JPH09309284A - Manufacture of ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance productivity during continuous lamination by making all of thickness of film equal in use for a printed circuit layer and spacer layer, providing an adhesive layer on a central axis of the card cross-section, and forming films to be laminated vertically symmetrical with respect to the central axis. SOLUTION: After applying a skin layer with an adhesive 2 applied on one surface of a polyester film 1 and an adhesive 4 on one surface of a polyester film 3, by printing a spacer layer having an opening made at only a part of an IC chip 6 and antenna 8 and circuit 9 using a silver paste on a polyester film 7, and heat-press bonding and laminating a printed circuit layer with an IC chip 6 connected on a circuit 9, a non-contact type IC card is manufactured. Since all tensions applied on each film layer during heat lamination are made equally, an excellent non-contact type IC card can be obtained having a good flatness after lamination and a small degree of distortion even in heating.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an IC card equipped with an electric component such as an IC chip.

[0002]

2. Description of the Related Art Conventional types of IC cards include a contact type and a non-contact type used for electronic tickets and the like. As the contact type, as shown in FIG.
There is a semiconductor module in which a semiconductor module is fitted and pushed into a recess of a card base material. More specifically, in FIG. 5, the semiconductor module 12 including the substrate 14 on which the functional component 13 is mounted is fixed to the concave portion of the card base material 15, and contacts the bottom surface of the concave portion or the concave portion of the semiconductor module 12. The electrode terminals 16 are fixed to the outer surface of the card via an adhesive or an adhesive film. The material of the card base material 15 is usually a molded product such as ABS resin or vinyl chloride resin.

The non-contact type has a winding coil used as an antenna 17 as shown in FIG. 6, and the semiconductor module 12 and the antenna 17 are preliminarily recessed in card base materials 18 and 19. Is provided,
A component is sandwiched between the central portions of the two base materials, and heat fusion or an adhesive is arranged to fix the two base materials. This card substrate 1
Nos. 8 and 19 are made of molded products such as ABS resin and vinyl chloride resin.

[0004]

Recently, a non-contact type IC is used.
Although the demand for cards is increasing, it is difficult to reduce the thickness of the non-contact type IC card with the above-mentioned structure because the parts are molded in the card base material. There was a problem that the thickness could not be reduced up to 760 μm. Further, since the winding coil of the antenna part is used, there are problems that workability is lowered and the card cost is high due to the molding process, so that the non-contact type IC card is not widely used.

Recently, a printed circuit layer on which electric parts are mounted is formed on a plastic film on which a circuit is formed by using a conductive ink, and an adhesive is applied on the plastic film so that the printed circuit layer has the same thickness as the electric parts after lamination. An IC card was devised which consisted of a spacer layer that was opened only on the electrical parts after the application of the coating, and a skin layer where the adhesive was applied on the plastic film. The thickness of the plastic film used for each layer Therefore, productivity cannot be improved because the film tension is difficult to control during continuous lamination, and there is a problem that the card is warped due to uneven tension during lamination even after lamination. It was

It is an object of the present invention to provide a method of manufacturing an IC card which improves productivity during continuous lamination and prevents warping of the card after lamination.

[0007]

The IC card according to the present invention comprises:
A circuit is formed on a plastic film by using a conductive ink, and a printed circuit layer on which electric parts are mounted, a spacer layer made of an adhesive film in which parts of the electric parts are hollowed out, and a plurality of adhesive film are formed. In an IC card formed by stacking layers, the thicknesses of the films used for the printed circuit layer and the spacer layer are the same as those of the electric components, and an adhesive layer is provided on the central axis of the card cross section, and the central axis is It is characterized in that the films laminated to each other are vertically symmetrical.

That is, according to the present invention, with reference to the thickness of the electric component to be mounted, the plastic film with a circuit (printed circuit layer) on which the component is mounted and the part of the electric component are hollowed out and an adhesive is applied. It was found that the structure using a plastic film (spacer layer) with the same thickness as that of electric parts has excellent productivity by continuous lamination and is also effective in preventing warpage after lamination. It was done by.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION In the laminating step, first, a printed circuit layer on which electric parts are mounted is attached to a film (spacer layer) with an adhesive in which parts of the electric parts are hollowed out, and an adhesive is provided above and below the film. The film is laminated as a skin layer. The laminating method at this time is not particularly limited, such as hot pressing and roll laminating, but in view of productivity, continuous production by roll laminating is preferable. When the printed circuit layer and the spacer layer are laminated, if the thickness of each substrate film is different, even if laminated with the same heating history and tension setting, residual stress after lamination due to the difference in physical properties of individual materials etc. This tends to cause warpage or deformation when the card is heated. It is possible to suppress the deformation of the card immediately after lamination by giving different lamination conditions for each substrate, but if heat history is added to the card after lamination, the heat shrinkage rate and expansion of each film will increase. The card is easily deformed due to a difference in material properties such as a coefficient. Therefore, the plastic films used for the printed circuit layer and the spacer layer are made of the same material and have the same thickness, and by eliminating the physical properties of the material, it is possible to eliminate warpage and deformation. Furthermore, since they can be laminated under the same conditions, they are excellent in productivity. The skin layers laminated above and below the laminated printed circuit layer and the spacer layer are preferably films made of the same material and having the same thickness, but the flexibility of the card thickness after lamination is lost. Therefore, when using a film with a different thickness from the film used for the printed circuit layer for the skin layer, make the thickness of the upper and lower skin layers the same so that the center axis in the thickness direction of the card Since the structure can be made symmetrical, the difference due to the physical properties of the material can be offset, and the warpage and deformation can be suppressed.

