JP2001250839A - Device for manufacturing semiconductor mounted parts, semiconductor mounted finished product and device for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device for manufacturing semiconductor mounted parts, a device for manufacturing a semiconductor mounded finished product, and a semiconductor mounted finished product which have high quality and high productivity and are inexpensive. SOLUTION: After a semiconductor element 114 is inserted into a substrate 122 by a semiconductor parts press-in device 173, a contact area increasing part 115 is formed in a bump 13 of the semiconductor element by contact area increasing devices 150 and 154, and a circuit pattern 116 is formed in the circuit connection part provided with the contact area increasing part so as to complete mounting. Therefore, no anisotropic conductive sheet or anisotropic conductive particle is used, so that the productivity can be greatly improved and the cost also reduced compared with conventional one. In addition, since no disconnection of the circuit pattern occurs not like in the conventional ways, and high-quality semiconductor mounted parts and a semiconductor mounted finished product can be produced stably.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC
An electronic component such as an IC chip, which is used when an IC chip is electrically connected to connection pads provided on a circuit pattern made of a conductive paste as in the case of manufacturing a card, is mounted on a base material. Device for manufacturing semiconductor component mounted components by manufacturing semiconductor component mounted components, manufacturing device for completed semiconductor component mounted products having semiconductor component mounted components manufactured by the manufacturing device, and completed semiconductor component mounted products The present invention relates to a finished product on which a semiconductor component is mounted, which is manufactured by a product manufacturing apparatus.

[0002]

2. Description of the Related Art A non-contact IC card will be described as an example, and a conventional method of manufacturing a completed product with a semiconductor component mounted thereon will be described below with reference to FIGS. Conventionally, coils and I
When manufacturing a non-contact IC card having a built-in C chip and transmitting data to and from the outside through the coil, the method of forming the coil includes a method using a coil wound from copper, A method of printing and forming a conductor paste such as a silver paste, a method of etching a metal foil such as a copper foil to form a coil, and the like are used. The method of forming is prosperous.

FIGS. 20 to 27 show a conventional non-contact IC card and a method of manufacturing the same. As shown in FIG. 20, in a conventional non-contact IC card, a coil pattern 2 is formed of a conductive paste on a first base material 1a.
The connection pad 6 provided on the outer peripheral end 3a of the coil pattern 2 and the connection pad 6 provided on the inner peripheral end 3b of the coil pattern 2
It is configured to be electrically connected to the electrode part of the C chip 4. In the manufacturing process, as shown in FIG. 21, first, in step (indicated by “S” in the figure) 1, the first base material 1 a
A circuit pattern including the coil pattern 2 is printed on the surface of the substrate with a conductive paste. As the conductive paste,
Silver paste is preferably used. The printing of the conductive paste is performed by screen printing, offset printing, gravure printing, or the like.
A conductive paste is printed on the first base material 1a through a mask of 65 mesh / inch and an emulsion thickness of 10 μm to form a circuit pattern with a conductor thickness of about 30 μm. The first base material 1
a and a second base material 2b described later have a thickness of 0.1 to 0.5 made of polyethylene terephthalate, vinyl chloride, polycarbonate, acrylonitrile butadiene styrene, or the like.
A thermoplastic resin of about mm is used.

[0004] In step 2, the first printing method is used.
The circuit pattern made of the conductive paste formed on the base material 1a is heated at a temperature of 120 ° C. for 10 minutes to cure the conductive paste. In step 3, FIG.
As shown in FIG.
Then, an anisotropic conductive sheet 9 is attached to the connection pad 6 provided on the inner peripheral end 3b. The anisotropic conductive sheet is a resin sheet containing metal particles, and electrically connects the metal particles and the connection pads 6 by being heated and pressed. In Step 4, the anisotropic conductive sheet 9 is heated to 100 ° C.
For 5 seconds, and temporarily bonded to the connection pad 6. In step 5, the semiconductor element 4 is placed on the temporarily compressed anisotropic conductive sheet 9.
And components such as capacitors. On the mounting surface of the semiconductor element, bumps 10 are formed on the electrode pads 7 on the semiconductor element 4 as shown in FIG. 23, and as shown in FIG. 24, the bumps 10 and the connection pads 6 are anisotropically conductive sheets. 9
Are electrically connected via The bump 10 is formed by a wire bonding method or a plating method, specifically, solder, gold,
It is formed on the electrode pad 7 of the semiconductor element 4 by a plating method using silver, copper, or the like.

