JPH07179088A - Ic card and its manufacture - Google Patents

Abstract

PURPOSE:To eliminate generation of unevenness on the surface of a laminated product after press lamination, by a method wherein a reinforcing plate from which a part corresponding to at least a part of a plurality of spheres surrounding electronic parts mounting part is removed through blanking is provided. CONSTITUTION:In a circuit board 10, a conductor circuit 11 which is formed by removing selectively copper foils stuck together through, for example, an ester type thermoplastic adhesive agent by etching and a letter pattern 12 which expresses a product number on the upper part and right of the conductor circuit 11 are provided on the surface. In an adhesive agent sheet 20, circular holes 21a, 21b, 21c which correspond to a sphere containing chip condenser mounting pad 11a and semiconductor IC chip mounting pads 11b, 11c and a square hole 21d corresponding to four pieces of film condenser mounting pads 11d are provided. In a reinforcing plate 30, blanked hole by a press in a fixed position with the circuit board 10, that is, circular holes 31a, 31b, 31c, 31e and a small circular hole 32 are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card, and particularly to an IC card using a flexible substrate such as polyester resin.
Regarding C card.

[0002]

2. Description of the Related Art Conventionally, as shown in, for example, Japanese Unexamined Patent Publication (Kokai) No. 4-286697, an IC card of this type is an electronic component in which an adhesive is applied to the front side of a circuit board made of polyester resin and the back side A thick-walled reinforcing plate (structural member) made of polyester resin provided with an opening for accommodating was laminated by pressing. Then, an IC card is formed by pressing a thermoplastic plastic thin plate such as vinyl chloride onto the front and back surfaces of the laminated product of the circuit board and the reinforcing plate.

[0003]

By the way, the above-mentioned circuit board is provided with a film-like component adhered to a conductor wiring made of a metal thin film or an electrode of the metal thin film, and the substrate surface is provided with irregularities. . When the reinforcing plate coated with the adhesive is laminated on the circuit board by pressing, the pressure of the press is, for example, 40 kg / The pressure should be as high as cm ² . As a result, there is a problem in that a flexible substrate such as polyester is plastically deformed, and defects such as deformation and warpage occur in the laminated product. To avoid this, if the press pressure is lowered, the above irregularities will appear on the back side of the circuit board, and the irregularities will also remain on the plastic plate that will be pressure-bonded after that, making it possible to achieve high-quality display of letters, patterns, etc. on the plastic plate. There is a problem that you cannot do it. The present invention is intended to solve the above-mentioned problems, and provides an IC card and a method of manufacturing the IC card, which has high reliability without causing unevenness on the surface of a laminated product after press lamination of a circuit board and a reinforcing plate member. The purpose is to provide.

[0004]

In order to achieve the above object, the structural feature of the invention according to claim 1 is that a plurality of electronic component mounting portions made of a metal thin film and a conductor wire portion are provided on the front surface side. A plastic circuit board provided and an adhesive sheet having substantially the same shape as the circuit board adhered to the surface side of the circuit board, and enclosing a region surrounding the electronic component mounting portion and a dense portion of the conductor line portion. An adhesive sheet obtained by punching out and removing at least a part of a portion corresponding to a region, and a plastic plate adhered and fixed on the adhesive sheet, corresponding to at least a part of a plurality of regions surrounding an electronic component mounting portion. The reinforcing plate is formed by punching out the portion to be removed.

Further, the structural feature of the invention according to claim 2 is that in the IC card according to claim 1, the IC card is adhered and fixed to an adhesive sheet adhered to an electronic component mounting portion of a circuit board. The film-type electronic component, in which the terminal is crimped and fixed, is provided on the conductor wire portion terminal of the circuit board exposed at the punched and removed portion of the adhesive sheet.

Further, the structural feature of the invention according to claim 3 is the step of forming a plastic circuit board having a plurality of metal thin film electronic component mounting portions and conductor wire portions on the front surface side. A step of adhering to the surface side of the circuit board an adhesive sheet obtained by punching and removing at least a part of a region corresponding to a region surrounding the electronic component mounting portion and a region surrounding a dense portion of the conductor wire portion; And a step of laminating a plastic reinforcing plate, which is formed by punching and removing a portion corresponding to at least a part of a region surrounding the electronic component mounting portion, via the agent sheet on the circuit board.

Further, the constitutional feature of the invention according to claim 4 is that, in the method of manufacturing an IC card according to claim 3, the film-type electronic component is adhered onto the adhesive sheet and the adhesive agent is used. There is a step of crimping and fixing the terminals of the same film type electronic component to the conductor terminals exposed at the punched portion of the sheet.