The plastic film used for each layer is not particularly limited, but a polyester film,
Polycarbonate film, polypropylene film,
Examples thereof include a polyimide film, and a polyester film is preferable from the viewpoint of film strength, cost, and flexibility of general-purpose film thickness. The thickness is 25, 38, 50,
75, 100, 125, 150, 175, 188, 20
Films with various thicknesses of 0, 225, 250, 300 μm, etc. can be selected based on the thickness of the electric components to be mounted.

As the adhesive, a polyester-based adhesive,
There are nitrile rubber-based, acrylic-based, epoxy-based, etc., and they are used after being crosslinked as necessary, but are not particularly limited.

According to the card structure of the present invention, even in a laminating method using a roll laminator suitable for continuous production, warpage and deformation are less likely to occur, and the setting conditions for each layer can be the same, so that workability can be improved.

[0013]

EXAMPLES Hereinafter, the method for manufacturing an IC card of the present invention will be specifically described by way of examples, but the present invention is not limited thereto. FIG. 1 is a cross-sectional view of a non-contact type IC card according to the configuration of the present invention, in which a skin layer having an adhesive 2 applied to one surface of a polyester film 1
After applying the adhesive 4 on one surface of the polyester film 3, a spacer layer in which only the IC chip 6 is processed with an opening is formed, and as shown in FIG.
The antenna 8 and the circuit 9 are printed using a silver paste, and a printed circuit layer to which the IC chip 6 is connected is laminated on the circuit 9 by thermocompression bonding. FIG. 2 is a cross-sectional view of the skin layer used in the non-contact type IC card shown in FIG. 1, which is a polyester film 1 having a thickness of 100 μm, DIAFOIL T100 (manufactured by DIAFOIL HEKTO CORPORATION, product). (Name) is subjected to corona treatment on one surface, and the polyester adhesive 2 XD-281-
3 (manufactured by Hitachi Chemical Polymer Co., Ltd., trade name) was applied and dried so that the thickness after drying was 20 μm. FIG. 3 is a sectional view of the spacer layer, which has a thickness of 250 μm.
Diafoil T10 which is a polyester film 3 of m
Corona treatment was performed on both surfaces of 0 (manufactured by Dia foil Hekito Co., Ltd.), and one side thereof was polyester adhesive 4 XD-281-3 (manufactured by Hitachi Chemical Polymer Co., Ltd.) Is applied and dried so that the thickness after drying becomes 20 μm, and then the portion 5 corresponding to the IC chip portion is punched. FIG. 4 shows a thickness of 250
Diafoil T1 which is a polyester film 7 of μm
The antenna 8 and the circuit 9 are printed and dried so that the thickness of the silver paste after drying is 20 μm on one side of 00 (trade name of Dia foil Hekito Co., Ltd.), and then through the through hole. An antenna is printed and dried on one surface, and this circuit is connected to a pad portion of an IC chip having a thickness of 250 μm. The holes of the spacer layer shown in FIG. 3 are aligned with the parts of the printed circuit shown in FIG.
The layers are laminated by heating roll lamination under the conditions of 0 ° C., 10 kg / cm ² , and 0.5 m / min, and then the adhesive surface of the skin layer shown in FIG. A non-contact type IC card shown in FIG. The amount of warpage of the obtained IC card was 0.2 mm, the amount of warpage after drying at 100 ° C. for 1 hour was 0.4 mm, and the flatness was good.

[0014]

The present invention is constructed as described above,
Further, since the tension applied to each film layer during heating and laminating can be the same, it is possible to provide an excellent non-contact type IC card which has excellent flatness of the card after laminating and has a small amount of deformation even during heating. it can. Further, since it is excellent in workability during roll lamination, it can be easily manufactured at low cost.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a sectional view showing a part of an embodiment of the present invention.

FIG. 3 is a sectional view showing another part of the embodiment of the present invention.

FIG. 4 is a sectional view showing still another part of the embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a conventional example.

FIG. 6 is a sectional view showing another conventional example.

[Explanation of symbols]

 1. Polyester film (thickness 100 μm) 1. Adhesive (20 μm thick) 3. Polyester film (thickness 250 μm) 4. Adhesive (thickness 20 μm) 5. Opening 6. IC chip 7. Polyester film (thickness 250 μm) 8. Silver paste printing antenna section 9. Silver paste printed circuit section 10. Silver paste through hole 11. Silver paste antenna part 12. Semiconductor module 13. Functional parts 14. Substrate 15. Card base material 16. Electrode terminal 17. Winding coil 18. Card base material 19. Card base material

Claims (1)

[Claims] 1. A printed circuit layer on which a circuit is formed by using a conductive ink on a plastic film, and an electric component is mounted thereon, a spacer layer made of a film with an adhesive in which a part of the electric component is hollowed out, and an adhesive. In an IC card having a plurality of laminated films, the thicknesses of the films used for the printed circuit layer and the spacer layer are the same as those of the electric parts, and the adhesive layer is provided on the central axis of the card cross section, and A method of manufacturing an IC card, characterized in that films laminated with respect to a central axis are vertically symmetrical.