In step 6, the semiconductor element 4 is heated at a temperature of 200 ° C. for 30 seconds to harden the anisotropic conductive sheet as shown in FIG. In addition, the first substrate 1a
In a general semiconductor mounting using a glass epoxy substrate or a ceramic substrate, the mounting of the semiconductor element is completed by this step 6. Then, in step 7, the first
An IC in which the connection pads 6 and the bumps 10 are electrically connected via the anisotropic conductive paste 9 as shown in FIG. 26 by laminating the second base material 1b to the base material 1a and laminating the same. You get a card. In FIG. 26, reference numeral 5 denotes a capacitor connected in parallel to the coil pattern 2.

[0006]

However, in the above-described conventional method for manufacturing a completed product with semiconductor components mounted thereon and the configuration of a non-contact IC card as a completed product with semiconductor components mounted manufactured by the manufacturing method, There were the following problems. The first
In general, inexpensive thermoplastic resins such as polyethylene terephthalate and vinyl chloride are used for the substrate 1a and the second substrate 1b. On the other hand, in the conventional manufacturing process, in step 6 described above, the semiconductor element 4 is placed via the anisotropic conductive sheet 9.
Because the temperature at the time of final pressure bonding is as high as 200 ° C or more,
There is a problem that the first base material 1a and the second base material 1b having poor heat resistance are easily deteriorated. In addition, since the components such as the semiconductor element 4 are fixed to the first base material 1a using the anisotropic conductive sheet 9, the provisional pressure bonding and the main pressing process of the anisotropic conductive sheet 9 to the first base material 1a are performed. Required. Therefore, there is a problem that the number of processes is increased, productivity is reduced, and costs are increased.

[0007] The same applies to the case where anisotropic conductive particles are used instead of the anisotropic conductive sheet 9. Further, since the semiconductor element 4 is heated and pressurized during the laminating process in step 7, as shown in FIG.
Sinks into the first base material 1a, and the circuit pattern 6 made of the conductive paste is deformed into a curved shape. As a result, the possibility of disconnection of the circuit pattern is high, and a malfunction such as a malfunction occurs. The present invention has been made in order to solve such problems, and is a high-quality, high-productivity, inexpensive device for manufacturing semiconductor-part-mounted components, a device for manufacturing completed semiconductor-component-mounted products, and a semiconductor component. The purpose is to provide mounted finished products.

[0008]

To achieve the above object, the present invention is configured as follows. That is, the first of the present invention
The manufacturing apparatus for a semiconductor component-mounted component according to an aspect, a circuit pattern formed of a conductive paste which is electrically connected to the semiconductor component by contacting a circuit connecting portion of the semiconductor component on a pattern forming surface of a base material. A semiconductor component-mounted component manufacturing apparatus that mounts the semiconductor component on the circuit pattern by forming the semiconductor component on the circuit pattern, and inserts the semiconductor component into the base material and forms the circuit of the semiconductor component on the pattern formation surface. The contact area between the circuit pattern and the circuit connecting portion is increased with respect to the semiconductor component pressing device that exposes or non-exposes the connecting portion and the circuit connecting portion that is exposed or close to the pattern forming surface. A contact area increasing device for forming a contact area increasing portion to be contacted.

Further, the contact area increasing device includes an increasing portion forming member that forms the contact area increasing portion by contacting the circuit connecting portion or by contacting the pattern forming surface near the circuit connecting portion. A pressing device for an increasing portion forming member that presses the increasing portion forming member against the circuit connecting portion or the pattern forming surface near the circuit connecting portion may be provided.

The increasing portion forming member is formed in a cylindrical shape, and the circuit connecting portion is formed by a pressing operation of the increasing portion forming member pressing device to form the contact area increasing portion on the circuit connecting portion. May be formed.

The increasing portion forming member has an uneven portion at the tip, and the circuit connecting portion is formed by a pressing operation of the increasing portion forming member pressing device to increase the contact area on the circuit connecting portion. An uneven portion as a portion can also be formed.