[0008]

In the invention according to claim 1 configured as described above, on the front surface side of the same circuit board, a region surrounding a dense portion of the electronic component mounting portion and the conductor wire portion protruding from the substrate surface By providing the adhesive sheet obtained by punching and removing at least a part of the portion corresponding to, there is almost no unevenness on the surface of the adhesive sheet at this point. Therefore, when the reinforcing plate is laminated on the adhesive sheet by pressing next, it is almost unnecessary to absorb the unevenness of the circuit board surface by the adhesive sheet, so that the pressing pressure can be lowered. And, even if the pressing pressure is lowered, the unevenness does not occur on the back surface of the laminated product.
As a result, it is possible to prevent the occurrence of defects such as dimensional abnormality, warpage, and deformation of the laminated product. Also, since the pressing pressure can be lowered, it is not necessary to use an expensive material having excellent dimensional stability and elastic modulus for the circuit board and the reinforcing plate,
Inexpensive materials can be used. Furthermore, since the surface of the laminated product can be made flat, it is possible to form decoration, characters, etc. on the surface of the cover sheet with high quality after the cover sheet is further bonded to the laminated product.
Then, by these improvements, the manufacturing yield of the IC card can be increased and the price of the IC card can be reduced.

Further, in the invention according to claim 2 having the above-mentioned structure, the film type electronic component is adhered to the adhesive sheet, and the terminal of the circuit board is exposed from the punched and removed portion of the adhesive sheet. By crimping to the connection terminal, the film type electronic component can be adhered to the circuit board without contact between the conductor portion of the film type electronic component and the conductor wire portion of the circuit board. In particular, the present invention uses an electronic component such as a film-type coil component, which has a spiral shape and both terminals are separated at the center and the periphery.
Suitable for C cards.

In the invention according to claim 3 configured as described above, the IC card according to claim 1 can be properly manufactured by this manufacturing method.

In the invention according to claim 4 configured as described above, the IC card according to claim 2 can be properly manufactured by this manufacturing method.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a flexible type I according to the first embodiment.
It is a perspective view showing a schematic configuration of a C card.
This IC card covers the circuit board 10, an adhesive sheet 20 adhered to the surface side thereof, a reinforcing plate 30 laminated on the circuit board 10 via the adhesive sheet 20, and an opening portion of the reinforcing plate 30. Cover sheets 41 and 42 are provided, and label sheets 51 and 52 joined to the back surface of the circuit board and the front surface of the reinforcing plate are provided.

The circuit board 10 is made of polyester resin,
It is a substantially rectangular thin plate having a length of 85 mm, a width of 53 mm, and a thickness of 125 μm. As shown in FIG. 2A, the circuit board 10 includes a conductor circuit 11 formed by selectively removing by etching a copper foil bonded to the surface via, for example, an ester-based thermoplastic adhesive, and a conductor circuit 11 on the upper right side. A character pattern 12 indicating the product number is provided. The conductor circuit 11 is provided with a chip capacitor mounting pad 11a, semiconductor IC chip mounting pads 11b and 11c, and four film capacitor mounting pads 11d in order from the right side, and conductor wirings 11e arranged between the pads. The left end portion of the conductor wiring 11e is formed as two electrode terminals 11e1 for connecting the film type coil component. Also, the circuit board 1
0 is 3 for each evenly spaced near the top and the bottom.
Individual positioning holes 13 are provided.

The adhesive sheet 20 is a thermoplastic adhesive,
It is a thin plate having a thickness of 50 μm. The adhesive sheet 20 is shown in FIG.
As shown in (b), punching holes are provided at positions corresponding to a plurality of regions of the circuit board 10. As the punched holes, the chip capacitor mounting pad 11a, the semiconductor IC
Circular holes 21a, 21b, 21c corresponding to the regions including the chip mounting pads 11b, 11c, and square holes 21d corresponding to the four film capacitor mounting pads 11d,
Square hole 2 corresponding to dense area D of wiring of circuit board 10
1f, small circular holes 21e corresponding to the two terminals 11e1 of the film type coil component, square holes 22 corresponding to the character pattern 12, and six small circles corresponding to the upper and lower three alignment holes 13 respectively. And a hole 23 is provided.

The reinforcing plate 30 is made of polyester resin and is a substantially rectangular thick plate having a length of 85 mm, a width of 53 mm and a thickness of 350 μm. As shown in FIG. 2C, the reinforcing plate 30 has punched holes formed by a press at predetermined positions corresponding to the circuit board 10. As the punched holes, the chip capacitor mounting pad 11a, the semiconductor IC chip mounting pad 11
circular holes 31a, 31 corresponding to regions including b, 11c
b, 31c and two terminals 11 of the film type coil component
A circular hole 31e including e1 and six small circular holes 32 corresponding to the upper and lower three positioning holes 13 of the circuit board 10, respectively.
And are provided.

