed in a letter shape.

  The invention according to claim 9 of the present invention is the non-contact type IC card according to any one of claims 1 to 5, wherein the spacer (10) excludes the IC portion (3) from the outer peripheral edge of the card. A non-contact type IC card formed over the entire surface.

  The non-contact type IC card according to the present invention includes a substrate, an antenna sheet in which an antenna pattern formed by etching on a metal foil is disposed on the surface of the substrate, and an IC chip connected to the antenna portion of the antenna sheet. The IC chip is sealed with a mold resin, and a reinforcing plate (SUS plate) is placed on the IC chip. An inlet obtained by heating and curing the inlet is sandwiched between the inlet and the inlet. A core sheet made of a thermoplastic resin and composed of an intermediate sheet in which through-holes are formed at the positions of the IC chip and the reinforcing plate of the inlet, and the core sheet on the front and back of the core sheet Non-contact type formed by laminating a front exterior sheet and a rear exterior sheet comprising a base material provided with an adhesive layer on the side in contact with each other, and laminating at a predetermined temperature In the C card, a thickness adjusting spacer is formed on the inner side or the outer side of the front surface outer sheet or the rear surface outer sheet, thereby ensuring the uniformity of the thickness of the non-contact type IC card. Even if a plurality of sheets (about 100 to 500) are stacked in the card issuing machine, the inclination generated on the upper surface side is kept to a minimum, and the card can be transported smoothly. is there. Furthermore, local rubbing on the upper surface of the IC chip portion is also solved, and the appearance characteristics are excellent.

  Embodiments of the present invention will be described in detail with reference to FIGS.

  FIG. 1 is a side cross-sectional view showing an embodiment of the non-contact type IC card according to the present invention before heat lamination of the front and back exterior sheets on the front and back of the core sheet. FIG. 3 is a side cross-sectional view showing an embodiment of the non-contact type IC card according to the present invention after heat lamination of the front and back exterior sheets on the front and back of the core sheet. FIG. FIG. 4 is a side sectional view showing another embodiment of the non-contact type IC card according to the present invention before thermal lamination of the front and back exterior sheets on the front and back of the core sheet. FIG. FIG. 5 is a side sectional view showing another embodiment of the non-contact type IC card according to the present invention in a state after the front and back surfaces of the core sheet are thermally laminated on the front and back surfaces of the core sheet. Non-contact FIG. 6 is a plan view showing one embodiment of a type IC card in which a spacer is formed on the outside of the surface exterior sheet, and FIG. 6 is a diagram showing a spacer on the outside of the surface exterior sheet in the non-contact type IC card according to the present invention. FIG. 7 is a plan view showing another embodiment in a state in which a spacer is formed, and FIG. 7 shows another embodiment in a state in which a spacer is formed on the outer side of the exterior sheet for the surface in the non-contact type IC card according to the present invention. FIG. 8 is a plan view showing still another embodiment of the non-contact type IC card according to the present invention in a state in which a spacer is formed on the outer side of the front exterior sheet.

  As shown in FIGS. 1 to 4, the non-contact type IC card of the present invention is an antenna sheet in which a substrate (1) and an antenna pattern formed by etching a metal foil on the surface of the substrate (1) are arranged. (2) and an IC chip (3A) connected to the antenna portion of the antenna sheet (2), and the IC chip (3A) is sealed with a mold resin (5), and is mounted on the IC chip. A reinforcing plate (SUS plate) (4) is placed on the inlet, and is made of an inlet obtained by heating and curing the thermoplastic resin so as to sandwich the inlet. The IC chip (3A) of the inlet and the reinforcement At the position of the plate (4), a core sheet (C) composed of an intermediate sheet (6) in which a through hole (9) is formed, and the core sheet on the front and back of the core sheet (C) Adhesive layer (8 on the side in contact with (C) In the non-contact type IC card formed by laminating the front surface sheet (A) and the back surface sheet (B) composed of the base material (7) provided with a laminate at a predetermined temperature, The contactless IC card is characterized in that a spacer (10) for adjusting the thickness is formed on the inside or outside of the exterior sheet (A) for the front surface or the exterior sheet (B) for the back surface.