The increasing portion forming member is formed in a cylindrical shape, and the pattern forming surface near the circuit connecting portion is pressed by the pressing operation of the increasing portion forming member pressing device so as to be in the vicinity of the circuit connecting portion. The circuit connecting portion may be exposed from the base material by forming a contact area increasing groove on the base member.

[0013] Further, a second aspect of the present invention relates to an apparatus for manufacturing a finished product with a semiconductor component mounted thereon, wherein the apparatus for manufacturing a component with a mounted semiconductor component according to the first aspect and the apparatus for manufacturing a component with a semiconductor component mounted thereon are used. A sealing device for sealing the manufactured semiconductor component-mounted component.

Further, a completed semiconductor component mounted product according to a third aspect of the present invention includes the semiconductor component mounted component manufactured by the semiconductor component mounted component manufacturing apparatus of the first aspect. Features.

[0015]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a semiconductor device-mounted component manufacturing apparatus, a semiconductor component-mounted completed product manufacturing apparatus, and a semiconductor component-mounted completed product according to an embodiment of the present invention. explain. Here, the semiconductor device-mounted finished product manufacturing device is a device for manufacturing a semiconductor component-mounted completed product having a semiconductor component mounted component manufactured by the semiconductor component-mounted component manufacturing device, and The completed semiconductor component mounted product has a semiconductor component mounted component manufactured by the semiconductor component mounted component manufacturing apparatus, and is manufactured by the semiconductor component mounted finished product manufacturing device. It is a thing. In the drawings, the same components are denoted by the same reference numerals.

In the present embodiment, the first thermoplastic resin substrate 122 is taken as an example to fulfill the function of the "substrate" described in the above "Means for Solving the Problems". In this embodiment, the bump 113 is taken as an example that fulfills the function of (1). Furthermore, in the present embodiment, as an example that fulfills the function of the “contact area increasing portion”,
In the present embodiment, the uneven portion 1131 and the exposed surface 1132 are taken as an example, and in the present embodiment, the increasing portion forming members 150, 155, and 157, the heating device 153, and the pressing for the increasing portion forming member are provided as an example that fulfills the function of the “contact area increasing device”. Take the device 154 as an example. Further, in the present embodiment, a non-contact IC card is taken as an example that fulfills the function of "finished product with semiconductor components mounted thereon", but is not limited to this.

FIG. 1 shows a non-contact IC card 101 as an example of a completed semiconductor component mounted product provided with a semiconductor component mounted component manufactured using the semiconductor component mounted component manufacturing apparatus of the present embodiment. ing. The non-contact IC card 1
In FIG. 01, the semiconductor element 114 is embedded in the first thermoplastic resin base material 122 in advance, and the first thermoplastic resin base material
A protrusion 118 is formed on the member forming surface 115 of the bump 113 exposed on the pattern forming surface 123 of FIG. The circuit pattern 116 and the protrusion 118 formed of the conductive paste are different from the conventional example in that electrical continuity is obtained directly without using an anisotropic conductive paste or the like. Reference numerals 124 and 125 denote a second thermoplastic resin sheet base material and a third thermoplastic resin sheet base material which are subjected to a laminating process for protecting the semiconductor component mounted component 121 having the semiconductor element 114 and the circuit pattern 116. The sealing devices 126 and 127 are used for the above-described lamination processing corresponding to the sealing operation of the semiconductor component mounted component 121. Below, the non-contact IC card 1
01 will be described with reference to FIGS. 2 to 8 and FIG.

In FIG. 2, reference numeral 117 denotes an electrode of a semiconductor element 114 corresponding to a semiconductor component;
4 shows a passivation film for protecting the active surface of No. 4. The steps shown in FIGS. 2 and 15 (“S” in FIG. 15)
In (1), the bump 113 is formed on the electrode 117 of the semiconductor element 114 by a wire bonding method using a metal wire made of Au, Cu, solder, or the like.