The cover sheets 41 and 42 have a thickness of 35 μm.
Of the prepreg obtained by impregnating the epoxy resin into the cloth, and is divided into a rectangular plate that covers the circular holes 31a to 31c of the reinforcing plate 30 and a rectangular plate that covers the circular holes 31e. The label sheets 51 and 52 are made of polyvinyl chloride resin and have a length of 85 mm, a width of 53 mm, and a thickness of 25.
It is a thin plate of μm.

Next, the manufacturing process of the IC card will be described. First, the film capacitors 61 are fixed to the four film capacitor mounting pads 11d of the circuit board 10 with an adhesive. Next, the adhesive sheet 20 is shown in FIG.
As shown in FIG. 3, the alignment holes 13 and 23 of the both are aligned and bonded to the front surface side of the circuit board 10. At this time, the adhesive sheet 20 is attached to each pad portion 1 of the circuit board 10.
Since the holes are provided in the protruding portions such as 1a to 11d and the dense portion D of the conductor wiring 11e, the adhesive sheet 20 is not lifted by these protruding portions. Therefore, at this point, there are almost no irregularities on the surface of the adhesive sheet 20.

Next, the small circular hole 21 of the adhesive sheet 20.
In the electrode terminal 11e1 of the wiring board 10 exposed at the position e,
The film type coil component 62 shown in FIG. 5 is connected. That is, the two terminals 62a of the film-type coil component 62, which are formed by selectively etching a copper foil bonded to a polyester film with an adhesive and are plated with gold as necessary, are used as electrode terminals. It is assembled by aligning with 11e1 and pressing a polyester film onto the adhesive sheet 20. At this time, only the terminal 62a of the film-type coil component 62 is pressure-bonded to the electrode terminal 11e1, and the ring portion is the adhesive sheet 2
The ring portion is not short-circuited with the conductor wiring 11e because it is provided on the wiring 0. Therefore, the film type coil component 62 can be reliably assembled to the circuit board 10.

Next, the reinforcing plate 30 is adhered to the adhesive sheet 20 and pressure-bonded by a pressing device, so that the reinforcing plate 30 is laminated on the circuit board 10 via the adhesive sheet 20 as shown in FIG. It At this time, since there is almost no unevenness on the surface of the adhesive sheet 20, the adhesive sheet 2
There is almost no need for 0 to absorb the protruding portion of the circuit board 10. Therefore, the pressing pressure for stacking can be lowered, and thus the back surface of the circuit board 10 is not uneven.

Next, the exposed chip capacitor mounting pad 11a and the semiconductor IC chip mounting pads 11b and 11 are exposed.
As shown in FIG. 4, the chip capacitor 63 and the semiconductor IC chips 64 and 65 are bonded to c. Then, the chip capacitor and the electrode pad of the semiconductor IC chip are connected to the corresponding conductor wiring 11e of the circuit board 10 by wire bonding. After that, a soft epoxy resin containing ferrite particles is injected into the circular hole 31e of the reinforcing plate 30 on which the film type coil component 62 is mounted in order to eliminate magnetic influence. In addition, a mold resin such as epoxy resin is filled in the hole portion of the reinforcing plate 30 on which the chip capacitor 63 and the semiconductor IC chips 64 and 65 are mounted. Then, the soft epoxy resin layer and the epoxy resin layer are cured by heat treatment at 150 ° C. for 60 minutes to become a mold resin layer. Next, the cover sheets 41 and 42
However, it is coated and adhered to the resin-molded portion of the reinforcing plate 30 to further enhance protection of the chip capacitor and the like in addition to the molding resin layer.

Next, the ester thermoplastic adhesive is applied to the label sheets 51 and 52. The coating thickness is, for example, the cover sheet 4 for the label sheet 51 on the reinforcing plate side.
The portions corresponding to 1 and 42 are set to about 50 μm, and the other portions are set to about 85 μm to absorb the protrusion of the thickness of the cover sheets 41 and 42. The label sheet 52 on the circuit board side has an adhesive coating thickness of about 85 μm.
m. Label sheets 51 and 52 coated with an adhesive
Is attached to the reinforcing plate 30 and the circuit board 10, and 150
The label sheets 51 and 52 are laminated on the circuit board 10 and the reinforcing plate 30 by pressing at 40 ° C. and 40 kgf / cm ² for about 10 minutes. Then, an IC card can be obtained by printing characters and patterns on the label sheet 51 on the front surface side.