  The substrate (1) is a thermoplastic resin that has a low melting point and melts during lamination, such as polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyimide (PI), acrylonitrile-butadiene-styrene copolymer (ABS), An insulating film such as an acrylic resin or polycarbonate (PC) can be used alone or as a composite. The thickness of the substrate (1) is preferably in the range of 15 to 200 μm.

  Bumps are formed on the antenna sheet (2) on which an antenna pattern formed by etching is disposed after laminating a copper foil or aluminum foil having a thickness of 15 to 50 μm on the insulating film substrate (1). An IC chip (3A) having a thickness of about 200 μm on which (projection electrodes) are formed is mounted face-down so as to form a circuit with an antenna pattern via an anisotropic conductive adhesive sheet (ACF) (not shown). did.

  The IC chip (3A) is sealed with an epoxy mold resin, and at the same time, a reinforcing plate (SUS plate) (4) having a thickness in the range of 30 to 100 μm is placed on the IC chip (3A). This is heated and cured to form an inlet.

  A plurality of thermoplastic intermediate sheets (6) are arranged so as to sandwich the inlet, thereby forming a core sheet (C). Here, through-holes (9) are formed at positions of the IC chip (3A) of the inlet of the intermediate sheet (6) and the reinforcing plate (4).

  The intermediate sheet (6) uses a thermoplastic resin such as polyvinyl chloride (PVC), an amorphous polyester resin (for example, “PET-G” manufactured by Eastman Kodak Co., Ltd.), an acrylic resin, or a polypropylene resin.

  Furthermore, the exterior sheet for surfaces which has the adhesive layer (8) formed by apply | coating a vinyl chloride adhesive or a polyester-type adhesive to the front and back of the said core sheet (C) on the side which touches a core sheet (C) (A) and the exterior sheet (B) for the back surface are arranged. The adhesive may be applied to the core sheet (C) side.

The front exterior sheet (A) and the back exterior sheet (B) can be made of the same material as the substrate (2). For example, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyimide Insulating films such as (PI), acrylonitrile-butadiene-styrene copolymer (ABS), acrylic resin, and polycarbonate (PC) can be used alone or in combination. Moreover, the thickness of the said exterior sheet | seat (A) and the exterior sheet | seat (B) for back surfaces has the preferable range of 0.10-0.15 mm.

  Next, in the non-contact type IC card of the present invention, in order to prevent a phenomenon in which the thickness of the IC chip (3A) portion is thicker than the periphery and the card has a convex shape (11), A spacer (10) for adjusting the thickness is formed on the inner side or the outer side of (A) or the backside exterior sheet (B).

  As a method for forming the spacer (10), it is preferable to use a printing ink such as silk screen printing or gravure printing, but it may be a coating method in which a coating agent is coated by a gravure roll coater.

  The printing ink is preferably a vinyl chloride-based or urethane-based ink. In addition, when providing in the outer side of an exterior sheet | seat, it is preferable to use the thing excellent in transparency so that design property may not be impaired. The thickness of the spacer (10) is determined in consideration of the difference between the thickness of the IC chip (3A) portion and the thickness of the card peripheral portion when the spacer (10) is not provided.

  That is, when there is no spacer (10) for adjusting the thickness, the thickness of the IC chip (3A) is not reflected in the difference from the thickness of the peripheral portion of the card. It varies depending on the material. In the present invention, the thickness of the spacer (10) for adjusting the thickness is such that the difference in thickness within the card which is actually a problem is about 10 to 20 μm, which is a problem when they are stacked. The range of 10 to 20 μm is sufficient. As for the shape, it is preferable that the edge portion of the spacer (10) is gentle.

  Next, the spacer (10) is preferably provided at the following position on the card. For example, as shown in FIG. 5, it is continuously formed in a belt shape so as to go around a predetermined position on the outer peripheral portion of the card. As shown in FIG. 6, a strip-like intermittent U-shape is formed at a predetermined position on the outer periphery of the card. As shown in FIG. 7, it is formed in an L shape at a predetermined position in at least one corner of the card. As shown in FIG. 8, it is formed on the entire surface excluding the IC portion (3) from the outer peripheral edge of the card.