Next, in step 2 shown in FIGS. 3 and 15, the semiconductor element 114 on which the bump 113 has been formed is removed.
One or more are mounted on a sheet-shaped first thermoplastic resin base material 122 formed of a thermoplastic resin having electrical insulation properties such as polyethylene terephthalate, vinyl chloride, polycarbonate, and acrylonitrile butadiene styrene. Here, in the case of the present embodiment, the thickness of the first thermoplastic resin base material 122 is basically set because at least the member forming surface 115 of the bump 113 needs to be exposed from the first thermoplastic resin base material 122 as described later. Semiconductor element 1
14, the thickness of the semiconductor element 114 and the bump 11
It is desirable that the height of the height 3 be equal to or less than the combined thickness. For example, when the thickness of the semiconductor element 114 is 0.18 mm and the height of the bump 113 is 0.04 mm, the thickness of the first thermoplastic resin base 122 is preferably 0.2 mm.

Next, in step 3 shown in FIGS. 4 and 15, the first thermoplastic resin base 122 on which the semiconductor element 114 with
1 and 172, the semiconductor element 114 with the bump 113
The semiconductor component 114 is inserted into the first thermoplastic resin base 122 by pressing the semiconductor component 114 relatively with the semiconductor component pressing device 173 while heating the first thermoplastic resin base 122 and the first thermoplastic resin base 122. The condition of the hot pressing is, for example, when a first thermoplastic resin substrate made of polyethylene terephthalate is used, the pressure is 30 × 1.
0 ⁵ Pa, temperature 120 ° C., press time 1 minute. The temperature and pressure are made different depending on the material of the first thermoplastic resin base material 122.

FIG. 5 corresponding to step 4 is a sectional view showing a state of the semiconductor element 114 and the first thermoplastic resin base 122 after the above-mentioned pressing. According to the above-described operation of inserting the semiconductor element 114 into the first thermoplastic resin base material 122, in this embodiment, as shown in FIG. 5, the end surface of the bump 113, that is, the surface where the bump 113 contacts the hot press plate 171 by the press. In a state where the member forming surface 115 is exposed to the pattern forming surface 123 of the first thermoplastic resin base material 122, the semiconductor element 114 and the bump 113
It is embedded in a thermoplastic resin substrate. At this time, in the present embodiment, in order to reduce the thickness, the back surface 114a of the semiconductor element 114 facing the active surface and the back surface 122 of the first thermoplastic resin base 122 facing the pattern forming surface are used.
Although a is set to be the same plane as shown in the figure, the present invention is not limited to this. That is, depending on the semiconductor component-mounted component to be manufactured, the thickness of the above-described first thermoplastic resin base material 122 or the heat press plates 171 and 172
By adjusting the pressing force or the like, for example, the back surface 122a of the first thermoplastic resin
14a may be protruded.

It is to be noted that the member forming surface 115 is an example that functions as an electrical connection surface. In the present embodiment, only the member forming surface 115 is exposed from the pattern forming surface 123 of the first thermoplastic resin base material 122. However, for example, only the member forming surface 115 is devised by devising the shape of the press plate 171 or the like. Instead, part or all of the bumps 113 may be exposed from the pattern forming surface 123. With such a configuration, the electrical connection surface corresponds to the outer surface of a portion exposed from the pattern forming surface 123. FIG. 17 shows a case in which the member forming surface 115 of the bump 113 and the vicinity thereof are exposed from the pattern forming surface 123.

Next, step 5 in FIG. 6 and FIG.
By pressing the bump forming member 115 exposed on the pattern forming surface 123 of the first thermoplastic resin base material 122 with the increasing portion forming member 150, the protrusion 118 is formed on the member forming surface 115 from the bump 113. It is formed integrally with the bump 113. That is, as the increasing portion forming member 150, for example, a member having a cylindrical structure having a hollow portion 151 inside is used. The heating unit 153 connected to the increasing portion forming member 150 heats the increasing portion forming member 150 to, for example, 200 ° C.
By pressing the tip 152 of the increasing portion forming member 150 against the member forming surface 115 with a load of 100 g per bump by the increasing portion forming member pressing device 154, the member forming surface 115 is deformed. Part of the bump 113 enters the hollow portion 150a. Therefore, after the pressing, the protruding protrusion 118 protruding from the member forming surface 115 is formed integrally with the bump 113 on the member forming surface 115.