As described above, in this embodiment, when the reinforcing plate is laminated on the circuit board via the adhesive sheet by pressing, it is not necessary to absorb the unevenness of the board surface in the adhesive sheet. , The press pressure can be lowered. And, even by this, unevenness does not occur on the surface of the laminated product. Further, since the pressing pressure can be lowered, it is possible to reduce the occurrence of defects such as dimensional abnormality, warpage, and deformation of the laminated product. Further, since the pressing pressure can be lowered, it is not necessary to use an expensive material having excellent dimensional stability and elastic modulus as a material for the circuit board or the reinforcing plate, and an inexpensive material can be used. Furthermore, by preventing deformation such as warpage of the substrate, when a cover sheet is further adhered to the laminated product and then decorations, characters, etc. are printed on the cover sheet surface, there is no unevenness and high-quality printing that looks good. It can be performed.
And, due to these many improvements, the manufacturing yield of the IC card can be increased and the price of the IC card can be reduced.

In the above embodiment, the film type coil parts are used as the coil parts, and the assembly is preferably carried out. However, instead of this, ordinary coil parts may be used. In that case, the same assembling process for other chip components is adopted. Further, in the above-mentioned embodiment, the cover sheet can be omitted if necessary. Also,
The size and shape of the IC card, the material, the arrangement of parts, the wiring, and the like are not limited to those in the above embodiment, but can be changed as appropriate according to the purpose, application, and the like.

[Brief description of drawings]

FIG. 1 is an exploded perspective view schematically showing an IC card according to an embodiment of the present invention.

FIG. 2 is a plan view showing a circuit board, an adhesive sheet, and a reinforcing plate of the IC card.

FIG. 3 is a plan view showing a state in which an adhesive sheet is adhered to a circuit board of the IC card.

FIG. 4 is a plan view showing a state in which a reinforcing plate is laminated on the circuit board of the IC card via an adhesive sheet.

FIG. 5 is a partial plan view and a sectional view showing in detail a state in which the film coil is connected to a circuit board via an adhesive sheet.

[Explanation of reference numerals] 10: circuit board, 11a; chip capacitor mounting pad, 11b, 11c; IC chip mounting pad, 11d;
Film capacitor mounting pad, 11e; conductor wiring, 1
1e1; electrode terminal, 12; character pattern, 13; alignment hole, 20; adhesive sheet, 21a to 21c; circular hole, 21d; square hole, 21e; small circular hole, 21f; square hole, 22; square hole, 23; small circular hole, 30; reinforcing plate, 31a to 31c, 31e; circular hole, 32; small circular hole, 41, 42; cover sheet, 51, 52; label sheet, 61; film capacitor, 62; film coil Parts, 63; chip capacitors, 64, 65; semiconductor IC chips, D; dense parts of conductor wiring.

Claims (4)

[Claims] 1. A plastic circuit board having a plurality of electronic component mounting portions made of a metal thin film and a conductor wire portion on the front surface side, and a substantially same shape as the same circuit board adhered to the front surface side of the circuit board. An adhesive sheet in which at least a part of a portion corresponding to a region surrounding the electronic component mounting portion and a region surrounding a dense portion of the conductor wire portion is punched and removed; An IC card comprising a plastic plate adhesively fixed on a sheet, the reinforcing plate having a part corresponding to at least a part of a plurality of regions surrounding the electronic component mounting part punched out and removed. . 2. The IC card according to claim 1, wherein the IC card is adhesively fixed to the adhesive sheet adhered to an electronic component mounting portion of the circuit board, and is punched out of the adhesive sheet. An IC card, wherein a film-type electronic component, in which the terminal is crimped and fixed, is provided on the exposed conductor wire portion terminal of the circuit board. 3. A step of forming a plastic circuit board on which a plurality of electronic component mounting portions made of a metal thin film and a conductor wire portion are provided on the front surface side, and the electronic component mounting portion on the front surface side of the circuit board. Bonding an adhesive sheet from which at least a part of a region corresponding to a region surrounding the conductor wire portion and a region surrounding the dense portion of the conductor wire portion is adhered, and the electronic component mounting portion is provided via the adhesive sheet. And a step of stacking a plastic reinforcing plate, in which a portion corresponding to at least a part of the surrounding area is punched and removed, on the circuit board. 4. The method of manufacturing an IC card according to claim 3, wherein the film-type electronic component is adhered onto the adhesive sheet, and the conductive line terminal exposed on the punched-out portion of the adhesive sheet. A method of manufacturing an IC card, comprising a step of crimping and fixing terminals of a film-type electronic component.