  Next, the core sheet (C) in which the front exterior sheet (A) and the rear exterior sheet (B) are respectively arranged on the front and back of the core sheet (C) is laminated at a temperature of 100 to 150 ° C. A non-contact type IC card having a total thickness of about 0.8 mm and a flat card surface as shown in FIG. 2, and a high surface of the convex shape (11) of the IC chip (3A) as shown in FIG. A non-contact type IC card having the same height on the top surface of the spacer (10) was obtained. The above description is based on the assumption of a single card. However, in mass production, a multi-sided sheet is produced and then cut into a single card to form a non-contact type IC card.

As described above, the non-contact type IC card according to the present invention is connected to the substrate, the antenna sheet in which the antenna pattern formed by etching on the metal foil is disposed on the surface of the substrate, and the antenna portion of the antenna sheet. An IC chip is mounted, the IC chip is sealed with a mold resin, and a reinforcing plate (SUS plate) is placed on the IC chip. A core sheet composed of a thermoplastic resin so as to sandwich the inlet, and an IC sheet of the inlet and an intermediate sheet in which a through hole is formed at the position of the reinforcing plate, and on the front and back of the core sheet Is formed by laminating a front exterior sheet and a rear exterior sheet comprising a base material provided with an adhesive layer on the side in contact with the core sheet, and laminating at a predetermined temperature. In the non-contact type IC card, a thickness adjusting spacer is formed on the inner side or the outer side of the front surface outer sheet or the rear surface outer sheet, thereby ensuring the uniformity of the thickness of the non-contact type IC card, Even if a plurality of IC cards (about 100 to 500) are stacked in a card issuing machine, the inclination generated on the upper surface side can be kept to a minimum and the card can be transported smoothly. It is a thing. Furthermore, local rubbing on the upper surface of the IC chip portion is also solved, and the appearance characteristics are excellent.

  Hereinafter, the non-contact type IC card according to the present invention will be described in more detail with specific examples, but is not limited thereto.

<Example 1>
As shown in FIG. 1, an antenna sheet (2) having an antenna pattern formed by etching on a copper foil is laminated on the surface of a substrate (1) made of polyethylene terephthalate (PET) having a thickness of 25 μm, and the antenna An IC chip (3A) was attached in connection with the antenna portion of the sheet (2). The IC chip (3A) was sealed with an epoxy-based mold resin (5), and a reinforcing plate (SUS plate) (4) was placed on the IC chip. This was cured by heating to obtain an inlet. An intermediate sheet (6) made of polyvinyl chloride (PVC) resin is arranged so as to sandwich the inlet, and the IC chip (3A) of the inlet of the intermediate sheet (6) and the position of the reinforcing plate (4) The core sheet (C) was produced by forming through holes (9).

  Next, an adhesive layer (8) made of a polyester-based adhesive is provided on the side in contact with the core sheet (C) of the base material (7) made of polyethylene terephthalate (PET) having a thickness of 25 μm in a separate step, and the adhesive layer (8) The surface exterior sheet (A) formed by forming a spacer (10) having a thickness of 20 μm by printing on the top using a urethane printing ink by a silk screen printing method.

  Furthermore, the exterior sheet for the back surface provided with an adhesive layer (8) made of a polyester-based adhesive on the side in contact with the core sheet (C) of the base material (7) made of polyethylene terephthalate (PET) having a thickness of 25 μm in a separate step ( B) was prepared.

These front exterior sheet (A) and back exterior sheet (B) are respectively arranged on the front and back of the core sheet (C) and subjected to press lamination at a temperature of 120 ° C. and a pressure of 20 kg / cm ² for 12 minutes. After the crimping release, the sheet was punched into a predetermined card size to obtain a non-contact type IC card of Example 1 as shown in FIG.

<Example 2>
In Example 1, as shown in FIG. 3, a non-contact type IC card of Example 2 was obtained in the same manner as in Example 1 except that the spacer (10) was formed outside the surface exterior sheet (A). It was.

<Confirmation of effect>
When 100 pieces of non-contact type IC cards obtained in Example 1 and Example 2 were overlapped and the inclination was measured, there was almost no inclination. Furthermore, when 500 cards were placed on the card issuing machine and issued, it was possible to issue any card without any problem. Thereby, the effect of the invention was confirmed.