By forming such a protrusion 118,
Since the contact area of the conductive paste to be described later with the circuit pattern is increased as compared with the case where the circuit pattern is simply formed on the member forming surface 115, the bonding reliability is further increased. Further, since the protruding portion 118 is formed by the increasing portion forming member 150, the cost can be reduced as compared with a case where a bump is further formed on the bump 113, for example.

Further, the above-mentioned increasing portion forming member 150 is not limited to the above-described shape. For example, like a rod-like increasing portion forming member 155 shown in FIG.
It is also possible to use the one in which the end is preferably pointed, preferably a plurality of uneven portions 1561 are formed. Such an uneven portion 1561 of the increasing portion forming member 155
Is pressed onto the member forming surface 115 of the bump 113, thereby forming an uneven portion 1131 on the member forming surface 115, thereby increasing the contact area between the bump 113 and a circuit pattern made of a conductive paste described later. Can be
The reliability of bonding can be increased.

Further, as a modification of the increasing portion forming member 150, an increasing portion forming member 157 as shown in FIG. 19 can be used. The increasing portion forming member 157 includes the bump 11
3 is accommodated, and when a tip end of the increasing portion forming member 157 is pressed against the pattern forming surface 123 of the first thermoplastic resin base material 122, a conductive portion to be described later is formed around the bump 113. It has a tip 1573 for forming a contact area increasing groove 1572 for increasing the contact area between the circuit pattern formed by the paste and the bump 113. By pressing the increasing portion forming member 157 against the pattern forming surface 123 of the first thermoplastic resin base material 122, the contact area increasing groove 1572 is formed around the bump 113, and the contact area increasing groove 1572 is formed. An exposed surface 1132 exposed from the first thermoplastic resin base 122 by the groove 1572 is formed on the bump 113. Therefore, the pattern forming surface 123
The surface area of the bump 113 exposed from the bumps can be increased, the contact area between the bump 113 and a circuit pattern made of a conductive paste described later can be increased, and the reliability of bonding can be increased.

That is, for the bumps 113, an increasing portion forming member for forming a contact area increasing portion for increasing the contact area between the bump 113 and a circuit pattern made of a conductive paste described later can be used. Here, as the contact area increasing portion, the protrusion 118 or the uneven portion 1 is used.
The uneven portion 113 formed on the member forming surface 115 at 561
1 and the exposed surface 1132 exposed by the contact area increasing groove 1572 and the like. When the bumps 1131 are formed on the bumps, the bumps are formed on the bumps using the hot press plate provided with the bumps, utilizing the process of embedding the semiconductor element 114 in the hot press plate 171 in step 3. It can also be configured as follows.

Next, step 6 in FIG. 7 and FIG.
A circuit pattern electrically connected to the semiconductor element 114 by using a conductive paste such as Ag, Cu or the like so as to be in contact with the protrusion 118, preferably to bury the protrusion 118 as illustrated. 116 is formed on the pattern forming surface 123 of the first thermoplastic resin base material 122.
Also, the above-mentioned uneven portion 1131 in the above-mentioned bump 113 is formed.
Also, in the case of the exposed surface 1132, the uneven portion 1
The circuit pattern 116 that is electrically connected to the semiconductor element 114 so as to be in contact with the exposed surface 131 or the exposed surface 1132, preferably by embedding them, is formed on the pattern forming surface 123 of the first thermoplastic resin base material 122. Formed. The formation of the circuit pattern 116 using the conductive paste is generally performed by screen printing, offset printing, gravure printing, or the like. For example, in the case of screen printing, a conductive paste is printed through a mask of 165 mesh / inch and an emulsion thickness of 10 μm, and a conductor thickness of about 30 μm is used.
The m circuit patterns 116 are formed. In this embodiment, the formed circuit pattern 116 is the semiconductor element 11.
4 and the shape of an antenna coil for wirelessly transmitting and receiving information. Of course, the circuit pattern 116 is not limited to the antenna coil shape, but is formed in a form corresponding to the function of the semiconductor component-mounted component as a product. In this way, the semiconductor element 114 is mounted on the circuit pattern 116. Also, FIG.
The components in the state shown in FIG.
And

Next, step 7 in FIG. 8 and FIG.
In the above, the semiconductor component-mounted component 121 is formed from the thickness direction thereof with a sheet-shaped second thermoplastic resin base 124 and a third thermoplastic resin base having electrical insulation such as polyethylene terephthalate, vinyl chloride, polycarbonate, acrylonitrile butadiene styrene, etc. The semiconductor component 121 is sealed by sandwiching with the material 125 and laminating with the sealing devices 126 and 127. The conditions for the lamination treatment are as follows: when a first thermoplastic resin substrate made of polyethylene terephthalate is used, the pressure is 30 × 10 ⁵ P
a, temperature 120 ° C., press time 1 minute, pressure holding time 1 minute.

Through the above steps, as shown in FIG. 1, a semiconductor component mounted component as a module on which the semiconductor element 114 is mounted, or a semiconductor having the semiconductor component mounted component as in the present embodiment. Non-contact IC card 10 corresponding to an example that fulfills a function as a component-mounted completed product
1 is completed. As described above, according to the present embodiment, a card is formed after the semiconductor element 114 is embedded in the first thermoplastic resin base material 122 in advance.
As shown in FIG. 7, sinking of the semiconductor element 4 into the base material 1a after carding does not occur. Therefore, the circuit pattern 116 is not disconnected, and it is possible to manufacture high-quality semiconductor component-mounted components and semiconductor component-mounted finished products. Furthermore, since there is no need to use a bonding material such as an anisotropic conductive sheet or anisotropic conductive particles, there is no step required for processing the anisotropic conductive sheet or the like, and a high-productivity and inexpensive semiconductor component-mounted component and It is possible to provide a finished product on which semiconductor components are mounted.

In step 6, the pattern forming surface 123
After the circuit pattern 116 is formed thereon, as shown in FIG. 9, a semiconductor component-mounted component 128 in which an electronic component 129 which is a passive component such as a capacitor or a resistor is mounted at a predetermined position of the circuit pattern. You can do it. Then, as shown in FIG.
28 is sandwiched between the second thermoplastic resin substrate 124 and the third thermoplastic resin substrate 125 from the thickness direction thereof and laminated, and the non-contact IC card 10 shown in FIG.
2 can also be manufactured.

In FIGS. 1 to 10 described above, only the connection portions between the semiconductor element 114 and the circuit pattern 116 are shown, but FIG. 7 is a plan view showing the entire semiconductor component mounted component 121 shown in FIG. 11 is a cross-sectional view taken along the line II of FIG. 11, and FIG.
Non-contact I obtained by laminating the whole of No. 1 with a second thermoplastic resin base 124 and a third thermoplastic resin base 125
FIG. 1 is a cross-sectional view of the II section of the C card 101.
3 is shown.

Further, as shown in FIG.
In order to make a jumper connection between the outer peripheral end 130 of the semiconductor element 114 and the corresponding portion 131 of the electrode 117 of the semiconductor element 114, an insulating film 132 is provided on the circuit pattern 116, and then the outer peripheral end 130 and the electrode corresponding portion 131 are electrically conductive paste And electrically connected by a conductive foil 133 or the like. Thereby, the jumper as shown is completed. The insulating film 132 is formed by bonding a polyester insulating foil or printing an insulating paint.

The jumper connection between the outer peripheral end 130 of the circuit pattern 116 and the corresponding portion 131 of the electrode 117 of the semiconductor element 114 is not limited to the above-mentioned method. For example, as shown in FIG. This can also be performed by forming a circuit pattern 133 on the side opposite to the surface on which the circuit pattern 116 is formed by printing a conductive paste through a through-hole 180 provided in the thermoplastic resin base 122 in advance. The formation of the circuit pattern 133 is performed by forming the semiconductor element 114 on the first thermoplastic resin base 122.
May be performed before embedding in the circuit pattern 116.
It may be performed after formation. The filling of the conductive paste into the through holes 180 can be performed simultaneously with the printing of the circuit pattern 116 or the printing of the circuit pattern 133.

In this embodiment, the circuit pattern 116 is used.
The pattern 133 formed on the side opposite to the surface on which is formed is a coil jumper, but is not limited to this configuration.
The first thermoplastic resin substrate 122 can be formed as a double-sided substrate in a form corresponding to the function of the semiconductor component-mounted component as a product.