In the non-contact type IC card concerning the present invention, it is a sectional side view showing one example of a state before carrying out heat lamination of the surface exterior sheet and the back surface exterior sheet on the front and back of the core sheet. In the non-contact type IC card concerning the present invention, it is a sectional side view showing one example of the state after carrying out heat lamination of the surface exterior sheet and the back surface exterior sheet on the front and back of the core sheet. In the non-contact type IC card concerning the present invention, it is a sectional side view showing other examples of the state before carrying out heat lamination of the surface exterior sheet and the back surface exterior sheet on the front and back of the core sheet. In the non-contact type IC card concerning the present invention, it is a sectional side view showing other examples of the state after carrying out heat lamination of the surface exterior sheet and the back surface exterior sheet on the front and back of the core sheet. In the non-contact type IC card concerning the present invention, it is a top view showing one example of the state where the spacer was formed in the outside of the exterior sheet for surface. In the non-contact type IC card according to the present invention, it is a plan view showing another embodiment in a state in which a spacer is formed on the outer side of the front exterior sheet. In the non-contact type IC card according to the present invention, it is a plan view showing still another embodiment in a state in which a spacer is formed on the outer side of the outer packaging sheet for surface. In the non-contact type IC card according to the present invention, it is a plan view showing still another embodiment in a state in which a spacer is formed on the outer side of the outer packaging sheet for surface. In the conventional non-contact-type IC card, it is a sectional side view showing one example of a state before heat-laminating a front-side exterior sheet and a back-side exterior sheet on the front and back of a core sheet. In the conventional non-contact type IC card, it is a side sectional view showing one example of a state after heat laminating a front exterior sheet and a back exterior sheet on the front and back of a core sheet. It is a sectional side view which shows the state of the inclination of a card | curd when the conventional non-contact type IC card is stacked. It is a block diagram of the non-contact type IC card of a prior art technical document.

Explanation of symbols

A ... Exterior sheet for front surface B ... Exterior sheet for back surface C ... Core sheet 1 ... Substrate 2 ... Antenna sheet 3 ... IC part 3A ... IC chip 4 ... Reinforcement Plate 5 ... Mold resin 6 ... Intermediate sheet 7 ... Base material 8 ... Adhesive layer 9 ... Through hole 10 ... Spacer for adjusting thickness 11 ... Convex shape N ... Tilt K: Card 1 ': Non-contact type IC card 2': IC card substrate 2a ': Thickness adjusting member 3': Adhesive layer 4 ': Adhesive layer 5' ..Protective sheet 6 '... Protective sheet 11' ... Electronic circuit component for IC card 20 '... Electronic circuit component for IC card

Claims (9)

  A substrate, an antenna sheet in which an antenna pattern formed by etching a metal foil on the surface of the substrate is disposed, and an IC chip is mounted in connection with the antenna portion of the antenna sheet. The IC chip is molded resin A reinforcing plate (SUS plate) is placed on the IC chip. The inlet is a heat-cured inlet and a thermoplastic resin so as to sandwich the inlet. The IC chip of the inlet And a core sheet composed of an intermediate sheet in which through holes are formed at the position of the reinforcing plate, and a base material in which an adhesive layer is provided on the front and back of the core sheet on the side in contact with the core sheet In the non-contact type IC card formed by laminating a front surface sheet and a back surface sheet, respectively, and laminating at a predetermined temperature, Contactless IC card, characterized in that it spacer for thickness adjustment is formed inside or outside of the over preparative or rear outer sheet.   2. The non-contact type IC card according to claim 1, wherein the spacer is formed of printing ink by a printing method such as silk screen printing.   The non-contact type IC card according to claim 2, wherein the printing ink is a vinyl chloride-based or urethane-based ink.   The non-contact type IC card according to claim 1, wherein the spacer has a thickness in a range of 10 to 20 μm.   The non-contact type IC card according to claim 1, wherein an edge portion of the spacer is gentle.   6. The non-contact type IC card according to any one of claims 1 to 5, wherein the spacer is continuously formed in a belt shape so as to circulate to a predetermined position on an outer peripheral portion of the card.   6. The non-contact type IC card according to claim 1, wherein the spacer is formed in a strip-like intermittent U-shape at a predetermined position on the outer periphery of the card.   6. The non-contact type IC card according to claim 1, wherein the spacer is formed in an L shape at a predetermined position in at least one corner of the card.   6. The non-contact type IC card according to claim 1, wherein the spacer is formed on the entire surface excluding the IC portion from the outer peripheral edge of the card.