In the above description, when manufacturing a non-contact IC card as an example that fulfills the function of a completed semiconductor component mounted product, the semiconductor component mounted component 121 and the semiconductor component mounted component 128 are combined with two thermoplastic components. Resin base material 124,
Although a configuration of sandwiching at 125 is adopted, the present invention is not limited to this configuration. For example, when the first thermoplastic resin substrate 122 is placed on a plate and sealed, only the third thermoplastic resin substrate 125 may be used, and the semiconductor component-mounted component to be manufactured may be used. The two thermoplastic resin bases 124, 1
The use of 25 may be appropriately devised.

In the above-described embodiment, by adjusting the thickness of the first thermoplastic resin base material 122 and controlling the hot pressing operation as described above, the first thermoplastic resin Element 1 with bump 113 on material 122
The operation of inserting 14 and the operation of exposing the member forming surface 115 of the bump 113 to the pattern forming surface 123 are performed in the same process, but are not limited thereto. That is,
The electric connection surface, for example, the member forming surface 115 is not exposed to the pattern forming surface 123, and is exposed as the protrusion 118 by the pressing increasing portion forming member 150 in the step 6, and is electrically connected to the circuit pattern 116. The connection may be configured.

[0038]

As described above in detail, in the first embodiment of the present invention, the device for manufacturing a semiconductor component mounted component, in the second embodiment, the device for manufacturing a completed semiconductor component mounted product, and
According to the completed semiconductor component mounted product of the aspect, after the semiconductor component is inserted into the base material by the semiconductor component pressing device, the contact area increasing portion is contacted with the circuit connecting portion of the inserted semiconductor component by the contact area increasing device. The mounting is completed by forming a circuit pattern on the circuit connecting portion having the contact area increasing portion. Therefore, since the anisotropic conductive sheet and the anisotropic conductive particles are not used at the time of mounting, it is possible to significantly improve productivity and reduce costs as compared with the related art. Further, since the circuit pattern is formed on the semiconductor component inserted into the base material, it is possible to prevent sinking of the semiconductor component into the base material as conventionally occurred, and as a result, disconnection of the circuit pattern is prevented. Therefore, it is possible to stably produce high-quality semiconductor component-mounted components and semiconductor component-mounted finished products.

[Brief description of the drawings]

FIG. 1 is a sectional view of a completed semiconductor component mounted product according to an embodiment of the present invention.

FIG. 2 is a view for explaining a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a view showing a state in step 1;

FIG. 3 is a view for explaining a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a view showing a state in step 2;

FIG. 4 is a view for explaining a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a view showing a state in step 3;

FIG. 5 is a view for explaining a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a view showing a state in step 4;

FIG. 6 is a diagram for explaining a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a diagram showing a state in step 5;

FIG. 7 is a diagram for explaining a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a diagram showing a state in step 6;

FIG. 8 is a view for explaining a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1, and is a view showing a state in step 7;

FIG. 9 is a view showing a state in which electronic components are mounted on a circuit pattern for the semiconductor component mounted components included in the completed semiconductor component mounted product shown in FIG. 1;

FIG. 10 is a cross-sectional view showing a state where the semiconductor component-mounted component shown in FIG. 9 has been subjected to lamination processing.

11 is a plan view of the non-contact IC card when the completed semiconductor component mounted product shown in FIG. 1 is a non-contact IC card; FIG.

12 is a cross-sectional view taken along a line II shown in FIG.

FIG. 13 shows the above I of the non-contact IC card in FIG.
It is sectional drawing in the -I part.

FIG. 14 is a plan view showing a state in which a jumper is provided in the non-contact IC card in FIG. 11;

15 is a flowchart showing a manufacturing process of the completed semiconductor component mounted product shown in FIG. 1;

FIG. 16 is a sectional view of a modification of the non-contact IC card in FIG. 11 provided with a jumper.

FIG. 17 is a cross-sectional view of a modification of the semiconductor component-mounted component shown in FIG. 7;

FIG. 18 is a view showing a modification of the increasing portion forming member shown in FIG.

FIG. 19 is a view showing another modification of the increasing portion forming member shown in FIG. 6;

FIG. 20 is a perspective view showing the structure of a conventional non-contact IC card.

FIG. 21 is a flowchart showing a conventional non-contact IC card manufacturing process.

FIG. 22 is a cross-sectional view showing a conventional non-contact IC card manufacturing process.

FIG. 23 is a cross-sectional view showing a conventional non-contact IC card manufacturing process.

FIG. 24 is a cross-sectional view showing a conventional non-contact IC card manufacturing process.

FIG. 25 is a cross-sectional view showing a conventional non-contact IC card manufacturing process.

FIG. 26 is a sectional view showing the structure of a conventional non-contact IC card.

FIG. 27 is a cross-sectional view showing a defective state of a conventional non-contact IC card.

[Explanation of symbols]

101, 102: Non-contact IC card, 113: Bump,
114: semiconductor element, 115: member forming surface, 116: circuit pattern, 117: electrode, 118: circuit connecting member,
Reference numeral 121 denotes a component on which semiconductor components are mounted, 122 denotes a first thermoplastic resin base, 123 denotes a pattern forming surface, 124 denotes a second thermoplastic resin base, and 125 denotes a third thermoplastic resin base.
... Semiconductor component mounted parts, 129 ... Electronic parts, 150 ...
Increase part forming member.

Continued on the front page (72) Inventor Hideki Miyagawa 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E346 FF45 GG28 HH31 5F044 KK02 LL07 QQ02 QQ04 RR16

Claims (9)

[Claims] A circuit connection part (1) of a semiconductor component (114).
13) is formed on the pattern forming surface (123) of the base material (122) by forming a circuit pattern (116) which is electrically connected to the semiconductor component and is made of a conductive paste in contact with the semiconductor component. In the apparatus for manufacturing a semiconductor component mounted component that mounts the semiconductor component on the substrate, the semiconductor component is inserted into the base material, and the circuit connection portion of the semiconductor component is exposed or unexposed on the pattern forming surface. A semiconductor component pressing device (173) for bringing the circuit pattern into close contact with the circuit connecting portion, and a contact area increasing portion for increasing a contact area between the circuit pattern and the circuit connecting portion with respect to the circuit connecting portion exposed or close to the pattern forming surface. (118, 1131,
1132) to form a contact area increasing device (150, 15).
3, 154, 155, and 157). 2. The contact area increasing device, comprising: an increasing portion forming member (150) that contacts the circuit connecting portion or contacts the pattern forming surface near the circuit connecting portion to form the contact area increasing portion. 155, 157), and an increasing portion forming member pressing device (154) for pressing the increasing portion forming member against the circuit connecting portion or the pattern forming surface near the circuit connecting portion. Manufacturing equipment for semiconductor component mounted components. 3. The increasing portion forming member has a cylindrical shape, and the circuit connecting portion is formed by a pressing operation of the increasing portion forming member pressing device, and is formed on the circuit connecting portion as the contact area increasing portion. Forming a projection (118) of
A manufacturing device for a semiconductor component-mounted component described in the above. 4. The end forming member includes a tip (156).
The circuit connecting portion is formed by pressing operation of the increasing portion forming member pressing device, and the circuit connecting portion is provided with the uneven portion (1561) as the contact area increasing portion.
131. The apparatus for manufacturing a component already mounted with a semiconductor component according to claim 2, wherein 131) is formed. 5. The increasing portion forming member has a cylindrical shape, and presses the pattern forming surface in the vicinity of the circuit connecting portion by a pressing operation of the increasing portion forming member pressing device. 3. The apparatus for manufacturing a semiconductor component-mounted component according to claim 2, wherein a groove (1572) for increasing a contact area is formed in the substrate to expose the circuit connection portion from the base material. 6. A device for manufacturing a semiconductor component mounted component according to claim 1, and a semiconductor component mounted component manufactured by said semiconductor component mounted device manufacturing device. A sealing device for stopping,
An apparatus for manufacturing a finished product on which semiconductor components are mounted, comprising: 7. A completed semiconductor component mounted component comprising a semiconductor component mounted component (121) manufactured by the semiconductor component mounted component manufacturing apparatus according to any one of claims 1 to 5. Goods. 8. A finished product on which a semiconductor component is mounted, which is manufactured by the apparatus for manufacturing a finished product on which a semiconductor component is mounted according to claim 6. 9. The non-contact I-to-chip finished product is
9. The completed semiconductor component mounted product according to claim 7, which is a C card.